Datasheet RF2352 Datasheet (RF Micro Devices)

Preliminary

RF2352

4

Typical Applications

• TDMA/CDMA/FM Driver Amplifier

• Low Noise Transmit Driver Amplifier

Product Description

The RF2352 is a low noise driver amplifier for 900MHz
CDMA/AMPS applications. The device is designed for
operation from 2.7V to 3.6V, and features selectable high
and low gain modes. In high gain mode, the device will
provide about 19dB of gain, and the linearity and current
drain are set with an external resistor, allowing the
designer to select the optimum performance for a given
application. In the low gain, or “bypass” mode, the gain is
controlled by an external attenuator network, and the
devicedraws essentially no current. The part is fabricated
using a high performance silicon BiCMOS process, and is
packaged in a 4mmx4 mm, 16-pin, leadless chip carrier.

3V CDMA DRIVER AMPLIFIER

• General Purpose Amplification

• Commercial and Consumer Systems

2

3.75

INDEX AREA

0.75

0.50

3.75

12°

3

0.75

1.00

0.65

0.90

0.05

0.00

NOTES:

2

3

4
5 Package Warpage: 0.05max.

0.45

0.28

+

1.50 SQ

3.20

4.00

Shaded PinisLead 1.1
Dimension appliestoplated terminal and is measured between

0.10 mmand0.25 mm from terminal tip.
The terminal#1identifier and terminal numbering convention

shall conformtoJESD 95-1 SPP-012. Details of terminal #1
identifier areoptional,but must be located within the zone
indicated. Theidentifiermay be either a mold or marked
feature.

Pins 1and9 are fused.

0.80
TYP

1

1

4.00

1.60

4

AMPLIFIERS

GENERAL PURPOSE

Optimum Technology Matching® Applied

Si BJT GaAs MESFETGaAs HBT
Si Bi-CMOS

ü

RF IN

NC

VREF

GND

1

2

3

4

5

PD

SiGe HBT

NC

16 1415

76

ATT OUT1

RF GND

NC

8

NC

ATT IN

Si CMOS

NC

13

12

RF OUT

11

VCC

10

ATT OUT2

9

GND

Functional Block Diagram

Package Style: LCC, 16-Pin, 4x4

Features

• Low Noise and High Intercept Point

• Power Down Control

• Gain Control

• Single 2.7V to 3.6V Power Supply

• Extremely Small MLF16 Package

Ordering Information

RF2352 3V CDMA Driver Amplifier
RF2352 PCBA Fully Assembled Evaluation Board

RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro,NC 27409, USA

Tel [phone]

Fax [phone]

http://www.rfmd.com

Rev A4 010720

4-177

RF2352

Absolute Maximum Ratings

Parameter Rating Unit

Supply Voltage -0.5 to +4.5 V
Input RF Level 0 dBm

Operating Ambient Temperature -40 to +85 °C
Storage Temperature -40 to +150 °C

DC

Preliminary

Caution! ESD sensitive device.

RF Micro Devices believes thefurnished information iscorrect andaccurate
at the time of this printing. However,RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).

4

GENERAL PURPOSE

Parameter

Min. Typ. Max.

Specification

Unit Condition

Overall
High Gain Mode

Gain 18 20 22 dB At 824MHz
Noise Figure 1.9 2.9 dB
Input VSWR 1.3 1.5
Output VSWR 1.6 1.8
Adjacent Channel Power

AMPLIFIERS

Rejection (ACPR1)

Alternate Channel Power

Rejection (ACPR2)
Gain 17 19 21 dB At 874MHz
Noise Figure 2.0 3.0 dB
Input VSWR 1.6 1.8
Output VSWR 1.5 1.7
Adjacent Channel Power

Rejection (ACPR1)
Alternate Channel Power

Rejection (ACPR2)
Gain 16.5 18.5 20.5 dB At 925MHz
Noise Figure 2.2 3.2 dB
Input VSWR 1.8 2.0
Output VSWR 1.4 1.6
Adjacent Channel Power

Rejection (ACPR1)
Alternate Channel Power

Rejection (ACPR2)

57 60 dBc 900kHz offset
78 80 dBc 1.98MHz offset

58 60 dBc 900kHz offset

76 77 dBc 1.98MHz offset

57 60 dBc 900kHz offset
76 77 dBc 1.98MHz offset

Bypass (Low Gain) Mode

Gain -4.2 dB At 824MHz
Noise Figure 4.2 dB
Input VSWR 1.2 1.4
Output VSWR 1.4 1.6
Gain -3.7 dB At 874MHz
Noise Figure 3.7 dB
Input VSWR 1.4 1.6
Output VSWR 1.3 1.5
Gain -4.7 dB At 925MHz
Noise Figure 4.7 dB
Input VSWR 1.5 1.7
Output VSWR 1.4 1.6

Power Supply

Power Supply Range (VCC)2.7 3.0 3.6V
Current Drain (I
Current Drain (I

) 15.0 mA VPD=2.8V (High Gain Mode)

CC

)10µAVPD=0V (Bypass Mode)

CC

VCC=3.0V,T=25°C, External Matching
Components Required.
VPD=2.8V, P

VPD=0V,Pins 6 and 8 shorted.

=+4dBm,ICC=15mA

OUT

4-178

Rev A4 010720

Preliminary

RF2352

Pin Function Description Interface Schematic

1GND
2RFIN

Ground connection. For best performance, keep traces physically short
and connect immed iately to ground plane.

RF input pin. It is DC-coupled and looks like 50Ω from 824MHz to
925MHz.

RF OUT

Bias

RF IN

3NC
4VREF

5PD

6 ATT OUT1

7NC
8ATTIN

Not connected.
Provides the bias voltage for controlling the RF amplifier current drain.

This pin is ty p ically connected through a resistor to an external regu­lated power supply. It may be connected to the same power supply as
the VCC pin. However, if more bias control is desired, it may be con­nected to a separate supply. With a series external resistor of 1500Ω
and power supply of 3V applied, the amplifier current drain should be
around 14mA. By increasing the resistor, the amplifier curre n t drain
may be dropped. Conversely, by decreasing the resistor, the amplifier
current may be increased to a maximum of 30mA.

Power down function. When 0V to 0.5V is applied, the device is in
Bypass Mode: the amplifier is shut off and the MOSFET switches are
activated. There isno DC current dissipation in thisstate. When 1.5V to
3Vis applied, the device is switchedtoHigh Gain Mode: the amplifier is
activated and the MOSFET switches are opened. This is the normal
operating mode.

Output of the first MOSFET switch. DC-cou pled. When the PD pin is
grounded (Bypass Mode), the MOSFET switches are shorted, sending
any signals at the RF IN pin through the first MOSFET and off the chip.
In cases where minimum RF attenuation i s desired, this pin should be
shortedwith50Ω microstrip to the ATT IN pin. This setup will yield
approximately 4dB of insertion loss. If more attenuation is desired, a
resistive pad between the ATT OUT1 and ATT IN pins can be added to
the PC board.

Not connected.
Input to the second MOSFET switch. DC-coupled. When the PD pin is

grounded (Bypass Mode), the MOSFET switches are shorted. See the
ATT OUT1 pin description for setup options.

VREF

4

PD

AMPLIFIERS

GENERAL PURPOSE

RF IN ATT OUT1

ATT OUT2ATT IN

9GND

10 ATT OUT2

11 VCC
12 RF OUT

13 NC
14 NC
15 RF GND

16 NC

Pkg

GND

Base

Rev A4 010720

Ground connection. For best performance, keep traces physically short
and connect immed iately to ground plane.

Output of the second MOSFET switch. DC-coupled. When the PD pin
is grounded (Bypass Mode), the MOSFET switches are shorted. This
pin should be shorted with 50Ω microstrip to the amplifier load.

Provides the power suppl y to the logic circuitry on the IC.
Amplifier output pin. An open collector output that needs VCC applied

to it through an inductor. Typically, a shunt inductor, series capacitor
matching network is used to provide a 50Ω output match.

Not connected.
Not connected.
Amplifier ground. For best performance, keep traces physically short

and connect immed iately to ground plane.
Not connected.

Ground connection for die flag. The backside of the packageshould be
soldered to a top side ground pad which is connected to the ground
plane with multiple vias.

4-179

RF2352

Application Schematic

V

CC

1nF

Preliminary

4

GENERAL PURPOSE

AMPLIFIERS

J1

RF IN

VREF

RF IN

V

CC

1nF

50 Ωµstrip

C2

1nF

22 nF

1500 Ω

1nF

MODE SELECT

1

2

3

4

5

16 1415

10 nH

13

12

11

10

8

76

9

Package base serves as die flag ground. The vias
connecting the backside of the board should be
large in diameter to allow for easier soldering.

4pF

1nF

50 Ωµstrip

Evaluation Board Schema t ic

(Download Bill of Materials from www.rfmd.com.)

C1

22 nF

R1

1500 Ω

C3

1nF

1

2

3

4

5

16 1415

76

13

12

11

10

8

9

2352400-

L1

10 nH

50 Ωµstrip

VCC

1nF

C6

1nF

C5

4pF

C4

50 Ωµstrip

RF OUT

V

CC

50 Ωµstrip

J2

RF OUT

VCC

4-180

* R2, R3 and R4 form a "Tee" attenuator network which

determines the gain in the bypass mode. Evaluation
boards are shipped with R2 and R4 as 0 Ω jumpers, and
R3 omitted. This configuration provides the maximum
gain (about -4 dB) available in bypassmode.

Package base serves as die flag ground. The vias
connecting thebackside of the board should be large in
diameter to allow for easier soldering.

PD

R2*
0 Ω

50 Ωµstrip

R3*

*

OMIT

R4*
0 Ω

P1

1
2
3

CON3

PD

GND

VREF

P2

1

GND

2

VCC

3

CON3

Rev A4 010720

NC

Preliminary

RF2352

Evaluation Board Layout

Board Size 2.0" x 2.0"

Board Thickness 0.031”; Board Material FR-4

4

AMPLIFIERS

GENERAL PURPOSE

Rev A4 010720

4-181

RF2352

Preliminary

4

GENERAL PURPOSE

AMPLIFIERS

VCC=3V, VPD=2.8V,Temperature=26°C, P

824 MHz
874 MHz
925MHz

10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0

ACPR1 (dB)

-50.0

-52.0

-54.0

-56.0

-58.0

-60.0

-62.0

-64.0

-66.0

-68.0

-70.0

ACPR1 versus I

CC

OUT

=4dBm

ICC(mA)

ICC=15mA, VPD=2.8V,Temperature=25°C, POUT=4dBm

Gain versus V

Gain (dB)

25.0

24.0

23.0

22.0

21.0

20.0

19.0

18.0

17.0

16.0

15.0

824 MHz
874 MHz
925 MHz

2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5

CC

VCC(V)

VCC=3V, VPD=2.8V,Temperature=26°C, P

ACPR2 versus I

-70.0

-72.0

-74.0

-76.0

-78.0

-80.0

ACPR2 (dB)

-82.0

-84.0

-86.0

-88.0

-90.0

10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0

CC

OUT

=4dBm

ICC(mA)

824 MHz
874 MHz
925 MHz

4-182

Rev A4 010720