Datasheet RF2162, RF2162PCBA Datasheet (RF Micro Devices)

Page 1
Preliminary
RF2162
2
Typical Applications
• 3V CDMA/AMPS Cellular Handsets
• 3V JCDMA/TACS Cellular Handsets
• 3V TDMA/AMPS Cellular Handsets
Product Description
The RF2162 is a high-power, high-efficiency linear ampli­fier IC targeting 3V handheld systems. The device is manufactured on an advanced Gallium Arsenide Hetero­junction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in dual-mode 3V CDMA/AMPS hand-held digital cellular equipment, spread-spectrum systems, and other applications in the 800 MHz to 960MHz band. The RF2162 has an analog bias control voltage to maximize efficiency. The device is self-contained with 50input and the output can be eas­ily matched to obtain optimum power, efficiency, and lin­earity characteristics. The device is packaged in a compact 4mmx4mm, 16-pin, leadless chip carrier.
3V 900MHZ LINEAR AMPLIFIER
• Spread-Spectrum Systems
•CDPDPortableDataCards
• Portable Battery-Powered Equipment
2
3.75
Dimensions in mm.
INDEX AREA
0.75
0.50
3.75
12°
3
0.75
1.00
0.65
0.90
0.05
0.00
NOTES:
2
3
4 5 Package Warpage: 0.05max.
0.45
0.28
+
1.50 SQ
3.20
4.00
Shaded PinisLead 1.1 Dimension appliestoplated terminal and is measured between
0.10 mmand0.25 mm from terminal tip. The terminal#1identifier and terminal numbering convention
shall conformtoJESD 95-1 SPP-012. Details of terminal #1 identifier areoptional,but must be located within the zone indicated. Theidentifiermay be either a mold or marked feature.
Pins 1and9 are fused.
2
0.80 TYP
1
1
POWER AMPLIFIERS
4.00
1.60
Optimum Technology Matching® Applied
Si BJT GaAs MESFETGaAs HBT Si Bi-CMOS
GND
GND
RFIN
ü
GND
2
3
4
VREG1
SiGe HBT
VCC1
161 131415
VMODE
VCC1
VREG2
VCC BIAS
BIAS GND
Si CMOS
2F0
12
RF OUT
11
RF OUT
10
RF OUT
98765
GND
Functional Block Diagram
Package Style: LCC, 16-Pin, 4x4
• Single 3V Supply
• 29dBm Linear Output Power
• 29dB Linear Gain
• 35% Linear Efficiency
• On-board Power Down Mode
• 800MHz to 960MHz Operation
Ordering Information
RF2162 3V 900MHz Linear Amplifier RF2162 PCBA Fully Assembled Evaluation Board
RF Micro Devices, Inc. 7628 Thorndike Road Greensboro,NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A17 011011
2-205
Page 2
2
RF2162
Absolute Maximum Ratings
Parameter Rating Unit
Supply Voltage (RF off) +8.0 V Supply Voltage (P Mode Voltage (V Control Voltage (VPD)+3.0V Input RF Power +12 dBm
Operating Case Temperature -30 to +110 °C Storage Temperature -30 to +150 °C Moisture Sensitivity Modified JEDEC Level 2
31dBm) +4.5 V
OUT
)+3.0V
MODE
DC
DC DC DC
RF Micro Devices believesthe furnishedinformation is correctand accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice.RF Micro Devices does not assume responsibility for the use of the described product(s).
Preliminary
Caution! ESD sensitive device.
Parameter
POWER AMPLIFIERS
Min. Typ. Max.
Specification
Unit Condition
Overall
Usable Frequency Range 800 960 MHz Typical Frequency Range 824-849 MHz Linear Gain 28 29 31 dB Second Harmonic (including
second harmonic trap) Max CW Output Power 31.5 dBm To tal Efficiency (AMPS mode) 50 % Maximum Linear Output Power
(CDMA Modulation) Total Linear Efficiency 30 35 % Adjacent Channel Power Rejec-
tion
Noise Power -90 -89 dBm V
Maximum Linear Output Power
(CDMA Modulation) To tal Efficiency (AMPS mode) 50 % Max CW Output Power 30 30.5 31 dBm Total Linear Efficiency 30 36 % Adjacent Channel Power Rejec-
tion
Input VSWR <2:1 Output Load VSWR 10:1 No damage.
-30 dBc
29 dBm
-46 -44 dBc ACPR @ 885kHz
-58 -56 dBc ACPR @1980kHz
29 dBm V
-46 -44 dBc ACPR @ 885kHz
-58 -56 dBc ACPR @ 1980kHz
TDMA
Linear Output Power 30 dBm Linear ACP -29 -28 30kHZ offset Linear ALT CP -49 -48 60kHZ offset Efficiency 45 46 O/P=30dBm
Power Supply
Power Supply Voltage 3.0 3.4 4.5 V Idle Current 135 200 mA V
V
Current 10 15 mA Total pins 6 and 7, V
REG
Turn On/Off time <100 ns Total Current (Power down) 10 µAV
“Low” Voltage 0 0.2 V
V
REG
V
“High” Voltage 2.7 2.8 2.9 V
REG
VMODE Bias Control Voltage
Range
0to2.5 V
T=25°C, VCC=3.4V, Freq=824MHz to 849MHz unless otherwise specified
=3.4V; BW=30kHz; RX Band NF mea-
CC
sure from TX center band to RX center band.
=3.0V
CC
=0Vto0.5V
MODE
=2.8V
REG
=Low
PD
2-206
Rev A17 011011
Page 3
Preliminary
RF2162
Pin Function Description Interface Schematic
1GND 2GND1
3GND1 4RFIN
5VREG1
6VMODE 7VREG2
8GND 9GND
10 RF OUT
11 RF OUT 12 RF OUT 13 2FO
14 VCC BIAS 15 VCC1
16 VCC1
Pkg
GND
Base
Ground connection. Connect to package base ground. This ground should be isolated from the ba ckside ground contact on top metal layer.
Ground for stage 1. Keep traces physically short and connect immedi­ately to ground plane for best performance. This ground should be iso­lated from the backside ground contact on top metal layer.
Same as Pin 2. RF input. An external D C blocking capacitor is required if this port is
connected to a DC path to ground or a DC voltage.
RF IN
Enable voltage for first stage. When this pin is “low”, all circuits are shut off. When this pin is 2.8V, all circuits are operating normally. V
requires a regulated 2.8V for the amplifier to operate properly over all specified tem perature and voltage ranges. A dropping resistor from a higher regulated voltage may be u sed to provide the required 2.8V. A 100pF high frequency bypass capacitor is recommended.
This is an ana log bias current control pin. T he range is 0V for minimum bias to 3.0 for maximum bias.
Enable voltage for second or output stage. When this pin is “low”, all circuits are shut off. When this pin is 2.8V, all circuits are operating nor­mally. V
erly over all specified temperature and voltage ranges. A dropping resistor from a higher regulated voltage may be used to provide the required 2.8V. A 100pF h igh frequency bypass capacitor is recom­mended.
Bias circuitry ground. See application schematic. Ground connection. Connect to package base ground. This ground
should be isolated from the ba ckside ground contact on top metal layer. RF output and power supply for the output stage. The bias for the out-
put stage is provided through this pin and pin 13. A n external matching network is required to provide the optimum load impedance; see the application schematics for details.
Same as pin 10. See pin 10. Same as pin 10. Harmonic trap. This pin connects to the RF output but is used for pro-
viding a low impedance to the second harmonic of the operating fre­quency.An inductor or transmission line resonating with an on chip capacitor at 2fo is required at this pin.
Power supply for bias circuitry. A 100pF high frequency bypass capaci­tor is recommended.
Interstage tuning and bias supply for first stage. Interstage tuning and bias supply for first stage. Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul­tiple vias. The pad should have a short thermal path to the ground plane.
requires a regulated 2.8V for the amplifier to operate prop-
REG
REG
From Bias Stages
From Bias Stages
VCC1
GND1
RF OUT
2
POWER AMPLIFIERS
Rev A17 011011
2-207
Page 4
2
RF2162
Application Schematic - US CDMA
V
CC
100 pF
100 pF
Interstage tuning for centering
frequency response
TL
3
1nH
10 nF
100 pF
Preliminary
Bypassing for V
2nd Harmonic Trap
CC
1.8 nH
161 131415
To Vary Gain
100 pF
100 pF
15 nH
330
100 pF
2
3
4
0
0
POWER AMPLIFIERS
RF IN
Matching network for
optimum input return loss
10 nH
100 pF
TL
4
12
11
10
98765
Bias Return
Bypassing for
and V
V
REG1
REG2
TL
27 nH*
1
9.1 pF** 5.1 pF**
TL
1pF
100 pF
2
RF OUT
Matching network for optimum load impedance
VREG
1k
VMODE
* High Q inductor (i.e., Coilcraft 0805HQ-series). **High Q capacitors (i.e., Johanson C-series).
2-208
Rev A17 011011
Page 5
Preliminary
RF2162
Application Schematic - US TDMA
To Vary Gain
RF IN
Matching network for
optimum input return loss
VREG
Interstage tuning for
centering frequency response
100 pF
820
100 pF
15 nH
100 pF
C30
2
3
4
P1-1
0
TL
5
1.5 nH
161 131415
100 pF
27 nH
100 pF
10 nF
Bypassing for V
2nd Harmonic Trap
3.6 pF
TL
7
100 pF
16 nH*
1pF
12
TL
11
1
10
TL
12 pF**
98765
Bias Return
Bypassing for V
and V
REG1
REG2
* L1 is a High Q inductor (i.e.,Coilcraft 0805HQ-series). **C1 and C14 are High Q capacitors (i.e., Johanson C-series).
1.5 nH
2
Matching network for optimum load impedance
TL
3
4.7 pF**
CC
100 pF
2
POWER AMPLIFIERS
RF OUT
VMODE
Rev A17 011011
1k
2-209
Page 6
RF2162
Preliminary
Evaluation Board Schematic - US CDMA
(Download Bill of Materials from www.rfmd.com.)
2
P1-1
C25
C27
100 pF
C10
4.7 µF
4.7 µF
C30
2
3
4
R3
0
TL
4
L3
1.8 nH
TL
3
161 131415
R4
0
100 pF
18 nH
C13
100 pF
C6
L5
1nH
TL
5
12
TL
11
10
98765
L4
1
2162400B
P1
P1-1 VCC
P2-1 VREG
POWER AMPLIFIERS
1 2
P2
1 2
J1
RF IN
GND
VMODEP2-2
C18
100 pF
C5
100 pF
L2
15 nH
R2
C2
4.7 uF
C28
10 nF
C4
100 pF
L1*
TL
C1** C14**
C17
1pF
C3
100 pF
2
J4
RF OUT
2-210
P2-1
R1
TL
1k
TL
2
3
L=15 mils
W=16 mils
P2-2
Board R2 () C14 (pF)C30 (pF) C1 (pF) L1 (nH) CDMA (US)
Transmission Line Length
CDMA (US)
330 5.1100 9.1 27
TL
1
175 mils
165 mils
TL
4
L=40-45 mils
from L3
W=16 mils
* L1 is a High Q inductor (i.e., Coilcraft0805HQ-series). **C1 and C14 are High Q capacitors
(i.e., Johanson C-series).
TL
5
L=15-20 mils
W=14 mils
Rev A17 011011
Page 7
Preliminary
RF2162
Evaluation Board Schematic - US TDMA
Er = 4.7 H = 14 mils t=1mil
J1
RF IN
C5
100 pF
C18
100 pF
R2
L2
15 nH
C27
100 pF
C25 1 µF
C30
2
3
4
TL
5
L3
1.5 nH
TL
4
161 131415
R1
1k
P1-1
C13
100 pF
100 pF
TL
6
C6
C2
4.7 uF
C28
10 nF
C4
100 pF
C55
3.6 pF
TL
7
L1*
12
TL
11
10
98765
1
L4
27 nH
2162401B
TL
C1**
C17
1pF
L10
1.5 nH
2
P1-1 VCC
P2-1 VREG
TL
3
P1
P2
C3
100 pF
C14**
1
GND
2
1
VMODEP2-2
2
2
POWER AMPLIFIERS
J4
RF OUT
R3
TL
P2-2
P2-1
2
0
Board R2 () C14 (pF)C30 (pF) C1 (pF) L1 (nH) TDMA (US)
Transmission Line Length
TDMA (US)
820 5.656 12 16
TL
1
90 mils
R4
0
TL
3
135 mils82 mils
* L1 is a High Q inductor (i.e., Coilcraft0805HQ-series). **C1 and C14 are High Q capacitors (i.e., Johanson C-series).
TL
4
L=12 mils
W=16 mils
TL
5
L=49 mils
W=16 mils
TL
6
L=12 mils
TL
7
L=12 mils
W=14 mils
Rev A17 011011
2-211
Page 8
2
RF2162
Preliminary
Evaluation Board Layout - CDMA
Board Size 2.0" x 2.0"
Board Thickness 0.031”, Board Material FR-4
POWER AMPLIFIERS
2-212
Rev A17 011011
Page 9
Preliminary
RF2162
Evaluation Board Layout - TDMA
2
POWER AMPLIFIERS
Rev A17 011011
2-213
Page 10
2
RF2162
POWER AMPLIFIERS
Preliminary
2-214
Rev A17 011011
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