The RF2161 is a high-power, high-efficiency linear amplifier IC targeting 3V handheld systems. The device is
manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been
designed for use as the final RF amplifier in 3V
CDMA-2000 and W-CDMA handsets, spread spectrum
systems, and other applications in the 1920 MHz to
1980MHz band. The device is self-contained with 50Ω
input and the output can be easily matched to obtain optimum power, efficiency, and linearity characteristics over
all recommended supply voltages.
3V W-CDMA POW ER 1900MHZ
3V LINEAR POWER AMPLIFIE R
• Commercial and Consumer Systems
• Portable Battery-Powered Equipment
3.50
3.35
1.20
4.20
3.95
.50
0.38
2.00
0.28
0.13
0.80
.20
3.95
3.50
3.35
1
ALL SOLDER PAD TOLERANCESP0.05mm
0.40
sq.
2
POWER AMPLIFIERS
.50 sq.
Optimum Technology Matching® Applied
Si BJTGaAs MESFETGaAs HBT
Si Bi-CMOS
GND2
VCC1
RFIN
ü
VCC2
161415
1
2
3
4
678
5
GND1
SiGe HBT
VCC2
VCC2
VPD1
VMODE
VCC
VPD2
Si CMOS
2F0
13
12
RF OUT
11
RF OUT
10
RF OUT
9
GND
Functional Block Diagram
Package Style: MP16KO1A
Features
• Single 3V Supply
• 27dBm Linear Output Power
• 30dB Linear Gain
• 35% Linear Efficiency
• On-board Power Down Mode
Ordering Information
RF21613V W-CDMAPower 1900MHZ 3V Linear Power
RF2161 PCBAFully Assembled Evaluation Board
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro,NC 27409, USA
Amplifier
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A3 010514
2-197
Page 2
2
RF2161
Absolute Maximum Ratings
ParameterRatingUnit
Supply Voltage (RF off)+8.0V
Supply Voltage (P
Mode Voltage (V
Control Voltage (VPD)+3.0V
Input RF Power+6dBm
Operating Case Temperature-30 to +100°C
Storage Temperature-30 to +150°C
≤31dBm)+5.0V
OUT
)+3.0V
MODE
DC
DC
DC
DC
RF Micro Devices believesthe furnishedinformation is correctand accurate
at the time of this printing. However,RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
Preliminary
Caution! ESD sensitive device.
Parameter
Overall
POWER AMPLIFIERS
Usable Frequency Range18502000MHz
Typical Frequency Range1850 to 1910MHz
Linear Gain2830dBMo de=Low
Second Harmonic (including
second harmonic trap)
Third Harmonic-40dBc
Fourth Harmonic-45dBc
Maximum Linear Output Power
(W-CDMA Modulation)
Total Linear Efficiency3035%V
Adjacent Channel Power
Rejection@5MHz
Adjacent Channel Power
Rejection@10MHz
Noise Power-137dBm/HzP
Maximum Linear Output Power
(W-CDMA Modulation)
Total Linear Efficiency35%
Input VSWR< 2 :1
Output Load VSWR5:1No oscillations
Min.Typ.Max.
Specification
1920 to 1980
2628dBMode=High
-35dBc
27dBm
-40-38dBcP
-50-48dBcP
26dBmV
UnitCondition
Power Supply
Power Supply Voltage3.03.45.0V
Idle Current120mAMODE = high
V
Current13mATotal pins 6 and 8, VPD=2.8V
PD
Total Current (Power down)1010µAV
V
“Low” Voltage00.2V
PD
“High” Voltage2.72.82.9V
V
PD
MODE “High” Voltage2.52.8
MODE “Low” Voltage00.5
T=25°C, VCC=3.4V unless otherwise specified
High, P
MODE
=27dBm, W-CDMA Modulation
OUT
3G PP 3.2 03-00 DPCCH+1DPDCH
=27dBm, W-CDMA Modulation
OUT
3G PP 3.2 03-00 DPCCH+1DPDCH
=+27dBm, Rx Band 2110MHz to
OUT
2170MHz
=3.0V
CC
=low
PD
OUT
=27dBm
2-198
Rev A3 010514
Page 3
Preliminary
RF2161
PinFunctionDescriptionInterface Schematic
1VCC2
2GND2
3VCC1
4RFIN
5GND1
6VPD1
7VMODE
8VPD2
9GND
10RF OUT
11RF OUT
12RF OUT
132FO
14VCC
15VCC2
16VCC2
Powersupply for second stage and interstage match. Pins 1, 15 and 16
should be connected by a common trace where the pins contact the
printed ci r cuit board.
Ground for second stage.For best performance, keep traces physically
short and connect immediately to ground plane. This groun d should be
isolated from the backside ground contact.
Power supply for first stage and interstage match. VCCshould be fed
through a 1.2nH inductor terminated with a 8.2pF capacitor on the sup-
ply side. The inductor should be as close to the pin as possible.
RF input. An external series capacito r is required as a DC block. The
input match can be improved to <2:1 by using a series capacitor and
shunt inductor.
Ground for first stage. For best performance, keep traces physically
short and connect immediately to ground plane. This groun d should be
isolated from the backside ground contact.
Power Down control for first and second stages. When this pin is “low”,
all first and second stage circuits are shut off. When this pin is 2.8V,all
first and second stage circuits operate normally. V
lated 2.8V for the amplifier to operate properly over all specified temperature and voltage ranges. A dropping resistor from a h igher
regulated voltage may be used to provide the required 2.8V.
V
adjusts the bias to the 2nd and 3rd stages. For full power oper-
MODE
ation, MODE is set low. When operating in a lower output power mode
(<+25dBm) this pin is set high to reduce bias current by up to 50%. An
external series resistor is optional to limit the amount of current
required. At low temperature (-30
low to maintain correct o perat ion.
Power Down control for third stag e. When this pin is “low”, all and third
stage circuits are shut off. When this pin is 2.8V, all and third stage circuits operate normally. V
to operate properly over all specified temperature and voltage ranges.
A dropping resistor from a higher regulated voltage maybeused to provide the required 2.8V. A 15pF hig h frequency bypass capacitor is recommended.
For best perfo rmance, keep traces physically short and connect immediately to ground plane. T his ground should be isolated from the backside ground contact.
RF output and power supply for final stage. This is the unmatched collector output of the third stage. A DC block is required following the
matching components. The biasing may be provided via a parallel L-C
set for resonance at the operating frequency of 1920MHz to 1980MHz.
It is important to select an inductor with very low DC resistance with a
1A current rating. Alternatively,shunt microstrip techniques are also
applicable and provide very low DC resistance. Low frequency bypassing is required for stability.
Same as pin 10.See pin 10.
Same as pin 10.See pin 10.
Second harmonic trap.Keep traces physically short and connect imme-
diately to ground plane. This ground should be isolated from backside
ground contact.
Supply for bias reference and control circuits. High frequency bypassing may be necessary.
Same as Pin 1.
Same as Pin 1.
PD
ο
C), it is recommended to set V
requires a regulated 2.8V for the amplifier
requires a regu-
PD1
MODE
See pin 4.
RF IN
See pin 4.
From Bias
Stages
From Bias
Stages
VCC1
GND1
RF OUT
2
POWER AMPLIFIERS
Rev A3 010514
2-199
Page 4
2
RF2161
PinFunctionDescriptionInterface Schematic
Pkg
Base
POWER AMPLIFIERS
GND
Ground connection. The backside of the package should be soldered
to a top side ground pad which is connected to the ground plane with
multiple vias. The pad should have a short thermal path to the ground
plane.
Preliminary
2-200
Rev A3 010514
Page 5
Preliminary
1 µF
10 nF
Application Schemati c
W-CDMA (1920MHz to 1980MHz)
V
CC
+
10 nF
4.7 uF
+
10 nF
RF2161
2
RF IN
VREG
VMODE
8.2 pF
15 pF
1.2 nH
R2
C30
161415
1
2
3
4
678
5
15 pF
1uF
+
1.8k Ω
10 nH
TL
3
15 pF
15 pF
15 pF
13
12
11
10
9
L1*
1
C1**C14**
TL
TL
15 nH
* L1 is a High Q inductor (i.e., Coilcraft 0805HQ-series).
**C1 andC14 are High Q capacitors