The RF2155 is a 3V medium power programmable gain
amplifierIC.Thedeviceismanufacturedonanadvanced
Gallium Arsenide Heterojunction Bipolar Transistor (HBT)
process, and has been designed for use as the final RF
amplifier in analog cellular phone transmitters or ISM
applications operating at 915MHz. The device is self-contained with the exception of the output matching network
and power supply feed line. A two-bit digital control provides 4 levels of power control, in 8dB steps.
• Driver Stage for Higher Power Applications
• 3V Applications
-A-
0.009
0.004
0.050
8° MAX
0° MIN
0.392
0.386
0.158
0.150
0.244
0.230
0.021
0.014
0.069
0.064
0.060
0.054
2
POWER AMPLIFIERS
Optimum Technology Matching® Applied
Si BJTGaAs MESFETGaAs HBT
Si Bi-CMOS
NC
VCC1
VCC2
GND
GND
GND1
RF IN
PD
ü
SiGe HBT
1
2
3
4
5
6
7
8
Si CMOS
16
15
14
13
12
11
10
9
G16
G8
RF OUT
GND
GND
RF OUT
NC
NC
Functional Block Diagram
0.010
0.035
0.008
0.016
Package Style: Standard Batwing
Features
• Single 3V Supply
• 500mW CW Output Power
• 31dB Small Signal Gain
• Up to 60% Efficiency
• Digitally Controlled Output Power
• 430MHz to 930MHz Frequency Range
Ordering Information
RF21553V Programmable Gain PowerAmplifier
RF2155 PCBAFully Assembled Evaluation Board
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro,NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev B3 010417
2-179
Page 2
2
RF2155
Absolute Maximum Ratings
ParameterRatingUnit
Supply Voltage-0.5 to +5.5V
Power Down Voltage (VPD)-0.5 to +3.3V
DC Supply Current500mA
Input RF Power+10dBm
Output Load VSWR10:1
Ambient Operating Temperature-30 to +85°C
Storage Temperature-40 to +150°C
DC
Caution! ESD sensitive device.
RF Micro Devices believesthe furnishedinformation is correctand accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice.RF Micro Devices does not
assume responsibility for the use of the described product(s).
Parameter
Overall
POWER AMPLIFIERS
Frequency Range430 to 930MHz
Maximum CW Output Power450mWV
Small Signal Gain31dB
Second Harmonic-30dBcWithout external second harmonic trap
Third Harmonic-40dBc
Fourth Harmonic-36dBc
Input VSWR2:1All gain settings
CW Efficiency5056%G16=“high”, G8=“high”, P
Output Load VSWR6:1Spurious<-60dBc
Min.Typ.Max.
Specification
300mWV
UnitCondition
T=25°C, VCC=3.6V,VPD=3.0V,
Z
=13Ω,PIN=0dBm,Freq=915MHz
LOAD
=3.6V
CC
=3.0V
CC
Power Control
Power Down “ON”2.72.83.0VVoltagesupplied to the input
Power Down “OFF”00.50.8VVoltage supplied to the input
PD Input Current3.75.0mAOnly in “ON” state
G16, G8 “ON”2.22.53.0VVoltage supplied to the input
G16, G8 “OFF”00.30. 5VVoltage supplied to the input
G16, G8 Input Current0.81.01.6mAOnly in “ON” state
Output Power+25.5+26.5+28.0dBmG16=“high”, G8=“high”, P
+16.0+18.5+21.0dBmG16=“high”, G8=“low”, P
+8.0+10.5+13.0dBmG16 =“low”, G8=“high”, P
-1.0+1.5+4.0dBmG16=“low”, G8=“low”, P
Turn On/Off Time100ns
Power Supply
Power Supply Voltage3.6VSpecifications
3.05.0VOperating limits
Power Supply Current225300mAG 16=“high”, G8=“high”, P
90115mAG16=“high”, G8=“low”, P
3755mAG16=“low”, G8=“high”, P
2535mAG16=“low”, G8=“low”, P
2050110mAG16=“high”, G8=“high”, No RF In
110µAG16=“low”, G8=“low”, PD=“low”
IN
IN
=0dBm
IN
=0dBm
IN
=0dBm
IN
IN
=0dBm
IN
=0dBm
IN
=0dBm
IN
=0dBm
=0dBm
=0dBm
2-180
Rev B3 010417
Page 3
RF2155
PinFunctionDescriptionInterface Schematic
1NC
2VCC1
3VCC2
4GND
5GND
6GND1
7RFIN
8PD
Not internally connected.
Positive supply for the first stage (driver) amplifier. This is an
unmatched transistor collector output. This pin should see an inductive
pathtoACground(V
tance can be achieved with a short, thin microstrip line (approximately
equivalent to 0.4nH).Atlower frequencies, the induct ance valueshould
be larger (longer microstrip line) and V
larger bypass capacitor. This inductance forms a matching network
with the amplifier stages, setting the amplifier's frequency of maximum
gain. An additional 1µF bypass capacitor in parallel with the UHF
bypass capacitor is also recommended, but placement of this component is not as cr itical. A resistor of 39Ω fromthispintopin3isnecessary to ensure stability under extreme output VSWR conditions.
Positive supply for the bias circuits. This pin should be bypassed with a
single UHF capacitor, placed as close as possible to the package.
Ground connection. Keep traces physically short and connect immediately to the ground plane for best performance.
Same as pin 4.
Ground return for the first stage; this should be connected to a via very
close to the device.
Amplifier RF input. This is a 50Ω RF input port to the amplifier. To
improve the input match over all four gain control settings, a n input
inductor of 6.8nH should be added. The amplifier does not contain
internal DC blocking and, therefore, should be externally DC blocked
before connecting to any d evice which has DC present or which contains a DC path to ground. A series UHF capacitor is recommended for
the DC blocking.
Powerdown control voltage. When this pin is at 0V, the device will be in
power down mode, dissipating minimum DC power. When this pin is at
3V the device will be in full power mode delivering maximum available
gain and output power capability. This pin should not, in any circumstance, be higher than 3.3V. This pin should also have an externa l UHF
and HF bypassing capacitor.
with a UHF bypassing capacitor). This induc-
CC
shouldbebypassedwitha
CC
See pin 2.
RF IN
From Bias
Stages
PD
VCC1
To RF
Stages
2
POWER AMPLIFIERS
9NC
10NC
11RF OUT
12GND
13GND
14RF OUT
15G8
Rev B3 010417
Not internally connected.
Not internally connected.
Amplifier RF output. This is an unmatched collector output of the final
amplifier transistor. It is internally connected to pins 11 and 14 to provide low series inductance and flexibility in output matching. Bias for
the final power amplifier output transistor must also be provided
through one of these pins. Typically, pin 14 is used to supply bias. A
transmission line of approximately 500mils length, followed by a
bypass capacitor, is adequate. This pin can also be used to create a
second harmonic trap. A UHF and large tantalum (1µF) capacitor
should be placed on the power supply side of the bias inductor. Pin 11
should be used for the RF output with a matchi n g network thatpresents
the optimum load impedance to the PA for maximum power and efficiency,as well as providing DC blocking at the output.
Same as pin 4.
Same as pin 4.
Same as pin 11.
RF output power gain control 8dB bit (see specification table for logic).
The control voltage at this pin should never exceed 3.3V and a logic
high should be at least 2.7V. This pin should also have an external UHF
bypassing capacitor.
Gxx
From Bias
Stages
RF OUT
VCC2
To RF
Stages
2-181
Page 4
RF2155
PinFunctionDescriptionInterface Schematic
16G16
RF output power gain control 16dB bit (see specification table for
logic). The control voltage at this pin should never exceed 3.3V and a
logic high should be at least2.7V. This pin should also have an external
UHF bypassing capacitor.
Same as pin 15.
2
Application Schematic
915 MHz
V
CC
W=20, L=180 mil
33 pF
39
Ω
POWER AMPLIFIERS
33 pF
RF In
Power Down
Board Material: FR-4 (Er=4.7)
h=30 mil
Impedances are critical at pin
2, 7, 11, and 14
33 pF
6.8 nH
1
2
3
4
5
6
7
8
33 pF
16
15
14
13
12
11
10
9
33 pF33pF
W=20, L=570 mil
W=55, L=330 mil
16 dB Ctrl
V
CC
33 pF
50
Ω
3.9 pF
8 dB Ctrl
33 pF
RF Out
2-182
Rev B3 010417
Page 5
Evaluation Board Schemati c
(Download Bill of Materials from www.rfmd.com.)
RF2155
P2-1
RF IN
J1
P1-3
C13
1
P1
1
P1-1
P1-3
C14
µ
F
1
C6
µ
F
50
Ω µ
strip
1nF
C1
33 pF
C5
33 pF
L1
6.8 nH
C9
1nF
R1
39
C4
33 pF
C3
33 pF
Ω
VB2
GND
2
PD
3
2155400 Rev -
1
2
3
4
5
6
7
8
P2-1
P2-3
P2
1
VCC
GND
2
VB1
3
strip
P2-3
P1-1
RF OUT
J2
16
15
14
13
12
11
10
9
L=570 mil,
W=20 mil
L=330 mil,
W=55 mil
C12 1 nF
C2
33 pF
C2
33 pF
C10
3.9 pF
33 pF
33 pF
50
C7
C8
Ω µ
2
POWER AMPLIFIERS
Rev B3 010417
2-183
Page 6
2
RF2155
Evaluation Board Layout
Board Size 2.0” x 2.0”
POWER AMPLIFIERS
2-184
Rev B3 010417
Page 7
RF2155
Pout and Icc vs. Pin, State 11
30
25
20
Pout (dBm)
15
10
5
-20-15-10-50510
(915 MHz, Vcc=3.6 V, Vpd=3.0 V)
Pout
Icc
Pin (dBm)
Pout and Icc vs. Pin, State 01
20
15
10
(915 MHz, Vcc=3.6 V, Vpd=3.0 V)
Pout
Icc
300
250
200
150
100
50
300
250
200
Pout and Icc vs. Pin, State 10
25
20
15
Icc (mA)
10
Pout (dBm)
5
0
-5
-20-15-10-50510
(915 MHz, Vcc=3.6 V, Vpd=3.0 V)
Pout
Icc
Pin (dBm)
300
250
200
150
100
50
0
2
Icc (mA)
POWER AMPLIFIERS
Pout and Icc vs. Pin, State 01
10
5
0
(915 MHz, Vcc=3.6 V, Vpd=3.0 V)
Pout
Icc
300
250
200
5
Pout (dBm)
0
-5
-10
-20-15-10-50510
Pin (dBm)
Pout and Efficiency vs. Vcc, Full Gain
(915 MHz, Pin=0 dBm, Vcc=3.6 V, Vpd=3.0 V)
30
29
28
Pout (dBm)
27
26
Pout
Efficiency
150
100
50
0
60.0
57.0
54.0
51.0
48.0
Icc (mA)
-5
Pout (dBm)
-10
-15
-20
-20-15-10-50510
150
Icc (mA)
100
50
0
Pin (dBm)
Pout vs. Temperature, All Gain Settings
30
25
20
15
10
Pout (dBm)
Efficiency (%)
5
0
(Pin=0 dBm, Vcc=3.6 V, Vpd=3.0 V)
Bit1=1;Bit2=1
Bit1=1;Bit2=0
Bit1=0;Bit2=1
Bit1=0;Bit2=0
25
3.03.54.04.55.05.5
Vcc (Volts)
Rev B3 010417
45.0
-5
-25-51535557595
Temperature (°C)
2-185
Page 8
RF2155
2
Pout vs. Frequency, All Gain Settings
30
25
20
15
10
Pout (dBm)
5
0
POWER AMPLIFIERS
-5
870880890900910920930940950960
(Pin=0 dBm, Vcc=3.6 V, Vpd=3.0 V)
Bit1=1;Bit2=1
Bit1=1;Bit2=0
Bit1=0;Bit2=1
Bit1=0;Bit2=0
Frequency (MHz)
250
200
150
Icc (mA)
100
50
0
870880890900910920930940950960
Icc vs. Frequency, All Gain Settings
(Pin=0 dBm, Vcc=3.6 V, Vpd=3.0 V)
Bit1=1;Bit2=1
Bit1=1;Bit2=0
Bit1=0;Bit2=1
Bit1=0;Bit2=0
Frequency (MHz)
2-186
Rev B3 010417
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