Datasheet RF2155, RF2155PCBA Datasheet (RF Micro Devices)

Page 1
RF2155
2
3V PROGRAMMABLE GAIN POWER AMPLIF IER
Typical Applications
• Analog Communication Systems
• 900MHz Spread Spectrum Systems
• 400MHz Industrial Radios
Product Description
The RF2155 is a 3V medium power programmable gain amplifierIC.Thedeviceismanufacturedonanadvanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in analog cellular phone transmitters or ISM applications operating at 915MHz. The device is self-con­tained with the exception of the output matching network and power supply feed line. A two-bit digital control pro­vides 4 levels of power control, in 8dB steps.
• Driver Stage for Higher Power Applications
• 3V Applications
-A-
0.009
0.004
0.050
8° MAX
0° MIN
0.392
0.386
0.158
0.150
0.244
0.230
0.021
0.014
0.069
0.064
0.060
0.054
2
POWER AMPLIFIERS
Optimum Technology Matching® Applied
Si BJT GaAs MESFETGaAs HBT Si Bi-CMOS
NC
VCC1
VCC2
GND
GND
GND1
RF IN
PD
ü
SiGe HBT
1
2
3
4
5
6
7
8
Si CMOS
16
15
14
13
12
11
10
9
G16
G8
RF OUT
GND
GND
RF OUT
NC
NC
0.010
0.035
0.008
0.016
Package Style: Standard Batwing
Features
• Single 3V Supply
• 500mW CW Output Power
• 31dB Small Signal Gain
• Up to 60% Efficiency
• Digitally Controlled Output Power
• 430MHz to 930MHz Frequency Range
Ordering Information
RF2155 3V Programmable Gain PowerAmplifier RF2155 PCBA Fully Assembled Evaluation Board
RF Micro Devices, Inc. 7628 Thorndike Road Greensboro,NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev B3 010417
2-179
Page 2
2
RF2155
Absolute Maximum Ratings
Parameter Rating Unit
Supply Voltage -0.5 to +5.5 V Power Down Voltage (VPD) -0.5 to +3.3 V DC Supply Current 500 mA
Input RF Power +10 dBm Output Load VSWR 10:1 Ambient Operating Temperature -30 to +85 °C Storage Temperature -40 to +150 °C
DC
Caution! ESD sensitive device.
RF Micro Devices believesthe furnishedinformation is correctand accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice.RF Micro Devices does not assume responsibility for the use of the described product(s).
Parameter
Overall
POWER AMPLIFIERS
Frequency Range 430 to 930 MHz Maximum CW Output Power 450 mW V
Small Signal Gain 31 dB Second Harmonic -30 dBc Without external second harmonic trap Third Harmonic -40 dBc Fourth Harmonic -36 dBc Input VSWR 2:1 All gain settings CW Efficiency 50 56 % G16=“high”, G8=“high”, P
Output Load VSWR 6:1 Spurious<-60dBc
Min. Typ. Max.
Specification
300 mW V
Unit Condition
T=25°C, VCC=3.6V,VPD=3.0V, Z
=13Ω,PIN=0dBm,Freq=915MHz
LOAD
=3.6V
CC
=3.0V
CC
Power Control
Power Down “ON” 2.7 2.8 3.0 V Voltagesupplied to the input Power Down “OFF” 0 0.5 0.8 V Voltage supplied to the input PD Input Current 3.7 5.0 mA Only in “ON” state G16, G8 “ON” 2.2 2.5 3.0 V Voltage supplied to the input G16, G8 “OFF” 0 0.3 0. 5 V Voltage supplied to the input G16, G8 Input Current 0.8 1.0 1.6 mA Only in “ON” state Output Power +25.5 +26.5 +28.0 dBm G16=“high”, G8=“high”, P
+16.0 +18.5 +21.0 dBm G16=“high”, G8=“low”, P
+8.0 +10.5 +13.0 dBm G16 =“low”, G8=“high”, P
-1.0 +1.5 +4.0 dBm G16=“low”, G8=“low”, P
Turn On/Off Time 100 ns
Power Supply
Power Supply Voltage 3.6 V Specifications
3.0 5.0 V Operating limits
Power Supply Current 225 300 mA G 16=“high”, G8=“high”, P
90 115 mA G16=“high”, G8=“low”, P 37 55 mA G16=“low”, G8=“high”, P 25 35 mA G16=“low”, G8=“low”, P
20 50 110 mA G16=“high”, G8=“high”, No RF In
110µA G16=“low”, G8=“low”, PD=“low”
IN
IN
=0dBm
IN
=0dBm
IN
=0dBm
IN
IN
=0dBm
IN
=0dBm
IN
=0dBm
IN
=0dBm
=0dBm
=0dBm
2-180
Rev B3 010417
Page 3
RF2155
Pin Function Description Interface Schematic
1NC 2VCC1
3VCC2 4GND 5GND
6GND1 7RFIN
8PD
Not internally connected. Positive supply for the first stage (driver) amplifier. This is an
unmatched transistor collector output. This pin should see an inductive pathtoACground(V
tance can be achieved with a short, thin microstrip line (approximately equivalent to 0.4nH).Atlower frequencies, the induct ance valueshould be larger (longer microstrip line) and V
larger bypass capacitor. This inductance forms a matching network with the amplifier stages, setting the amplifier's frequency of maximum gain. An additional 1µF bypass capacitor in parallel with the UHF bypass capacitor is also recommended, but placement of this compo­nent is not as cr itical. A resistor of 39fromthispintopin3isneces­sary to ensure stability under extreme output VSWR conditions.
Positive supply for the bias circuits. This pin should be bypassed with a single UHF capacitor, placed as close as possible to the package.
Ground connection. Keep traces physically short and connect immedi­ately to the ground plane for best performance.
Same as pin 4. Ground return for the first stage; this should be connected to a via very
close to the device. Amplifier RF input. This is a 50RF input port to the amplifier. To
improve the input match over all four gain control settings, a n input inductor of 6.8nH should be added. The amplifier does not contain internal DC blocking and, therefore, should be externally DC blocked before connecting to any d evice which has DC present or which con­tains a DC path to ground. A series UHF capacitor is recommended for the DC blocking.
Powerdown control voltage. When this pin is at 0V, the device will be in power down mode, dissipating minimum DC power. When this pin is at 3V the device will be in full power mode delivering maximum available gain and output power capability. This pin should not, in any circum­stance, be higher than 3.3V. This pin should also have an externa l UHF and HF bypassing capacitor.
with a UHF bypassing capacitor). This induc-
CC
shouldbebypassedwitha
CC
See pin 2.
RF IN
From Bias Stages
PD
VCC1
To RF Stages
2
POWER AMPLIFIERS
9NC 10 NC 11 RF OUT
12 GND 13 GND 14 RF OUT 15 G8
Rev B3 010417
Not internally connected. Not internally connected. Amplifier RF output. This is an unmatched collector output of the final
amplifier transistor. It is internally connected to pins 11 and 14 to pro­vide low series inductance and flexibility in output matching. Bias for the final power amplifier output transistor must also be provided through one of these pins. Typically, pin 14 is used to supply bias. A transmission line of approximately 500mils length, followed by a bypass capacitor, is adequate. This pin can also be used to create a second harmonic trap. A UHF and large tantalum (1µF) capacitor should be placed on the power supply side of the bias inductor. Pin 11 should be used for the RF output with a matchi n g network thatpresents the optimum load impedance to the PA for maximum power and effi­ciency,as well as providing DC blocking at the output.
Same as pin 4. Same as pin 4. Same as pin 11. RF output power gain control 8dB bit (see specification table for logic).
The control voltage at this pin should never exceed 3.3V and a logic high should be at least 2.7V. This pin should also have an external UHF bypassing capacitor.
Gxx
From Bias Stages
RF OUT
VCC2
To RF Stages
2-181
Page 4
RF2155
Pin Function Description Interface Schematic
16 G16
RF output power gain control 16dB bit (see specification table for logic). The control voltage at this pin should never exceed 3.3V and a logic high should be at least2.7V. This pin should also have an external UHF bypassing capacitor.
Same as pin 15.
2
Application Schematic
915 MHz
V
CC
W=20, L=180 mil
33 pF
39
POWER AMPLIFIERS
33 pF
RF In
Power Down
Board Material: FR-4 (Er=4.7) h=30 mil
Impedances are critical at pin 2, 7, 11, and 14
33 pF
6.8 nH
1
2
3
4
5
6
7
8
33 pF
16
15
14
13
12
11
10
9
33 pF 33pF
W=20, L=570 mil
W=55, L=330 mil
16 dB Ctrl
V
CC
33 pF
50
3.9 pF
8 dB Ctrl
33 pF
RF Out
2-182
Rev B3 010417
Page 5
Evaluation Board Schemati c
(Download Bill of Materials from www.rfmd.com.)
RF2155
P2-1
RF IN
J1
P1-3
C13 1
P1
1
P1-1
P1-3
C14
µ
F
1
C6
µ
F
50
Ω µ
strip
1nF
C1
33 pF
C5
33 pF
L1
6.8 nH
C9
1nF
R1
39
C4
33 pF
C3
33 pF
VB2
GND
2
PD
3
2155400 Rev -
1
2
3
4
5
6
7
8
P2-1
P2-3
P2
1
VCC GND
2
VB1
3
strip
P2-3
P1-1
RF OUT
J2
16
15
14
13
12
11
10
9
L=570 mil,
W=20 mil
L=330 mil,
W=55 mil
C12 1 nF
C2
33 pF
C2
33 pF
C10
3.9 pF
33 pF
33 pF
50
C7
C8
Ω µ
2
POWER AMPLIFIERS
Rev B3 010417
2-183
Page 6
2
RF2155
Evaluation Board Layout
Board Size 2.0” x 2.0”
POWER AMPLIFIERS
2-184
Rev B3 010417
Page 7
RF2155
Pout and Icc vs. Pin, State 11
30
25
20
Pout (dBm)
15
10
5
-20 -15 -10 -5 0 5 10
(915 MHz, Vcc=3.6 V, Vpd=3.0 V)
Pout
Icc
Pin (dBm)
Pout and Icc vs. Pin, State 01
20
15
10
(915 MHz, Vcc=3.6 V, Vpd=3.0 V)
Pout
Icc
300
250
200
150
100
50
300
250
200
Pout and Icc vs. Pin, State 10
25
20
15
Icc (mA)
10
Pout (dBm)
5
0
-5
-20 -15 -10 -5 0 5 10
(915 MHz, Vcc=3.6 V, Vpd=3.0 V)
Pout
Icc
Pin (dBm)
300
250
200
150
100
50
0
2
Icc (mA)
POWER AMPLIFIERS
Pout and Icc vs. Pin, State 01
10
5
0
(915 MHz, Vcc=3.6 V, Vpd=3.0 V)
Pout
Icc
300
250
200
5
Pout (dBm)
0
-5
-10
-20 -15 -10 -5 0 5 10
Pin (dBm)
Pout and Efficiency vs. Vcc, Full Gain
(915 MHz, Pin=0 dBm, Vcc=3.6 V, Vpd=3.0 V)
30
29
28
Pout (dBm)
27
26
Pout Efficiency
150
100
50
0
60.0
57.0
54.0
51.0
48.0
Icc (mA)
-5
Pout (dBm)
-10
-15
-20
-20 -15 -10 -5 0 5 10
150
Icc (mA)
100
50
0
Pin (dBm)
Pout vs. Temperature, All Gain Settings
30
25
20
15
10
Pout (dBm)
Efficiency (%)
5
0
(Pin=0 dBm, Vcc=3.6 V, Vpd=3.0 V)
Bit1=1;Bit2=1
Bit1=1;Bit2=0
Bit1=0;Bit2=1
Bit1=0;Bit2=0
25
3.03.54.04.55.05.5
Vcc (Volts)
Rev B3 010417
45.0
-5
-25-51535557595
Temperature (°C)
2-185
Page 8
RF2155
2
Pout vs. Frequency, All Gain Settings
30
25
20
15
10
Pout (dBm)
5
0
POWER AMPLIFIERS
-5 870 880 890 900 910 920 930 940 950 960
(Pin=0 dBm, Vcc=3.6 V, Vpd=3.0 V)
Bit1=1;Bit2=1
Bit1=1;Bit2=0
Bit1=0;Bit2=1
Bit1=0;Bit2=0
Frequency (MHz)
250
200
150
Icc (mA)
100
50
0
870 880 890 900 910 920 930 940 950 960
Icc vs. Frequency, All Gain Settings
(Pin=0 dBm, Vcc=3.6 V, Vpd=3.0 V)
Bit1=1;Bit2=1
Bit1=1;Bit2=0
Bit1=0;Bit2=1
Bit1=0;Bit2=0
Frequency (MHz)
2-186
Rev B3 010417
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