The RF2153 is a high-power, high-efficiency linear amplifier IC targeting 3V handheld systems. The device is
manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been
designed for use as the final RF amplifier in 3 V CDMA
and TDMA handheld digital equipment, spread-spectrum
systems, and other applications in the 1750MHz to
1910 MHz band. The device is packaged in a compact
4mmx4mm (LCC). The device’s frequency response can
be optimized for linear performance in the 1750MHz to
1910MHz band.
CDMA/TDMA/PACS
1900MHZ 3V P OWER AMPLIFIER
• 3V TDMA PCS Handsets
• Spread-Spectrum Systems
• Commercial and Consumer Systems
3.50
3.35
1.50
1.20
4.20
3.95
0.38
2.00
0.28
0.13
0.80
4.20
3.95
3.50
3.35
1
ALL SOLDER PAD TOLERANCES P0.05mm
0.40
sq.
1.50 sq.
2
POWER AMPLIFIERS
Optimum Technology Matching® Applied
Si BJTGaAs MESFETGaAs HBT
Si Bi-CMOS
GND2
VCC1
RFIN
!
SiGe HBT
VCC2
VCC2
161415
1
2
3
4
678
5
VPD1
GND1
VCC2
V MODE
VCC
VPD2
Si CMOS
2F0
13
12
RF OUT
11
RF OUT
10
RF OUT
9
BIAS GND
Functional Block Diagram
Package Style: MP16KO1A
Features
• Single 3V Supply
• 29dBm Linear Ou tput Power
• 30dB Linear Gain
• 33% Linear Efficiency CDMA
• 40% Linear Efficiency TDMA
• On-board Power Down Mode
Ordering Information
RF2153CDMA/TDMA/PACS 1900MHz 3V Power Amplifier
RF2153 PCBAFully Assembled Evaluation Board
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A18 001114
2-167
Page 2
2
RF2153
Absolute Maximum Ratings
ParameterRatingUnit
Supply Voltage (RF off)+8.0V
Supply Voltage (P
Mode Voltage (V
≤31dBm)+4.5V
OUT
)+3.5V
MODE
Control Voltage (VPD)+3.5V
Input RF Power+10dBm
Operating Case Temperature-30 to +110°C
Storage Temperature-30 to +150°C
DC
DC
DC
DC
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printi ng. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
Caution! ESD sensitive device.
Specification
UnitCondition
Overall - CDMA
POWER AMPLIFIERS
Parameter
Min.Typ.Max.
Usable Frequency Range17501910MHz
Typi cal Frequency Range1750-1780
1850-1910
MHz
MHz
Small Signal Gain303234dB V
2629 V
Linear Gain2629dB V
Second Harmonic (including
-35dBc
second harmonic trap)
Third Harmonic-40dBc
Fourth Harmonic-45dBc
Minimum Linear Output Power
29dBm
(CDMA or TDMA Modulation)
Idle Current90100200mAV
CDMA Linear Efficiency3033P
CDMA Adjacent Channel Power
Power supply f or second stage and interstage match. Pins 1, 15 and 16
should be connected by a common trace where the pins contact the
printed circuit board.
Ground for second stage. Keep traces physically short and connect
immediately to ground plane for best performance. This ground should
be isolated from the backside ground contact on top metal layer.
Power supply for first stage and interstage match. VCC should be fed
through a 1.5nH inductor terminated with a 15pF capacitor on the sup-
ply side.
RF input. An external 15pF series capacitor is required as a DC block
and also provides for an input VSWR of <2:1 typical.
Ground for first stage. Keep traces physically short and connect immediately to ground plane for best performance. This ground should be
isolated from the backside ground contact on top metal layer.
Power Down control for first and second stages. When this pin is “low”,
all first and second stage circuits are shut off. When this pin is 2.8V, all
first stage circuits are operating normally. V
2.8V for the amplifier to operate properly over all specified temperature
and voltage ranges. A dropping resistor from a higher regulated voltage
may be used to provide the required 2.8V.
For full power operation, MODE is set low. VMODE will reduce the bias
current by up to 50% when set HIGH. Large Signal Gain is reduced
approximately 1.5dB at 29dBm P
approximately 6dB. An external series resistor is option al to limit the
amount of current required by the V
Power Down control for the third stage. When this pin is “low”, the third
stage circuit is shut off. When this pin is 2.8V, the third stage circuit is
operating normally. V
operate properly over all specified temperatu re and voltage ranges. A
dropping resistor from a higher regulated voltage may be used to provide the required 2.8V. A 15pF high frequency bypass capacitor is recommended.
Requires a 15nH inductor.
RF output and power supply for final stage. This is the unmatched col-
lector output of the third stage. A DC block is required following the
matching components. The biasing may be provided via a parallel L-C
set for resonance at the operating frequency of 1850MHz to 1910MHz.
It is important to select an inductor with very low DC resistance with a
1A current rating. Alternatively, shunt microstrip techniques are also
applicable and provide very low DC resistance. Low frequency bypassing is required for stability.
Same as pin 12.See pin 10.
Same as pin 12.See pin 10.
Second harmonic trap . Keep traces physically short and connect imme-
diately to ground plane. This ground should be isolated from backside
ground contact.
Supply for bias reference and control circuits. High frequency bypassing may be necessary.
Same as pin 1.
Same as pin 1.
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with multiple vias. The pad should have a short thermal path to the ground
plane.
requires a regulated 2.8V for the amplifier to
PD
and Small Signal Gain is reduced
OUT
MODE
requires a regulated
PD1
pin.
See pin 4.
RF IN
See pin 4.
From Bias
Network
RF OUT
From Bias
Network
VCC1
GND1
2-170
Rev A18 001114
Page 5
Application Schemati c
US - CDMA
V
CC
2nd Interstage tuning for
centering frequency response