
Preliminary
RF2119
2
Typical Applications
•Two-WayPagers
• 915MHz ISM Band Equipment
• Spread-Spectrum Systems
Product Description
The RF2119 is a high-power, high-efficiency amplifier IC
targeting 2V to 4V handheld systems. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been
designed for use as the final RF amplifier in hand-held
digital cellular equipment, spread spectrum systems, and
other applications in the 800MHz to 960MHz band. The
device is well suited for either CW or pulsed applications.
At 3V, the RF2119 can deliver 29.5dBm of linear output
power. The device is self-contained with 50Ω input and
the output can be easily matched to obtain optimum
power, efficiency, and linearity characteristics. The package is a PSSOP-16 with backsideground.
HIGH EFFICIENCY 2V POWER AMPLIFIER
• 3V AMPS/ETACS Cellular Handsets
•CDPDPortableDataCards
• Personal Digital Cellular
4.90 ± 0.10
8° MAX
0° MIN
3.90
±0.10
6.00 ± 0.20
0.60 ± 0.15
0.24
0.20
0.25 ± 0.05
0.635
1.40 ± 0.10
-A-
0.05 ± 0.05
3
Exposed
Heat Sink
1.70 ± 0.10
3
2.70 ± 0.10
2
POWER AMPLIFIERS
Optimum Technology Matching® Applied
Si BJT GaAs MESFETGaAs HBT
Si Bi-CMOS
GND
LMATCH
GND
VCC
GND1
RF IN
GND
BIAS1
ü
SiGe HBT
1
2
3
4
5
6
7
BIAS
8
CIRCUITS
PACKAGE BASE
GND
Si CMOS
BIAS2
16
NC
15
RF OUT
14
RF OUT
13
RF OUT
12
NC
11
NC
10
VPC
9
Functional Block Diagram
Package Style: PSSOP-16
Features
• Single 2V to 5V Supply
• 30dBm Output Power at 2.5V
• 30dB Small Signal Gain
• 53% Efficiency
• On-board Power Down Mode
• 800MHz to 960MHz Operation
Ordering Information
RF2119 High Efficiency 2V Power Amplifier
RF2119 PCBA Fully Assembled Evaluation Board
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro,NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A8 010720
2-55

RF2119
Preliminary
2
Absolute Maximum Ratings
Parameter Rating Unit
Supply Voltage (RF off) +8.0 V
Supply Voltage +5.2 V
Control Voltage (VPC)+3.0V
Input RF Power +12 dBm
CW Dissipated Power 1.8 W
Peak Dissipated Power 2.5 W
Operating Case Temperature -30 to +110 °C
Storage Temperature -30 to +150 °C
Parameter
POWER AMPLIFIERS
Overall
Usable Frequency Range 800 902 960 MHz
Small Signal Gain 30 dB
Maximum CW Output Power 29.5 30.5 31.5 dBm Supply Voltage=2.5V
Maximum Pulsed Output Power 30 31 32 Supply Voltage=2.5V, 12.5% duty cycle
Total CW Efficiency 45 51 %
Pulsed Efficiency 47 53 % 12.5% duty cycle
Input Power 0 +2 +6 dBm
OFF Isolation -25 dBm V
Second Harmonic Suppression 45 dBc
Third Harmonic Suppression >60 dBc
Input VSWR <2:1 With a 50Ω source impeda nce
Output Load VSWR 10:1 No damage.
Specification
Min. Typ. Max.
31 32 34 dBm Supply Voltage=3.0V
32.5 33.5 35 dB m Supply Voltage=3.5V
29.3 dB m Supply Voltage=2.0V
31.5 33 34.5 Supply Voltage=3.0V, 12.5% duty cycle
33 34 35.5 Supply Voltage=3.5V, 12.5% duty cycle
AMPS Application #1
Frequency 824 to 849 MHz
Maximum Output Power 30.5 dBm
Efficiency @ Maximum Output
Power
Idle Current 195 250 mA
Second Harmonic Suppression -45 dBc
Current Total 760 mA
50 %
AMPS Application #2
Frequency 824 to 849 MHz
Maximum Output Power 29.5 30.5 dBm V
30.8 31.5 dBm V
32 33 dBm V
Efficiency @ Maximum Output
Power
Idle Current 120 mA
I
@ Maximum Output Power 20 mA
PC
50 55 %
DC
DC
DC
Refer to “Handling ofPSOP and P SSOP Products”
on page 16-15 for special handling information.
Caution! ESD sensitive device.
RF Micro Devices believesthe furnishedinformation is correctand accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice.RF Micro Devices does not
assume responsibility for the use of the described product(s).
Unit Condition
T=25°C, VCC=2.5V, VPC=2.2V,
Freq=902MHz, P
=0V,Input Power=+6dBm
PC
T=25°C, VCC=3.4V, VPC=1.8V,
Freq=836MHz, P
T=25°C, VCC=3.5V, VPC=1.6V,
Freq=836MHz, P
application schematic)
=2.7V
CC
=3.0V
CC
=3.5V
CC
=2dBm
IN
=+3dBm
IN
= +8dBm (see AMPS
IN
2-56
Rev A8 010720

Preliminary
RF2119
Parameter
Specification
Min. Typ. Max.
Unit Condition
Power Down C ontrol
Turn On/Off Time 100 ns
V
“OFF” Voltage 0.2 0.5 V
PC
“ON” Voltage 2.0 2.2 2.8 V
V
PC
“ON” Current 30 mA VPC=2.2V
I
PC
“OFF” Current 10 µA Standby, VPC=0.5V
I
PC
Power Supply
Voltage 2.5 V Specifications
Voltage 2.0 5.0 V Operating Limits
Current Total 700 900 1200 mA V
=2.5V,VPC=2.2V,
CC
P
=+3dBm,T=25°C
IN
2
POWER AMPLIFIERS
Rev A8 010720
2-57

2
RF2119
Preliminary
Pin Function Description Interface Schematic
1GND
2LMATCH
3GND
4 VCC1
5 GND1
6RFIN
7GND
POWER AMPLIFIERS
8BIAS1
9 VPC
10 NC
11 NC
12 RF OUT
13 RF OUT
14 RF OUT
15 NC
16 BIAS2
Pkg
GND
Base
Ground extern ally.
Interstage tuning. This pin is internally DC blocked and will connectto a
shunt inductor or microstrip line used for interstage tuning. Length from
pin to via should be approximately 6 0mils for 915MHz and 75mils for
902MHz and 120mils for 836MHz. The lumped element equ ivalent is
1.2nH to 2.0nH to ground, depending on frequency band of interest.
Ground extern ally.
Power supply for stage 1. VCCshould be fed through a 3.9nH inductor
with a decoupling capacitor on the V
Ground for stage 1. Keep traces physically short and connect immediately to ground plane for best performance.
RF input. An external DC blocking capacitor is required if this port is
connected to a DC path to ground or a DC voltage.
Ground extern ally.
Ground return for the first stage bias. This pin should be connectedtoa
33nH inductor to ground.
Power control voltage. For maximum power, this voltage should be a t
least 2.2V. To turn off, this voltage should be less than 0.6 V. This pin
should be bypassed as close to the pin as practical.
No connection.
No connection.
RF output and power supply for the output stage. T he bias for the out-
put stage is provided through this pin and pin 13. An external matching
network is required to provide the optimum load impedance; see the
application schematics for details.
Same as pin 12.
Same as pin 12.
No connection.
Ground return for the second stage bias. This pin should be connected
to a 33nH inductor to ground.
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with multiple vias. The pad should have a short thermal path to the ground
plane.
CC
side.
2-58
Rev A8 010720

Preliminary
Application Schemati c
902MHz to 928MHz (V
=2.5V)
CC
RF2119
RF IN
RF IN
1
60 mils
V
CC
33 pF
3.9 nH
33 pF
33 nH
2
3
4
5
6
7
BIAS
8
CIRCUITS
PACKAGE BASE
33 nH
16
15
14
13
12
11
10
9
22 nH
22 nH
1.8 nH
12pF 5.6 pF
33 pF
33 pF
V
CC
2
1nF3.3µF
33 pF
RF OUT
POWER AMPLIFIERS
VPC
AMPS Application Schematic
824MHz to 849MHz (V
1
120 mils
V
CC
33 pF
2pF
15 nH
2pF
2
3
4
5
6
33 nH
16
15
14
13
12
11
=3.5V)
CC
22 nH
22 nH
2.2 nH
10 pF 6pF
33 pF
V
CC
1nF3.3µF
33 pF
RF OUT
Rev A8 010720
12 nH
33 nH
7
BIAS
8
CIRCUITS
PACKAGE BASE
10
9
33 pF
VPC
2-59

RF2119
Evaluation Board Schema t ic
824MHz to 928MHz (V
(Download Bill of Materials from www.rfmd.com.)
=3.5V)
CC
Preliminary
2
C8
1nF
P1
1
2
3
GND
GND
VCC
P1-1
C9
µ
3.3
RF OUT
P1-3
F
P2
1
2
3
C5
5.6 pF
C10
1nF
VPC
GND
GND
C2
33 pF
P1-1
C7
33 pF
P1-3
Drawing 2119400-
L1
1
60-120 mils
POWER AMPLIFIERS
P1-1
C6
33 pF
RF IN
Two Layer: (31 mils; w/plating)
L2
3.9 nH
C1
33 pF
L3
33 nH
PCB mat'l: FR-4;
2
3
4
5
6
7
BIAS
8
CIRCUITS
PACKAGE BASE
Off of Pin 2: 60 mil microstrip line for 902
MHZ to 928 MHz and 75 mil microstrip line
for 890 MHZ to 915 MHz and 120 mil for 824
MHz to 849 MHz. Lumped element off of Pin
2 would be 1.2 nH to 2.0 nH to ground
depending on frequency band of interest.
33 nH
16
15
14
13
12
11
10
9
L5 22nH
L6
22 nH
L4
1.8 nH
C4
12pF
C3
33 pF
2-60
Rev A8 010720