Datasheet RC5058 Datasheet (Fairchild Semiconductor)

Page 1
www.fairchildsemi.com
RC5058
High Performance Programmable Synchronous DC-DC Controller for Multi-Voltage Platforms
Features
•P rogrammable output for Vcore from 1.3V to 3.5V using
an integrated 5-bit DAC Controls adjustable linears for Vagp (selectable 1.5V/3.3V),
• Vclock (2.5V), and Vtt (1.5V) or Vnorthbridge (1.8V)
• Meets VRM specification with as few as 5 capacitors
• Meets 1.550V +40/-70mV over initial tolerance, temperature and transients
• Remote sense
• Programmable Active Droop™ (Voltage Positioning)
• Drives N-Channel MOSFETs
• Overcurrent protection using MOSFET sensing
• 85% efficiency typical at full load
• Integrated Power Good and Enable/Soft Start functions
• 24 pin SOIC package
Block Diagram
+3.3V
+1.5V
+2.5V
9
+
10
VCCP
11
+
12
OSC
REF
­PWRGD,
OCL
REF
-
PWRGD, OCL
OCL
VCCA
-
+
Applications
• Power supply for Pentium
• Power supply for Pentium III Whitney Platform
• VRM for Pentium III processor
• Programmable multi-output power supply
®
III Camino Platform
Description
The RC5058 is a synchronous mode DC-DC controller IC which provides a highly accurate, programmable set of output voltages for multi-voltage platforms such as the Intel Camino, and provides a complete solution for the Intel Whitney and other high-performance processors. The RC5058 features remote voltage sensing, independently adjustable current limit, and a proprietary Programmable Active Droop transient response. The RC5058 uses a 5-bit D/A converter to program the output voltage from 1.3V to 3.5V. The RC5058 uses a high level of integration to deliver load currents in excess
+5V
21
-
+
-
+
19
18
20 24
1
R
R
S
VCCP HIDRV
D
+12V
™
for optimal converter
+5V
15
14
+
V
-
5-Bit
DAC
VID2
PWRGD, OCL
VID4
VID3
3.3/1.5V
Pentium is a registered trademark of Intel Corporation. Programmable Active Droop is a trademark of Fairchild Semiconductor.
13
87654
VID0
VID1
-
+
1.24V
Reference
-
+
3
GNDA
Digital
Control
16
ENABLE/SS
Power
Good
2
23
22
17
LODRV
GNDP
PWRGD
VCC
Rev. 1.0.0
Page 2
2
RC5058 PRODUCT SPECIFICATION
of 16A from a 5V source with minimal external circuitry. Synchronous-mode operation offers optimum efficiency over the entire specified output voltage range. An on-board precision low TC reference achieves tight tolerance voltage regulation without expensive external components, while Programmable Active Droop
™
permits exact tailoring of voltage for the most demanding load transients. The RC5058 includes linear regulator controllers for Vtt termination (1.5V), Vclock (2.5V), and Vnorthbridge (1.8V) or Vagp (selectable 1.5V/3.3V), each adjust­able with an external divider. The RC5058 also offers integrated functions including Power Good, Output Enable/Soft Start and current limiting, and is available in a 24 pin SOIC package.
Pin Definitions
Pin
Number Pin Name Pin Function Description
1 HIDRV
2SW
3 GNDA
4-8 VID0-4
9 VTTGATE Gate Driver for VTT Transistor. For 1.5V output. 10 VTTFB 11 VCKGATE Gate Driver for VCK Transistor. For 2.5V output. 12 VCKFB 13 VAGPFB 14 VAGPGATE Gate Driver for VAGP Transistor. For 3.3/1.5V output. 15 TYPEDET Type Detect. Sets 3.3V or 1.5V for AGP. 16 ENABLE/SS Output Enable. A logic LOW on this pin will disable all outputs. An internal current source
17 PWRGD
18 ILIM
19 DROOP 20 VFB
21 VCCA 22 GNDP 23 LODRV
24 VCCP
High Side FET Driver. Connect this pin through a resistor to the gate of an N-channel
MOSFET. The trace from this pin to the MOSFET gate should be <0.5".
High side Driver Source and Low side Driver Drain Switching Node. Together with
DROOP and ILIM pins allows FET sensing for Vcc current.
Analog Ground. Return path for low power analog circuitry. This pin should be
connected to a low impedance system ground plane to minimize ground loops.
Voltage Identification Code Inputs. These open collector/TTL compatible inputs will
program the output voltage over the ranges specified in Table 2. Pull-up resistors are internal to the controller.
Voltage Feedback for VTT.
Voltage Feedback for VCK. Voltage Feedback for VAGP.
allows for open collector control. This pin also doubles as soft start for all outputs.
Power Good Flag. An open collector output that will be logic LOW if any output voltage
is more than ±12% outside of the nominal output voltage setpoint.
Vcc Current Feedback. Pin 18 is used in conjunction with pin 2 as the input for the Vcc
current feedback control loop. Layout of these traces is critical to system performance. See Application Information for details.
Droop set. Use this pin to set magnitude of active droop. Vcc Voltage Feedback. Pin 20 is used as the input for the Vcc voltage feedback control
loop. See Application Information for details regarding correct layout.
Analog VCC. Connect to system 5V supply and decouple with a 0.1µF ceramic capacitor. Power Ground. Return pin for high currents flowing in pin 24 (VCCP). Vcc Low Side FET Driver. Connect this pin through a resistor to the gate of an N-channel
MOSFET for synchronous operation. The trace from this pin to the MOSFET gate should be <0.5".
Power VCC. For all FET drivers. Connect to system 12V supply through a 33 Ω , and
decouple with a 1µF ceramic capacitor.
Pin Assignments
HIDRV
SW
GNDA
VID4 VID3 VID2
VID1
VID0
VTTGATE
VTTFB
VCKGATE
VCKFB
1 2 3 4 5 6 7 8 9 10 11 12
RC5058
24 23 22 21 20 19 18 17 16 15 14 13
VCCP LODRV GNDP VCCA VFB DROOP ILIM PWRGD SS/ENABLE TYPEDET VAGPGATE VAGPFB
REV. 1.0.0 6/30/00
Page 3
PRODUCT SPECIFICATION RC5058
Absolute Maximum Ratings
Supply Voltage VCCA to GND 13.5V Supply Voltage VCCP to GND 15V Voltage Identification Code Inputs, VID0-VID4 VCCA All Other Pins 13.5V Junction Temperature, T
J
150°C Storage Temperature -65 to 150°C Lead Soldering Temperature, 10 seconds 300°C Thermal Resistance Junction-to-ambient, Θ
Note:
1. Component mounted on demo board in free air.
JA
1
75°C/W
Recommended Operating Conditions
Parameter Conditions Min. Typ. Max. Units
Supply Voltage VCCA 4.5 5 5.25 V Input Logic HIGH 2.0 V Input Logic LOW 0.8 V Ambient Operating Temperature 0 70 °C Output Driver Supply, VCCP 10.8 12 13.2 V
Electrical Specifications
(V
= 5V, V
CCA
The • denotes specifications which apply over the full operating temperature range.
Parameter Conditions Min. Typ. Max. Units VCC Regulator
Output Voltage See Table 1 • 1.3 3.5 V Output Current 18 A Initial Voltage Setpoint I
Output Temperature Drift T
Line Regulation V Internal Droop Impedance I Maximum Droop 60 mV Output Ripple 20MHz BW, I Total Output Variation,
Steady State
Total Output Variation,
Transient Short Circuit Detect Current • 45 50 60 µA Efficiency I Output Driver Rise & Fall Time See Figure 3 50 nsec Output Driver Deadtime See Figure 3 50 nsec
CCP
2
= 12V, V
1
= 2.0V, and T
OUT
= +25°C using circuit in Figure 1 unless otherwise noted.)
A
= 0.8A,V
LOAD
= 0 to 70°C,V
A
= 4.75V to 5.25V • -4 mV/V
IN
= 0.8A to 12.5A 13.0 14.4 15.8 K Ω
LOAD
V
= 2.000V
OUT
V
= 1.550V
OUT
I
= 0.8A to 18A, V
LOAD
= 18A, V
LOAD
= 2.400V
OUT
V
= 2.000V
OUT
V
= 1.550V
OUT
= 2.000V
OUT
V
= 1.550V
OUT
= 18A 11 mVpk
LOAD
3
= 2.000V
OUT
V
= 1.550V
OUT
= 2.0V 85 %
OUT
3
2.397
2.000
1.550
•
•
••1.940
1.480
••1.900
1.480
2.424
2.020
1.565 +8
+6
2.454
2.040
1.580
2.070
1.590
2.100
1.590
V V V
mV mV
V
V
REV. 1.0.0 6/30/00
3
Page 4
4
≤
≤
≤
≤
RC5058 PRODUCT SPECIFICATION
Electrical Specifications
(V
CCA
= 5V, V
CCP
= 12V, V
OUT
(Continued)
= 2.0V, and T
= +25°C using circuit in Figure 1 unless otherwise noted.)
A
The • denotes specifications which apply over the full operating temperature range.
Parameter Conditions Min. Typ. Max. Units
Duty Cycle 0 100 % 5V UVLO • 3.74 4 4.26 V 12V UVLO • 7.65 8.5 9.35 V Soft Start Current • 5 10 17 µA
VTT Linear Regulator
Output Voltage I
2A • 1.455 1.5 1.545 V
LOAD
Under Voltage Trip Level Over Current 80 %V
VCLK Linear Regulator
Output Voltage I
2A • 2.375 2.5 2.625 V
LOAD
Under Voltage Trip Level Over Current 80 %V
VAGP Linear Regulator
Output Voltage I Output Voltage I
2A, TYPEDET=0V • 1.425 1.5 1.575 V
LOAD
2A, TYPEDET=OPEN • 3.135 3.3 3.465 V
LOAD
Under Voltage Trip Level Over Current 80 %V
Common Functions
Oscillator Frequency • 255 310 345 kHz PWRGD Threshold Logic HIGH, All Outputs
Linear Regulator Under Voltage
Logic LOW, Any Output Over Current 30 µsec
•
92
•
88
108 112
Delay Time
Notes:
1. Steady State Voltage Regulation includes Initial Voltage Setpoint, Droop, Output Ripple and Output Temperature Drift and is measured at the converter’s VFB sense point.
2. As measured at the converter’s VFB sense point. For motherboard applications, the PCB layout should exhibit no more than
0.5m Ω trace resistance between the converter’s output capacitors and the CPU. Remote sensing should be used for optimal performance.
3. Using the VFB pin for remote sensing of the converter’s output at the load, the converter will be in compliance with Intel’s VRM 8.4 specification of +50, –80mV. If Intel specifications on maximum plane resistance from the converter’s output capacitors to the CPU are met, the specification of +40, –70mV at the capacitors will also be met.
%V
O
O
O
OUT
REV. 1.0.0 6/30/00
Page 5
PRODUCT SPECIFICATION RC5058
Table 1. Output Voltage Programming Codes
VID4 VID3 VID2 VID1 VID0 Nominal V
01111 1.30V 01110 1.35V 01101 1.40V 01100 1.45V 01011 1.50V 01010 1.55V 01001 1.60V 01000 1.65V 00111 1.70V 00110 1.75V 00101 1.80V 00100 1.85V 00011 1.90V 00010 1.95V 00001 2.00V 00000 2.05V 11111 2.0V 11110 2.1V 11101 2.2V 11100 2.3V 11011 2.4V 11010 2.5V 11001 2.6V 11000 2.7V 10111 2.8V 10110 2.9V 10101 3.0V 10100 3.1V 10011 3.2V 10010 3.3V 10001 3.4V 10000 3.5V
OUT
Note:
1. 0 = processor pin is tied to GND. 1 = processor pin is open.
REV. 1.0.0 6/30/00
5
Page 6
RC5058 PRODUCT SPECIFICATION
V
Typical Operating Characteristics
(V
= 5V, V
CCA
88 86 84 82 80 78 76
Efficiency (%)
74 72 70 68 66 64
0 3 6 9 12 15 18
= 12V, and T
CCP
V
Efficiency vs. Output Current
CPU
V
= 1.550V
OUT
Output Current (A)
= +25°C using circuits in Figure 1, unless otherwise noted.)
A
Droop, V
2.04
V
= 2.000
OUT
2.03
2.02
2.01
2.00
1.99
(V)
1.98
OUT
V
1.97
1.96
1.95
1.94 0 3 6 9 12 15 18
= 2.0V, RD = 8K Ω
CPU
Output Current (A)
6
CPU Output Voltage vs. Output Current
3.5
3.0
2.5
2.0
(V)
OUT
1.5
Output Programming, VID4 = 0
2.1
1.9
1.7
(V)
1.5
CPU
V
1.3
V
1.0
0.5 0
0 5 10 15 20 25
Output Current (A)
3.5
3.0
2.5
(V)
2.0
CPU
V
1.5
Output Programming, VID4 = 1
1.1
1.30 1.40 1.50 1.60 1.70 1.80 1.90 2.00
DAC Setpoint
1.0
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2. 3.3 3.4 3.5
DAC Setpoint
REV. 1.0.0 6/30/00
Page 7
PRODUCT SPECIFICATION RC5058
Typical Operating Characteristics
Output Ripple, 2.0V @ 18A
(20mV/div)
CPU
V
Time (1µs/div)
Transient Response, 0.5A to 12.5A
1.590V
(50mV/div)
CPU
V
1.550V
1.480V
(continued)
Transient Response, 12.5A to 0.5A
(50mV/div)
CPU
V
Switching Waveforms, 18A Load
5V/div 5V/div
1.590V
1.550V
1.480V
Time (100µs/div)
HIDRV pin
LODRV pin
(2V/div)
IN
(1V/div) V
CPU
V
Time (100µs/div)
Output Startup, System Power-up
Time (10ms/div)
Time (1µs/div)
Output Startup from Enable
(1V/div) ENABLE (2V/div)
CPU
V
Time (10ms/div)
REV. 1.0.0 6/30/00
7
Page 8
RC5058 PRODUCT SPECIFICATION
Typical Operating Characteristics (continued)
Linear Regulator Noise
2.042
2.040
2.038
(10mV/div)
OUT
(V)
CPU
V
2.036
2.034
2.030
2.028
2.026 0 25 70 100
Application Circuit
L1
+5V
(Optional)
VO
C
OUT
C10 C11
*
L2
3.3V IN
1.5V†
C8
Temperature (°C)
CIN*
C2
Q1
Q2
D1
Q3
2.5V†
AC COUPLED V
Time (100µs/div)
R7
R5
R2
R3
Q4
C9
R6
VID4
VID3 VID2
VID1
VID0
C1
C4
R1
+12V
C5
ENABLE/SS
VCC
R4
PWRGD
C6
, C
IN
OUT
,
1 2
3 4
U1
5
RC5058
6 7 8 9
10 11
12
24 23
22 21
20 19 18 17 16 15
14 13
TYPEDET
C12
C3
Q5
3.3/1.5V (AGP)†
C7
* Refer to Appendix for values of C
R5 and R7.
† Adjustable with an external divider.
Figure 1. Typical Application Circuit
(Worst Case Analyzed! See Appendix for Details)
8 REV. 1.0.0 6/30/00
Page 9
PRODUCT SPECIFICATION RC5058
Table 2. RC5058 Application Bill of Materials
(Components based on Worst Case Analysis—See Appendix for Details)
Reference Manufacturer Part # Quantity Description Requirements/Comments
C1 AVX
TAJB475M010R5
C2, C5 Panasonic
ECU-V1C105ZFX
C3-4,C6 Panasonic
ECU-V1H104ZFX
C7-9 Sanyo
6MV1000FA C10-12 Any 3 22µF, 6.3V Capacitor Low ESR C
IN
Sanyo
10MV1200GX C
OUT
Sanyo
6MV1500GX D1 Motorola
MBRD835L L1 Any Optional 2.5µH, 8A Inductor DCR ~ 10mΩ
L2 Any 1 1.3µH, 20A Inductor DCR ~ 2mΩ Q1 Fairchild
FDB6030L Q2 Fairchild
FDB7030BL Q3-5 Fairchild
FDB4030L R1 Any 1 33Ω R2-3 Any 2 4.7Ω R4 Any 1 10KΩ R5 Any 1 * R6 Any 1 10Ω R7 Any 1 * U1 Fairchild
RC5058M
1 4.7µF, 10V Capacitor
2 1µF, 16V Capacitor
3 100nF, 50V Capacitor
3 1000µF, 6.3V Electrolytic
* 1200µF, 10V Electrolytic I
RMS
= 2A
* 1500µF, 6.3V Electrolytic ESR ≤ 44mΩ
1 8A Schottky Diode
See Note 1.
1 N-Channel MOSFET R
DS(ON)
= 20mΩ @
VGS = 4.5V See Note 2.
1 N-Channel MOSFET R
V
= 10mΩ @
DS(ON)
= 4.5V See Note 2.
GS
3 N-Channel MOSFET
1 DC/DC Controller
Notes:
1. Inductor L1 is recommended to isolate the 5V input supply from noise generated by the MOSFET switching, and to comply with Intel dI/dt requirements. L1 may be omitted if desired.
2. For 17.4A designs using the TO-220 MOSFETs, heatsinks with thermal resistance ΘSA < 20°C/W should be used. For designs using the TO-263 MOSFETs, adequate copper area should be used. For details and a spreadsheet on MOSFET selections, refer to Applications Bulletins AB-8 and AB-15.
*Refer to Appendix for values.
REV. 1.0.0 6/30/00 9
Page 10
RC5058 PRODUCT SPECIFICATION
L1
+5V
(Optional)
CIN*
VO
C
*
OUT
C10 C11
R7
R5
C2
Q1
L2
R8
Q2
D1
3.3V IN
Q3
1.5V†
C8
2.5V†
R2
R3
Q4
C9
R6
VID4 VID3 VID2
VID1 VID0
C1
C4
R1
+12V
C5
ENABLE/SS
VCC
OUT
R4
PWRGD
C6
and CIN.
1 2
3 4
U1
5
RC5058
6 7 8 9
10 11
12
24 23
22 21
20 19 18 17 16 15
14 13
TYPEDET
C12
C3
Q5
3.3/1.5V (AGP)†
C7
*Refer to Table 4 for values of C
† Adjustable with an external divider.
Figure 2. Application Circuit for Coppermine/Camino Motherboards
(Typical Design)
10 REV. 1.0.0 6/30/00
Page 11
PRODUCT SPECIFICATION RC5058
Table 3. RC5058 Application Bill of Materials for Intel Coppermine/Camino Motherboards
(Typical Design)
Reference Manufacturer Part # Quantity Description Requirements/Comments
C1 AVX
TAJB475M010R5
C2, C5 Panasonic
ECU-V1C105ZFX
C3-4,C6 Panasonic
ECU-V1H104ZFX
C7-9 Sanyo
6MV1000FA C10-12 Any 3 22µF, 6.3V Capacitor Low ESR C
IN
Sanyo
10MV1200GX C
OUT
Sanyo
6MV1500GX D1 Motorola
MBRD835L L1 Any Optional 2.5µH, 5A Inductor DCR ~ 10mΩ
L2 Any 1 1.3µH, 15A Inductor DCR ~ 3mΩ Q1 Fairchild
FDB6030L Q2 Fairchild
FDB7030BL Q3-5 Fairchild
FDB4030L R1 Any 1 33Ω R2-3 Any 2 4.7Ω R4 Any 1 10KΩ R5, R7 Any 2 6.24KΩ R6 Any 1 10Ω R8 N/A 1 3.0mΩ PCB Trace Resistor U1 Fairchild
RC5058M
1 4.7µF, 10V Capacitor
2 1µF, 16V Capacitor
3 100nF, 50V Capacitor
3 1000µF, 6.3V Electrolytic
3 1200µF, 10V Electrolytic I
RMS
= 2A
12 1500µF, 6.3V Electrolytic ESR ≤ 44mΩ
1 8A Schottky Diode
See Note 1.
1 N-Channel MOSFET R
V
1 N-Channel MOSFET R
V
= 20mΩ @
DS(ON)
= 4.5V See Note 2.
GS
= 10mΩ @
DS(ON)
= 4.5V See Note 2.
GS
3 N-Channel MOSFET
1 DC/DC Controller
Notes:
1. Inductor L1 is recommended to isolate the 5V input supply from noise generated by the MOSFET switching, and to comply with Intel dI/dt requirements. L1 may be omitted if desired.
2. For 12.5A designs using the TO-220 MOSFETs, heatsinks with thermal resistance Θ designs using the TO-263 MOSFETs, adequate copper area should be used. For details and a spreadsheet on MOSFET selections, refer to Applications Bulletins AB-8 and AB-15.
REV. 1.0.0 6/30/00 11
< 20°C/W should be used. For
SA
Page 12
RC5058 PRODUCT SPECIFICATION
Test Parameters
t
R
5V
2V
t
DT
2V
Figure 3. Ouput Drive Timing Diagram
5V
2V
t
F
HIDRV to SW
t
DT
2V
LODRV
Application Information
The RC5058 Controller
The RC5058 is a programmable synchronous DC-DC con­troller IC. When designed around the appropriate external components, the RC5058 can be configured to deliver more than 16A of output current, as appropriate for the Katmai and Coppermine and other processors. The RC5058 functions as a fixed frequency PWM step down regulator.
Main Control Loop
Refer to the RC5058 Block Diagram on page 1. The RC5058 implements “summing mode control”, which is different from both classical voltage-mode and current-mode control. It provides superior performance to either by allowing a large converter bandwidth over a wide range of output loads.
The control loop of the regulator contains two main sections: the analog control block and the digital control block. The analog section consists of signal conditioning amplifiers feeding into a comparator which provides the input to the digital control block. The signal conditioning section accepts input from the DROOP (current feedback) and VFB (voltage feedback) pins and sets up two controlling signal paths. The first, the voltage control path, amplifies the difference between the VFB signal and the reference voltage from the DAC and presents the output to one of the summing amplifier inputs. The second, current control path, takes the difference between the DROOP and SW pins when the high-side MOSFET is on, reproducing the voltage across the MOSFET and thus the input current; it presents the resulting signal to another input of the summing amplifier. These two signals are then summed together. This output is then presented to a comparator looking at the oscillator ramp, which provides the main PWM control signal to the digital control block.
The digital control block takes the analog comparator input and the main clock signal from the oscillator to provide the appropriate pulses to the HIDRV and LODRV output pins. These two outputs control the external power MOSFETs.
High Current Output Drivers
The RC5058 contains two identical high current output drivers that utilize high speed bipolar transistors in a push-pull config­uration. The drivers’ power and ground are separated from the chip’s power and ground for switching noise immunity. The power supply pin, VCCP, is supplied from an external 12V source through a series 33Ω resistor. The resulting volt­age is sufficient to provide the gate to source drive to the external MOSFETs required in order to achieve a low R
DS,ON
Internal Voltage Reference
The reference included in the RC5058 is a precision band-gap voltage reference. Its internal resistors are precisely trimmed to provide a near zero temperature coefficient (TC). Based on the reference is the output from an integrated 5-bit DAC. The DAC monitors the 5 voltage identification pins, VID0-4. When the VID4 pin is at logic HIGH, the DAC scales the reference voltage from 2.0V to 3.5V in 100mV increments. When VID4 is pulled LOW, the DAC scales the reference from 1.30V to
2.05V in 50mV increments. All VID codes are available, includ­ing those below 1.80V.
Power Good (PWRGD)
The RC5058 Power Good function is designed in accordance with the Pentium II and III DC-DC converter specifications and provides a continuous voltage monitor on the VFB pin. The circuit compares the VFB signal to the VREF voltage and outputs an active-low interrupt signal to the CPU should the power supply voltage deviate more than ±12% of its nominal setpoint. Power Good outputs an open collector high when the output voltage is within ±8% of its nominal setpoint. The Power Good flag provides no other control function to the RC5058.
Output Enable/Soft Start (ENABLE/SS)
The RC5058 will accept an open collector/TTL signal for controlling the output voltage. The low state disables the output voltage. When disabled, the PWRGD output is in the low state.
Even if an enable is not required in the circuit, this pin should have attached a capacitor (typically 100nF) to softstart the switching. A larger value may occasionally be required if the converter has a very large capacitor at its output.
Over-Voltage Protection
The RC5058 constantly monitors the output voltage for protec­tion against over-voltage conditions. If the voltage at the VFB pin exceeds the selected program voltage, an over-voltage condition is assumed and the RC5058 disables the output drive signal to the external high-side MOSFET. The DC-DC converter returns to normal operation after the output voltage returns to normal levels.
There is an additional comparator in the analog control section whose function is to set the point at which the RC5058 current limit comparator disables the output drive signals to the external power MOSFETs.
12 REV. 1.0.0 6/30/00
Oscillator
The RC5058 oscillator section uses a fixed frequency of operation of 300KHz.
Page 13
PRODUCT SPECIFICATION RC5058
95%).
Design Considerations and Component Selection
Additional information on design and component selection may be found in Fairchild’s Application Note 57.
MOSFET Selection
This application requires N-channel Logic Level Enhancement Mode Field Effect Transistors. Desired characteristics are as follows:
• Low Static Drain-Source On-Resistance, R
DS,ON
< 20mΩ
(lower is better)
• Low gate drive voltage, VGS = 4.5V rated
• Power package with low Thermal Resistance
• Drain-Source voltage rating > 15V.
The on-resistance (R
is the primary parameter for
DS,ON)
MOSFET selection. The on-resistance determines the power dissipation within the MOSFET and therefore significantly affects the efficiency of the DC-DC Converter. For details and a spreadsheet on MOSFET selection, refer to Applica­tions Bulletin AB-8.
Inductor Selection
Choosing the value of the inductor is a tradeoff between allowable ripple voltage and required transient response. The system designer can choose any value within the allowed minimum to maximum range in order to either minimize ripple or maximize transient performance. The first order equation (close approximation) for minimum inductance is:
(V
– V
)
in
L
=
min
out
f
V
out
x
V
where: Vin = Input Power Supply
= Output Voltage
V
out
f = DC/DC converter switching frequency ESR = Equivalent series resistance of all output capacitors in parallel V
= Maximum peak to peak output ripple voltage budget.
ripple
The first order equation for maximum allowed inductance is:
(V
– V
in
L
max
2C
=
O
out
2
I
pp
where: Co = The total output capacitance Ipp = Maximum to minimum load transient current Vtb = The output voltage tolerance budget allocated to load transient Dm = Maximum duty cycle for the DC/DC converter (usually
x
in
) Dm V
ESR
V
ripple
tb
Some margin should be maintained away from both L L
. Adding margin by increasing L almost always adds
max
min
and
expense since all the variables are predetermined by system performance except for C
, which must be increased to
O
increase L. Adding margin by decreasing L can be done by purchasing capacitors with lower ESR. The RC5058 pro­vides significant cost savings for the newer CPU systems that typically run at high supply current.
RC5058 Short Circuit Current Characteristics
The RC5058 protects against output short circuit on the core supply by turning off both the high-side and low-side MOSFETs and resetting softstart. The short circuit limit is set with the RS resistor, as given by the formula
I
*R
SC
R
=
S
with I R
DS,on
≈ 50µA, I
Detect
the high-side MOSFET’s on resistance. Remember to
is the desired current limit, and
SC
make the RS large enough to include the effects of initial tol­erance and temperature variation on the MOSFET’s R Alternately, use of a sense resistor in series with the source of the MOSFET eliminates this source of inaccuracy in the current limit. The value of RS should be less than 8.3KΩ. If a greater value is necessary, a lower R be used instead.
As an example, Figure 4 shows the typical characteristic of the DC-DC converter circuit with an FDB6030L high-side MOSFET (RDS = 20mΩ maximum at 25°C * 1.25 at 75°C = 25mΩ) and a 8.2KΩ RS.
CPU Output Voltage vs. Output Current
3.5
3.0
2.5
2.0
(V)
OUT
1.5
V
1.0
0.5 0
0 5 10 15 20 25
Figure 4. RC5058 Short Circuit Characteristic
The converter exhibits a normal load regulation characteristic until the voltage across the MOSFET exceeds the internal short circuit threshold of 50µA * 8.2KΩ = 410mV, which occurs at 410mV/25mΩ = 16.4A. (Note that this current limit level can be as high as 410mV/15mΩ = 27A, if the MOSFET has typical R
rather than maximum, and is at 25°C).
DS,on
I
Detect
DS, on
MOSFET should
DS,on
DS,on
.
REV. 1.0.0 6/30/00 13
Page 14
RC5058 PRODUCT SPECIFICATION
converter, and to limit the inrush current into the input capac-
itors during power up. A value of 2.5µH is recommended. At this point, the internal comparator trips and signals the con­troller to discharge the softstart capacitor. This causes a drastic reduction in the output voltage as the load regulation collapses into the short circuit control mode. With a 40mΩ output short, the voltage is reduced to 16.4A * 40mΩ = 650mV. The output voltage does not return to its nominal value until the output current is reduced to a value within the safe operating ranges for the DC-DC converter.
It is necessary to have some low ESR aluminum electrolytic
capacitors at the input to the converter. These capacitors
deliver current when the high side MOSFET switches on.
Figure 5 shows 3 x 1000µF, but the exact number required
will vary with the speed and type of the processor. For the
top speed Katmai and Coppermine, the capacitors should be
rated to take 9A and 6A of ripple current respectively.
Capacitor ripple current rating is a function of temperature, If any of the linear regulator outputs are loaded heavily enough that their output voltage drops below 80% of nominal for >30µsec, all RC5058 outputs, including the switcher, are shut off and remain off until power is recycled.
and so the manufacturer should be contacted to find out the
ripple current rating at the expected operational temperature.
For details on the design of an input filter, refer to Applica-
tions Bulletin AB-15.
Schottky Diode Selection
The application circuit of Figure 1 shows a Schottky diode, D1, which is used as a free-wheeling diode to assure that the body-diode in Q2 does not conduct when the upper MOSFET is turning off and the lower MOSFET is turning on. It is undesirable for this diode to conduct because its high forward voltage drop and long reverse recovery time degrades efficiency, and so the Schottky provides a shunt path for the current. Since this time duration is very short, the selection criterion for the diode is that the forward voltage of the Schottky at the output current should be less than the forward voltage of the MOSFET’s body diode.
Output Filter Capacitors
The output bulk capacitors of a converter help determine its output ripple voltage and its transient response. It has already been seen in the section on selecting an inductor that the ESR helps set the minimum inductance, and the capacitance value helps set the maximum inductance. For most converters, however, the number of capacitors required is determined by the transient response and the output ripple voltage, and these are determined by the ESR and not the capacitance value. That is, in order to achieve the necessary ESR to meet the transient and ripple requirements, the capacitance value required is already very large.
The most commonly used choice for output bulk capacitors is aluminum electrolytics, because of their low cost and low ESR. The only type of aluminum capacitor used should be those that have an ESR rated at 100kHz. Consult Application Bulletin AB-14 for detailed information on output capacitor selection.
2.5µH
™
Vin
1000µF, 10V Electrolytic
5V
0.1µF
Figure 5. Input Filter
Programmable Active Droop
The RC5058 includes Programmable Active Droop™: as the
output current increases, the output voltage drops, and the
amount of this drop is user adjustable. This is done in order
to allow maximum headroom for transient response of the
converter. The current is typically sensed by measuring the
voltage across the R
of the high-side MOSFET during
DS,on
its on time, as shown in Figure 1.
To program the amount of droop, use the formula
where I
14.4KΩ *I
R
D
is the current at which the droop occurs, and R
max
V
max
Droop
*R
*18
sense
sense
is the resistance of the current sensor, either the source resistor
or the high-side MOSFET’s on-resistance. For example, to
get 30mV of droop with a maximum output current of 12.5A
and a 10mΩ sense resistor, use RD = 14.4KΩ * 12.5A * 10mΩ/
(30mV * 18) = 3.33KΩ. Further details on use of the
Programmable Active Droop™ may be found in Applications
Bulletin AB-24.
The output capacitance should also include a number of small value ceramic capacitors placed as close as possible to the processor; 0.1µF and 0.01µF are recommended values.
Input Filter
The DC-DC converter design may include an input inductor between the system +5V supply and the converter input as shown in Figure 5. This inductor serves to isolate the +5V
Remote Sense
The RC5058 offers remote sense of the output voltage to
minimize the output capacitor requirements of the converter.
It is highly recommended that the remote sense pin, Pin 20,
be tied directly to the processor power pins, so that the
effects of power plane impedance are eliminated. Further
details on use of the remote sense feature of the RC5058 may
be found in Applications Bulletin AB-24. supply from the noise in the switching portion of the DC-DC
14 REV. 1.0.0 6/30/00
Page 15
PRODUCT SPECIFICATION RC5058
traces that connect to pins 3, 20 and 21.
Adjusting the Linear Regulators’ Output Voltages
Any or all of the linear regulators’ outputs may be adjusted high to compensate for voltage drop along traces, as shown in Figure 6.
VGATE
VOUT
R
VFB
10KΩ
Figure 6. Adjusting the Output Voltage of the Linear
Regulator
The resistor value should be chosen as
V
R 10KΩ* –1
=
out
V
nom
For example, to get the VTT voltage to be 1.55V instead of
1.50V, use R = 10KΩ * [(1.55/1.50) – 1] = 333Ω.
Using the RC5058 for Vnorthbridge = 1.8V
In some motherboards, Intel requires that the AGP power can not be greater than 2.2V while the chipset voltage (Vnorthbridge =
1.8V) is less than 1.0V. The RC5058 can accomplish this by using the VTT regulator to generate Vnorthbridge. Use the circuit in Figure 6 with R = 2KΩ. Since the linear regulators on the RC5058 all rise proportionally to one another, when Vnorth­bridge = 1.0V, Vagp = 1.8V, meeting the Intel requirement.
• Place the 0.1µF decoupling capacitors as close to the RC5058 pins as possible. Extra lead length on these reduces their ability to suppress noise.
• Each VCC and GND pin should have its own via to the appropriate plane. This helps provide isolation between pins.
• Place the MOSFETs, inductor, and Schottky as close together as possible for the same reasons as in the first bullet above. Place the input bulk capacitors as close to the drains of the high side MOSFETs as possible. In addition, placement of a 0.1µF decoupling cap right on the drain of each high side MOSFET helps to suppress some of the high frequency switching noise on the input of the DC-DC converter.
• Place the output bulk capacitors as close to the CPU as possible to optimize their ability to supply instantaneous current to the load in the event of a current transient. Additional space between the output capacitors and the CPU will allow the parasitic resistance of the board traces to degrade the DC-DC converter’s performance under severe load transient conditions, causing higher voltage deviation. For more detailed information regarding capacitor placement, refer to Application Bulletin AB-5.
• A PC Board Layout Checklist is available from Fairchild Applications. Ask for Application Bulletin AB-11.
Additional Information
For additional information contact Fairchild Semiconductor at http://www.fairchildsemi.com/cf/tsg.htm or contact an autho­rized representative in your area.
PCB Layout Guidelines
• Placement of the MOSFETs relative to the RC5058 is critical. Place the MOSFETs such that the trace length of the HIDRV and LODRV pins of the RC5058 to the FET gates is minimized. A long lead length on these pins will cause high amounts of ringing due to the inductance of the trace and the gate capacitance of the FET. This noise radiates throughout the board, and, because it is switching at such a high voltage and frequency, it is very difficult to suppress.
• In general, all of the noisy switching lines should be kept away from the quiet analog section of the RC5058. That is, traces that connect to pins 1, 2, 23, and 24 (HIDRV, SW, LODRV and VCCP) should be kept far away from the
REV. 1.0.0 6/30/00 15
Page 16
RC5058 PRODUCT SPECIFICATION
Appendix
Worst-Case Formulae for the Calculation of Cin, Cout , R5, R7 and Roffset
Figure 1 only)
The following formulae design the RC5058 for worst-case operation, including initial tolerance and temperature dependence of all of the IC parameters (initial setpoint, reference tolerance and tempco, internal droop impedance, current sensor gain), the initial tolerance and temperature dependence of the MOSFET, and the ESR of the capacitors. The following information must be provided:
V
, the value of the positive static voltage limit;
S+
|, the absolute value of the negative static voltage limit;
|V
S-
V
, the value of the positive transient voltage limit;
T+
|VT-|, the absolute value of the negative transient voltage limit;
IO, the maximum output current;
V
, the nominal output voltage;
nom
Vin, the input voltage (typically 5V);
I
, the ripple current rating of the input capacitors, per cap
rms
(2A for the Sanyo parts shown in this datasheet);
RD, the resistance of the current sensor (usually the MOSFET);
(Circuits similar to
The value of R7 must be ≤ 8.3KΩ. If a greater value is calcu­lated, R
Number of capacitors needed for C
must be reduced.
D
X=
= the greater of:
out
ESR * I
O
V
+ V
T-
– .024 * V
S+
nom
or
Y
=
VT+ – V
S+
ESR * I
+
Example: Suppose that the static limits are +89mV/-79mV, transient limits are ±134mV, current I is 14.2A, and the nominal voltage is 2.000V, using MOSFET current sensing. We have VS+ = 0.089, |VS-| = 0.079, VT+ = |VT-| = 0.134, IO = 14.2, V
= 2.000, and ∆RD = 1.67. We calculate:
nom
Since Y > X, we choose Y, and round up to find we need 7 capacitors for C
OUT
.
O
14400 * I
O
18 * R5 * 1.1
* R
D
∆RD, the tolerance of the current sensor (usually about 67% for MOSFET sensing, including temperature); and
ESR, the ESR of the output capacitors, per cap (44mΩ for the Sanyo parts shown in this datasheet).
2
–
nom
-
V
nom
V
in
* 1KΩ
6
C
R
in
offset
V
nom
*IO
V
in
=
I
rms
V
– .024 * V
S+
=
1.01 * V
IO* RD * (1 + ∆RD)
R7
=
nom
45 * 10
14400 * IO* RD * (1 + ∆RD) *1.1
R5 =
18 * (V
S+
+ V
– .024 * V
S-
nom
)
A detailed explanation of this calculation may be found in Applications Bulletin AB-24.
2.000
*14.2
=
C
in
R
offset
R7
14400 * 14.2 * 0.020 * (1 + 0.67) * 1.1
=
R5
Y
18 * (0.089 + 0.079 – .024 * 2.000)
X==
=
0.134 – 0.089
5
0.089 – .024 * 2.000
=
1.01 * 2.000
14.2 * 0.010 * (1 + 0.67)
=
0.134 + 0.089 – .024 * 2.00
0.044 * 14.2
2.000
–
2
45 * 10
0.044 * 14.2
14400 * 14.2 * 0.020
+
18 * 3640 * 1.1
2
5
-6
=
3.47 ⇒ 4 caps
20.3Ω*1000
=
5.25KΩ
=
3.48KΩ
=
3.57
6.14
=
16 REV. 1.0.0 6/30/00
Page 17
PRODUCT SPECIFICATION RC5058
Mechanical Dimensions
24 Lead SOIC
Symbol
A .093 .104 2.35 2.65 A1 .004 .012 0.10 0.30 B .013 0.33 C .009 .013 0.23 0.32 D .599 .614 15.20 15.60 E .290 .299 7.36 7.60 e H h L .016 .050 0.40 1.27 N24 24
α
ccc .004 0.10——
24 13
Inches
Min. Max. Min. Max.
.020 0.51
.050 BSC 1.27 BSC
.394 .419 10.00 10.65 .010 .020 0.25 0.51
0° 8° 0° 8°
Millimeters
Notes
5 2 2
3 6
H
E
Notes:
1.
Dimensioning and tolerancing per ANSI Y14.5M-1982.
2.
"D" and "E" do not include mold flash. Mold flash or protrusions shall not exceed .010 inch (0.25mm).
3.
"L" is the length of terminal for soldering to a substrate.
4.
Terminal numbers are shown for reference only.
5.
"C" dimension does not include solder finish thickness.
6.
Symbol "N" is the maximum number of terminals.
112
D
A
e
B
A1
SEATING PLANE
– C –
LEAD COPLANARITY
ccc C
h x 45°
C
α
L
REV. 1.0.0 6/30/00 17
Page 18
RC5058 PRODUCT SPECIFICATION
Ordering Information
Product Number Package
RC5058M 24 pin SOIC
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
6/30/00 0.0m 012
2000 Fairchild Semiconductor Corporation
Stock#DS30005058
Loading...