Page 1
Spec. No. : C345S2
CYStech Electronics Corp.
Issued Date : 2004.04.27
Revised Date : 2013.04.15
Page No. : 1/6
Small Signal Schottky diode
RB751V-40S2
Description
Planar silicon Schottky barrier diode encapsulated in a SOD-323 plastic SMD package.
Features
•Small surface mounting type SC-76/SOD323
•Low reverse current and low forward voltage
•High reliability
•Pb-free lead plating and halogen-free package
Applications
Low current rectification and high speed switching
Symbol Outline
RB751V-40S2
2 (Anode)
SOD-323
Ordering Information
Device Package Shipping
RB751V-40S2-0-T1-G
SOD-323 (Pb-free lead plating
and halogen-free package)
3000 pcs / Tape & Reel 5E
Marking
RB751V-40S2 CYStek Product Specification
Page 2
Spec. No. : C345S2
CYStech Electronics Corp.
Issued Date : 2004.04.27
Revised Date : 2013.04.15
Page No. : 2/6
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature Tstg..................................................................................................... -40~+125°C
Junction Temperature Tj .............................................................................................................. +125°C
• Maximum Voltages and Currents (Ta=25°C)
Peak Reverse Voltage VRM…………………………………………………………………………. 40 V
DC Reverse Voltage VR ...................................................................................................................... 30 V
Mean Rectifying Current IO ........................................................................................................... 30 mA
Peak Forward Surge Current IFSM………………………………….. ……………………………………….200 mA
Characteristics
Characteristic Symbol Condition Min. Typ Max. Unit
Forward Voltage VF IF=1mA -
Reverse Leakage Current IR VR=30V -
Capacitance Between Terminals CT VR=1V, f=1MHz -
(Ta=25°C)
2
-
-
370 mV
0.5 μA
- pF
RB751V-40S2 CYStek Product Specification
Page 3
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C345S2
Issued Date : 2004.04.27
Revised Date : 2013.04.15
Page No. : 3/6
Forward Current Derating Curve
120
100
Mounting on glass
epoxy PCBs
80
60
40
20
Percentage of Rated Forward Current---(%)
0
0 25 50 75 100 125 150
Ambient Temperature---T
A
(℃)
100
10
(mA)
F
1
0.1
Forward Current---I
0.01
0 0.10.20.30.40
Reverse Leakage Current vs Revers e Voltage
(pF)
T
10
100
Ta=
10
125℃
Forward Current vs Forward Voltage
Typ.
pulse measurement
125℃
Forward Voltage---VF(V)
Capacitance vs Reverse Voltage
75℃
25℃
- 25℃
f=1MHz
Ta=25℃
.5
Ta=
1
0.1
Ta=
25℃
0.01
Reverse Leakage Current---IR(μA)
0.001
0102030
Reverse Voltage---VR(V)
75℃
Ta=-25℃
Typ. pulse e asurement
Capacitance between terminals---C
1
0246810121
Reverse Voltage---V
4
(V)
R
RB751V-40S2 CYStek Product Specification
Page 4
Reel Dimension
CYStech Electronics Corp.
Spec. No. : C345S2
Issued Date : 2004.04.27
Revised Date : 2013.04.15
Page No. : 4/6
Carrier Tape Dimension
RB751V-40S2 CYStek Product Specification
Page 5
CYStech Electronics Corp.
Recommended wave soldering condition
Product Peak Temperature Soldering Time
Pb-free devices
Recommended temperature profile for IR reflow
260 +0/-5 °C
Spec. No. : C345S2
Issued Date : 2004.04.27
Revised Date : 2013.04.15
Page No. : 5/6
5 +1/-1 seconds
Profile feature Sn-Pb eutectic Assembly
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(T
−Temperature Max(T
S min)
S max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
3°C/second max. 3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5 °C 260 +0/-5 °C
10-30 seconds 20-40 seconds
6°C/second max. 6°C/second max.
6 minutes max. 8 minutes max.
Pb-free Assembly
150°C
200°C
60-180 seconds
217°C
60-150 seconds
RB751V-40S2 CYStek Product Specification
Page 6
SOD-323 Dimension
K
A
CYStech Electronics Corp.
Spec. No. : C345S2
Issued Date : 2004.04.27
Revised Date : 2013.04.15
Page No. : 6/6
Marking:
5 H
5E
2
B
J
Millimeters Inches Millimeters
DIM
C
E
Min. Max. Min. Max.
Style: Pin 1.Cathode 2.Anode
2-Lead SOD-323 Plastic Surface
Mounted Package,
CYStek Package Code: S2
*: Typical
D
DIM
1
H
Inches
Min. Max. Min. Max.
A 0.0630 0.0709 1.60 1.80 E 0.0060 REF 0.15 REF
B 0.0453 0.0531 1.15 1.35 H 0.0000 0.0040 0.00 0.10
C 0.0315 0.0394 0.80 1.00 J 0.0035 0.0070 0.089 0.177
D 0.0098 0.0157 0.25 0.40 K 0.0906 0.1063 2.30 2.70
Notes: 1.Controlling dimension : millimeters.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
RB751V-40S2 CYStek Product Specification
Page 7
Loading...