The R2J20655NP multi-chip module incorporates a high-side MOS FET, low-side MOS FET, and MOS-FET driver in
a single QFN package. The on and off timing of the power MOS FET is optimized by the built-in driver, making this
device suitable for large-current buck converters. The chip also incorporates a high-side bootstrap switch, eliminating
the need for an external SBD for this purpose.
Features
Based on Intel 6 6 DrMOS Specification.
Built-in power MOS FET suitable for Desktop, Server application.
Low-side MOS FET with built-in SBD for lower loss and reduced ringing.
Built-in driver circuit which matches the power MOS FET
Built-in tri-state input function which can support a number of PWM controllers
High-frequency operation (above 1 MHz) possible
VIN operating-voltage range: 27 Vmax
Large average output current (Max. 3 5 A)
Achieve low power dissipation
Controllable driver: Remote on/off
Low side MOS FET disabled function for DCM operation
Double thermal protection: Thermal Warning & Thermal Shutdown
Built-in bootstrapping Switch
Small package: QFN40 (6 mm 6 mm 0.95 mm)
Pb-free/Halogen-Free
Outline
THWN
DISBL#
LSDBL#
PWM
MOS FET Driver
CGND
Integrated Driver-MOS FET (DrMOS)
QFN40 package 6 mm × 6 mm
VINGHBOOTVCIN Reg5V
VSWH
GLPGND
110
40
Driver
Pad
Low-side MOS Pad
31
3021
(Bottom view)
High-side
MOS Pad
11
20
R07DS0200EJ0100 Rev.1.00 Page 1 of 17
Jan 25, 2011
Page 2
R2J20655NP Preliminary
Block Diagram
Driver Chip
THWN
DISBL#
LSDBL#
PWM
THWNTHDN
2 μA
CGND
CGND
160 k
Reg5V
Input Logic
(TTL Level)
(3 state in)
Reg5V
VCIN
UVL
Reg5V
Supervisor
Reg5V
Level Shifter
Overlap
Protection.
& Logic
BOOTGH
Boot
SW
Reg5V
VIN
High Side
MOS FET
20 k
VSWH
Low Side
MOS FET
35 k
PGND
GLCGND
Notes: 1. Truth table for the DISBL# pin2. Truth table for the LSDBL# pin
3. Output signal from the UVL block 4. Output signal from the THWN block
VHVL
For active
VCIN
Thermal Warning
Logic Level
"H"
"L"
Normal
operating
Thermal
Warning
T
(°C)
IC
TwarnHTwarnL
UVL output
Logic Level
"H"
For shutdown
"L"
5. Truth table for the THDN block
Driver IC Temp. Driver Chip Status
< 150°C Enable (GL, GH = "Active")
> 150°C
Shutdown (GL, GH = "L")
(latch-off)
R07DS0200EJ0100 Rev.1.00 Page 2 of 17
Jan 25, 2011
Page 3
R2J20655NP Preliminary
Pin Arrangement
VIN
VIN
VIN
VSWHGHCGND
1098765432
11
VINPWM
12
VIN
13
VIN
14
VIN
VSWH
PGND
PGND
PGND
PGND
PGNDVSWH
15
16
17
18
19
20
VIN
VSWH
21 22 23 24 25 26 27 28 29 30
PGND
PGND
PGND
PGND
PGND
PGND
BOOT
VCIN
CGND
PGND
PGND
Reg5V
VSWH
(Top view)
Note: All die-pads (three pads in total) should be soldered to PCB.
Pin Description
LSDBL#
1
40
39
38
37
36
35
34
33
32
31
VSWH
DISBL#
THWN
CGND
GL
VSWH
VSWH
VSWH
VSWH
Pin Name Pin No. Description Remarks
LSDBL# 1 Low-side gate disable When asserted "L" signal, Low-side gate disable
Reg5V 2 +5 V logic power supplyoutput
VCIN 3 Control input voltage Driver Vcc input
BOOT 4 Bootstrap voltage pin To be supplied +5 V through internal switch
CGND 5, 37, Pad Control signal ground Should be connected to PGND externally
GH 6 High-side gate signal Pin for monitor
VIN 8 to 14, Pad Input voltage
VSWH 7, 15, 29 to 35, Pad Phase output/Switch output
PGND 16 to 28 Power ground
GL 36 Low-side gate signal Pin for monitor
THWN 38 Thermal warning Thermal warning when over 115°C
DISBL# 39 Signal disable
Disabled when DISBL# is "L".
This Pin is pulled low when internal IC over the
thermal shutdown level, 150°C.
PWM 40 PWM drive logic input Capable of both 3.3 V and 5 V logic input
R07DS0200EJ0100 Rev.1.00 Page 3 of 17
Jan 25, 2011
Page 4
R2J20655NP Preliminary
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Rating Units Note
Pt(25) 25 Power dissipation
Pt(110) 8
Average output current Iout 35 A
VIN(DC) –0.3 to +27 2 Input voltage
VIN(AC) 30
VSWH(DC) 27 2 Switch node voltage
VSWH(AC) 30
VBOOT(DC) 32 2 BOOT voltage
VBOOT(AC) 36
Supply voltage VCIN –0.3 to +27 V 2
PWM voltage Vpwm
Other I/O voltage Vdisbl, Vlsdbl –0.3 to VCIN + 0.3 V 2
Reg5V voltage Vreg5V –0.3 to +6V 2, 7
Reg5V current Ireg5V –20 to +0.1 mA 3
THWN/THDN current Ithwn, Idisbl 0 to 1.0 mA 3
Operating junction temperature Tj-opr –40 to +150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. Pt(25) represents a PCB temperature of 25°C, and Pt(110) represents 110C.
2. Rated voltages are relative to voltages on the CGND and PGND pins.
3. For rated current, (+) indicates inflow to thechip and (–) indicates outflow.
4. This rating is when UVL (Under Voltage Lock out) is ineffective (normal operation mode).
5. This rating is when UVL (Under Voltage Lock out) is effective (lock out mode).
6. The specification values indicated "AC" are limited within 10ns.
7. This rating is when the external power-source is applied to Reg5V pin.
8. Reg5V + 0.3 V < 6 V
–0.3 to +5.5 @UVL OFF
–0.3 to +0.3 @UVL ON
–0.3 to Reg5V + 0.3
W 1
V
2, 4, 6
V
2, 4, 6
V
2, 4, 6
V
2, 4
2, 5
2, 7, 8
Safe Operating Area
4540
35
30
25
20
VOUT = 1.3 V
15
VIN = 12 V
10
VCIN = 5 V
L = 0.45 μH
Average Output Current (A)
5
Fsw = 1 MHz
0
0255075100125150175
PCB Temperature (°C)
R07DS0200EJ0100 Rev.1.00 Page 4 of 17
Jan 25, 2011
Page 5
R2J20655NP Preliminary
Recommended Operating Condition
Item Symbol Rating Units Note
Input voltage VIN 4.5 to 22 V
Supply voltage &
Drive voltage
VCIN
4.5 to 5.5
or
V
When the usage of VCIN = 4.5 V to 5.5 V,
VCIN should be connected to Reg5V
(Refer to "Pin Connection")
Note: 1. Reference values for design. Not 100% tested in production.
VCIN start threshold VH 7.0 7.4 7.8 V
VCIN shutdown threshold VL 6.6 7.0 7.4 V
UVLO hysteresis dUVL — 0.4 — V VH – VL
VCIN operating current I
— 49 — mA
CIN
f
PWM
= 1 MHz,
Ton_pwm = 120 ns
VCIN disable current I
— — 800 A
CIN-DISBL
DISBL# = 0 V,
PWM = LSDBL# = Open
PWM input high level V
PWM input low level V
PWM input resistance R
PWM input tri-state range V
Shutdown hold-off time t
Enable level V
Disable level V
Input current I
THDN on resistance R
Low-side activation level V
Low-side disable level V
Input current I
Warning temperature T
Temperature hysteresis T
THWN on resistance R
THWN leakage current I
Shutdown temperature Tstdn *
2.6 — — V 3.3 V/5.0 V PWM interface
H-PWM
— —0.8 V
L-PWM
6.5 12.5 25 kPWM = 1 V
IN-PWM
1.4 — 2.0 V 3.3 V/5.0 V PWM interface
IN-tri
HOLD-OFF
ENBL
DISBL
DISBL
THDNLSDBLHLSDBLL
LSDBL
THWNHYS
THWN
LEAK
1
*
— 150 — ns
2.0 — — V
— — 0.8 V
— 2.0 5.0 A DISBL# = 1 V
*10.2 0.5 1.0 kDISBL# = 0.2 V
2.0 — — V
— — 0.8 V
–52 –26 –12 A LSDBL# = 1 V
*1100 115 130 °C Driver IC temperature
*1 — 15 — °C
*1 0.2 0.5 1.0 kTHWN = 0.2 V
— — 1.0 A THWN = 5 V
1
130 150 — °C Driver IC temperature
Output voltage Vreg 4.95 5.2 5.45 V
Line regulation Vreg-line –10 0 10 mV VCIN = 12 V to 16 V
Load regulation Vreg-load –10 0 10 mV Ireg = 0 to 10 mA
R07DS0200EJ0100 Rev.1.00 Page 5 of 17
Jan 25, 2011
Page 6
R2J20655NP Preliminary
Typical Application
(1) Desktop/Server Application
+12 V
+5 V
PWM
Control
Circuit
PWM1
PWM2
PWM3
PWM4
VCIN
THWN
DISBL#
Reg5V
R2J20655NP
PWM
CGNDGL
VCIN
THWN
DISBL#
Reg5V
R2J20655NP
PWM
CGNDGL
LSDBL#
LSDBL#
GH
GH
BOOT
VIN
VSWH
PGND
BOOT
VIN
VSWH
PGND
+1.3 V
VCIN
THWN
DISBL#
Reg5V
R2J20655NP
PWM
LSDBL#
CGNDGL
VCIN
THWN
DISBL#
Reg5V
R2J20655NP
PWM
CGNDGL
LSDBL#
GH
GH
BOOT
VSWH
PGND
BOOT
VSWH
PGND
VIN
Power GNDSignal GND
VIN
R07DS0200EJ0100 Rev.1.00 Page 6 of 17
Jan 25, 2011
Page 7
R2J20655NP Preliminary
Typical Application (cont.)
(2) Notebook Application
+19 V
+5 V
PWM
Control
Circuit
PWM1
PWM2
PWM3
VCIN
THWN
DISBL#
Reg5V
R2J20655NP
PWM
CGNDGL
VCIN
THWNDISBL#Reg5V
R2J20655NP
PWM
CGNDGL
LSDBL#
LSDBL#
GH
GH
BOOT
VIN
VSWH
PGND
BOOT
VIN
VSWH
PGND
+1.1 V
VCIN
THWN
DISBL#
Reg5V
R2J20655NP
PWM
CGNDGL
LSDBL#
BOOT
VIN
VSWH
PGND
GH
Power GNDSignal GND
R07DS0200EJ0100 Rev.1.00 Page 7 of 17
Jan 25, 2011
Page 8
R2J20655NP Preliminary
Pin Connection
(1) Single 12 V Application
VIN
12 V
10 μF × 4
PGND
Power GND Signal GND
PGND
0.1 μF
GH
11
12
13
VIN
14
15
VSWH
16
PGND
17
18
19
20
VIN
VIN
PAD
R2J20655NP
VSWH
VSWH
CGND
PAD
0 to 10 Ω
BOOT
CGND
PAD
1.0 μF
VCIN
PGND
1.0 μF
12345678910
Reg5V
DISBL#
THWN
CGND
VSWH
VSWH
30292827262524232221
CGND
PWM
LSDBL#
GL
Low Side Disable Signal INPUT
CGND
40
39
38
37
36
35
34
333231
Thermal Warning
10 kΩ
10 kΩ
PWM INPUT
Thermal Shutdown
VCIN
VCIN
0.45μH
Vout
PGND
(2) VCIN 5 V Application
VIN
12 V
10 μF × 4
PGND
Power GND Signal GND
PGND
0.1 μF
1.0 μF
0 to 10 Ω
Low Side Disable Signal INPUT
5.0 V
12345678910
GH
VIN
11
12
13
VIN
14
15
VSWH
16
PGND
17
18
19
20
VSWH
VIN
PAD
R2J20655NP
VSWH
PAD
CGND
VCIN
BOOT
CGND
PAD
PGND
Reg5V
DISBL#
THWN
CGND
VSWH
VSWH
30292827262524232221
PWM
LSDBL#
GL
40
39
38
37
36
35
34
33
32
31
CGND
Thermal Warning
0.45 μH
External
Power Supply
Thermal Shutdown
10 kΩ
10 kΩ
PWM INPUT
5 V
5 V
Vout
PGND
R07DS0200EJ0100 Rev.1.00 Page 8 of 17
Jan 25, 2011
Page 9
R2J20655NP Preliminary
Test Circuit
I
IN
Vinput
Vcont
5 V pulse
A
V
V
IN
I
CIN
A
V
V
CIN
VCIN
DISBL#
R2J20655NP
Reg5V
LSDBL#
PWM
CGND
GH
GL
BOOT
VSWH
PGND
VIN
Electric
load
I
O
Note: P
= IIN × VIN + I
IN
P
= IO × V
OUT
Efficiency = P
P
(DrMOS) = PIN – P
LOSS
Ta = 27°C
O
OUT
CIN
/ P
× V
IN
CIN
OUT
Averaging
circuit
Average Output Voltage
V
V
O
R07DS0200EJ0100 Rev.1.00 Page 9 of 17
Jan 25, 2011
R07DS0200EJ0100 Rev.1.00 Page 11 of 17
Jan 25, 2011
Page 12
R2J20655NP Preliminary
Description of Operation
The DrMOS multi-chip module incorporates a high-side MOS FET, low-side MOS FET, and MOS-FET driver in a
single QFN package. Since the parasitic inductance between each chip is extremely small, the module is highly suitable
for use in buck converters to be operated at high frequencies. The control timing between the high-side MOS FET, lowside MOS FET, and driver is optimized so that high efficiency can be obtained at low output-voltage.
VCIN & DISBL#
The VCIN pin is connected to the UVL (under-voltage lockout) module, so that the built-in 5 V regulator is disabled as
long as VCIN is 7.4 V or less. On cancellation of UVL, the built-in 5 V regulator remains enabled until the UVL input
is driven to 7.0 V or less.
The built-in 5 V regulator is a series regulator with temperature compensation. A ceramic capacitor with a value of 0.1
F or more must be connected between the CGND plane and the Reg5V pin.
The output of 5 V regulator is monitored by the internal Supervisor circuits. When the Supervisor detects this output is
more than 4.3 V (typ.), the driver state becomes active (figure 1.1). Supervisor circuit has hysteresis and its shutdown
level of Supervisor is 3.8 V (typ.).
Figure 1.2 shows the application when the external 5 V regulator is used. When the Reg5V pin is applied into external 5
V, the Supervisor can activate the driver. In this application usage, VCIN should be connected to Reg5V.
The signal on pin DISBL# also enables or disables the circuit. When UVL disables the circuit , the built-in 5 V
regulator does not operate, but when the signal on DISBL# disables the circuit, only output-pulse generation is
terminated, and the 5 V regulator is not disabled.
Voltages from –0.3 V to VCIN+0.3 V can be applied to the DISBL#pin, soon/off control by a logic IC or the use of a
resistor, etc., to pull the DISBL# line up to VCIN are bothpossible.
VCIN DISBL# REG5V Driver State
L 0 Disable (GL, GH = L)
H L Active Disable (GL, GH = L)
H H Active Active
H Open ActiveDisable (GL, GH = L)
12 V
VCIN
VCIN > 7.4 V
VCIN
5 V
IN
UVL &
5 V Regulator
To Internal
Logic
Supervisor
Reg5V
OUT
Figure 1.1 Typical 12 V Input Application
To Internal
Logic
IN
UVL &
5 V Regulator
Supervisor
OUT
Reg5V
External 5 V
Figure 1.2 External 5 V Application
(Activate Built-in 5 V Regulator)
R07DS0200EJ0100 Rev.1.00 Page 12 of 17
Jan 25, 2011
Page 13
R2J20655NP Preliminary
PWM & LSDBL#
The PWM pin is the signal input pin for the driver chip. When the PWM input is high, the gate of the high-side MOS
FET (GH) is high and the gate of the low-side MOS FET (GL) is low.
PWM GH GL
L L H
H H L
The LSDBL# pin is the Low Side Gate Disable pin for "Discontinuous Conduction Mode (DCM)" when LSDBL# is
low.
Figure 2 shows the Typical high side and low side gate switching and Inductor current (IL) during "Continuous
Conduction Mode (CCM)" and low side gate disabled when asserting LSDBL# signal.
This pin is internally pulled up to Reg5V with 160 k resistor.
When low side disable function is not used, keep this pin open or pulled up to VCIN.
CCM Operation (LSDBL# = "H" or Open mode)
IL
GH
GL
Figure 2.1 Typical Signals during CCM
DCM Operation (LSDBL# = "L")
IL
0 A
GH
GL
Figure 2.2 Typical Signals during DCM
R07DS0200EJ0100 Rev.1.00 Page 13 of 17
Jan 25, 2011
Page 14
R2J20655NP Preliminary
The PWM input is TTL level and has hysteresis. When the signal route from the control IC is high impedance, the tristate function turns off the high- and low-side MOS FETs. This function operates when the PWM input signal stays in
the input hysteresis window for 150ns (typ.). After the tri-state mode has been entered and GH and GL have become
low, a PWM input voltage of 2.6 V or more is required to make the circuit return to normal operation.
PWM
GH
GL
PWM
2.0 V
1.4 V
2.0 V
1.4 V
150 ns (t
150 ns (t
HOLD-OFF
HOLD-OFF
)
)
150 ns (t
150 ns (t
HOLD-OFF
HOLD-OFF
)
)
GH
GL
Figure 3 PWM Shutdown-Hold Time Signal
R07DS0200EJ0100 Rev.1.00 Page 14 of 17
Jan 25, 2011
Page 15
R2J20655NP Preliminary
The equivalent circuit for the PWM-pin input is shown in the next figure. M1 is in the ON state during normal
operation; after the PWM input signal has stayed in the hysteresis window for 150 ns (typ.) and the tri-state detection
signal has been driven high, the transistor M1 is turned off.
When VCIN is powered up, M1 is started in the OFF state regardless of PWM Low or Open state. After PWM is
asserted high signal, M1 becomes ON and shifts to normal operation.
Reg5V
M1
25 k
Tri-state
PWM Pin
Input
Logic
12.5 k
detection signal
To internal control
Figure 4 Equivalent Circuit for the PWM-pin Input
THWN & THDN
This device has two level thermal detection, one is thermal warning and the other is thermal shutdown function.
This Thermal Warning feature is the indication of the high temperature status.
THWN is an open drain logic output signal and need to connect a pull-up resistor(ex.51 k) to THWN for Systems
with the thermal warning implementation.
When the chip temperature of the internal driver IC becomes over 115°C, Thermal warning function operates.
This signal is only indication for the system controller and does not disable DrMOS operation.
When thermal warning function is not used, keep this pin open.
115100
Thermal
warning
TIC (°C)
THWN outputLogic Level
"H"
Normal
operating
"L"
Figure 5 THWN Trigger Temperature
R07DS0200EJ0100 Rev.1.00 Page 15 of 17
Jan 25, 2011
Page 16
R2J20655NP Preliminary
r
THDN is an internal thermal shutdown signal when driver IC becomes over 150°C.
This function makes High Side MOS FET and Low Side MOS FET turn off for the device protection from abnormal
high temperature situation and at the same time DISBL# pin is pulled low internally to give notice to the system
controller. Once thermal shutdown function operates, driver IC keeps DISBL# pin pulled low until VCIN becomes
under UVL level (or under supervisor shutdown level).
Figure 6 shows the example of two types of DISBL# connection with the system controller signal.
Figure 6.1 THDN Signal to the System ControllerFigure 6.2 ON/OFF Signal from the System Controlle
MOS FET
The MOS FETs incorporated in R2J20655NP are highly suitable for synchronous-rectification buck conversion. For the
high-side MOS FET, the drain is connected to the VIN pin and the sourceis connected to the VSWH pin. For the lowside MOS FET, the drain is connected to theVSWH pin and the source is connected to the PGND pin.
R07DS0200EJ0100 Rev.1.00 Page 16 of 17
Jan 25, 2011
R07DS0200EJ0100 Rev.1.00 Page 17 of 17
Jan 25, 2011
Page 18
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7F, No. 363 Fu Shing North Road Taipei, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics Korea Co., Ltd.
11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5141