1) De-rating factor of 0.13% per °C is applicable for T
2) Double side cooled, single phase; 50Hz, 180° half-sinewave.
3) Cathode side cooled, single phase; 50Hz, 180° half-sinewave.
4) Double side cooled.
5) Half-sinewave, 125°C T
6) V
VOLTAGE RATINGS
Repetitive peak off-state voltage, (note 1) 1200 V
Non-repetitive peak off-state voltage, (note 1) 1200 V
Repetitive peak reverse voltage, (note 1) 1200 V
Non-repetitive peak reverse voltage, (note 1) 1300 V
Maximum average on-state current, T
Maximum average on-state current. T
Maximum average on-state current. T
Nominal RMS on-state current, T
D.C. on-state current, T
Critical rate of rise of on-state current (repetitive), (Note 6) 1000 A/µs
cr
Critical rate of rise of on-state current (non-repetitive), (Note 6) 1500 A/µs
Peak reverse gate voltage 5 V
Mean forward gate power 5 W
Peak forward gate power 30 W
Operating temperature range -40 to +125 °C
Storage temperature range -40 to +150 °C
initial.
=67% V
D
, IFG=2A, tr≤0.5µs, T
DRM
j
=125°C.
case
=55°C, (note 2) 2075 A
sink
=85°C, (note 2) 1365 A
sink
=85°C, (note 3) 720 A
sink
=25°C, (note 2) 4200 A
sink
, (note 5) 29.0 kA
RRM
, (note 5) 4.21×10
RRM
below 25°C.
j
Date:- 13
th
December 2014
Data Sheet Issue:- A2
MAXIMUM
LIMITS
MAXIMUM
LIMITS
31.9 kA
6
5.09×10
6
UNITS
UNITS
A2s
A2s
Data Sheet. Type R2075MC12x Issue A2 Page 1 of 13 December 2014
Page 2
Distributed Gate Thyristor type R2075MC12x
Characteristics
PARAMETER MIN. TYP. MAX. TEST CONDITIONS (Note 1)UNITS
V
TM
V
TM
V
T0
r
T
(dv/dt)crCritical rate of rise of off-state voltage 200 - - VD=80% V
I
DRM
I
RRM
V
GT
I
GT
V
GD
I
H
t
gd
t
gt
Q
rr
Q
ra
I
rm
t
rr
t
q
Maximum peak on-state voltage - - 1.90 ITM=2200A V
Maximum peak on-state voltage - - 2.42 ITM=6200A V
Threshold voltage - - 1.390 V
Slope resistance - - 0.167
, Linear ramp, Gate o/c
DRM
Peak off-state current - - 100 Rated V
Peak reverse current - - 100 Rated V
Gate trigger voltage - - 3.0 V
T
Gate trigger current - - 300
Gate non-trigger voltage - - 0.25 Rated V
DRM
RRM
=25°C VD=10V, IT=3A
j
DRM
mΩ
V/µs
mA
mA
mA
V
Holding current - - 1000 Tj=25°C mA
Gate controlled turn-on delay time - 0.5 1.0
Turn-on time - 0.8 1.6
=67% V
V
D
I
=2A, tr=0.5µs, Tj=25°C
FG
, ITM=1000A, di/dt=60A/µs,
DRM
µs
Recovered charge - 230 300 µC
Recovered charge, 50% Chord - 120 - µC
Reverse recovery current - 95 - A
Reverse recovery time - 2.3 -
- 10 -
Turn-off time (note 2)
- 12 -
=1000A, tp=1000µs, di/dt=60A/µs,
I
TM
V
=50V
r
=1000A, tp=1000µs, di/dt=60A/µs,
I
TM
V
=50V, Vdr=33%V
r
=1000A, tp=1000µs, di/dt=60A/µs,
I
TM
V
=50V, Vdr=33%V
r
, dVdr/dt=20V/µs
DRM
, dVdr/dt=200V/µs
DRM
µs
µs
- - 0.015 Double side cooled K/W
R
thJK
Thermal resistance, junction to heatsink
- - 0.028 Anode side cooled K/W
- - 0.033 Cathode side cooled K/W
F Mounting force 19 - 26 kN
W
t
Weight - 510 - g
Notes:-
1) Unless otherwise indicated T
2)
The required tq (specified with dVdr/dt=200V/µs) is represented by an ‘x’ in the device part number. See ordering information for
details of t
codes.
q
=125°C.
j
Data Sheet. Type R2075MC12x Issue A2 Page 2 of 13 December 2014
Page 3
Distributed Gate Thyristor type R2075MC12x
Notes on Ratings and Characteristics
1.0 Voltage Grade Table
Voltage Grade
V
DRM VDSM VRRM
V
V
RSM
V
V
V
D
DC V
R
12 1200 1300 810
2.0 Extension of Voltage Grades
This report is applicable to other and higher voltage grades when supply has been agreed by
Sales/Production.
3.0 Extension of Turn-off Time
This Report is applicable to other t
/re-applied dv/dt combinations when supply has been agreed by
q
Sales/Production.
4.0 Repetitive dv/dt
Higher dv/dt selections are available up to 1000V/µs on request.
5.0 De-rating Factor
A blocking voltage de-rating factor of 0.13%/°C is applicable to this device for T
below 25°C.
j
6.0 Snubber Components
When selecting snubber components, care must be taken not to use excessively large values of snubber
capacitor or excessively small values of snubber resistor. Such excessive component values may lead to
device damage due to the large resultant values of snubber discharge current. If required, please consult
the factory for assistance.
7.0 Rate of rise of on-state current
The maximum un-primed rate of rise of on-state current must not exceed 1500A/µs at any time during
turn-on on a non-repetitive basis. For repetitive performance, the on-state rate of rise of current must not
exceed 1000A/µs at any time during turn-on. Note that these values of rate of rise of current apply to the
total device current including that from any local snubber network.
8.0 Gate Drive
The nominal requirement for a typical gate drive is illustrated below. An open circuit voltage of at least
30V is assumed. This gate drive must be applied when using the full di/dt capability of the device.
I
GM
4A/µs
I
G
t
p1
The magnitude of I
(t
) should be 20µs or sufficient to allow the anode current to reach ten times IL, whichever is greater.
p1
should be between five and ten times IGT, which is shown on page 2. Its duration
GM
Otherwise, an increase in pulse current could be needed to supply the necessary charge to trigger. The
‘back-porch’ current I
magnitude in the order of 1.5 times I
should remain flowing for the same duration as the anode current and have a
G
.
GT
Data Sheet. Type R2075MC12x Issue A2 Page 3 of 13 December 2014
Page 4
Distributed Gate Thyristor type R2075MC12x
(
)
⋅−=
9.0 Frequency Ratings
The curves illustrated in figures 10 to 18 are for guidance only and are superseded by the maximum
ratings shown on page 1.
10.0 Square wave ratings
These ratings are given for load component rate of rise of forward current of 100 and 500 A/µs.
11.0 Duty cycle lines
The 100% duty cycle is represented on all the ratings by a straight line. Other duties can be included as
parallel to the first.
12.0 Maximum Operating Frequency
The maximum operating frequency is set by the on-state duty, the time required for the thyristor to turn off
) and for the off-state voltage to reach full value (tv), i.e.
(t
q
f
13.0 On-State Energy per Pulse Characteristics
These curves enable rapid estimation of device dissipation to be obtained for conditions not covered by
the frequency ratings.
Let E
Let R
and T
Then the average dissipation will be:
max
=
be the Energy per pulse for a given current and pulse width, in joules
p
be the steady-state d.c. thermal resistance (junction to sink)
th(J-Hs)
be the heat sink temperature.
SINK
1
vqpulsettt
++
⋅=125
14.0 Reverse recovery ratings
(i) Q
is based on 50% Irm chord as shown in Fig. 1
ra
is based on a 50µs integration time i.e.
(ii) Q
rr
(iii)
RWT and fEW
()
.)(max
−
HsJthAVSINKPAV
Fig. 1
s
µ
150
=
rrrr
∫
0
FactorK=
dtiQ
.
1
t
2
t
Data Sheet. Type R2075MC12x Issue A2 Page 4 of 13 December 2014
Page 5
Distributed Gate Thyristor type R2075MC12x
(
)
⋅+⋅
⋅
(
⋅
⋅
15.0 Reverse Recovery Loss
15.1 Determination by Measurement
From waveforms of recovery current obtained from a high frequency shunt (see Note 1, Page 5) and
reverse voltage present during recovery, an instantaneous reverse recovery loss waveform must be
constructed. Let the area under this waveform be E joules per pulse. A new heat sink temperature can
then be evaluated from the following:
−=
)()(
Where k=0.227 (°C/W)/s
E = Area under reverse loss waveform per pulse in joules (W.s.)
f = rated frequency Hz at the original heat sink temperature.
R
The total dissipation is now given by:
15.2 Determination without Measurement
In circumstances where it is not possible to measure voltage and current conditions, or for design
purposes, the additional losses E in joules may be estimated as follows.
Let E be the value of energy per reverse cycle in joules (curves in Figure 9).
Let f be the operating frequency in Hz
()()
Where T
T
A suitable R-C snubber network is connected across the thyristor to restrict the transient reverse voltage
to a peak value (V
67% of Grade, the reverse loss may be approximated by a pro rata adjustment of the maximum value
obtained from the curves.
NOTE 1- Reverse Recovery Loss by Measurement
This thyristor has a low reverse recovered charge and peak reverse recovery current. When measuring
the charge, care must be taken to ensure that:
(a) a.c. coupled devices such as current transformers are not affected by prior passage of high
amplitude forward current.
(b) A suitable, polarised, clipping circuit must be connected to the input of the measuring oscilloscope
to avoid overloading the internal amplifiers by the relatively high amplitude forward current signal
(c) Measurement of reverse recovery waveform should be carried out with an appropriate critically
damped snubber, connected across diode anode to cathode. The formula used for the calculation
of this snubber is shown below:
= d.c. thermal resistance (°C/W).
th(J-Hs)
+=
SINK (new)
SINK (original)
(original)(TOT)
is the required maximum heat sink temperature and
is the heat sink temperature given with the frequency ratings.
) of 67% of the maximum grade. If a different grade is being used or Vrm is other than
rm
fEWW
−=
RfkETT
()
−
)
fRETT
thoriginalSINKnewSINK
HsJthoriginalSINKnewSINK
=
2
R
Data Sheet. Type R2075MC12x Issue A2 Page 5 of 13 December 2014
V
C
r
di
⋅
dt
S
Where:
⋅= 4
V
C
R
r
S
Commutating source voltage
=
Snubber capacitance
=
Snubber resistance
Page 6
Distributed Gate Thyristor type R2075MC12x
(
16.0 Computer Modelling Parameters
16.1 Calculating V
using ABCD Coefficients
T
The on-state characteristic I
(i) the well established V
vs VT, on page 8 is represented in two ways;
T
and rT tangent used for rating purposes and
T0
(ii) a set of constants A, B, C, D, forming the coefficients of the representative equation for V
terms of I
given below:
T
in
T
)
IDICIBAV⋅+⋅+⋅+=ln
TTTT
The constants, derived by curve fitting software, are given in this report for hot and cold characteristics
where possible. The resulting values for V
agree with the true device characteristic over a current range,
T
which is limited to that plotted.
25°C Coefficients 125°C Coefficients
A 1.896672 0.9411555
B 0.1253406 0.2449814
C 1.0811×10
-4
3.5544×10
-4
D -0.0136753 -0.0364255
Data Sheet. Type R2075MC12x Issue A2 Page 6 of 13 December 2014
Page 7
Distributed Gate Thyristor type R2075MC12x
16.2 D.C. Thermal Impedance Calculation
−
=
np
⎛
⎜
∑
=
p
1
1
pt
⎜
⎝
t
⎞
τ
p
⎟
err
−⋅=
⎟
⎠
Where p = 1 to n, n is the number of terms in the series.
t = Duration of heating pulse in seconds.
= Thermal resistance at time t.
r
t
r
= Amplitude of pth term.
p
= Time Constant of rth term.
τ
p
D.C. Single Side Cooled
Term 1 2 3 4 5
p
p
9.104123×10
0.7550773 0.1091817 0.03500190 8.477858×10
r
τ
-3
3.619725×10
-3
7.903528×10
-4
1.293186×10
-3
1.020409×10
-3
1.163500×10
-4
-3
D.C. Anode Side Cooled
Term 1 2 3 4
r
p
τ
p
0.01810857 4.157607×10
4.193879 0.4707370 0.08453147 5.073650×10
-3
4.191171×10
-3
1.205064×10
-3
-3
D.C. Cathode Side Cooled
Term 1 2 3 4
r
p
τ
p
0.02445377 5.055305×10
4.454021 0.2250056 0.04386925 5.603667×10
-3
2.064040×10
-3
1.142007×10
-3
-3
Data Sheet. Type R2075MC12x Issue A2 Page 7 of 13 December 2014
Data Sheet. Type R2075MC12x Issue A2 Page 8 of 13 December 2014
Gate Trigger Voltage - V
6
4
2
0
02468
PG 5W dc
Gate Trigger Current - I
PG Max 30W dc
Min VG dc
(A)
GT
10
Page 9
Figure 5 - Total recovered charge, Q
1000
R2075MC12x
Issue A2
Tj = 125°C
(µC)
rr
rr
2000A
1500A
1000A
500A
Distributed Gate Thyristor type R2075MC12x
Figure 6 - Recovered charge, Qra (50% chord)
1000
R2075MC12x
Issue A2
Tj = 125°C
2000A
1500A
1000A
500A
(µC)
ra
100
Total recovered charge - Q
100
101001000
Commutation rate - di/dt (A/µs)
Figure 7 - Peak reverse recovery current, I
1000
R2075MC12x
Issue A2
Tj = 125°C
2000A
1500A
1000A
(A)
rm
100
500A
Total recovered charge - Q
10
101001000
Commutation rate - di/dt (A/µs)
Figure 8 - Maximum recovery time, t
rm
10
R2075MC12x
Issue A2
Tj = 125°C
(µs)
rr
(50% chord)
rr
Reverse recovery current - I
10
101001000
Commutation rate - di/dt (A/µs)
Reverse recovery time - t
1
101001000
Commutation rate - di/dt (A/µs)
2000A
1500A
1000A
500A
Data Sheet. Type R2075MC12x Issue A2 Page 9 of 13 December 2014
Page 10
Distributed Gate Thyristor type R2075MC12x
Figure 9 – Reverse recovery energy per pulse Figure 10 - Sine wave energy per pulse
1000
(mJ)
r
100
R2075MC12x
Issue A2
Tj = 125°C
Vrm = 80% V
RRM
2000A
1500A
1000A
500A
1.00E+02
1.00E+01
1.00E+00
R2075MC12x
Issue A2
Tj=125°C
5kA
3kA
2kA
1.00E-01
Energy per pulse (J)
Energy per pulse - E
1.00E-02
1kA
500A
250A
10
101001000
Commutation rate - di/dt (A/µs)
Figure 11 - Sine wave frequency ratings
1.00E+05
1kA
100% Duty Cycle
2kA
1.00E+04
3kA
5kA
1.00E+03
Frequency (Hz)
1.00E+02
R2075MC12x
Issue A2
THs=55°C
1.00E-03
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
Figure 12 - Sine wave frequency ratings
1.00E+05
1kA
1.00E+04
1.00E+03
Frequency (Hz)
1.00E+02
2kA
3kA
5kA
100% Duty Cycle
R2075MC12x
Issue A2
THs=85°C
1.00E+01
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
1.00E+01
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
Data Sheet. Type R2075MC12x Issue A2 Page 10 of 13 December 2014
Page 11
Distributed Gate Thyristor type R2075MC12x
Figure 13 - Square wave frequency ratings Figure 14 - Square wave frequency ratings
5kA
100% Duty Cycle
R2075MC12x
Issue A2
THs=55°C
di/dt=100A/µs
1.00E+05
2kA
1.00E+04
1kA
3kA
5kA
R2075MC12x
di/dt=500A/µs
100% Duty Cycle
Issue A2
THs=55°C
1.00E+05
2kA
1.00E+04
3kA
1.00E+03
Frequency (Hz)
1.00E+02
1.00E+01
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
1.00E+03
Frequency (Hz)
1.00E+02
1.00E+01
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
Figure 15 - Square wave frequency ratings Figure 16 - Square wave frequency ratings
1.00E+05
1.00E+04
1.00E+03
Frequency (Hz)
1kA
2kA
3kA
5kA
R2075MC12x
di/dt=100A/µs
100% Duty Cycle
Issue A2
THs=85°C
1.00E+05
1.00E+04
1.00E+03
Frequency (Hz)
1kA
3kA
5kA
500A
2kA
100% Duty Cycle
R2075MC12x
Issue A2
THs=85°C
di/dt=500A/µs
1.00E+02
1.00E+01
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
Data Sheet. Type R2075MC12x Issue A2 Page 11 of 13 December 2014
1.00E+02
1.00E+01
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
Page 12
Distributed Gate Thyristor type R2075MC12x
Figure 17 - Square wave energy per pulse Figure 18 - Square wave energy per pulse
1.00E+03
1.00E+02
1.00E+01
1.00E+00
Energy per pulse (J)
1.00E-01
1.00E-02
500A
R2075MC12x
Issue A2
di/dt=100A/µs
Tj=125°C
1kA
250A
2kA
5kA
3kA
1.00E+03
1.00E+02
1.00E+01
1.00E+00
Energy per pulse (J)
1.00E-01
R2075MC12x
Issue A2
di/dt=500A/µs
Tj=125°C
5kA
3kA
2kA
1kA
500A
250A
1.00E-03
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
Figure 19 - Maximum surge and I2t Ratings
Gate may temporarily lose control of conduction angle
100000
(A)
TSM
10000
Total peak half sine surge current - I
1000
13510151050100
Duration of surg e (ms)Duration of surge (cycles @ 50Hz)
1.00E-02
1.00E-051.00E-041.00E-031.00E-02
Pulse width (s)
1.00E+08
RRM
: V
RRM
: 60% V
≤
≤
10V
RRM
10V
1.00E+07
RRM
1.00E+06
I2t: V
I2t: 60% V
I
TSM
I
TSM
R2075MC12x
Issue A2
T
(initial) = 125°C
j
s)
2
t (A
2
Maximum I
Data Sheet. Type R2075MC12x Issue A2 Page 12 of 13 December 2014
Page 13
Outline Drawing & Ordering Information
Distributed Gate Thyristor type R2075MC12x
101A357
ORDERING INFORMATION (Please quote 10 digit code as below)
R2075 MC
Fixed
Type Code
Typical order code: R2075MC120B – 1200V V
The information contained herein is confidential and is protected by Copyright. The information may not be used or
disclosed except with the written permission of and in the manner permitted by the proprietors IXYS UK Westcode Ltd.
In the interest of product improvement, IXYS UK Westcode Ltd reserves the right to change specifications at any time
without prior notice.
Devices with a suffix code (2-letter or letter/digit/letter combination) added to their generic code are not necessarily subject
to the conditions and limits contained in this report.