Datasheet R1LP0408-70, R1LP0408-55 Specification

Page 1
R1LP0408C-I Series
Wide Temperature Range Version 4M SRAM (512-kword × 8-bit)
REJ03C0067-0200Z
Rev. 2.00
Description
The R1LP0408C-I is a 4-Mbit static RAM organized 512-kword × 8-bit. R1LP0408C-I Series has realized higher density, higher performance and low power consumption by employing CMOS process technology (6-transistor memory cell). The R1LP0408C-I Series offers low power standby power dissipation; therefore, it is suitable for battery backup systems. It has packaged in 32-pin SOP, 32-pin TSOP II.
Features
Single 5 V supply: 5 V ± 10%
Access time: 55/70 ns (max)
Power dissipation: Active: 10 mW/MHz (typ) Standby: 4 µW (typ)
Completely static memory. No clock or timing strobe required
Equal access and cycle times
Common data input and output. Three state output
Directly TTL compatible. All inputs and outputs
Battery backup operation.
Operating temperature: 40 to +85°C
Rev.2.00, May.26.2004, page 1 of 12
Page 2
R1LP0408C-I Series
Ordering Information
Type No. Access time Package
R1LP0408CSP-5SI 55 ns 525-mil 32-pin plastic SOP (32P2M-A) R1LP0408CSP-7LI 70 ns R1LP0408CSB-5SI 55 ns 400-mil 32-pin plastic TSOP II (32P3Y-H) R1LP0408CSB-7LI 70 ns R1LP0408CSC-5SI 55 ns 400-mil 32-pin plastic TSOP II reverse (32P3Y-J) R1LP0408CSC-7LI 70 ns
Rev.2.00, May.26.2004, page 2 of 12
Page 3
R1LP0408C-I Series
Pin Arrangement
32-pin SOP 32-pin TSOP
32-pin TSOP (reverse)
A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 V
SS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
(Top view)
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
V
CC
A15 A17 WE# A13 A8 A9 A11 OE# A10 CS# I/O7 I/O6 I/O5 I/O4 I/O3
Pin Description
Pin name Function
A0 to A18 Address input I/O0 to I/O7 Data input/output CS# (CS) Chip select OE# (OE) Output enable WE# (WE) Write enable VCC Power supply VSS Ground
V
CC
A15 A17 WE# A13 A8 A9 A11 OE# A10 CS# I/O7 I/O6 I/O5 I/O4 I/O3
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
(Top view)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 V
SS
Rev.2.00, May.26.2004, page 3 of 12
Page 4
R1LP0408C-I Series
Block Diagram
LSB
MSB
A11
A9
A8 A15 A18 A10 A13 A17 A16 A14 A12
I/O0
I/O7
Row Decoder
Input Data Control
LSB
Memory Matrix 2,048 2,048
Column Decoder
A3 A2A1A0 A6A5
×
Column I/O
A4 A7
MSB
V
CC
V
SS
CS#
WE#
OE#
Rev.2.00, May.26.2004, page 4 of 12
Timing Pulse Generator
Read/Write Control
Page 5
R1LP0408C-I Series
Operation Table
WE# CS# OE# Mode VCC current I/O0 to I/O7 Ref. cycle
, I
× H × Not selected I
High-Z
SB
SB1
H L H Output disable ICC High-Z H L L Read ICC Dout Read cycle L L H Write ICC Din Write cycle (1) L L L Write ICC Din Write cycle (2) Note: H: VIH, L: VIL, ×: VIH or VIL
Absolute Maximum Ratings
Parameter Symbol Value Unit
Power supply voltage relative to V
V
SS
Terminal voltage on any pin relative to VSS V Power dissipation PT 0.7 W Operating temperature Topr 40 to +85 °C Storage temperature range Tstg 65 to +150 °C Storage temperature range under bias Tbias 40 to +85 °C Notes: 1. VT min: 3.0 V for pulse half-width 30 ns.
2. Maximum voltage is +7.0 V.
0.5 to +7.0 V
CC
0.5*1 to VCC + 0.3*2 V
T
DC Operating Conditions
(Ta = 40 to +85°C)
Parameter Symbol Min Typ Max Unit
Supply voltage VCC 4.5 5.0 5.5 V V Input high voltage VIH 2.2  V Input low voltage VIL 0.3*1 0.8 V Note: 1. VIL min: 3.0 V for pulse half-width 30 ns.
Rev.2.00, May.26.2004, page 5 of 12
0 0 0 V
SS
+ 0.3 V
CC
Page 6
R1LP0408C-I Series
DC Characteristics
Parameter Symbol Min Typ Max Unit Test conditions
Input leakage current |I Output leakage current |ILO|   1 µA CS# = VIH or OE# = VIH or
Operating current ICC 1.5*1 3 mA CS# = VIL,
Average operating current I
I
Standby current ISB 0.1*1 0.5 mA CS# = VIH Standby current
5SI
to +85°C I to +70°C I to +40°C I to +25°C I
7LI
to +85°C I to +70°C I to +40°C I
to +25°C I Output low voltage VOL 0.4 V IOL = 2.1 mA Output high voltage VOH 2.4   V IOH = 1.0 mA V Notes: 1. Typical values are at VCC = 5.0 V, Ta = +25°C and specified loading, and not guaranteed.
2. Typical values are at V
= 5.0 V, Ta = +40°C and specified loading, and not guaranteed.
CC
|   1 µA Vin = VSS to VCC
LI
WE# = VIL or V
Others = VIH/ VIL, I
8*1 25 mA Min. cycle, duty = 100%,
CC1
= VSS to VCC
I/O
= 0 mA
I/O
CS# = VIL, Others = VIH/V I
= 0 mA
I/O
2*1 5 mA Cycle time = 1 µs,
CC2
duty = 100%, I
= 0 mA, CS# 0.2 V,
I/O
VIH VCC 0.2 V, VIL 0.2 V
  10 µA Vin ≥ 0 V, CS# ≥ VCC 0.2 V
SB1
  8 µA
SB1
1.0*2 3 µA
SB1
0.8*1 3 µA
SB1
  20 µA
SB1
  16 µA
SB1
1.0*2 10 µA
SB1
0.8*1 10 µA
SB1
2.6 V IOH = 0.1 mA
OH2
IL
Capacitance
(Ta = +25°C, f = 1.0 MHz)
Parameter Symbol Min Typ Max Unit Test conditions Note Input capacitance Cin   8 pF Vin = 0 V 1 Input/output capacitance C
Note: 1. This parameter is sampled and not 100% tested.
Rev.2.00, May.26.2004, page 6 of 12
  10 pF V
I/O
= 0 V 1
I/O
Page 7
R1LP0408C-I Series
AC Characteristics
(Ta = 40 to +85°C, VCC = 5 V ± 10%, unless otherwise noted.)
Test Conditions
Input pulse levels: V
= 0.4 V, VIH = 2.4 V
IL
Input rise and fall time: 5 ns
Input and output timing reference levels: 1.5 V
Output load: 1 TTL Gate + C
1 TTL Gate + C
(50 pF) (R1LP0408C-5SI)
L
(100 pF) (R1LP0408C-7LI)
L
(Including scope and jig)
Read Cycle
R1LP0408C-I
-5SI -7LI Parameter Symbol Min Max Min Max Unit Notes
Read cycle time tRC 55  70  ns Address access time tAA 55  70 ns Chip select access time tCO 55 70 ns Output enable to output valid tOE 25 35 ns Chip select to output in low-Z tLZ 10  10  ns 2 Output enable to output in low-Z t Chip deselect to output in high-Z tHZ 0 20 0 25 ns 1, 2 Output disable to output in high-Z t Output hold from address change tOH 10  10  ns
5  5  ns 2
OLZ
0 20 0 25 ns 1, 2
OHZ
Rev.2.00, May.26.2004, page 7 of 12
Page 8
R1LP0408C-I Series
Write Cycle
R1LP0408C-I
-5SI -7LI Parameter Symbol Min Max Min Max Unit Notes
Write cycle time tWC 55  70  ns Chip selection to end of write tCW 50  60  ns 4 Address setup time tAS 0  0  ns 5 Address valid to end of write tAW 50  60  ns Write pulse width tWP 40  50  ns 3, 12 Write recovery time tWR 0  0  ns 6 Write to output in high-Z t Data to write time overlap tDW 25  30  ns Data hold from write time tDH 0  0  ns Output active from end of write tOW 5  5  ns 2 Output disable to output in high-Z t Notes: 1. tHZ, t
OHZ
and t
are defined as the time at which the outputs achieve the open circuit conditions
WHZ
and are not referred to output voltage levels.
2. This parameter is sampled and not 100% tested.
3. A write occurs during the overlap (tWP) of a low CS# and a low WE#. A write begins at the later
transition of CS# going low or WE# going low. A write ends at the earlier transition of CS# going high or WE# going high. tWP is measured from the beginning of write to the end of write.
4. tCW is measured from CS# going low to the end of write.
5. tAS is measured from the address valid to the beginning of write.
6. tWR is measured from the earlier of WE# or CS# going high to the end of write cycle.
7. During this period, I/O pins are in the output state so that the input signals of the opposite phase
to the outputs must not be applied.
8. If the CS# low transition occurs simultaneously with the WE# low transition or after the WE#
transition, the output remain in a high impedance state.
9. Dout is the same phase of the write data of this write cycle.
10. Dout is the read data of next address.
11. If CS# is low during this period, I/O pins are in the output state. Therefore, the input signals of
the opposite phase to the outputs must not be applied to them.
12. In the write cycle with OE# low fixed, t
data bus contention. tWP tDW min + t
0 20 0 25 ns 1, 2, 7
WHZ
0 20 0 25 ns 1, 2, 7
OHZ
must satisfy the following equation to avoid a problem of
WP
max
WHZ
Rev.2.00, May.26.2004, page 8 of 12
Page 9
R1LP0408C-I Series
Timing Waveform
Read Timing Waveform (WE# = VIH)
t
RC
Address
CS#
OE#
Dout
High impedance
Valid address
t
AA
t
CO
t
LZ
t
OE
t
OLZ
t
HZ
t
OHZ
Valid data
t
OH
Rev.2.00, May.26.2004, page 9 of 12
Page 10
R1LP0408C-I Series
Write Timing Waveform (1) (OE# Clock)
t
WC
Address
OE#
CS#
WE#
Dout
Din
Valid address
t
AW
t
CW
*8
t
AS
t
OHZ
t
WP
t
WR
High impedance
t
DW
t
DH
Valid data
Rev.2.00, May.26.2004, page 10 of 12
Page 11
R1LP0408C-I Series
Write Timing Waveform (2) (OE# Low Fixed)
t
WC
Address
CS#
WE#
Dout
Din
Valid address
t
CW
*8
t
AW
t
WP
t
AS
t
WHZ
t
WR
t
OW
t
OH
*9
*10
High impedance
t
DW
t
DH
*11
Valid data
Rev.2.00, May.26.2004, page 11 of 12
Page 12
R1LP0408C-I Series
Low VCC Data Retention Characteristics
(Ta = 40 to +85°C)
Parameter Symbol Min Typ Max Unit Test conditions*3
for data retention VDR 2  V CS# ≥ VCC 0.2 V, Vin 0 V
V
CC
Data retention current
5SI
to +85°C I to +70°C I to +40°C I to +25°C I
7LI
to +85°C I to +70°C I to +40°C I
to +25°C I Chip deselect to data retention time t Operation recovery time tR t Notes: 1. Typical values are at VCC = 3.0 V, Ta = +25°C and specified loading, and not guaranteed.
2. Typical values are at VCC = 3.0 V, Ta = +40°C and specified loading, and not guaranteed.
3. CS# controls address buffer, WE# buffer, OE# buffer, and Din buffer. In data retention mode,
Vin levels (address, WE#, OE#, I/O) can be in the high impedance state.
4. tRC = read cycle time.
10 µA VCC = 3.0 V, Vin 0 V
CCDR
8 µA CS# ≥ VCC 0.2 V
CCDR
1.0*23 µA
CCDR
0.8*13 µA
CCDR
20 µA
CCDR
16 µA
CCDR
1.0*210 µA
CCDR
0.8*110 µA
CCDR
0 ns See retention waveform
CDR
*4 ns
RC
Low VCC Data Retention Timing Waveform (CS# Controlled)
V
CC
4.5 V
2.2 V V
DR
CS#
0 V
t
CDR
Data retention mode
CS# VCC – 0.2 V
t
R
Rev.2.00, May.26.2004, page 12 of 12
Page 13
Revision History R1LP0408C-I Series Data Sheet
Contents of Modification Rev. Date Page Description
1.00 Aug.01.2003 Initial issue
2.00 May.26.2004 6
12
12
DC characteristics
5SI and 7LI items’ description are divided. Low V
Data Retention Characteristics
CC
5SI and 7LI items’ description are divided. Low V
Data Retention Timing Waveform
CC
2.4 V to 2.2 V
Page 14
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