Wide Temperature Range Version
4M SRAM (512-kword × 8-bit)
REJ03C0067-0200Z
Rev. 2.00
May.26.2004
Description
The R1LP0408C-I is a 4-Mbit static RAM organized 512-kword × 8-bit. R1LP0408C-I Series has realized
higher density, higher performance and low power consumption by employing CMOS process technology
(6-transistor memory cell). The R1LP0408C-I Series offers low power standby power dissipation;
therefore, it is suitable for battery backup systems. It has packaged in 32-pin SOP, 32-pin TSOP II.
WE# CS# OE# Mode VCC current I/O0 to I/O7 Ref. cycle
, I
× H × Not selected I
High-Z
SB
SB1
H L H Output disable ICC High-Z
H L L Read ICC Dout Read cycle
L L H Write ICC Din Write cycle (1)
L L L Write ICC Din Write cycle (2)
Note: H: VIH, L: VIL, ×: VIH or VIL
Absolute Maximum Ratings
Parameter Symbol Value Unit
Power supply voltage relative to V
V
SS
Terminal voltage on any pin relative to VSS V
Power dissipation PT 0.7 W
Operating temperature Topr −40 to +85 °C
Storage temperature range Tstg −65 to +150 °C
Storage temperature range under bias Tbias −40 to +85 °C
Notes: 1. VT min: −3.0 V for pulse half-width ≤ 30 ns.
2. Maximum voltage is +7.0 V.
−0.5 to +7.0 V
CC
−0.5*1 to VCC + 0.3*2 V
T
DC Operating Conditions
(Ta = −40 to +85°C)
Parameter Symbol Min Typ Max Unit
Supply voltage VCC 4.5 5.0 5.5 V
V
Input high voltage VIH 2.2 V
Input low voltage VIL −0.3*1 0.8 V
Note: 1. VIL min: −3.0 V for pulse half-width ≤ 30 ns.
Rev.2.00, May.26.2004, page 5 of 12
0 0 0 V
SS
+ 0.3 V
CC
Page 6
R1LP0408C-I Series
DC Characteristics
Parameter Symbol Min Typ Max Unit Test conditions
Input leakage current |I
Output leakage current |ILO| 1 µA CS# = VIH or OE# = VIH or
Operating current ICC 1.5*1 3 mA CS# = VIL,
Average operating current I
I
Standby current ISB 0.1*1 0.5 mA CS# = VIH
Standby current
−5SI
to +85°C I
to +70°C I
to +40°C I
to +25°C I
−7LI
to +85°C I
to +70°C I
to +40°C I
to +25°C I
Output low voltage VOL 0.4 V IOL = 2.1 mA
Output high voltage VOH 2.4 V IOH = −1.0 mA
V
Notes: 1. Typical values are at VCC = 5.0 V, Ta = +25°C and specified loading, and not guaranteed.
2. Typical values are at V
= 5.0 V, Ta = +40°C and specified loading, and not guaranteed.
CC
| 1 µA Vin = VSS to VCC
LI
WE# = VIL or V
Others = VIH/ VIL, I
8*1 25 mA Min. cycle, duty = 100%,
CC1
= VSS to VCC
I/O
= 0 mA
I/O
CS# = VIL, Others = VIH/V
I
= 0 mA
I/O
2*1 5 mA Cycle time = 1 µs,
CC2
duty = 100%,
I
= 0 mA, CS# ≤ 0.2 V,
I/O
VIH ≥ VCC − 0.2 V, VIL ≤ 0.2 V
10 µA Vin ≥ 0 V, CS# ≥ VCC − 0.2 V
SB1
8 µA
SB1
1.0*2 3 µA
SB1
0.8*1 3 µA
SB1
20 µA
SB1
16 µA
SB1
1.0*2 10 µA
SB1
0.8*1 10 µA
SB1
2.6 V IOH = −0.1 mA
OH2
IL
Capacitance
(Ta = +25°C, f = 1.0 MHz)
Parameter Symbol Min Typ Max Unit Test conditionsNote
Input capacitance Cin 8 pF Vin = 0 V 1
Input/output capacitance C
Note: 1. This parameter is sampled and not 100% tested.
Rev.2.00, May.26.2004, page 6 of 12
10 pF V
I/O
= 0 V 1
I/O
Page 7
R1LP0408C-I Series
AC Characteristics
(Ta = −40 to +85°C, VCC = 5 V ± 10%, unless otherwise noted.)
Test Conditions
• Input pulse levels: V
= 0.4 V, VIH = 2.4 V
IL
• Input rise and fall time: 5 ns
• Input and output timing reference levels: 1.5 V
• Output load: 1 TTL Gate + C
1 TTL Gate + C
(50 pF) (R1LP0408C-5SI)
L
(100 pF) (R1LP0408C-7LI)
L
(Including scope and jig)
Read Cycle
R1LP0408C-I
-5SI -7LI
Parameter Symbol Min Max Min Max Unit Notes
Read cycle time tRC 55 70 ns
Address access time tAA 55 70 ns
Chip select access time tCO 55 70 ns
Output enable to output valid tOE 25 35 ns
Chip select to output in low-Z tLZ 10 10 ns 2
Output enable to output in low-Z t
Chip deselect to output in high-Z tHZ 0 20 0 25 ns 1, 2
Output disable to output in high-Z t
Output hold from address change tOH 10 10 ns
5 5 ns 2
OLZ
0 20 0 25 ns 1, 2
OHZ
Rev.2.00, May.26.2004, page 7 of 12
Page 8
R1LP0408C-I Series
Write Cycle
R1LP0408C-I
-5SI -7LI
Parameter Symbol Min Max Min Max Unit Notes
Write cycle time tWC 55 70 ns
Chip selection to end of write tCW 50 60 ns 4
Address setup time tAS 0 0 ns 5
Address valid to end of write tAW 50 60 ns
Write pulse width tWP 40 50 ns 3, 12
Write recovery time tWR 0 0 ns 6
Write to output in high-Z t
Data to write time overlap tDW 25 30 ns
Data hold from write time tDH 0 0 ns
Output active from end of write tOW 5 5 ns 2
Output disable to output in high-Z t
Notes: 1. tHZ, t
OHZ
and t
are defined as the time at which the outputs achieve the open circuit conditions
WHZ
and are not referred to output voltage levels.
2. This parameter is sampled and not 100% tested.
3. A write occurs during the overlap (tWP) of a low CS# and a low WE#. A write begins at the later
transition of CS# going low or WE# going low. A write ends at the earlier transition of CS# going
high or WE# going high. tWP is measured from the beginning of write to the end of write.
4. tCW is measured from CS# going low to the end of write.
5. tAS is measured from the address valid to the beginning of write.
6. tWR is measured from the earlier of WE# or CS# going high to the end of write cycle.
7. During this period, I/O pins are in the output state so that the input signals of the opposite phase
to the outputs must not be applied.
8. If the CS# low transition occurs simultaneously with the WE# low transition or after the WE#
transition, the output remain in a high impedance state.
9. Dout is the same phase of the write data of this write cycle.
10. Dout is the read data of next address.
11. If CS# is low during this period, I/O pins are in the output state. Therefore, the input signals of
the opposite phase to the outputs must not be applied to them.
12. In the write cycle with OE# low fixed, t
data bus contention. tWP ≥ tDW min + t
0 20 0 25 ns 1, 2, 7
WHZ
0 20 0 25 ns 1, 2, 7
OHZ
must satisfy the following equation to avoid a problem of
WP
max
WHZ
Rev.2.00, May.26.2004, page 8 of 12
Page 9
R1LP0408C-I Series
Timing Waveform
Read Timing Waveform (WE# = VIH)
t
RC
Address
CS#
OE#
Dout
High impedance
Valid address
t
AA
t
CO
t
LZ
t
OE
t
OLZ
t
HZ
t
OHZ
Valid data
t
OH
Rev.2.00, May.26.2004, page 9 of 12
Page 10
R1LP0408C-I Series
Write Timing Waveform (1) (OE# Clock)
t
WC
Address
OE#
CS#
WE#
Dout
Din
Valid address
t
AW
t
CW
*8
t
AS
t
OHZ
t
WP
t
WR
High impedance
t
DW
t
DH
Valid data
Rev.2.00, May.26.2004, page 10 of 12
Page 11
R1LP0408C-I Series
Write Timing Waveform (2) (OE# Low Fixed)
t
WC
Address
CS#
WE#
Dout
Din
Valid address
t
CW
*8
t
AW
t
WP
t
AS
t
WHZ
t
WR
t
OW
t
OH
*9
*10
High impedance
t
DW
t
DH
*11
Valid data
Rev.2.00, May.26.2004, page 11 of 12
Page 12
R1LP0408C-I Series
Low VCC Data Retention Characteristics
(Ta = −40 to +85°C)
Parameter Symbol Min Typ Max Unit Test conditions*3
for data retention VDR 2 V CS# ≥ VCC − 0.2 V, Vin ≥ 0 V
V
CC
Data
retention
current
−5SI
to +85°C I
to +70°C I
to +40°C I
to +25°C I
−7LI
to +85°C I
to +70°C I
to +40°C I
to +25°C I
Chip deselect to data retention time t
Operation recovery time tR t
Notes: 1. Typical values are at VCC = 3.0 V, Ta = +25°C and specified loading, and not guaranteed.
2. Typical values are at VCC = 3.0 V, Ta = +40°C and specified loading, and not guaranteed.
3. CS# controls address buffer, WE# buffer, OE# buffer, and Din buffer. In data retention mode,
Vin levels (address, WE#, OE#, I/O) can be in the high impedance state.
4. tRC = read cycle time.
10 µA VCC = 3.0 V, Vin ≥ 0 V
CCDR
8 µA CS# ≥ VCC − 0.2 V
CCDR
1.0*23 µA
CCDR
0.8*13 µA
CCDR
20 µA
CCDR
16 µA
CCDR
1.0*210 µA
CCDR
0.8*110 µA
CCDR
0 ns See retention waveform
CDR
*4 ns
RC
Low VCC Data Retention Timing Waveform (CS# Controlled)
V
CC
4.5 V
2.2 V
V
DR
CS#
0 V
t
CDR
Data retention mode
CS# ≥ VCC – 0.2 V
t
R
Rev.2.00, May.26.2004, page 12 of 12
Page 13
Revision History R1LP0408C-I Series Data Sheet
Contents of Modification Rev. Date
Page Description
1.00 Aug.01.2003 Initial issue
2.00 May.26.2004 6
12
12
DC characteristics
−5SI and −7LI items’ description are divided.
Low V
Data Retention Characteristics
CC
−5SI and −7LI items’ description are divided.
Low V
Data Retention Timing Waveform
CC
2.4 V to 2.2 V
Page 14
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