Parameter
Collector-base voltage
Collector-emitter voltage
Emitter-base voltage
Collector current
Power dissipation
Junction temperature
Range of storage temperature
∗1 Single pulse, Pw=1ms
∗2 Mounted on a 25mm 25mm t0.8mm ceramic substrate
+
+
Di2
ParameterSymbol
Peak reverse voltage
Reverse voltage (DC)
Average rectified forward current
orward current surge peak (60HZ, 1∞)
F
Power dissipation
Junction temperature
Range of storage temperature
∗ Mounted on a 25mm 25mm t0.8mm ceramic substrate
+
+
Tr1&Di2
ParameterSymbol
Total power disipation
∗1 Each terminal mounted on a recommended land.
∗2Mounted on a 25mm 25mm t0.8mm ceramic substrate.
+
+
zElectrical characteristics (Ta=25°C)
Tr1
ParameterSymbol Min. Typ. Max. UnitConditions
Collector-base breakdown voltage
Collector-emitter breakdown voltage
Emitter-base breakdown voltage
Collector cutoff current
Emitter cutoff current
Collector-emitter saturation voltage
DC current gain
Transition frequency
Collector output capacitance
∗ Pulsed
Di2
Parameter
Forward voltage
Reverse current
Reverse recovery fime
/
ELEMENT
W
Unit
V
V
V
A
A
°C
°C
∗1
∗2
Limits
15
12
6
1.5
3
0.9
150
−40 to +125
Limits
25
20
700
3
0.7
125
−40 to +125
Unit
V
V
mA
A
W / ELEMENT
°C
°C
∗
Unit
W / ELEMENT
W
/
ELEMENT
1
∗
2
∗
15
−−
12
−−
6
−−
−−
−−
85200mV
−
270
−
400
−
12
−
Min.Typ.Max.UnitConditions
−
−200
−
−−
9
V
V
V
100nA
100nA
680
MHz
−
pF
−
490450
I
C
=10µA
C
=1mA
I
E
=10µA
I
VCB=15V
EB
=6V
V
IC/IB=500mA/25mA
−V
CE/IC
=2V/200mA
VCE=2V, I
E
=
−200mA, f=100MHz
VCB=10V, IE=0A, f=1MHz
F
mVnsI
µA
=700mA
VR=20V
F=IR
=100mA, Irr=0.1I
I
QSL10
∗
∗
R
Rev.A 2/4
Page 3
Transistors
zElectrical characteristic curves
Tr1
1000
FE
Ta=25°C
100
DC CURRENT GAIN : h
10
0.0010.010.1110
COLLECTOR CURRENT : I
Fig.1 DC current gain
10
(A)
C
1
Ta=100°C
0.1
Ta=100°C
Ta=−40°C
VCE=2V
Pulsed
C
(A)
vs. collector current
VCE=2V
Pulsed
Ta=25°C
10
(V)
(V)
BE (sat)
BASE SATURATION VOLTAGE : V
Ta=−40°C
CE (sat)
COLLECTOR SATURATION VOLTAGE : V
Ta=25°C
V
Ta=100°C
1
0.1
V
0.01
0.001
0.0010.010.1110
COLLECTOR CURRENT : I
BE(sat)
Ta=100°C
CE(sat)
Fig.2 Collector-emitter saturation voltage
base-emitter saturation voltage
vs. collector current
1000
(MHz)
T
100
IC/IB=20/1
IC/IB=20
Pulsed
Pulsed
Ta=25°C
Ta=−40°C
C
(A)
1
(V)
CE(sat)
0.1
IC/IB=50/1
0.01
IC/IB=20/1
IC/IB=10/1
0.001
0.0010.010.1110
COLLECTOR SATURATION VOLTAGE : V
COLLECTOR CURRENT : I
Fig.3 Collector-emitter saturation voltage
vs. collector current
1000
100
tstg
QSL10
Ta=25°C
CE
=2V
V
C
(A)
Ta=25°C
CE
=2V
V
f=100MHz
0.01
COLLECTOR CURRENT : I
0.001
0
0.5
BASE TO EMITTER VOLTAGE : V
Ta=−40°C
Fig.4 Grounded emitter propagation
characteristics
VCE=2V
E
(A)
Ta=25°C
Pulsed
TRANSITION FREQUENCY : f
10
1.51.0
−0.001−0.01−0.1−1−10
BE
(V)
EMITTER CURRENT : I
Fig.5 Gain bandwidth product
vs. emitter current
10
SWITCHING TIME : (ns)
1
0.010.1110
COLLECTOR CURRENT : I
tdon
tf
tr
C
Fig.6 Switching time
(A)
100
Cib
Cob
10
1
0.1110100
EMITTER INPUT CAPACITANCE : Cib (pF)
EMITTER TO BASE VOLTAGE : V
COLLECTOR OUTPUT CAPACITANCE : Cob (pF)
COLLECTOR TO BASE VOLTAGE : V
IE=0A
f=1MHz
Ta=25°C
Fig.7 Collector output capacitance
vs. collector-base voltage
Emitter input capacitance
vs. emitter-base voltage
EB
(V)
CB
(V)
Rev.A 3/4
Page 4
Transistors
Di2
10
1
(A)
F
C
100m
10m
1m
FORWARD CURRENT : I
0.1m
00.10.20.30.40.50.6
°
Ta=125
C
°
=25
Ta
FORWARD VOLTAGE : VF (V)
Ta=−
°C
25
Fig.8 Forward characteristics
1000m
100m
(A)
R
100µ
REVERSE CURRENT : I
10m
10µ
0.1µ
1m
1µ
Ta=−25°C
010
REVERSE VOLTAGE : V
Ta=125°C
Ta=25°C
20 30 4050 60 70
Fig.9 Reverse characteristics
QSL10
R
(V)
Rev.A 4/4
Page 5
Appendix
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
Notes
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1
Page 6
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