Datasheet QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Datasheet (Fairchild)

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QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR — Surface Mount Silicon Pin Photodiode

August 2008

QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Surface Mount Silicon Pin Photodiode

Features

■

Daylight Filter (QSB34GR and QSB34ZR only) Surface Mount Packages:

■

– QSB34GR/QSB34CGR for overmount board – QSB34ZR/QSB34CZR for undermount board

Fast PIN Photodiode

■

Wide Reception Angle, 120°

■

Large Chip Size = 3mm x 3mm Sensitive Area - 2.55mm x 2.55mm

■

High Sensitivity Low Capacitance

■

Available in 0.470" (12mm) width tape on 7" (178mm) diameter reel; 1,000 units per reel

Package Dimensions, QSB34GR

4.50

4.30

0.175

6.70

6.10

0.10 Min

Anode

0.90

0.70

1.50

Package

Center

Photosensitive surface

0.17

0.13

0–5°

0.80

0.70

Chip

1.70

1.50

Chip Center

1.20

4.00

3.80

4.00

3.80

Schematic

ANODE

CATHODE

Notes:

1.Dimensions for all drawings are in mm.

2.Tolerance of ±.0.13 on all non-nominal dimensions unless otherwise specified.

QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR — Surface Mount Silicon Pin Photodiode

Absolute Maximum Ratings

= 25°C unless otherwise speciﬁed)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.

Symbol Parameter Rating Unit

OPR

STG

SOL

Note:

1. Soldering time ≤ 5 seconds

Electrical/Optical Characteristics

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.

Operating Temperature -25 to +85 °C

Storage Temperature -40 to +85 °C

Soldering Temperature 260 °C

Reverse Voltage 32 V

Power Dissipation at (or below) 25°C

150 mW

Free Air Temperature

=25°C unless otherwise speciﬁed)

Symbol Parameter Test Conditions Min. Typ. Max. Units

R(D)

Reverse Voltage I

Dark Reverse Current V

Peak Sensitivity V

= 0.1mA 32 V

= 10V 30 nA

= 5V 940 nm

Reception Angle @ 1/2 Power ±60 °

Photo Current Ee = 1.0mW/cm

C Capacitance V

Rise Time V

Fall Time V

, V

= 3V 25 pF

= 10V, R

= 50 Ω

= 5V

(4)

25 37 µA

50 ns

Spectral Sensitivity QSB34GR, QSB34ZR

0.5

QSB34CGR, QSB34CZR

730 400

1100 1100

Typical Performance Curves

QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR — Surface Mount Silicon Pin Photodiode

Fig. 1 Relative Spectral Sensitivity vs. Wavelength

1.0

0.8

0.6

0.4

RELATIVE SPECTRAL SENSITIVITY

0.2

100 300 500 700 900 1100 1300

QSB34CGR, QSB34CZR

QSB34GR, QSB34ZR

λ – WAVELENGTH (nm)

Ta = 25°C

Fig. 3 Capacitance vs. Reverse Voltage

f = 1 MHz H = 0mW/cm

Fig. 2 Short Circuit Current vs. Irradiance

- SHORT CIRCUIR CURRENT (µA)

VR = 5V

λ = 940nm

0 0.5 1.0 1.5

Ee - IRRADIANCE (mW/cm2)

Fig. 4 Dark Current vs. Temperature

1000

100

CAPACITANCE (pF)

0.1 1 10 100

VR - REVERSE VOLTAGE (V)

Fig. 5 Dark Current vs. Reverse Voltage

1200

Ee = 0mV/cm

1000

800

600

400

-DARK CURRENT (pA)

200

02468101214161820

VR - REVERSE VOLTAGE (V)

- DARK CURRENT (nA) R

VR = 10 V Ee = 0mV/cm

20 40 60 80 100

TA -TEMPERATURE (°C)

Fig. 6 Response Time vs. Load Resistance

VR = 10V TA = 25°C

-1

-2

RESPONSE TIME tr, ff (µs)

-3

LOAD RESISTANCE RL (Ω)

QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR — Surface Mount Silicon Pin Photodiode

Package Dimensions, QSB34ZR

Package Dimensions

Anode

0.90

0.70

1.50

Package

Center

0.20

0.10

0–5°

0.175

Photosensitive surface

4.50

4.30

6.70

6.10

1.10

0.90

0.012 (0.30)

Chip

1.70

1.50

Chip Center

0.10

1.20

Recommended Solder Screen Pattern (For Reference Only)

4.00

3.80

Note:

1. All dimensions in mm

2. Pattern applies to both QSB34GR and QSB34ZR

Note:

1. Dimensions for all drawings are in mm.

2. Tolerance of ±.0.13 on all non-nominal dimensions unless otherwise specified.

7.4

4.3

1.8

1.55

Recommend IR Reflow Soldering Profile

1 ~ 3°C/sec.

Pre-heating

1 ~ 3°C/sec.

180 ~ 200°C

120sec. Max.

260°C Max.

10sec. Max.

60sec. Max. Above 220°C

2.50

0.5

Ø13

0.5

0.2

Ordering Information

Option Description

QSB34GR Gullwing, 1000 units per reel

QSB34ZR Z-Bend reversed, 1000 units per reel

QSB34CGR Gullwing, 1000 units per reel

QSB34CZR Z-Bend reversed, 1000 units per reel

Tape & Reel Dimensions

QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR — Surface Mount Silicon Pin Photodiode

CATHODE

Ø1.5±0.1

2.0±0.05

13.21.

16.

4.0±0.10

1.75±0.10

5.5±0.05

+0.3

9°

–0.1

6.90±0.10

COVER TAPE

4.20±0.10

Ø1.50±0.25

8.0±0.10

1.45±0.10

Unit: mm

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries,andis not intended to be an exhaustive list of all such trademarks.

Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK

EfficentMax™ EZSWITCH™ *

™

Fairchild Fairchild Semiconductor FACT Quiet Series™

FACT

FAST FastvCore™ FlashWriter

®*

*EZSWITCH™ and FlashW riter

FPS™ F-PFS™

FRFET Global Power Resource

Green FPS™ Green FPS™e-Series™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC OPTOPLANAR

are trademarks of System General Corporation, used under license by Fairchild Semiconductor.

PDP SPM™ Power-SPM™ PowerTrench Programmable Active Droop™ QFET

QS™ Quiet Series™ RapidConfigure™ Saving our world, 1mW at a time™ SmartMax™ SMART START™

SPM STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™

ThePower Franchise

TinyBoost™ TinyBuck™

TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™

UHC Ultra FRFET™ UniFET™ VCX™ VisualMax™

QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR — Surface Mount Silicon Pin Photodiode

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICHCOVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably

2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

expected to result in a significant injury of the user.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technicaland product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative / In Design

Preliminary First Production

No Identification Needed Full Production

Obsolete Not In Production

Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.

Rev. I35

Datasheet QSB34GR, QSB34ZR, QSB34CGR, QSB34CZR Datasheet (Fairchild)

Specifications and Main Features

Frequently Asked Questions

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