Page 1
• λ
PLASTIC INFRARED
LIGHT EMITTING DIODE
QEE122 QEE123
PACKAGE DIMENSIONS
0.175 (4.44)
0.087 (2.22)
Ø0.065 (1.65)
0.050 (1.27)
Ø0.095 (2.41)
CATHODE
0.020 (0.51) SQ.
0.030 (0.76)
0.100 (2.54)
NOM
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless
otherwise specified.
0.200 (5.08)
0.500 (12.70)
ANODE
(2X)
0.100 (2.54)
MIN
SCHEMATIC
ANODE
CATHODE
DESCRIPTION
The QEE12X is a 880 nm AlGaAs LED encapsulated in a medium wide angle, plastic sidelooker package.
FEATURES
= 880 nm
• Package Type = Sidelooker
• Chip Material = AlGaAs
• Matched Photosensor: QSE113
• Medium Wide Emission Angle, 50°
• Package Material: Clear Epoxy
• High Output Power
• Orange stripe on the top side
© 2002 Fairchild Semiconductor Corporation
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4/30/02
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PLASTIC INFRARED
LIGHT EMITTING DIODE
QEE122 QEE123
ABSOLUTE MAXIMUM RATINGS
(T
= 25°C unless otherwise specified)
A
Parameter Symbol Rating Unit
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)
Soldering Temperature (Flow)
Continuous Forward Current
Reverse Voltage
Power Dissipation
(1)
(2,3,4)
(2,3)
T
T
T
SOL-I
T
SOL-F
OPR
STG
I
F
V
R
P
D
-40 to + 100 °C
-40 to + 100 °C
240 for 5 sec °C
260 for 10 sec °C
50 mA
5V
100 mW
NOTES:
1. Derate power dissipation linearly 1.33 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6 mm) minimum from housing
.
ELECTRICAL / OPTICAL CHARACTERISTICS
(T
A
=25°C)
Parameter Test Conditions Symbol Min Typ Max Units
I
Peak Emission Wavelength
Emission Angle
Forward Voltage
Reverse Current
Radiant Intensity QEE122
Radiant Intensity QEE123
Rise Time
Fall Time
= 100 mA
F
I
= 100 mA
F
I
= 100 mA, tp = 20 ms V
F
V
= 5 V I
R
I
= 100 mA, tp = 20 ms I
F
I
= 100 mA, tp = 20 ms I
F
I
= 100 mA
F
λ
PE
— 940 — nm
2 Θ 1/2 — 50 — Deg.
F
R
E
E
t
r
t
f
——1.7 V
——10 µA
4 — 16 mW/sr
8 ——mW/sr
— 800 — ns
— 800 — ns
© 2002 Fairchild Semiconductor Corporation
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PLASTIC INFRARED
LIGHT EMITTING DIODE
QEE122 QEE123
Fig.1 Normalized Radiant Intensity vs. Forward Current
10
Normalized to:
= 100 mA Pulsed
I
F
= 100 µs
t
pw
Duty Cycle = 0.1 %
1
= 25˚C
T
A
0.1
0.01
- NORMALIZED RADIANT INTENSITY
e
I
0.001
1 10 100 1000
IF - FORWARD CURRENT (mA)
Fig.3 Forward Voltage vs. Ambient Temperature
2.0
1.5
1.0
- FORWARD VOLTAGE (V)
F
0.5
Normalized to:
V
Pulsed
I
F
= 100 µs
t
pw
Duty Cycle = 0.1 %
0.0
-40 -20 0 20 40 60 80 100
IF = 20 mA
TA - AMBIENT TEMPERATURE (˚C)
IF = 50 mA
IF = 100 mA
IF = 10 mA
Fig.2 Coupling Characteristics of QEE123 And QSE113
1.0
0.8
0.6
0.4
0.2
IF = 20 mA
(ON) - NORMALIZED COLLECTOR CURRENT (mA)
C
0.0
I
0123456
IF = 100 mA
LENS TIP SEPARATION (INCHES)
Fig. 4 Normalized Intensity vs. Wavelength
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
NORMALIZED RADIANT INTENSITY
0.1
775 800 825 850 875 900 925 950
Normalized to:
d = 0
Pulsed
I
F
= 100 µs
t
pw
Duty Cycle = 0.1 %
= 5 V
V
CC
= 100 Ω
R
L
= 25˚C
T
A
λ (nm)
160
170
180
1.0
© 2002 Fairchild Semiconductor Corporation
150
140
0.8
130
0.6
120
Fig. 5
Radiation Diagram
100
110
0.2
0.4
Page 3 of 4
90
80
70
60
50
40
30
0.0
0.0 0.2 0.4 0.6 0.8 1.0
20
10
0
4/30/02
Page 4
PLASTIC INFRARED
LIGHT EMITTING DIODE
QEE122 QEE123
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
© 2002 Fairchild Semiconductor Corporation
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4/30/02
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