✔ 350 Watts Peak Pulse Power per Line (tp=8/20µs)
✔ Monolithic Design
✔ Available in Multiple Voltage Types Ranging From 5V to 24V
✔ Protect 4 Lines
✔ ESD Protection > 25 kilovolts
✔ Low Clamping Voltage
✔ Unidirectional & Bidirectional Configurations
✔ Low Leakage Current
thru
PSMS24C
SOT-23-6
MECHANICAL CHARACTERISTICS
✔ Molded JEDEC SOT-23-6 Package
✔ Weight 0.6 grams (Approximate)
✔ Flammability rating UL 94V-0
✔ 8mm Tape and Reel Per EIA Standard 481
✔ Marking: Marking Code & Pin One Defined By DOT on Package
PIN CONFIGURATIONS
UNIDIRECTIONAL
1
2
3
6
5
4
BIDIRECTIONAL
1
2
3
6
5
4
105095.R3 9/03www.protekdevices.com
Page 2
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PSMS05
thru
PSMS24C
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOLVALUE
P
PP
T
J
T
STG
350Watts
-55°C to 150°C
-55°C to 150°C°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
Note 1: Part numbers with an additional “C” suffix are bidirectional devices, i.e., PSMS05C.
Note 2:
Unidirectional Only:
Note 3:
Bidirectional Only:
Note 4:
Unidirectional Only:
10,000
1,000
100
- Peak Pulse Power - Watts
PP
P
10
0.1 1 10 100 1,000 10,000
Test between pin 1 to 2 or 5, 4 to 2 or 5, 6 to 2 or 5, 3 to 2 or 5.
Test between pin 5 to 1 or 3 or 4 or 6. Electrical characteristics apply in both directions.
Capacitance measured between pins 1, 3, 4, 6, to 2.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
350W 8/20µs Waveform
td - Pulse Duration - µs
2www.protekdevices.com05095.R3 9/03
FIGURE 2
120
PP
100
80
60
40
- Peak Pulse Current - % of I
20
PP
I
0
0 5 10 15 20 25 30
PULSE WAVE FORM
t
f
Peak Value I
-t
e
td = t
t - Time - µs
PP
IPP/2
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
Page 3
GRAPHS
PSMS05
thru
PSMS24C
POWER DERATING CURVE
100
80
60
40
% Of Rated Power
20
0
0 25 50 75 100 125 150
T
- Lead Temperature - °C
L
Peak Pulse Power
8/20µs
Average Power
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PSMS05C
40
30
20
5 Volts per Division
10
FIGURE 3
0
ESD Test Pulse: 25 kilovolt, 1/30ns (waveform)
FIGURE 5
TYPICAL REVERSE VOLTAGE VS CAPACITANCE FOR PSMS05
160
120
80
C - Capacitance - pF
40
0
0 1 2 3 4 5
V
- Reverse Voltage - Volts
R
3www.protekdevices.com05095.R3 9/03
Page 4
PSMS05
3
1
5
6
2
4
3
1
5
6
2
4
thru
PSMS24C
APPLICATION NOTE
The PSMS Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD or EFT. This product series provides both
unidirectional and bidirectional protection, with a surge capability of 350 Watts PPP per line for an 8/20µs waveform and ESD protection > 25 kilovolts.
The PSMS Series provides up to four (4) lines of protection in a common-mode configuration as depicted in Figure 1.
Circuit connectivity is as follows:
✔Line 1 is connected to Pin 1.
✔Line 2 is connected to Pin 3.
✔Line 3 is connected to Pin 4.
✔Line 4 is connected to Pin 6.
✔Pin 5 is connected to ground.
The PSMSxxC Series provides up to four (4) lines of protection in a common-mode
configuration as depicted in Figure 2.
Circuit connectivity is as follows:
✔Line 1 is connected to Pin 1.
✔Line 2 is connected to Pin 3.
✔Line 3 is connected to Pin 4.
✔Line 4 is connected to Pin 5.
✔Pin 6 is connected to ground.
✔Pin 2 is not connected.
Figure 1 - Unidirectional Configuration
Common-Mode I/O Port Protection
LINE 1
LINE 2
I/O PORT
LINE 3
LINE 4
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following
guidelines are recommended:
✔The protection device should be placed near the
input terminals or connectors, the device will
divert the transient current immediately before it
can be coupled into the nearby traces.
✔The path length between the TVS device and the
protected line should be minimized.
✔All conductive loops including power and ground
loops should be minimized.
✔The transient current return path to ground
should be kept as short as possible to reduce
parasitic inductance.
✔Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
Figure 2 - Bidirectional Configuration
Common-Mode I/O Port Protection
LINE 1
LINE 2
I/O PORT
LINE 3
LINE 4
4www.protekdevices.com05095.R3 9/03
Page 5
PACKAGE OUTLINE & DIMENSIONS
PSMS05
thru
PSMS24C
D
6
1
V
E
54
2
3
F
A
0.028” (0.70mm)
PACKAGE OUTLINE
K
L
G
C
MOUNTING PAD
0.094” (2.40mm)
0.074” (1.90mm)
0.037” (0.95mm)
0.039” (1.00mm)
SOT-23-6
0º - 10º
J
J
B
M
PACKAGE DIMENSIONS
MILLIMETERS
DIMMINMAXMINMAX
A
B
C
D
E
F
G
J
K
L
M
NOTES
1. Dimensioning and tolerances per ANSI Y14.5M, 1985.
2. Controlling Dimension: Inches
3. Dimensions are exclusive of mold flash and metal burrs.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 3,000 pieces per 8mm tape,
i.e.,
3. Suffix-T13 = 13 Inch Reel - 10,000 pieces per 8mm tape,
i.e.,
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
5www.protekdevices.com05095.R3 9/03
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