Datasheet PSMDF05, PSMDF12 Datasheet (PROTEK)

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105123.R4 9/03 www.protekdevices.com
STANDARD CAPACITANCE TVS ARRAY
Only One Name Means ProTek’Tion™
APPLICATIONS
Cellular PhonesMP3 PlayersPersonnal Digital Assistant (PDA)NotebooksDigital Cameras
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV61000-4-4 (EFT): 40A - 5/50ns
FEATURES
100 Watts Peak Pulse Power per Line (tp=8/20µs)Available in 2 Voltages: 5V & 12VUp to Four (4) Lines of ProtectionESD Protection > 25 kilovoltsLow Clamping Voltage
MECHANICAL CHARACTERISTICS
Molded JEDEC SC-70-4L PackageWeight 14 milligrams (Approximate)Flammability rating UL 94V-08mm Tape and Reel Per EIA Standard 481Marking: Marking Code & Pin One Defined By DOT on Package
05123
PIN CONFIGURATIONS
SC-70-5L
1
3
5
4
2
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DEVICE CHARACTERISTICS
0 5 10 15 20 25 30
t - Time - µs
0
20
40
60
80
100
120
I
PP
- Peak Pulse Current - % of I
PP
TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs
t
f
Peak Value I
PP
e
-t
td = t
IPP/2
FIGURE 2
PULSE WAVE FORM
0.1 1 10 100 1,000 10,000 td - Pulse Duration - µs
100W 8/20µs Waveform
10
100
1,000
10,000
P
PP
- Peak Pulse Power - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
Operating Temperature
SYMBOL VALUE
-55°C to 150°C
°C
-55°C to 150°C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
Peak Pulse Power (tp = 8/20µs) - See Figure 1
P
PP
100 Watts
Forward Voltage @ 1A, 8/20µs Volts1.5V
FP
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PA RT
NUMBER
DEVICE
MARKING
CODE
MINIMUM
BREAKDOWN
VOLTAGE
(See Note 1)
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 1A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20µs
VC @ I
PP
MAXIMUM
CAPACITANCE
@0V, 1 MHz
C
J
pF
PSMF05 PSMF12
05 12
6.0
13.3
9.5
15.0
12.0V @ 9.0A
22.0V @ 5.0A
60 30
MAXIMUM
LEAKAGE
CURRENT
@V
WM
I
D
µA 10
1
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
5.0
12.0
Note 1: Test between pins 1 to 2, 3 to 2, 4 to 2 and 5 to 2.
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GRAPHS
0 2 4 6 8 10
I
PP
- Peak Pulse Current - Amps
V
C
- Clamping Voltage - Volts
0
4
8
12
16
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PSMF05
0 25 50 75 100 125 150
TL - Lead Temperature - °C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20µs
Average Power
FIGURE 3
POWER DERATING CURVE
0
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PSMF05
ESD Test Pulse: 5 kilovolt, 1/30ns (waveform)
5 Volts per Division
-5
5
15
25
35
FIGURE 6
TYPICAL REVERSE VOLTAGE VS CAPACITANCE FOR PSMF05
0 1 2 3 4 5 6
V
R
- Reverse Voltage - Volts
C - Capacitance - pF
0
40
80
120
160
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APPLICATION NOTE
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended:
The protection device should be placed near the
input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground
loops should be minimized.
The transient current return path to ground
should be kept as short as possible to reduce parasitic inductance.
Ground planes should be used whenever
possible. For multilayer PCBs, use ground vias.
The PSMF Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD or EFT. This product provides unidirectional protection, with a surge capability of 200 Watts PPP per line for an 8/20µs waveform and ESD protection > 25 kilovolts.
UNIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1)
The PSMF Series provides up to four (4) lines of protection in a common-mode configuration as depicted in Figure 1. Circuit connectivity is as follows:
I/O 1 is connected to Pin 1. I/O 2 is connected to Pin 3. I/O 3 is connected to Pin 4. I/O 4 is connected to Pin 5. Pin 2 is connected to ground.
Figure 1 - Unidirectional Configuration
Common-Mode I/O Port Protection
31
5
2
4
I/O 4
I/O 3
I/O 2
I/O 1
I/O INTEGRATED CIRCUIT
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COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyers and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
PACKAGE OUTLINE & DIMENSIONS
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
A B C D E F
G
J K L
M
1.90
1.15
0.80
0.15
0.65 BSC
1.30 BSC
0.80
0.08
1.90 0
0.26
2.15
1.35
1.00
0.30
-
-
1.10
0.25
2.15
0.10
0.46
0.074
0.045
0.031
0.006
0.0255 BSC
0.0512 BSC
0.031
0.003
0.074 0
0.010
0.084
0.055
0.040
0.012
-
-
0.043
0.010
0.084
0.004
0.018
DIM MIN MAX MIN MAX
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES
1. Dimensioning and tolerances per ANSI Y14.5M, 1985.
2. Controlling Dimension: Inches
3. Dimensions are exclusive of mold flash and metal burrs.
PACKAGE OUTLINE
SC -70-5L
MOUNTING PAD
E
D
A
L
F
4
3
5
B
G
V
J
C
K
0º - 8º
1
2
M
J
4
1
6
2
7
5
3
0.020
0.051
0.026
0.094
0.024
0.028
0.098
1 2 3 4 5 6 7
0.50
1.30
0.65
2.40
0.60
0.70
2.50
DIM
Millimeters Inches
TYPICAL
Outline & Dimensions: Rev 0 - 11/01, 06005
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 3,000 pieces per 8mm tape, i.e.,
PSMF05-T7.
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