Datasheet PSD813F1, PSD813F1V Datasheet (SGS Thomson Microelectronics)

Page 1
Flash In-System Programmable (ISP) Peripherals
FEATURES SUMMARY
– 5 V±10% for PSD813F1-A – 3.3 V±10% for PSD813F1-AV
Up to 1Mbit of Primary Flash Memory (8 uniform
sectors)
256Kbit Secondary EEPROM (4 uniform
sectors)
Up to 16Kbit SRAM
Over 3,000 Gates of PLD: DPLD and CPLD
27 Reconfigurable I/O ports
Enhanced JTAG Serial Port
Programmable power management
High Endurance:
– 100,000 Erase/Write Cycles of Flash Memory – 10,000 Erase/Write Cycles of EEPROM – 1,000 Erase/Write Cycles of PLD
PSD813F1-A
For 8-bi t MCUs
PRELIMINARY DATA
Figure 1. Packages
PQFP52 (T)
PLCC52 (K)
January 2002
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/3
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Revision A Flash PSD
PSD813F1-A
Flash In-System-Programmable Microcontroller Peripherals
Table of Contents
1.0 Introduction...........................................................................................................................................................1
2.0 Key Features ........................................................................................................................................................2
PSD813F1 Block Diagram .............................................................................................................................4
3.0 General Information..............................................................................................................................................5
4.0 PSD813F1 Family.................................................................................................................................................5
5.0 PSD813F1 Architectural Overview .......................................................................................................................6
5.1 Memory...................................................................................................................................................6
5.2 Page Register.........................................................................................................................................6
5.3 PLDs.......................................................................................................................................................6
5.4 I/O Ports..................................................................................................................................................7
5.5 Microcontroller Bus Interface..................................................................................................................7
5.6 JTAG Port...............................................................................................................................................7
5.7 In-System Programming.........................................................................................................................8
5.8 Power Management................................................................................................................................8
6.0 Development System............................................................................................................................................9
7.0 PSD813F1 Pin Descriptions ...............................................................................................................................10
8.0 PSD813F1 Register Description and Address Offset.........................................................................................14
9.0 PSD813F1 Functional Blocks.............................................................................................................................15
9.1 Memory Blocks.....................................................................................................................................15
9.1.1 Main Flash and Secondary EEPROM........................................................................................15
9.1.2 SRAM.........................................................................................................................................29
9.1.3 Memory Select Signals...............................................................................................................29
9.1.4 Page Register.............................................................................................................................32
9.2 PLDs.....................................................................................................................................................33
9.2.1 Decode PLD (DPLD)..................................................................................................................35
9.2.2 Complex PLD (CPLD)................................................................................................................35
9.3 Microcontroller Bus Interface................................................................................................................44
9.3.1 PSD813F Interface to a Multiplexed 8-bit Bus ...........................................................................44
9.3.2 PSD813F Interface to a Non-Multiplexed 8-bit Bus....................................................................44
9.3.3 Data Byte Enable Reference......................................................................................................47
9.3.4 Microcontroller Interface Examples............................................................................................47
9.4 I/O Ports................................................................................................................................................52
9.4.1 General Port Architecture...........................................................................................................52
9.4.2 Port Operating Modes................................................................................................................54
9.4.3 Port Configuration Registers (PCRs) .........................................................................................57
9.4.4 Port Data Registers....................................................................................................................60
9.4.5 Ports A and B – Functionality and Structure ............................................................................61
9.4.6 Port C – Functionality and Structure ........................................................................................63
9.4.7 Port D – Functionality and Structure ........................................................................................63
9.5 Power Management..............................................................................................................................67
9.5.1 Automatic Power Down (APD) Unit and Power Down Mode .....................................................67
9.5.2 Other Power Saving Options......................................................................................................71
9.5.3 Reset and Power On Requirement ............................................................................................72
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For additional information,
Call 800-832-6974 Fax: 510-657-8495
Web Site: http://www.psdst.com
E-mail: ask.psd@st.com
Revision A Flash PSD
PSD813F1-A
Flash In-System-Programmable Microcontroller Peripherals
Table of Contents
(cont.)
9.6 Programming In-Circuit Using the JTAG Interface ...............................................................................73
9.6.1 Standard JTAG Signals..............................................................................................................74
9.6.2 JTAG Extensions........................................................................................................................75
9.6.3 Security and Flash Memories and EEPROM Protection............................................................75
Absolute Maximum Ratings.........................................................................................................................................76
AD/DC Parameters......................................................................................................................................................77
Example of PSD813F Typical Power Calculation at VCC= 5.0 V.......................................................................78
PSD813F1 DC Characteristics (5 V ± 10% Versions)........................................................................................80
PSD813F1 AD/DC Parameters – CPLD Timing Parameters (5 V ± 10% versions).........................................81
PSD813F1V DC Characteristics (3 V Versions).................................................................................................91
PSD813F1V AC/DC Parameters – CPLD Timing Parameters (3 V versions).................................................92
Timing Diagrams .......................................................................................................................................................100
Programming.............................................................................................................................................................107
PSD813F1 Pin Assignments.....................................................................................................................................108
PSD813F1 Package Information...............................................................................................................................110
Selector Guide...........................................................................................................................................................113
Part Number Construction.........................................................................................................................................114
Ordering Information..................................................................................................................................................114
Product Revisions......................................................................................................................................................115
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PSD813F1-A Family Preliminary
For additional information,
Call 800-832-6974 Fax: 510-657-8495
Web Site: http://www.psdst.com
E-mail: ask.psd@st.com
Page 5
1
1.0 Introduction
Preliminary
Programmable Peripheral
Revision A Flash PSD PSD813F1-A
Flash In-System-Programmable Microcontroller Peripherals
The PSD813F1 family of Programmable Microcontroller (MCU) Peripherals brings In-System-Programmability (ISP) to Flash memory and programmable logic. The result is a simple and flexible solution for embedded designs. PSD813F1 devices combine many of the peripheral functions found in MCU based applications:
1 Mbit of Flash memory
A second EEPROM memory
Over 3,000 gates of Flash programmable logic
SRAM
Reconfigurable I/O ports
Programmable power management.
PSD813F1 devices integrate an optimized “microcontroller macrocell” logic architecture called the MicroCellTM. The MicroCell was created to address the unique requirements of embedded system designs. It allows direct connection between the system address/data bus and the internal PSD registers to simplify communication between the MCU and other supporting devices.
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PSD813F1-A Preliminary
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1.0 Introduction
(Cont.)
The PSD813F1 family offers two methods to program PSD Flash memory while the PSD is soldered to a circuit board.
In-System Programming (ISP) JTAG
An IEEE 1149.1 compliant JTAG interface is included on the PSD enabling the entire device (Flash memory, EEPROM, the PLD, and all configuration) to be rapidly programmed while soldered to the circuit board. This requires no MCU participation, which means the PSD can be programmed anytime, even while completely blank.
The innovative JTAG interface to flash memories is an industry first, solving key problems faced by designers and manufacturing houses, such as:
First time programming – How do I get firmware into the flash the very first time?
JTAG is the answer, program the PSD while blank with no MCU involvement.
Inventory build-up of pre-programmed devices – How do I maintain an accurate
count of pre-programmed flash memory and PLD devices based on customer demand? How many and what version? JTAG is the answer, build your hardware with blank PSDs soldered directly to the board and then custom program just before they are shipped to customer. No more labels on chips and no more wasted inventory.
Expensive sockets – How do I eliminate the need for expensive and unreliable
sockets? JTAG is the answer. Solder the PSD directly to the circuit board. Program first time and subsequent times with JTAG. No need to handle devices and bend the fragile leads.
In-Application Programming (IAP)
Two independent memory arrays (Flash and EEPROM) are included so the MCU can execute code from one memory while erasing and programming the other. Robust product firmware updates in the field are possible over any communication channel (CAN, Ethernet, UART, J1850, etc) using this unique architecture. Designers are relieved of these problems:
Simultaneous read and write to flash memory – How can the MCU program the
same memory from which it is executing code? It cannot. The PSD allows the MCU to operate the two memories concurrently, reading code from one while erasing and programming the other during IAP.
Complex memory mapping – I have only a 64K-byte address space to start with.
How can I map these two memories efficiently? A Programmable Decode PLD is the answer. The concurrent PSD memories can be mapped anywhere in MCU address space, segment by segment with extremely high address resolution. As an option, the secondary flash memory can be swapped out of the system memory map when IAP is complete. A built-in page register breaks the 64K-byte address limit.
Separate program and data space – How can I write to flash or EEPROM memory
while it resides in “program” space during field firmware updates, my MCU won’t allow it! The flash PSD provides means to “reclassify” flash or EEPROM memory as “data” space during IAP, then back to “program” space when complete.
PSDsoft —ST’s software development tool—now has the ability to generate ANSI-C compliant code for use with your target MCU. The code generated allows you to manipulate the non-volatile memory (NVM) within the PSD. Code examples are also provided for:
Flash ISP via the UART of the host MCU
Memory paging to execute code across several PSD memory pages
Loading, reading, and manipulation of PSD MicroCells by the MCU
The PSD813F1 is available in a 52-pin PLCC package and a 64-pin plastic Thin Quad Flatpack (TQFP) package.
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Preliminary PSD813F1-A
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A simple interface to 8-bit microcontrollers that use either multiplexed or
non-multiplexed busses. The bus interface logic uses the control signals generated by the microcontroller automatically when the address is decoded and a read or write is performed. A partial list of the MCU families supported include:
Intel 8031, 80196, 80186, 80C251, and 80386EX
Motorola 68HC11, 68HC16, 68HC12, and 683XX
Philips 8031 and 8051XA
Zilog Z80 and Z8
Internal 1 Mbit Flash memory. This is the main Flash memory. It is divided into eight
equal-sized blocks that can be accessed with user-specified addresses.
Internal secondary 256 Kbit EEPROM memory. It is divided into four equal-sized blocks
that can be accessed with user-specified addresses. This secondary memory brings the ability to execute code and update the main Flash concurrently.
16 Kbit scratchpad SRAM. The SRAM’s contents can be protected from a power failure
by connecting an external battery.
Optional 64 byte One Time Programmable (OTP) memory that can be used for product
configuration and calibration.
CPLD with 16 Output MicroCells (OMCs) and 24 Input MicroCells (IMCs). The
CPLD may be used to efficiently implement a variety of logic functions for internal and external control. Examples include state machines, loadable shift registers, and loadable counters.
Decode PLD (DPLD) that decodes address for selection of internal memory blocks.
The DPLD can also be used to generate external chip selects.
27 individually configurable I/O port pins that can be used for the following functions:
MCU I/Os
PLD I/Os
Latched MCU address output
Special function I/Os.
16 of the I/O ports may be configured as open-drain outputs.
Standby current as low as 50 µA for 5 V devices, 25 µA for 3 V devices.Built-in JTAG compliant serial port allows full-chip In-System Programmability (ISP).
With it, you can program a blank device or reprogram a device in the factory or the field.
Internal page register that can be used to expand the microcontroller address space by
a factor of 256.
Internal programmable Power Management Unit (PMU) that supports a low power mode
called Power Down Mode. The PMU can automatically detect a lack of microcontroller activity and put the PSD813F1 into Power Down Mode.
Erase/Write cycles:
Flash memory – 100,000 minimum
EEPROM – 10,000 minimum
PLD – 1,000 minimum
Data Retention: 15 year minimum at 90 degrees Celsius (for Main Flash, Boot, PLD
and Configuration bits).
2.0 Key Features
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PSD813F1-A Preliminary
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PROG.
MCU BUS
INTRF.
ADIO
PORT
CNTL0,
CNTL1,
CNTL2
AD0 – AD15
CLKIN
CLKIN
CLKIN
PLD
INPUT
BUS
PROG.
PORT
PORT
A
PROG.
PORT
PORT
B
POWER
MANGMT
UNIT
1 MBIT MAIN FLASH
MEMORY
8 SECTORS
VSTDBY
PA0 – PA7
PB0 – PB7
PROG.
PORT
PORT
C
PROG.
PORT
PORT
D
PC0 – PC7
PD0 – PD2
ADDRESS/DATA/CONTROL BUS
PORT A ,B & C
3 EXT CS TO PORT D
24 INPUT MICROCELLS
PORT A ,B & C
73
73
256 KBIT SECONDARY
MEMORY (BOOT OR DATA)
4 SECTORS
EEPROM – F1
16 KBIT BATTERY
BACKUP SRAM
RUNTIME CONTROL
AND I/O REGISTERS
SRAM SELECT
PERIP I/O MODE SELECTS
MICROCELL FEEDBACK OR PORT INPUT
CSIOP
FLASH ISP CPLD
(CPLD)
16 OUTPUT MICROCELLS
FLASH DECODE
PLD
(
DPLD
)
PLD, CONFIGURATION
& FLASH MEMORY
LOADER
JTAG
SERIAL
CHANNEL
(
PC2
)
PAGE
REGISTER
EMBEDDED
ALGORITHM
SECTOR
SELECTS
SECTOR
SELECTS
GLOBAL
CONFIG. &
SECURITY
Figure 1. PSD813F1 Block Diagram
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Preliminary PSD813F1-A
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3.0 General Information
The PSD813F1 series architecture allows In-System Programming of all Memory, PLD Logic and Device Configuration. The embedded Input and Output MicroCells enable efficient implementation of user defined logic functions that require both software and hardware interaction. The devices eliminate the need for discrete glue logic, and allow the development of entire systems using only a few highly integrated devices.
4.0 PSD813F1 Family
All PSD813F1 devices provide these features: 1 Mbit main Flash Memory, JTAG port, CPLD, DPLD, power management, and 27 I/O pins. The PSD813F1 also adds 64 bytes of OTP memory for any use (product serial number, calibration constants, etc.). Once written, the OTP memory can never be altered.
The following table summarizes the PSD813F1:
Part # Flash Additional
No. of Serial ISP Main Memory Memory for PSD813F1 I/O MicroCells JTAG/ISC Kbit Boot and/or Data SRAM Turbo Supply Family Device Pins Input/Output Port (8 Sectors) (4 Sectors) Kbit Mode Voltage
PSD813F1 PSD813F1 27 24/16 Yes 1024 256 Kbit EEPROM 16 Yes 5V PSD813F1V PSD813F1V 27 24/16 Yes 1024 256 Kbit EEPROM 16 Yes 3V
Table 1. PSD813F1 Product Matrix
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PSD813F1-A Preliminary
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PSD813F1 devices contain several major functional blocks. Figure 1 on page 3 shows the architecture of the PSD813F1 device. The functions of each block are described briefly in the following sections. Many of the blocks perform multiple functions and are user config­urable.
5.1 Memory
The PSD813F1 contains the following memories:
A 1 Mbit Flash
A secondary 256 Kbit EEPROM memory
A 16 Kbit SRAM.
Each of the memories is briefly discussed in the following paragraphs. A more detailed discussion can be found in section 9.
The 1 Mbit Flash is the main memory of the PSD813F1. It is divided into eight equally-sized sectors that are individually selectable.
The 256 Kbit EEPROM or Flash is divided into four equally-sized sectors. Each sector is individually selectable.
The 16 Kbit SRAM is intended for use as a scratchpad memory or as an extension to the microcontroller SRAM. If an external battery is connected to the PSD813F1s Vstby pin, data will be retained in the event of a power failure.
Each block of memory can be located in a different address space as defined by the user. The access times for all memory types includes the address latching and DPLD decoding time.
5.2 Page Register
The eight-bit Page Register expands the address range of the microcontroller by up to 256 times.The paged address can be used as part of the address space to access external memory and peripherals or internal memory and I/O. The Page Register can also be used to change the address mapping of blocks of Flash memory into different memory spaces for in-circuit reprogramming.
5.3 PLDs
The device contains two PLD blocks, each optimized for a different function, as shown in Table 2. The functional partitioning of the PLDs reduces power consumption, optimizes cost/performance, and eases design entry.
The Decode PLD (DPLD) is used to decode addresses and generate chip selects for the PSD813F1 internal memory and registers. The CPLD can implement user-defined logic functions. The DPLD has combinatorial outputs. The CPLD has 16 Output MicroCells and 3 combinatorial outputs. The PSD813F1 also has 24 Input MicroCells that can be configured as inputs to the PLDs. The PLDs receive their inputs from the PLD Input Bus and are differentiated by their output destinations, number of Product Terms, and MicroCells.
The PLDs consume minimal power by using Zero-Power design techniques. The speed and power consumption of the PLD is controlled by the Turbo Bit (ZPSD only) in the PMMR0 register and other bits in the PMMR2 registers. These registers are set by the microcontroller at runtime. There is a slight penalty to PLD propagation time when invoking the ZPSD features.
5.0 PSD813F1 Architectural Overview
Name Abbreviation Inputs Outputs Product Terms
Decode PLD DPLD 73 17 42 Complex PLD CPLD 73 19 140
Table 2. PLD I/O Table
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Preliminary PSD813F1-A
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PSD813F1 Architectural Overview
(cont.)
5.4 I/O Ports
The PSD813F1 has 27 I/O pins divided among four ports (Port A, B, C, and D). Each I/O pin can be individually configured for different functions. Ports A, B, C and D can be configured as standard MCU I/O ports, PLD I/O, or latched address outputs for microcontrollers using multiplexed address/data busses.
The JTAG pins can be enabled on Port C for In-System Programming (ISP). Ports A and B can also be configured as a data port for a non-multiplexed bus or
multiplexed Address/Data buses for certain types of 16-bit microcontrollers.
5.5 Microcontroller Bus Interface
The PSD813F1 easily interfaces with most 8-bit microcontrollers that have either multiplexed or non-multiplexed address/data busses. The device is configured to respond to the microcontrollers control signals, which are also used as inputs to the PLDs. Where there is a requirement to use a 16-bit data bus to interface to a 16-bit microcontroller, two PSDs must be used. Section 9.3.5 contains microcontroller interface examples.
5.6 JTAG Port
In-System Programming can be performed through the JTAG pins on Port C. This serial interface allows complete programming of the entire PSD813F1 device. A blank device can be completely programmed. The JTAG signals (TMS, TCK, TSTAT, TERR, TDI, TDO) can be multiplexed with other functions on Port C. Table 3 indicates the JTAG signals pin assignments.
Port C Pins JTAG Signal
PC0 TMS PC1 TCK PC3 TSTAT PC4 TERR PC5 TDI PC6 TDO
Table 3. JTAG Signals on Port C
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PSD813F1-A Preliminary
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5.7 In-System Programming
Using the JTAG signals on Port C, the entire PSD813F1 device can be programmed or erased without the use of the microcontroller. The main Flash memory can also be programmed in-system by the microcontroller executing the programming algorithms out of the EEPROM or SRAM. The EEPROM can be programmed the same way by executing out of the main Flash memory. The PLD logic or other PSD813F1 configuration can be programmed through the JTAG port or a device programmer. Table 4 indicates which programming methods can program different functional blocks of the PSD813F1.
PSD813F1 Architectural Overview
(cont.)
JTAG Device In-System Parallel
Functional Block Programming Programmer Programming
Main Flash memory Yes Yes Yes EEPROM memory Yes Yes Yes PLD Array (DPLD and CPLD) Yes Yes No PSD Configuration Yes Yes No Optional OTP Row No Yes Yes
Table 4. Methods of Programming Different Functional Blocks of the PSD813F1
5.8 Power Management Unit
The Power Management Unit (PMU) in the PSD813F1 gives the user control of the power consumption on selected functional blocks based on system requirements. The PMU includes an Automatic Power Down unit (APD) that will turn off device functions due to microcontroller inactivity. The APD unit has a Power Down Mode that helps reduce power consumption.
The PSD813F1 also has some bits that are configured at run-time by the MCU to reduce power consumption of the CPLD. The turbo bit in the PMMR0 register can be turned off and the CPLD will latch its outputs and go to sleep until the next transition on its inputs. Additionally, bits in the PMMR2 register can be set by the MCU to block signals from entering the CPLD to reduce power consumption. See section 9.5.
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Preliminary PSD813F1-A
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6.0 Development System
Define General Purpose
Logic in CPLD
Merge MCU Firmware
with PSD Configuration
ST
PSD Programmer
*.OBJ FILE
Point and click definition of
combinatorial and registered logic
in CPLD. Access to HDL is
available if needed.
Define PSD Pin and
Node functions
Point and click definition of
PSD pin functions, internal nodes,
and MCU system memory map.
Choose MCU and PSD
Automatically Configures MCU
bus interface and other PSD
attributes.
PSDPro or
FlashLink (JTAG)
A composite object file is created
containing MCU firmware and
PSD configuration.
C Code Generation
Generate C Code
Specific to PSD
Functions
User's choice of
Microcontroller
Compiler/Linker
*.OBJ file
available
for 3rd party
programmers
(Conventional or JTAG-ISP)
MCU Firmware
Hex or S-Record
format
Figure 2. PSDsoft Development Tool
The PSD813F1 is supported by PSDsoft a Windows-based (95, 98, NT) software development tool. A PSD design is quickly and easily produced in a point and click environment. The designer does not need to enter Hardware Definition Language (HDL) equations (unless desired) to define PSD pin functions and memory map information. The general design flow is shown in Figure 2 below. PSDsoft is available from our web site (www.st.com/psm) or other distribution channels.
PSDsoft directly supports two low cost device programmers from ST, PSDpro and FlashLINK (JTAG). Both of these programmers may be purchased through your local rep/distributor, or directly from our web site using a credit card. The PSD813F1 is also supported by third party device programmers, see web site for current list.
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PSD813F1-A Preliminary
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The following table describes the pin names and pin functions of the PSD813F1. Pins that have multiple names and/or functions are defined using PSD Configuration.
7.0 Table 5. PSD813F1 Pin Descriptions
Pin Name Pin* Type Description
ADIO0-7 30-37 I/O This is the lower Address/Data port. Connect your MCU
address or address/data bus according to the following rules:
1. If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect AD[0:7] to this port.
2. If your MCU does not have a multiplexed address/data bus, or you are using an 80C251 in page mode, connect A[0:7] to this port.
3. If you are using an 80C51XA in burst mode, connect A4/D0 through A11/D7 to this port.
ALE or AS latches the address. The PSD drives data out only if the read signal is active and one of the PSD functional blocks was selected. The addresses on this port are passed to the PLDs.
ADIO8-15 39-46 I/O This is the upper Address/Data port. Connect your MCU
address or address/data bus according to the following rules:
1. If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect A[8:15] to this port.
2. If your MCU does not have a multiplexed address/data bus, connect A[8:15] to this port.
3. If you are using an 80C251 in page mode, connect AD[8:15] to this port.
4. If you are using an 80C51XA in burst mode, connect A12/D8 through A19/D15 to this port.
ALE or AS latches the address. The PSD drives data out only if the read signal is active and one of the PSD functional blocks was selected. The addresses on this port are passed to the PLDs.
CNTL0 47 I The following control signals can be connected to this port,
based on your MCU:
1. WR active-low write input.
2. R_W active-high read/active low write input.
This port is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations.
CNTL1 50 I The following control signals can be connected to this port,
based on your MCU:
1. RD active-low read input.
2. E E clock input.
3. DS active-low data strobe input.
4. PSEN connect PSEN to this port when it is being used
as an active-low read signal. For example, when the 80C251 outputs more than 16 address bits, PSEN is actually the read signal.
This port is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations.
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Preliminary PSD813F1-A
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Pin Name Pin* Type Description
CNTL2 49 I This port can be used to input the PSEN (Program Select
Enable) signal from any MCU that uses this signal for code exclusively. If your MCU does not output a Program Select Enable signal, this port can be used as a generic input. This port is connected to the PLDs.
Reset 48 I Active low reset input. Resets I/O Ports, PLD MicroCells
and some of the configuration registers. Must be active at power up.
PA0 29 I/O These pins make up Port A. These port pins are configurable PA1 28
and can have the following functions:
PA2 27
1. MCU I/O write to or read from a standard output or
PA3 25
input port.
PA4 24
2. CPLD MicroCell (McellAB0-7) outputs.
PA5 23
3. Inputs to the PLDs.
PA6 22
4. Latched address outputs (see Table 6).
PA7 21
5. Address inputs. For example, PA0-3 could be used for A[0:3] when using an 80C51XA in burst mode.
6. As the data bus inputs D[0:7] for non-multiplexed address/data bus MCUs.
7. D0/A16-D3/A19 in M37702M2 mode.
8. Peripheral I/O mode.
Note: PA0-3 can only output CMOS signals with an option for high slew rate. However, PA4-7 can be configured as CMOS or Open Drain Outputs.
PB0 7 I/O These pins make up Port B. These port pins are configurable PB1
6 and can have the following functions:
PB2
5 1. MCU I/O write to or read from a standard output or
PB3
4 input port.
PB4
3 2. CPLD MicroCell (McellAB0-7 or McellBC0-7) outputs.
PB5
2 3. Inputs to the PLDs.
PB6
52 4. Latched address outputs (see Table 6).
PB7
51 Note: PB0-3 can only output CMOS signals with an option
for high slew rate. However, PB4-7 can be configured as CMOS or Open Drain Outputs.
PC0 20 I/O PC0 pin of Port C. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. CPLD MicroCell (McellBC0) output.
3. Input to the PLDs.
4. TMS Input** for the JTAG Interface.
This pin can be configured as a CMOS or Open Drain output.
PC1 19 I/O PC1 pin of Port C. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. CPLD MicroCell (McellBC1) output.
3. Input to the PLDs.
4. TCK Input** for the JTAG Interface.
This pin can be configured as a CMOS or Open Drain output.
Table 5. PSD813F1 Pin Descriptions
(cont.)
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PSD813F1-A Preliminary
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Table 5. PSD813F1 Pin Descriptions
(cont.)
Pin Name Pin* Type Description
PC2 18 I/O PC2 pin of Port C. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. CPLD MicroCell (McellBC2) output.
3. Input to the PLDs.
4. Vstby SRAM standby voltage input for SRAM battery backup.
This pin can be configured as a CMOS or Open Drain output.
PC3 17 I/O PC3 pin of Port C. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. CPLD MicroCell (McellBC3) output.
3. Input to the PLDs.
4. TSTAT output** for the JTAG interface.
5. Rdy/Bsy output for in-system parallel programming.
This pin can be configured as a CMOS or Open Drain output.
PC4 14 I/O PC4 pin of Port C. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. CPLD MicroCell (McellBC4) output.
3. Input to the PLDs.
4. TERR output** for the JTAG interface.
5. Vbaton battery backup indicator output. Goes high when power is being drawn from an external battery.
This pin can be configured as a CMOS or Open Drain output.
PC5 13 I/O PC5 pin of Port C. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. CPLD MicroCell (McellBC5) output.
3. Input to the PLDs.
4. TDI input** for the JTAG interface.
This pin can be configured as a CMOS or Open Drain output.
PC6 12 I/O PC6 pin of Port C. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. CPLD MicroCell (McellBC6) output.
3. Input to the PLDs.
4. TDO output** for the JTAG interface.
This pin can be configured as a CMOS or Open Drain output.
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Preliminary PSD813F1-A
13
Table 5. PSD813F1 Pin Descriptions
(cont.)
Pin Name Pin* Type Description
PC7 11 I/O PC7 pin of Port C. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. CPLD MicroCell (McellBC7) output.
3. Input to the PLDs.
4. DBE active-low Data Byte Enable input from 68HC912 type MCUs.
This pin can be configured as a CMOS or Open Drain output.
PD0 10 I/O PD0 pin of Port D. This port pin can be configured to have
the following functions:
1. ALE/AS input latches address output from the MCU.
2. MCU I/O write or read from a standard output or input port.
3. Input to the PLDs.
4. CPLD output (external chip select).
PD1 9 I/O PD1 pin of Port D. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. Input to the PLDs.
3. CPLD output (external chip select).
4. CLKIN clock input to the CPLD MicroCells, the automatic power-down units power-down counter, and the CPLD AND array.
PD2 8 I/O PD2 pin of Port D. This port pin can be configured to have
the following functions:
1. MCU I/O write to or read from a standard output or input port.
2. Input to the PLDs.
3. CPLD output (external chip select).
4. CSI chip select input. When low, the MCU can access the PSD memory and I/O. When high, the PSD memory blocks are disabled to conserve power.
V
CC
15, 38 Power pins
GND 1,16,26 Ground pins
Port A Port B
Microcontroller Port A (3:0) Port A (7:4) Port B (3:0) Port B (7:4)
8051XA (8-bit) N/A Address [7:4] Address [11:8] N/A 80C251 (page mode) N/A N/A Address [11:8] Address [15:12]
All other 8-bit multiplexed
Address [3:0] Address [7:4] Address [3:0] Address [7:4]
8-bit non-multiplexed bus
N/A N/A Address [3:0] Address [7:4]
Table 6. I/O Port Latched Address Output Assignments*
N/A = Not Applicable
**Refer to the I/O Port Section on how to enable the Latched Address Output function.
**The pin numbers in this table are for the PLCC package only. See the package information section for pin
numbers on other package types.
**These functions can be multiplexed with other functions.
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PSD813F1-A Preliminary
14
Table 7 shows the offset addresses to the PSD813F1 registers relative to the CSIOP base address. The CSIOP space is the 256 bytes of address that is allocated by the user to the internal PSD813F1 registers. Table 7 provides brief descriptions of the registers in CSIOP space. For a more detailed description, refer to section 9.
8.0 PSD813F1 Register Description and Address Offset
Register Name Port A Port B Port C Port D Other* Description
Data In 00 01 10 11
Reads Port pin as input, MCU I/O input mode
Control 02 03
Selects mode between MCU I/O or Address Out
Stores data for output
Data Out 04 05 12 13 to Port pins, MCU I/O
output mode
Direction 06 07 14 15
Configures Port pin as input or output
Configures Port pins as either CMOS or Open
Drive Select 08 09 16 17 Drain on some pins, while
selecting high slew rate on other pins.
Input MicroCell 0A 0B 18 Reads Input MicroCells
Reads the status of the
Enable Out 0C 0D 1A 1B output enable to the I/O
Port driver
Read – reads output of Output MicroCells AB MicroCells AB
20 20
Write – loads Microcell
Flip-Flops
Read – reads output of Output MicroCells BC MicroCells BC
21 21
Write – loads Microcell
Flip-Flops
Mask
22 22
Blocks writing to the MicroCells AB Output MicroCells AB
Mask
23 23
Blocks writing to the MicroCells BC Output MicroCells BC
Flash Protection C0
Read only – Flash Sector
Protection
PSD/EE
Read only – PSD Security Protection
C2 and EEPROM Sector
Protection
JTAG Enable C7 Enables JTAG Port PMMR0 B0
Power Management
Register 0 PMMR2 B4
Power Management
Register 2 Page E0 Page Register
Places PSD memory VM E2
areas in Program and/or
Data space on an
individual basis.
Table 7. Register Address Offset
*Other registers that are not part of the I/O ports.
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Preliminary PSD813F1-A
15
9.0 The PSD813F1 Functional Blocks
As shown in Figure 1, the PSD813F1 consists of six major types of functional blocks:
Memory BlocksPLD BlocksBus InterfaceI/O PortsPower Management UnitJTAG Interface
The functions of each block are described in the following sections. Many of the blocks perform multiple functions, and are user configurable.
9.1 Memory Blocks
The PSD813F1 has the following memory blocks:
The main Flash memory
Secondary EEPROM memory
SRAM.
The memory select signals for these blocks originate from the Decode PLD (DPLD) and are user-defined in PSDsoft.
Table 8 summarizes the PSD813F1 memory blocks.
Device Main Flash EEPROM SRAM
PSD813F1 128KB 32KB 2KB
Table 8. Memory Blocks
9.1.1 Main Flash and Secondary EEPROM
The 1 Mbit main Flash memory block is divided evenly into eight 16 Kbyte sectors. The EEPROM memory is divided into four sectors of eight Kbytes each. Each sector of either memory can be separately protected from program and erase operations.
Flash memory may be erased on a sector-by-sector basis and programmed byte-by-byte. Flash sector erasure may be suspended while data is read from other sectors of memory and then resumed after reading.
EEPROM may be programmed byte-by-byte or sector-by-sector, and erasing is automatic and transparent. The integrity of the data can be secured with the help of Software Data Protection (SDP). Any write operation to the EEPROM is inhibited during the first five milliseconds following power-up.
During a program or erase of Flash, or during a write of the EEPROM, the status can be output on the Rdy/Bsy pin of Port C3. This pin is set up using PSDsoft Configuration.
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PSD813F1-A Preliminary
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9.1.1.1 Memory Block Selects
The decode PLD in the PSD813F1 generates the chip selects for all the internal memory blocks (refer to the PLD section). Each of the eight Flash memory sectors have a Flash Select signal (FS0-FS7) which can contain up to three product terms. Each of the four EEPROM memory sectors have a Select signal (EES0-3 or CSBOOT0-3) which can contain up to three product terms. Having three product terms for each sector select signal allows a given sector to be mapped in different areas of system memory. When using a microcontroller with separate Program and Data space, these flexible select signals allow dynamic re-mapping of sectors from one space to the other.
9.1.1.2 The Ready/Busy Pin (PC3)
Pin PC3 can be used to output the Ready/Busy status of the PSD813F1. The output on the pin will be a 0 (Busy) when Flash or EEPROM memory blocks are being written to, or when the Flash memory block is being erased. The output will be a 1 (Ready) when no write or erase operation is in progress.
9.1.1.3 Memory Operation
The main Flash and EEPROM memory are addressed through the microcontroller interface on the PSD813F1 device. The microcontroller can access these memories in one of two ways:
The microcontroller can execute a typical bus write or read operation just as it would
if accessing a RAM or ROM device using standard bus cycles.
The microcontroller can execute a specific instruction that consists of several write
and read operations. This involves writing specific data patterns to special addresses within the Flash or EEPROM to invoke an embedded algorithm. These instructions are summarized in Table 9.
Typically, Flash memory can be read by the microcontroller using read operations, just as it would read a ROM device. However, Flash memory can only be erased and programmed with specific instructions. For example, the microcontroller cannot write a single byte directly to Flash memory as one would write a byte to RAM. To program a byte into Flash memory, the microcontroller must execute a program instruction sequence, then test the status of the programming event. This status test is achieved by a read operation or polling the Rdy/Busy pin (PC3).
The Flash memory can also be read by using special instructions to retrieve particular Flash device information (sector protect status and ID).
The EEPROM is a bit different. Data can be written to EEPROM memory using write operations, like writing to a RAM device, but the status of each write event must be checked by the microcontroller. A write event can be one to 64 contiguous bytes. The status test is very similar to that used for Flash memory (read operation or Rdy/Busy). Optionally, the EEPROM memory may be put into a Software Data Protect (SDP) mode where it requires instructions, rather than operations, to alter its contents. SDP mode makes writing to EEPROM much like writing to Flash memory.
The PSD813F1 Functional Blocks
(cont.)
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The PSD813F1 Functional Blocks
(cont.)
9.1.1.3.1 Instructions
An instruction is defined as a sequence of specific operations. Each received byte is sequentially decoded by the PSD and not executed as a standard write operation. The instruction is executed when the correct number of bytes are properly received and the time between two consecutive bytes is shorter than the time-out value. Some instructions are structured to include read operations after the initial write operations.
The sequencing of any instruction must be followed exactly. Any invalid combination of instruction bytes or time-out between two consecutive bytes while addressing Flash memory will reset the device logic into a read array mode (Flash memory reads like a ROM device). An invalid combination or time-out while addressing the EEPROM block will cause the offending byte to be interpreted as a single operation.
The PSD813F1 supports these instructions (see Table 9):
Flash memory:
Erase memory by chip or sectorSuspend or resume sector eraseProgram a byteReset to read array modeRead Flash Identifier valueRead sector protection status
EEPROM:
Write data to OTP RowRead data from OTP RowPower down memoryEnable Software Data Protect (SDP)Disable SDPReturn from read OTP Row read mode or power down mode.
These instructions are detailed in Table 9. For efficient decoding of the instructions, the first two bytes of an instruction are the coded cycles and are followed by a command byte or confirmation byte. The coded cycles consist of writing the data AAh to address X555h during the first cycle and data 55h to address XAAAh during the second cycle. Address lines A15-A12 are dont cares during the instruction write cycles. However, the appropriate sector select signal (FSi or EESi) must be selected.
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Flash
EEPROM Sector
Sector Select Select (FSi)
Instruction (EESi)
(Note 2) Cycle 1 Cycle 2 Cycle 3 Cycle 4 Cycle5 Cycle 6 Cycle 7
Read
Read
AAh 55h 90h
identifier
Flash
01
@X555h @XAAAh @X555h
with
Identifier
(A6,A1,A0
(Note 3, 5)
at 0,0,1)
Read OTP Row 1 0 AAh 55h 90h Read Read Read (Note 4) @X555h @XAAAh @X555h byte 1 byte 2 byte N
Read
Read Sector
AAh 55h 90h
identifier
Protection
01
@X555h @XAAAh @X555h
with
Status
(A6,A1,A0
(Notes 3, 5)
at 0,1,0)
Program a
0 1 AAh 55h A0h Data
Flash Byte
@X555h @XAAAh @X555h @ address
(Note 5) Erase one
AAh 55h 80h AAh 55h
30h 30h
Flash Sector
0 1 @X555h @XAAAh @X555h @X555h @XAAAh
@ Sector @ Sector
(Note 5) address address(1) Erase the
0 1 AAh 55h 80h AAh 55h 10h
whole Flash
@X555h @XAAAh @X555h @X555h @XAAAh @X555h
(Note 5) Suspend Sector B0h
Erase 0 1 @ any (Note 5) address
Resume 30h Sector Erase 0 1 @ any (Note 5) address
EEPROM Power
10
AAh 55h 30h
Down (Note 4) @X555h @XAAAh @X555h SDP Enable/
1 0 AAh 55h A0h Write Write Write
EEPROM Write
@X555h @XAAAh @X555h byte 1 byte 2 byte N
(Note 4) SDP Disable 1 0 AAh 55h 80h AAh 55h 20h
(Note 4) @X555h @XAAAh @X555h @X555h @XAAAh @X555h Write in OTP 1 0 AAh 55h B0h Write Write Write
Row (Notes 4, 6) @X555h @XAAAh @X555h byte 1 byte 2 byte N Return (from OTP
F0h @
Read or EEPROM
1 0 any
Power-Down)
address
(Note 4)
AAh 55h
F0h
Reset
01
@X555h @XAAAh
@ any
(Notes 3, 5)
address
Reset F0h (short instruction) 0 1 @ any (Note 5) address
Table 9. Instructions
NOTES: 1. Additional sectors to be erased must be entered within 80 µs. A Sector Address is any address within
the Sector.
2. Flash and EEPROM Sector Selects are active high. Addresses A15-A12 are dont cares in Instruction Bus Cycles.
3. The Reset instruction is required to return to the normal read array mode if DQ5 goes high or after reading the Flash Identifier or Protection status.
4. The MCU cannot invoke these instructions while executing code from EEPROM. The MCU must be operating from some other memory when these instructions are performed.
5. The MCU cannot invoke these instructions while executing code from the same Flash memory for which the instruction is intended. The MCU must operate from some other memory when these instructions are executed.
6. Writing to OTP Row is allowed only when SDP mode is disabled.
The PSD813F1 Functional Blocks
(cont.)
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The PSD813F1 Functional Blocks
(cont.)
9.1.1.4 Power Down Instruction and Power Up Condition
9.1.1.4.1 EEPROM Power Down Instruction
The EEPROM can enter power down mode with the help of the EEPROM power down instruction (see Table 9). Once the EEPROM power down instruction is decoded, the EEPROM memory cannot be accessed unless a Return instruction (also in Table 9) is decoded. Alternately, this power down mode will automatically occur when the APD circuit is triggered (see section 9.5.1). Therefore, this instruction is not required if the APD circuit is used.
9.1.1.4.2 Power-Up Condition
The PSD813F1 internal logic is reset upon power-up to the read array mode. Any write operation to the EEPROM is inhibited during the first 5 msec following power-up. The FSi and EESi select signals, along with the write strobe signal, must be in the false state during power-up for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of a write strobe signal. Any write cycle initiation is locked when VCCis below VLKO.
9.1.1.5 Read
Under typical conditions, the microcontroller may read the Flash or EEPROM memory using read operations just as it would a ROM or RAM device. Alternately, the microcontoller may use read operations to obtain status information about a program or erase operation in progress. Lastly, the microcontroller may use instructions to read special data from these memories. The following sections describe these read functions.
9.1.1.5.1 Read the Contents of Memory
Main Flash is placed in the read array mode after power-up, chip reset, or a Reset Flash instruction (see Table 9). The microcontroller can read the memory contents of main Flash or EEPROM by using read operations any time the read operation is not part of an instruction sequence.
9.1.1.5.2 Read the Main Flash Memory Identifier
The main Flash memory identifier is read with an instruction composed of 4 operations: 3 specific write operations and a read operation (see Table 9). During the read operation, address bits A6, A1, and A0 must be 0,0,1, respectively, and the appropriate sector select signal (FSi) must be active. The Flash ID is E3h for the PSD813F1. The MCU can read the ID only when it is executing from the EEPROM.
9.1.1.5.3 Read the Main Flash Memory Sector Protection Status
The main Flash memory sector protection status is read with an instruction composed of 4 operations: 3 specific write operations and a read operation (see Table 9). During the read operation, address bits A6, A1, and A0 must be 0,1,0, respectively, while the chip select FSi designates the Flash sector whose protection has to be verified. The read operation will produce 01h if the Flash sector is protected, or 00h if the sector is not protected.
The sector protection status for all NVM blocks (main Flash or EEPROM) can be read by the microcontroller accessing the Flash Protection and PSD/EE Protection registers in PSD I/O space. See section 9.1.1.9.1 for register definitions.
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9.1.1.5.4 Read the OTP Row
There are 64 bytes of One-Time-Programmable (OTP) memory that reside in EEPROM. These 64 bytes are in addition to the 32 Kbytes of EEPROM memory. A read of the OTP row is done with an instruction composed of at least 4 operations: 3 specific write operations and one to 64 read operations (see Table 9). During the read operation(s), address bit A6 must be zero, while address bits A5-A0 define the OTP Row byte to be read while any EEPROM sector select signal (EESi) is active. After reading the last byte, an EEPROM Return instruction must be executed (see Table 9).
9.1.1.5.5 Read the Erase/Program Status Bits
The PSD813F1 provides several status bits to be used by the microcontroller to confirm the completion of an erase or programming instruction of Flash memory. Bits are also available to show the status of writes to EEPROM. These status bits minimize the time that the microcontroller spends performing these tasks and are defined in Table 10. The status bits can be read as many times as needed.
FSi/
CSBOOTi EESi DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
Data Toggle Error Erase
Flash V
IH
VILPolling Flag Flag X Time- X X X
out
EEPROM V
IL
V
IH
Data Toggle
XXXXXX
Polling Flag
Table 10. Status Bit
NOTES: 1. X = Not guaranteed value, can be read either 1 or 0.
2. DQ7-DQ0 represent the Data Bus bits, D7-D0.
3. FSi and EESi are active high.
The PSD813F1 Functional Blocks
(cont.)
For Flash memory, the microcontroller can perform a read operation to obtain these status bits while an erase or program instruction is being executed by the embedded algorithm. See section 9.1.1.7 for details.
For EEPROM not in SDP mode, the microcontroller can perform a read operation to obtain these status bits just after a data write operation. The microcontroller may write one to 64 bytes before reading the status bits. See section 9.1.1.6 for details.
For EEPROM in SDP mode, the microcontroller will perform a read operation to obtain these status bits while an SDP write instruction is being executed by the embedded algorithm. See section 9.1.1.1.3 for details.
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Preliminary PSD813F1-A
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The PSD813F1 Functional Blocks
(cont.)
9.1.1.5.6 Data Polling Flag DQ7
When Erasing or Programming the Flash memory (or when Writing into the EEPROM memory), bit DQ7 outputs the complement of the bit being entered for Programming/Writing on DQ7. Once the Program instruction or the Write operation is completed, the true logic value is read on DQ7 (in a Read operation). Flash memory specific features:
Data Polling is effective after the fourth Write pulse (for programming) or after the
sixth Write pulse (for Erase). It must be performed at the address being programmed or at an address within the Flash sector being erased.
During an Erase instruction, DQ7 outputs a 0. After completion of the instruction,
DQ7 will output the last bit programmed (it is a 1 after erasing).
If the byte to be programmed is in a protected Flash sector, the instruction is
ignored.
If all the Flash sectors to be erased are protected, DQ7 will be set to 0 for about
100 µs, and then return to the previous addressed byte. No erasure will be performed.
9.1.1.5.7 Toggle Flag DQ6
The PSD813F1 offers another way for determining when the EEPROM write or the Flash memory Program instruction is completed. During the internal Write operation and when either the FSi or EESi is true, the DQ6 will toggle from 0 to 1 and 1 to 0 on subsequent attempts to read any byte of the memory.
When the internal cycle is complete, the toggling will stop and the data read on the Data Bus D0-7 is the addressed memory byte. The device is now accessible for a new Read or Write operation. The operation is finished when two successive reads yield the same output data. Flash memory specific features:
The Toggle bit is effective after the fourth Write pulse (for programming) or after the
sixth Write pulse (for Erase).
If the byte to be programmed belongs to a protected Flash sector, the instruction is
ignored.
If all the Flash sectors selected for erasure are protected, DQ6 will toggle to 0 for
about 100 µs and then return to the previous addressed byte.
9.1.1.5.8 Error Flag DQ5
During a correct Program or Erase, the Error bit will set to 0. This bit is set to 1 when there is a failure during Flash byte programming, Sector erase, or Bulk Erase.
In the case of Flash programming, the Error Bit indicates the attempt to program a Flash bit(s) from the programmed state (0) to the erased state (1), which is not a valid operation. The Error bit may also indicate a timeout condition while attempting to program a byte.
In case of an error in Flash sector erase or byte program, the Flash sector in which the error occurred or to which the programmed byte belongs must no longer be used. Other Flash sectors may still be used. The Error bit resets after the Reset instruction.
9.1.1.5.9 Erase Time-out Flag DQ3 (Flash Memory only)
The Erase Timer bit reflects the time-out period allowed between two consecutive Sector Erase instructions. The Erase timer bit is set to 0 after a Sector Erase instruction for a time period of 100 µs + 20% unless an additional Sector Erase instruction is decoded. After this time period or when the additional Sector Erase instruction is decoded, DQ3 is set to 1.
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9.1.1.6 Writing to the EEPROM
Data may be written a byte at a time to the EEPROM using simple write operations, much like writing to an SRAM. Unlike SRAM though, the completion of each byte write must be checked before the next byte is written. To speed up this process, the PSD813F1 offers a Page write feature to allow writing of several bytes before checking status.
To prevent inadvertent writes to EEPROM, the PSD813F1 offers a Software Data Protect (SDP) mode. Once enabled, SDP forces the MCU to unlock the EEPROM before altering its contents, much like Flash memory programming.
9.1.1.6.1 Write a Byte to EEPROM
A write operation is initiated when an EEPROM select signal (EESi) is true and the write strobe signal (wr) into the PSD813F1 is true. If the PSD813F1 detects no additional writes within 120 µsec, an internal storage operation is initiated. Internal storage to EEPROM memory technology typically takes a few milliseconds to complete.
The status of the write operation is obtained by the MCU reading the Data Polling or Toggle bits (as detailed in section 9.1.1.5), or the Ready/Busy output pin (section 9.1.1.2).
Keep in mind that the MCU does not need to erase a location in EEPROM before writing it. Erasure is performed automatically as an internal process.
9.1.1.6.2 Write a Page to EEPROM
Writing data to EEPROM using page mode is more efficient than writing one byte at a time. The PSD813F1 EEPROM has a 64 byte volatile buffer that the MCU may fill before an internal EEPROM storage operation is initiated. Page mode timing approaches a 64:1 advantage over the time it takes to write individual bytes.
To invoke page mode, the MCU must write to EEPROM locations within a single page, with no more than 120 µsec between individual byte writes. A single page means that address lines A14 to A6 must remain constant. The MCU may write to the 64 locations on a page in any order, which is determined by address lines A5 to A0. As soon as 120 µsec have expired after the last page write, the internal EEPROM storage process begins and the MCU checks programming status. Status is checked the same way it is for byte writes, described above.
Note: be aware that if the upper address bits (A14 to A6) change during page write operations, loss of data may occur. Ensure that all bytes for a given page have been successfully stored in the EEPROM before proceeding to the next page. Correct management of MCU interrupts during EEPROM page write operations is essential.
9.1.1.6.3 EEPROM Software Data Protect (SDP)
The SDP feature is useful for protecting the contents of EEPROM from inadvertent write cycles that may occur during uncontrolled MCU bus conditions. These may happen if the application software gets lost or when VCCis not within normal operating range.
Instructions from the MCU are used to enable and disable SDP mode (see Table 9). Once enabled, the MCU must write an instruction sequence to EEPROM before writing data (much like writing to Flash memory). SDP mode can be used for both byte and page writes to EEPROM. The device will remain in SDP mode until the MCU issues a valid SDP disable instruction.
PSD813F1 devices are shipped with SDP mode disabled. However, within PSDsoft, SDP mode may be enabled as part of programming the device with a device programmer (PSDpro).
The PSD813F1 Functional Blocks
(cont.)
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Preliminary PSD813F1-A
23
WRITE AAh to
Address 555h
WRITE 55h to
Address AAAh
WRITE A0h to
Address 555h
Page Write
Instruction
SDP is set
WRITE AAh to
Address 555h
WRITE 55h to
Address AAAh
WRITE A0h to
Address 555h
WRITE Data to
be Written in any Address
Page Write
Instruction
SDP
Set
SDP
not Set
Write
in Memory
Write Data
+
SDP Set
after tWC
(Write Cycle Time)
WRITE is enabled
SDP ENABLE ALGORITHM
Figure 3. EEPROM SDP Enable Flowcharts
The PSD813F1 Functional Blocks
(cont.)
9.1.1.6.3 EEPROM Software Data Protect (SDP) (cont.)
To enable SDP mode at run time, the MCU must write three specific data bytes at three specific memory locations, as shown in Figure 3. Any further writes to EEPROM when SDP is set will require this same sequence, followed by the byte(s) to write. The first SDP enable sequence can be followed directly by the byte(s) to be written.
To disable SDP mode, the MCU must write specific bytes to six specific locations, as shown in Figure 4.
The MCU must not be executing code from EEPROM when these instructions are invoked. The MCU must be operating from some other memory when enabling or disabling SDP mode.
The state of SDP mode is not changed by power on/off sequences (nonvolatile). When either the SDP enable or SDP disable instructions are issued from the MCU, the MCU must use the Toggle bit (status bit DQ6) or the Ready/Busy output pin to check programming status. The Ready/Busy output is driven low from the first write of AAh @ 555h until the completion of the internal storage sequence. Data Polling (status bit DQ7) is not supported when issuing the SDP enable or SDP disable commands.
Note: Using the SDP sequence (enabling, disabling, or writing data) is initiated when specific bytes are written to addresses on specific pages of EEPROM memory, with no more than 120 µsec between writes. The addresses 555h and AAAh are located on different pages of EEPROM. This is how the PSD813F1 distinguishes these instruction sequences from ordinary writes to EEPROM, which are expected to be within a single EEPROM page.
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Figure 4. Software Data Protection Disable Flow Chart
9.1.1.6.4 Write OTP Row
Writing to the OTP row (64 bytes) can only be done once per byte, and is enabled by an instruction. This instruction is composed of three specific Write operations of data bytes at three specific memory locations followed by the data to be stored in the OTP row (refer to Table 9). During the write operations, address bit A6 must be zero, while address bits A5-A0 define the OTP Row byte to be written while any EEPROM Sector Select signal (EESi) is active. Writing the OTP Row is allowed only when SDP mode is not enabled.
9.1.1.7 Programming Flash Memory
Flash memory must be erased prior to being programmed. The MCU may erase Flash memory all at once or by-sector, but not byte-by-byte. A byte of Flash memory erases to all logic ones (FF hex), and its bits are programmed to logic zeros. Although erasing Flash memory occurs on a sector basis, programming Flash memory occurs on a byte basis.
The PSD813F1 main Flash and optional boot Flash require the MCU to send an instruction to program a byte or perform an erase function (see Table 9). This differs from EEPROM, which can be programmed with simple MCU bus write operations (unless EEPROM SDP mode is enabled).
Once the MCU issues a Flash memory program or erase instruction, it must check for the status of completion. The embedded algorithms that are invoked inside the PSD813F1 support several means to provide status to the MCU. Status may be checked using any of three methods: Data Polling, Data Toggle, or the Ready/Busy output pin.
WRITE AAh to
Address 555h
WRITE 55h to
Address AAAh
WRITE 80h to
Address 555h
WRITE AAh to
Address 555h
WRITE 55h to
Address AAAh
WRITE 20h to
Address 555h
Page Write
Instruction
Unprotected State
after
tWC (Write Cycle time)
The PSD813F1 Functional Blocks
(cont.)
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Preliminary PSD813F1-A
25
The PSD813F1 Functional Blocks
(cont.)
9.1.1.7.1 Data Polling
Polling on DQ7 is a method of checking whether a Program or Erase instruction is in progress or has completed. Figure 5 shows the Data Polling algorithm.
When the MCU issues a programming instruction, the embedded algorithm within the PSD813F1 begins. The MCU then reads the location of the byte to be programmed in Flash to check status. Data bit DQ7 of this location becomes the compliment of data bit 7of the original data byte to be programmed. The MCU continues to poll this location, comparing DQ7 and monitoring the Error bit on DQ5. When the DQ7 matches data bit 7 of the original data, and the Error bit at DQ5 remains 0, then the embedded algorithm is complete. If the Error bit at DQ5 is 1, the MCU should test DQ7 again since DQ7 may have changed simultaneously with DQ5 (see Figure 5).
The Error bit at DQ5 will be set if either an internal timeout occurred while the embedded algorithm attempted to program the byte or if the MCU attempted to program a 1 to a bit that was not erased (not erased is logic 0).
It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed to compare the byte that was written to Flash with the byte that was intended to be written.
When using the Data Polling method after an erase instruction, Figure 5 still applies. However, DQ7 will be 0 until the erase operation is complete. A 1 on DQ5 will indicate a timeout failure of the erase operation, a 0 indicates no error. The MCU can read any location within the sector being erased to get DQ7 and DQ5.
PSDsoft will generate ANSI C code functions which implement these Data Polling algorithms.
Figure 5. Data Polling Flow Chart
START
READ DQ5 & DQ7
at VALID ADDRESS
YES
YES
YES
NO
NO
NO
DQ7
=
DATA7
DQ5
=1
DQ7
=
DATA
READ DQ7
FAIL PASS
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26
9.1.1.7.2 Data Toggle
Checking the Data Toggle bit on DQ6 is a method of determining whether a Program or Erase instruction is in progress or has completed. Figure 6 shows the Data Toggle algorithm.
When the MCU issues a programming instruction, the embedded algorithm within the PSD813F1 begins. The MCU then reads the location of the byte to be programmed in Flash to check status. Data bit DQ6 of this location will toggle each time the MCU reads this location until the embedded algorithm is complete. The MCU continues to read this location, checking DQ6 and monitoring the Error bit on DQ5. When DQ6 stops toggling (two consecutive reads yield the same value), and the Error bit on DQ5 remains 0, then the embedded algorithm is complete. If the Error bit on DQ5 is 1, the MCU should test DQ6 again, since DQ6 may have changed simultaneously with DQ5 (see Figure 6).
The Error bit at DQ5 will be set if either an internal timeout occurred while the embedded algorithm attempted to program the byte, or if the MCU attempted to program a 1 to a bit that was not erased (not erased is logic 0).
It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed to compare the byte that was written to Flash with the byte that was intended to be written.
When using the Data Toggle method after an erase instructin, Figure 6 still applies. DQ6 will toggle until the erase operation is complete. A 1 on DQ5 will indicate a timeout failure of the erase operation, a 0 indicates no error. The MCU can read any location within the sector being erased to get DQ6 and DQ5.
PSDsoft will generate ANSI C code functions which implement these Data Toggling algorithms.
The PSD813F1 Functional Blocks
(cont.)
Figure 6. Data Toggle Flow Chart
START
READ
DQ5 & DQ6
NO
YES
NO
YES
YES
NO
DQ6
=
TOGGLE
DQ5
=1
DQ6
=
TOGGLE
READ DQ6
FAIL PASS
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Preliminary PSD813F1-A
27
The PSD813F1 Functional Blocks
(cont.)
9.1.1.8 Erasing Flash Memory
9.1.1.8.1. Flash Bulk Erase Instruction
The Flash Bulk Erase instruction uses six write operations followed by a Read operation of the status register, as described in Table 9. If any byte of the Bulk Erase instruction is wrong, the Bulk Erase instruction aborts and the device is reset to the Read Flash memory status.
During a Bulk Erase, the memory status may be checked by reading status bits DQ5, DQ6, and DQ7, as detailed in section 9.1.1.7. The Error bit (DQ5) returns a 1 if there has been an Erase Failure (maximum number of erase cycles have been executed).
It is not necessary to program the array with 00h because the PSD813F1 will automatically do this before erasing to 0FFh.
During execution of the Bulk Erase instruction, the Flash memory will not accept any instructions.
9.1.1.8.2 Flash Sector Erase Instruction
The Sector Erase instruction uses six write operations, as described in Table 9. Additional Flash Sector Erase confirm commands and Flash sector addresses can be written subsequently to erase other Flash sectors in parallel, without further coded cycles, if the additional instruction is transmitted in a shorter time than the timeout period of about 100 µs. The input of a new Sector Erase instruction will restart the time-out period.
The status of the internal timer can be monitored through the level of DQ3 (Erase time-out bit). If DQ3 is 0, the Sector Erase instruction has been received and the timeout is counting. If DQ3 is 1, the timeout has expired and the PSD813F1 is busy erasing the Flash sector(s). Before and during Erase timeout, any instruction other than Erase suspend and Erase Resume will abort the instruction and reset the device to Read Array mode. It is not necessary to program the Flash sector with 00h as the PSD813F1 will do this automatically before erasing (byte=FFh).
During a Sector Erase, the memory status may be checked by reading status bits DQ5, DQ6, and DQ7, as detailed in section 9.1.1.7.
During execution of the erase instruction, the Flash block logic accepts only Reset and Erase Suspend instructions. Erasure of one Flash sector may be suspended, in order to read data from another Flash sector, and then resumed.
9.1.1.8.3 Flash Erase Suspend Instruction
When a Flash Sector Erase operation is in progress, the Erase Suspend instruction will suspend the operation by writing 0B0h to any address when an appropriate Chip Select (FSi) is true. (See Table 9). This allows reading of data from another Flash sector after the Erase operation has been suspended. Erase suspend is accepted only during the Flash Sector Erase instruction execution and defaults to read array mode. An Erase Suspend instruction executed during an Erase timeout will, in addition to suspending the erase, terminate the time out.
The Toggle Bit DQ6 stops toggling when the PSD813F1 internal logic is suspended. The toggle Bit status must be monitored at an address within the Flash sector being erased. The Toggle Bit will stop toggling between 0.1 µs and 15 µs after the Erase Suspend instruction has been executed. The PSD813F1 will then automatically be set to Read Flash Block Memory Array mode.
If an Erase Suspend instruction was executed, the following rules apply:
Attempting to read from a Flash sector that was being erased will output invalid data.
Reading from a Flash sector that was not being erased is valid.
The Flash memory cannot be programmed, and will only respond to Erase Resume
and Reset instructions (read is an operation and is OK).
If a Reset instruction is received, data in the Flash sector that was being erased will
be invalid.
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28
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Sec7_Prot Sec6_Prot Sec5_Prot Sec4_Prot Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot
Flash Protection Register
9.1.1.9.2 Reset Instruction
The Reset instruction resets the internal memory logic state machine in a few milliseconds. Reset is an instruction of either one write operation or three write operations (refer to Table 9).
Bit Definitions:
Sec<i>_Prot 1 = Flash <i> is write protected. Sec<i>_Prot 0 = Flash <i> is not write protected.
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Security_
***
Sec3_Prot Sec2_Prot Sec1_Prot Sec0_Prot
Bit
PSD/EE Protection Register
Bit Definitions:
Sec<i>_Prot 1 = EEPROM Boot Sector <i> is write protected. Sec<i>_Prot 0 = EEPROM Boot Sector <i> is not write protected.
Security_Bit 0 = Security Bit in device has not been set.
1 = Security Bit in device has been set.
Table 11. Sector Protection/Security Bit Definition
*: Not used.
The PSD813F1 Functional Blocks
(cont.)
9.1.1.8.4 Flash Erase Resume Instruction
If an Erase Suspend instruction was previously executed, the erase operation may be resumed by this instruction. The Erase Resume instruction consists of writing 030h to any address while an appropriate Chip Select (FSi) is true. (See Table 9.)
9.1.1.9 Flash and EEPROM Memory Specific Features
9.1.1.9.1 Flash and EEPROM Sector Protect
Each Flash and EEPROM sector can be separately protected against Program and Erase functions. Sector Protection provides additional data security because it disables all program or erase operations. This mode can be activated through the JTAG Port or a Device Programmer.
Sector protection can be selected for each sector using the PSDsoft Configuration program. This will automatically protect selected sectors when the device is programmed through the JTAG Port or a Device Programmer. Flash and EEPROM sectors can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The microcontroller can read (but cannot change) the sector protection bits.
Any attempt to program or erase a protected Flash or EEPROM sector will be ignored by the device. The Verify operation will result in a read of the protected data. This allows a guarantee of the retention of the Protection status.
The sector protection status can be read by the MCU through the Flash protection and PSD/EE protection registers (CSIOP). See Table 11.
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Preliminary PSD813F1-A
29
The PSD813F1 Functional Blocks
(cont.)
9.1.2 SRAM
The SRAM is a 16 Kbit (2K x 8) memory. The SRAM is enabled when RS0the SRAM chip select output from the DPLDis high. RS0 can contain up to two product terms, allowing flexible memory mapping.
The SRAM can be backed up using an external battery. The external battery should be connected to the Vstby pin (PC2). If you have an external battery connected to the PSD813F1, the contents of the SRAM will be retained in the event of a power loss. The contents of the SRAM will be retained so long as the battery voltage remains at 2V or greater. If the supply voltage falls below the battery voltage, an internal power switchover to the battery occurs.
Pin PC4 can be configured as an output that indicates when power is being drawn from the external battery. This Vbaton signal will be high with the supply voltage falls below the battery voltage and the battery on PC2 is supplying power to the internal SRAM.
The chip select signal (RS0) for the SRAM, Vstby, and Vbaton are all configured using PSDsoft Configuration.
9.1.3 Memory Select Signals
The main Flash (FSi), EEPROM (EESi), and SRAM (RS0) memory select signals are all outputs of the DPLD. They are setup by entering equations for them in PSDsoft. The following rules apply to the equations for the internal chip select signals:
1. Flash memory and EEPROM memory sector select signals must not be larger than the physical sector size.
2. Any main Flash memory sector must not be mapped in the same memory space as another Flash sector.
3. An EEPROM memory sector must not be mapped in the same memory space as another EEPROM sector.
4. SRAM, I/O, and Peripheral I/O spaces must not overlap.
5. An EEPROM memory sector may overlap a main Flash memory sector. In case of overlap, priority will be given to the EEPROM.
6. SRAM, I/O, and Peripheral I/O spaces may overlap any other memory sector. Priority will be given to the SRAM, I/O, or Peripheral I/O.
Example
FS0 is valid when the address is in the range of 8000h to BFFFh, EES0 is valid from 8000h to 9FFFh, and RS0 is valid from 8000h to 87FFh. Any address in the range of RS0 will always access the SRAM. Any address in the range of EES0 greater than 87FFh (and less than 9FFFh) will automatically address EEPROM memory segment 0. Any address greater than 9FFFh will access the Flash memory segment 0. You can see that half of the Flash memory segment 0 and one-fourth of EEPROM segment 0 can not be accessed in this example. Also note that an equation that defined FS1 to anywhere in the range of 8000h to BFFFh would not be valid.
Figure 7 shows the priority levels for all memory components. Any component on a higher level can overlap and has priority over any component on a lower level. Components on the same level must not overlap. Level one has the highest priority and level 3 has the lowest.
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30
Level 1
SRAM, I/O, or Peripheral I/O
Level 2
EEPROM Memory
Highest Priority
Lowest Priority
Level 3
Flash Memory
Figure 7. Priority Level of Memory and I/O Components
9.1.3.1. Memory Select Configuration for MCUs with Separate Program and Data Spaces
The 8031 and compatible family of microcontrollers, which includes the 80C51, 80C151, 80C251, 80C51XA, and the C500 family, have separate address spaces for code memory (selected using PSEN) and data memory (selected using RD). Any of the memories within the PSD813F1 can reside in either space or both spaces. This is controlled through manip­ulation of the VM register that resides in the PSDs CSIOP space.
The VM register is set using PSDsoft to have an initial value. It can subsequently be changed by the microcontroller so that memory mapping can be changed on-the-fly. For example, I may wish to have SRAM and Flash in Data Space at boot, and EEPROM in Program Space at boot, and later swap EEPROM and Flash. This is easily done with the VM register by using PSDsoft to configure it for boot up and having the microcontroller change it when desired.
Table 13 describes the VM Register.
Bit 7 Bit 6* Bit 5* Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 PIO_EN FL_Data EE_Data FL_Code EE_Code SRAM_Code
0 = disable
**
0 = RD 0 = RD 0 = PSEN 0 = PSEN 0 = PSEN
PIO mode cant cant cant cant cant
access access access access access Flash EEPROM Flash EEPROM SRAM
1= enable
**
1 = RD 1 = RD 1 = PSEN 1 = PSEN 1 = PSEN
PIO mode access access access access access
Flash EEPROM Flash EEPROM SRAM
Table 13. VM Register
NOTE: Bits 6-5 are not used.
The PSD813F1 Functional Blocks
(cont.)
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Preliminary PSD813F1-A
31
The PSD813F1 Functional Blocks
(cont.)
FLASH
DPLD
EEPROM SRAM
RS0
EES0-3
FS0-7
CS CSCS
OE OE
RD
PSEN
OE
Figure 8. 8031 Memory Modes – Separate Space Mode
FLASH
DPLD
EEPROM SRAM
RS0
EES0-3
FS0-7
RD
CS CSCS
RD
OE OE
VM REG BIT 2
PSEN
VM REG BIT 0
VM REG BIT 1
VM REG BIT 3
VM REG BIT 4
OE
Figure 9. 80C31 Memory Mode – Combined Space Mode
9.1.3.2 Configuration Modes for MCUs with Separate Program and Data Spaces
9.1.3.2.1 Separate Space Modes
Code memory space is separated from data memory space. For example, the PSEN signal is used to access the program code from the Flash Memory, while the RD signal is used to access data from the EEPROM, SRAM and I/O Ports. This configuration requires the VM register to be set to 0Ch.
9.1.3.2.2 . Combined Space Modes
The program and data memory spaces are combined into one space that allows the main Flash Memory, EEPROM, and SRAM to be accessed by either PSEN or RD. For example, to configure the main Flash memory in combined space mode, bits 2 and 4 of the VM register are set to 1.
9.1.3.3 80C31 Memory Map Example
See Application Notes 57 and 64 for examples.
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32
RESET
D0-D7
R/W
D0 Q0
Q1 Q2 Q3 Q4 Q5 Q6 Q7
D1 D2 D3 D4 D5 D6 D7
PAGE
REGISTER
PGR0 PGR1
PGR2 PGR3
FLASH
DPLD
AND
FLASH
CPLD
INTERNAL SELECTS AND LOGIC
FLASH
PLD
PGR4 PGR5 PGR6 PGR7
Figure 10. Page Register
The PSD813F1 Functional Blocks
(cont.)
9.1.4 Page Register
The eight bit Page Register increases the addressing capability of the microcontroller by a factor of up to 256. The contents of the register can also be read by the microcontroller. The outputs of the Page Register (PGR0-PGR7) are inputs to the DPLD decoder and can be included in the Flash Memory, EEPROM, and SRAM chip select equations.
If memory paging is not needed, or if not all 8 page register bits are needed for memory paging, then these bits may be used in the CPLD for general logic. See Application Note 57.
Figure 10 shows the Page Register. The eight flip flops in the register are connected to the internal data bus D0-D7. The microcontroller can write to or read from the Page Register. The Page Register can be accessed at address location CSIOP + E0h.
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Preliminary PSD813F1-A
33
The PSD813F1 Functional Blocks
(cont.)
9.2 PLDs
The PLDs bring programmable logic functionality to the PSD813F1. After specifying the logic for the PLDs using the PSDabel tool in PSDsoft, the logic is programmed into the device and available upon power-up.
The PSD813F1 contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD). The PLDs are briefly discussed in the next few paragraphs, and in more detail in sections 9.2.1 and 9.2.2. Figure 11 shows the configuration of the PLDs.
The DPLD performs address decoding for internal and external components, such as memory, registers, and I/O port selects.
The CPLD can be used for logic functions, such as loadable counters and shift registers, state machines, and encoding and decoding logic. These logic functions can be constructed using the 16 Output MicroCells (OMCs), 24 Input MicroCells (IMCs), and the AND array. The CPLD can also be used to generate external chip selects.
The AND array is used to form product terms. These product terms are specified using PSDabel. An Input Bus consisting of 73 signals is connected to the PLDs. The signals are shown in Table 15.
Input Source Input Name Number
of Signals
MCU Address Bus A[15:0]* 16 MCU Control Signals CNTL[2:0] 3 Reset RST 1 Power Down PDN 1 Port A Input MicroCells PA[7-0] 8 Port B Input MicroCells PB[7-0] 8 Port C Input MicroCells PC[7-0] 8 Port D Inputs PD[2:0] 3 Page Register PGR(7:0) 8 MicroCell AB Feedback MCELLAB.FB[7:0] 8 MicroCell BC Feedback MCELLBC.FB[7:0] 8 EEPROM Programming Status Bit Rdy/Bsy 1
Table 15. DPLD and CPLD Inputs
NOTE: The address inputs are A[19:4] in 80C51XA mode.
The Turbo Bit in PSD813F1
The PLDs in the PSD813F1 can minimize power consumption by switching off when inputs remain unchanged for an extended time of about 70 ns. Setting the Turbo mode bit to off (Bit 3 of the PMMR0 register) automatically places the PLDs into standby if no inputs are changing. Turbo-off mode increases propagation delays while reducing power consumption. Refer to the Power Management Unit section on how to set the Turbo Bit. Additionally, five bits are available in the PMMR2 register to block MCU control signals from entering the PLDs. This reduces power consumption and can be used only when these MCU control signals are not used in PLD logic equations.
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34
PLD INPUT BUS
8
INPUT MICRO
CELL & INPUT PORTS
DIRECT MICRO
CELL INPUT TO MCU DATA BUS
CSIOP SELECT
SRAM SELECT
EEPROM SELECTS
DECODE PLD
PAGE
REGISTER
PERIPHERAL SELECTS JTAG SELECT
CPLD
PT
ALLOC.
MICRO⇔CELL
ALLOC.
MCELLAB
MCELLBC
DIRECT MICRO⇔CELL ACCESS FROM MCU DATA BUS
24 INPUT MICRO⇔CELL
(PORT A,B,C)
16 OUTPUT
MICRO⇔CELL
I/O PORTS
FLASH MEMORY SELECTS
3
PORT D INPUTS
TO PORT A OR B
TO PORT B OR C
DATA
BUS
8
8
8
4 1 1 2 1
EXTERNAL CHIP SELECTS
TO PORT D
3
73
16
73
24
OUTPUT MICRO⇔CELL FEEDBACK
Figure 11. PLD Block Diagram
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Preliminary PSD813F1-A
35
The PSD813F1 Functional Blocks
(cont.)
Each of the two PLDs has unique characteristics suited for its applications They are described in the following sections.
9.2.1 Decode PLD (DPLD)
The DPLD, shown in Figure 12, is used for decoding the address for internal and external components. The DPLD can generate the following decode signals:
8 sector selects for the main Flash memory (three product terms each)
4 sector selects for the EEPROM memory
(three product terms each)
1 internal SRAM select signal (two product terms)
1 internal CSIOP (PSD configuration register) select signal
1 JTAG select signal (enables JTAG on Port C)
2 internal peripheral select signals (peripheral I/O mode).
9.2.2 Complex PLD (CPLD)
The CPLD can be used to implement system logic functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols, state machines, and random logic. The CPLD can also be used to generate 3 external chip selects, routed to Port D. Although external chip selects can be produced by any Output MicroCell, these three external chip selects on Port D do not consume any Output MicroCells.
As shown in Figure 11, the CPLD has the following blocks:
24 Input MicroCells (IMCs)
16 Output MicroCells (OMCs)
MicroCell Allocator
Product Term Allocator
AND array capable of generating up to 137 product terms
Four I/O ports.
Each of the blocks are described in the subsections that follow. The Input and Output MicroCells are connected to the PSD813F1 internal data bus and
can be directly accessed by the microcontroller. This enables the MCU software to load data into the Output MicroCells or read data from both the Input and Output MicroCells. This feature allows efficient implementation of system logic and eliminates the need to connect the data bus to the AND logic array as required in most standard PLD macrocell architectures.
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36
(INPUTS)
(24)
(8)
(16)
(1)
PDN (APD OUTPUT)
I/O PORTS (PORT A,B,C)
(8)
PGR0 -PGR7
(8)
MCELLAB.FB [7:0] (FEEDBACKS)
MCELLBC.FB [7:0] (FEEDBACKS)
A[15:0
]
*
(3)
(3)
PD[2:0] (ALE,CLKIN,CSI)
CNTRL[2:0
] (
READ/WRITE CONTROL SIGNALS)
(1)
(1)
RESET
RD_BSY
RS0
CSIOP
PSEL0
PSEL1
8 FLASH MEMORY SECTOR SELECTS
EEPROM SELECTS
SRAM SELECT
I/O DECODER SELECT
PERIPHERAL I/O MODE SELECT
EES0
EES1
EES2
EES3
FS0
FS7
3
3
3
3
3
3
3
3
3
3
3
3
2
JTAGSEL
Figure 12. DPLD Logic Array
*NOTE: The address inputs are A[19:4] in 80C51XA mode.
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Preliminary PSD813F1-A
37
I/O PORTS
CPLD MICRO
CELLS
INPUT MICRO
CELLS
LATCHED
ADDRESS OUT
MUX
MUX
MUX
MUX MUX
D
D
Q
Q
Q
G
D
QD
WR
WR
PDR
DATA
PRODUCT TERM
ALLOCATOR
DIR
REG.
SELECT
INPUT
PRODUCT TERMS
FROM OTHER
MICRO
CELLS
POLARITY
SELECT
UP TO 10
PRODUCT TERMS
CLOCK
SELECT
PR DI LD
D/T
CK
CL
Q
D/T/JK FF
SELECT
PT CLEAR
PT
CLOCK
GLOBAL
CLOCK
PT OUTPUT ENABLE
(
OE
)
MICRO
CELL FEEDBACK
I/O PORT INPUT
ALE/AS
PT INPUT LATCH GATE/CLOCK
MCU LOAD
PT PRESET
MCU DATA IN
COMB.
/REG
SELECT
MICRO
CELL
TO
I/O PORT
ALLOC.
FGPLD
OUTPUT
TO OTHER I/O PORTS
PLD INPUT BUSPLD INPUT BUS
MCU ADDRESS /DATA BUS
MICRO
CELL
OUT TO
MCU
DATA
LOAD
CONTROL
AND ARRAY
FGPLD OUTPUT
I/O PIN
Figure 13. The Micro⇔Cell and I/O Port
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38
The PSD813F1 Functional Blocks
(cont.)
9.2.2.1 Output MicroCell
Eight of the Output MicroCells are connected to Ports A and B pins and are named as McellAB0-7. The other eight MicroCells are connected to Ports B and C pins and are named as McellBC0-7. If an McellAB output is not assigned to a specific pin in PSDabel, the MicroCell Allocator will assign it to either Port A or B. The same is true for a McellBC output on Port B or C. Table 16 shows the MicroCells and Port assignment.
Maximum
Native Borrowed Data Bit for
Output Port Product Product Loading or
MicroCell Assignment Terms Terms Reading
McellAB0 Port A0, B0 3 6 D0 McellAB1 Port A1, B1 3 6 D1 McellAB2 Port A2, B2 3 6 D2 McellAB3 Port A3, B3 3 6 D3 McellAB4 Port A4, B4 3 6 D4 McellAB5 Port A5, B5 3 6 D5 McellAB6 Port A6, B6 3 6 D6 McellAB7 Port A7, B7 3 6 D7 McellBC0 Port B0, C0 4 5 D0 McellBC1 Port B1, C1 4 5 D1 McellBC2 Port B2, C2 4 5 D2 McellBC3 Port B3, C3 4 5 D3 McellBC4 Port B4, C4 4 6 D4 McellBC5 Port B5, C5 4 6 D5 McellBC6 Port B6, C6 4 6 D6 McellBC7 Port B7, C7 4 6 D7
Table 16. Output Micro⇔Cell Port and Data Bit Assignments
The Output MicroCell (OMC) architecture is shown in Figure 14. As shown in the figure, there are native product terms available from the AND array, and borrowed product terms available (if unused) from other OMCs. The polarity of the product term is controlled by the XOR gate. The OMC can implement either sequential logic, using the flip-flop element, or combinatorial logic. The multiplexer selects between the sequential or combinatorial logic outputs. The multiplexer output can drive a Port pin and has a feedback path to the AND array inputs.
The flip-flop in the OMC can be configured as a D, T, JK, or SR type in the PSDabel program. The flip-flops clock, preset, and clear inputs may be driven from a product term of the AND array. Alternatively, the external CLKIN signal can be used for the clock input to the flip-flop. The flip-flop is clocked on the rising edge of the clock input. The preset and clear are active-high inputs. Each clear input can use up to two product terms.
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Preliminary PSD813F1-A
39
9.2.2.2 The Product Term Allocator
The CPLD has a Product Term Allocator. The PSDabel compiler uses the Allocator to borrow and place product terms from one MicroCell to another. The following list summarizes how product terms are allocated:
McellAB0-7 all have three native product terms and may borrow up to six more
McellBC0-3 all have four native product terms and may borrow up to five more
McellBC4-7 all have four native product terms and may borrow up to six more.
Each MicroCell may only borrow product terms from certain other MicroCells. Product terms already in use by one MicroCell will not be available for a different MicroCell.
If an equation requires more product terms than what is available to it, then external product terms will be required, which will consume other OMCs. If external product terms are used, extra delay will be added for the equation that required the extra product terms. This is called product term expansion. PSDsoft will perform this expansion as needed.
9.2.2.3 Loading and Reading the Output Micro⇔Cells (OMCs)
The OMCs occupy a memory location in the MCU address space, as defined by the CSIOP (refer to the I/O section). The flip-flops in each of the 16 OMCs can be loaded from the data bus by a microcontroller. Loading the OMCs with data from the MCU takes priority over internal functions. As such, the preset, clear, and clock inputs to the flip-flop can be overridden by the MCU. The ability to load the flip-flops and read them back is useful in such applications as loadable counters and shift registers, mailboxes, and handshaking protocols.
Data can be loaded to the OMCs on the trailing edge of the WR signal (edge loading) or during the time that the WR signal is active (level loading). The method of loading is specified in PSDsoft Configuration.
9.2.2.4 The OMC Mask Register
There is one Mask Register for each of the two groups of eight OMCs. The Mask Registers can be used to block the loading of data to individual OMCs. The default value for the Mask Registers is 00h, which allows loading of the OMCs. When a given bit in a Mask Register is set to a 1, the MCU will be blocked from writing to the associated OMC. For example, suppose McellAB0-3 are being used for a state machine. You would not want a MCU write to McellAB to overwrite the state machine registers. Therefore, you would want to load the Mask Register for McellAB (Mask MicroCell AB) with the value 0Fh.
9.2.2.5 The Output Enable of the OMC
The OMC can be connected to an I/O port pin as a PLD output. The output enable of each Port pin driver is controlled by a single product term from the AND array, ORed with the Direction Register output. The pin is enabled upon power up if no output enable equation is defined and if the pin is declared as a PLD output in PSDsoft.
If the OMC output is declared as an internal node and not as a Port pin output in the PSDabel file, then the Port pin can be used for other I/O functions. The internal node feedback can be routed as an input to the AND array.
The PSD813F1 Functional Blocks
(cont.)
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40
PT
ALLOCATOR
MASK
REG.
PT CLK
PT
PT
PT
CLKIN
FEEDBACK
(
.FB
)
PORT INPUT
AND ARRAY
PLD INPUT BUS
MUX
MUX
POLARITY
SELECT
LD
IN
CLR
Q
PRDIN
COMB/REG
SELECT
PORT
DRIVER
INPUT
MICRO
CELL
I/O PIN
MICRO
CELL
ALLOCATOR
INTERNAL DATA BUS
D
[
7:0
]
DIRECTION
REGISTER
CLEAR
(
.RE
)
PROGRAMMABLE
FF
(
D/T/JK/SR
)
WR
ENABLE
(
.OE
)
PRESET
(
.PR
)
RD
MICRO
CELL CS
Figure 14. CPLD Output MicroCell
The PSD813F1 Functional Blocks
(cont.)
Page 45
Preliminary PSD813F1-A
41
9.2.2.6 Input MicroCells (IMCs)
The CPLD has 24 IMCs, one for each pin on Ports A, B, and C. The architecture of the IMC is shown in Figure 15. The IMCs are individually configurable, and can be used as a latch, register, or to pass incoming Port signals prior to driving them onto the PLD input bus. The outputs of the IMCs can be read by the microcontroller through the internal data bus.
The enable for the latch and clock for the register are driven by a multiplexer whose inputs are a product term from the CPLD AND array or the MCU address strobe (ALE/AS). Each product term output is used to latch or clock four IMCs. Port inputs 3-0 can be controlled by one product term and 7-4 by another.
Configurations for the IMCs are specified by equations written in PSDabel (see Application Note 55). Outputs of the IMCs can be read by the MCU via the IMC buffer. See the I/O Port section on how to read the IMCs.
IMCs can use the address strobe to latch address bits higher than A15. Any latched addresses are routed to the PLDs as inputs.
IMCs are particularly useful with handshaking communication applications where two processors pass data back and forth through a common mailbox. Figure 16 shows a typical configuration where the Master MCU writes to the Port A Data Out Register. This, in turn, can be read by the Slave MCU via the activation of the Slave-Read output enable product term. The Slave can also write to the Port A IMCs and the Master can then read the IMCs directly. Note that the Slave-Read and Slave-Wr signals are product terms that are derived from the Slave MCU inputs RD, WR, and Slave_CS.
The PSD813F1 Functional Blocks
(cont.)
Page 46
PSD813F1-A Preliminary
42
OUTPUT
MICRO
CELLS BC
AND
MICRO
CELL AB
PT
PT
FEEDBACK
AND ARRAY
PLD INPUT BUS
PORT
DRIVER
I/O PIN
INTERNAL DATA BUS
D[7:0
]
DIRECTION
REGISTER
MUX
MUX
ALE/AS
PT
Q
Q
D
D
G
LATCH
INPUT MICROCELL
ENABLE (.OE
)
D FF
INPUT MICRO
CELL_ RD
Figure 15. Input MicroCell
The
PSD813F1
Functional
Blocks
(cont.)
Page 47
Preliminary PSD813F1-A
43
MASTER
MCU
MCU-RD
MCU-RD
MCU-WR
SLAVE–WR
SLAVE–CS
MCU-WR
D[7:0
]
D[7:0
]
CPLD
DQ
QD
PORT A DATA OUT REGISTER
PORT A
INPUT
MICRO⇔CELL
PORT A
SLAVE–READ
SLAVE
MCU
RD WR
PSD813F1
Figure 16. Handshaking Communication Using Input MicroCells
The
PSD813F1
Functional
Blocks
(cont.)
Page 48
PSD813F1-A Preliminary
44
The PSD813F1 Functional Blocks
(cont.)
9.3 Microcontroller Bus Interface
The no-glue logic PSD813F1 Microcontroller Bus Interface can be directly connected to most popular microcontrollers and their control signals. Key 8-bit microcontrollers with their bus types and control signals are shown in Table 17. The interface type is specified using the PSDsoft Configuration.
Data
Bus
MCU Width CNTL0 CNTL1 CNTL2 PC7 PD0** ADIO0 PA3-PA0 PA7-PA3
8031 8 WR RD PSEN * ALE A0 ** 80C51XA 8 WR RD PSEN * ALE A4 A3-A0 * 80C251 8 WR PSEN **ALE A0 ** 80C251 8 WR RD PSEN * ALE A0 ** 80198 8 WR RD **ALE A0 ** 68HC11 8 R/W E **AS A0 ** 68HC912 8 R/W E * DBE AS A0 ** Z80 8 WR RD ***A0 D3-D0 D7-D4 Z8 8 R/W DS **AS A0 ** 68330 8 R/W DS **AS A0 ** M37702M2 8 R/W E **ALE A0 D3-D0 D7-D4
Table 17. Microcontrollers and their Control Signals
**Unused CNTL2 pin can be configured as CPLD input. Other unused pins (PC7, PD0, PA3-0) can be **configured for other I/O functions.
**ALE/AS input is optional for microcontrollers with a non-multiplexed bus
9.3.1. PSD813F1 Interface to a Multiplexed 8-Bit Bus
Figure 17 shows an example of a system using a microcontroller with an 8-bit multiplexed bus and a PSD813F1. The ADIO port on the PSD813F1 is connected directly to the
microcontroller address/data bus. ALE latches the address lines internally. Latched addresses can be brought out to Port A or B. The PSD813F1 drives the ADIO data bus only when one of its internal resources is accessed and the RD input is active. Should the system address bus exceed sixteen bits, Ports A, B, C, or D may be used as additional address inputs.
9.3.2. PSD813F1 Interface to a Non-Multiplexed 8-Bit Bus
Figure 18 shows an example of a system using a microcontroller with an 8-bit non-multiplexed bus and a PSD813F1. The address bus is connected to the ADIO Port, and the data bus is connected to Port A. Port A is in tri-state mode when the PSD813F1 is not accessed by the microcontroller. Should the system address bus exceed sixteen bits, Ports B, C, or D may be used for additional address inputs.
Page 49
Preliminary PSD813F1-A
45
The
PSD813F1
Functional
Blocks
(cont.)
MICRO-
CONTROLLER
WR
RD
BHE
ALE
RESET
AD[7:0
]
A[15:8
]
A[15:8
]
A[7:0
]
ADIO
PORT
PORT
A
PORT
B
PORT
C
WR (CNTRL0
)
RD (CNTRL1
)
BHE (CNTRL2
)
RST
ALE (PD0
)
PORT D
(
OPTIONAL
)
(
OPTIONAL
)
PSD813F1
Figure 17. An Example of a Typical 8-Bit Multiplexed Bus Interface
Page 50
PSD813F1-A Preliminary
46
The
PSD813F1
Functional
Blocks
(cont.)
MICRO-
CONTROLLER
WR
RD
BHE
ALE
RESET
D[7:0
]
A[15:0
]
A[23:16
]
D[7:0
]
ADIO
PORT
PORT
A
PORT
B
PORT
C
WR (CNTRL0
)
RD (CNTRL1
)
BHE (CNTRL2
)
RST
ALE (PD0
)
PORT D
(OPTIONAL)
PSD813F1
Figure 18. An Example of a Typical 8-Bit Non-Multiplexed Bus Interface
Page 51
Preliminary PSD813F1-A
47
The PSD813F1 Functional Blocks
(cont.)
9.3.3 Data Byte Enable Reference
Microcontrollers have different data byte orientations. The following table shows how the PSD813F1 interprets byte/word operations in different bus write configurations. Even-byte refers to locations with address A0 equal to zero and odd byte as locations with A0 equal to one.
BHE A0 D7-D0
X 0 Even Byte X 1 Odd Byte
Table 18. Eight-Bit Data Bus
9.3.4 Microcontroller Interface Examples
Figures 19 through 23 show examples of the basic connections between the PSD813F1 and some popular microcontrollers. The PSD813F1 Control input pins are labeled as to the microcontroller function for which they are configured. The MCU interface is specified using the PSDsoft Configuration.
9.3.4.1 80C31
Figure 19 shows the interface to the 80C31, which has an 8-bit multiplexed address/data bus. The lower address byte is multiplexed with the data bus. The microcontroller control signals PSEN, RD, and WR may be used for accessing the internal memory components and I/O Ports. The ALE input (pin PD0) latches the address.
9.3.4.2 80C251
The Intel 80C251 microcontroller features a user-configurable bus interface with four possible bus configurations, as shown in Table 19.
Configuration 1 is 80C31 compatible, and the bus interface to the PSD813F1 is identical to that shown in Figure 19. Configurations 2 and 3 have the same bus connection as shown in Figure 20. There is only one read input (PSEN) connected to the Cntl1 pin on the PSD813F1. The A16 connection to the PA0 pin allows for a larger address input to the PSD813F1. Configuration 4 is shown in Figure 21. The RD signal is connected to Cntl1 and the PSEN signal is connected to the CNTL2.
The 80C251 has two major operating modes: Page Mode and Non-Page Mode. In Non-Page Mode, the data is multiplexed with the lower address byte, and ALE is active in every bus cycle. In Page Mode, data D[7:0] is multiplexed with address A[15:8]. In a bus cycle where there is a Page hit, the ALE signal is not active and only addresses A[7:0] are changing. The PSD813F1 supports both modes. In Page Mode, the PSD bus timing is identical to Non-Page Mode except the address hold time and setup time with respect to ALE is not required. The PSD access time is measured from address A[7:0] valid to data in valid.
Page 52
PSD813F1-A Preliminary
48
The PSD813F1 Functional Blocks
(cont.)
Configuration 80C251 Connecting to Page Mode
Read/Write PSD813F1
Pins Pins
WR CNTL0 Non-Page Mode, 80C31 compatible
1 RD CNTL1 A[7:0] multiplex with D[7:0}
PSEN CNTL2
2
WR CNTL0 Non-Page Mode PSEN only CNTL1 A[7:0] multiplex with D[7:0}
3
WR CNTL0 Page Mode PSEN only CNTL1 A[15:8] multiplex with D[7:0}
4
WR CNTL0 Page Mode RD CNTL1 A[15:8] multiplex with D[7:0} PSEN CNTL2
Table 19. 80C251 Configurations
9.3.4.3 80C51XA
The Philips 80C51XA microcontroller family supports an 8- or 16-bit multiplexed bus that can have burst cycles. Address bits A[3:0] are not multiplexed, while A[19:4] are multiplexed with data bits D[15:0] in 16-bit mode. In 8-bit mode, A[11:4] are multiplexed with data bits D[7:0].
The 80C51XA can be configured to operate in eight-bit data mode. (shown in Figure 22). The 80C51XA improves bus throughput and performance by executing Burst cycles for code fetches. In Burst Mode, address A19-4 are latched internally by the PSD813F1, while the 80C51XA changes the A3-0 lines to fetch up to 16 bytes of code. The PSD access time is then measured from address A3-A0 valid to data in valid. The PSD bus timing requirement in Burst Mode is identical to the normal bus cycle, except the address setup and hold time with respect to ALE does not apply.
9.3.4.4 68HC11
Figure 23 shows an interface to a 68HC11 where the PSD813F1 is configured in 8-bit multiplexed mode with E and R/W settings. The DPLD can generate the READ and WR signals for external devices.
Page 53
Preliminary PSD813F1-A
49
EA/VP X1
X2
RESET
RESET
INT0 INT1 T0 T1
P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7
P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
PC0
PC2
PC1
PC3 PC4 PC5 PC6 PC7
P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7
ADIO0 ADIO1
ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7
ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15
CNTL0(WR) CNTL1(RD)
CNTL2(PSEN)
PD0-ALE PD1 PD2
RESET
RD
WR
PSEN
ALE/P
TXD
RXD
RESET
29 28 27 25 24 23 22 21
30
39
31 19
18
9
12 13 14 15
1 2 3 4 5 6 7 8
38 37 36 35 34 33 32
AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7
AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7
31 32 33
34 35 36 37
39 40 41
42
43 44 45 46
47
48
50
49
10
9
8
7 6 5
4 3 2 52
51
PSD813F
80C31
AD[7:0
]
AD[7:0
]
21 22 23 24 25 26 27
28
17 16
29 30
A8 A9 A10 A11 A12 A13 A14 A15
RD WR PSEN
ALE 11 10
RESET
20 19 18 17 14 13 12 11
Figure 19. Interfacing the PSD813F1 with an 80C31
ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7
ADIO8 ADIO9 ADIO10
ADIO11 ADIO12 ADIO13 ADIO14 ADIO15
CNTL0(WR
)
CNTL1(RD
)
CNTL2(PSEN)
PD0-ALE PD1 PD2
RESET
32
26
43 42 41 40 39 38 37 36
24 25
27 28 29 30
31
33
A0 A1 A2 A3 A4 A5 A6 A7
AD8 AD9 AD10
AD14 AD15
AD13
AD11 AD12
A0 A1 A2 A3 A4 A5 A6 A7
AD8 AD9 AD10 AD11
AD15
ALE
WR A16
RD
AD14
AD12 AD13
14
9
2 3 4 5 6 7 8
21
20
11
13
P1.0 P1.1 P1.2 P1.3 P1.4
P1.5 P1.6 P1.7
P3.0/RXD P3.1/TXD P3.2/INT0
X2
X1
P3.3/INT1
RST
EA
A16
*
A17
*
A17
P0.1
P0.0 P0.2
P0.3 P0.4 P0.5 P0.6 P0.7
P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6
P2.7
ALE
PSEN
WR
RD/A16
PC0 PC1
PC3 PC4 PC5 PC6 PC7
19
18
30 31 32 33 34 35 36 37
39 40 41 42 43 44 45 46
48
8
9
10
49
50
47
29 28 27 25 24 23 22
21
20 19 18 17 14 13 12 11
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
7 6 5 4 3 2 52
51
80C251SB
PSD813F
RESET
RESET
35
P3.4/T0 P3.5/T1
16
15
17 10
RESET
PC2
Figure 20. Interfacing the PSD813F1 to the 80C251, with One Read Input
**Connection is optional.
**Non-page mode: AD[7:0] - ADIO[7:0].
Page 54
PSD813F1-A Preliminary
50
ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7
ADIO8 ADIO9 ADIO10
ADIO11 ADIO12 ADIO13 ADIO14 ADIO15
CNTL0(WR
)
CNTL1(RD
)
CNTL2(PSEN)
PD0-ALE PD1 PD2
RESET
32
26
43 42 41 40 39 38 37 36
24 25
27 28 29 30
31
33
A0 A1 A2 A3 A4 A5 A6 A7
AD8 AD9 AD10
AD14 AD15
AD13
AD11 AD12
A0 A1 A2 A3 A4 A5 A6 A7
AD8 AD9 AD10 AD11
AD15
ALE
WR PSEN
RD
AD14
AD12 AD13
14
9
2 3 4 5 6 7 8
21
20
11
13
P1.0
P1.1
P1.2 P1.3 P1.4
P1.5 P1.6 P1.7
P3.0/RXD P3.1/TXD P3.2/INT0
X2
X1
P3.3/INT1
RST
EA
P0.1
P0.0 P0.2
P0.3 P0.4 P0.5 P0.6 P0.7
P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6
P2.7
ALE
PSEN
WR
RD/A16
PC0 PC1
PC3 PC4 PC5 PC6 PC7
19
18
30 31 32 33 34 35 36 37
39 40 41 42 43 44
45
46
48
8
9
10
49
50
47
29 28 27 25 24 23 22
21
20 19 18 17 14 13 12 11
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
7 6 5 4 3 2 52
51
80C251SB
PSD813F
RESET
RESET
35
P3.4/T0 P3.5/T1
16
15
17 10
RESET
PC2
Figure 21. Interfacing the PSD813F1 to the 80C251, with Read and PSEN Inputs
ADIO0 ADIO1
ADIO2 ADIO3 AD104 AD105 ADIO6 ADIO7
ADIO8
ADIO9
ADIO10 ADIO11 AD1012 AD1013 ADIO14 ADIO15
CNTL0(WR
)
CNTL1(RD
)
CNTL2(PSEN) PD0-ALE
PD1 PD2
RESET
31
33
36
2 3 4 5 43 42 41 40 39 38 37
24 25 26 27
28 29 30
A4D0 A5D1 A6D2 A7D3 A8D4 A9D5
A10D6 A11D7
A12 A13 A14
A18 A19
A17
A15
A16
A0 A1 A2 A3
A4D0 A5D1 A6D2 A7D3 A8D4
A9D5 A10D6 A11D7 A12
A16 A17 A18 A19
A15
A13
A14
TXD1
T2EX T2 T0
RST
EA/WAIT BUSW
A1
A0/WRH
A2 A3
A4D0 A5D1 A6D2
A7D3 A8D4
A9D5 A10D6 A11D7 A12D8 A13D9
A14D10 A15D11 A16D12 A17D13 A18D14 A19D15
PSEN
RD
WRL
PC0 PC1
PC3 PC4
PC5 PC6 PC7
ALE
PSEN
RD WR
ALE
32 19 18
30 31 32 33 34 35 36 37
39 40 41 42 43 44 45 46
48
8 9
10
49
50
47
7
9 8
16
XTAL1 XTAL2
RXD0 TXD0 RXD1
21 20
11 13
6
29 28 27 25
24 23 22
21
20 19 18 17 14 13 12 11
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
PA0 PA1
PA2 PA3
PA4 PA5 PA6 PA7
7 6 5 4 3
2 52 51
A0 A1 A2 A3
80C51XA
PSD813F
RESET
RESET
35
17
INT0 INT1
14
10
15
PC2
Figure 22. Interfacing the PSD813F1 to the 80C51XA, 8-Bit Data Bus
Page 55
Preliminary PSD813F1-A
51
9 10 11 12 13 14 15 16
ADIO0 ADIO1 ADIO2 ADIO3 AD104 AD105 ADIO6 ADIO7
ADIO8 ADIO9 ADIO10 ADIO11 AD1012 AD1013 ADIO14 ADIO15
CNTL0(R_W) CNTL1(E)
CNTL2
PD0–AS PD1
PD2
RESET
20
21
22
23
24
25
3
5
4
6
42 41 40 39
38
37 36 35
AD0
AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7
A8 A9
A10
A14 A15
A13
A11 A12
AD1 AD2 AD3 AD4 AD5 AD6 AD7
E
AS R/W
XT EX
RESET IRQ XIRQ
PA0 PA1 PA2
PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7
VRH VRL
PA3 PA4 PA5 PA6 PA7
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
PC0 PC1
PC3 PC4
PC5 PC6 PC7
PD0 PD1 PD2 PD3 PD4 PD5
MODA
E
AS
R/W
31
30 31 32
33 34 35 36 37
39 40
41 42 43 44 45 46
48
8
9
10
49
50
47
8 7
17 19 18
34 33 32
43 44 45 46 47 48 49 50
52 51
30
29
28
27
29 28 27 25 24 23 22 21
20 19 18 17 14 13 12 11
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
7 6 5 4 3 2 52 51
MODB
2
68HC11
PSD813F
RESET
RESET
AD[7:0]
AD[7:0]
PC2
Figure 23. Interfacing the PSD813F1 with a 68HC11
Page 56
PSD813F1-A Preliminary
52
The PSD813F1 Functional Blocks
(cont.)
9.4 I/O Ports
There are four programmable I/O ports: Ports A, B, C, and D. Each of the ports is eight bits except Port D, which is 3 bits. Each port pin is individually user configurable, thus allowing multiple functions per port. The ports are configured using PSDsoft Configuration or by the microcontroller writing to on-chip registers in the CSIOP address space.
The topics discussed in this section are:
General Port Architecture
Port Operating Modes
Port Configuration Registers
Port Data Registers
Individual Port Functionality.
9.4.1 General Port Architecture
The general architecture of the I/O Port is shown in Figure 24. Individual Port architectures are shown in Figures 26 through 29. In general, once the purpose for a port pin has been defined, that pin will no longer be available for other purposes. Exceptions will be noted.
As shown in Figure 24, the ports contain an output multiplexer whose selects are driven by the configuration bits in the Control Registers (Ports A and B only) and PSDsoft Configuration. Inputs to the multiplexer include the following:
Output data from the Data Out Register Latched address outputsCPLD MicroCell outputExternal Chip Select from CPLD.
The Port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be read. The PDB is connected to the Internal Data Bus for feedback and can be read by the microcontroller. The Data Out and MicroCell outputs, Direction and Control Registers, and port pin input are all connected to the PDB.
The Port pins tri-state output driver enable is controlled by a two input OR gate whose inputs come from the CPLD AND array enable product term and the Direction Register. If the enable product term of any of the array outputs are not defined and that port pin is not defined as a CPLD output in the PSDabel file, then the Direction Register has sole control of the buffer that drives the port pin.
The contents of these registers can be altered by the microcontroller. The PDB feedback path allows the microcontroller to check the contents of the registers.
Ports A, B, and C have embedded Input MicroCells (IMCs). The IMCs can be configured as latches, registers, or direct inputs to the PLDs. The latches and registers are clocked by the address strobe (AS/ALE) or a product term from the PLD AND array. The outputs from the IMCs drive the PLD input bus and can be read by the microcontroller. Refer to the IMC subsection of the PLD section.
Page 57
Preliminary PSD813F1-A
53
INTERNAL DATA BUS
DATA OUT
REG.
DQ
D G
Q
DQ
DQ
WR
WR
WR
ADDRESS
MICRO⇔CELL OUTPUTS
ENABLE PRODUCT TERM (.OE
)
EXT CS
ALE
READ MUX
P D B
CPLD-INPUT
CONTROL REG.
DIR REG.
INPUT
MICRO⇔CELL
ENABLE OUT
DATA IN
OUTPUT
SELECT
OUTPUT
MUX
PORT PIN
DATA OUT
ADDRESS
Figure 24. General I/O Port Architecture
The
PSD813F1
Functional
Blocks
(cont.)
Page 58
PSD813F1-A Preliminary
54
The PSD813F1 Functional Blocks
(cont.)
9.4.2 Port Operating Modes
The I/O Ports have several modes of operation. Some modes can be defined using PSDabel, some by the microcontroller writing to the Control Registers in CSIOP space, and some by both. The modes that can only be defined using PSDsoft must be programmed into the device and cannot be changed unless the device is reprogrammed. The modes that can be changed by the microcontroller can be done so dynamically at run-time. The PLD I/O, Data Port, Address Input, and Peripheral I/O modes are the only modes that must be defined before programming the device. All other modes can be changed by the microcontroller at run-time. See Application Note 55 for more detail.
Table 20 summarizes which modes are available on each port. Table 23 shows how and where the different modes are configured. Each of the port operating modes are described in the following subsections.
Port Mode Port A Port B Port C Port D
MCU I/O Yes Yes Yes Yes PLD I/O
McellAB Outputs Yes Yes No No McellBC Outputs No Yes Yes No Additional Ext. CS Outputs No No No Yes PLD Inputs Yes Yes Yes Yes
Address Out Yes (A7– 0) Yes (A7– 0) No No
or A15– 8) Address In Yes Yes Yes Yes Data Port Yes (D7– 0) No No No Peripheral I/O Yes No No No JTAG ISP No No Yes* No
Table 20. Port Operating Modes
*Can be multiplexed with other I/O functions.
Page 59
Preliminary PSD813F1-A
55
The PSD813F1 Functional Blocks
(cont.)
Control Direction VM
Defined In Defined In Register Register Register JTAG
Mode PSDabel PSDconfiguration Setting Setting Setting Enable
Declare
1= output,
MCU I/O
pins only
NA* 0 0=input NA NA
(Note 1)
PLD I/O
Logic NA NA (Note 1) NA NA equations
Data Port
NA Specify bus type NA NA NA NA
(Port A) Address Out Declare
NA 1 1 (Note 1) NA NA
(Port A,B) pins only
Address In
Logic equation
(Port A,B,C,D)
for Input NA NA NA NA NA MicroCells
Peripheral I/O Logic equations NA NA NA PIO bit =1 NA (Port A) (PSEL0 & 1)
JTAG ISP
JTAGSEL JTAG Configuration NA NA NA
JTAG_
(Note 2) Enable
Table 21. Port Operating Mode Settings
*NA = Not Applicable
NOTE: 1. The direction of the Port A,B,C, and D pins are controlled by the Direction Register ORed with the
individual output enable product term (.oe) from the CPLD AND array.
2. Any of these three methods will enable JTAG pins on Port C.
9.4.2.1 MCU I/O Mode
In the MCU I/O Mode, the microcontroller uses the PSD813F1 ports to expand its own I/O ports. By setting up the CSIOP space, the ports on the PSD813F1 are mapped into the microcontroller address space. The addresses of the ports are listed in Table 7.
A port pin can be put into MCU I/O mode by writing a 0 to the corresponding bit in the Control Register. The MCU I/O direction may be changed by writing to the corresponding bit in the Direction Register, or by the output enable product term. See the subsection on the Direction Register in the Port Registers section. When the pin is configured as an output, the content of the Data Out Register drives the pin. When configured as an input, the microcontroller can read the port input through the Data In buffer. See Figure 25.
Ports C and D do not have Control Registers, and are in MCU I/O mode by default. They can be used for PLD I/O if equation are written for them in PSDabel.
9.4.2.2 PLD I/O Mode
The PLD I/O Mode uses a port as an input to the CPLDs Input MicroCells, and/or as an output from the CPLDs Output MicroCells. The output can be tri-stated with a control signal. This output enable control signal can be defined by a product term from the PLD, or by setting the corresponding bit in the Direction Register to 0. The corresponding bit in the Direction Register must not be set to 1 if the pin is defined as a PLD input pin in PSDabel. The PLD I/O Mode is specified in PSDabel by declaring the port pins, and then writing an equation assigning the PLD I/O to a port.
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The PSD813F1 Functional Blocks
(cont.)
9.4.2.4 Address In Mode
For microcontrollers that have more than 16 address lines, the higher addresses can be connected to Port A, B, C, and D. The address input can be latched in the Input MicroCell by the address strobe (ALE/AS). Any input that is included in the DPLD equations for the PLDs Flash, EEPROM, or SRAM is considered to be an address input.
9.4.2.5 Data Port Mode
Port A can be used as a data bus port for a microcontroller with a non-multiplexed address/data bus. The Data Port is connected to the data bus of the microcontroller. The general I/O functions are disabled in Port A if the port is configured as a Data Port.
9.4.2.6 Peripheral I/O Mode
Peripheral I/O Mode can be used to interface with external peripherals. In this mode, all of Port A serves as a tri-stateable, bi-directional data buffer for the microcontroller. Peripheral I/O Mode is enabled by setting Bit 7 of the VM Register to a 1. Figure 25 shows how Port A acts as a bi-directional buffer for the microcontroller data bus if Peripheral I/O Mode is enabled. An equation for PSEL0 and/or PSEL1 must be written in PSDabel. The buffer is tri-stated when PSEL 0 or 1 is not active.
9.4.2.7 JTAG ISP
Port C is JTAG compliant, and can be used for In-System Programming (ISP). You can multiplex JTAG operations with other functions on Port C because ISP is not performed during normal system operation. For more information on the JTAG Port, refer to section 9.6.
9.4.2.3 Address Out Mode
For microcontrollers with a multiplexed address/data bus, Address Out Mode can be used to drive latched addresses onto the port pins. These port pins can, in turn, drive external devices. Either the output enable or the corresponding bits of both the Direction Register and Control Register must be set to a 1 for pins to use Address Out Mode. This must be done by the MCU at run-time. See Table 22 for the address output pin assignments on Ports A and B for various MCUs.
For non-multiplexed 8 bit bus mode, address lines A[7:0] are available to Port B in Address Out Mode.
Note: do not drive address lines with Address Out Mode to an external memory device if it is intended for the MCU to boot from the external device. The MCU must first boot from PSD memory so the Direction and Control register bits can be set.
Microcontroller Port A (3:0) Port A (7:4) Port B (3:0) Port B (7:4)
8051XA (8-Bit) N/A* Address (7:4) Address (11:8) N/A 80C251 N/A N/A Address (11:8) Address (15:12)
(Page Mode) All Other Address (3:0) Address (7:4) Address (3:0) Address (7:4)
8-Bit Multiplexed 8-Bit N/A N/A Address [3:0] Address [7:4]
Non-Multiplexed Bus
Table 22. I/O Port Latched Address Output Assignments
N/A = Not Applicable.
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Preliminary PSD813F1-A
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The PSD813F1 Functional Blocks
(cont.)
RD
PSEL0
PSEL1
PSEL
VM REGISTER BIT 7
WR
PA0- PA7
D0-D7 DATA BUS
Figure 25. Peripheral I/O Mode
9.4.3 Port Configuration Registers (PCRs)
Each port has a set of PCRs used for configuration. The contents of the registers can be accessed by the microcontroller through normal read/write bus cycles at the addresses given in Table 7. The addresses in Table 7 are the offsets in hex from the base of the CSIOP register.
The pins of a port are individually configurable and each bit in the register controls its respective pin. For example, Bit 0 in a register refers to Bit 0 of its port. The three PCRs, shown in Table 23, are used for setting the port configurations. The default power-up state for each register in Table 23 is 00h.
Register Name Port MCU Access
Control A,B Write/Read Direction A,B,C,D Write/Read Drive Select* A,B,C,D Write/Read
Table 23. Port Configuration Registers
*NOTE: See Table 27 for Drive Register bit definition.
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The PSD813F1 Functional Blocks
(cont.)
9.4.3.1 Control Register
Any bit set to 0 in the Control Register sets the corresponding Port pin to MCU I/O Mode, and a 1 sets it to Address Out Mode. The default mode is MCU I/O. Only Ports A and B have an associated Control Register.
9.4.3.2 Direction Register
The Direction Register, in conjunction with the output enable (except for Port D), controls the direction of data flow in the I/O Ports. Any bit set to 1 in the Direction Register will cause the corresponding pin to be an output, and any bit set to 0 will cause it to be an input. The default mode for all port pins is input.
Figures 26 and 28 show the Port Architecture diagrams for Ports A/B and C, respectively. The direction of data flow for Ports A, B, and C are controlled not only by the direction register, but also by the output enable product term from the PLD AND array. If the output enable product term is not active, the Direction Register has sole control of a given pins direction.
An example of a configuration for a port with the three least significant bits set to output and the remainder set to input is shown in Table 26. Since Port D only contains three pins, the Direction Register for Port D has only the three least significant bits active.
Direction Register Bit Port Pin Mode
0 Input 1 Output
Table 24. Port Pin Direction Control,
Output Enable P.T. Not Defined
Direction Register Bit Output Enable P.T. Port Pin Mode
0 0 Input 0 1 Output 1 0 Output 1 1 Output
Table 25. Port Pin Direction Control, Output Enable P.T. Defined
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
00000111
Table 26. Port Direction Assignment Example
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59
Drive
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register
Port A
Open Open Open Open Slew Slew Slew Slew
Drain Drain Drain Drain Rate Rate Rate Rate
Port B
Open Open Open Open Slew Slew Slew Slew
Drain Drain Drain Drain Rate Rate Rate Rate
Port C
Open Open Open Open Open Open Open Open
Drain Drain Drain Drain Drain Drain Drain Drain
Port D NA NA NA NA NA
Slew Slew Slew Rate Rate Rate
Table 27. Drive Register Pin Assignment
NOTE: NA = Not Applicable.
The PSD813F1 Functional Blocks
(cont.)
9.4.3.3 Drive Select Register
The Drive Select Register configures the pin driver as Open Drain or CMOS for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins configured as Open Drain.
A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a 1. The default pin drive is CMOS.
Aside: the slew rate is a measurement of the rise and fall times of an output. A higher slew rate means a faster output response and may create more electrical noise. A pin operates in a high slew rate when the corresponding bit in the Drive Register is set to 1. The default rate is slow slew.
Table 27 shows the Drive Register for Ports A, B, C, and D. It summarizes which pins can be configured as Open Drain outputs and which pins the slew rate can be set for.
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The PSD813F1 Functional Blocks
(cont.)
9.4.4 Port Data Registers
The Port Data Registers, shown in Table 28, are used by the microcontroller to write data to or read data from the ports. Table 28 shows the register name, the ports having each register type, and microcontroller access for each register type. The registers are described below.
9.4.4.1 Data In
Port pins are connected directly to the Data In buffer. In MCU I/O input mode, the pin input is read through the Data In buffer.
9.4.4.2 Data Out Register
Stores output data written by the MCU in the MCU I/O output mode. The contents of the Register are driven out to the pins if the Direction Register or the output enable product term is set to 1. The contents of the register can also be read back by the microcontroller.
9.4.4.3 Output MicroCells (OMCs)
The CPLD OMCs occupy a location in the microcontrollers address space. The microcontroller can read the output of the OMCs. If the Mask MicroCell Register bits are not set, writing to the MicroCell loads data to the MicroCell flip flops. Refer to the PLD section for more details.
9.4.4.4 Mask MicroCell Register
Each Mask Register bit corresponds to an OMC flip flop. When the Mask Register bit is set to a 1, loading data into the OMC flip flop is blocked. The default value is 0 or unblocked.
9.4.4.5 Input MicroCells (IMCs)
The IMCs can be used to latch or store external inputs. The outputs of the IMCs are routed to the PLD input bus, and can be read by the microcontroller. Refer to the PLD section for a detailed description.
9.4.4.6 Enable Out
The Enable Out register can be read by the microcontroller. It contains the output enable values for a given port. A 1 indicates the driver is in output mode. A 0 indicates the driver is in tri-state and the pin is in input mode.
Register Name Port MCU Access
Data In A,B,C,D Read – input on pin Data Out A,B,C,D Write/Read Output MicroCell A,B,C Read – outputs of MicroCells
Write – loading MicroCells Flip-Flop
Mask MicroCell A,B,C Write/Read – prevents loading into a given
MicroCell Input MicroCell A,B,C Read – outputs of the Input MicroCells Enable Out A,B,C Read – the output enable control of the port driver
Table 28. Port Data Registers
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The PSD813F1 Functional Blocks
(cont.)
9.4.5 Ports A and B – Functionality and Structure
Ports A and B have similar functionality and structure, as shown in Figure 26. The two ports can be configured to perform one or more of the following functions:
MCU I/O ModeCPLD Output – MicroCells McellAB[7:0] can be connected to Port A or Port B.
McellBC[7:0] can be connected to Port B or Port C.
CPLD Input – Via the input MicroCells.Latched Address output – Provide latched address output per Table 30.Address In – Additional high address inputs using the Input MicroCells.Open Drain/Slew Rate – pins PA[3:0] and PB[3:0] can be configured to fast slew rate,
pins PA[7:4] and PB[7:4] can be configured to Open Drain Mode.
Data Port – Port A to D[7:0] for 8 bit non-multiplexed busMultiplexed Address/Data port for certain types of microcontroller interfaces.Peripheral Mode – Port A only
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The
PSD813F1
Functional
Blocks
(cont.)
INTERNAL DATA BUS
DATA OUT
REG.
DQ
D G
Q
DQ
DQ
WR
WR
WR
ADDRESS
MICRO⇔CELL OUTPUTS
ENABLE PRODUCT TERM (.OE
)
ALE
READ MUX
P D B
CPLD-INPUT
CONTROL REG.
DIR REG.
INPUT
MICRO⇔CELL
ENABLE OUT
DATA IN
OUTPUT
SELECT
OUTPUT
MUX
PORT
A OR B PIN
DATA OUT
ADDRESS
A[7:0] OR A[15:8
]
Figure 26. Ports A and B Structure
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The PSD813F1 Functional Blocks
(cont.)
9.4.6 Port C – Functionality and Structure
Port C can be configured to perform one or more of the following functions (see Figure 28):
MCU I/O ModeCPLD Output – McellBC[7:0] outputs can be connected to Port B or Port C.CPLD Input – via the Input MicroCellsAddress In – Additional high address inputs using the Input MicroCells.In-System Programming – JTAG port can be enabled for programming/erase of the
PSD813F1 device. (See Section 9.6 for more information on JTAG programming.)
Open Drain – Port C pins can be configured in Open Drain ModeBattery Backup features – PC2 can be configured as a Battery Input (Vstby) pin.
PC4 can be configured as a Battery On Indicator output pin, indicating when Vcc is less than Vbat.
Port C does not support Address Out mode, and therefore no Control Register is required. Pin PC7 may be configured as the DBE input in certain microcontroller interfaces.
9.4.7 Port D – Functionality and Structure
Port D has three I/O pins. See Figure 29. This port does not support Address Out mode, and therefore no Control Register is required. Port D can be configured to perform one or more of the following functions:
MCU I/O ModeCPLD Output – (external chip select)CPLD Input – direct input to CPLD, no Input MicroCellsSlew rate – pins can be set up for fast slew rate
Port D pins can be configured in PSDsoft as input pins for other dedicated functions:
PD0 – ALE, as address strobe inputPD1 – CLKIN, as clock input to the MicroCells Flip Flops and APD counterPD2 – CSI, as active low chip select input. A high input will disable the
Flash/EEPROM/SRAM and CSIOP.
9.4.7.1 External Chip Select
The CPLD also provides three chip select outputs on Port D pins that can be used to select external devices. Each chip select (ECS0-2) consists of one product term that can be configured active high or low. The output enable of the pin is controlled by either the output enable product term or the Direction Register. (See Figure 29.)
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64
The PSD813F1 Functional Blocks
(cont.)
INTERNAL DATA BUS
DATA OUT
REG.
DQ
DQ
WR
WR
MCELLBC
[
7:0
]
ENABLE PRODUCT TERM
(
.OE
)
READ MUX
P
D
B
CPLD-INPUT
DIR REG.
INPUT
MICRO
CELL
ENABLE OUT
SPECIAL FUNCTION
*
SPECIAL FUNCTION*
CONFIGURATION
BIT
DATA IN
OUTPUT
SELECT
OUTPUT
MUX
PORT C PIN
DATA OUT
Figure 27. Port C Structure
*ISP or battery back-up.
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Preliminary PSD813F1-A
65
The
PSD813F1
Functional
Blocks
(cont.)
INTERNAL DATA BUS
DATA OUT
REG.
DQ
DQ
WR
WR
ECS[2:0
]
READ MUX
P D B
CPLD-INPUT
DIR REG.
DATA IN
ENABLE PRODUCT
TERM (.OE)
OUTPUT
SELECT
OUTPUT
MUX
PORT D PIN
DATA OUT
Figure 28. Port D Structure
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66
The
PSD813F1
Functional
Blocks
(cont.)
PLD INPUT BUS
POLARITY
BIT
PD2 PIN
PT2
ECS2
DIRECTION
REGISTER
POLARITY
BIT
PD1 PIN
PT1
ECS1
ENABLE (.OE)
ENABLE (.OE)
DIRECTION
REGISTER
POLARITY
BIT
PD0 PIN
PT0
ECS0
ENABLE (.OE)
DIRECTION
REGISTER
CPLD AND ARRAY
Figure 29. Port D External Chip Selects
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Preliminary PSD813F1-A
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9.5 Power Management
The PSD813F1 offers configurable power saving options. These options may be used individually or in combinations, as follows:
All memory types in a PSD (Flash, EEPROM, and SRAM) are built with Zero-Power
technology. In addition to using special silicon design methodology, Zero-Power technology puts the memories into standby mode when address/data inputs are not changing (zero DC current). As soon as a transition occurs on an input, the affected memory wakes up, changes and latches its outputs, then goes back to standby. The designer does not have to do anything special to achieve memory standby mode when no inputs are changingit happens automatically.
The PLD sections can also achieve standby mode when its inputs are not changing, see PMMR registers below.
Like the Zero-Power feature, the Automatic Power Down (APD) logic allows the PSD to
reduce to standby current automatically. The APD will block MCU address/data signals from reaching the memories and PLDs. This feature is available on all PSD813F1 devices. The APD unit is described in more detail in section 9.5.1.
Built in logic will monitor the address strobe of the MCU for activity. If there is no activity for a certain time period (MCU is asleep), the APD logic initiates Power Down Mode (if enabled). Once in Power Down Mode, all address/data signals are blocked from reaching PSD memories and PLDs, and the memories are deselected internally. This allows the memories and PLDs to remain in standby mode even if the address/data lines are changing state externally (noise, other devices on the MCU bus, etc.). Keep in mind that any unblocked PLD input signals that are changing states keeps the PLD out of standby mode, but not the memories.
The PSD Chip Select Input (CSI) on all families can be used to disable the internal
memories, placing them in standby mode even if inputs are changing. This feature does not block any internal signals or disable the PLDs. This is a good alternative to using the APD logic, especially if your MCU has a chip select output. There is a slight penalty in memory access time when the CSI signal makes its initial transition from deselected to selected.
The PMMR registers can be written by the MCU at run-time to manage power.
PSD813F1 supports blocking bits in these registers that are set to block designated signals from reaching both PLDs. Current consumption of the PLDs is directly related to the composite frequency of the changes on their inputs (see Figures 34 and 34a). Significant power savings can be achieved by blocking signals that are not used in DPLD or CPLD logic equations.
The PSD813F1 has a Turbo Bit in the PMMR0 register. This bit can be set to disable the Turbo Mode feature (default is Turbo Mode on). While Turbo Mode is disabled, the PLDs can achieve standby current when no PLD inputs are changing (zero DC current). Even when inputs do change, significant power can be saved at lower frequencies (AC current), compared to when Turbo Mode is enabled. When the Turbo Mode is enabled, there is a significant DC current component and the AC component is higher.
9.5.1 Automatic Power Down (APD) Unit and Power Down Mode
The APD Unit, shown in Figure 30, puts the PSD into Power Down Mode by monitoring the activity of the address strobe (ALE/AS). If the APD unit is enabled, as soon as activity on the address strobe stops, a four bit counter starts counting. If the address strobe remains inactive for fifteen clock periods of the CLKIN signal, the Power Down (PDN) signal becomes active, and the PSD will enter into Power Down Mode, discussed next.
The PSD813F1 Functional Blocks
(cont.)
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The PSD813F1 Functional Blocks
(cont.)
Access 5V VCC,
PLD Memory Recovery Time Typical
Propagation Access to Normal Standby
Mode Delay Time Access Current
Power Down
Normal tpd
No Access tLVDV
50 µA
(Note 1) (Note 2)
Table 30. PSD813F1 Timing and Standby Current During Power
Down Mode
NOTES: 1. Power Down does not affect the operation of the PLD. The PLD operation in this
mode is based only on the Turbo Bit.
2. Typical current consumption assuming no PLD inputs are changing state and the PLD Turbo bit is off.
Port Function Pin Level
MCU I/O No Change PLD Out No Change Address Out Undefined Data Port Three-State Peripheral I/O Three-State
Table 29. Power Down Mode’s Effect on
Ports
9.5.1 Automatic Power Down (APD) Unit and Power Down Mode (cont.) Power Down Mode
By default, if you enable the PSD APD unit, Power Down Mode is automatically enabled. The device will enter Power Down Mode if the address strobe (ALE/AS) remains inactive for fifteen CLKIN (pin PD1) clock periods.
The following should be kept in mind when the PSD is in Power Down Mode:
If the address strobe starts pulsing again, the PSD will return to normal operation.
The PSD will also return to normal operation if either the CSI input returns low or the Reset input returns high.
The MCU address/data bus is blocked from all memories and PLDs.
Various signals can be blocked (prior to Power Down Mode) from entering the PLDs
by setting the appropriate bits in the PMMR registers. The blocked signals include MCU control signals and the common clock (CLKIN). Note that blocking CLKIN from the PLDs will not block CLKIN from the APD unit.
All PSD memories enter Standby Mode and are drawing standby current. However,
the PLDs and I/O ports do not go into Standby Mode because you dont want to have to wait for the logic and I/O to wake-up before their outputs can change. See table 29 for Power Down Mode effects on PSD ports.
Typical standby current is 50 µA for 5 V devices, and 25 µA for 3 V devices. These
standby current values assume that there are no transitions on any PLD input.
HC11 (or compatible) Users Note
The HC11 turns off its E clock when it sleeps. Therefore, if you are using an HC11 (or compatible) in your design, and you wish to use the Power Down, you must not connect the E clock to the CLKIN input (PD1). You should instead connect an independent clock signal to the CLKIN input. The clock frequency must be less than 15 times the frequency of AS. The reason for this is that if the frequency is greater than 15 times the frequency of AS, the PSD813F1 will keep going into Power Down Mode.
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69
APD EN PMMR0 BIT 1=1
ALE
RESET
CSI
CLKIN
TRANSITION
DETECTION
EDGE
DETECT
APD
COUNTER
POWER DOWN (
PDN
)
DISABLE BUS INTERFACE
EEPROM SELECT FLASH SELECT
SRAM SELECT
PD
CLR
PD
DISABLE FLASH/EEPROM/SRAM
PLD
SELECT
Figure 30. APD Logic Block
The PSD813F1 Functional Blocks
(cont.)
Enable APD
Set PMMR0 Bit 1 = 1
PSD in Power
Down Mode
ALE/AS idle
for 15 CLKIN
clocks?
RESET
Yes
No
OPTIONAL
Disable desired inputs to PLD
by setting PMMR0 bits 4 and 5
and PMMR2 bits 2 through 6.
Figure 31. Enable Power Down Flow Chart
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PSD813F1-A Preliminary
70
Bit 1 0 = Automatic Power Down (APD) is disabled.
1 = Automatic Power Down (APD) is enabled.
Bit 3 0 = PLD Turbo is on.
1 = PLD Turbo is off, saving power.
Bit 4 0 = CLKIN input to the PLD AND array is connected.
Every CLKIN change will power up the PLD when Turbo bit is off.
1 = CLKIN input to PLD AND array is disconnected, saving power.
Bit 5 0 = CLKIN input to the PLD MicroCells is connected.
1 = CLKIN input to PLD MicroCells is disconnected, saving power.
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
**
PLD PLD PLD
*
APD
*
Mcell clk Array clk Turbo Enable
1 = off 1 = off 1 = off 1 = on
Table 31. Power Management Mode Registers (PMMR0, PMMR2)**
PMMR0
***Bits 0, 2, 6, and 7 are not used, and should be set to 0. ***The PMMR0, and PMMR2 register bits are cleared to zero following power up.
***Subsequent reset pulses will not clear the registers.
The PSD813F1 Functional Blocks
(cont.)
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
*
PLD PLD PLD PLD PLD
**
array array array array array
DBE ALE CNTL2 CNTL1 CNTL0
1 = off 1 = off 1 = off 1 = off 1 = off
PMMR2
Bit 2 0 = Cntl0 input to the PLD AND array is connected.
1 = Cntl0 input to PLD AND array is disconnected, saving power.
Bit 3 0 = Cntl1 input to the PLD AND array is connected.
1 = Cntl1 input to PLD AND array is disconnected, saving power.
Bit 4 0 = Cntl2 input to the PLD AND array is connected.
1 = Cntl2 input to PLD AND array is disconnected, saving power.
Bit 5 0 = ALE input to the PLD AND array is connected.
1 = ALE input to PLD AND array is disconnected, saving power.
Bit 6 0 = DBE input to the PLD AND array is connected.
1 = DBE input to PLD AND array is disconnected, saving power.
*Unused bits should be set to 0.
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Preliminary PSD813F1-A
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APD ALE
Enable Bit PD Polarity ALE Level APD Counter
0 X X Not Counting 1 X Pulsing Not Counting 1 1 1 Counting (Generates PDN after 15 Clocks) 1 0 0 Counting (Generates PDN after 15 Clocks)
Table 32. APD Counter Operation
The PSD813F1 Functional Blocks
(cont.)
9.5.2 Other Power Saving Options
The PSD813F1 offers other reduced power saving options that are independent of the Power Down Mode. Except for the SRAM Standby and CSI input features, they are enabled by setting bits in the PMMR0 and PMMR2 registers.
9.5.2.1 Zero Power PLD
The power and speed of the PLDs are controlled by the Turbo bit (bit 3) in the PMMR0. By setting the bit to 1, the Turbo mode is disabled and the PLDs consume Zero Power current when the inputs are not switching for an extended time of 70 ns. The propagation delay time will be increased by 10 ns after the Turbo bit is set to 1 (turned off) when the inputs change at a composite frequency of less than 15 MHz. When the Turbo bit is set to a 0 (turned on), the PLDs run at full power and speed. The Turbo bit affects the PLDs D.C. power, AC power, and propagation delay.
Note: Blocking MCU control signals with PMMR2 bits can further reduce PLD AC power consumption.
9.5.2.2 SRAM Standby Mode (Battery Backup)
The PSD813F1 supports a battery backup operation that retains the contents of the SRAM in the event of a power loss. The SRAM has a Vstby pin (PC2) that can be connected to an external battery. When VCCbecomes lower than Vstby then the PSD will automatically connect to Vstby as a power source to the SRAM. The SRAM Standby Current (Istby) is typically 0.5 µA. The SRAM data retention voltage is 2 V minimum. The battery-on indicator (Vbaton) can be routed to PC4. This signal indicates when the VCChas dropped below the Vstby voltage.
9.5.2.3 The CSI Input
Pin PD2 of Port D can be configured in PSDsoft as the CSI input. When low, the signal selects and enables the internal Flash, EEPROM, SRAM, and I/O for read or write operations involving the PSD813F1. A high on the CSI pin will disable the Flash memory, EEPROM, and SRAM, and reduce the PSD power consumption. However, the PLD and I/O pins remain operational when CSI is high. Note: there may be a timing penalty when using the CSI pin depending on the speed grade of the PSD that you are using. See the timing parameter t
SLQV
in the AC/DC specs.
9.5.2.4 Input Clock
The PSD813F1 provides the option to turn off the CLKIN input to the PLD to save AC power consumption. The CLKIN is an input to the PLD AND array and the Output MicroCells. During Power Down Mode, or, if the CLKIN input is not being used as part of the PLD logic equation, the clock should be disabled to save AC power. The CLKIN will be disconnected from the PLD AND array or the MicroCells by setting bits 4 or 5 to a 1 in PMMR0.
9.5.2.5 Input Control Signals
The PSD813F1 provides the option to turn off the input control signals (CNTL0-2, ALE, and DBE) to the PLD to save AC power consumption. These control signals are inputs to the PLD AND array. During Power Down Mode, or, if any of them are not being used as part of the PLD logic equation, these control signals should be disabled to save AC power. They will be disconnected from the PLD AND array by setting bits 2, 3, 4, 5, and 6 to a 1 in the PMMR2.
Page 76
The PSD813F1 Functional Blocks
(cont.)
9.5.3 Reset and Power On Requirement
Power On Reset
Upon power up the PSD813F1 requires a reset pulse of tNLNH-PO (minimum 1ms) after VCCis steady. During this time period the device loads internal configurations, clears some of the registers and sets the Flash or EEPROM into operating mode. After the rising edge of reset, the PSD813F1 remains in the reset state for an additional tOPR (minimum 120 ns) nanoseconds before the first memory access is allowed.
The PSD813F1 Flash or EEPROM memory is reset to the read array mode upon power up. The FSi and EESi select signals along with the write strobe signal must be in the false state during power-up reset for maximum security of the data contents and to remove the possi­bility of a byte being written on the first edge of a write strobe signal. The PSD automatically prevents write strobes from reaching the EEPROM memory array for about 5 ms (tEEHWL). Any Flash memory write cycle initiation is prevented automatically when VCCis below VLKO.
Warm Reset
Once the device is up and running, the device can be reset with a much shorter pulse of tNLNH (minimum 150 ns). The same tOPR time is needed before the device is operational after warm reset. Figure 32 shows the timing of the power on and warm reset.
PSD813F1-A Preliminary
72
OPERATING LEVEL
POWER ON RESET
V
CC
RESET
t
NLNH–PO
t
OPR
t
NLNH
t
OPR
WARM RESET
Figure 32. Power On and Warm Reset Timing
I/O Pin, Register and PLD Status at Reset
Table 33 shows the I/O pin, register and PLD status during power on reset, warm reset and power down mode. PLD outputs are always valid during warm reset, and they are valid in power on reset once the internal PSD configuration bits are loaded. This loading of PSD is completed typically long before the VCCramps up to operating level. Once the PLD is active, the state of the outputs are determined by the PSDabel equations.
Page 77
Preliminary PSD813F1-A
73
Port C Pin JTAG Signals Description
PC0 TMS Mode Select PC1 TCK Clock PC3 TSTAT Status PC4 TERR Error Flag PC5 TDI Serial Data In PC6 TDO Serial Data Out
Table 34. JTAG Port Signals
The PSD813F1 Functional Blocks
(cont.)
9.6 Programming In-Circuit using the JTAG Interface
The JTAG interface on the PSD813F1 can be enabled on Port C (see Table 34). All memory (Flash and EEPROM), PLD logic, and PSD configuration bits may be programmed through the JTAG interface. A blank part can be mounted on a printed circuit board and programmed using JTAG.
The standard JTAG signals (IEEE 1149.1) are TMS, TCK, TDI, and TDO. Two additional signals, TSTAT and TERR, are optional JTAG extensions used to speed up program and erase operations.
By default, on a blank PSD (as shipped from factory or after erasure), four pins on Port C are enabled for the basic JTAG signals TMS, TCK, TDI, and TDO.
See Application Note 54 for more details on JTAG In-System-Programming.
*SR_cod and Periph Mode bits in the VM Register are always cleared to zero on power on or warm reset.
Port Configuration Power On Reset Warm Reset Power Down Mode
MCU I/O Input Mode Input Mode Unchanged PLD Output Valid after internal Valid Depend on inputs to
PSD configuration PLD (address are
bits are loaded blocked in PD mode) Address Out Tri-stated Tri-stated Not defined Data Port Tri-stated Tri-stated Tri-stated Peripheral I/O Tri-stated Tri-stated Tri-stated
Table 33. Status During Power On Reset, Warm Reset and Power Down Mode
Register Power On Reset Warm Reset Power Down Mode
PMMR0, 2 Cleared to 0 Unchanged Unchanged MicroCells Flip Cleared to 0 by Depend on .re and Depend on .re and
Flop status internal power on .pr equations .pr equations
reset
VM Register* Initialized based on Initialized based on Unchanged
the selection in the selection in
PSDsoft PSDsoft
Configuration Menu. Configuration Menu
All other registers Cleared to 0 Cleared to 0 Unchanged
Page 78
PSD813F1-A Preliminary
74
9.6.1 Standard JTAG Signals
The standard JTAG signals (TMS, TCK, TDI, and TDO) can be enabled by any of three different conditions that are logically ORed. When enabled, TDI, TDO, TCK, and TMS are inputs, waiting for a serial command from an external JTAG controller device (such as FlashLink or Automated Test Equipment). When the enabling command is received from the external JTAG controller, TDO becomes an output and the JTAG channel is fully functional inside the PSD. The same command that enables the JTAG channel may optionally enable the two additional JTAG pins, TSTAT and TERR.
The following symbolic logic equation specifies the conditions enabling the four basic JTAG pins (TMS, TCK, TDI, and TDO) on their respective Port C pins. For purposes of discussion, the logic label JTAG_ON will be used. When JTAG_ON is true, the four pins are enabled for JTAG. When JTAG_ON is false, the four pins can be used for general PSD I/O.
JTAG_ON = PSDsoft_enabled +
/* An NVM configuration bit inside the PSD is set by the designer
in the PSDsoft Configuration utility. This dedicates the pins for JTAG at all times (compliant with IEEE 1149.1) */
Microcontroller_enabled +
/* The microcontroller can set a bit at run-time by writing to the
PSD register, JTAG Enable. This register is located at address CSIOP + offset C7h. Setting the JTAG_ENABLE bit in this register will enable the pins for JTAG use. This bit is cleared by a PSD reset or the microcontroller. See Table 35 for bit definition. */
PSD_product_term_enabled;
/* A dedicated product term (PT) inside the PSD can be used to
enable the JTAG pins. This PT has the reserved name JTAGSEL. Once defined as a node in PSDabel, the designer can write an equation for JTAGSEL. This method is used when the Port C JTAG pins are multiplexed with other I/O signals. It is recommended to logically tie the node JTAGSEL to the JEN\ signal on the Flashlink cable when multiplexing JTAG signals. See Application Note 54 for details.
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
*******
JTAG_ENABLE
Table 35. JTAG Enable Register
JTAG Enable
*Bits 1-7 are not used and should set to 0.
Bit definitions:
JTAG_ENABLE 1 = JTAG Port is Enabled.
0 = JTAG Port is Disabled.
The PSD813F1 Functional Blocks
(cont.)
Page 79
Preliminary PSD813F1-A
75
9.6.1 Standard JTAG Signals (cont.)
The PSD813F1 supports JTAG In-System-Configuration (ISC) commands, but not Boundary Scan. A definition of these JTAG-ISC commands and sequences are defined in a supplemental document available from ST. STs PSDsoft software tool and FlashLink JTAG programming cable implement these JTAG-ISC commands. This document is needed only as a reference for designers who use a FlashLink to program their PSD813F1.
9.6.2 JTAG Extensions
TSTAT and TERR are two JTAG extension signals enabled by an ISC_ENABLE command received over the four standard JTAG pins (TMS, TCK, TDI, and TDO). They are used to speed programming and erase functions by indicating status on PSD pins instead of having to scan the status out serially using the standard JTAG channel. See Application Note 54.
TERR will indicate if an error has occurred when erasing a sector or programming a byte in Flash memory. This signal will go low (active) when an error condition occurs, and stay low until an ISC_CLEAR command is executed or a chip reset pulse is received after an ISC-DISABLE command. TERR does not apply to EEPROM.
TSTAT behaves the same as the Rdy/Bsy signal described in section 9.1.1.2. TSTAT will be high when the PSD813F1 device is in read array mode (Flash memory and EEPROM contents can be read). TSTAT will be low when Flash memory programming or erase cycles are in progress, and also when data is being written to EEPROM.
TSTAT and TERR can be configured as open-drain type signals during an ISC_ENABLE command. This facilitates a wired-OR connection of TSTAT signals from several PSD813F1 devices and a wired-OR connection of TERR signals from those same devices. This is useful when several PSD813F1 devices are chained together in a JTAG environment.
9.6.3 Security and Flash Memories and EEPROM Protection
When the security bit is set, the device cannot be read on a device programmer or through the JTAG Port. When using the JTAG Port, only a full chip erase command is allowed. All other program/erase/verify commands are blocked. Full chip erase returns the part to a non-secured blank state. The Security Bit can be set in PSDsoft Configuration.
All Flash Memory and EEPROM sectors can individually be sector protected against erasures. The sector protect bits can be set in PSDsoft Configuration.
The PSD813F1 Functional Blocks
(cont.)
Page 80
PSD813F1-A Preliminary
76
Symbol Parameter Condition Min Max Unit
T
STG
Storage Temperature PLDCC – 65 + 125 °C
Commercial 0 + 70 °C
Operating Temperature
Industrial – 40 + 85 °C
Voltage on any Pin With Respect to GND – 0.6 + 7 V
V
PP
Device Programmer Supply Voltage
With Respect to GND – 0.6 + 14 V
V
CC
Supply Voltage With Respect to GND – 0.6 + 7 V ESD Protection >2000 V
Absolute Maximum Ratings
NOTE: Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not recommended. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect device reliability.
Symbol Parameter Condition Min Typ Max Unit
V
CC
Supply Voltage All Speeds 4.5 5 5.5 V
V
CC
Supply Voltage
V-Versions
3.0 3.6 V
All Speeds
Recommended Operating Conditions
Range Temperature VCCTolerance
Commercial 0° C to +70°C + 5 V ± 10% Industrial –40° C to +85°C + 5 V ± 10% Commercial 0° C to +70°C 3 V to 3.6 V Industrial –40° C to +85°C 3 V to 3.6 V
Operating Range
Page 81
Preliminary PSD813F1-A
77
AC/DC Parameters
The following tables describe the AD/DC parameters of the PSD813F1 family:
DC Electrical SpecificationAC Timing Specification
PLD Timing
Combinatorial TimingSynchronous Clock ModeAsynchronous Clock ModeInput MicroCell Timing
Microcontroller Timing
Read TimingWrite TimingPeripheral Mode TimingPower Down and Reset Timing
Following are issues concerning the parameters presented:
In the DC specification the supply current is given for different modes of operation.
Before calculating the total power consumption, determine the percentage of time that the PSD813F1 is in each mode. Also, the supply power is considerably different if the Turbo bit is "OFF".
The AC power component gives the PLD, EPROM, and SRAM mA/MHz specification.
Figures 33 and 33a show the PLD mA/MHz as a function of the number of Product Terms (PT) used.
In the PLD timing parameters, add the required delay when Turbo bit is "OFF".
Figure 33. PLD ICC/FrequencyConsumption (V
CC
= 5 V ± 10%)
0
10
20
30
40
60
70
80
90
100
110
V
CC
= 5V
50
010155 20 25
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
I
CC
– (mA)
TURBO ON (100%)
TURBO ON (25%)
TURBO OFF
TURBO OFF
PT 100% PT 25%
Page 82
PSD813F1-A Preliminary
78
Figure 33a. PLD ICC/Frequency Consumption (PSD813FV Versions, V
CC
= 3 V)
0
10
20
30
40
50
60
V
CC
= 3V
010155 20 25
I
CC
– (mA)
TURBO ON (100%)
TURBO ON (25%)
TURBO OFF
TURBO OFF
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
PT 100% PT 25%
Conditions
Highest Composite PLD input frequency
(Freq PLD) = 8 MHz
MCU ALE frequency (Freq ALE) = 4 MHz
% Flash Access = 80% % SRAM access = 15% % I/O access = 5% (no additional power above base)
Operational Modes
% Normal = 10% % Power Down Mode = 90%
Number of product terms used
(from fitter report) = 45 PT % of total product terms = 45/182 = 24.7%
Turbo Mode = ON
Calculation (typical numbers used)
I
CC
total = Ipwrdown x %pwrdown + %normal x (ICC(ac) + ICC(dc))
= Ipwrdown x %pwrdown + % normal x (%flash x 2.5 mA/MHz x Freq ALE
+ %SRAM x 1.5 mA/MHz x Freq ALE + % PLD x 2 mA/MHz x Freq PLD + #PT x 400 µA/PT
= 50 µA x 0.90 + 0.1 x (0.8 x 2.5 mA/MHz x 4 MHz
+ 0.15 x 1.5 mA/MHz x 4 MHz +2 mA/MHz x 8 MHz + 45 x 0.4 mA/PT)
= 45 µA + 0.1 x (8 + 0.9 + 16 + 18 mA) = 45 µA + 0.1 x 42.9 = 45 µA + 4.29 mA
= 4.34 mA
This is the operating power with no EEPROM writes or Flash erases. Calculation is based on I
OUT
= 0 mA.
Example of PSD813F Typical Power Calculation at VCC= 5.0 V
AC/DC Parameters
(cont.)
Page 83
Preliminary PSD813F1-A
79
Conditions
Highest Composite PLD input frequency
(Freq PLD) = 8 MHz
MCU ALE frequency (Freq ALE) = 4 MHz
% Flash Access = 80% % SRAM access = 15% % I/O access = 5% (no additional power above base)
Operational Modes
% Normal = 10% % Power Down Mode = 90%
Number of product terms used
(from fitter report) = 45 PT % of total product terms = 45/182 = 24.7%
Turbo Mode = Off
Calculation (typical numbers used)
I
CC
total = Ipwrdown x %pwrdown + %normal x (ICC(ac) + ICC(dc))
= Ipwrdown x %pwrdown + % normal x (%flash x 2.5 mA/MHz x Freq ALE
+ %SRAM x 1.5 mA/MHz x Freq ALE + % PLD x (from graph using Freq PLD))
= 50 µA x 0.90 + 0.1 x (0.8 x 2.5 mA/MHz x 4 MHz
+ 0.15 x 1.5 mA/MHz x 4 MHz
+ 24 mA) = 45 µA + 0.1 x (8 + 0.9 + 24) = 45 µA + 0.1 x 32.9 = 45 µA + 3.29 mA
= 3.34 mA
This is the operating power with no EEPROM writes or Flash erases. Calculation is based on I
OUT
= 0 mA.
Example of PSD813F1 Typical Power Calculation at VCC= 5.0 V
AC/DC Parameters
(cont.)
Page 84
PSD813F1-A Preliminary
80
NOTE: 1. Reset input has hysteresis. V
IL1
is valid at or below .2VCC–.1. V
IH1
is valid at or above .8VCC.
2. CSI deselected or internal Power Down mode is active.
3. PLD is in non-turbo mode and none of the inputs are switching
4. Refer to Figure 32 for PLD current calculation.
5. I
OUT
= 0 mA
Symbol Parameter Conditions Min Typ Max Unit
V
CC
Supply Voltage All Speeds 4.5 5 5.5 V
V
IH
High Level Input Voltage 4.5 V < VCC< 5.5 V 2 VCC+.5 V
V
IL
Low Level Input Voltage 4.5 V < VCC< 5.5 V –.5 0.8 V
V
IH1
Reset High Level Input Voltage (Note 1) .8 V
CC
VCC+.5 V
V
IL1
Reset Low Level Input Voltage (Note 1) –.5 .2 V
CC
–.1 V
V
HYS
Reset Pin Hysteresis 0.3 V
V
LKO
VCCMin for Flash Erase and Program 2.5 4.2 V
V
OL
Output Low Voltage
I
OL
= 20 µA, VCC= 4.5 V 0.01 0.1 V
IOL= 8 mA, VCC= 4.5 V 0.25 0.45 V
V
OH
Output High Voltage Except V
STBY
On
I
OH
= –20 µA, VCC= 4.5 V 4.4 4.49 V
IOH= –2 mA, VCC= 4.5 V 2.4 3.9 V
V
OH
1
Output High Voltage V
STBY
On I
OH
1
= 1 µA V
SBY
– 0.8 V
V
SBY
SRAM Standby Voltage 2.0 V
CC
V
I
SBY
SRAM Standby Current (V
STBY
Pin) VCC= 0 V 0.5 1 µA
I
IDLE
Idle Current (V
STBY
Pin) VCC> V
SBY
–0.1 0.1 µA
V
DF
SRAM Data Retention Voltage Only on V
STBY
2V
I
SB
Standby Supply Current for Power CSI > VCC–0.3 V
50 200 µA
Down Mode (Notes 2 and 3)
I
LI
Input Leakage Current VSS< V
IN
< V
CC
–1 ±.1 1 µA
I
LO
Output Leakage Current 0.45 < V
IN
< V
CC
–10 ±5 10 µA
ZPLD_TURBO = OFF,
0mA
f = 0 MHz (Note 5)
ZPLD Only
ZPLD_TURBO = ON, f = 0 MHz
400 700 µA/PT
I
CC
(DC) Operating Supply
During Flash or EEPROM,
(Note 5) Current
Flash or
Write/Erase Only 15 30 mA
EEPROM
Read Only, f = 0 MHz 0 0 mA
SRAM f = 0 MHz 0 0 mA
ZPLD AC Adder
Fig. 33
I
CC
(AC)
(Note 4)
(Note 5) FLASH or EEPROM AC Adder 2.5 3.5 mA/MHz
SRAM AC Adder 1.5 3.0 mA/MHz
PSD813F1 DC Characteristics (5 V ± 10% Versions)
Page 85
Preliminary PSD813F1-A
81
-90 -12 -15 Fast
PT TURBO Slew
Symbol Parameter Conditions Min Max Min Max Min Max Aloc OFF
* (Note 1) Unit
t
PD
CPLD Input Pin/Feedback to
25 30 32 Add 2 Add 10 Sub 2 ns
CPLD Combinatorial Output
t
EA
CPLD Input to CPLD Output Enable
26 30 32 Add 10 Sub 2 ns
t
ER
CPLD Input to CPLD Output Disable
26 30 32 Add 10 Sub 2 ns
t
ARP
CPLD Register Clear or Preset Delay
26 30 33 Add 10 Sub 2 ns
t
ARPW
CPLD Register Clear or
20 24 29 Add 10 ns
Preset Pulse Width
t
ARD
CPLD Array Delay
Any
16 18 22 Add 2 ns
MicroCell
CPLD Combinatorial Timing (5 V ± 10%)
NOTE: 1. Fast Slew Rate output available on PA[3:0], PB[3:0], and PD[2:0].
*ZPSD versions only.
PSD813F1 AC/DC
Parameters –
CPLD Timing
Parameters
(5 V ± 10% Versions)
Page 86
PSD813F1-A Preliminary
82
-90 -12 -15 Fast
PT TURBO Slew
Symbol Parameter Conditions Min Max Min Max Min Max Aloc OFF
*
(Note 1) Unit
Maximum Frequency External Feedback
1/(tS+tCO) 30.30 26.3 23.8 MHz
Maximum Frequency
f
MAX
Internal Feedback 1/(tS+tCO–10) 43.48 35.7 31.25 MHz (f
CNT
)
Maximum Frequency Pipelined Data
1/(tCH+tCL)
50.00 41.67 33.3 MHz
t
S
Input Setup Time 15 18 20 Add 2 Add 10 ns
t
H
Input Hold Time 0 0 0 ns
t
CH
Clock High Time Clock Input 10 12 15 ns
t
CL
Clock Low Time Clock Input 10 12 15 ns
t
CO
Clock to Output Delay Clock Input 18 20 22 Sub 2 ns
t
ARD
CPLD Array Delay Any MicroCell 16 18 22 Add 2 ns
t
MIN
Minimum Clock Period tCH+tCL(Note 2) 20 24 30 ns
CPLD Micro⇔Cell Synchronous Clock Mode Timing (5 V ± 10% Versions)
NOTES: 1. Fast Slew Rate output available on PA[3:0], PB[3:0], and PD[2:0].
2. CLKIN t
CLCL
= tCH+ tCL.
*ZPSD versions only.
PSD813F1 AC/DC
Parameters –
CPLD Timing
Parameters
(5 V ± 10% Versions)
Page 87
Preliminary PSD813F1-A
83
-90 -12 -15 PT TURBO Slew
Symbol Parameter Conditions Min Max Min Max Min Max Aloc OFF
* Rate Unit
Maximum Frequency External Feedback
1/(tSA+t
COA
) 26.32 23.25 20.4 MHz
Maximum Frequency
f
MAXA
Internal Feedback 1/(tSA+t
COA
–10) 35.71 30.30 25.64 MHz
(f
CNTA
)
Maximum Frequency Pipelined Data
1/(t
CHA+tCLA
) 41.67 35.71 33.3 MHz
t
SA
Input Setup Time 8 10 12 Add 2 Add 10 ns
t
HA
Input Hold Time 12 14 14 ns
t
CHA
Clock Input High Time 12 14 15 Add 10 ns
t
CLA
Clock Input Low Time 12 14 15 Add 10 ns
t
COA
Clock to Output Delay 30 33 37 Add 10 Sub 2 ns
t
ARDA
CPLD Array Delay Any MicroCell 16 18 22 Add 2 ns
t
MINA
Minimum Clock Period 1/f
CNTA
28 33 39 ns
CPLD Micro⇔Cell Asynchronous Clock Mode Timing (5 V ± 10% Versions)
*ZPSD versions only.
PSD813F1 AC/DC
Parameters –
CPLD Timing
Parameters
(5 V ± 10% Versions)
Page 88
PSD813F1-A Preliminary
84
-90 -12 15 PT TURBO
Symbol Parameter Conditions Min Max Min Max Min Max Aloc OFF
* Unit
t
IS
Input Setup Time (Note 1) 0 0 0 ns
t
IH
Input Hold Time (Note 1) 20 22 26 Add 10 ns
t
INH
NIB Input High Time (Note 1) 12 15 18 ns
t
INL
NIB Input Low Time (Note 1) 12 15 18 ns
t
INO
NIB Input to Combinatorial Delay (Note 1) 46 50 59 Add 2 Add 10 ns
Input Micro⇔Cell Timing (5 V ± 10% Versions)
NOTE: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE/AS latch timings refer to t
AVLX
and t
LXAX
.
*ZPSD versions only.
PSD813F1 AC/DC
Parameters –
CPLD Timing
Parameters
(5 V ± 10% Versions)
Page 89
Preliminary PSD813F1-A
85
AC Symbols for PLD Timing. Example:
t
AVLX
– Time from Address Valid to ALE Invalid.
Signal Letters
A – Address Input C – CEout Output D – Input Data E – E Input G – Internal WDOG_ON signal I – Interrupt Input L – ALE Input N – Reset Input or Output P – Port Signal Output Q – Output Data R – WR, UDS, LDS, DS, IORD, PSEN Inputs S – Chip Select Input T–R/W Input W–Internal PDN Signal B–Vstby Output M – Output MicroCell
Signal Behavior
t – Time L – Logic Level Low or ALE H – Logic Level High V – Valid X – No Longer a Valid Logic Level Z – Float PW – Pulse Width
Microcontroller Interface – AC/DC Parameters
(5V ± 10% Versions)
Page 90
PSD813F1-A Preliminary
86
NOTES: 1. RD timing has the same timing as DS, LDS, UDS, and PSEN signals.
2. RD and PSEN have the same timing.
3. Any input used to select an internal PSD813F function.
4. In multiplexed mode, latched addresses generated from ADIO delay to address output on any Port.
5. RD timing has the same timing as DS, LDS, and UDS signals.
6. In Turbo Off mode, add 10ns to t
AVQV
.
-90 -12 -15
Turbo
Symbol Parameter Conditions Min Max Min Max Min Max Off Unit
t
LVLX
ALE or AS Pulse Width 20 22 28 ns
t
AVLX
Address Setup Time (Note 3) 6 8 10 ns
t
LXAX
Address Hold Time (Note 3) 8 9 11 ns
t
AVQV
Address Valid to Data Valid (Notes 3 and 6) 90 120 150 Add 10 ns
t
SLQV
CS Valid to Data Valid 100 135 150 ns RD to Data Valid 8-Bit Bus (Note 5) 32 35 40 ns
t
RLQV
RD or PSEN to Data Valid 8-Bit Bus, 8031, 80251
(Note 2) 38 42 45 ns
t
RHQX
RD Data Hold Time (Note 1) 0 0 0 ns
t
RLRH
RD Pulse Width (Note 1) 32 35 38 ns
t
RHQZ
RD to Data High-Z (Note 1) 25 29 33 ns
t
EHEL
E Pulse Width 32 36 38 ns
t
THEH
R/W Setup Time to Enable 10 13 18 ns
t
ELTL
R/W Hold Time After Enable 0 0 0 ns
t
AVPV
Address Input Valid to
(Note 4) 25 28 32 ns
Address Output Delay
Read Timing (5 V ± 10% Versions)
Microcontroller Interface – PSD813F1 AC/DC Parameters
(5V ±10% Versions)
Page 91
Preliminary PSD813F1-A
87
-90 -12 -15
Symbol Parameter Conditions Min Max Min Max Min Max Unit
t
LVLX
ALE or AS Pulse Width 20 22 28
t
AVLX
Address Setup Time (Note 1) 6 8 10 ns
t
LXAX
Address Hold Time (Note 1) 8 9 11 ns
t
AVWL
Address Valid to Leading Edge of WR
(Notes 1 and 3) 15 18 20 ns
t
SLWL
CS Valid to Leading Edge of WR (Note 3) 15 18 20 ns
t
DVWH
WR Data Setup Time (Note 3) 35 40 45 ns
t
WHDX
WR Data Hold Time (Note 3) 5 5 5 ns
t
WLWH
WR Pulse Width (Note 3) 35 40 45 ns
t
WHAX
1
Trailing Edge of WR to Address Invalid
(Note 3) 8 9 10 ns
t
WHAX
2
Trailing Edge of WR to DPLD Address Input Invalid
(Notes 3 and 6) 0 0 0 ns
t
WHPV
Trailing Edge of WR to Port Output Valid Using I/O Port Data Register
(Note 3) 30 35 38 ns
t
WLMV
WR Valid to Port Output Valid Using MicroCell Register Preset/Clear
(Notes 3 and 4) 55 60 65 ns
Data Valid to Port Output Valid
t
DVMV
Using MicroCell Register (Notes 3 and 5) 55 60 65 ns Preset/Clear
t
AVPV
Address Input Valid to Address
(Note 2) 25 28 30 ns
Output Delay
Write, Erase and Program Timing (5 V ± 10% Versions)
NOTES: 1. Any input used to select an internal PSD813F function.
2. In multiplexed mode, latched addresses generated from ADIO delay to address output on any Port.
3. WR timing has the same timing as E, LDS, UDS, WRL, and WRH signals.
4. Assuming data is stable before active write signal.
5. Assuming write is active before data becomes valid.
6. Address Hold Time for DPLD inputs that are used to generate chip selects for internal PSD memory.
Microcontroller Interface – PSD813F1 AC/DC Parameters
(5V ±10% Versions)
Page 92
PSD813F1-A Preliminary
88
-90 -12 -15
Turbo
Symbol Parameter Conditions Min Max Min Max Min Max Off Unit
t
AVQV (PA)
Address Valid to Data Valid
(Note 3) 40 45 45 Add 10 ns
t
SLQV (PA)
CSI Valid to Data Valid 35 40 45 Add 10 ns RD to Data Valid (Notes 1 and 4) 32 35 40 ns
t
RLQV (PA)
RD to Data Valid 8031 Mode 38 42 45 ns
t
DVQV (PA)
Data In to Data Out Valid 30 35 38 ns
t
QXRH (PA)
RD Data Hold Time 0 0 0 ns
t
RLRH (PA)
RD Pulse Width (Note 1) 32 35 38 ns
t
RHQZ (PA)
RD to Data High-Z (Note 1) 25 28 30 ns
Port A Peripheral Data Mode Read Timing (5 V ± 10%)
-90 -12 -15
Symbol Parameter Conditions Min Max Min Max Min Max Unit
t
WLQV (PA)
WR to Data Propagation Delay (Note 2) 35 38 40 ns
t
DVQV (PA)
Data to Port A Data Propagation Delay
(Note 5) 30 35 38 ns
t
WHQZ (PA)
WR Invalid to Port A Tri-state (Note 2) 25 30 33 ns
Port A Peripheral Data Mode Write Timing (5 V ± 10%)
NOTES: 1. RD timing has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode) signals.
2. WR timing has the same timing as E, LDS, UDS, WRL, and WRH signals.
3. Any input used to select Port A Data Peripheral Mode.
4. Data is already stable on Port A.
5. Data stable on ADIO pins to data on Port A.
Microcontroller Interface – PSD813F1 AC/DC Parameters
(5V ±10% Versions)
Page 93
Preliminary PSD813F1-A
89
Symbol Parameter Conditions Min Typ Max Unit
t
NLNH
Warm RESET Active Low Time (Note 1) 150 ns
t
OPR
RESET High to Operational Device 120 ns
t
NLNH-PO
Power On Reset Active Low Time
1ms
(Note 2)
Reset Timing (5 V ± 10%)
NOTE: 1. t
CLCL
is the CLKIN clock period.
Microcontroller Interface – PSD813F1 AC/DC Parameters
(5V ±10% Versions)
Symbol Parameter Conditions Min Typ Max Unit
t
BVBH
Vstby Detection to Vstbyon Output High 20 µs
t
BXBL
V
stby
Off Detection to V
stbyon
Output Low
20 µs
V
stbyon
Timing (5 V ± 10%)
-90 -12 -15
Symbol Parameter Conditions Min Max Min Max Min Max Unit
t
LVDV
ALE Access Time from Power Down
90 120 150 ns
Maximum Delay from
t
CLWH
APD Enable to Internal Using CLKIN Input 15 * t
CLCL
(Note 1) µs
PDN Valid Signal
Power Down Timing (5 V ± 10%)
NOTE: 1. RESET will not reset Flash or EEPROM programming/erase cycles.
2. tNLNH-PO is 10 ms for devices manufactured before rev. A.
Page 94
PSD813F1-A Preliminary
90
-90 -12 -15
Symbol Parameter Conditions Min Max Min Max Min Max Unit
t
ISCCF
TCK Clock Frequency (except for PLD) (Note 1) 18 16 14 MHz
t
ISCCH
TCK Clock High Time (Note 1) 26 29 31 ns
t
ISCCL
TCK Clock Low Time (Note 1) 26 29 31 ns
t
ISCCF-P
TCK Clock Frequency (for PLD only) (Note 2) 2 2 2 MHz
t
ISCCH-P
TCK Clock High Time (for PLD only) (Note 2) 240 240 240 ns
t
ISCCL-P
TCK Clock Low Time (for PLD only) (Note 2) 240 240 240 ns
t
ISCPSU
ISC Port Set Up Time 8 10 10 ns
t
ISCPH
ISC Port Hold Up Time 5 5 5 ns
t
ISCPCO
ISC Port Clock to Output 23 24 25 ns
t
ISCPZV
ISC Port High-Impedance to Valid Output
23 24 25 ns
t
ISCPVZ
ISC Port Valid Output to High-Impedance 23 24 25 ns
ISC Timing (5 V ± 10%)
Microcontroller Interface – PSD813F1 AC/DC Parameters
(5V ±10% Versions)
Symbol Parameter Min Typ Max Unit
Flash Program 8.5 sec Flash Bulk Erase (Preprogrammed) (Note 1) 3 30 sec Flash Bulk Erase (Not Preprogrammed) 10 sec
t
WHQV3
Sector Erase (Preprogrammed) 1 30 sec
t
WHQV2
Sector Erase (Not Preprogrammed) 2.2 sec
t
WHQV1
Byte Program 14 1200 µs Program/Erase Cycles (Per Sector) 100,000 cycles
t
WHWLO
Sector Erase Time-Out 100 µs
t
Q7VQV
DQ7 Valid to Output (DQ7-0) Valid
30 ns
(Data Polling) (Note 2)
Flash Program, Write and Erase Times (5 V ± 10%)
NOTES: 1. Programmed to all zeros before erase.
2. The Polling Status DQ7 is valid t
Q7VQV
ns, before the data byte DQ0-7 is valid for reading.
Symbol Parameter Min Typ Max Unit
t
EEHWL
Write Protect After Power Up 5 msec
t
BLC
EEPROM Byte Load Cycle Timing (Note 1) 0.2 120 µsec
t
WCB
EEPROM Byte Write Cycle Time 4 10 msec
t
WCP
EEPROM Page Write Cycle Time (Note 2) 6 30 msec Program/Erase Cycles (Per Sector) 10,000 cycles
EEPROM Write Times (5 V ± 10%)
NOTES: 1. If the maximum time has elapsed between successive writes to an EEPROM page, the transfer of this data to EEPROM cells will
begin. Also, bytes cannot be written (loaded) to a page any faster than the indicated minimum type.
2. These specifications are for writing a page to EEPROM cells.
NOTES: 1. For “non-PLD” programming, erase or in ISC by-pass mode.
2. For program or erase PLD only.
Page 95
Preliminary PSD813F1-A
91
Symbol Parameter Conditions Min Typ Max Unit
V
CC
Supply Voltage All Speeds 3.0 3.6 V
V
IH
High Level Input Voltage 3.0 V < VCC< 3.6 V .7 V
CC
VCC+.5 V
V
IL
Low Level Input Voltage 3.0 V < VCC< 3.6 V –.5 0.8 V
V
IH1
Reset High Level Input Voltage (Note 1) .8 V
CC
VCC+.5 V
V
IL1
Reset Low Level Input Voltage (Note 1) –.5 .2 V
CC
–.1 V
V
HYS
Reset Pin Hysteresis 0.3 V
V
LKO
VCCMin for Flash Erase and Program 1.5 2.2 V
V
OL
Output Low Voltage
I
OL
= 20 µA, VCC= 3.0 V 0.01 0.1 V
IOL= 4 mA, VCC= 3.0 V 0.15 0.45 V
V
OH
Output High Voltage Except V
STBY
On
I
OH
= –20 µA, VCC= 3.0 V 2.9 2.99 V
IOH= –1 mA, VCC= 3.0 V 2.7 2.8 V
V
OH
1
Output High Voltage V
STBY
On I
OH
1
= 1 µA V
SBY
– 0.8 V
V
SBY
SRAM Standby Voltage 2.0 V
CC
V
I
SBY
SRAM Standby Current VCC= 0 V 0.5 1 µA
I
IDLE
Idle Current (V
STBY
Pin) VCC> V
SBY
–0.1 0.1 µA
V
DF
SRAM Data Retention Voltage Only on V
STBY
2V
I
SB
Standby Supply Current
CSI >V
CC
–0.3 V (Note 2) 25 100 µA
for Power Down Mode
I
LI
Input Leakage Current VSS< V
IN
< V
CC
–1 ±.1 1 µA
I
LO
Output Leakage Current 0.45 < V
IN
> V
CC
–10 ±5 10 µA
ZPLD_TURBO = OFF, f = 0 MHz (Note 3)
0mA
ZPLD Only
ZPLD_TURBO = ON,
ICC(DC) Operating
f = 0 MHz
200 400 µA/PT
(Note 3) Supply Current During FLASH or
FLASH or EEPROM EEPROM Write/Erase Only
10 25 mA
Read Only, f = 0 MHz 0 0 mA
SRAM f = 0 MHz 0 0 mA
ZPLD AC Adder Figure 34a
I
CC
(AC) FLASH or
(Note 3) EEPROM 1.5 2.0 mA/MHz
AC Adder SRAM AC Adder 0.8 1.5 mA/MHz
PSD813F1V DC Characteristics (3.0 V to 3.6 V Versions)
NOTES: 1. Reset input has hysteresis. V
IL1
is valid at or below .2VCC–.1. V
IH1
is valid at or above .8VCC.
2. CSI deselected or internal PD is active.
3. I
OUT
= 0 mA
Page 96
PSD813F1-A Preliminary
92
PSD813F1V AC/DC Parameters – CPLD Timing Parameters
(3.0 V to 3.6 V Versions)
-15 -20 Slew
PT TURBO Rate
Symbol Parameter Conditions Min Max Min Max Aloc OFF
* (Note 1) Unit
CPLD Input Pin/Feedback to
t
PD
CPLD Combinatorial Output
48 55 Add 4 Add 20 Sub 6 ns
t
EA
CPLD Input to CPLD Output Enable
43 50 Add 20 Sub 6 ns
t
ER
CPLD Input to CPLD Output Disable
43 50 Add 20 Sub 6 ns
t
ARP
CPLD Register Clear or Preset Delay
48 55 Add 20 Sub 6 ns
t
ARPW
CPLD Register Clear or
30 35 Add 20 ns
Preset Pulse Width
t
ARD
CPLD Array Delay Any MicroCell 29 33 Add 4 ns
CPLD Combinatorial Timing (3.0 V to 3.6 V Versions)
-15 -20 Slew
PT TURBO Rate
Symbol Parameter Conditions Min Max Min Max Aloc OFF
* (Note 1) Unit
Maximum Frequency External Feedback
1/(tS+tCO) 17.8 14.7 MHz
Maximum Frequency
f
MAX
Internal Feedback (f
CNT
)
1/(tS+tCO–10) 19.6 17.2 MHz
Maximum Frequency Pipelined Data
1/(tCH+tCL) 33.3 31.2 MHz
t
S
Input Setup Time 27 35 Add 4 Add 20 ns
t
H
Input Hold Time 0 0 ns
t
CH
Clock High Time Clock Input 15 16 ns
t
CL
Clock Low Time Clock Input 15 16 ns
t
CO
Clock to Output Delay Clock Input 35 39 Sub 6 ns
t
ARD
CPLD Array Delay Any MicroCell 29 33 Add 4 ns
t
MIN
Minimum Clock Period tCH+tCL(Note 2) 29 32 ns
CPLD Micro⇔Cell Synchronous Clock Mode Timing (3.0 V to 3.6 V Versions)
NOTES: 1. Fast Slew Rate output available on PA[3:0], PB[3:0], and PD[2:0].
2. CLKIN t
CLCL
= tCH+ tCL.
*ZPSD versions only.
NOTE: 1. Fast Slew Rate output available on PA[3:0], PB[3:0], and PD[2:0].
*ZPSD versions only.
Page 97
Preliminary PSD813F1-A
93
-15 -20 PT TURBO Slew
Symbol Parameter Conditions Min Max Min Max Aloc OFF
* Rate Unit
Maximum Frequency External Feedback
1/(tSA+t
COA
) 19.2 16.9 MHz
Maximum Frequency
f
MAXA
Internal Feedback (f
CNTA
)
1/(tSA+t
COA
–10)
23.8 20.4 MHz
Maximum Frequency Pipelined Data
1/(t
CHA+tCLA
) 27 24.4 MHz
t
SA
Input Setup Time 12 13 Add 4 Add 20 ns
t
HA
Input Hold Time 15 17 ns
t
CHA
Clock High Time 22 25 Add 20 ns
t
CLA
Clock Low Time 15 16 Add 20 ns
t
COA
Clock to Output Delay 40 46 Add 20 Sub 6 ns
t
ARD
CPLD Array Delay Any MicroCell 29 33 Add 4 ns
t
MINA
Minimum Clock Period 1/f
CNTA
42 49 ns
CPLD Micro⇔Cell Asynchronous Clock Mode Timing (3.0 V to 3.6 V Versions)
NOTE: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE latch timings refer to t
AVLX
and t
LXAX
.
*ZPSD Versions Only.
-15 -20 PT TURBO
Symbol Parameter Conditions Min Max Min Max Aloc OFF
* Unit
t
IS
Input Setup Time (Note 1) 0 0 ns
t
IH
Input Hold Time (Note 1) 25 30 Add 20 ns
t
INH
NIB Input High Time (Note 1) 13 15 ns
t
INL
NIB Input Low Time (Note 1) 13 15 ns
t
INO
NIB Input to Combinatorial Delay
(Note 1) 62 70 Add 4 Add 20 ns
Input Micro⇔Cell Timing (3.0 V to 3.6 V Versions)
PSD813F1V AC/DC Parameters – CPLD Timing Parameters
(3.0 V to 3.6 V Versions)
*ZPSD Versions Only.
Page 98
PSD813F1-A Preliminary
94
AC Symbols for PLD Timing. Example:
t
AVLX
– Time from Address Valid to ALE Invalid.
Signal Letters
A – Address Input C – CEout Output D – Input Data E – E Input G – Internal WDOG_ON signal I – Interrupt Input L – ALE Input N – Reset Input or Output P – Port Signal Output Q – Output Data R – WR, UDS, LDS, DS, IORD, PSEN Inputs S – Chip Select Input T–R/W Input W–Internal PDN Signal B–Vstby Output M – Output MicroCell
Signal Behavior
t – Time L – Logic Level Low or ALE H – Logic Level High V – Valid X – No Longer a Valid Logic Level Z – Float PW – Pulse Width
Microcontroller Interface – PSD813F1V AC/DC Parameters
(3.0 V to 3.6 V Versions)
Page 99
Preliminary PSD813F1-A
95
-15 -20
Turbo
Symbol Parameter Conditions Min Max Min Max Off Unit
t
LVLX
ALE or AS Pulse Width 26 30 ns
t
AVLX
Address Setup Time (Note 3) 10 12 ns
t
LXAX
Address Hold Time (Note 3) 12 14 ns
t
AVQV
Address Valid to Data Valid (Notes 3 and 6) 150 200 Add 20 ns
t
SLQV
CS Valid to Data Valid 150 200 ns RD to Data Valid 8-Bit Bus (Note 5) 35 40 ns
t
RLQV
RD or PSEN to Data Valid 8-Bit Bus, 8031, 80251
(Note 2) 50 55 ns
t
RHQX
RD Data Hold Time (Note 1) 0 0 ns
t
RLRH
RD Pulse Width (also DS, LDS, UDS) 40 45 ns RD or PSEN Pulse Width (8031, 80251) 55 60 ns
t
RHQZ
RD to Data High-Z (Note 1) 40 45 ns
t
EHEL
E Pulse Width 45 52 ns
t
THEH
R/W Setup Time to Enable 18 20 ns
t
ELTL
R/W Hold Time After Enable 0 0 ns
t
AVPV
Address Input Valid to
(Note 4) 35 40 ns
Address Output Delay
Read Timing (3.0 V to 3.6 V Versions)
Microcontroller Interface – PSD813F1V AC/DC Parameters
(3.0 V to 3.6 V Versions)
NOTES: 1. RD timing has the same timing as DS, LDS, UDS, and PSEN signals.
2. RD and PSEN have the same timing for 8031.
3. Any input used to select an internal PSD813F function.
4. In multiplexed mode latched address generated from ADIO delay to address output on any Port.
5. RD timing has the same timing as DS, LDS, and UDS signals.
6. In Turbo Off mode, add 20ns to t
AVQV
.
Page 100
PSD813F1-A Preliminary
96
-15 -20
Symbol Parameter Conditions Min Max Min Max Unit
t
LVLX
ALE or AS Pulse Width 26 30
t
AVLX
Address Setup Time (Note 1) 10 12 ns
t
LXAX
Address Hold Time (Note 1) 12 14 ns
t
AVWL
Address Valid to Leading Edge of WR
(Notes 1 and 3) 20 25 ns
t
SLWL
CS Valid to Leading Edge of WR (Note 3) 20 25 ns
t
DVWH
WR Data Setup Time (Note 3) 45 50 ns
t
WHDX
WR Data Hold Time (Note 3) 8 10 ns
t
WLWH
WR Pulse Width (Note 3) 48 53 ns
t
WHAX
1
Trailing Edge of WR to Address Invalid (Note 3) 12 17 ns
t
WHAX2
Trailing Edge of WR to DPLD Address Input Invalid
(Notes 3 and 6) 0 0 ns
t
WHPV
Trailing Edge of WR to Port Output Valid Using I/O Port Data Register
(Note 3) 45 50 ns
t
WLMV
WR Valid to Port Output Valid Using MicroCell Register Preset/Clear
(Notes 3 and 4) 90 100 ns
t
DVMV
Data Valid to Port Output Valid Using MicroCell Register Preset/Clear
(Notes 3 and 5) 90 100 ns
t
AVPV
Address Input Valid to Address
(Note 2) 48 55 ns
Output Delay
Write, Erase and Program Timing (3.0 V to 3.6 V Versions)
NOTES: 1. Any input used to select an internal PSD813F function.
2. In multiplexed mode, latched addresses generated from ADIO delay to address output on any Port.
3. WR timing has the same timing as E, LDS, UDS, WRL, and WRH signals.
4. Assuming data is stable before active write signal.
5. Assuming write is active before data becomes valid.
6. Address Hold Time for DPLD inputs that are used to generate chip selects for internal PSD memory.
Microcontroller Interface – PSD813F1V AC/DC Parameters
(3.0 V to 3.6 V Versions)
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