Datasheet PS7141-2A, PS7141-2B, PS7141L-1A, PS7141L-1B, PS7141L-1C Datasheet (NEC)

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DATA SHEET
Solid State Relay
OCMOS FET
PS7141C-2A,PS7141CL-2A
2-ch Optical Coupled MOS FET
DESCRIPTION
The PS7141C-2A and PS7141CL-2A are solid state relays containing GaAs LEDs on the light emitting side (input side) and MOS FETs including current control circuit on the output side. Current control circuit of OCMOS FET protects this device from thermal breakdown and output circuit.
They are suitable for analog signal control because of their low offset and high linearity.
The PS7141CL-2A has a surface mount type lead.
FEATURES
• Limit current (I
• 2 channel type (1 a + 1 a output)
• Low LED operating current (IF = 2 mA)
• Designed for AC/DC switching line changer
• Small package (8-pin DIP)
• Low offset voltage
• PS7141CL-2A: Surface mount type
LMT
= 170 to 250 mA)
APPLICATIONS
• Exchange equipment
• Measurement equipment
• FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P13861EJ6V0DS00 (6th edition) Date Published December 1999 NS CP(K) Printed in Japan
The mark
••••
shows major revised points.
©
1998, 1999
PACKAGE DIMENSIONS (in millimeters)
PS7141C-2A,PS7141CL-2A
PS7141C-2A
3.5±0.3
4.15±0.3
3.3±0.3
0.5±0.1
1.34±0.1
0.25 M
9.25±0.5
2.54
87
12 43
PS7141CL-2A
TOP VIEW
65
7.62
6.5±0.5
0 to 15˚
1. LED Anode
2. LED Cathode
3. LED Anode
4. LED Cathode
5. MOS FET
6. MOS FET
7. MOS FET
8. MOS FET
3.5±0.3
1.34±0.1
0.25 M
9.25±0.5
2.54
87
12 43
0.9±0.25
TOP VIEW
65
6.5±0.5
9.60±0.4
1. LED Anode
2. LED Cathode
3. LED Anode
4. LED Cathode
5. MOS FET
6. MOS FET
7. MOS FET
8. MOS FET
+0.10
–0.05
0.10
2
Data Sheet P13861EJ6V0DS00
ORDERING INFORMATION
PS7141C-2A,PS7141CL-2A
Part Number Package Packing Style
Application Part Number PS7141C-2A 8-pin DIP Magazine case 50 pcs PS7141C-2A PS7141CL-2A PS7141CL-2A PS7141CL-2A-E3 Embossed Tape 1 000 pcs/reel PS7141CL-2A-E4
For the application of the Safety Standard, following part number should be used.
*1
ABSOLUTE MAXIMUM RATINGS (TA = 25 °°°°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current (DC) I
Reverse Voltage V Power Dissipation P Peak Forward Current
*1
MOS FET Break Down Voltage V
Continuous Load Current I Pulse Load Current
*2
(AC/DC Connection) Power Dissipation P
Isolation Voltage
*3
Total Power Dissipat i on P Operating Ambient Temperature T Storage Temperature T
F
R
D
FP
I
L
L
LP
I
D
50 mA
5.0 V 50 mW/ch
1A 400 V 120 mA 120 mA
375 mW/ch
BV 1 500 Vr.m.s.
T
A
stg
850 mW
40 to +80
40 to +100
°
C
°
C
*1
PW = 100 µs, Duty Cycle = 1 %
*1
PW = 100 ms, 1 shot
*2
AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
*3
RECOMMENDED OPERATING CONDITIONS (TA = 25 °°°°C)
Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current I LED Off Voltage V
F
F
21020mA
00.5V
Data Sheet P13861EJ6V0DS00
3
ELECTRICAL CHARACTERISTICS (TA = 25 °°°°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
PS7141C-2A,PS7141CL-2A
Diode Forward Voltage V
Reverse Current I
MOS FET Off-state Leakage Current I
Output Capacitance C
Coupled LED On-state Current I
On-state Resistance R
R Turn-on Time Turn-off Time
*1
*1
Isolation Resistance R Isolation Capacitance C Limit Current I
Test Circuit for Switching Time
*1
I
F
Pulse Input
F
IF = 10 mA 1.2 1.4 V
R
VR = 5 V 5.0
Loff
VD = 400 V 0.03 1.0
out
VD = 0 V, f = 1 MHz 65 pF/ch
FonIL
on
t
off
t
LMTIF
= 120 mA 2.0 mA
on1IF
= 10 mA, IL = 10 mA 26 35
on2IF
= 10 mA, IL = 120 mA, t ≤ 10 ms 22 30
IF = 10 mA, VO = 5 V, PW ≥ 10 ms 0.6 2. 0 ms
0.03 1.0
I-O
I-O
V
= 1.0 kV
I-O
V = 0 V, f = 1 MHz 1.1 pF/ch
DC
10
9
= 10 mA, t = 5 ms, VL = 6 V 170 200 250 mA/ch
V
L
Input
50 %
µ
A
µ
A
0
Input monitor monitorV
R
in
R
L
O
VO = 5 V
90 %
Output
10 %
t
on
t
off
4
Data Sheet P13861EJ6V0DS00
PS7141C-2A,PS7141CL-2A
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE
100
(mA)
80
F
60
40
20
Maximum Forward Current I
0
Ambient Temperature TA (˚C)
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
1.8 IF = 50 mA
30 mA 20 mA 10 mA
5 mA 1 mA
(V)
F
1.6
1.4
1.2
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
300
(mA)
L
200
100
Maximum Load Current I
80
7550250–25
100
0
80
750–25 5025
100
Ambient Temperature TA (˚C)
OUTPUT CAPACITANCE vs. APPLIED VOLTAGE
200
(pF)
150
out
100
f = 1 MHz
Forward Voltage V
1.0
0.8
0–25 25 50 75 Ambient Temperature TA (˚C)
OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE
–5
10
(A)
Loff
–6
10
–7
10
–8
10
Off-state Leakage Current I
–9
10
1000 200 300 400
Applied Voltage VD (V)
TA = 80 ˚C
25 ˚C
100
500
50
Output Capacitance C
0
20 40 60 80 100 120
Applied Voltage VD (V)
LOAD CURRENT vs. LOAD VOLTAGE
IF = 10 mA, t = 5 ms
(mA)
L
–8.0 –4.0 0 8.04.0
Load Current I
200
100
–100
–200
Load Voltage VL (V)
Data Sheet P13861EJ6V0DS00
5
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
3.0
on
2.5
2.0
Normalized to 1.0
A
= 25 ˚C,
at T I
F
= 10 mA,
L
= 10 mA
I
PS7141C-2A,PS7141CL-2A
ON-STATE RESISTANCE DISTRIBUTION
30
25
20
n = 50 pcs, I
F
= 10 mA,
L
= 10 mA
I
1.5
1.0
0.5
Normalized On-state Resistance R
0.0
Ambient Temperature TA (˚C)
TURN-ON TIME vs. FORWARD CURRENT
6
VO = 5 V
5
(ms)
4
on
3
2
Turn-on Time t
1
0
Forward Current IF (mA)
252015105
15
Number (pcs)
10
5
100755025–25 0
0
25 26
On-state Resistance Ron ()
TURN-OFF TIME vs. FORWARD CURRENT
0.30 V
O
= 5 V
0.25
0.20
(ms)
off
0.15
0.10
Turn-off Time t
0.05
30
0
Forward Current IF (mA)
30252015105
30
25
20
15
Number (pcs)
10
5
0
6
TURN-ON TIME DISTRIBUTION
n = 50 pcs, I
F
= 10 mA,
O
= 5 V
V
0.6 0.7
Turn-on Time ton (ms)
30
25
20
15
Number (pcs)
10
Data Sheet P13861EJ6V0DS00
TURN-OFF TIME DISTRIBUTION
5
0
0.03 0.06
Turn-off Time t
off
(ms)
n = 50 pcs, I
F
= 10 mA,
O
= 5 V
V
PS7141C-2A,PS7141CL-2A
NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE
3.0
on
2.5
2.0
1.5
1.0
0.5
Normalized Turn-on Time t
0.0 0–25 25 50 75
Ambient Temperature TA (˚C)
Normalized to 1.0 at TA = 25 ˚C, I VO = 5 V
NORMALIZED LIMIT CURRENT vs. AMBIENT TEMPERTURE
LMT
3.0
2.5
2.0
Normalized to 1.0 at TA = 25 ˚C, I t = 5 ms, VL = 6 V
F = 10 mA,
F = 10 mA,
100
NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE
3.0
off
2.5
2.0
1.5
1.0
0.5
Normalized Turn-off Time t
0.0 0–25 25 50 75
Ambient Temperature TA (˚C)
Normalized to 1.0 at T IF = 10 mA, VO = 5 V
A = 25 ˚C,
100
1.5
1.0
0.5
Normalized Limit Current I
0.0
Remark
0–25 25 50 75 Ambient Temperature TA (˚C)
The graphs indicate nominal characteristics.
100
Data Sheet P13861EJ6V0DS00
7
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
1.55±0.1
12.0±0.1
Tape Direction
1.55±0.1
10.4±0.1
PS7141C-2A,PS7141CL-2A
1.75±0.1
7.5±0.1
16.0±0.3
4.3±0.2
10.3±0.1
0.3
PS7141CL-2A-E3 PS7141CL-2A-E4
Outline and Dimensions (Reel)
R 1.0
2.0±0.5
13.0±0.5
φ
21.0±0.8
φ
330
φ
80.0±5.0
φ
1.5
+2.0
16.4
–0.0
Packing: 1 000 pcs/reel
8
Data Sheet P13861EJ6V0DS00
PS7141C-2A,PS7141CL-2A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature 235 °C (package surface temperature)
• Time of temperature higher than 210 °C 30 seconds or less
• Number of reflows Two
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature) 210 ˚C
to 30 s
100 to 160 ˚C
60 to 120 s
(preheating)
Package Surface Temperature T (˚C)
Time (s)
(2) Dip soldering
• Temperature 260 °C or below (molten solder temperature)
• Time 10 seconds or less
• Number of times One
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
•Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
Data Sheet P13861EJ6V0DS00
9
[MEMO]
PS7141C-2A,PS7141CL-2A
10
Data Sheet P13861EJ6V0DS00
[MEMO]
PS7141C-2A,PS7141CL-2A
Data Sheet P13861EJ6V0DS00
11
PS7141C-2A,PS7141CL-2A
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
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M7 98. 8
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