Datasheet PRF949 Datasheet (Philips)

DISCRETE SEMICONDUCTORS
M3D173
DATA SHEET
PRF949
UHF wideband transistor
Preliminary specification 1999 Oct 29
UHF wideband transistor PRF949
FEATURES
Small size
Low noise
Low distortion
High gain
Gold metallization ensures excellent reliability.
APPLICATIONS
Communication and instrumentation systems.
DESCRIPTION
Silicon NPN transistor in a surface mount 3-pin SOT416 (SC75) package. The transistor is primarily intended for wideband applications in the GHz-range in the RF front end of analog and digital cellular telephones, cordless phones, radar detectors, pagers and satellite TV-tuners.
QUICK REFERENCE DATA
PINNING SOT416 (SC75)
PIN DESCRIPTION
1base 2 emitter 3 collector
handbook, halfpage
12
Marking code: V0
3
Fig.1 Simplified outline (SOT416).
MAM337
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
C
re
f
T
G
UM
NF noise figure Γ
feedback capacitance IC=0; VCB=6V; f=1MHz 0.3 tbf pF transition frequency IC=15mA; VCE=6V; fm=1GHz 7 9 GHz maximum unilateral power gain IC=15mA; VCE=6V;
T
=25°C; f = 1 GHz
amb
= Γ
S
; IC=5mA; VCE=6V;
opt
16 dB
1.5 2.5 dB
f=1GHz P R
tot
th j-s
total power dissipation Ts=90°C; note 1 −−180 mW thermal resistance from junction
P
= 180 mW −−335 K/W
tot
to soldering point
Note
is the temperature at the soldering point of the collector pin.
1. T
s
1999 Oct 29 2
Philips Semiconductors Preliminary specification
UHF wideband transistor PRF949
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
C(AV)
P
tot
T
stg
T
j
Note
1. T
s
collector-base voltage open emitter 20 V collector-emitter voltage open base 10 V emitter-base voltage open collector 1.5 V DC collector current 50 mA average collector current 50 mA total power dissipation Ts=60°C; note 1 250 mW storage temperature −65 +150 °C junction temperature 175 °C
is the temperature at the soldering point of the collector pin.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s
thermal resistance from junction
P
= 180 mW; Ts=90°C; note 1 335 K/W
tot
to soldering point
Note
1. T
is the temperature at the soldering point of the collector pin.
s
1999 Oct 29 3
Philips Semiconductors Preliminary specification
UHF wideband transistor PRF949
CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
DC characteristics
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
V
BEF
I
CBO
I
EBO
h
FE
AC characteristics
C
re
f
T
2
|s
|
21
G
UM
NF noise figure Γ
collector-base breakdown voltage IC=100µA; IE=0 20 −−V collector-emitter breakdown
IC=100µA; IB=0 10 −−V
voltage emitter-base breakdown voltage IE=10µA; IC=0 1.5 −−V forward base-emitter voltage IE=25mA −−1.05 V collector-base leakage current VCB=10V; IE=0 −−100 nA emitter-base leakage current VEB=1V; IC=0 −−100 nA DC current gain IC=5mA; VCE= 6 V 100 150 200
=15mA; VCE=6V 150
I
C
feedback capacitance IC=0; VCB=6V; f=1MHz 0.3 tbf pF transition frequency IC=15mA; VCE=6V; fm=1GHz 7 9 GHz insertion gain IC=15mA; VCE= 6 V; f = 1 GHz 13 15 dB maximum unilateral power gain;
note 1
IC=15mA; VCE=6V; T
=25°C; f = 1 GHz
amb
I
=15mA; VCE=6V;
C
=25°C; f = 2 GHz
T
amb
= Γ
S
; IC=5mA; VCE=6V;
opt
16 dB
10 dB
1.5 2.5 dB
f=1GHz
= Γ
Γ
S
; IC=5mA; VCE=6V;
opt
2.1 dB
f=2GHz
Note
1. G
is the maximum unilateral power gain, assuming s12 is zero.
UM
G
UM
--------------------------------------------------------
10
1s
()1s
2
s
21
2
11
()
22
dBlog=
2
1999 Oct 29 4
Philips Semiconductors Preliminary specification
UHF wideband transistor PRF949
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads SOT416
D
v M
A
3
12
e
b
1
p
e
w M
B
E
H
E
A
A
1
detail X
AB
L
p
X
Q
c
0 0.5 1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
0.95
mm
0.60
OUTLINE VERSION
SOT416 SC-75
max
0.1
b
cD
p
0.30
0.25
0.10
1.8
1.4
0.15
IEC JEDEC EIAJ
e
E
0.9 1
0.7
REFERENCES
0.5
e
H
L
Qw
1
1.75
1.45
p
E
0.45
0.23
0.15
0.13
v
0.2
0.2
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
1999 Oct 29 5
Philips Semiconductors Preliminary specification
UHF wideband transistor PRF949
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1999 Oct 29 6
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1999
Internet: http://www.semiconductors.philips.com
68
Printed in The Netherlands 125006/03/pp7 Date of release: 1999 Oct 29 Document order number: 9397 750 06402
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