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COMMUNICATIONS MODULES & SUBSYSTEMS
RoHS-Compliant Small Form Factor Solder-Down Cage
PL-KP1-00-000-06
Applications
• Switch and hub devices
• Mass storage systems interconnect
• Host adapter cards
• Enterprise switch interconnects
Key Features
The unique lead-free and RoHS-Compliant, pluggable,
one of JDSU’s complementary products to the Small Form Factor Pluggable (SFP)
transceivers. Its patented design enables enhanced EMI performance using improved
shielding between the cage and bezel. Optimized for use with all transceiver products complying with the SFP multisource agreement (MSA), the cage design allows
for low-cost implementation using standard manufacturing processes. Its hardened
spring-tempered material, plus excellent material memory characteristics, further
provide for consistent transceiver mate/de-mate performance that provides for port
fl exibility over the life of the system.
• Compatible with all MSA compliant SFP transceivers and
PCB layouts for single and double sided applications
• Enhanced EMI performance at data rates up to and above
4Gbps
• RoHS compliant and lead-free
solder-down cage represents
NORTH AMERICA: 800 498-JDSU (5378)
Highlights
• Industry’s most robust and sturdy cage design optimized for all SFP
applications, including Fibre Channel, Gigabit Ethernet, and SONET
• Enhanced EMI performance due to improved mechanical shielding
• Supports all industry SFP transceivers, using MSA-compliant board layouts and
hole sizes for single and double sided applications
• Extensive compatibility testing with industry-wide MSA-based modules for
interoperability in multiple vendor implementation
• Backward compatible design offers superior mechanical stability, simplifying
implementation to customer PCBs
• Tested for common applications and standard industry processes to allow
seamless integration into manufacturing without additional equipment or
requirements
WORLDWIDE: +800 5378-JDSU
WEBSITE: www.jdsu.com
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PL-KP1-00-000-06 Features
• RoHS-compliant and lead-free
• Superior EMI performance at 4Gbps
• Solder-down attachment
• Proven SFP MSA compliant
transceiver cage
• Supports MSA compliant board
layout and hole sizes
• Supports multiple system confi gurations
• Robust manufacturing process
• Sturdy construction
• Hardened spring tempered alloy
• Simple assembly
• Utilizes common manufacturing
equipment and processes
• 360 degree EMI contact fi ngers
• Low emission design
• FCC Class B compliant
ROHS-COMPLIANT SMALL FORM FACTOR
PLUGGABLE SOLDER-DOWN CAGE
15.02
48.73
9.60
DIMENSIONS IN MILLIMETERS
The PL-KP1-00-000-06 solder-down cage accommodates all MSA-compliant SFP
transceivers, and is ideally suited for application on printed circuit board (PCB) with a
minimum thickness of 0.062 inches.
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3
14.00
(
INSIDE
ROHS-COMPLIANT SMALL FORM FACTOR
PLUGGABLE SOLDER-DOWN CAGE
Section 1 Functional Description
The solder-down Cage is designed in compliance with the Small Form Factor Pluggable (SFP) Transceiver Multisource Agreement (MSA). See Figure 1.
48.73
14.70
)(
OUTSIDE
)
15.02
8.20
DIMENSIONS IN MILLIMETERS
Figure 1 Standard solder-down cage mechanical drawing (PL-KP1-00-000-06)
INSIDE
)8.90(
9.60
)(
OUTSIDE
2.35
5.00
6.40
9.50
3.66
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4
ROHS-COMPLIANT SMALL FORM FACTOR
PLUGGABLE SOLDER-DOWN CAGE
Section 2 Recommended OEM PCB
Layouts
2X
2X
37.10 2X
32.50 2X
30.90
30.00
27.50
MIN23.50
20.00
10.00
±0.104.50
2
7X
±0.050.95
M
A0.10
B
0
B
1
A
2.33 2X
0
0
MIN1.00
DIMENSIONS ARE IN MILLIMETERS
TYP
11.92 2X
14.25
A
MIN15.25
MIN
16.25
8X
1.05
2X
COMPONENT AND TRACE KEEPOUT
AREA. ALL EXPOSED METAL SHOULD
BE TIED TO CHASSIS GROUND
2
±0.05
M
A0.10
B
1.55±0.05
0.10
37.80
35.00
25.00
22.80
15.00
5.00
3
NOTES:
BMA
1
DATUM B TO BE ESTABLISHED BY CUSTOMER
NOTED PADS AND VIAS ARE PLATED AND TIED TO
2
CHASSIS GROUND. DIMENSIONS APPLY AFTER PLATING.
NOTED THRU HOLES ARE UNPLATED.
3
MIN
ELECTRICAL PAD LAYOUT PER SFP MSA.
4
Figure 2 Board layout
1.4
MIN
TYP
4.10
4.10 TYP
2.0 MIN TYP
COMPONENT KEEPOUT
AREA, TRACES OK.
Figure 3 Detail board layout
10.53
0.80 TYP
10.93
DETAIL A
SCALE 6 : 1
DIMENSIONS ARE IN MILLIMETERS
4
±0.030.50 TYP
0.06AB
MIN2.0 TYP
2
TYPMIN4.5
PLATED CHASSIS GROUND
PADS AND VIAS, TYP.
TYP
±0.05
2.00
L
0.10 A
2
2
B
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5
ROHS-COMPLIANT SMALL FORM FACTOR
PLUGGABLE SOLDER-DOWN CAGE
14.25
- A -
10.40 MAX
3.50±0.50
15.25±0.10
0.20 A
A
A
DIMENSIONS ARE IN MILLIMETERS
R0.5 MAX TYP
1.70
10.40±0.10
Figure 4 Recommended panel cut-out and PCB offset
1.0 MIN
0.40±0.10
3.50±0.50
SECTION A-A
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ROHS-COMPLIANT SMALL FORM FACTOR
PLUGGABLE SOLDER-DOWN CAGE
Section 3 Package and Handling
Instructions
The PL-KP1-00-000-06 is packaged in card board boxes. Each box has 10 layers
of cages. Each layer consists of 35 cages in plastic clamshell trays. There are 350
cages per box.
Flammability
The PL-KP1-00-000-06 solder-down cage is made from Alloy 770 sheet metal
with a tin-plated BeCu EMI collar welded on.
RoHS Compliance
Compliant per the Directive 2002/95/EC of the European Parliament and of the
Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
Order Information
For more information on this or other products and their availability, please contact your local JDSU account manager or
JDSU directly at 1-800-498-JDSU (5378) in North America and +800-5378-JDSU worldwide or via e-mail at
customer.service@jdsu.com.
Sample: PL-KP1-00-000-06
Part Number Description
PL-KP1-00-000-06 Solder-down Cage, Standard Application
NORTH AMERICA: 800 498-JDSU (5378)
Product specifi cations and descriptions in this document subject to change without notice. © 2008 JDS Uniphase Corporation 30149205 500 0708 PL-KP1-00-000-06.DS.CMS.AE July 2008
WORLDWIDE: +800 5378-JDSU
WEBSITE: www.jdsu.com
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