Datasheet PKFC05C, PKFC08C, PKFC12C, PKFC15C, PKFC24C Datasheet (PROTEK)

PKFC3.3C*

05180

Only One Name Means ProTek’Tion™

APPLICATIONS

✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns

FEATURES

✔ ✔

✔

CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm)

✔ ✔

✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line

thru

PKFC36C*

PACKAGED FLIP CHIP ARRAY

MECHANICAL CHARACTERISTICS

✔ Encapsulated 0502 Chip ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel

PIN CONFIGURATION

105180.R0 8/03 www.protekdevices.com

*PATENT PENDING”

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

PKFC3.3C*

thru

PKFC36C*

PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature

SYMBOL VALUE

P

PP

T

J

T

STG

250 Watts

-55°C to 150°C

-55°C to 150°C°C

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PA RT

NUMBER

(See Note 1)

PKFC3.3C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC36C

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Typical leakage current < 5µA @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V.

RATED

STAND-OFF

VOLTAGE

V

WM

VOLTS

3.3

5.0

8.0

12.0

15.0

24.0

36.0

MINIMUM

BREAKDOWN

VOLTAGE

@ 1mA

V

(BR)

VOLTS

4.0

6.0

8.5

13.3

16.7

26.7

40.0

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@ IP = 1A

V

C

VOLTS

7.0

9.8

13.4

19.0

24.0

43.0

64.0

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@8/20µs

VC @ I

PP

12.5V @ 20A

14.7V @ 17A

19.2V @ 13A

29.7V @ 9.0A

35.7V @ 7.0A

55.0V @ 5.0A

84.0V @ 3.0A

MAXIMUM LEAKAGE

CURRENT

(See Note 2)

@V

WM

I

D

µA

75*

10**

10***

1 1 1 1

UNITS

°C

TYPICAL

CAPACITANCE

@0V, 1 MHz

C

pF

150 100

75 50 40 30 25

10,000

1,000

100

- Peak Pulse Current - Watts

PP

P

10

0.01 1 10 100 1,000 10,000

PEAK PULSE POWER VS PULSE TIME

FIGURE 1

250W, 8/20µs Waveform

td - Pulse Duration - µs

FIGURE 2

120

PP

100

80

60

40

- Peak Pulse Current - % of I

20

PP

I

0

0 5 10 15 20 25 30

2 www.protekdevices.com05180.R0 8/03

PULSE WAVE FORM

t

f

Peak Value I

-t

e

td = t

t - Time - µs

TEST WAVEFORM

PP

PARAMETERS tf = 8µs td = 20µs

IPP/2

*PATENT PENDING

GRAPHS

PKFC3.3C*

thru

PKFC36C*

POWER DERATING CURVE

FIGURE 3

100

80

60

40

% Of Rated Power

20

0

0 25 50 75 100 125 150

TL - Lead Temperature - °C

Peak Pulse Power

8/20µs

Average Power

200°C

100°C

Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material.

Instantaneous

to 200°C

1-2 Minutes

to 150°C

FIGURE 5

OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C

35

25

REFLOW SOLDER PROFILE

FIGURE 4

225°C

5-10 sec

1-2 Minutes to 25°C

Pre-Heat

Time

Soldering

Time

Cool Down

Time

15

5 Volts per Division

5

-5

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 6

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C

14

12

10

8

6

4

- Clamping Voltage - Volts

C

V

2

0

0 5 10 15 20

- Peak Pulse Current - Amps

I

PP

3 www.protekdevices.com05180.R0 8/03

*PATENT PENDING

PACKAGE OUTLINE & DIMENSIONS

PKFC3.3C*

thru

PKFC36C*

PACKAGE OUTLINE

TOP

A

K

B

J

H

D

BOTTOM SIDE

G

E

F

C

MOUNTING PAD

A

G

B

PACKAGE DIMENSIONS

DIM

NOTES

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad : ± 0.003” (± 0.08mm).

3. Maximum size: 0.052” (1.321mm) by 0.036” (0.914mm).

4. All dimensions ±0.003” on package outline.

A B C D E F G H J K

MILLIMETERS

0.838

1.245

0.762

0.533

0.228

0.533

0.305

0.432

0.355

INCHES

0.033

0.049

0.030

0.021

0.009

0.021

0.012

0.017

0.014

PAD DIMENSIONS

DIM

A B C E F G J

MILLIMETERS

1.016

0.635

1.473

0.203

0.508

0.343

INCHES

0.040

0.025

0.058

0.008

0.020

0.0135

F

J

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and reeled in accordance with EIA 481.

2.

8mm Plastic Tape:

3.

8mm Paper Tape:

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reser ves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.

7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PKFC05C-T75-1).

7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., PKFC05C-T75-2)

CE

Solder Print Diameter

0.010” - 0.012”

TAPE & REEL ORIENTATION

Package Outline

Package Contact Pads

NOTE

1. Top view of tape. Solder PADS face down in tape

package.

Outline & Dimensions: Rev 1 - 8/03, 06040

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com

*PATENT PENDING

4 www.protekdevices.com05180.R0 8/03