TABLE 1:PIC32MX1XX/2XX/5XX 64/100-PIN CONTROLLER FAMILY FEATURES
Remappable Peripherals
(1)
(4)
Device
PIC32MX120F064H 64
PIC32MX130F128H 64
PIC32MX130F128L
PIC32MX230F128H 64
PIC32MX230F128L
PIC32MX530F128H 64
PIC32MX530F128L
PIC32MX150F256H 64
PIC32MX150F256L
PIC32MX250F256H 64
PIC32MX250F256L
PIC32MX550F256H 64
PIC32MX550F256L
PIC32MX170F512H 64
PIC32MX170F512L
PIC32MX270F512H 64
PIC32MX270F512L
PIC32MX570F512H 64
PIC32MX570F512L
Note 1:All devices feature 3 KB of Boot Flash memory.
2:Four out of five timers are remappable.
3:Four out of five external interrupts are remappable.
4:Please contact your local Microchip Sales Office for information regarding the availability of devices in the 100-pin TFBGA package.
Pins
Packages
QFN,
TQFP
QFN,
TQFP
100 TQFP
100 TFBGA
QFN,
TQFP
100 TQFP
100 TFBGA
QFN,
TQFP
100 TQFP
100 TFBGA
QFN,
TQFP
100 TQFP
100 TFBGA
QFN,
TQFP
100 TQFP
100 TFBGA
QFN,
TQFP
100 TQFP
100 TFBGA
QFN,
TQFP
100 TQFP
100 TFBGA
QFN,
TQFP
100 TQFP
100 TFBGA
QFN,
TQFP
100 TQFP
100 TFBGA
Data Memory (KB)
Program Memory (KB)
64+38375/5/5435283N0Y2YY4/053YN
128+3 16375/5/5435283N0Y2YY4/0 53YN
128+3 16545/5/5545483N0Y2YY4/0 85YY
128+3 16375/5/5435283Y0Y2YY 4/2 49YN
128+3 16545/5/5545483Y0Y2YY
128+3 16375/5/5435283Y1Y2YY 4/4 49YN
128+3 16545/5/5545483Y1Y2YY 4/4 81YY
256+3 32375/5/5435283N0Y2YY4/0 53YN
256+3 32545/5/5545483N0Y2YY4/0 85YY
256+3 32375/5/5435283Y0Y2YY 4/2 49YN
256+3 32545/5/5545483Y0Y2YY 4/2 81YY
256+3 32375/5/5435283Y1Y2YY 4/4 49YN
256+3 32545/5/5545483Y1Y2YY 4/4 81YY
512+3 64375/5/5435283N0Y2YY4/0 53YN
512+3 64545/5/5545483N0Y2YY4/0 85YY
512+3 64375/5/5435283Y0Y2YY 4/2 49YN
512+3 64545/5/5545483Y0Y2YY 4/2 81YY
512+3 64375/5/5435283Y1Y2YY 4/4 49YN
512+3 64545/5/5545483Y1Y2YY 4/4 81YY
Remappable Pins
(2)
(3)
S
2
UART
SPI/I
External Interrupts
Timers/Capture/Compare
Analog Comparators
10-bit 1 Msps ADC (Channels)
CAN
USB On-The-Go (OTG)
CTMU
2
C™
I
PMP
RTCC
DMA Channels (Programmable/Dedicated)
4/2
JTAG
I/O Pins
81YY
Trace
DS60001290C-page 2Preliminary 2014 Microchip Technology Inc.
1
64
64-PIN QFN
(4)
AND TQFP (TOP VIEW)
PIC32MX120F064H
PIC32MX130F128H
PIC32MX150F256H
64
1
M
TQFP
QFN
(4)
PIC32MX170F512H
PIC32MX1XX/2XX/5XX 64/100-PIN FAMILY
Device Pin Tables
TABLE 2:PIN NAMES FOR 64-PIN GENERAL PURPOSE DEVICES
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
Select” for restrictions.
2:Every I/O port pin (RAx-RGx) can be used as a change notification pin (CNAx-CNGx). See Section 11.0 “I/O Ports” for more information.
3:Shaded pins are 5V tolerant.
4:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
2:Every I/O port pin (RAx-RGx) can be used as a change notification pin (CNAx-CNGx). See Section 11.0 “I/O Ports” for more information.
3:Shaded pins are 5V tolerant.
4:The metal plane at the bottom of the QFN device is not connected to any pins and is recommended to be connected to VSS externally.
USBID/RPF3/RF3
33
VUSB3V3
35
D+
37
OSC1/CLKI/RC12
39
AN26/C3IND/RPD3/RD3
51
RPD5/PMRD/RD5
53
C3INB/RD7
55
VDD
57
DS60001290C-page 4Preliminary 2014 Microchip Technology Inc.
TABLE 4:PIN NAMES FOR 100-PIN GENERAL PURPOSE DEVICES
1
100
100-PIN TQFP (TOP VIEW)
PIC32MX130F128L
PIC32MX170F512L
PIC32MX150F256L
Pin #Full Pin NamePin #Full Pin Name
AN28/RG15
1
2VDD37 VDD
AN22/RPE5/PMD5/RE5
3
4AN23/PMD6/RE639 AN34/RPF13/SCK3/RF13
AN27/PMD7/RE7
5
6AN29/RPC1/RC141 AN12/PMA11/RB12
AN30/RPC2/RC2
7
8AN31/RPC3/RC343 AN14/RPB14/CTED5/PMA1/RB14
9RPC4/CTED7/RC444 AN15/RPB15/OCFB/CTED6/PMA0/RB15
10 AN16/C1IND/RPG6/SCK2/PMA5/RG645 V
11 AN17/C1INC/RPG7/PMA4/RG746 VDD
12 AN18/C2IND/RPG8/PMA3/RG847 AN36/RPD14/RD14
13 MCLR48 AN37/RPD15/SCK4/RD15
14 AN19/C2INC/RPG9/PMA2/RG9
SS50RPF5/PMA8/RF5
15 V
V
DD
16
TMS/CTED1/RA0
17
18 AN32/RPE8/RE853 AN39/RPF8/RF8
AN33/RPE9/RE9
19
20 AN5/C1INA/RPB5/RB5
AN4/C1INB/RB4
21
22 PGED3/AN3/C2INA/RPB3/RB3
PGEC3/AN2/CTCMP/C2INB/RPB2/CTED13/RB2
23
24 PGEC1/AN1/RPB1/CTED12/RB1
25 PGED1/AN0/RPB0/RB0
26 PGEC2/AN6/RPB6/RB661 TDO/RA5
27 PGED2/AN7/RPB7/CTED3/RB762 V
28 VREF-/PMA7/RA963 OSC1/CLKI/RC12
REF+/PMA6/RA1064 OSC2/CLKO/RC15
29 V
30 AV
DD65 VSS
31 AVSS66 RPA14/RA14
32 AN8/RPB8/CTED10/RB8
33 AN9/RPB9/CTED4/RB9
CV
REFOUT/AN10/RPB10/CTED11/PMA13/RB10
34
35 AN11/PMA12/RB11
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
Select” for restrictions.
2:Every I/O port pin (RAx-RGx) can be used as a change notification pin (CNAx-CNGx). See Section 11.0 “I/O Ports” for more
2.0Guidelines for Getting Started with 32-bit MCUs........................................................................................................................ 25
6.0Flash Program Memory .............................................................................................................................................................. 61
10.0 USB On-The-Go (OTG)............................................................................................................................................................ 103
25.0 Comparator Voltage Reference (CVREF) ................................................................................................................................. 281
26.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 285
27.0 Power-Saving Features ........................................................................................................................................................... 291
28.0 Special Features ...................................................................................................................................................................... 297
29.0 Instruction Set .......................................................................................................................................................................... 309
30.0 Development Support............................................................................................................................................................... 311
33.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 365
The Microchip Web Site ..................................................................................................................................................................... 383
Customer Change Notification Service .............................................................................................................................................. 383
Product Identification System ............................................................................................................................................................ 384
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
docerrors@microchip.com. We welcome your feedback.
http://www.microchip.com
DS60001290C-page 10Preliminary 2014 Microchip Technology Inc.
PIC32MX1XX/2XX/5XX 64/100-PIN FAMILY
Referenced Sources
This device data sheet is based on the following
individual sections of the “PIC32 Family Reference Manual”. These documents should be considered as
the general reference for the operation of a particular
module or device feature.
Note:To access the documents listed below,
browse to the documentation section of
the Microchip web site
(www.microchip.com).
DS60001290C-page 12Preliminary 2014 Microchip Technology Inc.
PIC32MX1XX/2XX/5XX 64/100-PIN FAMILY
Note:Not all features are available on all devices. Refer to TABLE 1: “PIC32MX1XX/2XX/5XX 64/100-pin Controller
Family Features” for the list of features by device.
UART1-5
Comparators
PORTA/CNA
PORTD/CND
PORTE/CNE
PORTF/CNF
PORTG/CNG
PORTB/CNB
JTAG
Priority
DMACICD
MIPS32
®
M4K® CPU Core
ISDS
EJTAGINT
Bus Matrix
Data RAM
Peripheral Bridge
128
128-bit wide
Flash
32
32
32
32
Peripheral Bus Clocked by PBCLK
Program Flash Memory
Controller
32
32
32
Interrupt
Controller
BSCAN
PORTC/CNC
PMP
I2C1,2
SPI1-4
IC1-5
PWM
OC1-5
OSC1/CLKI
OSC2/CLKO
V
DD,
Timing
Generation
V
SS
MCLR
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Precision
Reference
Band Gap
FRC/LPRC
Oscillators
Regulator
Voltage
VCAP
OSC/SOSC
Oscillators
PLL
DIVIDERS
SYSCLK
PBCLK
Peripheral Bus Clocked by SYSCLK
USB
PLL-USB
USBCLK
32
RTCC
10-bit ADC
Timer1-5
32
32
Remappable
Pins
CTMU
1-3
CAN
32
1.0DEVICE OVERVIEW
This document contains device-specific information for
PIC32MX1XX/2XX/5XX 64/100-pin devices.
Note 1: This data sheet summarizes the features
of the PIC32MX1XX/2XX/5XX 64/100pin family of devices. It is not intended to
be a comprehensive reference source.
To complement the information in this
data sheet, refer to the related section of
Figure 1-1 illustrates a general block diagram of the
core and peripheral modules in the PIC32MX1XX/2XX/
5XX 64/100-pin family of devices.
Table 1-1 lists the functions of the various pins shown
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
64-pin
QFN/
TQFP
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
64-pin
QFN/
TQFP
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
100-pin
TQFP
Pin
Type
Buffer
Type
Description
Analog input channels.
External clock source input. Always associated with OSC1 pin
function.
Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. Optionally functions as CLKO in RC
and EC modes. Always associated with the OSC2 pin
function.
Oscillator crystal input. ST buffer when configured in RC
mode; CMOS otherwise.
Oscillator crystal output. Connects to crystal or resonator in
Crystal Oscillator mode. Optionally functions as CLKO in RC
and EC modes.
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
64-pin
QFN/
TQFP
(1)
, 46
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
64-pin
QFN/
TQFP
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
I/OSTSynchronous Serial Clock Input/Output for SPI1
(1)
SDI1PPSPPSI—SPI1 Data In
SDO1PPSPPSOSTSPI1 Data Out
SS1
PPSPPSI/O—SPI1 Slave Synchronization for Frame Pulse I/O
SCK2410I/OSTSynchronous Serial Clock Input/Output for SPI2
SDI2PPSPPSI—SPI2 Data In
SDO2PPSPPSOSTSPI2 Data Out
SS2
PPSPPSI/O—SPI2 Slave Synchronization for Frame Pulse I/O
SCK32939I/OSTSynchronous Serial Clock Input/Output for SPI3
SDI3PPSPPSI—SPI3 Data In
SDO3PPSPPSOSTSPI3 Data Out
SS3
PPSPPSI/O—SPI3 Slave Synchronization for Frame Pulse I/O
SCK4—48I/OSTSynchronous Serial Clock Input/Output for SPI4
SDI4—PPSI—SPI4 Data In
SDO4—PPSOSTSPI4 Data Out
SS4
SCL137
SDA136
—PPSI/O—SPI4 Slave Synchronization for Frame Pulse I/O
(1)
(1)
, 44
, 43
(2)57(1)
(2)56(1)
, 66
, 67
(2)
I/OSTSynchronous Serial Clock Input/Output for I2C1
(2)
I/OSTSynchronous Serial Data Input/Output for I2C1
SCL23258I/OSTSynchronous Serial Clock Input/Output for I2C2
SDA23159I/OSTSynchronous Serial Data Input/Output for I2C2
TMS2317ISTJTAG Test Mode Select Pin
TCK2738ISTJTAG Test Clock Input Pin
TDI2860I—JTAG Test Clock Input Pin
TDO2461O—JTAG Test Clock Output Pin
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
REFOUT2334OAnalogComparator Voltage Reference (Output)
C1INA1120IAnalog
C1INB1221IAnalog
C1INC511IAnalog
C1IND410IAnalog
C2INA1322IAnalog
C2INB1423IAnalog
C2INC814IAnalog
C2IND612IAnalog
C3INA5887IAnalog
C3INB5584IAnalog
C3INC5483IAnalog
C3IND5178IAnalog
C1OUTPPSPPSO—Comparator 1 Output
C2OUTPPSPPSO—Comparator 2 Output
C3OUTPPSPPSO—Comparator 3 Output
PMALL3044OTTL/STParallel Master Port Address Latch Enable Low Byte
PMALH2943OTTL/ST Parallel Master Port Address Latch Enable High Byte
PMA03044OTTL/ST
PMA12943OTTL/ST
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
64-pin
QFN/
TQFP
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
100-pin
TQFP
Pin
Type
Buffer
Type
Description
Comparator 1 Inputs
Comparator 2 Inputs
Comparator 3 Inputs
Parallel Master Port Address bit 0 Input (Buffered Slave
modes) and Output (Master modes)
Parallel Master Port Address bit 0 Input (Buffered Slave
modes) and Output (Master modes)
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
64-pin
QFN/
TQFP
3454I AnalogUSB Bus Power Monitor
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
100-pin
TQFP
Pin
Type
Buffer
Type
Description
Parallel Master Port data (Demultiplexed Master mode) or
Address/Data (Multiplexed Master modes)
Parallel Master Port data (Demultiplexed Master mode) or
Address/Data (Multiplexed Master modes)
USBOEN1221OTTL/STUSB D+, D- active status (see UOEMON bit in Register 10-20)
PGED11625I/OST
PGEC11524IST
PGED21827I/OST
PGEC21726IST
PGED31322I/OST
PGEC31423IST
TRCLK—91O—Trace clock
TRD0—97O—Trace Data bit 0
TRD1—96O—Trace Data bit 1
TRD2—95O—Trace Data bit 2
TRD3—92O—Trace Data bit 3
CTED1—17ISTCTMU External Edge Input 1
CTED2—38ISTCTMU External Edge Input 2
CTED31827ISTCTMU External Edge Input 3
CTED42233ISTCTMU External Edge Input 4
CTED52943ISTCTMU External Edge Input 5
CTED63044ISTCTMU External Edge Input 6
CTED7—9ISTCTMU External Edge Input 7
CTED8—92ISTCTMU External Edge Input 8
CTED9—60ISTCTMU External Edge Input 9
CTED102132ISTCTMU External Edge Input 10
CTED112334ISTCTMU External Edge Input 11
CTED121524ISTCTMU External Edge Input 12
CTED131423ISTCTMU External Edge Input 13
C1RXPPSPPSISTEnhanced CAN Receive
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
64-pin
QFN/
TQFP
(2)
(2)
(2)
3555P—
1120O—USB Host and OTG bus power control Output
3757I/OAnalog USB D+
3656I/OAnalogUSB D-
3351ISTUSB OTG ID Detect
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
100-pin
TQFP
Pin
Type
Buffer
Type
Description
USB internal transceiver supply. If the USB module is not
used, this pin must be connected to V
Data I/O pin for Programming/Debugging Communication
Channel 1
Clock Input pin for Programming/Debugging Communication
Channel 1
Data I/O Pin for Programming/Debugging Communication
Channel 2
Clock Input Pin for Programming/Debugging Communication
Channel 2
Data I/O Pin for Programming/Debugging Communication
Channel 3
Clock Input Pin for Programming/Debugging Communication
Channel 3
VCAP5685P—Capacitor for Internal Voltage Regulator
SS9, 25, 41
V
REF+1629PAnalogAnalog Voltage Reference (High) Input
V
V
REF-1528PAnalogAnalog Voltage Reference (Low) Input
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputI = InputO = Output
Note 1: This pin is only available on devices without a USB module.
2: This pin is only available on devices with a USB module.
3: This pin is not available on 64-pin devices with a USB module.
4: This pin is only available on 100-pin devices without a USB module.
64-pin
QFN/
TQFP
713IST
10, 26, 38, 572, 16, 37,
ST = Schmitt Trigger input with CMOS levelsTTL = TTL input bufferP = Power
100-pin
TQFP
46, 62, 86
15, 36, 45,
65, 75
Pin
Type
Buffer
Type
Master Clear (Reset) input. This pin is an active-low Reset to
the device.
Positive supply for analog modules. This pin must be
connected at all times.
P—Positive supply for peripheral logic and I/O pins
2.0GUIDELINES FOR GETTING
STARTED WITH 32-BI T MCUS
Note:This data sheet summarizes the features
of the PIC32MX1XX/2XX/5XX 64/100-pin
family of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section of the
“PIC32 Family Reference Manual”, which
is available from the Microchip web
(www.microchip.com/PIC32).
2.1Basic Connection Requirements
Getting started with the PIC32MX1XX/2XX/5XX 64/
100-pin family of 32-bit Microcontrollers (MCUs)
requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All VDD and VSS pins (see 2.2 “Decoupling
Capacitors”)
• All AVDD and AVSS pins, even if the ADC module is
not used (see 2.2 “Decoupling Capacitors”)
•VCAP pin (see 2.3 “Capacitor on Internal Voltage
Regulator (VCAP)”)
• MCLR pin (see 2.4 “Master Clear (MCLR) Pin”)
• PGECx/PGEDx pins, used for In-Circuit Serial
Programming (ICSP™) and debugging purposes
2.5 “ICSP Pins”)
(see
• OSC1 and OSC2 pins, when external oscillator
source is used (see
The following pins may be required:
VREF+/VREF- pins, used when external voltage
reference for the ADC module is implemented
Note:The AVDD and AVSS pins must be
connected, regardless of ADC use and
the ADC voltage reference source.
2.8 “External Oscillator Pins”)
site
.
2.2Decoupling Capacitors
The use of decoupling capacitors on power supply
pins, such as VDD, VSS, AVDD and AVSS is required.
Figure 2-1.
See
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A value of 0.1 µF
(100 nF), 10-20V is recommended. The capacitor
should be a low Equivalent Series Resistance
(low-ESR) capacitor and have resonance
frequency in the range of 20
further recommended that ceramic capacitors be
used.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended that
the capacitors be placed on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within onequarter inch (6
• Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Note 1: If the USB module is not used, this pin must be
connected to V
DD.
2: As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between V
DD and
AV
DD to improve ADC noise rejection. The inductor
impedance should be less than 3Ω and the inductor
capacity greater than 10 mA.
Where:
f
FCNV
2
------------- -=
f
1
2π LC()
-----------------------=
L
1
2πfC()
--------------------- -
2
=
(i.e., ADC conversion rate/2)
Connect
(2)
VUSB3V3
(1)
VCAP
Tantalum or
ceramic 10 µF
ESR ≤ 3Ω
(3)
2: Aluminum or electrolytic capacitors should not be
used. ESR ≤ 3Ω from -40ºC to 125ºC @ SYSCLK
frequency (i.e., MIPS).
1K
0.1 µF
Note 1: 470Ω ≤ R1 ≤ 1Ω will limit any current flowing into
MCLR
from the external capacitor C, in the event of
MCLR
pin breakdown, due to Electrostatic Discharge
(ESD) or Electrical Overstress (EOS). Ensure that the
MCLR
pin VIH and VIL specifications are met without
interfering with the Debug/Programmer tools.
2: The capacitor can be sized to prevent unintentional
Resets from brief glitches or to extend the device
Reset period during POR.
3: No pull-ups or bypass capacitors are allowed on
active debug/program PGECx/PGEDx pins.
R1
(1)
10k
V
DD
MCLR
PIC32
1 kΩ
0.1 µF
(2)
PGECx
(3)
PGEDx
(3)
ICSP™
1
5
4
2
3
6
V
DD
VSS
NC
R
C
FIGURE 2-1:RECOMMENDED
MINIMUM CONNECTION
2.4Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions:
• Device Reset
• Device programming and debugging
Pulling The MCLR pin low generates a device Reset.
Figure 2-2 illustrates a typical MCLR circuit. During
device programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the
levels (V
not be adversely affected. Therefore, specific values
of R and C will need to be adjusted based on the
application and PCB requirements.
For example, as illustrated in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the
operations.
Place the components illustrated in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:EXAMPLE OF MCLR PIN
MCLR pin. Consequently, specific voltage
IH and VIL) and fast signal transitions must
MCLR pin during programming and debugging
CONNECTIONS
2.2.1BULK CAPACITORS
The use of a bulk capacitor is recommended to improve
power supply stability. Typical values range from 4.7 µF
to 47
the device as possible.
2.3Capacitor on Internal Voltage
2.3.1INTERNAL REGULATOR MODE
A low-ESR (3 ohm) capacitor is required on the VCAP
pin, which is used to stabilize the internal voltage regulator output. The VCAP pin must not be connected to
DD, and must have a CEFC capacitor, with at least a
V
6V rating, connected to ground. The type can be
ceramic or tantalum. Refer to
Electrical Characteristics” for additional information
on CEFC specifications.
DS60001290C-page 26Preliminary 2014 Microchip Technology Inc.
µF. This capacitor should be located as close to
Regulator (V
CAP)
Section 31.0 “40 MHz
PIC32MX1XX/2XX/5XX 64/100-PIN FAMILY
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
2.5ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging pur
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
IH) and input voltage low (VIL) requirements.
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
®
MPLAB
For more information on MPLAB ICD 3 and MPLAB
REAL ICE connection requirements, refer to the follow
ing documents that are available on the Microchip web
site.
• “Using MPLAB® ICD 3” (poster) DS50001765
• “MPLAB® ICD 3 Design Advisory” DS50001764
• “MPLAB® REAL ICE™ In-Circuit Debugger
• “Using MPLAB® REAL ICE™ Emulator” (poster)
ICD 3 or MPLAB REAL ICE™.
User’s Guide” DS50001616
DS50001749
-
-
-
2.7Trace
The trace pins can be connected to a hardware
trace-enabled programmer to provide a compressed
real-time instruction trace. When used for trace, the
TRD3, TRD2, TRD1, TRD0 and TRCLK pins should
be dedicated for this use. The trace hardware
requires a 22 Ohm series resistor between the trace
pins and the trace connector.
2.8External Oscillator Pins
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to
Configuration” for details).
The oscillator circuit should be placed on the same side
of the board as the device. Also, place the oscillator circuit close to the respective oscillator pins, not exceeding one-half inch (12 mm) distance between them. The
load capacitors should be placed next to the oscillator,
on the same side of the board. Use a grounded copper
pour around the oscillator circuit to isolate them from
surrounding circuits. The grounded copper pour should
be routed directly to the MCU ground. Do not run any
signal traces or power traces inside the ground pour.
Also, if using a two-sided board, avoid any traces on
the other side of the board where the crystal is placed.
A suggested layout is illustrated in
FIGURE 2-3:SUGGESTED OSCILLATOR
CIRCUIT PLACEMENT
Section 8.0 “Oscillator
Figure 2-3.
2.6JTAG
The TMS, TDO, TDI and TCK pins are used for testing
and debugging according to the Joint Test Action
Group (JTAG) standard. It is recommended to keep the
trace length between the JTAG connector and the
JTAG pins on the device as short as possible. If the
JTAG connector is expected to experience an ESD
event, a series resistor is recommended, with the value
in the range of a few tens of Ohms, not to exceed 100
Ohms.
Pull-up resistors, series diodes and capacitors on the
TMS, TDO, TDI and TCK pins are not recommended
as they will interfere with the programmer/debugger
communications to the device. If such discrete
components are an application requirement, they
should be removed from the circuit during
programming and debugging. Alternatively, refer to the
AC/DC characteristics and timing requirements
information in the respective device Flash
programming specification for information on
capacitive loading limits and pin input voltage high (V
and input voltage low (VIL) requirements.
Rounded to the nearest standard value or 13 pF in this example for
Primary Oscillator crystals “C1” and “C2”.
OSC2OSC1
1M
Typical XT
(4-10 MHz)
Circuit A
C1
C2
OSC2OSC1
Typical HS
(10-25 MHz)
Circuit B
C1
C2
Rs
OSC2
OSC1
1M
Typical XT/HS
(4-25 MHz)
Circuit C
C1
C2
1M
Rs
OSC2OSC1
Not Recommended
Circuit D
Not Recommended
1M
Rs
OSC2
OSC1
Circuit E
2.8.1CRYSTAL OSCILLATOR DESIGN
CONSIDERATION
The following example assumptions are used to
calculate the Primary Oscillator loading capacitor
values:
•CIN = PIC32_OSC2_Pin Capacitance = ~4-5 pF
•COUT = PIC32_OSC1_Pin Capacitance = ~4-5 pF
• C1 and C2 = XTAL manufacturing recommended
loading capacitance
• Estimated PCB stray capacitance, (i.e.,12 mm
length) = 2.5 pF
EXAMPLE 2-1: CRYSTAL LOAD CAPACITOR
CALCULATION
The following tips are used to increase oscillator gain,
(i.e., to increase peak-to-peak oscillator signal):
• Select a crystal with a lower “minimum” power drive
rating
• Select an crystal oscillator with a lower XTAL
manufacturing “ESR” rating.
• Add a parallel resistor across the crystal. The smaller
the resistor value the greater the gain. It is recom
mended to stay in the range of 600k to 1M
• C1 and C2 values also affect the gain of the oscillator.
The lower the values, the higher the gain.
• C2/C1 ratio also affects gain. To increase the gain,
make C1 slightly smaller than C2, which will also help
start-up performance.
Note:Do not add excessive gain such that the
oscillator signal is clipped, flat on top of
the sine wave. If so, you need to reduce
the gain or add a series resistor, RS, as
shown in circuit “C” in
Figure 2-4. Failure
to do so will stress and age the crystal,
which can result in an early failure. Adjust
the gain to trim the max peak-to-peak to
DD-0.6V. When measuring the oscilla-
~V
tor signal you must use a FET scope
probe or a probe with ≤ 1.5 pF or the
scope probe itself will unduly change the
gain and peak-to-peak levels.
2.8.1.1Additional Microchip References
• AN588 “PICmicro® Microcontroller Oscillator
• AN826 “Crystal Oscillator Basics and Crystal
• AN849 “Basic PICmicro® Oscillator Design”
DS60001290C-page 28Preliminary 2014 Microchip Technology Inc.
Design Guide”
Selection for rfPIC™ and PICmicro® Devices”
FIGURE 2-4:PRIMARY CRYSTAL
OSCILLATOR CIRCUIT
RECOMMENDATIONS
-
PIC32MX1XX/2XX/5XX 64/100-PIN FAMILY
PIC32
SOSCO
SOSCI
2.2 K
33 pF
33 pF
Note 1: P/N: Epson MC-306 32.7680K-A0:ROHS.
Crystal
(1)
2.9Unused I/Os
Unused I/O pins should not be allowed to float as
inputs. They can be configured as outputs and driven
to a logic-low state.
Alternatively, inputs can be reserved by connecting the
pin to VSS through a 1k to 10k resistor and configuring
the pin as an input.
2.10SOSC Design Recommendation
Figure 2-5 shows the recommended Sosc circuit
design. All components should be as close as possible
to the SOSCI and SOSCO pins of the PIC32 device,
(≤ 8 mm) and the capacitors should be ceramic-type.
2.11Considerations When Interfacing
to Remotely Powered Circuits
2.11.1NON-5V TOLERANT INPUT PINS
A quick review of the absolute maximum rating section
31.0 “40 MHz Electrical Characteristics” will indi-
in
cate that the voltage on any non-5v tolerant pin may not
exceed AVDD/VDD + 0.3V. Figure 2-6 shows an exam-
ple of a remote circuit using an independent power
source, which is powered while connected to a PIC32
non-5V tolerant circuit that is not powered.
FIGURE 2-6:PIC32 NON-5V TOLERANT CIRCUIT EXAMPLE
DS60001290C-page 30Preliminary 2014 Microchip Technology Inc.
Loading...
+ 356 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.