TABLE 3:PIN NAMES FOR 28-PIN GENERAL PURPOSE DEVICES
Pin #Full Pin NamePin #Full Pin Name
1
MCLR
2
REF
+/CV
REF
V
3
REF
V
4
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
5
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
6
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
7
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
8
SS
V
9
OSC1/CLKI/RPA2/RA2
10
OSC2/CLKO/RPA3/PMA0/RA3
11
SOSCI/RPB4/RB4
12
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4
13
DD
V
14
PGED3/RPB5/PMD7/RB5
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:Shaded pins are 5V tolerant.
+/AN0/C3INC/RPA0/CTED1/RA0
-/CV
REF
-/AN1/RPA1/CTED2/RA1
Select” for restrictions.
15
PGEC3/RPB6/PMD6/RB6
16
TDI/RPB7/CTED3/PMD5/INT0/RB7
17
TCK/RPB8/SCL1/CTED10/PMD4/RB8
18
TDO/RPB9/SDA1/CTED4/PMD3/RB9
19
SS
V
20
CAP
V
21
PGED2/RPB10/CTED11/PMD2/RB10
22
PGEC2/TMS/RPB11/PMD1/RB11
23
AN12/PMD0/RB12
24
AN11/RPB13/CTPLS/PMRD/RB13
25
REFOUT
CV
26
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
27
AV
28
AV
/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
SS
DD
DS60001168L-page 4 2011-2019 Microchip Technology Inc.
TABLE 5:PIN NAMES FOR 28-PIN GENERAL PURPOSE DEVICES
Pin #Full Pin NamePin #Full Pin Name
1
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
2
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
3
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
4
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
5
V
SS
6
OSC1/CLKI/RPA2/RA2
7
OSC2/CLKO/RPA3/PMA0/RA3
8
SOSCI/RPB4/RB4
9
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4
10
DD
V
11
PGED3/RPB5/PMD7/RB5
12
PGEC3/RPB6/PMD6/RB6
13
TDI/RPB7/CTED3/PMD5/INT0/RB7
14
TCK/RPB8/SCL1/CTED10/PMD4/RB8
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
Select” for restrictions.
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:Shaded pins are 5V tolerant.
15
TDO/RPB9/SDA1/CTED4/PMD3/RB9
16
SS
V
17
CAP
V
18
PGED2/RPB10/CTED11/PMD2/RB10
19
PGEC2/TMS/RPB11/PMD1/RB11
20
AN12/PMD0/RB12
21
AN11/RPB13/CTPLS/PMRD/RB13
22
REFOUT
CV
23
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
24
AV
25
AV
26
MCLR
27
V
28
V
/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
SS
DD
REF
+/CV
REF
+/AN0/C3INC/RPA0/CTED1/RA0
REF
-/CV
REF
-/AN1/RPA1/CTED2/RA1
SS
externally.
DS60001168L-page 6 2011-2019 Microchip Technology Inc.
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
Select” for restrictions.
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:Shaded pins are 5V tolerant.
TABLE 7:PIN NAMES FOR 36-PIN GENERAL PURPOSE DEVICES
Pin #Full Pin NamePin #Full Pin Name
1
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
2
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
(4)
PGED4
PGEC4
V
V
OSC1/CLKI/RPA2/RA2
OSC2/CLKO/RPA3/PMA0/RA3
SOSCI/RPB4/RB4
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4
RPC3/RC3
V
V
V
PGED3/RPB5/PMD7/RB5
PGEC3/RPB6/PMD6/RB6
TDI/RPB7/CTED3/PMD5/INT0/RB7
TCK/RPB8/SCL1/CTED10/PMD4/RB8
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:This pin function is not available on PIC32MX110F016C and PIC32MX120F032C devices.
5:Shaded pins are 5V tolerant.
/AN6/RPC0/RC0
(4)
/AN7/RPC1/RC1
DD
SS
SS
DD
DD
Select” for restrictions.
19
TDO/RPB9/SDA1/CTED4/PMD3/RB9
20
RPC9/CTED7/RC9
21
V
SS
22
V
CAP
23
DD
V
24
PGED2/RPB10/CTED11/PMD2/RB10
25
PGEC2/TMS/RPB11/PMD1/RB11
26
AN12/PMD0/RB12
27
AN11/RPB13/CTPLS/PMRD/RB13
28
REFOUT
CV
29
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
30
AV
31
AV
32
MCLR
33
V
34
V
35
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
36
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
SS
DD
REF
+/CV
REF
+/AN0/C3INC/RPA0/CTED1/RA0
REF
-/CV
REF
-/AN1/RPA1/CTED2/RA1
SS
externally.
DS60001168L-page 8 2011-2019 Microchip Technology Inc.
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
(4)
/AN6/RPC0/RC0
PGED4
(4)
PGEC4
/AN7/RPC1/RC1
V
DD
SS
V
OSC1/CLKI/RPA2/RA2
OSC2/CLKO/RPA3/PMA0/RA3
SOSCI/RPB4/RB4
SOSCO/RPA4/T1CK/CTED9/PMA1/RA4
AN12/RPC3/RC3
SS
V
V
DD
V
DD
TMS/RPB5/USBID/RB5
BUS
V
TDI/RPB7/CTED3/PMD5/INT0/RB7
TCK/RPB8/SCL1/CTED10/PMD4/RB8
Select” for restrictions.
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:This pin function is not available on PIC32MX210F016C and PIC32MX120F032C devices.
5:Shaded pins are 5V tolerant.
TABLE 9:PIN NAMES FOR 44-PIN GENERAL PURPOSE DEVICES
Pin #Full Pin NamePin #Full Pin Name
1
RPB9/SDA1/CTED4/PMD3/RB9
2
RPC6/PMA1/RC6
3
RPC7/PMA0/RC7
4
RPC8/PMA5/RC8
5
RPC9/CTED7/PMA6/RC9
6
SS
V
7
CAP
V
8
PGED2/RPB10/CTED11/PMD2/RB10
9
PGEC2/RPB11/PMD1/RB11
10
AN12/PMD0/RB12
11
AN11/RPB13/CTPLS/PMRD/RB13
12
13
14
15
16
17
18
19
20
21
22
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
(4)
PGED4
PGEC4
CV
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AV
AV
MCLR
V
V
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:This pin function is not available on PIC32MX110F016D and PIC32MX120F032D devices.
5:Shaded pins are 5V tolerant.
/TMS/PMA10/RA10
(4)
/TCK/CTED8/PMA7/RA7
REFOUT
/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
SS
DD
REF
+/CV
REF
+/AN0/C3INC/RPA0/CTED1/RA0
REF
-/CV
REF
-/AN1/RPA1/CTED2/RA1
Select” for restrictions.
23
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
24
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
25
AN6/RPC0/RC0
26
AN7/RPC1/RC1
27
AN8/RPC2/PMA2/RC2
28
V
DD
29
SS
V
30
OSC1/CLKI/RPA2/RA2
31
OSC2/CLKO/RPA3/RA3
32
TDO/RPA8/PMA8/RA8
33
SOSCI/RPB4/RB4
34
SOSCO/RPA4/T1CK/CTED9/RA4
35
TDI/RPA9/PMA9/RA9
36
RPC3/RC3
37
RPC4/PMA4/RC4
38
RPC5/PMA3/RC5
39
V
SS
40
DD
V
41
PGED3/RPB5/PMD7/RB5
42
PGEC3/RPB6/PMD6/RB6
43
RPB7/CTED3/PMD5/INT0/RB7
44
RPB8/SCL1/CTED10/PMD4/RB8
SS
externally.
DS60001168L-page 10 2011-2019 Microchip Technology Inc.
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:This pin function is not available on PIC32MX110F016D and PIC32MX120F032D devices.
5:Shaded pins are 5V tolerant.
TABLE 11:PIN NAMES FOR 44-PIN GENERAL PURPOSE DEVICES
Pin #Full Pin NamePin #Full Pin Name
1
RPB9/SDA1/CTED4/PMD3/RB9
2
RPC6/PMA1/RC6
3
RPC7/PMA0/RC7
4
RPC8/PMA5/RC8
5
RPC9/CTED7/PMA6/RC9
6
SS
V
7
CAP
V
8
PGED2/RPB10/CTED11/PMD2/RB10
9
PGEC2/RPB11/PMD1/RB11
10
AN12/PMD0/RB12
11
AN11/RPB13/CTPLS/PMRD/RB13
12
13
14
15
16
17
18
19
20
21
22
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
(4)
PGED4
PGEC4
CV
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AV
AV
MCLR
V
V
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:This pin function is not available on PIC32MX110F016D and PIC32MX120F032D devices.
5:Shaded pins are 5V tolerant.
/TMS/PMA10/RA10
(4)
/TCK/CTED8/PMA7/RA7
REFOUT
/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
SS
DD
REF
+/CV
REF
+/AN0/C3INC/RPA0/CTED1/RA0
REF
-/CV
REF
-/AN1/RPA1/CTED2/RA1
Select” for restrictions.
23
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
24
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
25
AN6/RPC0/RC0
26
AN7/RPC1/RC1
27
AN8/RPC2/PMA2/RC2
28
V
DD
29
SS
V
30
OSC1/CLKI/RPA2/RA2
31
OSC2/CLKO/RPA3/RA3
32
TDO/RPA8/PMA8/RA8
33
SOSCI/RPB4/RB4
34
SOSCO/RPA4/T1CK/CTED9/RA4
35
TDI/RPA9/PMA9/RA9
36
RPC3/RC3
37
RPC4/PMA4/RC4
38
RPC5/PMA3/RC5
39
V
SS
40
DD
V
41
PGED3/RPB5/PMD7/RB5
42
PGEC3/RPB6/PMD6/RB6
43
RPB7/CTED3/PMD5/INT0/RB7
44
RPB8/SCL1/CTED10/PMD4/RB8
SS
externally.
DS60001168L-page 12 2011-2019 Microchip Technology Inc.
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
(4)
/TMS/PMA10/RA10
PGED4
(4)
PGEC4
/TCK/CTED8/PMA7/RA7
REFOUT
CV
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AV
AV
MCLR
PGED3/V
PGEC3/V
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/PMD0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/PMD1/RB1
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:This pin function is not available on PIC32MX210F016D and PIC32MX220F032D devices.
5:Shaded pins are 5V tolerant.
TABLE 13:PIN NAMES FOR 44-PIN GENERAL PURPOSE DEVICES
Pin #Full Pin NamePin #Full Pin Name
1
RPB9/SDA1/CTED4/PMD3/RB9
2
RPC6/PMA1/RC6
3
RPC7/PMA0/RC7
4
RPC8/PMA5/RC8
5
RPC9/CTED7/PMA6/RC9
6
SS
V
7
CAP
V
8
PGED2/RPB10/CTED11/PMD2/RB10
9
PGEC2/RPB11/PMD1/RB11
10
AN12/PMD0/RB12
11
AN11/RPB13/CTPLS/PMRD/RB13
12
13
14
15
16
17
18
19
20
21
22
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
(4)
PGED4
PGEC4
CV
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AV
AV
MCLR
V
V
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/RB1
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:This pin function is not available on PIC32MX110F016D and PIC32MX120F032D devices.
5:Shaded pins are 5V tolerant.
/TMS/PMA10/RA10
(4)
/TCK/CTED8/PMA7/RA7
REFOUT
/AN10/C3INB/RPB14/SCK1/CTED5/PMWR/RB14
SS
DD
REF
+/CV
REF
+/AN0/C3INC/RPA0/CTED1/RA0
REF
-/CV
REF
-/AN1/RPA1/CTED2/RA1
Select” for restrictions.
23
AN4/C1INB/C2IND/RPB2/SDA2/CTED13/RB2
24
AN5/C1INA/C2INC/RTCC/RPB3/SCL2/RB3
25
AN6/RPC0/RC0
26
AN7/RPC1/RC1
27
AN8/RPC2/PMA2/RC2
28
V
DD
29
SS
V
30
OSC1/CLKI/RPA2/RA2
31
OSC2/CLKO/RPA3/RA3
32
TDO/RPA8/PMA8/RA8
33
SOSCI/RPB4/RB4
34
SOSCO/RPA4/T1CK/CTED9/RA4
35
TDI/RPA9/PMA9/RA9
36
RPC3/RC3
37
RPC4/PMA4/RC4
38
RPC5/PMA3/RC5
39
SS
V
40
DD
V
41
PGED3/RPB5/PMD7/RB5
42
PGEC3/RPB6/PMD6/RB6
43
RPB7/CTED3/PMD5/INT0/RB7
44
RPB8/SCL1/CTED10/PMD4/RB8
SS
externally.
DS60001168L-page 14 2011-2019 Microchip Technology Inc.
Note 1:The RPn pins can be used by remappable peripherals. See Table 1 for the available peripherals and Section 11.3 “Peripheral Pin
(4)
/TMS/PMA10/RA10
PGED4
(4)
PGEC4
/TCK/CTED8/PMA7/RA7
REFOUT
CV
AN9/C3INA/RPB15/SCK2/CTED6/PMCS1/RB15
AV
AV
MCLR
PGED3/V
PGEC3/V
PGED1/AN2/C1IND/C2INB/C3IND/RPB0/PMD0/RB0
PGEC1/AN3/C1INC/C2INA/RPB1/CTED12/PMD1/RB1
2:Every I/O port pin (RAx-RCx) can be used as a change notification pin (CNAx-CNCx). See Section 11.0 “I/O Ports” for more information.
3:The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to V
4:This pin function is not available on PIC32MX210F016D and PIC32MX220F032D devices.
5:Shaded pins are 5V tolerant.
2.0 Guidelines for Getting Started with 32-bit MCUs........................................................................................................................ 27
3.0 CPU ............................................................................................................................................................................................ 37
5.0 Flash Program Memory.............................................................................................................................................................. 57
9.0 Direct Memory Access (DMA) Controller ................................................................................................................................... 87
10.0 USB On-The-Go (OTG)............................................................................................................................................................ 107
25.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 231
26.0 Power-Saving Features ........................................................................................................................................................... 237
27.0 Special Features ...................................................................................................................................................................... 243
28.0 Instruction Set .......................................................................................................................................................................... 255
29.0 Development Support............................................................................................................................................................... 257
32.0 DC and AC Device Characteristics Graphs.............................................................................................................................. 311
The Microchip Web Site ..................................................................................................................................................................... 347
Customer Change Notification Service .............................................................................................................................................. 347
Customer Support .............................................................................................................................................................................. 347
C) ..................................................................................................................................................... 177
DS60001168L-page 16 2011-2019 Microchip Technology Inc.
PIC32MX1XX/2XX 28/36/44-PIN FAMILY
TO OUR VALUED CUSTOMERS
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• Section 33. “Programming and Diagnostics” (DS60001129)
• Section 37. “Charge Time Measurement Unit (CTMU)” (DS60001167)
2
C)” (DS60001116)
REF
)” (DS60001109)
DS60001168L-page 18 2011-2019 Microchip Technology Inc.
PIC32MX1XX/2XX 28/36/44-PIN FAMILY
Note:Some features are not available on all devices. Refer to the family features tables (Ta bl e 1 and Table 2) for availability.
UART1-UART2
Comparators 1-3
PORTA
Remappable
PORTB
CTMU
JTAG
Priority
DMAC
ICD
MIPS32® M4K
®
ISDS
EJTAGINT
Bus Matrix
Data RAM
Peripheral Bridge
32
32-bit Wide
Flash
32 32
32
32
Peripheral Bus Clocked by PBCLK
Program Flash Memory
Controller
32
32
32
Interrupt
Controller
BSCAN
PORTC
PMP
I2C1-I2C2
SPI1-SPI2
IC1-IC5
PWM
OC1-OC5
OSC1/CLKI
OSC2/CLKO
V
DD
, V
SS
Timing
Generation
MCLR
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Precision
Reference
Band Gap
FRC/LPRC
Oscillators
Regulator
Vol tag e
V
CAP
OSC/S
OSC
Oscillators
PLL
Dividers
SYSCLK
PBCLK
Peripheral Bus Clocked by SYSCLK
USB
PLL-USB
USBCLK
32
RTCC
10-bit ADC
Timer1-Timer5
32
32
CPU Core
Pins
1.0DEVICE OVERVIEW
Note:This data sheet summarizes the features
of the PIC32MX1XX/2XX 28/36/44-pin
Family of devices. It is not intended to be
a comprehensive reference source. To
complement the information in this data
sheet, refer to documents listed in the
Documentation > Reference Manual
section of the Microchip PIC32 web site
(www.microchip.com/pic32).
FIGURE 1-1:BLOCK DIAGRAM
This document contains device-specific information for
PIC32MX1XX/2XX 28/36/44-pin Family of devices.
Figure 1-1 illustrates a general block diagram of the
core and peripheral modules in the PIC32MX1XX/2XX
28/36/44-pin Family of devices.
Table 1-1 lists the functions of the various pins shown
I/OSTPORTA is a bidirectional I/O port
RA12833420I/OST
RA269730I/OST
RA3710831I/OST
RA49121034I/OST
RA7———13I/OST
RA8———32I/OST
RA9———35I/OST
RA10———12I/OST
RB0143521I/OSTPORTB is a bidirectional I/O port
RB1253622I/OST
RB236123I/OST
RB347224I/OST
RB4811933I/OST
RB511141541I/OST
RB612
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
Pin
Typ e
I/OST
Buffer
Type
UART1 receive
O—UART1 transmit
IST
O—
IST
O—
IST
O—
UART2 receive
UART2 transmit
Synchronous serial clock input/output for
SPI1
SPI1 data in
SPI1 data out
pulse I/O
SPI2
SPI2 data in
SPI2 data out
pulse I/O
I2C1
Description
DS60001168L-page 22 2011-2019 Microchip Technology Inc.
PIC32MX1XX/2XX 28/36/44-PIN FAMILY
TABLE 1-1:PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
(1)
Pin Name
28-pin
QFN
28-pin
SSOP/
SPDIP/
SOIC
36-pin
VTLA
44-pin
QFN/
TQFP/
VTLA
Pin
Typ e
Buffer
Type
Description
SDA11518191I/OSTSynchronous serial data input/output for
I2C1
SCL247224I/OSTSynchronous serial clock input/output for
I2C2
SDA236123I/OSTSynchronous serial data input/output for
I2C2
TMS
19
11
(2)
(3)
22
14
(2)
(3)
25
15
(2)
(3)
12ISTJTAG Test mode select pin
TCK14171813ISTJTAG test clock input pin
TDI13161735O—JTAG test data input pin
TDO15181932O—JTAG test data output pin
RTCC47224OSTReal-Time Clock alarm output
C
VREF
-2833420IAnalog
VREF
+2723319IAnalog Comparator Voltage Reference (high)
C
C
VREFOUT
C1INA47224
22252814OAnalogComparator Voltage Reference output
Note 1: Pin numbers are provided for reference only. See the “Pin Diagrams” section for device pin availability.
2: Pin number for PIC32MX1XX devices only.
3: Pin number for PIC32MX2XX devices only.
DS60001168L-page 26 2011-2019 Microchip Technology Inc.
PIC32MX1XX/2XX 28/36/44-PIN FAMILY
2.0GUIDELINES FOR GETTING
STARTED WITH 32-BIT MCUs
Note:This data sheet summarizes the features
of the PIC32MX1XX/2XX 28/36/44-pin
Family of devices. It is not intended to be
a comprehensive reference source. To
complement the information in this data
sheet, refer to the documents listed in the
Documentation > Reference Manual
section of the Microchip PIC32 web site
(www.microchip.com/pic32).
2.1Basic Connection Requirements
Getting started with the PIC32MX1XX/2XX 28/36/44pin Family of 32-bit Microcontrollers (MCUs) requires
attention to a minimal set of device pin connections
before proceeding with development. The following is a
list of pin names, which must always be connected:
DD
•All V
•All AV
•V
•MCLR pin (see 2.4 “Master Clear (MCLR) Pin”)
• PGECx/PGEDx pins, used for In-Circuit Serial
• OSC1 and OSC2 pins, when external oscillator
The following pins may be required:
•V
and VSS pins (see 2.2 “Decoupling
Capacitors”)
DD
and AVSS pins, even if the ADC module
is not used (see 2.2 “Decoupling Capacitors”)
CAP
pin (see 2.3 “Capacitor on Internal
CAP
Voltage Regulator (V
Programming™ (ICSP™) and debugging purposes (see 2.5 “ICSP Pins”)
source is used (see 2.7 “External Oscillator
Pins”)
REF
+/V
REF
- pins – used when external voltage
reference for the ADC module is implemented
Note:The AV
nected, regardless of ADC use and the
ADC voltage reference source.
DD
)”)
and AVSS pins must be con-
2.2Decoupling Capacitors
The use of decoupling capacitors on power supply
pins, such as V
See Figure 2-1.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A value of 0.1 µF
(100 nF), 10-20V is recommended. The capacitor
should be a low Equivalent Series Resistance
(low-ESR) capacitor and have resonance frequency in the range of 20 MHz and higher. It is
further recommended that ceramic capacitors be
used.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended that
the capacitors be placed on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within onequarter inch (6 mm) in length.
• Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Note 1: If the USB module is not used, this pin must be
connected to V
DD
.
2: As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between V
DD
and
AV
DD
to improve ADC noise rejection. The inductor
impedance should be less than 3 and the inductor
capacity greater than 10 mA.
Where:
f
F
CNV
2
------------ --
=
f
1
2 LC
------------ -----------
=
L
1
2fC
------------ ----------
2
=
(i.e., ADC conversion rate/2)
Connect
(2)
V
USB3V
3
(1)
V
CAP
Tantalum or
ceramic 10 µF
ESR 3
(3)
1: Aluminum or electrolytic capacitors should not be
used. ESR 3 from -40ºC to 125ºC @ SYSCLK
frequency (i.e., MIPS).
1K
0.1 µF
Note 1: 470R1 1 will limit any current flowing into
MCLR
from the external capacitor C, in the event of
MCLR
pin breakdown, due to Electrostatic Discharge
(ESD) or Electrical Overstress (EOS). Ensure that the
MCLR
pin VIH and VIL specifications are met without
interfering with the Debug/Programmer tools.
2: The capacitor can be sized to prevent unintentional
Resets from brief glitches or to extend the device
Reset period during POR.
3: No pull-ups or bypass capacitors are allowed on
active debug/program PGECx/PGEDx pins.
R1
(1)
10k
V
DD
MCLR
PIC32
1 k
0.1 µF
(2)
PGECx
(3)
PGEDx
(3)
ICSP™
1
5
4
2
3
6
V
DD
V
SS
NC
R
C
FIGURE 2-1:RECOMMENDED
MINIMUM CONNECTION
2.4Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions:
• Device Reset
• Device programming and debugging
Pulling The MCLR
Figure 2-2 illustrates a typical MCLR circuit. During
device programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR
levels (V
IH
and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R and C will need to be adjusted based on the
application and PCB requirements.
For example, as illustrated in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the MCLR
pin during programming and debugging
operations.
Place the components illustrated in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR
FIGURE 2-2:EXAMPLE OF MCLR PIN
pin low generates a device Reset.
pin. Consequently, specific voltage
pin.
CONNECTIONS
2.2.1BULK CAPACITORS
The use of a bulk capacitor is recommended to improve
power supply stability. Typical values range from 4.7 µF
to 47 µF. This capacitor should be located as close to
the device as possible.
2.3Capacitor on Internal Voltage
2.3.1INTERNAL REGULATOR MODE
A low-ESR (3 ohm) capacitor is required on the V
pin, which is used to stabilize the internal voltage
regulator output. The V
to VDD, and must have a C
6V rating, connected to ground. The type can be
ceramic or tantalum. Refer to 30.0 “Electrical
Characteristics” for additional information on C
specifications.
DS60001168L-page 28 2011-2019 Microchip Technology Inc.
Regulator (V
CAP
)
CAP
pin must not be connected
EFC
capacitor, with at least a
CAP
EFC
2.5ICSP Pins
The PGECx and PGEDx pins are used for ICSP and
debugging purposes. It is recommended to keep the
trace length between the ICSP connector and the ICSP
pins on the device as short as possible. If the ICSP connector is expected to experience an ESD event, a
series resistor is recommended, with the value in the
range of a few tens of Ohms, not to exceed 100 Ohms.
PIC32MX1XX/2XX 28/36/44-PIN FAMILY
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communications to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
IH
) and input low (VIL) requirements.
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
®
ICD 3 or MPLAB REAL ICE™.
For more information on ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site:
®
• “Using MPLAB
ICD 3” (poster) (DS50001765)
• “MPLAB® ICD 3 Design Advisory” (DS50001764)
• “MPLAB® REAL ICE™ In-Circuit Debugger
User’s Guide” (DS50001616)
®
• “Using MPLAB
REAL ICE™ Emulator” (poster)
(DS50001749)
The oscillator circuit should be placed on the same side
of the board as the device. Also, place the oscillator circuit close to the respective oscillator pins, not exceeding one-half inch (12 mm) distance between them. The
load capacitors should be placed next to the oscillator
itself, on the same side of the board. Use a grounded
copper pour around the oscillator circuit to isolate them
from surrounding circuits. The grounded copper pour
should be routed directly to the MCU ground. Do not
run any signal traces or power traces inside the ground
pour. Also, if using a two-sided board, avoid any traces
on the other side of the board where the crystal is
placed. A suggested layout is illustrated in Figure 2-3.
FIGURE 2-3:SUGGESTED OSCILLATOR
CIRCUIT PLACEMENT
2.6JTAG
The TMS, TDO, TDI and TCK pins are used for testing
and debugging according to the Joint Test Action
Group (JTAG) standard. It is recommended to keep the
trace length between the JTAG connector and the
JTAG pins on the device as short as possible. If the
JTAG connector is expected to experience an ESD
event, a series resistor is recommended with the value
in the range of a few tens of Ohms, not to exceed 100
Ohms.
Pull-up resistors, series diodes and capacitors on the
TMS, TDO, TDI and TCK pins are not recommended
as they will interfere with the programmer/debugger
communications to the device. If such discrete components are an application requirement, they should be
removed from the circuit during programming and
debugging. Alternatively, refer to the AC/DC characteristics and timing requirements information in the
respective device Flash programming specification for
information on capacitive loading limits and pin input
IH
voltage high (V
) and input low (VIL) requirements.
2.7External Oscillator Pins
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 8.0 “Oscillator
Configuration” for details).
2.8Unused I/Os
Unused I/O pins should not be allowed to float as
inputs. They can be configured as outputs and driven
to a logic-low state.
Alternatively, inputs can be reserved by connecting the
Rounded to the nearest standard value or 12 pF in this example for
Primary Oscillator crystals “C1” and “C2”.
OSC2OSC1
1M
Typ ical XT
(4-10 MHz)
Circuit A
C1
C2
OSC2OSC1
Typ ical HS
(10-25 MHz)
Circuit B
C1
C2
Rs
OSC2
OSC1
1M
Typic al XT/ HS
(4-25 MHz)
Circuit C
C1
C2
1M
Rs
OSC2
OSC1
Not Recommended
Circuit D
Not Recommended
1M
Rs
OSC2OSC1
Circuit E
2.8.1CRYSTAL OSCILLATOR DESIGN
CONSIDERATION
The following example assumptions are used to
calculate the Primary Oscillator loading capacitor
values:
IN
= PIC32_OSC2_Pin Capacitance = ~4-5 pF
•C
OUT
•C
= PIC32_OSC1_Pin Capacitance = ~4-5 pF
• C1 and C2 = XTAL manufacturing recommended
loading capacitance
• Estimated PCB stray capacitance, (i.e.,12 mm
length) = 2.5 pF
EXAMPLE 2-1: CRYSTAL LOAD CAPACITOR
CALCULATION
The following tips are used to increase oscillator gain,
(i.e., to increase peak-to-peak oscillator signal):
• Select a crystal with a lower “minimum” power drive
rating
• Select an crystal oscillator with a lower XTAL
manufacturing “ESR” rating.
• Add a parallel resistor across the crystal. The smaller
the resistor value the greater the gain. It is recommended to stay in the range of 600k to 1M
• C1 and C2 values also affect the gain of the oscillator.
The lower the values, the higher the gain.
• C2/C1 ratio also affects gain. To increase the gain,
make C1 slightly smaller than C2, which will also help
start-up performance.
Note:Do not add excessive gain such that the
oscillator signal is clipped, flat on top of
the sine wave. If so, you need to reduce
the gain or add a series resistor, RS, as
shown in circuit “C” in Figure 2-4. Failure
to do so will stress and age the crystal,
which can result in an early failure. Adjust
the gain to trim the max peak-to-peak to
~V
DD
-0.6V. When measuring the oscilla-
tor signal you must use a FET scope
probe or a probe with 1.5 pF or the
scope probe itself will unduly change the
gain and peak-to-peak levels.
2.8.1.1Additional Microchip References
• AN588 “PICmicro® Microcontroller Oscill ato r
• AN826 “Crystal Oscillator Basics and Crystal
• AN849 “Basic PICmicro® Oscillator Design”
DS60001168L-page 30 2011-2019 Microchip Technology Inc.
Design Guide”
Selection for rfPIC™ and PICmicro
®
FIGURE 2-4:PRIMARY CRYSTAL
OSCILLATOR CIRCUIT
RECOMMENDATIONS
Devices”
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