Note the following details of the code protection feature on Microchip devices:
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
K
logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
The PIC24H Family of devices is ideal for a wide variety of 16-bit MCU embedded applications. The device
names, pin counts, memory sizes and peripheral availability of each device are listed below, followed by their
pinout diagrams.
PIC24H Family Controllers
DevicePins
PIC24HJ64GP206A64648898801 ADC,
PIC24HJ64GP210A100648898801 ADC,
PIC24HJ64GP506A64648898801 ADC,
PIC24HJ64GP510A100648898801 ADC,
PIC24HJ128GP206A 641288898801 ADC,
PIC24HJ128GP210A 1001288898801 ADC,
PIC24HJ128GP506A 641288898801 ADC,
PIC24HJ128GP510A 1001288898801 ADC,
PIC24HJ128GP306A 6412816898801 ADC,
PIC24HJ128GP310A 10012816898801 ADC,
PIC24HJ256GP206A 6425616898801 ADC,
PIC24HJ256GP210A 10025616898801 ADC,
PIC24HJ256GP610A 10025616898802 ADC,
Note 1:RAM size is inclusive of 2 Kbytes DMA RAM.
2:Maximum I/O pin count includes pins shared by the peripheral functions.
2.0Guidelines for Getting Started with 16-Bit Microcontrollers........................................................................................................ 23
5.0Flash Program Memory.............................................................................................................................................................. 63
21.0 Special Features ...................................................................................................................................................................... 221
22.0 Instruction Set Summary .......................................................................................................................................................... 229
23.0 Development Support............................................................................................................................................................... 237
25.0 High Temperature Electrical Characteristics ............................................................................................................................ 285
Index ................................................................................................................................................................................................. 307
The Microchip Web Site ..................................................................................................................................................................... 311
Customer Change Notification Service .............................................................................................................................................. 311
Product Identification System ............................................................................................................................................................ 313
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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of the PIC24HJXXXGPX06A/X08A/X10A
family of devices. However, it is not
intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the latest
family reference sections of the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
This document contains device specific information for
the following devices:
• PIC24HJ64GP206A
• PIC24HJ64GP210A
• PIC24HJ64GP506A
• PIC24HJ64GP510A
• PIC24HJ128GP206A
• PIC24HJ128GP210A
• PIC24HJ128GP506A
• PIC24HJ128GP510A
• PIC24HJ128GP306A
• PIC24HJ128GP310A
• PIC24HJ256GP206A
• PIC24HJ256GP210A
• PIC24HJ256GP610A
The PIC24HJXXXGPX06A/X08A/X10A device family
includes devices with different pin counts (64 and 100
pins), different program memory sizes (64 Kbytes, 128
Kbytes and 256 Kbytes) and different RAM sizes (8
Kbytes and 16 Kbytes).
This makes these families suitable for a wide variety of
high-performance digital signal control applications.
The devices are pin compatible with the dsPIC33F family of devices, and also share a very high degree of
compatibility with the dsPIC30F family devices. This
allows easy migration between device families as may
be necessitated by the specific functionality, computational resource and system cost requirements of the
application.
The PIC24HJXXXGPX06A/X08A/X10A device family
employs a powerful 16-bit architecture, ideal for
applications that rely on high-speed, repetitive
computations, as well as control.
The 17 x 17 multiplier, hardware support for division
operations, multi-bit data shifter, a large array of 16-bit
working registers and a wide variety of data addressing
modes, together provide the
PIC24HJXXXGPX06A/X08A/X10A Central Processing
Unit (CPU) with extensive mathematical processing
capability. Flexible and deterministic interrupt handling,
coupled with a powerful array of peripherals, renders
the PIC24HJXXXGPX06A/X08A/X10A devices suitable for control applications. Further, Direct Memory
Access (DMA) enables overhead-free transfer of data
between several peripherals and a dedicated DMA
RAM. Reliable, field programmable Flash program
memory ensures scalability of applications that use
PIC24HJXXXGPX06A/X08A/X10A devices.
Figure 1-1 shows a general block diagram of the
various core and peripheral modules in the
PIC24HJXXXGPX06A/X08A/X10A family of devices,
while Ta b le 1 -1 lists the functions of the various pins
shown in the pinout diagrams.
DDPPPositive supply for analog modules. This pin must be connected at all times.
AV
AVSSPPGround reference for analog modules.
CLKI
CLKO
CN0-CN23ISTInput change notification inputs.
C1RX
C1TX
C2RX
C2TX
PGED1
PGEC1
PGED2
PGEC2
PGED3
PGEC3
IC1-IC8ISTCapture inputs 1 through 8.
INT0
INT1
INT2
INT3
INT4
MCLR
OCFA
OCFB
OC1-OC8
OSC1
OSC2
RA0-RA7
RA9-RA10
RA12-RA15
RB0-RB15I/OSTPORTB is a bidirectional I/O port.
RC1-RC4
RC12-RC15
RD0-RD15I/OSTPORTD is a bidirectional I/O port.
RE0-RE7I/OSTPORTE is a bidirectional I/O port.
RF0-RF8
RF12-RF13
RG0-RG3
RG6-RG9
RG12-RG15
Legend: CMOS = CMOS compatible input or outputAnalog = Analog inputP = Power
ST = Schmitt Trigger input with CMOS levelsO = OutputI = Input
Pin
Type
I
O
I
O
I
O
I/O
I
I/O
I
I/O
I
I
I
I
I
I
I/PSTMaster Clear (Reset) input. This pin is an active-low Reset to the device.
I
I
O
I
I/O
I/O
I/O
I/O
I/O
I/O
I/OSTPORTF is a bidirectional I/O port.
I/O
I/O
I/O
Buffer
Typ e
ST/CMOS—External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes. Always associated
with OSC2 pin function.
Can be software programmed for internal weak pull-ups on all inputs.
ST
—
ST
—
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
ST
—
ST/CMOS—Oscillator crystal input. ST buffer when configured in RC mode; CMOS
ST
ST
ST
ST
ST
ST
ST
ST
ECAN1 bus receive pin.
ECAN1 bus transmit pin.
ECAN2 bus receive pin.
ECAN2 bus transmit pin.
Data I/O pin for programming/debugging communication channel 1.
Clock input pin for programming/debugging communication channel 1.
Data I/O pin for programming/debugging communication channel 2.
Clock input pin for programming/debugging communication channel 2.
Data I/O pin for programming/debugging communication channel 3.
Clock input pin for programming/debugging communication channel 3.
Synchronous serial clock input/output for SPI1.
SPI1 data in.
SPI1 data out.
SPI1 slave synchronization or frame pulse I/O.
Synchronous serial clock input/output for SPI2.
SPI2 data in.
SPI2 data out.
SPI2 slave synchronization or frame pulse I/O.
Synchronous serial clock input/output for I2C1.
Synchronous serial data input/output for I2C1.
Synchronous serial clock input/output for I2C2.
Synchronous serial data input/output for I2C2.
32.768 kHz low-power oscillator crystal output.
JTAG Test mode select pin.
JTAG test clock input pin.
JTAG test data input pin.
JTAG test data output pin.
This device data sheet is based on the following
individual chapters of the “dsPIC33F/PIC24H FamilyReference Manual”. These documents should be
considered as the general reference for the operation
of a particular module or device feature.
Note:To access the documents listed below,
browse to the documentation section of
the PIC24HJ256GP610A product page
on the Microchip web site
(www.microchip.com) or by selecting a
family reference manual section from
the following list.
In addition to parameters, features, and
other documentation, the resulting page
provides links to the related family
reference manual sections.
• Section 1. “Introduction” (DS70242)
• Section 2. “CPU” (DS70245)
• Section 3. “Data Memory” (DS70237)
• Section 4. “Program Memory” (DS70238)
• Section 5. “Flash Programming” (DS70228)
• Section 6. “Interrupts” (DS70224)
• Section 7. “Oscillator” (DS70227)
• Section 8. “Reset” (DS70229)
• Section 9. “Watchdog Timer and Power-Saving Modes” (DS70236)
2.0GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
Note 1: This data sheet summarizes the features
of the PIC24HJXXXGPX06A/X08A/X10A
family of devices. It is not intended to be
a comprehensive reference source. To
complement the information in this data
sheet, refer to the “dsPIC33F/PIC24HFamily Reference Manual”. Please see
the Microchip web site
(www.microchip.com) for the latest
dsPIC33F/PIC24H Family Reference
Manual sections.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
2.1Basic Connection Requirements
Getting started with the
PIC24HJXXXGPX06A/X08A/X10A family of 16-bit
Microcontrollers (MCUs) requires attention to a minimal
set of device pin connections before proceeding with
development. The following is a list of pin names, which
must always be connected:
DD and VSS pins
• All V
(see Section 2.2 “Decoupling Capacitors”)
• All AV
•V
•MCLR
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
•V
DD and AVSS pins (regardless if ADC module
is not used)
(see Section 2.2 “Decoupling Capacitors”)
CAP
(see Section 2.3 “CPU Logic Filter Capacitor
Connection (Vcap)”)
pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
REF+/VREF- pins used when external voltage
reference for ADC module is implemented
Note:The AV
connected independent of the ADC
voltage reference source.
DD and AVSS pins must be
2.2Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as V
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
• Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR
pin
V
IH and VIL specifications are met.
C
R1
R
V
DD
MCLR
PIC24H
JP
FIGURE 2-1:RECOMMENDED
MINIMUM CONNECTION
2.2.1TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including MCUs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that connects the power supply source to the device, and the
maximum current drawn by the device in the application. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.4Master Clear (MCLR) Pin
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device programming and debugging
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR
specific voltage levels (VIH and VIL) and fast signal
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For example, as shown in Figure 2-2, it is
recommended that the capacitor C, be isolated from
the MCLR
pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR
FIGURE 2-2:EXAMPLE OF MCLR PIN
CONNECTIONS
pin. Consequently,
pin.
2.3CPU Logic Filter Capacitor
CAP)
Connection (V
A low-ESR (< 5 Ohms) capacitor is required on the
CAP pin, which is used to stabilize the voltage
V
regulator output voltage. The V
connected to V
4.7 µF and 10 µF, 16V connected to ground. The type
can be ceramic or tantalum. Refer to Section 24.0
“Electrical Characteristics” for additional
information.
The placement of this capacitor should be close to the
CAP. It is recommended that the trace length not
V
exceed one-quarter inch (6 mm). Refer to Section 21.2
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging purposes. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communications to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
IH) and input low (VIL) requirements.
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
For more information on ICD 2, ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip website.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB® ICD 3 In-Circuit Debugger”
• “MPLAB
• “MPLAB
• “Using MPLAB
®
ICD 2, MPLAB ICD 3 or MPLAB REAL ICE™.
®
ICD 2 In-Circuit Debugger User’s
Guide” DS51331
®
®
ICD 2” (poster) DS51265
ICD 2 Design Advisory” DS51566
(poster) DS51765
®
ICD 3 Design Advisory” DS51764
®
REAL ICE™ In-Circuit Emulator User’s
Guide” DS51616
®
REAL ICE™” (poster) DS51749
2.6External Oscillator Pins
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 9.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
If the PLL of the target device is enabled and
configured for the device start-up oscillator, the
maximum oscillator source frequency must be limited
to ≤8 MHz for start-up with PLL enabled to comply with
device PLL start-up conditions. This means that if the
external oscillator frequency is outside this range, the
application must start-up in the FRC mode first. The
default PLL settings after a POR with an oscillator
frequency outside this range will violate the device
operating speed.
Once the device powers up, the application firmware
can initialize the PLL SFRs, CLKDIV and PLLDBF to a
suitable value, and then perform a clock switch to the
Oscillator + PLL clock source. Note that clock switching
must be enabled in the device Configuration word.
2.8Configuration of Analog and
Digital Pins During ICSP
Operations
If MPLAB ICD 2, ICD 3 or REAL ICE is selected as a
debugger, it automatically initializes all of the A/D input
pins (ANx) as “digital” pins, by setting all bits in the
AD1PCFGL register.
The bits in this register that correspond to the A/D pins
that are initialized by MPLAB ICD 2, ICD 3, or REAL
ICE, must not be cleared by the user application
firmware; otherwise, communication errors will result
between the debugger and the device.
If your application needs to use certain A/D pins as
analog input pins during the debug session, the user
application must clear the corresponding bits in the
AD1PCFGL register during initialization of the ADC
module.
When MPLAB ICD 2, ICD 3 or REAL ICE is used as a
programmer, the user application firmware must
correctly configure the AD1PCFGL register. Automatic
initialization of this register is only done during
debugger operation. Failure to correctly configure the
register(s) will result in all A/D pins being recognized as
analog input pins, resulting in the port value being read
as a logic ‘0’, which may affect user application
functionality.
2.9Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic-low state.
Alternatively, connect a 1k to 10k resistor between V
and the unused pins.
of the PIC24HJXXXGPX06A/X08A/X10A
family of devices. However, it is not
intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to
Section 2. “CPU” (DS70245) of the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip website (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
The PIC24HJXXXGPX06A/X08A/X10A CPU module
has a 16-bit (data) modified Harvard architecture with an
enhanced instruction set and addressing modes. The
CPU has a 24-bit instruction word with a variable length
opcode field. The Program Counter (PC) is 23 bits wide
and addresses up to 4M x 24 bits of user program
memory space. The actual amount of program memory
implemented varies by device. A single-cycle instruction
prefetch mechanism is used to help maintain throughput
and provides predictable execution. All instructions
execute in a single cycle, with the exception of
instructions that change the program flow, the double
word move (MOV.D) instruction and the table instructions.
Overhead-free, single-cycle program loop constructs are
supported using the REPEAT instruction, which is
interruptible at any point.
The PIC24HJXXXGPX06A/X08A/X10A devices have
sixteen, 16-bit working registers in the programmer’s
model. Each of the working registers can serve as a data,
address or address offset register. The 16th working
register (W15) operates as a software Stack Pointer (SP)
for interrupts and calls.
The PIC24HJXXXGPX06A/X08A/X10A instruction set
includes many addressing modes and is designed for
optimum C compiler efficiency. For most instructions,
the PIC24HJXXXGPX06A/X08A/X10A is capable of
executing a data (or program data) memory read, a
working register (data) read, a data memory write and
a program (instruction) memory read per instruction
cycle. As a result, three parameter instructions can be
supported, allowing A + B = C operations to be
executed in a single cycle.
A block diagram of the CPU is shown in Figure 3-1,
and the programmer’s model for the
PIC24HJXXXGPX06A/X08A/X10A is shown in
Figure 3-2.
3.1Data Addressing Overview
The data space can be linearly addressed as 32K words
or 64 Kbytes using an Address Generation Unit (AGU).
The upper 32 Kbytes of the data space memory map can
optionally be mapped into program space at any 16K
program word boundary defined by the 8-bit Program
Space Visibility Page (PSVPAG) register. The program to
data space mapping feature lets any instruction access
program space as if it were data space.
The data space also includes 2 Kbytes of DMA RAM,
which is primarily used for DMA data transfers, but may
be used as general purpose RAM.
3.2Special MCU Features
The PIC24HJXXXGPX06A/X08A/X10A features a
17-bit by 17-bit, single-cycle multiplier. The multiplier
can perform signed, unsigned and mixed-sign
multiplication. Using a 17-bit by 17-bit multiplier for
16-bit by 16-bit multiplication makes mixed-sign
multiplication possible.
The PIC24HJXXXGPX06A/X08A/X10A supports 16/16
and 32/16 integer divide operations. All divide
instructions are iterative operations. They must be
executed within a REPEAT loop, resulting in a total
execution time of 19 instruction cycles. The divide
operation can be interrupted during any of those
19 cycles without loss of data.
A multi-bit data shifter is used to perform up to a 16-bit,
left or right shift in a single cycle.
C = Clear only bitR = Readable bitU = Unimplemented bit, read as ‘0’
S = Set only bitW = Writable bit-n = Value at POR
‘1’ = Bit is set‘0’ = Bit is clearedx = Bit is unknown
bit 15-9Unimplemented: Read as ‘0’
bit 8DC: MCU ALU Half Carry/Borrow
1 = A carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized data)
0 = No carry-out from the 4th low-order bit (for byte sized data) or 8th low-order bit (for word sized
bit 7-5IPL<2:0>: CPU Interrupt Priority Level Status bits
111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 4RA: REPEAT Loop Active bit
1 = REPEAT loop in progress
0 = REPEAT loop not in progress
bit 3N: MCU ALU Negative bit
1 = Result was negative
0 = Result was non-negative (zero or positive)
bit 2OV: MCU ALU Overflow bit
This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the magnitude which
causes the sign bit to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation)
0 = No overflow occurred
bit 1Z: MCU ALU Zero bit
1 = An operation which affects the Z bit has set it at some time in the past
0 = The most recent operation which affects the Z bit has cleared it (i.e., a non-zero result)
bit 0C: MCU ALU Carry/Borrow
1 = A carry-out from the Most Significant bit (MSb) of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
(2)
R/W-0
(2)
of the result occurred
data) of the result occurred
R/W-0
(2)
R-0R/W-0R/W-0R/W-0R/W-0
RANOVZC
bit
(2)
bit
Note 1: The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when
IPL<3> = 1.
2: The IPL<2:0> Status bits are read only when NSTDIS = 1 (INTCON1<15>).