Datasheet PIC18F23K20, PIC18F24K20, PIC18F25K20, PIC18F26K20, PIC18F43K20 Datasheet

...
PIC18F23K20/24K20/25K20/26K20/
43K20/44K20/45K20/46K20
Data Sheet
28/40/44-Pin Flash Microcontrollers
with nanoWatt XLP Technology
2010 Microchip Technology Inc. DS41303G
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information c ontained in t his p ublication regarding d evice applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that yo ur ap plication me ets wi th yo ur sp ecifications. MICROCHIP MAKES N O R EPRESENTATIONS OR WARRANTIES OF AN Y KIN D W HETHER EXPRESS OR IMPLIED, WR ITTEN O R O RAL, ST ATUTORY OR OTHERWISE, RE LATED T O T HE I NFORMATION, INCLUDING B UT NOT L IMITED T O IT S C ONDITION, QUALITY, PE RFORMANCE, M ERCHANTABILITY OR FITNESS FOR PU RPOSE. Microchip dis claims al l lia bility arising f rom t his i nformation an d its use. U se o f Microchip devices in li fe support a nd/or safety applications is e ntirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold h armless M icrochip f rom a ny an d al l da mages, claims, suits, o r e xpenses re sulting f rom such u se. No li censes are conveyed, im plicitly or ot herwise, under an y M icrochip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
K rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC
32
logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
DS41303G-page 2 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
28/40/44-Pin Flash Microcontrollers
with nanoWatt XLP Technology

High-Performance RISC CPU:

• C Compiler Optimized Architecture:
- Optional extended instruction set designed to optimize re-entrant code
• Up to 1024 bytes Data EEPROM
• Up to 64 Kbytes Linear Program Memory Addressing
• Up to 3936 bytes Linear Data Memory Addressing
• Up to 16 MIPS Operation
• 16-bit Wide Instructions, 8-bit Wide Data Path
• Priority Levels for Interrupts
• 31-Level, Software Accessible Hardware Stack
• 8 x 8 Single-Cycle Hardware Multiplier

Flexible Oscillator Struc ture:

• Precision 16 MHz Internal Oscillator Block:
- Factory calibrated to ± 1%
- Software selectable frequencies range of
31 kHz to 16 MHz
- 64 MHz performance available using PLL –
no external components required
• Four Crystal modes up to 64 MHz
• Two External Clock modes up to 64 MHz
• 4X Phase Lock Loop (PLL)
• Secondary Oscillator using Timer1 @ 32 kHz
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if peripheral clock
stops
- Two-Speed Oscillator Start-up

Special Microcontroller Features:

• Operating Voltage Range: 1.8V to 3.6V
• Self-Programmable under Software Control
• Programmable 16-Level High/Low-Voltage Detection (HLVD) module:
- Interrupt on High/Low-Voltage Detection
• Programmable Brown-out Reset (BOR):
- With software enable option
• Extended Watchdog Timer (WDT):
- Programmable period from 4 ms to 131s
• Single-Supply 3V In-Circuit Serial Programming™ (ICSP™) via Two Pins
• In-Circuit Debug (ICD) via Two Pins

Extreme Low-Power Management with nanoWatt XLP:

• Sleep mode: < 100 nA @ 1.8V
• Watchdog Timer: < 800 nA @ 1.8V
• Timer1 Oscillator: < 800 nA @ 32 kHz and 1.8V

Analog Features:

• Analog-to-Digital Converter (ADC) module:
- 10-bit resolution, 13 External Channels
- Auto-acquisition capability
- Conversion available during Sleep
- 1.2V Fixed Voltage Reference (FVR) channel
- Independent input multiplexing
• Analog Comparator module:
- Two rail-to-rail analog comparators
- Independent input multiplexing
• Voltage Reference (CV
- Programmable (% VDD), 16 steps
- Two 16-level voltage ranges using V
REF) module
REF pins

Peripheral Highlight s:

• Up to 35 I/O Pins plus 1 Input-only Pin:
- High-Current Sink/Source 25 mA/25 mA
- Three programmable external interrupts
- Four programmable interrupt-on-change
- Eight programmable weak pull-ups
- Programmable slew rate
• Capture/Compare/PWM (CCP) module
• Enhanced CCP (ECCP) module:
- One, two or four PWM outputs
- Selectable polarity
- Programmable dead time
- Auto-Shutdown and Auto-Restart
• Master Synchronous Serial Port (MSSP) module
- 3-wire SPI (supports all 4 modes)
2
-I
C™ Master and Slave modes with address
mask
• Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) module:
- Supports RS-485, RS-232 and LIN
- RS-232 operation using internal oscillator
- Auto-Wake-up on Break
- Auto-Baud Detect
2010 Microchip Technology Inc. DS41303G-page 3
PIC18F2XK20/4XK20
-
Program Memory Data Memory
Device
PIC18F23K20 8K 4096 512 256 25 11 1/1 Y Y 1 2 1/3
PIC18F24K20 16K 8192 768 256 25 11 1/1 Y Y 1 2 1/3
PIC18F25K20 32K 16384 1536 256 25 11 1/1 Y Y 1 2 1/3
PIC18F26K20 64k 32768 3936 1024 25 11 1/1 Y Y 1 2 1/3
PIC18F43K20 8K 4096 512 256 36 14 1/1 Y Y 1 2 1/3
PIC18F44K20 16K 8192 768 256 36 14 1/1 Y Y 1 2 1/3
PIC18F45K20 32K 16384 1536 256 36 14 1/1 Y Y 1 2 1/3
PIC18F46K20 64k 32768 3936 1024 36 14 1/1 Y Y 1 2 1/3
Note 1: One pin is input only.
2: Channel count includes internal fixed voltage reference channel.
Flash
(bytes)
# Single-Word
Instructions
SRAM (bytes)
EEPROM
(bytes)
I/O
10-bit
(1)
A/D
(ch)
CCP/
ECCP
(2)
(PWM)
SPI
MSSP
Master
2
C™
I
Comp.
EUSART
Timers
8/16-bit
DS41303G-page 4 2010 Microchip Technology Inc.

Pin Diagrams

RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/KBI0/AN11 RB3/AN9/C12IN2-/CCP2
(1)
RB2/INT2/AN8 RB1/INT1/AN10/C12IN3­RB0/INT0/FLT0/AN12 V
DD
VSS RD7/PSP7/P1D RD6/PSP6/P1C
RD5/PSP5/P1B RD4/PSP4 RC7/RX/DT RC6/TX/CK RC5/SDO
RC4/SDI/SDA RD3/PSP3
RD2/PSP2
MCLR/VPP/RE3
RA0/AN0/C12IN0­RA1/AN1/C12IN1-
RA2/AN2/V
REF-/CVREF/C2IN+
RA3/AN3/V
REF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS
/HLVDIN/C2OUT
RE0/RD
/AN5
RE1/WR
/AN6
RE2/CS
/AN7
V
DD
VSS
OSC1/CLKIN/RA7 OSC2/CLKOUT/RA6 RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
(1)
RC2/CCP1/P1A
RC3/SCK/SCL
RD0/PSP0 RD1/PSP1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
10 11
2 3 4 5 6
1
8
7
9
12 13 14
15
16
17
18
19
20
23
24
25
26
27
28
22 21
MCLR/VPP/RE3 RA0/AN0/C12IN0­RA1/AN1/C12IN1-
RA2/AN2/V
REF-/CVREF/C2IN+
RA3/AN3/V
REF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS
/HLVDIN/C2OUT
V
SS
OSC1/CLKIN/RA7
OSC2/CLKOUT/RA6 RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
(1)
RC2/CCP1/P1A
RC3/SCK/SCL
RB7/KBI3/PGD RB6//KBI2/PGC RB5/KBI1/PGM RB4/KBI0/AN11/P1D RB3/AN9/C12IN2-/CCP2
(1)
RB2/INT2/AN8/P1B RB1/INT1/AN10/C12IN3-/P1C RB0/INT0/FLT0/AN12 V
DD
VSS RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA
40-pin PDIP
28-pin PDIP, SOIC, SSOP
Note 1: RB3 is the alternate pin for CCP2 multiplexing.
2: UQFN package availability applies only to PIC18F23K20.
10 11
2 3
6
1
18
19
20
21
22
12 13 14
15
8
7
16
17
232425262728
9
RC0/T1OSO/T13CKI
5
4
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4/KBI0/AN11/P1D
RB3/AN9/C12IN2-/CCP2
(1)
RB2/INT2/AN8/P1B RB1/INT1/AN10/C12IN3-/P1C RB0/INT0/FLT0/AN12 V
DD
VSS RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
MCLR
/VPP/RE3
RA0/AN0/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3/V
REF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS
/HLVDIN/C2OUT
V
SS
OSC1/CLKIN/RA7
OSC2/CLKOUT/RA6
RC1/T1OSI/CCP2
(1)
RC2/CCP1/P1A
RC3/SCK/SCL
28-pin QFN/UQFN
(2)
PIC18F23K20
PIC18F24K20
PIC18F25K20
PIC18F26K20
PIC18F43K20
PIC18F44K20
PIC18F45K20
PIC18F46K20
PIC18F23K20 PIC18F24K20 PIC18F25K20 PIC18F26K20
PIC18F2XK20/4XK20
2010 Microchip Technology Inc. DS41303G-page 5
PIC18F2XK20/4XK20
Note 1: RB3 is the alternate pin for CCP2 multiplexing.
10 11
2 3 4 5 6
1
1819202122
121314
15
38
8
7
4443424140
39
16
17
29
30
31
32
33
23
24
25
26
27
28
363435
9
37
RA3/AN3/V
REF+/C1IN+
RA2/AN2/V
REF-/CVREF/C2IN+
RA1/AN1/C12IN1-
RA0/AN0/C12IN0-
MCLR
/VPP/RE3
RB3/AN9/C12IN2-/CCP2
(1)
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4/KBI0/AN11
NC
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1/P1A
RC1/T1OSI/CCP2
(1)
RC0/T1OSO/T13CKI
OSC2/CLKOUT/RA6 OSC1/CLKIN/RA7 V
SS
VSS VDD VDD RE2/CS/AN7 RE1/WR
/AN6
RE0/RD
/AN5
RA5/AN4/SS
/HLVDIN/C2OUT
RA4/T0CKI/C1OUT
RC7/RX/DT
RD4/PSP4 RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D
V
SS
VDD VDD
RB0/INT0/FLT0/AN12
RB1/INT1/AN10/C12IN3-
RB2/INT2/AN8
44-pin QFN
10 11
2 3 4 5 6
1
1819202122
121314
15
38
8
7
4443424140
39
16
17
29
30
31
32
33
23
24
25
26
27
28
363435
9
37
RA3/AN3/VREF+/C1IN+
RA2/AN2/V
REF-/CVREF/C2IN+
RA1/AN1/C12IN1-
RA0/AN0/C12IN0-
MCLR
/VPP/RE3
NC
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4/KBI0/AN11
NC
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1/P1A
RC1/T1OSI/CCP2
(1)
NC
NC RC0/T1OSO/T13CKI OSC2/CLKOUT/RA6 OSC1/CLKIN/RA7 V
SS
VDD RE2/CS/AN7 RE1/WR
/AN6
RE0/RD
/AN5
RA5/AN4/SS
/HLVDIN/C2OUT
RA4/T0CKI/C1OUT
RC7/RX/DT
RD4/PSP4 RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D
V
SS
VDD
RB0/INT0/FLT0/AN12
RB1/INT1/AN10/C12IN3-
RB2/INT2/AN8
RB3/AN9/C12IN2-/CCP2
(1)
44-pin TQFP
PIC18F43K20 PIC18F44K20 PIC18F45K20 PIC18F46K20
PIC18F43K20 PIC18F44K20 PIC18F45K20 PIC18F46K20

Pin Diagrams (Cont.’d)

DS41303G-page 6 2010 Microchip Technology Inc.

T ABLE 1: PIC18F4XK20 PIN SUMMARY

PIC18F2XK20/4XK20
DIL Pin
TQFP Pin
2 19 19 RA0 AN0 C12IN0- 3 20 20 RA1 AN1 C12IN1- ————————
4 21 21 RA2 AN2 C2IN+ VREF-/
5 22 22 RA3 AN3 C1IN+ VREF+ ——————— 6 23 23 RA4 C1OUT T0CKI
7 24 24 RA5 AN4 C2OUT HLVDIN
14 31 33 RA6 OSC2/
13 30 32 RA7 33 8 9 RB0 AN12 FLT0 INT0 Yes 34 9 10 RB1 AN10 C12IN3- ———— — —INT1 Yes 35 10 11 RB2 AN8 INT2 Ye s 36 11 12 RB3 AN9 C12IN2- CCP2 37 14 14 RB4 AN11 KBI0 Ye s 38 15 15 RB5 ————————KBI1 Yes PGM 39 16 16 RB6 KBI2 Ye s PGC
40 17 17 RB7 15 32 34 RC0 T1OSO/
16 35 35 RC1 ———CCP2 17 36 36 RC2 CCP1/
18 37 37 RC3 —————SCK/
23 42 42 RC4 SDI/
24 43 43 RC5 —————SDO — ——— 25 44 44 RC6 TX/CK 26 1 1 RC7 ————RX/DT ————— 19 38 38 RD0 PSP0 20 39 39 RD1 ———————PSP1 —— 21 40 40 RD2 PSP2 22 41 41 RD3 ———————PSP3 —— 27 2 2 RD4 PSP4 28 3 3 RD5 ———P1B —— —PSP5 —— 29 4 4 RD6 P1C PSP6 30 5 5 RD7 ———P1D —— —PSP7 ——
8 25 25 RE0 AN5
9 26 26 RE1 AN6
10 27 27 RE2 AN7
11818RE3
11 7 7 VDD 32 28 28 — — —————— ——— VDD 12 6 6 VSS 31 29 30 — — —————— ——— VSS
NC 8 VDD –NC29 — — ————————— VDD
–- NC 31 VSS
Note 1: CCP2 multiplexed with RB3 when CONFIG3H<0> = 0
2: CCP2 multiplexed with RC1 when CONFIG3H<0> = 1 3: Input-only.
I/O
QFN Pin
(3)
Analog
Comparator
CV
Reference
REF
— —————————OSC1/CLKIN
————————KBI3 Yes PGD
— —————— —
— —————————
ECCP
EUSART
MSSP
Timers
——
(1)
—— — — — Ye s
(2)
——T1OSI ———
P1A
SS
————
T13CKI
————
SCL
SDA
Slave
Interrupts
Pull-up
CLKOUT
RD
WR
CS
— —— — —
MCLR/VPP
Basic
2010 Microchip Technology Inc. DS41303G-page 7
PIC18F2XK20/4XK20

TABLE 2: PIC18F2XK20 PIN SUMMARY

Pin DIL
2 27 RA0 AN0 C12IN0-
3 28 RA1 AN1 C12IN1-
4 1 RA2 AN2 C2IN+ VREF-/
5 2 RA3 AN3 C1IN+ VREF+
6 3 RA4 C1OUT T0CKI
7 4 RA5 AN4 C2OUT HLVDIN
10 7 RA6 OSC2/
9 6 RA7 OSC1/
21 18 RB0 AN12 FLT0 INT0 Yes
22 19 RB1 AN10 C12IN3- P1C INT1 Yes
23 20 RB2 AN8 P1B INT2 Yes
24 21 RB3 AN9 C12IN2- CCP2
25 22 RB4 AN11 P1D KBI0 Yes
26 23 RB5 KBI1 Yes PGM
27 24 RB6 KBI2 Yes PGC
28 25 RB7 KBI3 Yes PGD
11 8 RC0 T1OSO/
12 9 RC1 CCP2
13 10 RC2 CCP1/
14 11 RC3 SCK/
15 12 RC4 SDI/
16 13 RC5 SDO
17 14 RC6 TX/CK
18 15 RC7 RX/DT
126RE3
8 5 VSS
19 16 VSS
20 17 VDD
Note 1: CCP2 multiplexed with RB3 when CONFIG3H<0> = 0
2: CCP2 multiplexed with RC1 when CONFIG3H<0> = 1 3: Input-only
I/O
Pin QUAD
Analog
(3)
Comparator
CV
Reference
REF
P1A
ECCP
(1)
(2)
EUSART
SS
SCL
SDA
MSSP
Timers
T13CKI
T1OSI
Slave
Interrupts
Pull-up
CLKOUT
CLKIN
Yes
MCLR/
V
Basic
PP
DS41303G-page 8 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20

Table of Contents

1.0 Device Overview ....................................................................................................................................................................... 11
2.0 Oscillator Module (With Fail-Safe Clock Monitor)...................................................................................................................... 27
3.0 Power-Managed Modes ............................................................................................................................................................ 43
4.0 Reset......................................................................................................................................................................................... 51
5.0 Memory Organization ................................................................................................................................................................ 65
6.0 Flash Program Memory............................................................................................................................................................. 89
7.0 Data EEPROM Memory............................................................................................................................................................ 99
8.0 8 x 8 Hardware Multiplier......................................................................................................................................................... 105
9.0 Interrupts................................................................................................................................................................................. 107
10.0 I/O Ports .................................................................................................................................................................................. 121
11.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................ 143
12.0 Timer0 Module ........................................................................................................................................................................ 155
13.0 Timer1 Module ........................................................................................................................................................................ 159
14.0 Timer2 Module ........................................................................................................................................................................ 167
15.0 Timer3 Module ........................................................................................................................................................................ 169
16.0 Enhanced Capture/Compare/PWM (ECCP) Module............................................................................................................... 173
17.0 Master Synchronous Serial Port (MSSP) Module ................................................................................................................... 193
18.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .............................................................. 237
19.0 Analog-to-Digital Converter (ADC) Module ............................................................................................................................. 265
20.0 Comparator Module................................................................................................................................................................. 279
21.0 Voltage References ................................................................................................................................................................. 289
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................ 293
23.0 Special Features of the CPU................................................................................................................................................... 299
24.0 Instruction Set Summary......................................................................................................................................................... 315
25.0 Development Support.............................................................................................................................................................. 365
26.0 Electrical Characteristics......................................................................................................................................................... 369
27.0 DC and AC Characteristics Graphs and Tables...................................................................................................................... 403
28.0 Packaging Information............................................................................................................................................................. 427
Appendix A: Revision History............................................................................................................................................................ 441
Appendix B: Device Differences ....................................................................................................................................................... 442
Index ................................................................................................................................................................................................. 443
The Microchip Web Site.................................................................................................................................................................... 453
Customer Change Notification Service ............................................................................................................................................. 453
Customer Support ............................................................................................................................................................................. 453
Reader Response ............................................................................................................................................................................. 454
Product Identification System ........................................................................................................................................................... 455
2010 Microchip Technology Inc. DS41303G-page 9
PIC18F2XK20/4XK20
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs . Our publications will be refined and enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@mail.microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
• The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277 When contacting a sales office or t he literature center, please specify which device, revision of silicon and data sheet (include
literature number) you are using.

Customer Notification System

Register on our web site at www.microchip.com/cn to receive the most current information on all of our products.
DS41303G-page 10 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20

1.0 DEVICE OVERVIEW

This document contains device specific information for the following devices:
• PIC18F23K20 • PIC18F43K20
• PIC18F24K20 • PIC18F44K20
• PIC18F25K20 • PIC18F45K20
• PIC18F26K20 • PIC18F46K20
This fam ily of fers th e ad vantages of a ll PI C18 microcontrollers – na mely, hig h computational performance at an economical price – with the addition of high-endurance, Flash program memory. On top of these fea tures, the PIC18F2XK20/4XK20 fam ily introduces d esign en hancements t hat make t hese microcontrollers a log ical ch oice for many hig h­performance, power sensitive applications.

1.1 New Core Features

1.1.1 nanoWatt TECHNOLOGY

All of t he devices in the PIC18F2XK20/4XK20 family incorporate a ra nge o f features that c an s ignificantly reduce power c onsumption d uring operation. Ke y items include:
Alternate Run Modes: By clocking the controller
from the Timer1 source or the internal oscillator block, power consumption during code execution can be reduced by as much as 90%.
Multiple Idle Modes: The controller can also run
with its CPU core disabled but the peripherals still active. In these states, power consumption can be reduced even further, to as little as 4% of normal operation requirements.
On-the-fly Mode Switching: The power-
managed modes are invoked by user code during operation, allowing the user to incorporate power­saving ideas into their application’s software design.
Low Consumption in Key Modules: The
power requirements for both Timer1 and the Watchdog Timer are minimized. See
Section 26.0 “Electrical Characteristics”
for values.

1.1.2 MULTIPLE OSCILLATOR OPTIONS AND FEATURES

All of th e devices in the PIC18F2XK20/4XK20 family offer ten d ifferent oscillator options, allowing us ers a wide r ange o f ch oices in de veloping a pplication hardware. These include:
• Four Crystal modes, using crystals or ceramic
resonators
• Two External Clock modes, offering the option of
using two pins (oscillator input and a divide-by-4 clock output) or one pin (oscillator input, with the second pin reassigned as general I/O)
• Two External RC Oscillator modes with the same
pin options as the External Clock modes
• An internal oscillator block which contains a
16 MHz HFINTOSC oscillator and a 31 kHz LFINTOSC oscillator which together provide 8 user selectable clock frequencies, from 31 kHz to 16 MHz. This option frees the two oscillator pins for use as additional general purpose I/O.
• A Phase Lock Loop (PLL) frequency multiplier,
available to both the high-speed crystal and inter­nal oscillator modes, which allows clock speeds of up to 64 MHz. Used with the internal oscillator, the PLL gives users a complete selection of clock speeds, from 31 kHz to 64 MHz – all without using an external crystal or clock circuit.
Besides its availability as a cl ock so urce, the internal oscillator block provides a stable reference source that gives th e fam ily a dditional feat ures for ro bust operation:
Fail-Safe Clock Monitor: This option constantly
monitors the main clock source against a refer­ence signal provided by the LFINTOSC. If a clock failure occurs, the controller is switched to the internal oscillator block, allowing for continued operation or a safe application shutdown.
T wo-S pe ed Start-up: This option allows the
internal oscillator to serve as the clock source from Power-on Reset, or wake-up from Sleep mode, until the primary clock source is available.
2010 Microchip Technology Inc. DS41303G-page 11
PIC18F2XK20/4XK20

1.2 Other Special Features

Memory Endurance: The Flash cells for both
program memory and data EEPROM are rated to last for many thousands of erase/write cycles – up to 10K for program memory and 100K for EEPROM. Data retention without refresh is conservatively estimated to be greater than 40 years.
Self-programmability: These devices can write
to their own program memory spaces under inter­nal software control. By using a bootloader rou­tine located in the protected Boot Block at the top of program memory, it becomes possible to create an application that can update itself in the field.
Extended Instruction Set: The PIC18F2XK20/
4XK20 family introduces an optional extension to the PIC18 instruction set, which adds 8 new instructions and an Indexed Addressing mode. This extension, enabled as a device configuration option, has been specifically designed to optimize re-entrant application code originally developed in high-level languages, such as C.
Enhanced CCP module: In PWM mode, this
module provides 1, 2 or 4 modulated outputs for controlling half-bridge and full-bridge drivers. Other features include:
- Auto-Shutdown, for disabling PWM outputs on interrupt or other select conditions
- Auto-Restart, to reactivate outputs once the condition has cleared
- Output steering to selectively enable one or more of 4 outputs to provide the PWM signal.
Enhanced Addressable USART: This serial
communication module is capable of standard RS-232 operation and provides support for the LIN bus protocol. Other enhancements include automatic baud rate detection and a 16-bit Baud Rate Generator for improved resolution. When the microcontroller is using the internal oscillator block, the USART provides stable operation for applications that talk to the outside world without using an external crystal (or its accompanying power requirement).
10-bit A/D Converter: This module incorporates
programmable acquisition time, allowing for a channel to be selected and a conversion to be initiated without waiting for a sampling period and thus, reduce code overhead.
Extended Watchdog Timer (WDT): This
enhanced version incorporates a 16-bit postscaler, allowing an extended time-out range that is stable across operating voltage and
temperature. See Section 26.0 “Electrical
Characteristics” for time-out periods.

1.3 Details on Individual Family Members

Devices in the PIC18F2XK20/4XK20 family are av ail­able in 28-pin and 40/44-pin packages. Block diagrams for the tw o g roups are shown i n Fi gure 1-1 an d Figure 1-2.
The devices are differentiated from each other in five ways:
1. Flash program me mory (8 Kbytes for
PIC18F23K20/43K20 de vices, 16 Kbytes for PIC18F24K20/44K20 de vices, 32 Kbytes for PIC18F25K20/45K20 AN D 64 Kbytes for PIC18F26K20/46K20).
2. A/D channels (11 for 28-pin devices, 14 for
40/44-pin devices).
3. I/O ports (3 bidirectional ports on 28-pin devices,
5 bidirectional ports on 40/44-pin devices).
4. Parallel Sl ave Port (p resent only on 4 0/44-pin
devices).
All other features for devices in this family are identical. These are summarized in Table 1-1.
The pinouts for all devices are listed in the pin summary tables: Table 1 and Table 2, and I/O description tables: Table 1-2 and Table 1-3.
DS41303G-page 12 2010 Microchip Technology Inc.
2010 Microchip Technology Inc. DS41303G-page 13

TABLE 1-1: DEVICE FEATURES

Features PIC18F23K20 PIC18F24K20 PIC18F25K20 PIC18F26K20 PIC18F43K20 PIC18F44K20 PIC18F45K20 PIC18F46K20
Operating Frequency
Program Memory (Bytes) 8192 16384 32768 65536 8192 16384 32768 65536
Program Memory (Instructions)
Data Memory (Bytes) 512 768 1536 3936 512 768 1536 3936
Data EEPROM Memory (Bytes)
Interrupt Sources 19 19 19 19 20 20 20 20
I/O Ports A, B, C, (E)
Timers 4 4 44 44 44
Capture/Compare/PWM Modules
Enhanced Capture/ Compare/PWM Modules
Serial Communications MSSP, Enhanced
Parallel Communica­tions (PSP)
10-bit Analog-to-Digital Module
Resets (and Delays) POR, BOR, RESET
Programmable High/ Low-Voltage Detect
Programmable Brown­out Reset
Instruction Set 75 Instructions; 83
Packages 28-pin PDIP
Note 1: PORTE contains the single RE3 read-only bit. The LATE and TRISE registers are not implemented.
2: Frequency range shown applies to industrial range devices only. Maximum frequency for extended range devices is 48 MHz.
(2)
DC – 64 MHz DC – 64 MHz DC – 64 MHz DC – 64 MHz DC – 64 MHz DC – 64 MHz DC – 64 MHz DC – 64 MHz
USART
1 internal plus 10
Input Channels
Instruction, Stack
Full, Stack Underflow
(PWRT, OST),
MCLR
with Extended Instruction Set
enabled
28-pin SOIC
28-pin QFN 28-pin SSOP 28-pin UQFN
4096 8192 16384 32768 4096 8192 16384 32768
256 256 256 1024 256 256 256 1024
(1)
11111111
1 1 11 11 11
No No No No Yes Yes Yes Yes
(optional),
WDT
Yes Ye s Yes Ye s Yes Ye s Ye s Yes
Yes Ye s Yes Ye s Yes Ye s Ye s Yes
A, B, C, (E)
MSSP, Enhanced
1 internal plus 10
Input Channels
POR, BOR, RESET
Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR
(optional), WDT
75 Instructions; 83
with Extended
Instruction Set
28-pin PDIP
28-pin SOIC
28-pin QFN
28-pin SSOP
USART
enabled
(1)
MSSP, Enhanced
1 internal plus 10
POR, BOR, RESET
Instruction, Stack
Full, Stack Underflow
75 Instructions; 83
A, B, C, (E)
USART
Input Channels
(PWRT, OST),
MCLR
(optional),
WDT
with Extended Instruction Set
enabled
28-pin PDIP 28-pin SOIC 28-pin QFN
28-pin SSOP
(1)
MSSP, Enhanced
1 internal plus 10
POR, BOR, RESET
Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR
75 Instructions; 83
A, B, C, (E)
Input Channels
(optional), WDT
with Extended Instruction Set
28-pin PDIP 28-pin SOIC
28-pin QFN
28-pin SSOP
(1)
USART
enabled
A, B, C, D, E A, B, C, D, E A, B, C, D, E A, B, C, D, E
MSSP, Enhanced
USART
1 internal plus 13
Input Channels
POR, BOR, RESET
Instruction, Stack
Full, Stack Underflow
(PWRT, OST),
MCLR
(optional),
WDT
75 Instructions; 83
with Extended
Instruction Set
enabled
40-pin PDIP
44-pin QFN
44-pin TQFP
MSSP, Enhanced
USART
1 internal plus 13
Input Channels
POR, BOR, RESET
Instruction, Stack
Full, Stack Underflow
(PWRT, OST),
MCLR
(optional),
WDT
75 Instructions; 83
with Extended Instruction Set
enabled
40-pin PDIP
44-pin QFN
44-pin TQFP
MSSP, Enhanced
USART
1 internal plus 13
Input Channels
POR, BOR, RESET
Instruction, Stack
Full, Stack Underflow
(PWRT, OST),
MCLR
(optional),
WDT
75 Instructions; 83
with Extended Instruction Set
enabled
40-pin PDIP
44-pin QFN
44-pin TQFP
POR, BOR, RESET
Full, Stack Underflow (PWRT, OST), MCLR
MSSP, Enhanced
USART
1 internal plus 13
Input Channels
Instruction, Stack
(optional), WDT
75 Instructions; 83
with Extended Instruction Set
enabled
40-pin PDIP
44-pin QFN
44-pin TQFP
PIC18F2XK20/4XK20
PIC18F2XK20/4XK20
Instruction
Decode and
Control
PORTA
PORTB
PORTC
RA4/T0CKI/C1OUT RA5/AN4/SS
/HLVDIN/C2OUT
RB0/INT0/FLT0/AN12
RC0/T1OSO/T13CKI RC1/T1OSI/CCP2
(1)
RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT
RA3/AN3/VREF+
RA2/AN2/VREF-/CVREF
RA1/AN1
RA0/AN0
RB1/INT1/AN10/C12IN3-
Data Latch
Data Memory
Address Latch
Data Address<12>
12
Access
BSR
FSR0 FSR1 FSR2
inc/dec
logic
Address
4
12
4
PCH PCL
PCLATH
8
31-Level Stack
Program Counter
PRODLPRODH
8 x 8 Multiply
8
BITOP
8
8
ALU<8>
20
8
8
Table Pointer<21>
inc/dec logic
21
8
Data Bus<8>
Table Latch
8
IR
12
3
ROM Latch
RB2/INT2/AN8 RB3/AN9/CCP2
(1)
/C12IN2-
PCLATU
PCU
OSC2/CLKOUT
(3)
/RA6
Note 1: CCP2 is multiplexed with RC1 when Configuration bit CCP2MX is set, or RB3 when CCP2MX is not set.
2: RE3 is only available when MCLR
functionality is disabled.
3: OSC1/CLKIN and OSC2/CLKOUT are only available in select oscillator modes and when these pins are not being used as digital I/O.
Refer to Section 2.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for additional information.
RB4/KBI0/AN11 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD
EUSARTComparator
MSSP
10-bit
ADC
Timer2Timer1 Timer3Timer0
CCP2
HLVD
ECCP1
BOR
Data
EEPROM
W
Instruction Bus <16>
STKPTR
Bank
8
State machine control signals
Decode
8
8
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
OSC1
(3)
OSC2
(3)
VDD,
Brown-out
Reset
Internal
Oscillator
Fail-Safe
Clock Monitor
Precision
Reference
Band Gap
V
SS
MCLR
(2)
Block
LFINTOSC
Oscillator
16 MHz
Oscillator
Single-Supply Programming
In-Circuit
Debugger
T1OSO
OSC1/CLKIN
(3)
/RA7
T1OSI
PORTE
MCLR/VPP/RE3
(2)
FVR
FVR
FVR
CVREF
Address Latch
Program Memory
(8/16/32/64 Kbytes)
Data Latch

FIGURE 1-1: PIC18F2XK20 (28-PIN) BLOCK DIAGRAM

DS41303G-page 14 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
Instruction
Decode and
Control
Data Latch
Data Memory
Address Latch
Data Address<12>
12
Access
BSR
FSR0 FSR1 FSR2
inc/dec
logic
Address
4
12
4
PCH PCL
31-Level Stack
Program Counter
PRODLPRODH
8 x 8 Multiply
8
BITOP
8
8
ALU<8>
Address Latch
Program Memory
(8/16/32/64 Kbytes)
Data Latch
20
8
8
Table Pointer<21>
inc/dec logic
21
Data Bus<8>
Table Latch
8
IR
12
3
ROM Latch
PORTD
RD0/PSP0
PCU
PORTE
MCLR/VPP/RE3
(2)
RE2/CS/AN7
RE0/RD/AN5 RE1/WR/AN6
Note 1: CCP2 is multiplexed with RC1 when Configuration bit CCP2MX is set, or RB3 when CCP2MX is not set.
2: RE3 is only available when MCLR
functionality is disabled.
3: OSC1/CLKIN and OSC2/CLKOUT are only available in select oscillator modes and when these pins are not being used as digital I/O.
Refer to Section 2.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for additional information.
EUSARTComparator
MSSP
10-bit
ADC
Timer2Timer1 Timer3Timer0
CCP2
HLVD
ECCP1
BOR
Data
EEPROM
W
Instruction Bus <16>
STKPTR
Bank
8
State machine control signals
Decode
8
8
Power-up
Time r
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Time r
OSC1
(3)
OSC2
(3)
VDD,
Brown-out
Reset
Internal
Oscillator
Fail-Safe
Clock Monitor
Precision
Reference
Band Gap
V
SS
MCLR
(2)
Block
LFINTOSC
Oscillator
16 MHz
Oscillator
Single-Supply
Programming
In-Circuit
Debugger
T1OSI
T1OSO
RD1/PSP1 RD2/PSP2 RD3/PSP3
PORTA
PORTB
PORTC
RA4/T0CKI/C1OUT RA5/AN4/SS
/HLVDIN/C2OUT
RB0/INT0/FLT0/AN12
RC0/T1OSO/T13CKI RC1/T1OSI/CCP2
(1)
RC2/CCP1/P1A RC3/SCK/SCL
RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT
RA3/AN3/VREF+
RA2/AN2/VREF-/CVREF
RA1/AN1
RA0/AN0
RB1/INT1/AN10/C12IN3­RB2/INT2/AN8 RB3/AN9/CCP2
(1)
/C12IN2-
OSC2/CLKOUT
(3)
/RA6
RB4/KBI0/AN11 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD
OSC1/CLKIN
(3)
/RA7
RD4/PSP4 RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D
FVR
FVR
PSP
FVR
CVREF
PCLATH
8
8
PCLATU

FIGURE 1-2: PIC18F4XK20 (40/44-PIN) BLOCK DIAGRAM

2010 Microchip Technology Inc. DS41303G-page 15
PIC18F2XK20/4XK20

TABLE 1-2: PIC18F2XK20 PINOUT I/O DESCRIPTIONS

Pin Number
Pin Name
MCLR
/VPP/RE3 MCLR VPP RE3
OSC1/CLKIN/RA7
OSC1
CLKIN
RA7
OSC2/CLKOUT/RA6
OSC2
CLKOUT
RA6
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
PDIP, SOIC
126
96
10 7
QFN
Pin
Type
I
P
I
I
I
I/O
O
O
I/O
Buffer
Type
ST
ST
ST
CMOS
TTL
TTL
Description
Master Clear (input) or programming voltage (input)
Active-low Master Clear (device Reset) input Programming voltage input Digital input
Oscillator crystal or external clock input
Oscillator crystal input or external clock source input ST buffer when configured in RC mode; CMOS otherwise External clock source input. Always associated with pin function OSC1. (See related OSC1/CLKIN, OSC2/CLKOUT pins) General purpose I/O pin
Oscillator crystal or clock output
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate General purpose I/O pin
DS41303G-page 16 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
TABLE 1-2: PIC18F2XK20 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
RA0/AN0/C12IN0-
RA0 AN0 C12IN0-
RA1/AN1/C12IN1-
RA1 AN1 C12IN1-
RA2/AN2/V C2IN+
RA2 AN2 V CV C2IN+
RA3/AN3/V
RA3 AN3 V C1IN+
RA4/T0CKI/C1OUT
RA4 T0CKI C1OUT
RA5/AN4/SS C2OUT
RA5 AN4 SS HLVDIN C2OUT
RA6 See the OSC2/CLKOUT/RA6 pin
RA7 See the OSC1/CLKIN/RA7 pin
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
REF-/CVREF/
REF-
REF
REF+/C1IN+
REF+
/HLVDIN/
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
PDIP, SOIC
QFN
227
328
41
52
63
74
Pin
Type
I/O
I I
I/O
I I
I/O
I I
O
I
I/O
I I I
I/O
I
O
I/O
I I I
O
Buffer
Type
TTL Analog Analog
TTL Analog Analog
TTL Analog Analog Analog Analog
TTL Analog Analog Analog
ST ST
CMOS
TTL Analog
TTL Analog
CMOS
Description
PORTA is a bidirectional I/O port.
Digital I/O Analog input 0, ADC channel 0 Comparators C1 and C2 inverting input
Digital I/O ADC input 1, ADC channel 1 Comparators C1 and C2 inverting input
Digital I/O Analog input 2, ADC channel 2 A/D reference voltage (low) input Comparator reference voltage output Comparator C2 non-inverting input
Digital I/O Analog input 3, ADC channel 3 A/D reference voltage (high) input Comparator C1 non-inverting input
Digital I/O Timer0 external clock input Comparator C1 output
Digital I/O Analog input 4, ADC channel 4 SPI slave select input High/Low-Voltage Detect input Comparator C2 output
2010 Microchip Technology Inc. DS41303G-page 17
PIC18F2XK20/4XK20
TABLE 1-2: PIC18F2XK20 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
RB0/INT0/FLT0/AN12
RB0 INT0 FLT0 AN12
RB1/INT1/AN10/C12IN3­/P1C
RB1 INT1 AN10 C12IN3­P1C
RB2/INT2/AN8/P1B
RB2 INT2 AN8 P1B
RB3/AN9/C12IN2-/CCP2
RB3 AN9 C12IN2-
(2)
CCP2
RB4/KBI0/AN11/P1D
RB4 KBI0 AN11 P1D
RB5/KBI1/PGM
RB5 KBI1 PGM
RB6/KBI2/PGC
RB6 KBI2 PGC
RB7/KBI3/PGD
RB7 KBI3 PGD
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
PDIP, SOIC
21 18
22 19
23 20
24 21
25 22
26 23
27 24
28 25
QFN
Pin
Type
I/O
I I I
I/O
I I I
O
I/O
I I
O
I/O
I I
I/O
I/O
I I
O
I/O
I
I/O
I/O
I
I/O
I/O
I
I/O
Buffer
Type
TTL
ST ST
Analog
TTL
ST Analog Analog CMOS
TTL
ST Analog CMOS
TTL Analog Analog
ST
TTL
TTL Analog CMOS
TTL
TTL
ST
TTL
TTL
ST
TTL
TTL
ST
Description
PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-up on each input.
Digital I/O External interrupt 0 PWM Fault input for CCP1 Analog input 12, ADC channel 12
Digital I/O External interrupt 1 Analog input 10, ADC channel 10 Comparators C1 and C2 inverting input Enhanced CCP1 PWM output
Digital I/O External interrupt 2 Analog input 8, ADC channel 8 Enhanced CCP1 PWM output
Digital I/O Analog input 9, ADC channel 9 Comparators C1 and C2 inverting input Capture 2 input/Compare 2 output/PWM 2 output
Digital I/O Interrupt-on-change pin Analog input 11, ADC channel 11 Enhanced CCP1 PWM output
Digital I/O Interrupt-on-change pin Low-Voltage ICSP™ Programming enable pin
Digital I/O Interrupt-on-change pin In-Circuit Debugger and ICSP™ programming clock pin
Digital I/O Interrupt-on-change pin In-Circuit Debugger and ICSP™ programming data pin
DS41303G-page 18 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
TABLE 1-2: PIC18F2XK20 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Number
Pin Name
RC0/T1OSO/T13CKI
RC0 T1OSO T13CKI
RC1/T1OSI/CCP2
RC1 T1OSI
(1)
CCP2
RC2/CCP1/P1A
RC2 CCP1 P1A
RC3/SCK/SCL
RC3 SCK SCL
RC4/SDI/SDA
RC4 SDI SDA
RC5/SDO
RC5 SDO
RC6/TX/CK
RC6 TX CK
RC7/RX/DT
RC7 RX DT
RE3 See MCLR
V
SS 8, 19 5, 16 P Ground reference for logic and I/O pins
DD 20 17 P Positive supply for logic and I/O pins
V
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
PDIP, SOIC
11 8
12 9
13 10
14 11
15 12
16 13
17 14
18 15
QFN
Pin
Buffer
Type
Type
I/O
O
I
I/O
I
Analog
I/O
I/O I/O
O
CMOS
I/O I/O I/O
I/O
I
I/O
I/OOST
I/O
O
I/O
I/O
I
I/O
PORTC is a bidirectional I/O port.
ST
ST
ST
ST
ST ST
ST ST ST
ST ST ST
ST
ST
ST ST ST
Digital I/O Timer1 oscillator output Timer1/Timer3 external clock input
Digital I/O Timer1 oscillator input Capture 2 input/Compare 2 output/PWM 2 output
Digital I/O Capture 1 input/Compare 1 output Enhanced CCP1 PWM output
Digital I/O Synchronous serial clock input/output for SPI mode Synchronous serial clock input/output for I
Digital I/O SPI data in
2
C™ data I/O
I
Digital I/O SPI data out
Digital I/O EUSART asynchronous transmit EUSART synchronous clock (see related RX/DT)
Digital I/O EUSART asynchronous receive EUSART synchronous data (see related TX/CK)
/VPP/RE3 pin
Description
2
C™ mode
2010 Microchip Technology Inc. DS41303G-page 19
PIC18F2XK20/4XK20

TABLE 1-3: PIC18F4XK20 PINOUT I/O DESCRIPTIONS

Pin Name
/VPP/RE3
MCLR
MCLR VPP RE3
OSC1/CLKIN/RA7
OSC1
CLKIN
RA7
OSC2/CLKOUT/RA6
OSC2
CLKOUT
RA6
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
Pin Number
PDIP QFN TQFP
11818
13 32 30
14 33 31
Pin
Type
I
P
I
I
I
I/O
O
O
I/O
Buffer
Type
ST
ST
ST
CMOS
TTL
TTL
Description
Master Clear (input) or programming voltage (input)
Active-low Master Clear (device Reset) input Programming voltage input Digital input
Oscillator crystal or external clock input
Oscillator crystal input or external clock source input ST buffer when configured in RC mode; analog otherwise External clock source input. Always associated with pin function OSC1 (See related OSC1/CLKIN, OSC2/CLKOUT pins) General purpose I/O pin
Oscillator crystal or clock output
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate General purpose I/O pin
DS41303G-page 20 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
TABLE 1-3: PIC18F4XK20 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RA0/AN0/C12IN0-
RA0 AN0 C12IN0-
RA1/AN1/C12IN0-
RA1 AN1 C12IN0-
RA2/AN2/V C2IN+
RA3/AN3/V C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS C2OUT
RA6 See the OSC2/CLKOUT/RA6 pin
RA7 See the OSC1/CLKIN/RA7 pin
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
REF-/CVREF/
RA2 AN2
REF-
V
REF
CV C2IN+
REF+/
RA3 AN3 VREF+ C1IN+
RA4 T0CKI C1OUT
/HLVDIN/
RA5 AN4 SS HLVDIN C2OUT
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
Pin Number
PDIP QFN TQFP
21919
32020
42121
52222
62323
72424
Pin
Type
I/O
I I
I/O
I I
I/O
I I
O
I
I/O
I I I
I/O
I
O
I/O
I I I
O
Buffer
Type
TTL Analog Analog
TTL Analog Analog
TTL Analog Analog Analog Analog
TTL Analog Analog Analog
ST ST
CMOS
TTL Analog
TTL Analog CMOS
Description
PORTA is a bidirectional I/O port.
Digital I/O Analog input 0, ADC channel 0 Comparator C1 and C2 inverting input
Digital I/O Analog input 1, ADC channel 1 Comparator C1 and C2 inverting input
Digital I/O Analog input 2, ADC channel 2 A/D reference voltage (low) input Comparator reference voltage output Comparator C2 non-inverting input
Digital I/O Analog input 3, ADC channel 3 A/D reference voltage (high) input Comparator C1 non-inverting input
Digital I/O Timer0 external clock input Comparator C1 output
Digital I/O Analog input 4, ADC channel 4 SPI slave select input High/Low-Voltage Detect input Comparator C2 output
2010 Microchip Technology Inc. DS41303G-page 21
PIC18F2XK20/4XK20
TABLE 1-3: PIC18F4XK20 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RB0/INT0/FLT0/AN12
RB0 INT0 FLT0 AN12
RB1/INT1/AN10/ C12IN3-
RB1 INT1 AN10 C12IN3-
RB2/INT2/AN8
RB2 INT2 AN8
RB3/AN9/C12IN2-/ CCP2
RB3 AN9 C12IN23-
(2)
CCP2
RB4/KBI0/AN11
RB4 KBI0 AN11
RB5/KBI1/PGM
RB5 KBI1 PGM
RB6/KBI2/PGC
RB6 KBI2 PGC
RB7/KBI3/PGD
RB7 KBI3 PGD
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
Pin Number
PDIP QFN TQFP
33 9 8
34 10 9
35 11 10
36 12 11
37 14 14
38 15 15
39 16 16
40 17 17
Pin
Type
I/O
I I I
I/O
I I I
I/O
I I
I/O
I I
I/O
I/O
I I
I/O
I
I/O
I/O
I
I/O
I/O
I
I/O
Buffer
Type
TTL
ST ST
Analog
TTL
ST Analog Analog
TTL
ST Analog
TTL Analog Analog
ST
TTL
TTL Analog
TTL
TTL
ST
TTL
TTL
ST
TTL
TTL
ST
Description
PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-up on each input.
Digital I/O External interrupt 0 PWM Fault input for Enhanced CCP1 Analog input 12, ADC channel 12
Digital I/O External interrupt 1 Analog input 10, ADC channel 10 Comparator C1 and C2 inverting input
Digital I/O External interrupt 2 Analog input 8, ADC channel 8
Digital I/O Analog input 9, ADC channel 9 Comparator C1 and C2 inverting input Capture 2 input/Compare 2 output/PWM 2 output
Digital I/O Interrupt-on-change pin Analog input 11, ADC channel 11
Digital I/O Interrupt-on-change pin Low-Voltage ICSP™ Programming enable pin
Digital I/O Interrupt-on-change pin In-Circuit Debugger and ICSP™ programming clock pin
Digital I/O Interrupt-on-change pin In-Circuit Debugger and ICSP™ programming data pin
DS41303G-page 22 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
TABLE 1-3: PIC18F4XK20 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RC0/T1OSO/T13CKI
RC0 T1OSO T13CKI
RC1/T1OSI/CCP2
RC1 T1OSI
(1)
CCP2
RC2/CCP1/P1A
RC2 CCP1 P1A
RC3/SCK/SCL
RC3 SCK
SCL
RC4/SDI/SDA
RC4 SDI SDA
RC5/SDO
RC5 SDO
RC6/TX/CK
RC6 TX CK
RC7/RX/DT
RC7 RX DT
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
Pin Number
PDIP QFN TQFP
15 34 32
16 35 35
17 36 36
18 37 37
23 42 42
24 43 43
25 44 44
26 1 1
Pin
Buffer
Type
I/O
O
I
I/O
I
CMOS
I/O
I/O I/O
O
I/O I/O
I/O
I/O
I
I/O
I/OOST
I/O
O
I/O
I/O
I
I/O
Type
PORTC is a bidirectional I/O port.
ST
ST
ST
ST
ST ST
ST ST
ST
ST ST ST
ST
ST
ST ST ST
Digital I/O Timer1 oscillator output Timer1/Timer3 external clock input
Digital I/O Timer1 oscillator input Capture 2 input/Compare 2 output/PWM 2 output
Digital I/O Capture 1 input/Compare 1 output/PWM 1 output Enhanced CCP1 output
Digital I/O Synchronous serial clock input/output for SPI mode Synchronous serial clock input/output for I
Digital I/O SPI data in
2
C™ data I/O
I
Digital I/O SPI data out
Digital I/O EUSART asynchronous transmit EUSART synchronous clock (see related RX/DT)
Digital I/O EUSART asynchronous receive EUSART synchronous data (see related TX/CK)
Description
2
C™ mode
2010 Microchip Technology Inc. DS41303G-page 23
PIC18F2XK20/4XK20
TABLE 1-3: PIC18F4XK20 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RD0/PSP0
RD0 PSP0
RD1/PSP1
RD1 PSP1
RD2/PSP2
RD2 PSP2
RD3/PSP3
RD3 PSP3
RD4/PSP4
RD4 PSP4
RD5/PSP5/P1B
RD5 PSP5 P1B
RD6/PSP6/P1C
RD6 PSP6 P1C
RD7/PSP7/P1D
RD7 PSP7 P1D
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
Pin Number
PDIP QFN TQFP
19 38 38
20 39 39
21 40 40
22 41 41
27 2 2
28 3 3
29 4 4
30 5 5
Pin
Buffer
Type
Type
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/OSTTTL
I/O I/O
TTL
O
I/O I/O
TTL
O
I/O I/O
TTL
O
Description
PORTD is a bidirectional I/O port or a Parallel Slave Port (PSP) for interfacing to a microprocessor port. These pins have TTL input buffers when PSP module is enabled.
Digital I/O Parallel Slave Port data
Digital I/O Parallel Slave Port data
Digital I/O Parallel Slave Port data
Digital I/O Parallel Slave Port data
Digital I/O Parallel Slave Port data
ST
ST
ST
Digital I/O Parallel Slave Port data Enhanced CCP1 output
Digital I/O Parallel Slave Port data Enhanced CCP1 output
Digital I/O Parallel Slave Port data Enhanced CCP1 output
DS41303G-page 24 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
TABLE 1-3: PIC18F4XK20 PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
RE0/RD
RE1/WR/AN6
RE2/CS/AN7
RE3 See MCLR
VSS 12, 31 6, 30, 316, 29 P Ground reference for logic and I/O pins
/AN5 RE0 RD
AN5
RE1 WR
AN6
RE2 CS
AN7
Pin Number
PDIP QFN TQFP
82525
92626
10 27 27
Pin
Type
I/O
I
I
I/O
I
I
I/O
I
I
Buffer
Type
ST
TTL
Analog
ST
TTL
Analog
ST
TTL
Analog
Description
PORTE is a bidirectional I/O port
Digital I/O Read control for Parallel Slave Port (see related WR Analog input 5, ADC channel 5
Digital I/O Write control for Parallel Slave Port (see related CS Analog input 6, ADC channel 6
Digital I/O Chip Select control for Parallel Slave Port (see related RD Analog input 7, ADC channel 7
/VPP/RE3 pin
and CS pins)
and RD pins)
and WR)
V
DD 11, 32 7, 8,
28, 29
NC 13 12, 13,
Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output
ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power
Note 1: Default assignment for CCP2 when Configuration bit CCP2MX is set.
2: Alternate assignment for CCP2 when Configuration bit CCP2MX is cleared.
7, 28 P Positive supply for logic and I/O pins
No connect
33, 34
2010 Microchip Technology Inc. DS41303G-page 25
PIC18F2XK20/4XK20
NOTES:
DS41303G-page 26 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
4 x PLL
FOSC<3:0>
Secondary Oscillator
T1OSCEN Enable Oscillator
T1OSO
T1OSI
Clock Source Option for other Modules
OSC1
OSC2
Sleep
HSPLL, HFINTOSC/PLL
LP, XT, HS, RC, EC
T1OSC
CPU
Peripherals
IDLEN
Postscaler
MUX
MUX
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
250 kHz
500 kHz
OSCCON<6:4>
111 110 101 100
011 010 001 000
31 kHz
31 kHz Source
Internal
Oscillator
Block
WDT, PWRT, FSCM
16 MHz
Internal Oscillator
(HFINTOSC)
Clock
Control
OSCCON<1:0>
Source
16 MHz
31 kHz (LFINTOSC)
OSCTUNE<6>
(1)
0
1
OSCTUNE<7>
and Two-Speed Start-up
Primary Oscillator
PIC18F2XK20/4XK20
Sleep
Sleep
Main
FOSC<3:0> O SCCON<1:0>
Note 1: Operates only when HFINTOSC is the primary oscillator.

2.0 OSCILLATOR MODULE (WITH FAIL-SAFE CLOCK MONITOR)

2.1 Overview

The O scillator m odule has a wide va riety o f cl ock sources and selection features that allow it to be used in a wide range of applications while maximizing perfor­mance and minimizing power consumption. Figure 2-1 illustrates a block diagram of the Oscillator module.
Clock sources ca n be con figured from external oscillators, quartz crystal resonators, ceramic resonators and R esistor-Capacitor (R C) c ircuits. In a ddition, the system clock source can be configured from one of two internal oscillators, with a choice of speeds selectable via software. Additional clock features include:
• Selectable system clock source between external
or internal via software.
• Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and code execution.
• Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP, XT, HS, EC or RC modes) and switch automatically to the internal oscillator.
The Oscillator module can be configured in one of ten primary clock modes.
1. LP Low-Power Crystal
2. XT Crystal/Resonator
3. HS High-Speed Crystal/Resonator
4. HSPLL High-Speed Crystal/Resonator with PLL enabled
5. RC External Resistor/Capacitor with
OSC/4 output on RA6
F
6. RCIO External Resistor/Capacitor with I/O on RA6
7. INTOSC Internal Oscillator with F
OSC/4
output on RA6 and I/O on RA7
8. INTOSCIO Internal Oscillator with I/O on RA6 and RA7
9. EC External Clock with F
OSC/4 output
10. ECIO External Clock with I/O on RA6
Primary Clock modes are selected by the FOSC<3:0> bits of t he CONFIG1H C onfiguration R egister. T he HFINTOSC and LFINTOSC are factory calibrated high­frequency and low-frequency oscillators, respectively, which are used as the internal clock sources.

FIGURE 2-1: PIC® MCU CLOCK SOURCE BLOCK DIAGRAM

2010 Microchip Technology Inc. DS41303G-page 27
PIC18F2XK20/4XK20

2.2 Oscillator Control

The OSCCON register (Register 2-1) controls several aspects o f the dev ice c lock’s op eration, bo th in ful l power operation and in power-managed modes.
• Main System Clock Selection (SCS)
• Internal Frequency selection bits (IRCF)
• Clock Status bits (OSTS, IOFS)
• Power management selection (IDLEN)

2.2.1 MAIN SYSTEM CLOCK SELECTION

The Sy stem Cloc k Se lect b its, SCS<1 :0>, s elect th e main clock source. The available clock sources are
• Primary clock defined by the FOSC<3:0> bits of CONFIG1H. The primary clock can be the primary oscillator, an external clock, or the internal oscilla­tor block.
• Secondary clock (Timer1 oscillator)
• Internal oscillator block (HFINTOSC and LFINTOSC).
The c lock s ource cha nges i mmediately af ter one or more of the bits is written to, following a brief clock tran­sition interval. The SCS bits are cl eared to sel ect the primary clock on all forms of Reset.

2.2.4 CLOCK STATUS

The OSTS and IOFS bits of the OSCCON register, and the T1RUN bit of the T1CON register, indicate which clock source is currently providing the main clock. The OSTS b it i ndicates th at th e O scillator S tart-up T imer has timed out and the primary clock is p roviding the device clock. The IOFS bit indicates when the internal oscillator b lock has stabilized a nd is p roviding th e device cl ock i n H FINTOSC C lock m odes. The IO FS and O STS S tatus bit s w ill bo th b e s et w hen SCS<1:0> = 00 and HFINTOSC is the primary clock. The T1RUN bit indicates when the Timer1 oscillator is providing the device clock in secondary clock modes. When SCS<1:0> 00, only one of these three bits will be set at any time. If none of the se bits are set, th e LFINTOSC is providing the clock or the H FINTOSC has just started and is not yet stable.

2.2.5 POWER MANAGEMENT

The IDLEN bit of the OSCCON register determines if the d evice go es into Sle ep mode o r on e of the Idl e modes when the SLEEP instruction is executed.
The use of the flag and control bits in the OSCCON
register i s di scussed in m ore d etail in Section 3.0 “Power-Managed Modes”.
2.2.2 INTERNAL FREQUENCY
SELECTION
The Int ernal Os cillator Frequency Se lect bit s (IRCF<2:0>) select the frequency output of the internal oscillator block. The choices are the LFINTOSC source (31 kHz), the HFINTOSC so urce (16 MHz) or one of the freq uencies de rived from the H FINTOSC pos t­scaler (31 .25 kHz to 8 MHz). If the internal oscillator block is supplying the main clock, changing the states of th ese b its w ill ha ve an i mmediate c hange on th e internal oscillator’s output. On device Resets, the out­put f requency of the in ternal oscillator is s et t o th e default frequency of 1 MHz.

2.2.3 LOW FREQUENCY SELECTION

When a nominal output frequency of 31 kHz is selected (IRCF<2:0> = 000), users may choose which internal oscillator ac ts as th e s ource. Thi s i s done w ith th e INTSRC bit of the OSCTUNE register. Setting this bit selects the HFINTOSC as a 31.25 kHz clock source by enabling the di vide-by-512 ou tput of the H FINTOSC postscaler. Clearing INTSRC selects LFINTOSC (nom­inally 31 kHz) as the clock source.
This option allows users to select the tunable and more precise HFINTOSC as a clock source, while maintain­ing power savings with a very low clock speed. Regard­less of t he se tting of I NTSRC, LFINTOSC a lways remains th e c lock source fo r fea tures s uch a s th e Watchdog Timer and the Fail-Safe Clock Monitor.
Note 1: The Timer1 oscillator must be enabled to
select the secondary c lock so urce. Th e Timer1 oscillator is enabled by setting the T1OSCEN b it of the T1 CON re gister. If the Timer1 oscillator is not enabled, then the m ain osc illator w ill c ontinue to ru n from the previously selected source. The source will then switch to the secondary oscillator after the T1OSCEN bit is set.
2: It i s rec ommended tha t the Timer1
oscillator be operating and stable before selecting the secondary clock source or a very lo ng delay ma y o ccur while th e Timer1 oscillator starts.
DS41303G-page 28 2010 Microchip Technology Inc.
PIC18F2XK20/4XK20
REGISTER 2-1: OSCCON: OSCILLATOR CONTROL REGISTER
R/W-0 R/W-0 R/W-1 R/W-1 R-q R-0 R/W-0 R/W-0
IDLEN IRCF2 IRCF1 IRCF0 OSTS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ q = depends on condition
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IDLEN: Idle Enable bit
1 = Device enters Idle mode on SLEEP instruction 0 = Device enters Sleep mode on SLEEP instruction
bit 6-4 IRCF<2:0>: Internal Oscillator Frequency Select bits
111 = 16 MHz (HFINTOSC drives clock directly) 110 = 8 MHz 101 = 4 MHz 100 = 2 MHz 011 = 1 MHz 010 = 500 kHz 001 = 250 kHz 000 = 31 kHz (from either HFINTOSC/512 or LFINTOSC directly)
bit 3 OSTS: Oscillator Start-up Time-out Status bit
1 = Device is running from the clock defined by FOSC<2:0> of the CONFIG1 register 0 = Device is running from the internal oscillator (HFINTOSC or LFINTOSC)
bit 2 IOFS: HFINTOSC Frequency Stable bit
1 = HFINTOSC frequency is stable 0 = HFINTOSC frequency is not stable
bit 1-0 SCS<1:0>: System Clock Select bits
1x = Internal oscillator block 01 = Secondary (Timer1) oscillator 00 = Primary clock (determined by CONFIG1H[FOSC<3:0>]).
(3)
(1)
(1)
IOFS SCS1 SCS0
(2)
Note 1: Reset state depends on state of the IESO Configuration bit.
2: Source selected by the INTSRC bit of the OSCTUNE register, see text. 3: Default output frequency of HFINTOSC on Reset.
2010 Microchip Technology Inc. DS41303G-page 29
PIC18F2XK20/4XK20
OSC1/CLKIN
OSC2/CLKOUT
(1)
I/O
Clock from Ext. System
PIC
®
MCU
Note 1: Alternate pin functions are listed in
Section 1.0 “Device Overview”.

2.3 Clock Source Modes

Clock Source modes can be classified as external or internal.
• External Clock modes rely on external circuitry for the clock source. Examples are: Clock modules (EC mode), quartz crystal resonators or ceramic resonators (LP, XT and HS modes) and Resistor­Capacitor (RC mode) circuits.
• Internal clock sources are contained internally within the Oscillator block. The Oscillator block has two internal oscillators: the 16 MHz High­Frequency Internal Oscillator (HFINTOSC) and the 31 kHz Low-Frequency Internal Oscillator (LFINTOSC).
The system clock can be selected between external or internal cl ock sources vi a the S ystem Cl ock S elect (SCS<1:0>) b its o f the OSCCO N register. Se e
Section 2.9 “Clock Switching” for additional informa-
tion.

2.4 External Clock Modes

2.4.1 OSCILLATOR START-UP TIMER (OST)

When the Oscillator module is configured for LP, XT or HS modes, the Oscillator Start-up Timer (OST) counts 1024 oscillations from O SC1. Thi s occurs following a Power-on Reset (POR) and when the Power-up Timer (PWRT) has expired (if configured), or a wake-up from Sleep. During this time, the program counter does not increment and program execution is suspended. The OST ensures that the oscillator circuit, using a quartz crystal resonator or ceramic resonator, has started and is prov iding a stable system clo ck to the Oscillator module. W hen swi tching be tween cl ock s ources, a delay i s required to al low the new cl ock to s tabilize. These oscillator delays are shown in Table 2-1.
In order to minimize latency between external oscillator start-up a nd c ode ex ecution, the T wo-Speed C lock
Start-up mo de can be se lected (see Section 2.10
“Two-Speed Clock Start-up Mode”).
TABLE 2-1: OSCILLATOR DELAY EXAMPLES
Switch From Switch To Frequency Oscillator Delay
Sleep/POR
Sleep/POR EC, RC DC – 64 MHz 2 instruction cycles
LFINTOSC (31 kHz) EC, RC DC – 64 MHz 1 cycle of each
Sleep/POR LP, XT, HS 32 kHz to 40 MHz 1024 Clock Cycles (OST)
Sleep/POR HSPLL 32 MHz to 64 MHz 1024 Clock Cycles (OST) + 2 ms
LFINTOSC (31 kHz) HFINTOSC 250 kHz to 16 MHz 1 s (approx.)
LFINTOSC
HFINTOSC
31 kHz
250 kHz to 16 MHz
Oscillator Warm-Up Delay (T
WARM)

2.4.2 EC MODE

The Ext ernal C lock ( EC) mode al lows an ext ernally generated logic level as the system clock source. When operating in this mode , a n ext ernal clock sour ce is connected to the OSC1 input and the OSC2 is available for ge neral p urpose I /O. Fig ure 2-2 s hows th e pi n connections for EC mode.
The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in operation af ter a Power-on R eset (POR) or wake-up from Sleep. B ecause t he PIC static, sto pping t he external clock input w ill have the effect of halting the device while leaving all data intact. Upon res tarting the external cl ock, th e dev ice w ill resume operation as if no time had elapsed.
DS41303G-page 30 2010 Microchip Technology Inc.
®
MCU de sign is fully
FIGURE 2-2: EXTERNAL CLOCK (EC)
MODE OPERATION
Loading...
+ 426 hidden pages