Note the following details of the code protection feature on Microchip devices:
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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9.0Special Features of the CPU .................................................................................................................................................... 53
10.0 Instruction Set Summary ........................................................................................................................................................... 71
11.0 Development Support ....................................................................................................... ........................................................ 79
13.0 DC and AC Characteristics Graphs and Tables ..................................................................................................................... 105
14.0 Packaging Information ............................................................................................................................................................ 115
Appendix A: Data Sheet Revision History ......................................................................................................................................... 119
Index ................................................................................................................................................................................................. 121
On-Line Support ................................................................................................................................................................................125
Systems Information and Upgrade Hot Line .....................................................................................................................................125
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This documen t conta i ns dev ic e spec if i c in for m at i on fo r
the PIC16F630/676. Additional information may be
found in the PIC® Mid-Range Reference Manual
(DS33023), which may be obtained from your local
Microchip Sales Representative or downloaded from
the Microchip web site. The Reference Manual should
be considered a com pleme nt ary do cume nt to this Da t a
FIGURE 1-1:PIC16F630/676 BLOCK DIAGRAM
INT
13
Program Counter
8-Level Stack
Direct Addr
8
Power-up
Oscillator
Start-up Timer
Power-on
Watchdog
Brown-out
(13-bit)
Timer
Reset
Timer
Detect
RAM Addr
7
8
OSC1/CLKIN
OSC2/CLKOUT
Program
Bus
Internal
Oscillator
Configuration
FLASH
1K x 14
Program
Memory
14
Instruction reg
Instruction
Decode &
Control
Timing
Generation
Sheet and is highly recommended reading for a better
understanding o f the d ev ic e arc hi tec ture a nd operation
of the peripheral modules.
The PIC16F630 and PIC16F676 devices are covered
by this Data Sheet. They are identical, except the
PIC16F676 has a 10-bit A/D converter. They come in
14-pin PDIP, SOIC and TSSOP packages. Figure 1-1
shows a block diagram of th e PIC16F 630/67 6 devices .
Table 1-1 shows the pinout description.
The PIC16F630/676 devices have a 13-bit program
counter capable of addressing an 8K x 14 program
memory space. Only the first 1K x 14 (0000h - 03FFh)
for the PIC16F630/676 devices is physically implemented. Accessing a location above these boundaries
will cause a wrap around withi n the firs t 1K x 14 sp ac e.
The RESET vector is at 0000h and the interrupt vector
is at 0004h (see Figure 2-1).
FIGURE 2-1:PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16F630/676
PC<12:0>
CALL, RETURN
RETFIE, RETLW
Stack Level 1
Stack Level 2
Stack Level 8
13
2.2Data Memory Organization
The data memory (see Figure 2-2) is partitioned into
two banks, which contain the General Purpose registers and the Special Function registers. The Special
Function registers are located in the first 32 lo cations of
each bank. Register locations 20h-5Fh are General
Purpose registers, imple mented as st atic RAM and a re
mapped across both banks. All other RAM is
unimplemented and returns ‘0’ when read. RP0
(STATUS<5>) is the bank select bit.
• RP0 = 0 Bank 0 is selected
• RP0 = 1 Bank 1 is selected
Note:The IRP an d RP1 bits STAT US<7:6> are
reserved and shoul d always be mai ntaine d
as ‘0’s.
2.2.1GENERAL PURPOSE REGISTER
FILE
The register file is organized as 64 x 8 in the
PIC16F630/676 devices. Each register is accessed,
either directly or indirectly, through the File Select
Register FSR (see Section 2.4).
The Special Function registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (see Table 2-1). These
registers are static RAM.
The special re gisters can be classifi ed into two sets:
core and peripheral. The Special Function registers
associated with the “c ore” are des cribed in this sect ion.
Those related to the operation of the peripheral
features are described in the section of that peripheral
feature.
TABLE 2-1:PIC16F630/676 SPECIAL REGISTERS SUMMARY BANK 0
Value on
AddrNameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2 Bit 1Bit 0
Bank 0
00hINDFAddressing this location uses contents of FSR to address data memory (not a physical register)xxxx xxxx18,61
01hTMR0Timer0 Module’s Registerxxxx xxxx29
02hPCLProgram Counter's (PC) Least Significant Byte0000 000017
03hSTATUS
04hFSRIndirect data memory address pointerxxxx xxxx18
05hPORTA
06h—Unimplemented——
07hPORTC
08h—Unimplemented——
09h—Unimplemented——
0AhPCLATH
0BhINTCONGIE PEIET0IEINTE RAIET0IFINTF RAIF0000 000013
0ChPIR1
0Dh—Unimplemented——
0EhTMR1LHolding register for the Least Significant Byte of the 16-bit TMR1xxxx xxxx32
0FhTMR1HHolding register for the Most Significant Byte of the 16-bit TMR1xxxx xxxx32
Legend:– = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented
Note 1: Other (non Power-up) Resets include MCLR
2: IRP & RP1 bits are reserved, always maintain these bits clear.
3: PIC16 F6 76 onl y.
(3)
(3)
(2)
IRP
——
——
———Write buffer for upper 5 bits of program counter---0 000017
EEIFADIF——CMIF——TMR1IF00-- 0--015
—T1GET1CKPS1 T1CKPS0 T1OSCEN T1SYNCTMR1CSTMR1ON
—COUT—CINVCISCM2CM1CM0-0-0 000037
Most Significant 8 bits of the left shifted A/D result or 2 bits of right shifted result xxxx xxxx44
ADFMVCFG—CHS2CHS1CHS0GO/DONEADON
RP1
(2)
RP0TOPDZDCC
I/O Control Registers--xx xxxx19
I/O Control Registers--xx xxxx26
Reset, Brown-out Detect and Watchdog Timer Reset during normal operation.
96hIOCA
97h—Unimplemented——
98h—Unimplemented——
99hVRCONVREN
9AhEEDATEEPROM data register0000 000049
9BhEEADR
9ChEECON1————WRERRWRENWRRD---- x00050
9DhEECON2EEPROM control register 2 (not a physical register)---- ----49
9EhADRESL
9FhADCON1
Legend:– = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: Other (non Power-up) Resets include MCLR
2: IRP & RP1 bits are reserved, always maintain these bits clear.
3: PIC16F676 only.
(3)
(3)
RAPU
IRP
——TRISA5TRISA4TRISA3TRISA2TRISA1TRISA0--11 111119
——————PORBOD
ANS7ANS6ANS5ANS4ANS3ANS2ANS1ANS01111 111146
——
——IOCA5IOCA4IOCA3IOCA2IOCA1IOCA0--00 000021
—EEPROM address register0000 000049
Least Significant 2 bits of the left shifted result or 8 bits of the right shifted resultxxxx xxxx44
(3)
—ADCS2ADCS1ADCS0————-000 ----45,61
INTEDGT0CST0SEPSAPS2PS1PS0
(2)
(2)
RP1
—VRR—VR3VR2VR1VR00-0- 000042
RP0TOPDZDCC
——CMIE——TMR1IE00-- 0--014
WPUA5WPUA4
Reset, Brown-out Detect and Watchdog Timer Reset during normal operation.
The STATUS register, shown in Register 2-1, contains:
• the arithmetic status of the ALU
• the RESET status
• the bank select bits for data memory (SRAM)
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bit s are set or cleared ac cording to the
device logic. Furthermore, the TO
writable. Therefore, the result of an instruction with the
STATUS regis ter as destin ation may be diffe rent than
intended.
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as 000u u1uu (where u = unchanged).
and PD bits are not
It is recommended, therefore, that only BCF, BSF,SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any STATUS bits. For other instructions not
affecting any STATUS bits, see the “Instruction Set
Summary”.
Note 1: Bits IRP a nd RP1 (ST ATUS<7:6>) are not
used by the PIC16F630/676 and should
be maintained as clear. Use of these bits
is not recommended, s ince this may af fect
upward compatibility with future products.
2: The C and DC bits operate as a Borrow
and Digit Borrow out bit, respectively, in
subtraction. See the SUBLW and SUBWF
instructions for examples.
REGISTER 2-1:STATUS — STATUS REGISTER (ADDRESS: 03h OR 83h)
Reserved ReservedR/W-0R-1R-1R/W-xR/W-xR/W-x
IRPRP1RP0TOPDZDCC
bit 7bit 0
bit 7IRP: This bit is reserved and should be maintained as ‘0’
bit 6RP1: This bit is reserved and should be maintained as ‘0’
bit 5RP0: Register Bank Select bit (used for direct addressing)
1 = Bank 1 (80h - FFh)
0 = Bank 0 (00h - 7Fh)
bit 4TO
bit 3PD: Power-down bit
bit 2Z: Zero bit
bit 1DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)
bit 0C: Carry/borrow
: Time-out bit
1 = After power-up, CLRWDT instruction, or SLEEP instruct ion
0 = A WDT time-out occurred
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
For borrow ,
1 = A carry-out from the 4th low order bit of the result occurred
0 = No carry-out from the 4th low order bit of the result
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note:For borrow
the polarity is reversed.
bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)
the polarity is reversed. A subtraction is executed by adding the two’s
complement of the second operand. For rotate (RRF, RLF) instructions, this bit is
loaded with either the high or low order bit of the source register.
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
The INTCON register is a readable and writable
register , which c ontains the various en able and fl ag bit s
for TMR0 register overflow, PORTA change and
external RA2/INT pin in terrupts.
Note:Interrupt flag bit s are se t whe n an in terrupt
condition occurs, regardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>). User
software should ensure the appropriate
interrupt flag bits are cle ar prior to enabling
an interrupt.
REGISTER 2-3:INTCON — INTERRUPT CONTROL REGISTER (ADDRESS: 0Bh OR 8Bh)
R/W-0R/W-0R/W-0R/W-0R/W-0R/W-0R/W-0R/W-0
GIEPEIET0IEINTERAIET0IFINTFRAIF
bit 7bit 0
bit 7GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables all interrupts
bit 6PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5T0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 interrupt
0 = Disables the TMR0 interrupt
bit 4INTE: RA2/INT External Interrupt Enable bit
1 = Enables the RA2/INT external interrupt
0 = Disables the RA2/INT external interrupt
bit 3RAIE: Port Change Interrupt Enable bit
1 = Enables the PORTA change interrupt
0 = Disables the PORTA change interrupt
bit 2T0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 regis ter has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1INTF: RA2/INT External Interrupt Flag bit
1 = The RA2/INT external interrupt occurred (must be cleared in software)
0 = The RA2/INT external interrupt did not occur
bit 0RAIF: Port Change Interrupt Flag bit
1 = When at least one of the PORTA <5:0> pins changed state (must be cleared in software)
0 = None of the PORTA <5:0> pins have changed state
(1)
(2)
Note 1: IOCA register must also be enabled.
2: T0IF bit is set when T im er0 roll s ove r. Timer0 is unchanged o n RESET and should
be initialized before clearing T0IF bit.
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
bit 7EEIF: EEPROM Write Operation Interrupt Flag bit
1 = The write operation completed (must be cleared in software)
0 = The write operation has not completed or has not been started
bit 6ADIF: A/D Converter Interrupt Flag bit (PIC16F676 only)
1 = The A/D conversion is complete (must be cleared in software)
0 = The A/D conversion is not complete
bit 5-4Unimplemented: Read as ‘0’
bit 3CMIF: Comparator Interrupt Flag bit
1 = Comparator input has changed (must be cleared in software)
0 = Comparator input has not changed
bit 2-1Unimplemented: Read as ‘0’
bit 0TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflowed (must be cleared in software)
0 = TMR1 register did not overflow
Note:Interrupt flag bits are se t w he n an in terru pt
condition occurs, re gardless of the state of
its corresponding enable bit or the global
enable bit, GIE (INTCON<7>). User
software should ensure the appropriate
interrupt flag bit s are clear prio r to enab ling
an interrupt.
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
The Power Control (PCON) register contains flag bits
to differentiate between a:
• Power-on Reset (POR)
• Brown-out Detect (BOD)
• Watchdog Timer Reset (WDT)
• External MCLR
The PCON Register bits are shown in Register 2-6.
REGISTER 2-6:PCON — POWER CONTROL REGISTER (ADDRESS: 8Eh)
Reset
U-0U-0U-0U-0U-0U-0R/W-0R/W-x
——————PORBOD
bit 7bit 0
bit 7-2Unimplemented: Read as '0'
bit 1POR
bit 0BOD
: Power-on Reset STATUS bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
: Brown-out Detect STATUS bit
1 = No Brown-out Detect occurred
0 = A Brown-out Detect occurred (must be set in software after a Brown-out Detect occurs)
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
2.2.2.7OSCCAL Register
The Oscillator Calibrati on register (OSCCAL) is used to
calibrate the internal 4 MHz oscill ator. It contains 6 bits
to adjust the frequency up or down to achieve 4 MHz.
The OSCCAL register bits are shown in Register 2-7.
The program counter (PC) is 13-bits wide. The low byte
comes from the PCL regist er, which is a readable and
writable register. The high byte (PC<12:8>) is not
directly readable or writable and comes fr om PCLATH.
On any RESET, the PC is cleared. Figure 2-3 shows the
two situations for the loading of the PC. The upper
example in Figure 2-3 shows how the PC is loaded on
a write to PCL (PCLATH<4:0> → PCH). The lower
example in Figure 2-3 shows how the PC is loaded
during a CALL or GOTO instruction (PCLATH<4:3> →
PCH).
FIGURE 2-3:LOADING OF PC IN
DIFFERENT SITUATIONS
PCHPCL
128 70
PC
PCLATH<4:0>
5
PCLATH
PCHPCL
12 11 100
PC
2
87
PCLATH<4:3>
11
8
Instruction with
PCL as
Destination
ALU result
GOTO, CALL
Opcode <10:0>
2.3.2STACK
The PIC16F630/676 family ha s an 8-level x 13-bit wide
hardware stack (see Figure 2-1). The stack space is
not part of either program or data space and the stack
pointer is not readable or writable. The PC is PUSHed
onto the stack when a CALL instruction is executed or
an interrupt causes a branch. The stack is POPed in
the event of a RETURN, RETLW or a RETFIE
instruction execution. PCLATH is not affected by a
PUSH or POP operation.
The stack operat es as a circular buf fer . This means th at
after the stack has been PUSHed eight times, the ninth
push overwrites th e valu e that was s tored fro m the firs t
push. The tenth pus h ov erwr i tes the se co nd push (and
so on).
Note 1: There are no STATUS bits to indicate
stack overflow or stack underflow
conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interrupt address.
PCLATH
2.3.1COMPUTED GOTO
A computed GOTO is accomplish ed by adding an offs et
to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care
should be exercise d i f the t able loca tio n cros ses a PCL
memory boundary (each 256-byte block). Refer to the
Application Note “Implementing a Table Read"
(AN556).
The INDF register is not a physi cal register. Addressing
A simple program to clear RAM location 20h-2Fh using
indirect addressing is shown in Example 2-1.
EXAMPLE 2-1:INDIRECT ADDRESSING
the INDF register will cause indirect addressing.
Indirect addressing is possible by using the INDF
register. Any instruction using the INDF register
actually accesses data pointed to by the File Select
register (FSR). Reading INDF itself indirectly will
produce 00h. Writing to the INDF register indirectly
results in a n o operation (although STA TUS bits m ay be
affected). An effective 9-bit address is obtained by
NEXTclrfINDF;clear INDF register
CONTINUE;yes continue
movlw0x20;initialize pointer
movwfFSR;to RAM
incfFSR;inc pointer
btfssFSR,4 ;all done?
gotoNEXT;no clear next
concatenating the 8-bit FSR register and the IRP bit
(STATUS<7>), as shown in Figure 2-4.
There are as many as twelve general purpose I/O pins
available. Depending on which peripherals are
enabled, some or all of the pins may not be a vailable a s
general purpose I/O. In general, when a peripheral is
enabled, the associated pin may not be used as a
general purpose I/O pin.
Note:Additional information on I/O ports may be
found in the PIC
Manual, (DS33023)
3.1PORTA and the TRISA Registers
PORTA is an 6-bit wide, bi-directional port. The corresponding data direction register is TRISA. Setting a
TRISA bit (= 1) wi ll make the correspondin g PORTA pin
an input (i.e., put the corresponding output driver in a
Hi-impedance mode). Clearing a TRISA bit (= 0) will
make the correspondin g POR TA pin an output (i.e., put
the contents of the output latch on the selected pin).
The exception is RA3, which is input only and its TRIS
bit will always read as ‘1’. Example 3-1 shows how to
initialize PORTA.
Reading the PORTA register reads the status of the
pins, whereas writing to i t will wri te to th e po rt latch. All
write operations are read-modify-write operations.
Therefore, a write to a port implies that the port pins are
read, this value is modified and then written to the port
data latch. RA3 reads ‘0’ when MCLREN = 1.
The TRISA register controls the direction of the
PORT A pins, even when they are being used as analo g
inputs. The user must ensure the bits in the TRISA
®
Mid-Range Reference
register are maintained set when using the m as analog
inputs. I/O pins co nfigure d a s analo g i nput a lways read
‘0’.
Note:The ANSEL (91h) and CMCON (19h)
registers must be initializ ed to c onfigure a n
analog channel as a digital input. Pins
configured as analog inputs will read ‘0’.
The ANSEL register is defined for the
PIC16F676.
EXAMPLE 3-1:INITIALIZING PORTA
bcfSTATUS,RP0;Bank 0
clrfPORTA;Init PORTA
movlw05h;Set RA<2:0> to
movwfCMCON;digital I/O
bsfSTATUS,RP0;Bank 1
clrf ANSEL;digital I/O
movlw0Ch;Set RA<3:2> as inputs
movwfTRISA;and set RA<5:4,1:0>
bcfSTATUS,RP0;Bank 0
;as outputs
3.2Additional Pin Functions
Every PORTA pin on the PIC16F630/676 has an
interrupt-on-change option and every PORTA pin,
except RA3, has a weak pull-up option. The next two
sections describe thes e functions.
3.2.1WEAK PULL-UP
Each of the PORTA pins, except RA3, has an individually configurable weak internal pull-up. Control bits
WPUAx enable or disable each pull-up. Refer to
Register 3-3. Each wea k pull-up is autom atically turned
off when the port pin is configured as an output. The
pull-ups are disabled on a Power-on Reset by the
bit (OPTION<7>).
RAPU
REGISTER 3-1:PORTA — PORTA REGISTER (ADDRESS: 05h)
U-0U-0R/W-xR/W-xR/W-xR/W-xR/W-xR/W-x
——
bit 7bit 0
bit 7-6:Unimplemented: Read as ’0’
bit 5-0:PORTA<5:0>: PORTA I/O pin
1 = Port pin is >V
0 = Port pin is <VIL
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
bit 7-6Unimplemented: Read as ‘0’
bit 5-4WPUA<5:4>: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 3Unimplemented: Read as ‘0’
bit 2-0WPUA<2:0>: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global RAPU must be enabled for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in Output mode
(TRISA = 0).
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
3.2.2INTERRUPT-ON-CHANGE
Each of the PORTA pins is individually configurable as
an interrupt-on-change pin. Control bits IOCAx enable
or disable the interrupt function for each pin. Refer to
Register 3-4. The interrupt-on-change is disabled on a
Power-on Reset.
For enabled interrupt-on-change pins, the values are
compared with the old value la tched on the last rea d of
PORTA. The ‘mismatch’ outputs of the last read are
OR'd together to s et, the PO RTA Change Interrupt flag
bit (RAIF) in the INTCON register.
This interrupt can wake the device from SLEEP. The
user, in the Interrupt Service Routine, can clear the
interrupt in the following manner:
a)Any read or write of PORTA. This will end the
mismatch condition.
b)Clear the flag bit RAIF.
A mismatch c ond it i on wi ll cont i n ue to s et f lag bi t RA IF.
Reading PORTA will end the mismatch condition and
allow flag bit RAIF to be cleared.
Note:If a change on the I/O pin should occur
when the read operatio n is b eing ex ecute d
(start of the Q2 cycle), then the RAIF
interrupt flag may not get set.
Each PORTA pin is multiplexed with other functions.
The pins and their combined functions are briefly
described here. For specific information about individual functions such as the comparator or the A/D, refer
to the appropriate section in this Data Sheet.
3.2.3.1RA0/AN0/CIN+
Figure 3-1 shows th e diagr am for thi s pin. Th e RA0 pin
is configurable to function as one of the following:
• a general purpose I/O
• an analog input for the A/D (PIC16F676 only)
• an analog input to the comparator
3.2.3.2RA1/AN1/CIN-/VREF
Figure 3-1 shows th e diagr am for thi s pin. Th e RA1 pin
is configurable to function as one of the following:
• as a general purpose I/O
• an analog input for the A/D (PIC16F676 only)
• an analog input to the comparator
• a voltage reference input for the A/D (PIC16F676
PORTC is a general purp ose I/O port co nsisting of 6 bidirectional pins. The pins can be configured for either
digital I/O or analog i nput to A/D co nver ter. For specific
information about individual functions such as the
comparator or th e A/D , ref e r to th e appr o p ria t e se ct i on
in this Data Sheet.
Note:The ANSEL register (91h) must be clear to
configure an analog channel as a digital
input. Pins configu red as an alog in put s wil l
read ‘0’. The ANSEL register is define d for
the PIC16F676.
EXAMPLE 3-2:INITIALIZING PORTC
bcfSTATUS,RP0;Bank 0
clrfPORTC;Init PORTC
bsfSTATUS,RP0;Bank 1
clrf ANSEL;digital I/O
movlw0Ch;Set RC<3:2> as inputs
movwfTRISC;and set RC<5:4,1:0>
;as outputs
bcfSTATUS,RP0;Bank 0
3.3.1RC0/AN4, RC1/AN5, RC2/AN6, RC3/
AN7
3.3.2RC4 AND RC5
The RC4 and RC5 pins are configurable to function as
a general purpose I/Os.
FIGURE 3-7:BLOCK DIAGRAM OF RC4
AND RC5 PINS
Data bus
VDD
I/O Pin
VSS
WR
PORTC
WR
TRISC
RD
TRISC
RD
PORTC
D
Q
CK
Q
D
Q
CK
Q
The RC0/RC1/RC2/RC3 pins are configurable to
function as one of the following:
The Timer0 module timer/counter has the following
features:
• 8-bit timer/counter
• Readable and writable
• 8-bit software programmable prescaler
• Internal or external clock select
• Interrupt on overflow from FFh to 00h
• Edge select for external clock
Figure 4-1 is a bl ock diagram of the T imer0 m odule and
the prescaler shared with the WDT.
Note:Additional information on the Timer0
module is avail able in the PIC
Reference Manual, (DS33023).
4.1Timer0 Operation
Timer mode is selected by clearing the T0CS bit
(OPTION_REG<5>). In Timer mode, the Timer0
module will increment every instruction cycle (without
prescaler). If TMR0 is written , the increment is inhibited
for the following two instruction cycles. The user can
work around this by writing an adjusted value to the
TMR0 register.
®
Mid-Range
Counter mode is selected by setting the T0CS bit
(OPTION_REG<5>). In this mode, the Timer0 module
will increment either on every rising or falling edge of
pin RA2/T0CKI. The incrementing edge is determined
by the source edge (T0SE) control bit
(OPTION_REG<4>). Clearing the T0SE bit selects the
rising edge.
Note:Counter mode has specific external clock
requirements. Additional information on
these requirements is available i n the PIC
Mid-Range Reference Manual,
(DS33023).
4.2Timer0 Interrupt
A Timer0 interrupt is generated when the TMR0
register timer/counter overflows from FFh to 00h. This
overflow sets the T0IF bit. The interrupt can be masked
by clearing the T0IE bit (INTCON<5>). The T0IF bit
(INTCON<2>) must be cleared in software by the
Timer0 module Interrupt Service Routine before reenabling this interrupt. The Timer0 interrupt cannot
wake the processor from SLEEP since the timer is
shut-off during SLEEP.
®
FIGURE 4-1:BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
CLKOUT
(= FOSC/4)
0
1
1
T0CKI
pin
T0SE
Note 1: T0SE, T0CS, PSA , PS0-PS 2 are bits in the Option register.
When no pr escal er is us ed, t he ex ternal clock inpu t is
the same as the prescaler outp ut. Th e synchronization
of T0CKI, with the internal phase clocks, is accomplished by sampli ng the prescale r output on the Q2 and
Q4 cycles of the internal phase clocks. Therefore, it is
necessary for T0CKI to be high for at least 2T
OSC (and
a small RC delay of 20 ns) and low for at least 2T
(and a small RC delay of 20 ns). Refer to the electrical
specification of the desired device.
Note:The ANSEL (91h) and CMCON (19h)
registers must be initializ ed to c onfigure a n
analog channel as a digital input. Pins
configured as analog inputs will read ‘0’.
The ANSEL register is defined for the
PIC16F676.
An 8-bit counter is available as a prescaler for the
Timer0 module, or as a postscaler for the Watchdog
Timer. For simplicity, this counter will be referred to as
“prescaler” throughout this Data Sheet. The prescaler
assignment is controlled in software by the control bit
PSA (OPTION_REG<3>). Clearing the PSA bit will
assign the prescaler to Timer0. Prescale values are
selectable via the PS2:PS0 b its (OP TION_ REG<2:0 >).
The prescaler is not readable or writable. When
assigned to the Timer0 module, all instructions writing
to the TMR0 register (e.g., CLRF 1, MOVWF 1,
BSF 1, x....etc.) will clear the prescaler. When
assigned to WDT, a CLRWDT instruction will clear the
prescaler along with the Watchdog Timer.
4.4.1SWITCHING PRESCALER
ASSIGNMENT
The prescaler assignment is fully under software
control (i.e., it can be changed “on the fly” during
program execution). To avoid an unintended device
RESET, the following instruction sequence
(Example 4-1) must be executed when changing the
prescaler assignment from Timer0 to WDT.
EXAMPLE 4-1:CHANGING PRESCALER
(TIMER0→WDT)
bcfSTATUS,RP0;Bank 0
clrwdt;Clear WDT
clrfTMR0;Clear TMR0 and
; prescaler
bsfSTATUS,RP0;Bank 1
movlwb’00101111’ ;Required if desired
movwfOPTION_REG; PS2:PS0 is
clrwdt; 000 or 001
To change prescaler from the WDT to the TMR0
module, use the se quence sh own in Examp le 4-2. This
precaution must be t aken even if the WDT is disabled.
• 16-bit asynchronous counter
In Timer mode, Timer1 is incremented on every instruc-
tion cycle. In Counter mode, Timer1 is incremented on
the rising edge of the external clock input T1CKI. In
addition, the Counter mode clock can be sync hronized
to the microcontroller system clock or run
asynchronously.
In Counter and Timer modules, the counter/timer clock
can be gated by the T1G
If an external clock oscillator is needed (and the
microcontroller is using the INTOSC w/o CLKOUT),
Timer1 can use the LP oscillator as a clock source.
Note:In Counter mode , a falling edge must be
registered by the counter prior to the first
incrementing rising edge.
FIGURE 5-2:TIMER1 INCREMENTING EDGE
input.
5.2Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit (PIR1<0>) is set. To
enable the inter rupt on rollo ver , you must set th ese bits :
• Timer1 interrupt Enable bit (PIE1<0>)
• PEIE bit (INTCON<6>)
• GIE bit (INTCON<7>).
The interrupt is cleared by clearing the TMR1IF in the
Interrupt Service Routine.
Note:The TMR1H:TTMR1L regi st er pair and the
TMR1IF bit should be cleared before
enabling interrupts.
5.3Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4, or 8
divisions of the clock input. The T1CKPS bits
(T1CON<5:4>) control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write
to TMR1H or TMR1L.
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increm ents.
2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the
If control bit T1SYNC (T1CON<2>) is set, the external
clock input is not synchronized. The timer continues to
increment asynchronous to the internal phase clocks.
The timer will continue to run during SLEEP and can
generate an interrupt on overflow, which will wake-up
the processor. However, special precautions in
software are needed to read/write the timer
(Section 5.4.1).
Note:The ANSEL (91h) and CMCON (19h)
registers must be initializ ed to c onfigure a n
analog channel as a digital input. Pins
configured as analog inputs will read ‘0’.
The ANSEL register is defined for the
PIC16F676.
5.4.1READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER MODE
Reading TMR1H or TMR1L, while the timer is running
from an external asynchronous clock, will ensure a
valid read (taken care of in hardware). However, the
user shoul d keep i n mind that r eadin g the 16-bit time r
in two 8-bit values it self, poses certain problems, since
the timer may overflow between the reads.
For writes, it is recomm ended that the us er simply stop
the timer and write the desired values. A write contention may occur by writing to the timer registers, while
the register is incrementing. This may produce an
unpredictable value in the timer register.
Reading the 16-bit value requires some care.
Examples 12-2 and 12-3 in the PIC
Family Reference Manual (DS33023) show how to
read and write Timer1 when it is running in
Asynchronous mode.
®
Mid-Range MCU
5.5Timer1 Oscillator
A crystal oscilla tor circuit is built-in between pin s OSC1
(input) and OSC2 (amplifier output). It is enabled by
setting control bit T1OSCEN (T1C ON<3>). The oscill ator is a low power oscillator rated up to 32 kHz. It will
continue to run during SLEEP. It is primarily intended
for a 32 kHz crystal. Table 9-2 shows the capacitor
selection for the T im er1 osc il lat or.
The Timer1 oscillator is shared with the system LP
oscillator. Thus, Timer1 can use this mode only when
the system clock is derived from the internal oscillator.
As with the system LP oscillator, the user must provide
a software time delay to ensure proper oscillator
start-up.
TRISA5 and TRISA4 bits are set when the Timer1
oscillator is enabled. RA5 and RA4 read as ‘0’ and
TRISA5 and TRISA4 bits read as ‘1’.
Note:The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to enabling Timer1.
5.6Timer1 Operation During SLEEP
Timer1 can only operate during SLEEP when setup in
Asynchronous Counte r mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To setup the timer to wake the device:
• Timer1 must be on (T1CON<0>)
• TMR1IE bit (PIE1<0>) must be set
• PEIE bit (INTCON<6>) must be set
The device will wake-up on an overflow. If the GIE bit
(INTCON<7>) is set, the devi ce wil l wa ke -up an d jum p
to the Interrupt Service Routine on an overflow.
TABLE 5-1:REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER
0Bh/8Bh INTCONGIEPEIE
0ChPIR1
0EhTMR1LHolding Register for the Least Significant Byte of the 16-bit TMR1 Registerxxxx xxxx uuuu uuuu
0FhTMR1HHolding Register for the Most Significant Byte of the 16-bit TMR1 Registerxxxx xxxx uuuu uuuu
10hT1CON
8ChPIE1
Legend: x = unknown, u = unchanged, - = unimplemented, read as '0'. Shaded cells are not used by the Timer1 module.
The PIC16F630/676 device s have on e analog comp arator. Th e inputs to the comparator are multiplexed wi th
the RA0 and RA1 pins. There is an on-c hip Comparator
Voltage Reference that can also be applied to an input
of the comparator. In addition, RA2 can be configured
as the comparator output. The Comparator Control
Register (CMCON), shown in Register 6-1, contains
the bits to control the comparator.
REGISTER 6-1:CMCON — COMPARATOR CONTROL REGISTER (ADDRESS: 19h)
U-0R-0U-0R/W-0R/W-0R/W-0R/W-0R/W-0
—COUT—CINVCISCM2CM1CM0
bit 7bit 0
bit 7Unimplemented: Read as ‘0’
bit 6COUT: Compar ator Output bit
When C
1 = VIN+ > VIN-
0 = V
When C
1 = VIN+ < VIN-
0 = V
bit 5Unimplemented: Read as ‘0’
bit 4CINV: Comparator Output Inversion bit
1 = Output inverted
0 = Output not inverted
bit 3CIS: Comparator Input Switch bi t
When CM2:CM0 =
1 = VIN- connects to CIN+
0 = V
bit 2-0CM2:CM0: Comparator Mode bit s
Figure 6-2 shows the Comparator modes and CM2:CM0 bit settings
INV = 0:
IN+ < VIN-
INV = 1:
IN+ > VIN-
110 or 101:
IN- connects to CIN-
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
A single comparator is shown in Figure 6-1, along with
the relationship between the analog input levels and
the digital output . When the analo g input at V
than the analog input V
IN-, the output of the compara tor
is a digital low level. When the analog input at V
greater than the analog input V
IN-, the output of the
comparator is a digital high level. The shaded areas of
the output of the comparator in Figure 6-1 represent
the uncertainty due to input offsets and response time.
Note:To use CIN+ and CIN- pins as analog
inputs, the appropriate bits must be
programmed in the CMCON (19h) register.
The polarity of the comparator output can be inverted
by setting the CINV bit (CMCON<4>). Clearing CINV
results in a non-inverted output. A complete table
showing the output state versus input conditions and
the polarity bit is shown in Table 6-1.
Comparator mode is changed, the comparator output
level may not be valid for a specified period of t ime.
There are eight mod es of operat ion fo r th e comp arato r.
The CMCON register, shown in Register 6-1, is used to
select the mode. Figure6-2 shows the eight possible
modes. The TRISA register controls the data direction
of the comparator pins for each mode. If the
Refer to the specifications in Section 12.0.
Note:Comparator interrupts should be disabled
during a Comparat or mode ch ange. Othe rwise, a false interrupt may occur.
FIGURE 6-2:COMPARATOR I/O OPERATING MODES
Comparator Reset (POR Default Value - low power)Comparator Off (Lowest power)
CM2:CM0 = 000CM2:CM0 = 111
RA1/CINRA0/CIN+
RA2/COUT D
A
A
Off (Read as '0')
Comparator without OutputComparator w/o Output and with Interna l Referen ce
CM2:CM0 = 010CM2:CM0 = 100
RA1/CINRA0/CIN+
RA2/COUT D
A
A
COUT
RA1/CINRA0/CIN+
RA2/COUT D
RA1/CINRA0/CIN+
RA2/COUT D
D
D
A
D
From CVREF Module
Off (Read as '0')
COUT
Comparator with Output and Intern al Refere nc eMultiplexed Input with Internal Reference and Output
CM2:CM0 = 011CM2:CM0 = 101
RA1/CINRA0/CIN+
RA2/COUT D
A
D
From CVREF Module
COUT
RA1/CINRA0/CIN+
RA2/COUT D
A
CIS = 0
A
CIS = 1
From CVREF Module
COUT
Comparator with OutputMultiplexed Input with Internal Reference
CM2:CM0 = 001CM2:CM0 = 110
RA1/CINRA0/CIN+
RA2/COUT D
A
A
COUT
RA1/CINRA0/CIN+
RA2/COUT D
A
CIS = 0
A
CIS = 1
From CVREF Module
COUT
A = Analog Input, ports always reads ‘0’
D = Digital Input
CIS = Comparator Input Switch (CMCON<3>)
A simplified circuit for an analog input is shown in
Figure 6-3. Since the analog pins are connected to a
digital output, they have reverse biased diodes to VDD
and VSS. The analog input, th erefore, must be between
V
SS and VDD. If the input voltage deviates from this
FIGURE 6-3:ANALOG INPUT MODE
VDD
Rs < 10K
IN
A
VA
Legend:CPIN= Input Capacitance
CPIN
5 pF
V
T= Threshold Voltage
LEAKAGE= Leakage Current at the pin due to Various Junctions
I
IC= Interconnect Resistance
R
R
S= Source Impedance
VA= Analog Voltage
VT = 0.6V
VT = 0.6V
range by more than 0.6V in either direction, one of the
diodes is forward biased and a latchup may occur. A
maximum source impedance of 10 kΩ is
recommended for the analog sources. Any external
component connected to an analog input pin, such as
a capacitor or a Zener diode, should have very little
leakage current.
RIC
Leakage
±500 nA
Vss
6.4Comparator Output
The TRISA<2> bit functions as an output enable/
disable for the RA2 pin while the comparator is in an
The comparator output, COUT, is read through the
CMCON register. This bit is read-only. The comparator
output may also be directly output to the RA2 pin in
three of the eight possible modes, as shown in
Figure 6-2. When in one of thes e modes , the ou tput on
RA2 is asynch ronous to t he internal clock. Fig ure 6-4
shows the comparator output block diagram.
Output mode.
Note 1: When reading the PORTA register, all
pins configured as analog inputs will read
as a ‘0’. Pins configured as digital inputs
will convert an analog input according to
the TTL input specification.
2: Analog levels on any pin that is defined a s
a digital input, ma y ca us e t he in put buffer
to consume more current than is
specified.
The comparato r m od ule al so allows the selection of an
internally generated voltage reference for one of the
comparator inputs. The internal reference signal is
The following equations determine the output volt ages:
VRR = 1 (low range): CV
VRR = 0 (high range): CV
DD / 32)
V
REF = (VR3:VR0 / 24) x VDD
REF = (VDD / 4) + (VR3:VR0 x
used for four of the eight Comparator modes. The
VRCON register, Register 6-2, controls the voltage
reference module shown in Figure 6-5.
6.5.1CONFIGURING THE VOLTAGE
REFERENCE
The voltage reference can output 32 distinct voltage
levels, 16 in a high range and 16 in a low range.
6.5.2VOLTAGE REFERENCE
ACCURACY/ERROR
The full range of VSS to VDD cannot be rea liz ed due to
the construction of the module. The transistors on the
top and bottom of the resistor ladder network
(Figure 6-5) keep CV
DD. The V olt age R eference is VDD derived and there-
V
fore, the CV
V
DD. The tested absolute accuracy of the Comparator
REF output changes with fluctuations in
REF from approaching VSS or
Voltage Reference can be found in Section 12.0.
FIGURE 6-5:COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
16 Stages
8RRRRR
VDD
16-1 Analog
MUX
VREN
CVREF to
Comparator
Input
8R
VRR
VR3:VR0
6.6Comparator Response Time
Response time is the minimum time, after selecting a
new reference voltage or input source, before the
comparator output is ensured to have a valid level. If
the internal reference is changed, the maximum delay
of the internal voltage reference must be considered
when using the comparator outputs. Otherwise, the
maximum delay of the comparators should be used
(Table 12-7).
6.7Operation During SLEEP
Both the comparator and voltage reference, if enabled
before entering SLEEP mode, remain active during
SLEEP. This results in higher SLEEP currents than
shown in the power-down specifications. The
additional curren t consumed by the comparato r and the
voltage reference is shown separately in the specifications. To minimize power consumption while in SLEE P
mode, turn off the comparator, CM2:CM0 = 111, and
voltage reference, VRCON<7> = 0.
While the comparator is enabled during SLEEP, an
interrupt will wake-up the device. If the device wakes
up from SLEEP, the contents of the CMCON and
VRCON registers are not affected.
6.8Effects of a RESET
A device RESET forces the CMCON and VRCON
registers to their RESET states. This forces the
comparator module to be in the Comparator Reset
mode, CM2:CM0 = 000 and the voltage reference to it s
off state. Thus, all potential inputs are analog inputs
with the comparator and voltage reference disabled to
consume the smallest current possible.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
6.9Comparator Interrupts
The comparator interrupt flag is set whenever there is
a change in the output value of the comparator.
Software will need to maintain information about the
status of the output bits, as read from CMCON<6>, to
determine the actual change that has occurred. The
CMIF bit, PIR1<3>, is the comparator interrupt flag.
This bit mu st be rese t in softw are by cle aring it t o ‘0’.
Since it is also possible to write a '1' to this register, a
simulated interrupt may be initiated.
The CMIE bit (PIE1<3>) and the PEIE bit
(INTCON<6>) must be set to enable the interrupt. In
addition, the GIE bit must also be set. If any of these
bits are cleared, th e interrupt is not enable d, though the
CMIF bit will still be set if an interr upt co nd itio n occ urs .
The user, in the Interrupt Service Routine, can clear the
interrupt in the following manner:
a)Any read or write of CMCON. This will end the
mismatch condition.
b)Clear flag bit CMIF.
A mismatch condition will co nti nue to set fla g bit CMIF.
Reading CMCON will end the mismatch condition and
allow flag bit CMIF to be cleared.
Note:If a change in the CMCON register (COU T)
should occur when a read operation is
being executed (st art of the Q2 cycle), then
the CMIF (PIR1<3>) interrupt flag may not
get set.
TABLE 6-2:REGISTERS ASSOCIATED WITH COMPARATOR MODULE
0Bh/8BhINTCONGIEPEIE
0ChPIR1
19hCM CON
8ChPIE1
85hTRISA
99hVR CONVREN
Legend:x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the comparator module.
The analog-to-digit al converter (A/D) allow s conversion
of an analog input signal to a 10-bit binary representation of that signal. The PIC16F676 has eight analog
inputs, multiplexed into one sample and hold circuit.
FIGURE 7-1:A/D BLOCK DIAGRAM
VDD
VREF
RA0/AN0
RA1/AN1/VREF
RA2/AN2
RA4/AN3
RC0/AN4
RC1/AN5
RC2/AN6
RC3/AN7
VCFG = 0
VCFG = 1
GO/DONE
ADON
The output of the sample and hold is connected to the
input of the converter. The converter generates a
binary result via successive approximation and stores
the result in a 10-bit register. The voltage reference
used in the conversion is software selectable to either
DD or a voltage applied by the VREF pin. Figure 7-1
V
shows the block dia gram of the A/D on the PIC16 F676.
ADC
10
ADFM
10
VSS
ADRESH
ADRESL
CHS2:CHS0
7.1A/D Configuration and Operation
There are three registers available to control the
functionality of the A/D module:
1.ADCON0 (Register 7-1)
2.ADCON1 (Register 7-2)
3.ANSEL (Register 7-3)
7.1.1ANALOG PORT PINS
The ANS7:ANS0 bits (ANSEL<7:0>) and the TRISA
bits control the operation of the A/D port pins. Set the
corresponding TRISA bit s to set the pi n output driv er to
its high imp edance st ate. Li kewise, s et the co rresponding ANS bit to disable the digital input buffer.
Note:Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
7.1.2CHANNEL SELECTION
There are eight analog channels on the PIC16F676,
AN0 through AN7. The CHS2:CHS0 bits
(ADCON0<4:2>) control w hich channel is co nnected to
the sample and hold circuit.
7.1.3VOLTAGE REFERENCE
There are two options for the voltage reference to the
A/D converter: either V
applied to V
REF is used. The VCFG bit (ADCON0<6>)
DD is used, or an analog volt age
controls the volt age reference s election. If VC FG is set,
then the voltage on the V
otherwise, V
DD is the reference.
REF pin is the reference;
7.1.4CONVERSION CLOCK
The A/D conversion cycle requires 11 TAD. The source
of the conversion clock is software selectable via the
ADCS bits (ADCON1<6:4>). There are seven possible
clock options:
OSC/2
•F
•F
OSC/4
•FOSC/8
•FOSC/16
•F
OSC/32
•FOSC/64
•FRC (dedicated internal oscillator)
For correct conversion, the A/D conversion clock
AD) must be selecte d to ensure a minimum TAD of
(1/T
1.6 μs. Table 7-1 shows a few T
selected frequencies.
Legend:Shaded cells are outside of recommended range.
Note 1: The A/D RC source has a typical T
2: These values violate the minimum required T
3: For faster conversion times, the selection of another clock source is recommended.
4: When the device frequency is greater than 1 MHz, the A/D RC clock source is only recommended if the
conversion will be performed during SLEEP.
(2)
(2)
(2)
(2)
(1,4)
AD time of 4 μs for VDD > 3.0V.
2 - 6 μs
AD time.
(2)
400 ns
(2)
800 ns
1.6 μs2.0 μs6.4 μs
3.2 μs4.0 μs12.8 μs
(3)
(1,4)
500 ns
1.0 μs
16.0 μs
2 - 6 μs
(2)
(2)
(3)
(3)
(1,4)
1.6 μs
3.2 μs
25.6 μs
51.2 μs
2 - 6 μs
(3)
(3)
(3)
(1,4)
7.1.5STARTING A CONVERSION
The A/D conversion is initiated by setting the
GO/DONE
complete, the A/D module:
• Clears the GO/DONE bit
bit (ADCON0 <1> ). W hen th e co nvers ion is
previous conversion. After an aborted conversion, a
AD delay is required before another acquisition can
2T
be initiated. Following the delay, an input acquisition is
automatically started on the selected channel.
Note:The GO/DONE bit should not be set in the
• Sets the ADIF flag (PIR1<6>)
• Generates an interrupt (if enabled)
If the conversion must be aborted, the GO/DONE bit
can be cleared in software. The ADRESH:ADRESL
registers will not be u pdated with th e pa rtiall y comple te
A/D conversion sample. Instead, the
7.1.6CONVERSION OUTPUT
The A/D conversion can be su pplied in two format s: left
or right shifted. The ADFM bit (ADCON0<7>) controls
the output format. Figure7-2 shows the output formats.
ADRESH:ADRESL registers will retain the va lue of th e
REGISTER 7-3:ANSEL — ANALOG SELECT REGISTER (ADRESS: 91h) (PIC16F676 ONLY)
R/W-1R/W-1R/W-1R/W-1R/W-1R/W-1R/W-1R/W-1
ANS7ANS6ANS5ANS4ANS3ANS2ANS1ANS0
bit 7bit 0
bit 7-0:ANS<7:0>: Analog Select between analog or digital function on pins AN<7:0>, respectively.
1 = Analog input. Pin is assigned as analog input.
0 = Digital I/O. Pin is assigned to port or special function.
Note 1: Setting a pin to an analog input automatically disables the digital input circuitry,
weak pull-ups, and interrupt-on-change if available. The corresponding TRIS bit
must be set to In put mo de in order to allow external control of t he vo ltage on the pin.
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
For the A/D co nverter to meet its s pecified accuracy,
the charge holding capacitor (C
to fully charge to the input channel voltage level. The
analog input model is shown in Figur e7-3. The source
impedance (R
S) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (V
Figure 7-3. The maximum recommended imped-
ance for analog sources is 10 kΩ. As the impedance
EQUATION 7-1:ACQUISITION TIME
TACQ
TC
TACQ
=
Amplifier Settling Time +
Hold Capacitor Charging Time +
Temperature Coefficient
=
AMP + TC + TCOFF
T
=
2μs + TC + [(Temperature -25°C)(0.05μs/°C)]
=
C
HOLD (RIC + RSS + RS) In(1/2047)
=
- 120pF (1kΩ + 7kΩ + 10kΩ) In(0.0004885)
=
16.47μs
=
2μs + 16.47μs + [(50°C -25°C)(0.05μs/°C)
=
19.72μs
HOLD) must be allowed
DD), see
is decreased, the acquisition time may be decreased.
After the analog input channel is selected (changed),
this acquisition must be done before the conversion
can be started.
To calculate the minimum acquisition time, Equation 7-1
may be used. This equation ass umes that 1 /2 LSb e rror
is used (1024 steps for the A/D). The 1/2 LSb error is the
maximum error allowed for the A/D to meet its specified
resolution.
To calculate the minimum acquisition time, T
®
the PIC
Mid-Range Reference Manual (DS33023).
ACQ, see
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (C
HOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 kΩ. This is required to meet the pin
The A/D converter module can operate during SLEEP.
This requires the A/D clock source to be set to the
When the A/D clock source is something other than
RC, a SLEEP instruction causes the presen t conversion
to be aborted, and the A/D module is turned off. The
ADON bit remains set.
internal oscillator. When the RC clock source is
selected, the A/D waits one instruction before starting
7.4Effects of RESET
the conversion . T his a llows the SLEEP instruction to b e
executed, thus elim inating much of the switching noise
from the conversion. When the conversion is complete,
the GO/DONE
bit is cleared, and the result is loaded
into the ADRESH:ADRESL registers. If the A/D
A device RESET forces all registers to their RESET
state. Thus, the A/D module is turned off and any
pending conversion i s aborted. The ADRESH:ADRESL
registers are unchanged.
interrupt is enabled, the device awakens from SLEEP.
If the A/D interrupt is not enabled, the A/D module is
turned off, although the ADON bit remains set.
05hPORTA
07hPORTC
0Bh, 8Bh INTCONGIEPEIE
0ChPIR1
1EhADRESH Most Significant 8 bits of the Left Shifted A/D result or 2 bits of the Right Shifted Resultxxxx xxxx uuuu uuuu
1FhADCON0ADFMVCFG
85hTRISA
87hTRISC
8ChPIE1
91hANSELANS7ANS6ANS5ANS4ANS3ANS2ANS1ANS01111 1111 1111 1111
9EhADRESL Least Significant 2 bits of the Left Shifted A/D Result or 8 bi ts of the Ri ght Shi ft ed Result xxxx xxxx uuuu uuuu
9FhADCON1
Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used for A/D converter module.
The EEPROM data memory is readable and writable
during normal operation (full V
is not directly mapped in the register file space.
Instead, it is indirectly addressed through the Special
Function Registers. There are four SFRs used to read
and write this memory:
• EECON1
• EECON2 (not a physically implemented register)
• EEDA TA
• EEADR
EEDATA holds the 8-bit data for read/write, and
EEADR holds the address of the EEPROM location
being accessed. PIC16F630/676 devices have 128
bytes of data EEPROM with a n add res s ra nge from 0h
to 7Fh.
DD range). This memory
The EEPROM data memory allows b yte read and write.
A byte write automatically erases the location and
writes the new data (erase be fore write). The EEPROM
data memory is rated fo r high er ase/writ e cycles. T he
write time is controll ed by an on-chip timer. The write
time will vary with voltage and temperature as well as
from chip to chip. Please refer to AC Specifications for
exact limits.
When the data memory is code protected, the CPU
may continue to read and write the data EEPROM
memory . The device progra mmer can no longer access
this memory.
Additional information on the Data EEPROM is
available in the PIC
(DS33023).
®
Mid-Range Reference Manual,
REGISTER 8-1:EEDAT — EEPROM DATA REGISTER (ADDRESS: 9Ah)
R/W-0R/W-0R/W-0R/W-0R/W-0R/W-0R/W-0R/W-0
EEDAT7EEDAT6EEDAT5EEDAT4EEDAT3EEDAT2 EEDAT1EEDAT0
bit 7bit 0
bit 7-0EEDATn: Byte value to write to or read from Data EEPROM
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
The EEADR register can address up to a maximum of
128 bytes of data EEPROM. Only seven of the eight
bits in the register (EEADR<6:0>) are required. The
MSb (bit 7) is ignored.
The upper bit should always be ‘0’ to remain upward
compatible with devices tha t have more dat a EEPROM
memory.
8.2EECON1 AND EECON2
REGISTERS
EECON1 is the control register with four low order bits
physically implemented. The upper four bits are nonimplemented and read as '0's.
Control bits RD and WR initiate read and write,
respectively. These bits cannot be cleared, only set, in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental, premature
termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear. The WRERR bit
is set when a wr ite op eratio n is interr upte d by a M CLR
Reset, or a WDT Time-out Reset during normal
operation. In th ese situations, following RE SET, the
user can check the WRERR bit , clear it, and rewrite
the location. The data and address will be cleared,
therefore, the EEDATA and EEADR registers will
need to be re-initial ize d.
Interrupt flag bit EEIF in the PIR1 register is set when
write is complete. This bit must be cleared in software.
EECON2 is not a physical register. Reading EECON2
will read all '0's. The EECON2 register is used
exclusively in the Data EEPROM write sequence.
REGISTER 8-3:EECON1 — EEPROM CONTROL REGISTER (ADDRESS: 9Ch)
U-0U-0U-0U-0R/W-xR/W-0R/S-0R/S-0
————WRERRWRENWRRD
bit 7bit 0
bit 7-4Unimplemented: Read as ‘0’
bit 3WRERR: EEPROM Error Flag bit
1 =A write operation is prematurely terminated (any MCLR
normal operation or BOD detect)
0 =The write operation completed
bit 2WREN: EEPROM Write Enable bit
1 = Allows write cycles
0 = Inhibits write to the data EEPROM
bit 1WR: Write Control bit
1 =Initiates a write cycle (The bit is cleared by hardware once write is comp lete. The WR bit
can only be set, not cleared, in software.)
0 =Write cycle to the da ta EEPROM is complete
bit 0RD: Read Control bit
1 =Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit
can only be set, not cleared, in software.)
0 = Does not initiate an EEPROM read
Legend:
S = Bit can only be set
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
- n = Value at POR’1’ = Bit is set’0’ = Bit is clearedx = Bit is unknown
T o read a d ata memory loca tion, the user must write the
address to the EEADR register and then set control bit
RD (EECON1<0>), as shown in Exam ple 8-1. The data
is available, in the very next cycle, in the EEDATA
register. Therefore, it can be read in the next
instruction. EEDAT A holds this value until another read,
or until it is written to by the user (during a write
operation).
EXAMPLE 8-1:DATA EEPROM READ
bsfSTATUS,RP0;Bank 1
movlw CONFIG_ADDR;
movwf EEADR;Address to read
bsfEECON1,RD;EE Read
movfEEDATA,W;Move data to W
8.4WRITING TO THE EEPROM DATA
MEMORY
To write an EEPROM data location, the user must first
write the address to the EEADR register and the data
to the EEDATA register. Then the user must follow a
specific sequence to initiate the write for each byte, as
shown in Example 8-2.
After a write sequence has been initiated, clearing the
WREN bit will not af fect this writ e cycle. The WR bit will
be inhibited from being s et u nle ss the WREN bit is set.
At the completion of the write cycle, the WR bit is
cleared in hardware and the EE Write Complete
Interrupt Flag bit (EEIF) is set. The user can either
enable this interrupt or poll this bit. The EEIF bit
(PIR<7>) register must be cleared by software.
8.5WRITE VERIFY
Depending on the application, good programming
practice may dictate that the value written to the Data
EEPROM should be verified (see Example 8-3) to the
desired value to be written.
EXAMPLE 8-3:WRITE VERIFY
bcfSTATUS,RP0;Bank 0
:;Any code
bsfSTATUS,RP0;Bank 1 READ
movfEEDATA,W;EEDATA not changed
;from previous write
bsfEECON1,RD;YES, Read the
;value written
xorwf EEDATA,W
btfss STATUS,Z;Is data the same
gotoWRITE_ERR;No, handle error
:;Yes, continue
bsfEECON1,WR;Start the write
bsfINTCON,GIE;Enable INTS
The write will not initiate if the above sequence is not
exactly followed (write 55h to EECON2, write AAh to
EECON2, then set WR bit) for each byte. We strongly
recommend that interrupts be disabled during this
code segment. A cycle count is executed during the
required sequence. A ny number th at is not equa l to the
required cycles to execute the required sequence will
prevent the data from being writte n into the EEPROM.
Additionally, the WREN bit in EECON1 must be set to
enable write. This mechanism prevents accidental
writes to data EEPROM due to errant (unexpected)
code execution (i.e., lost programs). The user should
keep the WREN bit clear at all times, except when
updating EEPROM. The WREN bit is not cleared
by hardware.
8.5.1USING THE DATA EEPROM
The Data EEPROM is a high-endurance, byte addressable array that has been optimized for the storage of
frequently changing information (e.g., program
variables or other data that are updated often).
Frequently changing values will typically be updated
more often than sp ecification s D120 or D120A. If t his is
not the case, an ar ray r efr esh m ust be pe rfor med . For
this reason, variables that change infrequently (such as
constants, IDs, calibration, etc.) should be stored in
FLASH program memory.
8.6PROTECTION AGAINST
SPURIOUS WRITE
There are c onditions when the user may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built in. On power-up, WREN is cleared. Als o, the
Power-up Timer (72 ms duration) prevents
EEPROM write.
The write initiate sequence and the WREN bit together
help prevent an accidental write during:
Data memory can be code pro tected by progr amming
the CPD bit to ‘0’.
When the data memory is code protected, the CPU is
able to read and write data to the Data EEPROM. It is
recommended to code protect the program memory
when code protecting data memory. This prevents
anyone from programming zeroes over the existing
code (which will execute as NOPs) to reach an added
routine, programmed in unused program memory,
which outputs the contents of data memory.
Programming unused locations to ‘0’ will also help
prevent data memory code protection from becoming
breached.
TABLE 8-1:REGISTERS/BITS ASSOCIATED WITH DATA EEPROM
AddressNameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2 Bit 1Bit 0
0ChPIR1EEIF
9AhEEDATAEEPROM Data Register0000 0000 0000 0000
9BhEE ADR
9ChEECON1
9DhEECON2
Legend: x = unknown, u = unchanged, – = unimplemented read as '0', q = value depends upon condition.
Certain special circuits that deal with the needs of real
time applications are what sets a microcontroller apart
from other processors. The PIC16F63 0/676 family has
a host of such features intended to:
• maximize system reliability
• minimize cost through elimination of external
components
• provide power saving operating modes and offer
code protection
These features are:
• Oscillator selection
• RESET
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Detect (BOD)
• Interrupts
• Watchdog Timer (WDT)
• SLEEP
• Code protection
• ID Locations
• In-Circuit Serial Programming
The PIC16F630/676 has a Watchdog Timer that is
controlled by configuration bits. It runs off its own RC
oscillator for added reliabili ty. There are two timers that
offer necessary delays on power-up. One is the
Oscillator Start-up Timer (OST), intended to keep the
chip in RESET until the crystal oscillator is stable. The
other is the Power-up T imer (PWR T ), which prov ides a
fixed delay of 72 ms (nominal) on power-up only,
designed to keep the part in RESET while the power
supply stabilizes. There is also circuitry to reset the
device if a brown-ou t occurs, whi ch can provide at least
a 72 ms RESET. With these three functions on-chip,
most applications need no external RESET circuitry.
The SLEEP mode is designed to offer a very low
current Power-down m ode. The u ser can wake-u p from
SLEEP through:
• External RESET
• Watchdog Timer wake-up
• An interrupt
Several oscillator options are also made available to
allow the part to f it th e a ppl ic ati on. The IN T O SC op tio n
saves system co st while the LP crystal opti on saves
power. A set of configuration bits are used to select
various options (see Register 9-1).
The configuration b its can be prog rammed (read as '0'),
or left unprogrammed (read as '1') to select various
device configurati ons, as shown in Regi ster 9-1. These
bits are mapped in program memory location 2007h.
REGISTER 9-1:CONFIG — CONFIGURATION WORD (ADDRESS: 2007h)
memory space. It belongs to the special configuration memory space (2000h - 3FFFh),
which can be accessed only during programming. See PIC16F630/676 Programming
Specification for more information.
bit 13-12BG1:BG0: Bandgap Calibration bits for BOD and POR voltage
00 = Lowest bandgap voltage
11 = Highest bandgap voltage
bit 11-9Unimplemented: Read as ‘0’
bit 8CPD
bit 7CP
bit 6BODEN: Brown-out Detect Enable bit
bit 5MCLRE: RA3/MCLR
bit 4PWRTE: Power-up Timer Enable bit
bit 3WDTE: Watchdog Timer Enable bit
bit 2-0FOSC2:FOSC0: Oscillator Selection bits
: Data Code Protection bit
1 = Data memory code protection is disabled
0 = Data memory code protection is enabled
: Code Protection bit
1 = Program Memory code protection is disabled
0 = Program Memory code protection is enabled
1 = BOD enabled
0 = BOD disabled
pin function select
1 = RA3/MCLR pin function is MCLR
0 = RA3/MCLR
1 = PWRT disabled
0 = PWRT enabled
1 = WDT enabled
0 = WDT disabled
111 = RC oscillator: CLKOUT function on RA4/OSC2/CLKOUT pin, RC on RA5/OSC1/CLKIN
110 = RC oscillator: I/O function on RA4/OSC2/CLKOUT pin, RC on RA5/OSC1/CLKIN
101 = INTOSC oscillator: CLKOUT function on RA4/OSC2/CLKOUT pin, I/O function on RA5/OSC1/CLKIN
100 = INTOSC oscillator: I/O function on RA4/OSC2/CLKOUT pin, I/O function on RA5/OSC1/CLKIN
011 = EC: I/O function on RA4/OSC2/CLKOUT pin, CLKIN on RA5/OSC1/CLKIN
010 = HS oscillator: High speed crystal/resonator on RA4/OSC2/CLKOUT and RA5/OSC1/CLKIN
001 = XT oscillator: Crystal/resona tor on RA4 /OS C2/CLKO UT and RA5/O SC1/ CL KIN
000 = LP oscillator: Low power crystal on RA4/ OS C2/CLKO U T and RA5/OSC 1/ CLK IN
pin function is digital I/O, MCLR internally tied to VDD
(2)
(3)
(4)
(5)
(1)
Note 1: The Bandgap Calibration bits are factory programmed and must be read and saved prior to erasing
the device as specified in the PIC16F630/676 Programming Specification. These bits are reflected
in an export of the configuration word. Microchip Development Tools maintain all calibration bits to
factory settings.
2: The entire data EEPROM will be erased when the code protection is turned off.
3: The entire program memory will be erased, including OSCCAL value, when the code protection is
turned off.
4: Enabling Brown-out Detect does not automatically enable Power-up Timer.
5: When MCLR
Legend:
P = Programmed using ICSP
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
-n = Value at POR1 = bit is set0 = bit is clearedx = bit is unknown
is asserted in INTOSC or RC mode, the internal clock oscillator is disabled.
PIC16F630/676
9.2Oscillator Configurations
9.2.1OSCILLATOR TYPES
The PIC16F630/676 can be operated in eight different
Oscillator Option modes. The user can program three
configuration bits (FOSC2 through FOSC0) to select
one of these eight modes:
• LPLow Power Crystal
• XTCrystal/Resonator
• HSHigh Speed Crystal/Resonator
• RCExternal Resist or/Capacitor (2 modes)
• INTOSCInternal Oscillator (2 modes)
• ECExternal Clock In
Note:Additional information on oscillator config-
urations is availabl e in the PIC
Reference Manual, (DS33023).
9.2.2CRYSTAL OSCILLATOR / CERAMIC
RESONATORS
In XT, LP or HS modes a crystal or ceramic resonator
is connected to the OSC1 and OSC2 pins to establish
oscillation (see Figure 9-1). The PIC16F630/676 oscillator design requires the use of a parallel cut crystal.
Use of a series cut crystal may yield a frequency
outside of the crystal manufacturers specifications.
When in XT, LP or HS modes, the device can have an
external clock source to drive the OSC1 pin (see
Figure 9-2).
FIGURE 9-1:CRYSTAL OPERATION (OR
CERAMIC RESONATOR)
(HS, XT OR LP OSC
CONFIGURATION)
OSC1
(1)
C1
XTAL
OSC2
(2)
RS
(1)
C2
Note1: See Table 9-1 and Table 9-2 for recommended
values of C 1 and C2.
2: A series resistor may be required for AT strip cut
crystals.
3: RF varies with the Oscillator mode selected
(Approx. value = 10 MΩ).
RF
(3)
®
Mid-Range
To Internal
Logic
SLEEP
PIC16F630/676
FIGURE 9-2:EXTERNAL CLOCK INPUT
OPERATION (HS, XT, EC,
OR LP OSC
CONFIGURATION)
Clock from
External System
Open
Note 1: Functions as RA4 in EC Osc mode.
OSC1
PIC16F630/676
(1)
OSC2
T ABLE 9-1:CAPACITOR SELECTION FOR
CERAMIC RESONATORS
Ranges Characterized:
ModeFreqOSC1(C1)OSC2(C2)
XT455 kHz
2.0 MHz
4.0 MHz
HS8.0 MHz
16.0 MHz
68 - 100 pF
15 - 68 pF
15 - 68 pF
10 - 68 pF
10 - 22 pF
68 - 100 pF
15 - 68 pF
15 - 68 pF
10 - 68 pF
10 - 22 pF
Note 1: Higher capacitance increases the stability
of the oscillator but also increases the
start-up time. These values are for design
guidance only. Since each resonator has
its own characteristics, the user should
consult the resonator manufacturer for
appropriate values of external
components.
T ABLE 9-2:CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR
Mode FreqOSC1(C1) OSC2(C2)
LP32 kHz68 - 100 pF68 - 100 pF
XT100 kHz
2 MHz
4 MHz
HS8 MHz
10 MHz
20 MHz
Note 1: Higher capacitance increases the stability
of the oscillator but also increases the
start-up time. These values are for design
guidance only. Rs may be required in HS
mode as well as XT mode to avoid
overdriving crystals with low drive level
specification. Since each crystal has its
own characteristics, the user should
consult the crystal manufacturer for
appropriate values of external
components.
For applications where a clock is already available
elsewhere, users may dir ectly drive the PIC16F630/
676 provided that this external clock source meets the
AC/DC timing requirements listed in Section 12.0.
Figure 9-2 shows how an external clock circuit should
be configured.
9.2.4RC OSCILLATOR
For applications where precise timing is not a
requirement, the RC oscillator option is available. The
operation and functionality of the RC oscillator is
dependent upon a number of variables. The RC
oscillator frequency is a function of:
• Supply voltage
• Resistor (R
EXT) and capacitor (CEXT) values
• Operating temperature
The oscillator frequency will vary from unit to unit due
to normal process parameter variation. The difference
in lead frame capacitance between package types will
also affect the oscillation frequency, especially for low
EXT values. The user also needs to account for the
C
tolerance of the external R and C components.
Figure 9-3 shows how the R/C combination is
connected.
Two options are available for this Oscillator mode
which allow RA4 to be used as a general purpose I/O
or to output F
OSC/4.
FIGURE 9-3:RC OSCILLATOR MODE
REXT
CEXT
VSS
VDD
F
OSC/4
RA5/OSC1/
CLKIN
RA4/OSC2/CLKOUT
PIC16F630/676
Internal
Clock
9.2.5INTERNAL 4 MH
Z OSCILLATOR
When calibrated, the interna l oscillat or provides a fixe d
4 MHz (nominal) system clock. See Electrical
Specifications, Section12.0, for information on
variation over voltage and temperature.
Two options are available for this Oscillator mode
which allow RA4 to be used as a general purpose I/O
or to output F
OSC/4.
9.2.5.1Calibrating the Internal Oscillator
A calibration instruction is programmed into the last
location of program memory. This instruction is a
RETLW XX, where the literal is the calibration value.
The literal is placed in the OSCCAL register to set the
calibration of the internal oscillator. Example 9-1
demonstrates how to calibrate the internal oscillator.
For best operation, decouple (with capacitance) V
DD
and VSS as close to the device as possible.
Note:Erasing the device will also erase the pre-
programmed internal calibration value for
the internal oscilla tor. The calibration value
must be saved prior to erasing part as
specified in the PIC16F630/676 Programming specification. Microchip Development Tools maintain all calibration bits to
factory settings.
EXAMPLE 9-1:CALIBRA TING THE
INTERNAL OSCILLATOR
bsfSTATUS, RP0;Bank 1
call3FFh;Get the cal value
movwfOSCCAL;Calibrate
bcfSTATUS, RP0;Bank 0
9.2.6CLKOUT
The PIC16F630/676 devices can be configured to
provide a clock out signal in the INTOSC and RC
Oscillator modes. When configured, the oscillator
frequency divided by four (F
RA4/OSC2/CLKOUT pin. F
purposes or to synchronize other logic.
The PIC16F630/676 differentiates between various
kinds of RESET:
a)Power-on Reset (POR)
b)WDT Reset during normal operation
c)WDT Reset during SLEEP
d)MCLR
e)MCLR Reset during SLEEP
f)Brown-out Detect (BOD)
Some registers are not affected in any RESET
condition; their status is unknown on POR and
Reset during normal operation
They are not affected by a WDT wake-up, since this is
viewed as the resump tio n of no rm al op era tion . TO and
PD
bits are set or c leared di fferent ly in di fferent RESET
situations as indicated in Table 9-4. These bits are
used in software to determine the na ture of the RESET.
See Table 9-7 for a full description of RESET states of
all registers.
A simplified block di agram of the On-Chip Reset Circu it
is shown in Figure 9-4.
The MCLR
Reset path has a noise filter to detect and
ignore small pulses. See Table 12-4 in Electrical
Specifications Section for pulse width specification.
unchanged in any other RESET. M ost other registers
are reset to a “RESET state” on:
• Power-on R eset
•MCLR
Reset
•WDT Reset
• WDT Reset during SLEEP
• Brown-out Detect (BOD)
FIGURE 9-4:SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
External
Reset
MCLR/
PP pin
V
WDT
Module
VDD Rise
Detect
DD
V
OSC1/
CLKIN
pin
Note1: This is a separate oscillator from the INTOSC/EC oscillator.
It should be noted that a WDT Reset does not drive
pin low.
MCLR
The behavior of the ESD protection on the MCLR
pin
has been altered from previous devices of this family.
Volt a ges app lied to the pin th at exce ed it s spe cific ation
can result in both MCLR
Resets and excessiv e c urre nt
beyond the de v ic e sp e ci fic at i on du ri ng th e ESD ev e nt .
For this reason, Microchip recommends that the MCLR
pin no longer be tied directly to VDD. The use of an RC
network, as shown in Figure 9-5, is suggested.
An internal MCLR
option is enabled by setting the
MCLRE bit in the configuration word. When enabled,
MCLR is internally tied to VDD. No internal pull-up
option is available for the MCLR
pin.
FIGURE 9-5:RECOMMENDED MCLR
CIRCUIT
VDD
R1
1 kΩ (or greater)
C1
μf
0.1
(optional, not critical)
PIC16F630/676
MCLR
For additional information, refer to Application Note
AN607 “Power-up Trouble Shooting”.
9.3.3POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 72 ms (nominal)
time-out on power-up only, from POR or Brown-out
Detect. The Power-up Timer operates on an internal
RC oscillator. The chip is kept in RESET as long as
PWRT is active. The PWRT delay allows the V
DD to
rise to an acceptable level . A configuration bit, PWRTE
can disable (if set) or enable (if cleared or
programmed) the Power-up Timer. The Power-up
Timer should always be enabled when Brown-out
Detect is enabled.
The Power-up Time delay will vary from chip to chip
and due to:
DD variation
•V
• Temperature variation
• Process variation.
See DC parameters for details (Section 12.0).
9.3.4OSCILLATOR START-UP TIMER
(OST)
The Oscillator Start-up Timer (OST) provides a 1024
oscillator cycle (from OSC1 input) delay after the
PWRT delay is over. This ensures that the crystal
oscillator or resonator has started and stabilized.
The OST time-out is invoked only for XT, LP and HS
modes and only on Power-on Reset or wake-up from
SLEEP.
9.3.2POWER-ON RESET (POR)
The on-chip POR circuit holds the chip in RESET until
DD has reached a high enough level for proper
V
operation. To take advant age of the POR, simply tie th e
MCLR pin through a resistor to VDD. This will eliminate
external RC components usually needed to create
Power-on Reset. A maximum rise time for VDD is
required. See Electrical Specifications for details (see
Section 12.0). If the BOD is en abled, the maxi mum rise
time specificatio n does not apply . The B OD circuitry will
keep the device in RESET unt il V
Section 9.3.5).
Note:The POR circuit does not produc e an inter-
nal RESET when V
When the device starts normal operation (exits the
RESET condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in RESET until the operating
conditions are met.
The PIC16F630/676 me mbers hav e on-chip Brow n-out
Detect circuitry. A configuration bit, BODEN, can
disable (if clear/programmed) or enable (if set) the
Brown-out Detect circuitry. If V
greater than parameter (T
DD falls below VBOD for
BOD) in Table 12-4 (see
Section 12.0), the Brown-out situation will reset the
device. Th is will oc cur regar dless of V DD slew-rate. A
RESET is not guaranteed to occur if V
V
BOD for less than parameter (TBOD).
DD falls below
FIGURE 9-6:BROWN-OUT SITUATIONS
DD
V
Internal
RESET
DD
V
Internal
RESET
<72 ms
On any RESET (Power-on, Brown-out Detect,
Watchdog, etc.), the chip will remain in RESET until
DD rises above BVDD (see Figure 9-6). The Power-up
V
Timer w ill no w be invok ed, if enabl ed, and wil l kee p the
chip in RESET an additional 72 ms.
Note:A Brown-out Detect does not enable the
Power-up Timer if the PWRTE
bit in the
configuration word is set.
DD drops below BVDD while the Pow er-up Timer is
If V
running, the chip will go back into a Brown-out Detect
and the Power-up Tim er will be re-initialized. Onc e VDD
rises above BVDD, the Power-up Timer will execute a
72 ms RESET.
VBOD
(1)
72 ms
VBOD
(1)
72 ms
V
DD
Internal
RESET
Note 1: 72 ms delay only if PWRTE bit is programmed to ‘0’.
9.3.6TIME-OUT SEQUENCE
On power-up, the time-ou t sequenc e is as foll ows: firs t,
PWRT time-out is invoked after POR has expired.
Then, OST is activated. The total time-out will vary
based on oscillator configuration and PWRTE
status. For example, in EC mode with PWRTE
erased (PWRT disabled), there will be no time-out at
all. Figure 9-7, Figure 9-8 and Figure 9-9 depict timeout sequences.
Since the time-outs occur from the PO R pulse, if MCLR
is kept low long e nough , the ti me- outs will e xpire. Then
bringing MCL R
high will begin execution immediately
(see Figure 9-8). This is useful for testing purposes or
to synchronize more than one PIC16F630/676 device
operating in parallel.
Table 9-6 shows the RESET conditions for some
special registers, while Table 9-7 shows the RESET
conditions for all the registers.
bit
bit
VBOD
(1)
72 ms
9.3.7POWER CONTROL (PCON) STATUS
REGISTER
The power CONTROL/STATUS register, PCON
(address 8Eh) has two bits.
Bit0 is BOD (Brown-out). BOD is unknown on Poweron Reset. It must then be set by the user and checked
on subsequent RESETS to see if BOD
that a brown-out has occurred. The BOD
a don’t care and is not necessarily predictable if the
brown-out circuit is dis abl ed (by se tti ng BO DE N
in the Configuration word).
Bit1 is POR (Power-on Reset). It is a ‘0’ on Power-on
Reset and unaffec ted oth erwise. T he user m ust write a
‘1’ to this bit following a Power-on Reset. On a
subsequent RESET, if POR
is ‘0’, it will in dicate t hat a
Power-on Reset must have occurred (i.e., V
have gone too low).
Legend:u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: Other (non Power-up) Resets include MCLR
normal operation.
——— ———PORBOD---- --0x ---- --uq
Reset, Brown-out Detect and Watchdog Timer Reset during
TABLE 9-6:INITIALIZATION CONDITION FOR SPECIAL REGISTERS
Condition
Power-on Reset000h0001 1xxx---- --0x
Reset during normal operation000h000u uuuu---- --uu
Legend:u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.
Note 1: When the wake-up is due to an interrupt and global enable bit GIE is set, the PC is loaded with the
Legend:u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If V
DD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 9-6 for RESET value for specific condition.
5: If wake-up was due to data EEPROM write completing, bit 7 = 1; A/D conversion completing, bit 6 = 1;
Comparator input changing, bit 3 = 1; or Timer1 rolling over, bit 0 = 1. All other interrupts generating a
wake-up will cause these bits to = u.
6: If RESET was due to brown-out, then bit 0 = 0. All other RESETS will cause bit 0 = u.
• EEPROM Data Write Interrupt
The Interrupt Control regis ter (INTCON) and Periphera l
Interrupt register (PIR) record individual interrupt
requests in flag bits. The INTCON register also has
individual and global interrupt enable bits.
A global interrupt enable bit, GIE (INTCON<7>) enables
(if set) all unmasked interrupts, or disable s (if cleared) all
interrupts. Individual interrupts can be disabled through
their corresponding enable bits in INTCON register and
PIE register. GIE is cleared on RE SET.
The return from interrupt instruction,
interrupt routine, as well as sets the GIE bit, which reenables unmasked interrupts.
The following interrupt flags are contained in the
INTCON register:
• INT pin interrupt
• PORTA change interrupt
• TMR0 overflow interrupt
The peripheral interrupt flags are contained in the
special register PIR1. The corresponding interrupt
enable bit is contained in Special Register PIE1.
The following interrupt flags are contained in the PIR
register:
• EEPROM data write interrupt
• A/D interrupt
• Comparator interrupt
• Timer1 overflow interrupt
When an interrupt is serviced:
• The GIE is cleared to disable any further interrupt
• The return address is pushed onto the stack
• The PC is loaded with 0004h
Once in the Interrupt Service Routine, the source(s) of
the interrupt can be determined by polling the interrupt
flag bits. The in terrupt flag bit(s ) must be cleared in software before re-enabling interrupts to avoid RA2/INT
recursive interrupts.
For external interrupt events, such as the INT pin, or
PORTA change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (see
Figure 9-11). The latency is the same for one or twocycle instructions. Once in the Interrupt Service
Routine, the source(s) of the interrupt can be
determined by polling the interrupt flag bits. The
RETFIE, exits
interrupt flag bit(s) must be cleared in software before
re-enabling interrupts to avoid multiple interrupt
requests.
Note 1: Individual interrupt flag bits are set,
regardless of the status of their
corresponding mask bit or the GIE bit.
2: When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The interrupts which were
ignored are still pending to be serviced
when the GIE bit is set again.
External interrupt on RA2/INT pin is edge-triggered;
either rising if INTEDG bit (OPTION<6>) is set, or
falling, if INTEDG bit is clear. When a valid edge
appears on the RA2/INT pin, the INTF bit
(INTCON<1>) is set. This interrupt can be disabled by
clearing t he INTE contro l bit (I NTCON< 4>). Th e INTF
bit must be cleared in software in the Interrupt Service
Routine before re-enabling this interrupt. The RA2/INT
interrupt can wake-up th e proc es so r f rom SL EEP i f th e
INTE bit was set prior to going into SLEEP. The status
of the GIE bit decides whether or not the processor
branches to the in terrupt vector foll owing wake-up. Se e
Section 9.7 for details on SLEEP and Figure 9-13 for
timing of wake-up from SLEEP through RA2/INT
interrupt.
Note:The ANSEL (91h) and CMCON (19h)
registers must be initializ ed to c onfigure a n
analog channel as a digital input. Pins
configured as analog inputs will read ‘0’.
The ANSEL register is defined for the
PIC16F676.
9.4.2TMR0 INTERRUPT
An overflow (FFh → 00h) in the TMR0 register will
set the T0IF (INTCON<2>) bit. The interrupt can
be enabled/disabled by setting/clearing T0IE
(INTCON<5>) bit. For operation of the Timer0 module,
see Secti on 4.0.
9.4.3PORTA INTERRUPT
An input change on PORTA change sets the RAIF
(INTCON<0>) bit. The interrupt can be enabled/
disabled by setting/clearing the RAIE (INTCON<3>)
bit. Plus individual pins can be configured through the
IOCA register.
Note:If a change on the I/O pin should occur
when the read operatio n is be ing ex ecute d
(start of the Q2 cycle), then the RAIF interrupt flag may not get set.
9.4.4COMPARATOR INTERRUPT
See Section 6.9 for des cription of c omparator interrupt.
9.4.5A/D CONVERTER INTERRUPT
After a conversion is com ple te, t he ADIF fla g (PIR<6 >)
is set. The interrupt ca n be enabl ed/dis abled by se tting
or clearing ADIE (PIE<6>).
See Section 7.0 for operation of the A/D converter
interrupt.
FIGURE 9-11:INT PIN INTERRUPT TIMING
Q2Q1Q3 Q4Q2Q1Q3 Q4Q2Q1Q3 Q4Q2Q1Q3 Q4Q2Q1Q3 Q4
OSC1
CLKOUT
INT pin
INTF Flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Note 1: INTF flag is sampled here (every Q1).
3
Inst (PC-1)
2: Asynchronous interrupt latency = 3-4 T
is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in RC Oscillator mode.
4: For minimum width of INT pulse, refer to AC specs.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
AddressNameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2 Bit 1Bit 0
0Bh, 8Bh INTCONGIE PEIET0IEINTERAIET0IFINTFRAIF0000 0000 0000 000u
0ChPIR1
8ChPIE1EEIEADIE
Legend: x = unknown, u = unchanged, - = unimplemented read as '0', q = value depends upon condition.
Shaded cells are not used by the Interrupt module.
EEIFADIF——CMIF——TMR1IF00-- 0--0 00-- 0--0
——CMIE——TMR1IE00-- 0--0 00-- 0--0
Val ue on
POR, BOD
Value on all
other
RESETS
9.5Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (e.g., W register and
STATUS register). This must be implemented in
software.
Example 9-2 stores and restores the STATUS and W
registers. The user regi ster, W_TEMP , m ust be defined
in both banks and must be defined at the same offset
from the bank base address (i.e., W_TEMP is defined
at 0x20 in Bank 0 and it must also be defined at 0xA0
in Bank 1). The user regis ter, STATUS_TEMP, must be
defined in Bank 0. The Example 9-2:
• Stores the W regis ter
• Stores the STATUS register in Bank 0
• Executes the ISR code
• Restores the STATUS (and bank select bit
register)
• Restores the W register
EXAMPLE 9-2:SA VING THE ST A TUS AND
W REGISTERS IN RAM
MOVWF W_TEMP;copy W to temp register,
SWAPF STATUS,W;swap status to be saved into W
BCFSTATUS,RP0;change to bank 0 regardless of
MOVWF STATUS_TEMP ;save status to bank 0 register
:
:(ISR)
:
SWAPF STATUS_TEMP,W;swap STATUS_TEMP register into
MOVWF STATUS;move W into STATUS register
SWAPF W_TEMP,F;swap W_TEMP
SWAPF W_TEMP,W;swap W_TEMP into W
could be in either bank
current bank
W, sets bank to original state
9.6Watchdog Timer (WDT)
The Watchdog Timer is a free running, on-chip RC
oscillator, which requires no external components. This
RC oscillator is sep arate from the ex ternal RC oscillat or
of the CLKIN pin. That means that the WDT will run,
even if the clock on the OSC1 and OSC2 pins of the
device has been stoppe d (for ex ample , by ex ecuti on of
SLEEP instruction). During normal operation, a WDT
a
time-out generates a device RESET. If the device is in
SLEEP mode, a WDT time-out causes the device to
wake-up and continue wit h normal operation. Th e WDT
can be permanently disabled by programming the
configuration bit WDTE as clear (Section 9.1).
9.6.1WDT PERIOD
The WDT has a nominal tim e-out period of 18 m s, (with
no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (see
DC specs). If longer time-out periods are desired, a
prescaler with a division ratio of up to 1:128 can be
assigned to the WDT under software control by writing
to the OPTION register. Thus, time-out periods up to
2.3 seconds can be realized.
CLRWDT and SLEEP instructions clear the WDT
The
and the prescaler, if assigned to the WDT, and prevent
it from timing out and generating a device RESET.
bit in the ST ATUS register will be cleared upo n
The TO
a Watchdog Timer time-out.
9.6.2WDT PROGRAMMING
CONSIDERATIONS
It should also be taken in account that under worst case
conditions (i.e., V
WDT prescaler) it may take several seconds before a
WDT time-out occurs.
• WDT will be cleared but keeps running
bit in the STATUS register is cleared
•PD
•TO
bit is set
• Oscillator driver is turned off
• I/O ports maintain the status they had before
SLEEP was executed (driving high, low, or
hi-impedance).
For lowest current consumption in this mode, all I/O
pins should be either at V
circuitry drawing current from the I/O pin and the
comparators and CV
that are hi-impedance inputs should be pulled high or
low externally to avoid switching currents caused by
floating inputs. The T0CKI input should also be at V
or VSS for lowest current consumption. The
contribution from on-c hip pull-ups on PORTA should be
considered.
The MCLR
pin must be at a logic high level (VIHMC).
Note:It should be no ted that a RESET generate d
by a WDT time-out does not drive MCLR
pin low.
DD, or VSS, with no external
REF should be disabled. I/O pins
DD
The first event will cause a device RESET. The two
latter events are considered a continuation of program
execution. The TO
and PD bits in the STATUS register
can be used to determine the cause of device RESET.
The PD
SLEEP is invoked. TO
bit, which is set on power -u p, is cl ear ed wh en
bit is cleare d if WDT Wake-up
occurred.
When the
SLEEP instruction is being executed, the
next instruction (PC + 1) is pre-fetched. For the device
to wake-up through an inte rrupt eve nt, the co rresponding interrupt enabl e bit mu st be set (enabled) . W ake-up
is regardless of the state of the GIE bi t. If the GI E bit is
clear (disabled), the device continues execution at the
instruction after the
SLEEP instruction. If the GIE bit is
set (enabled), the device executes the instruction after
the SLEEP instruction, then branches to the interrupt
address (0004h). In cases where the execution of the
instructio n f oll o w ing
should have an
SLEEP is not desirable, the user
NOP after the SLEEP instruction.
Note:If the global interrupts are disabled (GIE is
cleared), but any interrupt source has both
its interrupt en abl e b it a nd the corresponding interrupt flag bits set, the device will
immediately wake-up from SLEEP. The
SLEEP instruction is completely exec ute d.
The WDT is cleared when the device wakes up from
SLEEP, regardless of the source of wake-up.
9.7.1WAKE-UP FROM SLEEP
The device can wake-up from SLEEP through one of
the following events:
1.External RESET input on MCLR pin
2.Watchdog Tim er Wake-up (if WDT was enabled)
3.Interrupt from RA2/INT pin, PORTA change, or
a peripheral interrupt.
FIGURE 9-13:WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
OSC1
(4)
CLKOUT
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Note1: XT, HS or LP Oscillator mode assumed.
2: T
3: GIE = '1' assumed. In this case after wake-up, the processor jumps to the interrupt routine. If GIE = '0', execution will continue in-line.
4: CLKOUT is not available in XT, HS, LP or EC Osc modes, but shown here for timing reference.
PCPC+1PC+2
Inst(PC) = SLEEP
Inst(PC - 1)
OST = 1024TOSC (drawing not to scale). Approximately 1 μs delay for RC Oscillator mode. See Section 12 for wake-up from SLEEP
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out for verification purposes.
Note:The entire data EEPROM and FLASH
program memory will be erased when the
code protection is turned off. The INTOSC
calibration data is also erased. See
PIC16F630/676 Programming Specification for more information.
9.9ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are
readable and writable during Program/Verify. Only the
Least Significant 7 bits of the ID locations are used.
9.10In-Circuit Serial Programming
The PIC16F630/676 microcontrollers can be serially
programmed while in t he en d app licati on c ircuit. This is
simply done with two lines fo r clock and data, an d three
other lines for:
• power
• ground
• programming voltage
This allows customers to manufacture boards with
unprogrammed devices and then program the microcontroller just before shipping the product. This also
allows the most recent firmware or a custom firmware
to be programmed.
The device i s placed into a Progra m/Ver ify mode by
holding the RA0 and RA1 pins low, while raising the
(VPP) pin from VIL to VIHH (see Program ming
MCLR
Specification). RA0 becomes the programming data
and RA1 becomes the programming clock. Both RA0
and RA1 are Schmitt Trigger inputs in this mode.
After RESET, to place the device into Programming/
Verify mode, the program counter (PC) is at location
00h. A 6-bit command is then supplied to the device.
Depending on the command, 14 bits of program data
are then supplied to or from the device, depending on
whether the command was a load or a read. For
complete details of s eri al p r ogr am mi ng, p lea se refe r to
the PIC16F630/676 Programming Specification.
A typical In-Circuit Serial Programming connection is
shown in Figure 9-14.
FIGURE 9-14:TY PICAL IN-CIRCUIT
SERIAL PROGRAMMING
CONNECTION
To No rma l
External
Connector
Signals
+5V
0V
V
PP
CLK
Data I/O
Connections
To No rma l
Connections
PIC16F630/676
DD
V
VSS
RA3/MCLR/VPP
RA1
RA0
DD
V
9.1 1In-Circuit Debugger
Since in-cir cuit debugging requi res the loss of clock,
data and MCLR
an 14-pin device is not practical. A special 20-pin
PIC16F676-ICD device is used with MPLAB ICD 2 to
provide separate clock, data and MCLR
all normally available pins to the user.
This special ICD device is mounted on the top of the
header and its signals are routed to the MPLAB ICD 2
connector. On the bottom of the header is an 14-pin
socket that plugs into the user’s target via the 14-pin
stand-off connector.
When the ICD
held low, the In-Circuit Debugger functionality is
enabled. This function allows simple debugging
functions when used with MPLAB ICD 2. When the
microcontroller has this feature enabled, some of the
resources are not avai lable for genera l use. Table 9-10
shows which features are consumed by the
background debugger:
TABLE 9-10:DEBUGGER RESOURCES
Program MemoryAddress 0h must be NOP
For more information, see 14-Pin MPLAB ICD 2
Header Information Sheet (DS51299) available on
Microchip’s website (www.microchip.com).
The PIC16F630/676 ins truction set is highly ort hogonal
and is comprised of three basic categories:
• Byte-oriented operations
• Bit-oriented operations
• Literal and control operations
Each PIC16 instruction is a 14-bit word divided into an
opcode, which specifies the instruction type, and one
or more operands, which further specify the operation
of the instruction. The formats for each of the
categories is presented in Figure 10-1, while the
various opcode fields are summarized in Table 10-1.
Table 10-2 lists the instructions recognized by the
MPASM
instruction is also avail able in the PIC
erence Manual (DS33023).
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The destination des ignator specifies w here the result of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W re gister . I f ‘d’ is one, the resul t is placed
in the file register specified in the instruction.
For bit-oriented instru ctions, ‘b’ represents a bit field
designator, which selects the bit affected by the
operation, while ‘f’ repre sen t s t he address of the file in
which the bit is located.
For literal and control operations, ‘k’ represents an
8-bit or 11-bit constant, or literal value
One instruction cyc le consist s of four oscillator peri ods;
for an oscilla tor frequency o f 4 MHz , this gives a normal
instruction execution time of 1 μs. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
changed as a result of an in struction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies
a hexadecimal digit.
TM
assembler. A complete description of each
®
Mid-Range Ref-
Note:To maintain upward compatibility with
future products, do not use
the OPTION
and TRIS instructions .
For example, a CLRF PORTA instruction will read
PORTA, clear all the data bits, then write the result back
to PORTA. This example would have the unintended
result of clearing the condition that set the RAIF flag.
TABLE 10-1:OPCODE FIELD
DESCRIPTIONS
FieldDescription
f
Register file address (0x00 to 0x7F)
W
Working register (accumulator)
b
Bit address within an 8-bit file register
k
Literal field, constant data or label
x
Don't care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
d
Destination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC
Program Counter
TO
Time-out bit
PD
Power-down bit
FIGURE 10-1:GENERAL FORMAT FOR
INSTRUCTIONS
Byte-oriented file regi s ter operations
13 8 7 6 0
OPCODE d f (FILE #)
d = 0 for destination W
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
General
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
10.1READ-MODIFY-WRITE
OPERATIONS
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
operation. The register is read, the data is modified,
CALL and GOTO instructions only
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
and the result is stored according to either the instruction, or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
Note 1: When an I/O register is modified as a function of itself (e.g., MOVF
f, d
Add W and f
f, d
AND W with f
f
Clear f
-
Clear W
f, d
Complement f
f, d
Decrement f
f, d
Decrement f, Skip if 0
f, d
Increment f
f, d
Increment f, Skip if 0
f, d
Inclusive OR W with f
f, d
Move f
f
Move W to f
-
No Operation
f, d
Rotate Left f through Carry
f, d
Rotate Right f through Carry
f, d
Subtract W from f
f, d
Swap nibbles in f
f, d
Exclusive OR W with f
f, b
Bit Clear f
f, b
Bit Set f
f, b
Bit Test f, Skip if Clear
f, b
Bit Test f, Skip if Set
k
Add literal and W
k
AND literal with W
k
Call subroutine
-
Clear Watchdog Timer
k
Go to address
k
Inclusive OR literal with W
k
Move literal to W
-
Return from interrupt
k
Return with literal in W
-
Return from Subroutine
-
Go into Standby mode
k
Subtract W from literal
Exclusive OR literal with W
k
on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external
device, the data will be written back with a '0'.
2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if
assigned to the Timer0 module.
3: If Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is
executed as a NOP.
DescriptionCycles
BYTE-ORIENTED FILE REGISTER OPERATIONS
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
BIT-ORIENTED FILE REGISTER OPERATIONS
1
1
1 (2)
1 (2)
LITERAL AND CONTROL OPERATIONS
1
1
2
1
2
1
1
2
2
2
1
1
1
PORTA, 1), the value used will be that value present
The PIC® microcontrollers are supported with a full
range of hardware and software development tools:
• Integrated Development Environment
- MPLAB
• Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
-MPLINK
MPLIB
- MPLAB ASM30 Assembler/Linker/Library
• Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debugger
- MPLAB ICD 2
• Device Programmers
- PICSTART
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
• Low-Cost Demonstration and Development
Boards and Evaluation Kits
®
IDE Software
TM
Object Linker/
TM
Object Librarian
®
Plus Development Programmer
11.1MPLAB Integrated Development
Environment Software
The MPLAB IDE so ftware brin gs an ease of sof tware
development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Visual device initializer for easy register
initialization
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
• Edit your s ource files (either assembl y or C)
• One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
• Debug using:
- Source files (assembly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
The MPASM Assembler is a full-featured, universal
macro assembler for all PIC MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Ob ject Linker, Intel
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
®
standard HEX
11. 3MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC 18 and PIC24 families of microcontrollers and the dsPIC3 0 a nd ds PIC33 fam il y o f d igi tal signal controllers. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use not found with other compilers.
For easy source level debuggi ng, the compil ers provide
symbol information that is opt imized to the MPLAB IDE
debugger.
11. 4MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librar ian manag es the cre ation an d
modification of library files of precompiled code. When
a routine from a library is called from a source file , only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
11.5MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linke d with other relocat able object fi les and
archives t o cr eat e an e xec utabl e fi le. Notab le f eat ures
of the assembler include:
• Support for the entire dsPIC30F instruction set
• Support for fixed-point an d floating-point data
• Command line interface
• Rich directive set
• Flexible macro language
• MPLAB IDE compatibility
11. 6MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
developmen t in a PC-hosted env ironment by simu lating the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripheral s and inte rnal registe rs.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PIC
microcontrollers. Software control of the MPLAB ICE
2000 In-Circuit Emulator is advanced by the MPLAB
Integrated Development Environment, which allows
editing, building, downloading and source debugging
from a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitoring features. Interc hangeabl e proces sor modul es allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PIC microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft
chosen to best make these features available in a
simple, unified application.
®
Windows® 32-bit operating system were
11. 8MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC® and MCU devices. It debugs and
programs PIC
the easy-to-use, powerful graphical user interface of the
MPLAB Integrated Development Environment (IDE),
included with each kit.
The MPLAB REAL ICE probe is connected to the de sign
engineer’s PC using a high-speed USB 2.0 interface and
is connected to the target with either a connector
compatible with the popular MPLAB ICD 2 system
(RJ11) or with the new high speed, noise tolerant, lowvoltage differential signal (LVDS) interconnection
(CAT5).
MPLAB REAL ICE is field upgradeable through future
firmware downloads in MPLAB IDE. In upcoming
releases of MPLAB IDE, new devices will be supported,
and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE
offers significant advantages ov er competitive emulators
including low-cost, full-speed emulation, real-time
variable watches, trace analysis, complex breakpoint s, a
ruggedized probe interface and long (up to three meters)
interconnection cables.
®
and dsPIC® Flash microcontrollers with
11.9MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PIC
MCUs and can be used to develop for these and other
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
the in-circuit debugging capability built into the Flash
devices. This feature, along with Microchip’s In-Circuit
Serial Programming
effective, in-circuit Flash debugging from the graphical
user interface of the MPLAB Integrated Development
Environment. This enables a designer to develop and
debug source code by s etting bre akpoi nts , singl e ste pping and watching variables, and CPU status and
peripheral registers. Running at full speed enables
testing hardware and applications in real time. MPLAB
ICD 2 also serves as a development programmer for
selected PIC devices.
TM
(ICSPTM) protocol, offers cost-
11.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus an d error m essag es and a m odular, detachable socket assembly to support various
package type s. The ICSP™ cable as sembly is incl uded
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can rea d, verify an d program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-spe ed comm unicatio ns and
optimized algorithms for quick programming of large
memory devices and in corporates an SD/MMC card f or
file storage and secure data applications.
The PICSTART Plus Develo pment Program mer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Integrated Devel opmen t Envi ronme nt sof tware makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PIC devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76X, may be sup ported with a n adapter socke t.
The PICSTART Plus Development Programmer is CE
compliant.
11. 12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer and selected Flash device debugger with
an easy-to-use interface for programming many of
Microchip’s b aseline, mid-ra nge and PIC18F fa milies of
Flash memory microcon trollers. The PICk it 2 S tarter Kit
includes a prototyping development board, twelve
sequential lessons, software and HI-TECH’s PICC™
Lite C compiler, and is designed to hel p get up to s peed
quickly using PIC
everything needed to program, evaluate and develop
applications using Microchip’s powerful, mid-range
Flash memory family of microcontrollers.
®
microcont rollers. The kit pr ovides
11.13 Demonstration, Development and
Evaluation Boards
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows qui ck applicatio n development o n fully functional system s. Most b oards in clude proto typing area s for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards suppo rt a variety of fea tures, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, K
®
, PowerSmart® battery management, SEEVAL
IrDA
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Check the Microchip web page (www.microchip.com)
and the latest “Product Selector Guide” (D S00148) for
the complete list of demonstration, development and
evaluation kits.
Ambient temperature under bias...........................................................................................................-40 to +125°C
Storage temperature........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin....................................................................................................25 mA
Maximum output current sourced by any I/O pin..............................................................................................25 mA
Maximum current sunk by PORTA and PORTC (combined)..........................................................................200 mA
Maximum current sourced PORTA and PORTC (combined)..........................................................................200 mA
DD with respect to VSS ..................................................................................................... -0.3 to +6.5V
with respect to Vss ..................................................................................................-0.3 to +13.5V
SS ...........................................................................-0.3V to (VDD + 0.3V)
SS pin.....................................................................................................................300 mA
DD pin........................................................................................................................250 mA
IK (VI < 0 or VI > VDD)...............................................................................................................± 20 mA
OK (Vo < 0 or Vo >VDD).........................................................................................................± 20 mA
Note 1: Power dissipation is ca lcu lated as follows: P
DIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL).
†NOTICE: Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100
pulling this pin direct ly to V
Ω should be used w hen ap plying a "low" level to the MCLR pin, rather than
Standard Opera ting Conditi ons (unle ss otherw is e stated)
DC CHARACTERISTICS
Param
No.
SymCharacteristicMin Typ† Max UnitsConditions
DDSupply Voltage
V
D001
D001A
D001B
D001C
D001D
D002V
D003V
DRRAM Data Retention
Voltage
PORVDD Start Voltage to
(1)
ensure internal Power-on
Reset signal
D004SVDDVDD Rise Rate to ensure
internal Power-on Reset
signal
D005VBOD—2.1— V
* These parameters are characterized but not tested.
† Data in "Typ" co lum n is at 5.0V, 25°C unless otherwis e st a t ed . Thes e p a r ameters are for design guidance
only and are not tested.
Note 1: This is the limit to which V
DD can be lowered in SLEEP mode without losing RAM data.
Operating temperature -40°C ≤ TA≤ +85°C for industrial
A≤ +125°C for extended
OSC < = 4 MHz:
Z < FOSC < = 10 MHz
2.0
2.2
2.5
3.0
4.5
—
—
—
—
—
5.5
5.5
5.5
5.5
5.5
-40°C ≤ T
F
PIC16F630/676 with A/D off
V
PIC16F676 with A/D on, 0°C to +125°C
V
PIC16F676 with A/D on, -40°C to +125°C
V
4 MH
V
V
1.5*——VDevice in SLEEP mode
—VSS—VSee section on Power-on Reset for details
0.05*——V/ms See section on Power-on Reset for details
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C ≤ T
PIC16F630/676
A ≤ +85°C for industrial
Param
No.
Device CharacteristicsMinTyp†MaxUnits
D010Supply Current (I
DDNote
V
DD)—916μA2.0FOSC = 32 kHz
—1828μA3.0
LP Oscillator Mode
Conditions
—3554μA5.0
D011—110150μA2.0F
—190280μA3.0
OSC = 1 MHz
XT Oscillator Mode
—330450μA5.0
D012—220280μA2.0F
—370650μA3.0
OSC = 4 MHz
XT Oscillator Mode
—0.61.4mA5.0
D013—70110μA2.0F
—140250μA3.0
OSC = 1 MHz
EC Oscillator Mode
—260390μA5.0
D014—180250μA2.0F
—320470μA3.0
OSC = 4 MHz
EC Oscillator Mode
—580850μA5.0
D015—340450μA2.0F
—500780μA3.0
OSC = 4 MHz
INTOSC Mode
—0.81.1mA5.0
D016—180250μA2.0F
—320450μA3.0
OSC = 4 MHz
EXTRC Mode
—580800μA5.0
D017—2.12.95mA4.5F
—2.43.0mA5.0
OSC = 20 MHz
HS Oscillator Mode
† Data in ‘Ty p’ co lum n is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test conditions for all IDD measurement s in Active Operation m ode are: OSC1 = external sq uare wave,
from rail to rail; all I/O pins tri-stated, pulled to V
DD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and sw itc hi ng rate , o sc ill ato r ty pe , i nternal code execution pattern, and temperature also have
an impact on the current consumption.
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C ≤ T
A ≤ +85°C for industrial
Param
No.
Device CharacteristicsMinTyp†MaxUnits
D020Power-down Base Current
(IPD)
DDNote
V
—0.99700nA2.0WDT, BOD, Comparators, V
—1.2770nA3.0
and T1OSC disabled
Conditions
—2.9995nA5.0
D021—0.31.5μA2.0WDT Current
(1)
—1.83.5μA3.0
—8.417μA5.0
D022—5870μA3.0BOD Current
(1)
—109130μA5.0
D023—3.36.5μA2.0Comparator Current
—6.18.5μA3.0
—11.516 μA5.0
D024—5870μA2.0CVREF Current
(1)
—85100μA3.0
—138160μA5.0
D025—4.06.5μA2.0T1 OSC Current
(1)
—4.67.0μA3.0
—6.010.5μA5.0
D026—1.2755nA3.0A/D Current
(1)
—0.00221.0μA5.0
† Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base I
DD or IPD and the additional current consumed when this
peripheral is enabled. The peripheral Δ current can be determined by subtracting the base I
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C ≤ T
PIC16F630/676
A ≤ +125°C for extended
Param
No.
Device CharacteristicsMinTyp†MaxUnits
D010ESupply Current (I
DDNote
V
DD)—916μA2.0FOSC = 32 kHz
—1828 μA3.0
LP Oscillator Mode
Conditions
—3554 μA5.0
D011 E—110150μA2.0F
—190280μA3.0
OSC = 1 MHz
XT Oscillator Mode
—330450μA5.0
D012E—220280μA2.0F
—370650μA3.0
OSC = 4 MHz
XT Oscillator Mode
—0.61.4mA5.0
D013E—70110μA2.0F
—140250μA3.0
OSC = 1 MHz
EC Oscillator Mode
—260390μA5.0
D014E—180250μA2.0F
—320470μA3.0
OSC = 4 MHz
EC Oscillator Mode
—580850μA5.0
D015E—340450μA2.0F
—500780μA3.0
OSC = 4 MHz
INTOSC Mode
—0.81.1mA5.0
D016E—180250μA2.0F
—320450μA3.0
OSC = 4 MHz
EXTRC Mode
—580800μA5.0
D017E—2.12.95mA4.5F
—2.43.0mA5.0
OSC = 20 MHz
HS Oscillator Mode
† Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test conditions for all IDD measurement s in Active Operation m ode are: OSC1 = external sq uare wave,
from rail to rail; all I/O pins tri-stated, pulled to V
DD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and sw itc hi ng rate , o sc ill ato r ty pe , i nternal code execution pattern, and temperature also have
an impact on the current consumption.
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Device Characteristi csMinTyp†MaxUnits
D020E Power-down Base Current
(IPD)
DDNote
V
—0.000993.5μA2.0WDT, BOD, Comparators, V
—0.00124.0μA3.0
Conditions
and T1OSC disabled
—0.00298.0μA5.0
D021E—0.36.0μA2.0WDT Current
(1)
—1.89.0μA3.0
—8.420μA5.0
D022E—5870μA3.0BOD Current
(1)
—109130μA5.0
D023E—3.310μA2.0Comparator Cur rent
—6.113μA3.0
—11.524μA5.0
D024E—5870μA2.0CVREF Current
(1)
—85100μA3.0
—138165μA5.0
D025E—4.010μA2.0T1 OSC Current
(1)
—4.612μA3.0
—6.020μA5.0
D026E—0.00126.0μA3.0A/D Current
(1)
—0.00228.5μA5.0
† Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base I
DD or IPD and the additional current consumed when this
peripheral is enabled. The peripheral Δ current can be determined by subtracting the base I
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
* These parameters are characterized but not tested.
† Data in ‘Typ’ column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note1: Instruction cycle period (T
CY) equals four times the input oscillator time-base period. All speci fie d va lu es a r e
based on characteriza tion da t a for th at p articular oscil lator ty pe un der st anda rd opera ting c onditi ons with the
device executing co de . Excee ding t hese s peci fied li mit s ma y resu lt in an u nst able o scil lator o peratio n an d/or
higher than expected current consumption. All devices are tested to operate at ‘min’ values with an external
clock applied to OSC1 pin. Whe n an ex tern al cloc k in put is use d, the ‘max ’ cy cle tim e li mi t is ‘D C’ (no cloc k)
for all devices.
* These parameters are characterized but not tested.
† Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Freq
Tolerance
±13.964.004.04MHz V
MinTyp†MaxUnitsConditions
DD = 3.5V, 25°C
±23.924.004.08MHz 2.5V ≤ VDD≤ 5.5V
A≤ +85°C
0°C ≤ T
±53.804.004.20MHz 2.0V ≤ VDD≤ 5.5V
-40°C ≤ T
-40°C ≤ T
——6 8μsV
DD = 2.0V, -40°C to +85°C
A≤ +85°C (IND)
A≤ +125°C (EXT)
——4 6μsVDD = 3.0V, -40°C to +85°C
——3 5μsVDD = 5.0V, -40°C to +85°C
11TosH2ckH OSC1↑ to CLOUT↑ —75200ns(Note 1)
12TckRCLKOUT rise time —35100ns(Note 1)
13TckFCLKOUT fall time —35100ns(Note 1)
14TckL2ioVCLKOUT↓ to Port out valid ——20ns(Note 1)
15TioV2ckH Port in valid before CLKOUT↑ T
16TckH2ioIPort in hold after CLKOUT↑ 0 ——ns(Note 1)
17TosH2ioV OSC1↑ (Q1 cycle) to Port out valid—50150 *ns
18TosH2ioIOSC1↑ (Q2 cycle) to Port input
19TioV2osH Port inpu t valid to OSC1↑
20TioRPort output rise time —1040ns
21TioFPort output fall time—1040n s
22TinpINT pin high or low time25——ns
23TrbpPORTA change INT high or low
* These parameters are characterized but not tested.
† Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4xT
* These parameters are characterized but not tested.
† Data in ‘Typ’ column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only