Datasheet PIC16F1826, PIC16F1827, PIC16LF1826 Datasheet

PIC16(L)F1826/27
Data Sheet
18/20/28-Pin Flash Microcontrollers
with nanoWatt XLP Technology
2011 Microchip Technology Inc. DS41391D
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, K
EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
PIC
logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-124-7
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
DS41391D-page 2 2011 Microchip Technology Inc.
PIC16(L)F1826/27
18/20/28-Pin Flash Microcontrollers wit h na noWatt XLP Techno logy

High-Performance RISC CPU:

• C Compiler Optimized Architecture
• 256 bytes Data EEPROM
• Up to 8 Kbytes Linear Program Memory Addressing
• Up to 384 bytes Linear Data Memory Addressing
• Interrupt Capability with Automatic Context Saving
• 16-Level Deep Hardware Stack with Optional Overflow/Underflow Reset
• Direct, Indirect and Relative Addressing modes:
- Two full 16-bit File Select Registers (FSRs)
- FSRs can read program and data memory

Flexible Oscillator Struc ture:

• Precision 32 MHz Internal Oscillator Block:
- Factory calibrated to ± 1%, typical
- Software selectable frequencies range of
31 kHz to 32 MHz
• 31 kHz Low-Power Internal Oscillator
• Four Crystal modes up to 32 MHz
• Three External Clock modes up to 32 MHz
• 4X Phase-Lock Loop (PLL)
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if peripheral clock
stops
• Two-Speed Oscillator Start-up
• Reference Clock Module:
- Programmable clock output frequency and
duty-cycle

Special Microcontroller Features:

• 1.8V-5.5V Operation – PIC16F1826/27
• 1.8V-3.6V Operation – PIC16LF1826/27
• Self-Programmable under Software Control
• Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
• Programmable Brown-out Reset (BOR)
• Extended Watchdog Timer (WDT):
- Programmable period from 1ms to 268s
• Programmable Code Protection
• In-Circuit Serial Programming™ (ICSP™) via two pins
• In-Circuit Debug (ICD) via two pins
• Enhance Low-Voltage Programming
• Power-Saving Sleep mode

Extreme Low-Power Management PIC16LF1826/27 with nanoWatt XLP:

• Operating Current: 75 A @ 1 MHz, 1.8V, typical
• Sleep mode: 30 nA
• Watchdog Timer: 500 nA
• Timer1 Oscillator: 600 nA @ 32 kHz

Analog Features:

• Analog-to-Digital Converter (ADC) Module:
- 10-bit resolution, 12 channels
- Auto acquisition capability
- Conversion available during Sleep
• Analog Comparator Module:
- Two rail-to-rail analog comparators
- Power mode control
- Software controllable hysteresis
• Voltage Reference Module:
- Fixed Voltage Reference (FVR) with 1.024V,
2.048V and 4.096V output levels
- 5-bit rail-to-rail resistive DAC with positive and negative reference selection

Peripheral Highlight s:

• 15 I/O Pins and 1 Input Only Pin:
- High current sink/source 25 mA/25 mA
- Programmable weak pull-ups
- Programmable interrupt-on- change pins
• Timer0: 8-Bit Timer/Counter with 8-Bit Prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Gate Input mode
- Dedicated, low-power 32 kHz oscillator driver
• Up to three Timer2-types: 8-Bit Timer/Counter with 8-Bit Period Register, Prescaler and Postscaler
• Up to two Capture, Compare, PWM (CCP) Modules
• Up to two Enhanced CCP (ECCP) Modules:
- Software selectable time bases
- Auto-shutdown and auto-restart
- PWM steering
• Up to two Master Synchronous Serial Port (MSSP) with SPI and I
- 7-bit address masking
- SMBus/PMBus
• Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) Module
• mTouch™ Sensing Oscillator Module:
- Up to 12 input channels
• Data Signal Modulator Module:
- Selectable modulator and carrier sources
•SR Latch:
- Multiple Set/Reset input options
- Emulates 555 Timer applications
2
CTM with:
TM
compatibility
2011 Microchip Technology Inc. DS41391D-page 3
PIC16(L)F1826/27
PDIP, SOIC
PIC16(L)F1826/27
1
2
3
4
18
17
16
15
5
6
7
14
13
12
RA2
RA3
RA4
RA5/MCLR
/VPP
VSS
RB0
RB1
RA1
RA0
RA7
RA6
V
DD
RB7
RB6
8
9
11
10
RB2
RB3
RB5
RB4
SSOP
PIC16(L)F1826/27
1
2
3
4
20
19
18
17
5
7
8
16
14
13
RA2
RA3
RA4
RA5/MCLR
/VPP
VSS
RB0
RB1
RA1
RA0
RA7
RA6
V
DD
RB7
RB6
9
10
12
11
RB2
RB3
RB5
RB4
6
15
VSS
VDD

PIC16(L)F1826/27 Family Types

Program
Memory
Device
Words
Data
Memory
SRAM
(bytes)
(1)
I/O’s
(bytes)
10-bit ADC (ch)
CapSense (ch)
Comparators
Timers (8/16-bit)
Data EEPROM
MSSP
EUSART
ECCP (Full-Bridge)
CCP
SR Latch
ECCP (Half-Bridge)
PIC16LF1826 2K 256 256 16 12 12 2 2/1 1 1 1 Yes PIC16F1826 2K 256 256 16 12 12 2 2/1 1 1 1 Yes PIC16LF1827 4K 38425616121224/112112Yes PIC16F1827 4K 384 256 16 12 12 2 4/1 1 2 1 1 2 Yes
Note 1: One pin is input only.
Pin Diagram – 18-Pin PDIP, SOIC
(PIC16(L)F1826/27)
Pin Diagram – 20-Pin SSOP (PIC16(L)F1826/27)
DS41391D-page 4 2011 Microchip Technology Inc.

Pin Diagram – 28-Pin QFN/UQFN (PIC16(L)F1826/27)

PIC16(L)F1826/27
RA2
RA3
RA4
RA5/MCLR/VPP
VSS
RB0
RB1
RA1
RA0
RA7 RA6 V
DD
RB7 RB6
RB2
RB3
RB5
RB4
VSS
VDD
NC
NC
282726
25
24
23
1
2 3
4 5
6 7
8
9
10
11
22
21 20 19 18 17 16 15
14
13
12
NC
NC
NC
NC
NC
NC
QFN/UQFN
PIC16(L)F1826/27
2011 Microchip Technology Inc. DS41391D-page 5
DS41391D-page 6 2011 Microchip Technology Inc.
TABLE 1: 18/20/28-PIN SUMMARY (PIC16(L)F1826/27)
18-Pin PDIP/SOIC
I/O
28-Pin QFN/UQFN
20-Pin SSOP
ANSEL
A/D
Reference
Cap Sense
Comparator
SR Latch
Timers
CCP
EUSART
MSSP
Interrupt
Modulator
Pull-up
Basic
PIC16(L)F1826/27
RA0 17 19 23 Y AN0 CPS0 C12IN0- SDO2
RA1 18 20 24 Y AN1 CPS1 C12IN1- SS2
RA2 1 1 26 Y AN2 VREF-
DACOUT
RA3 2 2 27 Y AN3 VREF+ CPS3 C12IN3-
CPS2 C12IN2-
C12IN+
N
SRQ CCP3
(2)
N
(2)
(2)
N
N
C1IN+
C1OUT
P2B
CCP2
P2A
P1A
(1)
(1,2)
(1) (1,2)
(1,2)
(1)
(2)
N
SDO1
(1)
(1)
Y
N OSC2
(3)
MCLR, VPP
CLKOUT
N OSC1
(1)
INT
IOC
Y
RA4 3 3 28 Y AN4 CPS4 C2OUT SRNQ T0CKI CCP4
RA5 4 4 1 N SS1
RA6 15 17 20 N P1D
RA7 16 18 21 N P1C
RB0 6 7 7 N SRI T1G CCP1
FLT0
RB1 7 8 8 Y AN11 CPS11 RX
RB2 8 9 9 Y AN10 CPS10 RX
RB3 9 10 10 Y AN9 CPS9 CCP1
P1A
(1,4)
(1,4)
RB4 10 11 12 Y AN8 CPS8 SCL1
DT
TX CK
(1,4) (1,4)
(1)
,DT
(1,4) (1,4)
SDA1
SDI1
(1)
SDA2
SDI2
(1,4)
SDO1
IOC Y
(2)
IOC MDMIN Y
(2)
IOC MDOUT Y
IOC MDCIN2 Y
SCK1
RB5 11 12 13 Y AN7 CPS7 P1B TX
RB6 12 13 15 Y AN5 CPS5 T1CKI
T1OSI
RB7 13 14 16 Y AN6 CPS6 T1OSO P1D
P1C
CCP2
P2A
P2B
(1,4) (1,2,4)
(1,2,4)
(1,4)
(1,2,4)
CK
(1) (1)
IOC Y ICSPCLK/
IOC MDCIN1 Y ICSPDAT/
SCL2 SCK2 SS1
(1,4)
(2)
IOC Y
(2)
ICDCLK
ICDDAT
VDD 14 15,16 17,19 VDD
Vss55,63,5———— — —— — — — ——— VSS
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
2: Functions are only available on the PIC16(L)F1827. 3: Weak pull-up always enabled when MCLR 4: Default function location.
is enabled, otherwise the pull-up is under user control.
CLKR
CLKIN
PIC16(L)F1826/27

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 9
2.0 Enhanced Mid-Range CPU........................................................................................................................................................ 15
3.0 Memory Organization................................................................................................................................................................. 17
4.0 Device Configuration.................................................................................................................................................................. 43
5.0 Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 51
6.0 Reference Clock Module............................................................................................................................................................ 69
7.0 Resets ........................................................................................................................................................................................ 73
8.0 Interrupts .................................................................................................................................................................................... 81
9.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 95
10.0 Watchdog Timer (WDT) ............................................................................................................................................................. 97
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 101
12.0 I/O Ports ................................................................................................................................................................................... 117
13.0 Interrupt-on-Change ................................................................................................................................................................. 131
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 135
15.0 Temperature Indicator.............................................................................................................................................................. 137
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 139
17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 153
18.0 SR Latch................................................................................................................................................................................... 157
19.0 Comparator Module.................................................................................................................................................................. 163
20.0 Timer0 Module ......................................................................................................................................................................... 173
21.0 Timer1 Module ......................................................................................................................................................................... 177
22.0 Timer2/4/6 Modules.................................................................................................................................................................. 191
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 193
24.0 Capture/Compare/PWM (ECCP1, ECCP2, ECCP3, CCP4) Modules ..................................................................................... 203
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 231
26.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 285
27.0 Capacitive Sensing Module ...................................................................................................................................................... 315
28.0 In-Circuit Serial Programming
29.0 Instruction Set Summary.......................................................................................................................................................... 325
30.0 Electrical Specifications............................................................................................................................................................ 339
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 371
32.0 Development Support............................................................................................................................................................... 379
33.0 Packaging Information.............................................................................................................................................................. 383
Appendix A: Revision History............................................................................................................................................................. 393
Appendix B: Device Differences ........................................................................................................................................................ 393
Index .................................................................................................................................................................................................. 395
The Microchip Web Site..................................................................................................................................................................... 403
Customer Change Notification Service .............................................................................................................................................. 403
Customer Support .............................................................................................................................................................................. 403
Reader Response .............................................................................................................................................................................. 404
Product Identification System ............................................................................................................................................................ 405
(ICSP) ................................................................................................................................ 321
2011 Microchip Technology Inc. DS41391D-page 7
PIC16(L)F1826/27
TO OUR VALUED CUSTOMERS
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If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback.

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DS41391D-page 8 2011 Microchip Technology Inc.

1.0 DEVICE OVERVIEW

The PIC16(L)F1826/27 are described within this data sheet. They are available in 18/20/28-pin packages.
Figure 1-1 shows a block diagram of the
PIC16(L)F1826/27 devices. Table 1-2 shows the pinout descriptions.
Reference Ta bl e 1 -1 for peripherals available per device.
TABLE 1-1: DEVICE PERIPHERAL
SUMMARY
Peripheral
PIC16(L)F1826/27
PIC16F/LF1826
ADC ●● Capacitive Sensing Module ●● Digital-to-Analog Converter (DAC) ●● Digital Signal Modulator (DSM) ●● EUSART ●● Fixed Voltage Reference (FVR) ●● Reference Clock Module ●● SR Latch ●● Capture/Compare/PWM Modules
ECCP1 ●● ECCP2
CCP3 CCP4
Comparators
C1 ●● C2 ●●
Master Synchronous Serial Ports
MSSP1 ●● MSSP2
Timers
Timer0 ●● Timer1 ●● Timer2 ●● Timer4 Timer6
PIC16(L)F1827
2011 Microchip Technology Inc. DS41391D-page 9
PIC16(L)F1826/27
PORTA
EUSART
Comparators
MSSPx
Timer2-
Timer1Timer0
ECCPx
ADC
10-Bit
CCPx
PORTB
SR
Latch
Note 1: See applicable chapters for more information on peripherals.
2: See Ta bl e 1 -1 for peripherals available on specific devices.
CPU
Program
Flash Memory
EEPROM
RAM
OSC1/CLKIN
OSC2/CLKOUT
Timing
Generation
INTRC
Oscillator
MCLR
(Figure 2-1)
Modulator
CapSense
Clock
CLKR
Reference
Type s
DAC
FVR

FIGURE 1-1: PIC16(L)F1826/27 BLOCK DIAGRAM

DS41391D-page 10 2011 Microchip Technology Inc.

T ABLE 1-2: PIC16(L)F1826/27 PINOUT DESCRIPTION

Input
Name Function
Type
Output
Type
PIC16(L)F1826/27
Description
RA0/AN0/CPS0/C12IN0-/
(2)
SDO2
RA0 TTL CMOS General purpose I/O.
AN0 AN A/D Channel 0 input.
CPS0 AN Capacitive sensing input 0.
C12IN0- AN Comparator C1 or C2 negative input.
SDO2 CMOS SPI data output.
(2)
RA1/AN1/CPS1/C12IN1-/SS2
RA1 TTL CMOS General purpose I/O.
AN1 AN A/D Channel 1 input.
CPS1 AN Capacitive sensing input 1.
C12IN1- AN Comparator C1 or C2 negative input.
ST Slave Select input 2.
RA2/AN2/CPS2/C12IN2-/ C12IN+/V
REF-/DACOUT
SS2
RA2 TTL CMOS General purpose I/O.
AN2 AN A/D Channel 2 input.
CPS2 AN Capacitive sensing input 2.
C12IN2- AN Comparator C1 or C2 negative input.
C12IN+ AN Comparator C1 or C2 positive input.
REF- AN A/D Negative Voltage Reference input.
V
DACOUT AN Voltage Reference output.
RA3/AN3/CPS3/C12IN3-/C1IN+/
REF+/C1OUT/CCP3
V
(2)
/SRQ
RA3 TTL CMOS General purpose I/O.
AN3 AN A/D Channel 3 input.
CPS3 AN Capacitive sensing input 3.
C12IN3- AN Comparator C1 or C2 negative input.
C1IN+ AN Comparator C1 positive input.
REF+ AN A/D Voltage Reference input.
V
C1OUT CMOS Comparator C1 output.
CCP3 ST CMOS Capture/Compare/PWM3.
SRQ CMOS SR latch non-inverting output.
RA4/AN4/CPS4/C2OUT/T0CKI/
(2)
/SRNQ
CCP4
RA4 TTL CMOS General purpose I/O.
AN4 AN A/D Channel 4 input.
CPS4 AN Capacitive sensing input 4.
C2OUT CMOS Comparator C2 output.
T0CKI ST Timer0 clock input.
CCP4 ST CMOS Capture/Compare/PWM4.
SRNQ CMOS SR latch inverting output.
RA5/MCLR
/VPP/SS1
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I
(1,2)
RA5 TTL CMOS General purpose I/O.
MCLR
V
PP HV Programming voltage.
SS1
ST Master Clear with internal pull-up.
ST Slave Select input 1.
2
C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
2: Functions are only available on the PIC16(L)F1827. 3: Default function location.
2011 Microchip Technology Inc. DS41391D-page 11
PIC16(L)F1826/27
TABLE 1-2: PIC16(L)F1826/27 PINOUT DESCRIPTION (CONTINUED)
Input
Name Function
RA6/OSC2/CLKOUT/CLKR/
(1)
P1D
/P2B
(1,2)
/SDO1
(1)
RA6 TTL CMOS General purpose I/O.
OSC2 XTAL Crystal/Resonator (LP, XT, HS modes).
CLKOUT CMOS F
CLKR CMOS Clock Reference Output.
P1D CMOS PWM output.
P2B CMOS PWM output.
SDO1 CMOS SPI data output 1.
RA7/OSC1/CLKIN/P1C CCP2
(1,2)
/P2A
(1,2)
/
RA7 TTL CMOS General purpose I/O.
OSC1 XTAL Crystal/Resonator (LP, XT, HS modes).
(1)
CLKIN CMOS External clock input (EC mode).
P1C CMOS PWM output.
CCP2 ST CMOS Capture/Compare/PWM2.
P2A CMOS PWM output.
RB0/T1G/CCP1
/INT/
RB0 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
(1)
(1)
/P1A
SRI/FLT0
T1G ST Timer1 Gate input.
CCP1 ST CMOS Capture/Compare/PWM1.
P1A CMOS PWM output.
INT ST External interrupt.
SRI ST SR latch input.
FLT0 ST ECCP Auto-Shutdown Fault input.
RB1/AN11/CPS11/RX
(1,3)
DT
/SDA1/SDI1
/
RB1 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
(1,3)
AN11 AN A/D Channel 11 input.
CPS11 AN Capacitive sensing input 11.
RX ST USART asynchronous input.
DT ST CMOS USART synchronous data.
SDA1 I
SDI1 CMOS SPI data input 1.
RB2/AN10/CPS10/MDMIN/
(1,3)
(1,3)
(1)
TX SDA2
/CK
(2)
/SDI2
/RX
(2)
/DT
/SDO1
(1)
(1,3)
/
RB2 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
AN10 AN A/D Channel 10 input.
CPS10 AN Capacitive sensing input 10.
MDMIN CMOS Modulator source input.
TX CMOS USART asynchronous transmit.
CK ST CMOS USART synchronous clock.
RX ST USART asynchronous input.
DT ST CMOS USART synchronous data.
SDA2 I
SDI2 ST SPI data input 2.
SDO1 CMOS SPI data output 1.
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I HV = High Voltage XTAL = Crystal levels
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
2: Functions are only available on the PIC16(L)F1827. 3: Default function location.
Output
Type
Type
OSC/4 output.
Individually enabled pull-up.
Individually enabled pull-up.
2
C™ OD I2C™ data input/output 1.
Individually enabled pull-up.
2
C™ OD I2C™ data input/output 2.
Description
2
C™ = Schmitt Trigger input with I2C
DS41391D-page 12 2011 Microchip Technology Inc.
PIC16(L)F1826/27
TABLE 1-2: PIC16(L)F1826/27 PINOUT DESCRIPTION (CONTINUED)
Input
Name Function
RB3/AN9/CPS9/MDOUT/ CCP1
(1,3)
/P1A
(1,3)
RB3 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
AN9 AN A/D Channel 9 input.
CPS9 AN Capacitive sensing input 9.
MDOUT CMOS Modulator output.
CCP1 ST CMOS Capture/Compare/PWM1.
P1A CMOS PWM output.
RB4/AN8/CPS8/SCL1/SCK1/
RB4 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
MDCIN2
AN8 AN A/D Channel 8 input.
CPS8 AN Capacitive sensing input 8.
SCL1 I
SCK1 ST CMOS SPI clock 1.
MDCIN2 ST Modulator Carrier Input 2.
(1)
(1)
/CK
/
RB5/AN7/CPS7/P1B/TX SCL2
(2)
/SCK2
(2)
/SS1
(1,3)
RB5 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
AN7 AN A/D Channel 7 input.
CPS7 AN Capacitive sensing input 7.
P1B CMOS PWM output.
TX CMOS USART asynchronous transmit.
CK ST CMOS USART synchronous clock.
SCL2 I
SCK2 ST CMOS SPI clock 2.
SS1
RB6/AN5/CPS5/T1CKI/T1OSI/ P1C
(1,3)
/CCP2
(1,2,3)
/P2A
(1,2,3)
ICSPCLK
RB6 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
/
AN5 AN A/D Channel 5 input.
CPS5 AN Capacitive sensing input 5.
T1CKI ST Timer1 clock input.
T1OSO XTAL XTAL Timer1 oscillator connection.
P1C CMOS PWM output.
CCP2 ST CMOS Capture/Compare/PWM2.
P2A CMOS PWM output.
ICSPCLK ST Serial Programming Clock.
RB7/AN6/CPS6/T1OSO/ P1D
(1,3)
/P2B
(1,2,3)
/MDCIN1/
ICSPDAT
RB7 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
AN6 AN A/D Channel 6 input.
CPS6 AN Capacitive sensing input 6.
T1OSO XTAL XTAL Timer1 oscillator connection.
P1D CMOS PWM output.
P2B CMOS PWM output.
MDCIN1 ST Modulator Carrier Input 1.
ICSPDAT ST CMOS ICSP™ Data I/O.
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I HV = High Voltage XTAL = Crystal levels
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
2: Functions are only available on the PIC16(L)F1827. 3: Default function location.
Output
Type
Type
Individually enabled pull-up.
Individually enabled pull-up.
2
C™ OD I2C™ clock 1.
Individually enabled pull-up.
2
C™ OD I2C™ clock 2.
ST Slave Select input 1.
Individually enabled pull-up.
Individually enabled pull-up.
Description
2
C™ = Schmitt Trigger input with I2C
2011 Microchip Technology Inc. DS41391D-page 13
PIC16(L)F1826/27
TABLE 1-2: PIC16(L)F1826/27 PINOUT DESCRIPTION (CONTINUED)
Input
Name Function
V
DD VDD Power Positive supply.
V
SS VSS Power Ground reference.
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I HV = High Voltage XTAL = Crystal levels
2: Functions are only available on the PIC16(L)F1827. 3: Default function location.
Type
Output
Type
Description
2
C™ = Schmitt Trigger input with I2C
DS41391D-page 14 2011 Microchip Technology Inc.

2.0 ENHANCED MID-RANGE CPU

This family of devices contain an enhanced mid-range 8-bit CPU core. The CPU has 49 instructions. Interrupt capability includes automatic context saving. The hardware stack is 16 levels deep and has Overflow and Underflow Reset capability. Direct, Indirect, and Relative addressing modes are available. Two File Select Registers (FSRs) provide the ability to read program and data memory.
• Automatic Interrupt Context Saving
• 16-level Stack with Overflow and Underflow
• File Select Registers
• Instruction Set

2.1 Automatic Interrupt Context Saving

During interrupts, certain registers are automatically saved in shadow registers and restored when returning from the interrupt. This saves stack space and user code. See Section 8.5 “Automatic Context Saving”, for more information.
PIC16(L)F1826/27

2.2 16-level Stack with Overflow and Underflow

These devices have an external stack memory 15 bits wide and 16 words deep. A Stack Overflow or Under­flow will set the appropriate bit (STKOVF or STKUNF) in the PCON register, and if enabled will cause a soft­ware Reset. See section Section 3.4 “Stack” for more details.

2.3 File Select Registers

There are two 16-bit File Select Registers (FSR). FSRs can access all file registers and program memory, which allows one Data Pointer for all memory. When an FSR points to program memory, there is one additional instruction cycle in instructions using INDF to allow the data to be fetched. General purpose memory can now also be addressed linearly, providing the ability to access contiguous data larger than 80 bytes. There are also new instructions to support the FSRs. See
Section 3.4 “Stack”for more details.

2.4 Instruction Set

There are 49 instructions for the enhanced mid-range CPU to support the features of the CPU. See
Section 29.0 “Instruction Set Summary” for more
details.
2011 Microchip Technology Inc. DS41391D-page 15
PIC16(L)F1826/27
Data Bus
8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
Direct Addr
7
12
Addr MUX
FSR reg
STATUS reg
MUX
ALU
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
V
DD
8
8
Brown-out
Reset
12
3
VSS
Internal
Oscillator
Block
Configuration
Data Bus
8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
Direct Addr
7
Addr MUX
FSR reg
STATUS reg
MUX
ALU
W reg
Instruction
Decode &
Control
Timing
Generation
V
DD
8
8
3
VSS
Internal
Oscillator
Block
Configuration
15
Data Bus
8
14
Program
Bus
Instruction Reg
Program Counter
16-Level Stack
(15-bit)
Direct Addr
7
RAM Addr
Addr MUX
Indirect
Addr
FSR0 Reg
STATUS Reg
MUX
ALU
Instruction
Decode and
Control
Timing
Generation
V
DD
8
8
3
VSS
Internal
Oscillator
Block
Configuration
Flash
Program
Memory
RAM
FSR regFSR reg
FSR1 Reg
15
15
MUX
15
Program Memory
Read (PMR)
12
FSR regFSR reg
BSR Reg
5

FIGURE 2-1: CORE BLOCK DIAGRAM

DS41391D-page 16 2011 Microchip Technology Inc.
PIC16(L)F1826/27

3.0 MEMORY ORGANIZATION

There are three types of memory in PIC16(L)F1826/27: Data Memory, Program Memory and Data EEPROM Memory
• Program Memory
• Data Memory
• Data EEPROM memory
(1)
.
- Core Registers
- Special Function Registers
- General Purpose RAM
- Common RAM
- Device Memory Maps
- Special Function Registers Summary
Note 1: The Data EEPROM Memory and the
method to access Flash memory through the EECON registers is described in
Section 11.0 “Data EEPROM and Flash Program Memory Control”.
(1)
The following features are associated with access and control of program memory and data memory:
• PCL and PCLATH
•Stack
• Indirect Addressing

3.1 Program Memory Organization

The enhanced mid-range core has a 15-bit program counter capable of addressing a 32K x 14 program memory space. Table 3-1 shows the memory sizes implemented for the PIC16(L)F1826/27 family. Accessing a location above these boundaries will cause a wrap-around within the implemented memory space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figures 3-1 and 3-2).

TABLE 3-1: DEVICE SIZES AND ADDRESSES

Device Program Memory Space (Words) Last Program Memory Address
PIC16(L)F1826 2,048 07FFh PIC16(L)F1827 4,096 0FFFh
2011 Microchip Technology Inc. DS41391D-page 17
PIC16(L)F1826/27
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
Stack Level 1
0005h
On-chip
Program
Memory
Page 0
07FFh
Wraps to Page 0
Wraps to Page 0
Wraps to Page 0
0800h
CALL, CALLW RETURN, RETLW
Interrupt, RETFIE
Rollover to Page 0
Rollover to Page 0
7FFFh
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
CALL, CALLW
RETURN, RETLW
Stack Level 1
0005h
On-chip
Program
Memory
Page 0
07FFh
Rollover to Page 0
0800h
0FFFh 1000h
7FFFh
Page 1
Rollover to Page 1
Interrupt, RETFIE
FIGURE 3-1: PROGRAM MEMORY MAP
AND STACK FOR PIC16(L)F1826
FIGURE 3-2: PROGRAM MEMORY MAP
AND STACK FOR PIC16(L)F1827
DS41391D-page 18 2011 Microchip Technology Inc.
3.1.1 READING PROGRAM MEMORY AS
constants
BRW ;Add Index in W to
;program counter to
;select data RETLW DATA0 ;Index0 data RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3
my_function
;… LOTS OF CODE… MOVLW DATA_INDEX call constants ;… THE CONSTANT IS IN W
DATA
There are two methods of accessing constants in pro­gram memory. The first method is to use tables of RETLW instructions. The second method is to set an FSR to point to the program memory.
3.1.1.1 RETLW Instruction
The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example 3-1.
EXAMPLE 3-1: RETLW INSTRUCTION
PIC16(L)F1826/27
The BRW instruction makes this type of table very sim­ple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available so the older table read method must be used.
2011 Microchip Technology Inc. DS41391D-page 19
PIC16(L)F1826/27
constants
RETLW DATA0 ;Index0 data RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3
my_function
;… LOTS OF CODE… MOVLW LOW constants MOVWF FSR1L MOVLW HIGH constants MOVWF FSR1H MOVIW 0[FSR1]
;THE PROGRAM MEMORY IS IN W
Addresses BANKx
x00h or x80h INDF0 x01h or x81h INDF1 x02h or x82h PCL x03h or x83h STATUS x04h or x84h FSR0L x05h or x85h FSR0H x06h or x86h FSR1L x07h or x87h FSR1H x08h or x88h BSR
x09h or x89h WREG x0Ah or x8Ah PCLATH x0Bh or x8Bh INTCON
3.1.1.2 Indirect Read with FSR
The program memory can be accessed as data by set­ting bit 7 of the FSRxH register and reading the match­ing INDFx register. The MOVIW instruction will place the lower 8 bits of the addressed word in the W register. Writes to the program memory cannot be performed via the INDF registers. Instructions that access the pro­gram memory via the FSR require one extra instruction cycle to complete. Example 3-2 demonstrates access­ing the program memory via an FSR.
The HIGH directive will set bit<7> if a label points to a location in program memory.
EXAMPLE 3-2: ACCESSING PROGRAM
MEMORY VIA FSR

3.2.1 CORE REGISTERS

The core registers contain the registers that directly affect the basic operation. The core registers occupy the first 12 addresses of every data memory bank (addresses x00h/x08h through x0Bh/x8Bh). These registers are listed below in Ta bl e 3 -2. For for detailed information, see Tab le 3 -5 .
TABLE 3-2: CORE REGISTERS

3.2 Data Memory Organization

The data memory is partitioned in 32 memory banks with 128 bytes in a bank. Each bank consists of (Figure 3-3):
• 12 core registers
• 20 Special Function Registers (SFR)
• Up to 80 bytes of General Purpose RAM (GPR)
• 16 bytes of common RAM
The active bank is selected by writing the bank number into the Bank Select Register (BSR). Unimplemented memory will read as ‘0’. All data memory can be accessed either directly (via instructions that use the file registers) or indirectly via the two File Select Registers (FSR). See Section 3.5 “Indirect
Addressing” for more information.
Data Memory uses a 12-bit address. The upper 7-bit of the address define the Bank address and the lower 5-bits select the registers/RAM in that bank.
DS41391D-page 20 2011 Microchip Technology Inc.
PIC16(L)F1826/27
3.2.1.1 STATUS Register
The STATUS register, shown in Register 3-1, contains:
• the arithmetic status of the ALU
• the Reset status
The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended.
and PD bits are not
For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits (Refer to Section 29.0
“Instruction Set Summary”).
Note 1: The C and DC bits operate as Borrow
and Digit Borrow out bits, respectively, in subtraction.
REGISTER 3-1: STATUS: STATUS REGISTER
U-0 U-0 U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
TO
PD ZDC
(1)
(1)
C
bit 7-5 Unimplemented: Read as ‘0’ bit 4 TO
bit 3 PD
bit 2 Z: Zero bit
bit 1 DC: Digit Carry/Digit Borrow
bit 0 C: Carry/Borrow
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register.
: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred
: Power-down bit
1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction
1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero
bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result
(1)
bit
(ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred
(1)
(1)
2011 Microchip Technology Inc. DS41391D-page 21
PIC16(L)F1826/27
0Bh 0Ch
1Fh
20h
6Fh
70h
7Fh
00h
Common RAM
(16 bytes)
General Purpose RAM
(80 bytes maximum)
Core Registers
(12 bytes)
Special Function Registers
(20 bytes maximum)
Memory Region
7-bit Bank Offset

3.2.2 SPECIAL FUNCTION REGISTER

The Special Function Registers are registers used by the application to control the desired operation of peripheral functions in the device. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). The registers associated with the operation of the peripherals are described in the appropriate peripheral chapter of this data sheet.

3.2.3 GENERAL PURPOSE RAM

There are up to 80 bytes of GPR in each data memory bank. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch through x1Fh/x9Fh).
3.2.3.1 Linear Access to GPR
The general purpose RAM can be accessed in a non-banked method via the FSRs. This can simplify access to large memory structures. See Section 3 .5.2
“Linear Data Memory” for more information.

3.2.4 COMMON RAM

There are 16 bytes of common RAM accessible from all banks.
FIGURE 3-3: BANKED MEMORY
PARTITIONING
DS41391D-page 22 2011 Microchip Technology Inc.

3.2.5 DEVICE MEMORY MAPS

The memory maps for the device family are as shown in Table 3-3 and Tab le 3 -4 .
2011 Microchip Technology Inc. DS41391D-page 23
TABLE 3-3: PIC16(L)F1826/27 MEMORY MAP
BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7
000h
Core Registers
(Ta bl e 3 - 2)
00Bh 08Bh 10Bh 18Bh 20Bh 28Bh 30Bh 38Bh 00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch WPUA 28Ch 00Dh PORTB 08Dh TRISB 10Dh LATB 18Dh ANSELB 20Dh WPUB 28Dh 00Eh 00Fh 010h
—08Eh—10Eh—18Eh—20Eh—28Eh—30Eh—38Eh— —08Fh—10Fh—18Fh—20Fh—28Fh—30Fh—38Fh—
—090h—110h—190h—210h—290h— 310h 390h — 011h PIR1 091h PIE1 111h CM1CON0 191h EEADRL 211h SSP1BUF 291h CCPR1L 311h CCPR3L 012h PIR2 092h PIE2 112h CM1CON1 192h EEADRH 212h SSP1ADD 292h CCPR1H 312h CCPR3H 013h PIR3 014h PIR4
015h TMR0 095h OPTION 115h CMOUT 195h EECON1 215h SSP1CON 295h CCP1AS 315h 016h 017h
018h 019h 01Ah 01Bh 01Ch 01Dh
TMR1L 096h PCON 116h BORCON 196h EECON2 216h SSP1CON2 296h PSTR1CON 316h TMR1H 097h WDTCON 117h FVRCON 197h T1CON 098h OSCTUNE 118h DACCON0 198h
T1GCON 099h OSCCON 119h DACCON1 199h RCREG 219h
TMR2 09Ah OSCSTAT 11Ah SRCON0 19Ah TXREG 21Ah
PR2 09Bh ADRESL 11Bh SRCON1 19Bh SPBRGL 21Bh
T2CON 09Ch ADRESH 11Ch
09Dh ADCON0 11Dh APFCON0 19Dh RCSTA 21Dh 01Eh CPSCON0 09Eh ADCON1 11Eh APFCON1 19Eh TXSTA 21Eh SSP2CON2 01Fh CPSCON1 09Fh
020h
General
Purpose
06Fh 0EFh 16Fh 1EFh 26Fh 2EFh 070h 0F0h
Register 96 Bytes
07Fh 0FFh 17Fh 1FFh 27Fh 2FFh 37Fh 3FFh
Legend: = Unimplemented data memory locations, read as ‘0
Note 1: Available only on PIC16(L)F1827.
(1)
(1)
080h
Core Registers
(Ta bl e 3 - 2)
093h PIE3 094h PIE4
0A0h
General Purpose Register
80 Bytes
Accesses
70h – 7Fh
100h
Core Registers
(Table 3-2)
(1)
113h CM2CON0 193h EEDATL 213h SSP1MASK 293h CCP1CON 313h CCP3CON
(1)
114h CM2CON1 194h EEDATH 214h SSP1STAT 294h PWM1CON 314h 394h IOCBP
180h
Core Registers
(Table 3-2)
200h
Core Registers
(Table 3-2)
217h SSP1CON3 297h 317h 397h — —218h— 298h CCPR2L
SSP2BUF SSP2ADD
SSP2MASK
19Ch SPBRGH 21Ch SSP2STAT
SSP2CON
—11Fh— 19Fh BAUDCON 21Fh SSP2CON3
120h
General Purpose Register
80 Bytes
1A0h
General Purpose Register
80 Bytes
220h General
(1)
Purpose Register
48 Bytes
Unimplemented
Read as ‘0’
170h
Accesses
70h – 7Fh
1F0h
Accesses
70h – 7Fh
270h
Accesses
70h – 7Fh
280h
Core Registers
(Table 3-2)
300h
Core Registers
(Table 3-2)
30Ch 38Ch — — 30Dh 38Dh
(1)
(1)
(1)
395h IOCBN — 396h IOCBF
(1)
318h CCPR4L
Read as ‘0’
(1)
319h CCPR4H
(1)
31Ah CCP4CON
(1)
31Bh —39Bh—
(1)
31Ch 39Ch MDCON
(1)
31Dh
(1)
31Eh
320h
Unimplemented
(1)
299h CCPR2H
(1)
29Ah CCP2CON
(1)
29Bh PWM2CON
(1)
29Ch CCP2AS
(1)
29Dh PSTR2CON
(1)
29Eh CCPTMRS
(1)
29Fh —31Fh—39Fh 2A0h
(1)
Unimplemented
(1)
(1)
(1)
— —
Read as ‘0’
36Fh 3EFh
2F0h
Accesses
70h – 7Fh
370h
Accesses
70h – 7Fh
380h
Core Registers
(Table 3-2)
391h — 392h — 393h
398h — 399h — 39Ah CLKRCON
39Dh 39Eh
3A0h
MDSRC MDCARL MDCARH
Unimplemented
Read as ‘0’
3F0h
Accesses
70h – 7Fh
PIC16(L)F1826/27
DS41391D-page 24 2011 Microchip Technology Inc.
Legend: = Unimplemented data memory locations, read as ‘0
BANK 8 BANK 9 BANK 10 BANK 11 BANK 12 BANK 13 BANK 14 BANK 15
400h
40Bh
Core Registers
(Ta bl e 3 -2 )
480h
48Bh
Core Registers
(Ta bl e 3 -2 )
500h
50Bh
Core Registers
(Ta bl e 3 -2 )
580h
58Bh
Core Registers
(Ta bl e 3 -2 )
600h
60Bh
Core Registers
(Ta bl e 3 -2 )
680h
68Bh
Core Registers
(Ta bl e 3 -2 )
700h
70Bh
Core Registers
(Ta bl e 3 -2 )
780h
78Bh
Core Registers
(Ta bl e 3 -2 )
40Ch
48Ch
50Ch
58Ch
60Ch
68Ch
70Ch
78Ch
40Dh
48Dh
50Dh
58Dh
60Dh
68Dh
70Dh
78Dh
40Eh
48Eh
50Eh
58Eh
60Eh
68Eh
70Eh
78Eh
40Fh
48Fh
50Fh
58Fh
60Fh
68Fh
70Fh
78Fh
410h
490h
510h
590h
610h
690h
710h
790h
411h
491h
511h
591h
611h
691h
711h
791h
412h
492h
512h
592h
612h
692h
712h
792h
413h
493h
513h
593h
613h
693h
713h
793h
414h
494h
514h
594h
614h
694h
714h
794h
415h
TMR4
(1)
495h
515h
595h
615h
695h
715h
795h
416h
PR4
(1)
496h
516h
596h
616h
696h
716h
796h
417h
T4CON
(1)
497h
517h
597h
617h
697h
717h
797h
418h
498h
518h
598h
618h
698h
718h
798h
419h
499h
519h
599h
619h
699h
719h
799h
41Ah
49Ah
51Ah
59Ah
61Ah
69Ah
71Ah
79Ah
41Bh
49Bh
51Bh
59Bh
61Bh
69Bh
71Bh
79Bh
41Ch
TMR6
(1)
49Ch
51Ch
59Ch
61Ch
69Ch
71Ch
79Ch
41Dh
PR6
(1)
49Dh
51Dh
59Dh
61Dh
69Dh
71Dh
79Dh
41Eh
T6CON
(1)
49Eh
51Eh
59Eh
61Eh
69Eh
71Eh
79Eh
41Fh
49Fh
51Fh
59Fh
61Fh
69Fh
71Fh
79Fh
420h
Unimplemented
Read as ‘0’
4A0h
Unimplemented
Read as ‘0’
520h
Unimplemented
Read as ‘0’
5A0h
Unimplemented
Read as ‘0’
620h
Unimplemented
Read as ‘0’
6A0h
Unimplemented
Read as ‘0’
720h
Unimplemented
Read as ‘0’
7A0h
Unimplemented
Read as ‘0’
46Fh 4EFh 56Fh 5EFh 66Fh 6EFh 76Fh 7EFh 470h
Accesses
70h – 7Fh
4F0h
Accesses 70h – 7Fh
570h
Accesses 70h – 7Fh
5F0h
Accesses
70h – 7Fh
670h
Accesses
70h – 7Fh
6F0h
Accesses
70h – 7Fh
770h
Accesses
70h – 7Fh
7F0h
Accesses
70h – 7Fh
47Fh
4FFh 57Fh
5FFh 67Fh 6FFh 77Fh 7FFh
TABLE 3-3: PIC16(L)F1826/27 MEMORY MAP (CONTINUED)
PIC16(L)F1826/27
2011 Microchip Technology Inc. DS41391D-page 25
BANK16 BANK17 BANK18 BANK19 BANK20 BANK21 BANK22 BANK23
800h
80Bh
Core Registers
(Ta bl e 3 -2 )
880h
88Bh
Core Registers
(Ta bl e 3 -2 )
900h
90Bh
Core Registers
(Ta bl e 3 -2 )
980h
98Bh
Core Registers
(Ta bl e 3 -2 )
A00h
A0Bh
Core Registers
(Ta bl e 3 -2 )
A80h
A8Bh
Core Registers
(Ta bl e 3 -2 )
B00h
B0Bh
Core Registers
(Ta bl e 3 -2 )
B80h
B8Bh
Core Registers
(Ta bl e 3 -2 )
80Ch
Unimplemented
Read as ‘0’
88Ch
Unimplemented
Read as ‘0’
90Ch
Unimplemented
Read as ‘0’
98Ch
Unimplemented
Read as ‘0’
A0Ch
Unimplemented
Read as ‘0’
A8Ch
Unimplemented
Read as ‘0’
B0Ch
Unimplemented
Read as ‘0’
B8Ch
Unimplemented
Read as ‘0’
86Fh 8EFh 96Fh
9EFh
A6Fh
AEFh
B6Fh
BEFh
870h
Common RAM
(Accesses
70h – 7Fh)
8F0h
Common RAM
(Accesses
70h – 7Fh)
970h
Common RAM
(Accesses 70h – 7Fh)
9F0h
Common RAM
(Accesses 70h – 7Fh)
A70h
Common RAM
(Accesses
70h – 7Fh)
AF0h
Common RAM
(Accesses
70h – 7Fh)
B70h
Common RAM
(Accesses 70h – 7Fh)
BF0h
Common RAM
(Accesses 70h – 7Fh)
87Fh 8FFh 97Fh 9FFh A7Fh AFFh B7Fh BFFh
Legend: = Unimplemented data memory locations, read as ‘0
BANK 24 BANK 25 BANK 26 BANK 27 BANK 28 BANK 29 BANK 30 BANK 31
C00h
C0Bh
Core Registers
(Ta bl e 3 -2 )
C80h
C8Bh
Core Registers
(Ta bl e 3 -2 )
D00h
D0Bh
Core Registers
(Ta bl e 3 -2 )
D80h
D8Bh
Core Registers
(Ta bl e 3 -2 )
E00h
E0Bh
Core Registers
(Ta bl e 3 -2 )
E80h
E8Bh
Core Registers
(Ta bl e 3 -2 )
F00h
F0Bh
Core Registers
(Ta bl e 3 -2 )
F80h
F8Bh
Core Registers
(Ta bl e 3 -2 )
C0Ch
C6Fh
Unimplemented
Read as ‘0’
C8Ch
CEFh
Unimplemented
Read as ‘0’
D0Ch
D6Fh
Unimplemented
Read as ‘0’
D8Ch
DEFh
Unimplemented
Read as ‘0’
E0Ch
E6Fh
Unimplemented
Read as ‘0’
E8Ch
EEFh
Unimplemented
Read as ‘0’
F0Ch
F6Fh
Unimplemented
Read as ‘0’
F8Ch
F9Fh
Unimplemented
Read as ‘0’
FA0h
See Tab l e 3 - 4 for more information
FEFh
C70h
Accesses
70h – 7Fh
CF0h
Accesses 70h – 7Fh
D70h
Accesses 70h – 7Fh
DF0h
Accesses 70h – 7Fh
E70h
Accesses 70h – 7Fh
EF0h
Accesses 70h – 7Fh
F70h
Common RAM
(Accesses 70h – 7Fh)
FF0h
Common RAM
(Accesses 70h – 7Fh)
C7Fh
CFFh D7Fh DFFh E7Fh EFFh F7Fh FFFh
TABLE 3-3: PIC16(L)F1826/27 MEMORY MAP (CONTINUED)
PIC16(L)F1826/27
PIC16(L)F1826/27
= Unimplemented data memory locations, read as ‘0’,
Bank 31
F80h
F8Bh
Core Registers
(Ta bl e 3 -2 )
F8Ch
FE3h
Unimplemented
Read as ‘0’
FE4h
STATUS_SHAD
FE5h
WREG_SHAD
FE6h
BSR_SHAD
FE7h
PCLATH_SHAD
FE8h
FSR0L_SHAD
FE9h
FSR0H_SHAD
FEAh
FSR1L_SHAD
FEBh
FSR1H_SHAD
FECh
FEDh
STKPTR
FEEh
TOSL
FEFh
TOSH
FF0h
Common RAM
(Accesses
70h – 7Fh)
FFFh
TABLE 3-4: PIC16(L)F1826/27 MEMORY MAP (CONTINUED)
DS41391D-page 26 2011 Microchip Technology Inc.
PIC16(L)F1826/27

3.2.6 CORE FUNCTION REGISTERS SUMMARY

The Core Function registers listed in Ta bl e 3 - 5 can be addressed from any Bank.
TABLE 3-5: CORE FUNCTION REGISTERS SUMMARY
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Bank 0-31
x00h or
INDF0
x80h
x01h or
INDF1
x81h
x02h or
PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000
x82h
x03h or
STATUS
x83h
x04h or
FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu
x84h
x05h or
FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000
x85h
x06h or
FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu
x86h
x07h or
FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000
x87h
x08h or
BSR
x88h
x09h or
WREG Working Register 0000 0000 uuuu uuuu
x89h
x0Ah or
PCLATH
x8Ah
x0Bh or
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000
x8Bh Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register)
Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register)
—TOPD ZDCC---1 1000 ---q quuu
BSR4 BSR3 BSR2 BSR1 BSR0 ---0 0000 ---0 0000
Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000
Shaded locations are unimplemented, read as ‘0’.
Value on
POR, BOR
xxxx xxxx uuuu uuuu
xxxx xxxx uuuu uuuu
Value on all
other Resets
2011 Microchip Technology Inc. DS41391D-page 27
PIC16(L)F1826/27
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR, BOR
Bank 0
00Ch PORTA
00Dh PORTB
00Eh
00Fh
010h 011h PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
012h PIR2 OSFIF C2IF C1IF EEIF BCL1IF
013h PIR3
014h PIR4 015h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu 016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
018h T1CON TMR1CS1 TMR1CS0 T1CKPS1 T1CKPS0 T1OSCEN T1SYNC
019h T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
01Ah TMR2 Timer2 Module Register 0000 0000 0000 0000 01Bh PR2 Timer2 Period Register 1111 1111 1111 1111
01Ch T2CON
01Dh
01Eh CPSCON0 CPSON
01Fh CPSCON1
Unimplemented
Unimplemented
Unimplemented
(1) (1)
Unimplemented
RA7
RB7 RB6 RB5 RB4 RB3 RB2
CCP4IF CCP3IF TMR6IF — — BCL2IF SSP2IF ---- --00 ---- --00
T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
CPSCH3 CPSCH2 CPSCH1 CPSCH0 ---- 0000 ---- 0000
RA6 RA5 RA4 RA3 RA2
—CCP2IF
DONE
CPSRNG1 CPSRNG0 CPSOUT T0XCS 0--- 0000 0--- 0000
T1GVAL T1GSS1 T1GSS0 0000 0x00 uuuu uxuu
RA1
RB1 RB0
TMR4IF
—TMR1ON0000 00-0 uuuu uu-u
RA0
xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx
(1)
0000 0--0 0000 0--0
--00 0-0- --00 0-0-
Bank 1
08Ch TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 1111 1111 08Dh TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
08Eh
08Fh
090h 091h PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
092h PIE2 OSFIE C2IE C1IE EEIE BCL1IE
093h PIE3
094h PIE4
095h
096h PCON STKOVF STKUNF
097h WDTCON
098h OSCTUNE
099h OSCCON SPLLEN IRCF3 IRCF2 IRCF1 IRCF0 09Ah OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 10q0 0q00 qqqq qq0q 09Bh ADRESL A/D Result Register Low xxxx xxxx uuuu uuuu 09Ch ADRESH A/D Result Register High xxxx xxxx uuuu uuuu
09Dh ADCON0
09Eh ADCON1 ADFM ADCS2 ADCS1 ADCS0
09Fh
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Note 1: PIC16(L)F1827 only.
Unimplemented
Unimplemented
Unimplemented
(1) (1)
OPTION_REG
Unimplemented
Shaded locations are unimplemented, read as ‘0’.
CCP4IE CCP3IE TMR6IE — — BCL2IE SSP2IE ---- --00 ---- --00
WPUEN INTEDG TMR0CS TMR0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
—RMCLRRI POR BOR 00-- 11qq qq-- qquu WDTPS4 WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN --01 0110 --01 0110 TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 --00 0000 --00 0000
CHS4 CHS3 CHS2 CHS1 CHS0
ADNREF
CCP2IE
TMR4IE
SCS1 SCS0 0011 1-00 0011 1-00
GO/DONE
ADPREF1
(1)
0000 0--0 0000 0--0
--00 0-0- --00 0-0-
ADON -000 0000 -000 0000
ADPREF0 0000 -000 0000 -000
Value on all
other
Resets
DS41391D-page 28 2011 Microchip Technology Inc.
PIC16(L)F1826/27
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR, BOR
Bank 2
10Ch LATA LATA7 LATA6 L ATA4 LATA3 LATA2 LATA1 L ATA0 xx-x xxxx uu-u uuuu 10Dh LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 xxxx xxxx uuuu uuuu
10Eh
10Fh
110h
111h CM1CON0 C1ON C1OUT C1OE C1POL
112h CM1CON1 C1INTP C1INTN C1PCH1 C1PCH0
113h CM2CON0 C2ON C2OUT C2OE C2POL
114h CM2CON1 C2INTP C2INTN C2PCH1 C2PCH0
115h CMOUT
116h BORCON SBOREN
117h FVRCON FVREN FVRRDY
118h DACCON0 DACEN DACLPS DACOE
119h DACCON1 11Ah SRCON0 SRLEN SRCLK2 SRCLK1 SRCLK0 SRQEN SRNQEN SRPS SRPR 0000 0000 0000 0000 11Bh SRCON1 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E 0000 0000 0000 0000
11Ch
11Dh APFCON0 RXDTSEL SDO1SEL SS1SEL P2BSEL
11Eh APFCON1
11Fh
Unimplemented
Unimplemented
Unimplemented
C1SP C1HYS C1SYNC 0000 -100 0000 -100 C1NCH<1:0> 0000 --00 0000 --00 C2SP C2HYS C2SYNC 0000 -100 0000 -100 C2NCH1 C2NCH0 0000 --00 0000 --00
MC2OUT MC1OUT ---- --00 ---- --00
BORRDY 1--- ---q u--- ---u
Reserved Reserved CDAFVR1 CDAFVR0 ADFVR1 ADFVR0 0qrr 0000 0qrr 0000
DACPSS1 DACPSS0 DACNSS 000- 00-0 000- 00-0
DACR4 DACR3 DACR2 DACR1 DACR0 ---0 0000 ---0 0000
Unimplemented
TXCKSEL ---- ---0 ---- ---0
Unimplemented
(1)
CCP2SEL
(1)
P1DSEL P1CSEL CCP1SEL 0000 0000 0000 0000
Bank 3
18Ch ANSELA ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 ---1 1111 ---1 1111
18Dh ANSELB ANSB7 ANSB6 ANSB5 ANSB4 ANSB3 ANSB2 ANSB1
18Eh
18Fh
190h 191h EEADRL EEPROM / Program Memory Address Register Low Byte 0000 0000 0000 0000
192h EEADRH 193h EEDATL EEPROM / Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu
194h EEDATH 195h EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 0000 x000 0000 q000 196h EECON2 EEPROM control register 2 0000 0000 0000 0000
197h
198h 199h RCREG USART Receive Data Register 0000 0000 0000 0000 19Ah TXREG USART Transmit Data Register 0000 0000 0000 0000 19Bh SPBRGL Baud Rate Generator Data Register Low 0000 0000 0000 0000 19Ch SPBRGH Baud Rate Generator Data Register High 0000 0000 0000 0000 19Dh RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 19Eh TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
19Fh BAUDCON ABDOVF RCIDL
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Note 1: PIC16(L)F1827 only.
Unimplemented
Unimplemented
Unimplemented
EEPROM / Program Memory Address Register High Byte -000 0000 -000 0000
EEPROM / Program Memory Read Data Register High Byte --xx xxxx --uu uuuu
Unimplemented
Unimplemented
SCKP BRG16 WUE ABDEN 01-0 0-00 01-0 0-00
Shaded locations are unimplemented, read as ‘0’.
1111 111- 1111 111-
Value on all
other
Resets
2011 Microchip Technology Inc. DS41391D-page 29
PIC16(L)F1826/27
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR, BOR
Bank 4
20Ch WPUA —WPUA5— --1- ---- --1- ---- 20Dh WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 1111 1111 1111 1111
20Eh
20Fh
210h
Unimplemented
Unimplemented
Unimplemented
211h SSP1BUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu 212h SSP1ADD ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0 0000 0000 0000 0000 213h SSP1MSK MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 MSK1 MSK0 1111 1111 1111 1111
214h SSP1STAT SMP CKE D/A
PSR/WUA BF 0000 0000 0000 0000 215h SSP1CON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000 216h SSP1CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 217h SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000
218h
219h SSP2BUF
21Ah SSP2ADD
21Bh SSP2MSK
21Ch SSP2STAT
21Dh SSP2CON1
21Eh SSP2CON2
21Fh SSP2CON3
Unimplemented
(1)
Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
(1)
ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0 0000 0000 0000 0000
(1)
MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 MSK1 MSK0 1111 1111 1111 1111
(1)
SMP CKE D/A PSR/WUA BF 0000 0000 0000 0000
(1)
WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
(1)
GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000
(1)
ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000
Bank 5
28Ch Unimplemented
28Dh
28Eh
28Fh
290h
Unimplemented
Unimplemented
Unimplemented
Unimplemented
291h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu 292h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu 293h CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000 294h PWM1CON P1RSEN P1DC6 P1DC5 P1DC4 P1DC3 P1DC2 P1DC1 P1DC0 0000 0000 0000 0000 295h CCP1AS CCP1ASE CCP1AS2 CCP1AS1 CCP1AS0 PSS1AC1 PSS1AC0 PSS1BD1 PSS1BD0 0000 0000 0000 0000
296h PSTR1CON
297h
298h CCPR2L
299h CCPR2H
29Ah CCP2CON
Unimplemented
(1)
(1)
(1)
29Bh PWM2CON
29Ch CCP2AS
(1)
29Dh PSTR2CON
29Eh CCPTMRS
29Fh
Unimplemented
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved.
(1)
Shaded locations are unimplemented, read as ‘0’.
STR1SYNC STR1D STR1C STR1B STR1A ---0 0001 ---0 0001
Capture/Compare/PWM Register 2 (LSB) xxxx xxxx uuuu uuuu Capture/Compare/PWM Register 2 (MSB) xxxx xxxx uuuu uuuu
P2M1 P2M0 DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 0000 0000 0000 0000
(1)
P2RSEN P2DC6 P2DC5 P2DC4 P2DC3 P2DC2 P2DC1 P2DC0 0000 0000 0000 0000
CCP2ASE CCP2AS2 CCP2AS1 CCP2AS0 PSS2AC1 PSS2AC0 PSS2BD1 PSS2BD0 0000 0000 0000 0000
(1)
STR2SYNC STR2D STR2C STR2B STR2A ---0 0001 ---0 0001
C4TSEL1 C4TSEL0 C3TSEL1 C3TSEL0 C2TSEL1 C2TSEL0 C1TSEL1 C1TSEL0 0000 0000 0000 0000
Note 1: PIC16(L)F1827 only.
Value on all
other
Resets
DS41391D-page 30 2011 Microchip Technology Inc.
PIC16(L)F1826/27
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR, BOR
Bank 6
30Ch Unimplemented
30Dh
30Eh
30Fh
310h
311h CCPR3L
312h CCPR3H
313h CCP3CON
314h
315h
316h
317h
318h CCPR4L
319h CCPR4H
31Ah CCP4CON
31Bh
31Ch
31Dh
31Eh
31Fh
Unimplemented
Unimplemented
Unimplemented
Unimplemented
(1)
Capture/Compare/PWM Register 3 (LSB) xxxx xxxx uuuu uuuu
(1)
Capture/Compare/PWM Register 3 (MSB) xxxx xxxx uuuu uuuu
(1)
Unimplemented
Unimplemented
Unimplemented
Unimplemented
(1)
(1)
(1)
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
DC3B1 DC3B0 CCP3M3 CCP3M2 CCP3M1 CCP3M0 --00 0000 --00 0000
Capture/Compare/PWM Register 4 (LSB) xxxx xxxx uuuu uuuu Capture/Compare/PWM Register 4 (MSB) xxxx xxxx uuuu uuuu
DC4B1 DC4B0 CCP4M3 CCP4M2 CCP4M1 CCP4M0 --00 0000 --00 0000
Bank 7
38Ch Unimplemented
38Dh
38Eh
38Fh
390h
391h
392h
393h
394h IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3
395h IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3
396h IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3
397h
398h
399h
39Ah CLKRCON CLKREN CLKROE CLKRSLR CLKRDC1 CLKRDC0
39Bh
39Ch MDCON MDEN MDOE MDSLR MDOPOL
39Dh MDSRC MDMSODIS
39Eh MDCARL MDCLODIS MDCLPOL MDCLSYNC
39Fh MDCARH MDCHODIS MDCHPOL MDCHSYNC
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Note 1: PIC16(L)F1827 only.
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
IOCBP2 IOCBP1 IOCBP0
IOCBN2 IOCBN1 IOCBN0
IOCBF2 IOCBF1 IOCBF0
Unimplemented
Unimplemented
Unimplemented
CLKRDIV2 CLKRDIV1 CLKRDIV0
Unimplemented
Shaded locations are unimplemented, read as ‘0’.
MDMS3 MDMS2 MDMS1 MDMS0
MDCL3 MDCL2 MDCL1 MDCL0
MDCH3 MDCH2 MDCH1 MDCH0
MDBIT
0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000
0011 0000 0011 0000
0010 ---0 0010 ---0 x--- xxxx u--- uuuu xxx- xxxx uuu- uuuu xxx- xxxx uuu- uuuu
Value on all
Resets
other
2011 Microchip Technology Inc. DS41391D-page 31
PIC16(L)F1826/27
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
POR, BOR
Bank 8
40Ch Unimplemented
40Dh
40Eh
40Fh
410h
411h
412h
413h
414h
415h TMR4
416h PR4
417h T4CON
418h
419h
41Ah
41Bh
41Ch TMR6
41Dh PR6
41Eh T6CON
41Fh
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Note 1: PIC16(L)F1827 only.
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
(1)
(1)
Unimplemented
Unimplemented
Unimplemented
Unimplemented
(1)
Unimplemented
Shaded locations are unimplemented, read as ‘0’.
Timer4 Module Register 0000 0000 0000 0000 Timer4 Period Register 1111 1111 1111 1111
(1)
(1)
(1)
T4OUTPS3 T4OUTPS2 T4OUTPS1 T4OUTPS0 TMR4ON T4CKPS1 T4CKPS0 -000 0000 -000 0000
Timer6 Module Register 0000 0000 0000 0000 Timer6 Period Register 1111 1111 1111 1111
T6OUTPS3 T6OUTPS2 T6OUTPS1 T6OUTPS0 TMR6ON T6CKPS1 T6CKPS0 -000 0000 -000 0000
Value on all
other
Resets
DS41391D-page 32 2011 Microchip Technology Inc.
PIC16(L)F1826/27
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Bank 9
48Ch — 49Fh
Bank 10
50Ch — 51Fh
Bank 11
58Ch — 59Fh
Bank 12
60Ch — 61Fh
Bank 13
68Ch — 69Fh
Bank 14
70Ch — 71Fh
Bank 15
78Ch — 79Fh
Bank 16
80Ch — 86Fh
Bank 17
88Ch — 8EFh
Bank 18
90Ch — 96Fh
Bank 19
98Ch — 9EFh
Bank 20
A0Ch — A6Fh
Bank 21
A8Ch — AEFh
Bank 22
B0Ch — B6Fh
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Note 1: PIC16(L)F1827 only.
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Shaded locations are unimplemented, read as ‘0’.
Value on
POR, BOR
Value on all
other
Resets
2011 Microchip Technology Inc. DS41391D-page 33
PIC16(L)F1826/27
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Bank 23
B8Ch — BEFh
Bank 24
C0Ch — C6Fh
Bank 25
C8Ch — CEFh
Bank 26
D0Ch — D6Fh
Bank 27
D8Ch — DEFh
Bank 28
E0Ch — E6Fh
Bank 29
E8Ch — EEFh
Bank 30
F0Ch — F6Fh
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Note 1: PIC16(L)F1827 only.
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Unimplemented
Shaded locations are unimplemented, read as ‘0’.
Value on
POR, BOR
Value on all
other
Resets
DS41391D-page 34 2011 Microchip Technology Inc.
PIC16(L)F1826/27
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Bank 31
F8Ch — FE3h
FE4h STATUS_
FE5h WREG_
FE6h BSR_
FE7h PCLATH_
FE8h FSR0L_
FE9h FSR0H_
FEAh FSR1L_
FEBh FSR1H_
FECh
FEDh
FEEh
FEFh
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Note 1: PIC16(L)F1827 only.
Unimplemented
Z_SHAD DC_
SHAD
Working Register Shadow 0000 0000 uuuu uuuu
SHAD
Bank Select Register Shadow ---x xxxx ---u uuuu
SHAD
Program Counter Latch High Register Shadow -xxx xxxx uuuu uuuu
SHAD
Indirect Data Memory Address 0 Low Pointer Shadow xxxx xxxx uuuu uuuu
SHAD
Indirect Data Memory Address 0 High Pointer Shadow xxxx xxxx uuuu uuuu
SHAD
Indirect Data Memory Address 1 Low Pointer Shadow xxxx xxxx uuuu uuuu
SHAD
Indirect Data Memory Address 1 High Pointer Shadow xxxx xxxx uuuu uuuu
SHAD
Unimplemented
STKPTR
TOSL
TOSH
Shaded locations are unimplemented, read as ‘0’.
Current Stack pointer ---1 1111 ---1 1111
Top-of-Stack Low byte xxxx xxxx uuuu uuuu
Top-of-Stack High byte -xxx xxxx -uuu uuuu
SHAD
C_SHAD ---- -xxx ---- -uuu
Value on
POR, BOR
Value on all
other
Resets
2011 Microchip Technology Inc. DS41391D-page 35
PIC16(L)F1826/27
PCLPCH
0
14
PC
06
7
ALU Result
8
PCLATH
PCLPCH
0
14
PC
06
4
OPCODE <10:0>
11
PCLATH
PCLPCH
0
14
PC
06
7
W
8
PCLATH
Instruction with
PCL as
Destination
GOTO, CALL
CALLW
PCL
PCH
0
14
PC
PC + W
15
BRW
PCLPCH
0
14
PC
PC + OPCODE <8:0>
15
BRA

3.3 PCL and PCLATH

The Program Counter (PC) is 15 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<14:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 3-4 shows the five situations for the loading of the PC.
FIGURE 3-4: LOADING OF PC IN
DIFFERENT SITUATIONS

3.3.3 COMPUTED FUNCTION CALLS

A computed function CALL allows programs to maintain tables of functions and provide another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block).
If using the CALL instruction, the PCH<2:0> and PCL registers are loaded with the operand of the CALL instruction. PCH<6:3> is loaded with PCLATH<6:3>.
The CALLW instruction enables computed calls by com­bining PCLATH and W to form the destination address. A computed CALLW is accomplished by loading the W register with the desired address and executing CALLW. The PCL register is loaded with the value of W and PCH is loaded with PCLATH.

3.3.4 BRANCHING

The branching instructions add an offset to the PC. This allows relocatable code and code that crosses page boundaries. There are two forms of branching, BRW and BRA. The PC will have incremented to fetch the next instruction in both cases. When using either branching instruction, a PCL memory boundary may be crossed.
If using BRW, load the W register with the desired unsigned address and execute BRW. The entire PC will be loaded with the address PC + 1 + W.
If using BRA, the entire PC will be loaded with PC + 1 +, the signed value of the operand of the BRA instruction.

3.3.1 MODIFYING PCL

Executing any instruction with the PCL register as the destination simultaneously causes the Program Coun­ter PC<14:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper 7 bits to the PCLATH register. When the lower 8 bits are written to the PCL register, all 15 bits of the program counter will change to the values con­tained in the PCLATH register and those being written to the PCL register.

3.3.2 COMPUTED GOTO

A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PC L). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to Application Note AN556, “Implementing a T able Read” (DS00556).
DS41391D-page 36 2011 Microchip Technology Inc.
PIC16(L)F1826/27
TOSH:TOSL
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x03
0x02
0x01
0x00
0x04
0x05
0x06
0x07
0x1F
Stack Reset Disabled (STVREN = 0)
Stack Reset Enabled (STVREN = 1)
0x0000
Initial Stack Configuration:
After Reset, the stack is empty. The empty stack is initialized so the Stack Pointer is pointing at 0x1F. If the Stack Overflow/Underflow Reset is enabled, the TOSH/TOSL registers will return ‘0’. If the Stack Overflow/Underflow Reset is disabled, the TOSH/TOSL registers will return the contents of stack address 0x0F.
STKPTR = 0x1F
STKPTR = 0x1F

3.4 Stack

All devices have a 16-level x 15-bit wide hardware stack (refer to Figures 3-5 through 3-8). The stack space is not part of either program or data space. The PC is PUSHed onto the stack when CALL or CALLW instructions are executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation.
The stack operates as a circular buffer if the STVREN bit is programmed to ‘0‘ (Configuration Word 2). This means that after the stack has been PUSHed sixteen times, the seventeenth PUSH overwrites the value that was stored from the first PUSH. The eighteenth PUSH overwrites the second PUSH (and so on). The STKOVF and STKUNF flag bits will be set on an Over­flow/Underflow, regardless of whether the Reset is enabled.
Note 1: There are no instructions/mnemonics
called PUSH or POP. These are actions that occur from the execution of the
CALL, CALLW, RETURN, RETLW and RETFIE instructions or the vectoring to
an interrupt address.

3.4.1 ACCESSING THE STACK

The stack is available through the TOSH, TOSL and STKPTR registers. STKPTR is the current value of the Stack Pointer. TOSH:TOSL register pair points to the TOP of the stack. Both registers are read/writable. TOS is split into TOSH and TOSL due to the 15-bit size of the PC. To access the stack, adjust the value of STKPTR, which will position TOSH:TOSL, then read/write to TOSH:TOSL. STKPTR is 5 bits to allow detection of overflow and underflow.
Note: Care should be taken when modifying the
STKPTR while interrupts are enabled.
During normal program operation, CALL, CALLW and Interrupts will increment STKPTR while RETLW, RETURN, and RETFIE will decrement STKPTR. At any time STKPTR can be inspected to see how much stack is left. The STKPTR always points at the currently used place on the stack. Therefore, a CALL or CALLW will increment the STKPTR and then write the PC, and a return will unload the PC and then decrement STKPTR.
Reference Figure 3-5 through Figure 3-8 for examples of accessing the stack.
FIGURE 3-5: ACCESSING THE STACK EXAMPLE 1
2011 Microchip Technology Inc. DS41391D-page 37
PIC16(L)F1826/27
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x03
0x02
0x01
0x00
0x04
0x05
0x06
0x07
Return Address
This figure shows the stack configuration after the first CALL or a single interrupt. If a RETURN instruction is executed, the return address will be placed in the Program Counter and the Stack Pointer decremented to the empty state (0x1F).
STKPTR = 0x00
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x03
0x02
0x01
0x00
0x04
0x05
0x06
0x07
Return Address
After seven CALLs, or six CALLs and an interrupt, the stack looks like the figure on the left. A series of RETURN instructions will repeatedly place the return addresses into the Program Counter and pop the stack.
STKPTR = 0x06
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
FIGURE 3-6: ACCESSING THE STACK EXAMPLE 2
FIGURE 3-7: ACCESSING THE STACK EXAMPLE 3
DS41391D-page 38 2011 Microchip Technology Inc.
FIGURE 3-8: ACCESSING THE STACK EXAMPLE 4
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x03
0x02
0x01
0x00
0x04
0x05
0x06
0x07
Return Address
When the stack is full, the next CALL or
interrupt will set the Stack Pointer to
0x10. This is identical to address 0x00
so the stack will wrap and overwrite the
return address at 0x00. If the Stack
Overflow/Underflow Reset is enabled, a
Reset will occur and location 0x00 will
not be overwritten.
STKPTR = 0x10
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
PIC16(L)F1826/27

3.4.2 OVERFLOW/UNDERFLOW RESET

If the STVREN bit in Configuration Word 2 is programmed to ‘1’, the device will be reset if the stack is PUSHed beyond the sixteenth level or POPed beyond the first level, setting the appropriate bits (STKOVF or STKUNF, respectively) in the PCON register.

3.5 Indirect Addressing

The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the File Select Registers (FSR). If the FSRn address specifies one of the two INDFn registers, the read will return ‘0’ and the write will not occur (though Status bits may be affected). The FSRn register value is created by the pair FSRnH and FSRnL.
The FSR registers form a 16-bit address that allows an addressing space with 65536 locations. These locations are divided into three memory regions:
• Traditional Data Memory
• Linear Data Memory
• Program Flash Memory
2011 Microchip Technology Inc. DS41391D-page 39
PIC16(L)F1826/27
0x0000
0x0FFF
Traditional
FSR
Address
Range
Data Memory
0x1000
Reserved
Linear
Data Memory
Reserved
0x2000
0x29AF
0x29B0
0x7FFF
0x8000
0xFFFF
0x0000
0x0FFF
0x0000
0x7FFF
Program
Flash Memory
Note: Not all memory regions are completely implemented. Consult device memory tables for memory limits.
0x1FFF

FIGURE 3-9: INDIRECT ADDRESSING

DS41391D-page 40 2011 Microchip Technology Inc.

3.5.1 TRADITIONAL DATA MEMORY

Indirect AddressingDirect Addressing
Bank Select
Location Select
4BSR 6
0
From Opcode
FSRxL70
Bank Select
Location Select
0000 0001 0010 1111
0x00
0x7F
Bank 0 Bank 1 Bank 2 Bank 31
0
FSRxH70
0000
The traditional data memory is a region from FSR address 0x000 to FSR address 0xFFF. The addresses correspond to the absolute addresses of all SFR, GPR and common registers.
FIGURE 3-10: TRADITIONAL DATA MEMORY MAP
PIC16(L)F1826/27
2011 Microchip Technology Inc. DS41391D-page 41
PIC16(L)F1826/27
7
0
1
7
0
0
Location Select
0x2000
FSRnH
FSRnL
0x020
Bank 0
0x06F 0x0A0
Bank 1 0x0EF 0x120
Bank 2
0x16F
0xF20
Bank 30
0xF6F
0x29AF
0
7
1
7
0
0
Location Select
0x8000
FSRnH
FSRnL
0x0000
0x7FFF
0xFFFF
Program Flash Memory (low 8 bits)

3.5.2 LINEAR DATA MEMORY

The linear data memory is the region from FSR address 0x2000 to FSR address 0x29AF. This region is a virtual region that points back to the 80-byte blocks of GPR memory in all the banks.
Unimplemented memory reads as 0x00. Use of the linear data memory region allows buffers to be larger than 80 bytes because incrementing the FSR beyond one bank will go directly to the GPR memory of the next bank.
The 16 bytes of common memory are not included in the linear data memory region.
FIGURE 3-11: LINEAR DATA MEMORY
MAP

3.5.3 PROGRAM FLASH MEMORY

To make constant data access easier, the entire program Flash memory is mapped to the upper half of the FSR address space. When the MSB of FSRnH is set, the lower 15 bits are the address in program memory which will be accessed through INDF. Only the lower 8 bits of each memory location is accessible via INDF. Writing to the program Flash memory cannot be accomplished via the FSR/INDF interface. All instructions that access program Flash memory via the FSR/INDF interface will require one additional instruction cycle to complete.
FIGURE 3-12: PROGRAM FLASH
MEMORY MAP
DS41391D-page 42 2011 Microchip Technology Inc.

4.0 DEVICE CONFIGURATION

Device Configuration consists of Configuration Word 1 and Configuration Word 2, Code Protection and Device ID.

4.1 Configuration Words

There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word 1 at 8007h and Configuration Word 2 at 8008h.
Note: The DEBUG bit in Configuration Word is
managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a '1'.
PIC16(L)F1826/27
2011 Microchip Technology Inc. DS41391D-page 43
PIC16(L)F1826/27

REGISTER 4-1: CONFIGURATION WORD 1

R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1/1
FCMEN IESO CLKOUTEN
bit 13 bit 8
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
CP
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit
bit 12 IESO: Internal External Switchover bit
bit 11 CLKOUTEN
bit 10-9 BOREN<1:0>: Brown-out Reset Enable bits
bit 8 CPD: Data Code Protection bit
bit 7 CP
bit 6 MCLRE: MCLR/VPP Pin Function Select bit
bit 5 PWRTE
bit 4-3 WDTE<1:0>: Watchdog Timer Enable bit
MCLRE PWRTE WDTE<1:0> FOSC<2:0>
1 = Fail-Safe Clock Monitor is enabled 0 = Fail-Safe Clock Monitor is disabled
1 = Internal/External Switchover mode is enabled 0 = Internal/External Switchover mode is disabled
: Clock Out Enable bit
If
FOSC configuration bits are set to LP, XT, HS modes:
This bit is ignored, CLKOUT function is disabled. Oscillator function on the CLKOUT pin.
All other
11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the BORCON register 00 = BOR disabled
1 = Data memory code protection is disabled 0 = Data memory code protection is enabled
1 = Program memory code protection is disabled 0 = Program memory code protection is enabled
If LVP bit =
If LVP bit =
1 = PWRT disabled 0 = PWRT enabled
11 = WDT enabled 10 = WDT enabled while running and disabled in Sleep 01 = WDT controlled by the SWDTEN bit in the WDTCON register 00 = WDT disabled
FOSC modes:
1 = CLKOUT function is disabled. I/O function on the CLKOUT pin. 0 = CLKOUT function is enabled on the CLKOUT pin
(2)
: Code Protection bit
1:
This bit is ignored.
0:
1 =MCLR 0 =MCLR
/VPP pin function is MCLR; Weak pull-up enabled. /VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of
WPUE3 bit.
: Power-up Timer Enable bit
BOREN<1:0> CPD
DS41391D-page 44 2011 Microchip Technology Inc.
REGISTER 4-1: CONFIGURATION WORD 1 (CONTINUED)
bit 2-0 FOSC<2:0>: Oscillator Selection bits
111 = ECH: External Clock, High-Power mode (4-20 MHz): device clock supplied to CLKIN pin 110 = ECM: External Clock, Medium-Power mode (0.5-4 MHz): device clock supplied to CLKIN pin 101 = ECL: External Clock, Low-Power mode (0-0.5 MHz): device clock supplied to CLKIN pin 100 = INTOSC oscillator: I/O function on CLKIN pin 011 = EXTRC oscillator: External RC circuit connected to CLKIN pin 010 = HS oscillator: High-speed crystal/resonator connected between OSC1 and OSC2 pins 001 = XT oscillator: Crystal/resonator connected between OSC1 and OSC2 pins 000 = LP oscillator: Low-power crystal connected between OSC1 and OSC2 pins
PIC16(L)F1826/27
2011 Microchip Technology Inc. DS41391D-page 45
PIC16(L)F1826/27

REGISTER 4-2: CONFIGURATION WORD 2

R/P-1 R/P-1 U-1 R/P-1 R/P-1 R/P-1/1
(1)
LVP
bit 13 bit 8
U-1 U-1 U-1 R/P-1/1 U-1 U-1 R/P-1 R/P-1
Reserved —WRT<1:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
bit 13 LVP: Low-Voltage Programming Enable bit
1 = Low-voltage programming enabled 0 = High-voltage on MCLR
bit 12 DEBUG: In-Circuit Debugger Mode bit
1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins 0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger
bit 11 Unimplemented: Read as ‘1’ bit 10 BORV: Brown-out Reset Voltage Selection bit
1 = Brown-out Reset voltage set to 1.9V (typical) 0 = Brown-out Reset voltage set to 2.5V (typical)
bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Stack Overflow or Underflow will cause a Reset 0 = Stack Overflow or Underflow will not cause a Reset
bit 8 PLLEN: PLL Enable bit
1 = 4xPLL enabled 0 = 4xPLL disabled
bit 7-5 Unimplemented: Read as ‘1’ bit 4 Reserved: This location should be programmed to a ‘1’. bit 3-2 Unimplemented: Read as ‘1’ bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits
2 kW Flash memory (PIC16(L)F1826 only)
11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to 7FFh may be modified by EECON control 01 = 000h to 3FFh write-protected, 400h to 7FFh may be modified by EECON control 00 = 000h to 7FFh write-protected, no addresses may be modified by EECON control
4 kW Flash memory (PIC16(L)F1827 only)
11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to FFFh may be modified by EECON control 01 = 000h to 7FFh write-protected, 800h to FFFh may be modified by EECON control 00 = 000h to FFFh write-protected, no addresses may be modified by EECON control
DEBUG
must be used for programming
(2)
—BORVSTVRENPLLEN
:
:
Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
2: The DEBUG
including debuggers and programmers. For normal device operation, this bit should be maintained as a '1'.
DS41391D-page 46 2011 Microchip Technology Inc.
bit in Configuration Word is managed automatically by device development tools

4.2 Code Protection

Code protection allows the device to be protected from unauthorized access. Program memory protection and data EEPROM protection are controlled independently. Internal access to the program memory and data EEPROM are unaffected by any code protection setting.

4.2.1 PROGRAM MEMORY PROTECTION

The entire program memory space is protected from external reads and writes by the CP Word 1. When CP program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section 4.3 “Write
Protection” for more information.
= 0, external reads and writes of

4.2.2 DATA EEPROM PROTECTION

The entire data EEPROM is protected from external reads and writes by the CPD nal reads and writes of data EEPROM are inhibited. The CPU can continue to read and write data EEPROM regardless of the protection bit settings.
bit in Configuration
bit. When CPD = 0, exter-
PIC16(L)F1826/27

4.3 Write Protection

Write protection allows the device to be protected from unintended self-writes. Applications, such as boot­loader software, can be protected while allowing other regions of the program memory to be modified.
The WRT<1:0> bits in Configuration Word 2 define the size of the program memory block that is protected.

4.4 User ID

Four memory locations (8000h-8003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See
Section 11.5 “User ID, Device ID and Configuration Word Access” for more information on accessing
these memory locations.
checksum calculation, see the PIC16F/LF1826/27
Memory Programming Specification(DS41390).
For more information on
2011 Microchip Technology Inc. DS41391D-page 47
PIC16(L)F1826/27

4.5 Device ID and Revision ID

The memory location 8006h is where the Device ID and Revision ID are stored. The upper nine bits hold the Device ID. The lower five bits hold the Revision ID. See
Section 11.5 “User ID, Device ID and Configuration Word Access” for more information on accessing
these memory locations.
Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID.
DS41391D-page 48 2011 Microchip Technology Inc.
PIC16(L)F1826/27
Device
DEVICEID<13:0> Values
DEV<8:0> REV<4:0>
PIC16F1826 10 0111 100 x xxxx PIC16F1827 10 0111 101 x xxxx PIC16LF1826 10 1000 100 x xxxx PIC16LF1827 10 1000 101 x xxxx
REGISTER 4-3: DEVICEID: DEVICE ID REGISTER
RRRRRR
bit 13 bit 8
RRRRRRRR
DEV<2:0> REV<4:0>
bit 7 bit 0
Legend:
R = Readable bit
u = Bit is unchanged
‘1’ = Bit is set
bit 13-5 DEV<8:0>: Device ID bits
W = Writable bit
x = Bit is unknown
‘0’ = Bit is cleared
(1)
DEV<8:3>
U = Unimplemented bit, read as ‘1’
-n/n = Value at POR and BOR/Value at all other Resets
P = Programmable bit
bit 4-0 REV< 4:0>: Revision ID bits
These bits are used to identify the revision.
Note 1: This location cannot be written.
2011 Microchip Technology Inc. DS41391D-page 49
PIC16(L)F1826/27
NOTES:
DS41391D-page 50 2011 Microchip Technology Inc.
PIC16(L)F1826/27

5.0OSCILLATOR MODULE (WITH FAIL-SAFE CLOCK MONITOR)

5.1 Overview

The oscillator module has a wide variety of clock sources and selection features that allow it to be used in a wide range of applications while maximizing perfor­mance and minimizing power consumption. Figure 5-1 illustrates a block diagram of the oscillator module.
Clock sources can be supplied from external oscillators, quartz crystal resonators, ceramic resonators and Resistor-Capacitor (RC) circuits. In addition, the system clock source can be supplied from one of two internal oscillators and PLL circuits, with a choice of speeds selectable via software. Additional clock features include:
• Selectable system clock source between external
or internal sources via software.
• Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and code execution.
• Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP, XT, HS, EC or RC modes) and switch automatically to the internal oscillator.
• Oscillator Start-up Timer (OST) ensures stability
of crystal oscillator sources
The oscillator module can be configured in one of eight clock modes.
1. ECL – External Clock Low-Power mode (0 MHz to 0.5 MHz)
2. ECM – External Clock Medium-Power mode (0.5 MHz to 4 MHz)
3. ECH – External Clock High-Power mode (4 MHz to 32 MHz)
4. LP – 32 kHz Low-Power Crystal mode.
5. XT – Medium Gain Crystal or Ceramic Resonator Oscillator mode (up to 4 MHz)
6. HS – High Gain Crystal or Ceramic Resonator mode (4 MHz to 20 MHz)
7. RC – External Resistor-Capacitor (RC).
8. INTOSC – Internal oscillator (31 kHz to 32 MHz).
Clock Source modes are selected by the FOSC<2:0> bits in the Configuration Word 1. The FOSC bits determine the type of oscillator that will be used when the device is first powered.
The EC clock mode relies on an external logic level signal as the device clock source. The LP, XT, and HS clock modes require an external crystal or resonator to be connected to the device. Each mode is optimized for a different frequency range. The RC clock mode requires an external resistor and capacitor to set the oscillator frequency.
The INTOSC internal oscillator block produces low, medium, and high frequency clock sources, designated LFINTOSC, MFINTOSC, and HFINTOSC. (see Internal Oscillator Block, Figure 5-1). A wide selection of device clock frequencies may be derived from these three clock sources.
2011 Microchip Technology Inc. DS41391D-page 51
PIC16(L)F1826/27
FOSC<2:0>
Oscillator
T1OSCEN Enable Oscillator
T1OSO
T1OSI
Clock Source Option for other modules
OSC1
OSC2
Sleep
LP, XT, HS, RC, EC
T1OSC
CPU and
Postscaler
MUX
MUX
16 MHz
8 MHz 4 MHz 2 MHz 1 MHz
250 kHz
500 kHz
IRCF<3:0>
31 kHz
500 kHz
Source
Internal
Oscillator
Block
WDT, PWRT, Fail-Safe Clock Monitor
16 MHz
Internal Oscillator
(HFINTOSC)
Clock
Control
SCS<1:0>
HFPLL
31 kHz (LFINTOSC)
Two-Speed Start-up and other modules
Oscillator
31 kHz
Source
500 kHz
(MFINTOSC)
125 kHz
31.25 kHz
62.5 kHz
FOSC<2:0> = 100
Peripherals
Sleep
External
Timer1
4 x PLL

FIGURE 5-1: SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM

DS41391D-page 52 2011 Microchip Technology Inc.
PIC16(L)F1826/27
OSC1/CLKIN
OSC2/CLKOUT
Clock from Ext. System
PIC
®
MCU
FOSC/4 or
I/O
(1)
Note 1: Output depends upon CLKOUTEN bit of the
Configuration Word 1.

5.2 Clock Source Types

Clock sources can be classified as external or internal.
External clock sources rely on external circuitry for the clock source to function. Examples are: oscillator mod­ules (EC mode), quartz crystal resonators or ceramic resonators (LP, XT and HS modes) and Resis­tor-Capacitor (RC) mode circuits.
Internal clock sources are contained internally within the oscillator module. The internal oscillator block has two internal oscillators and a dedicated Phase-Lock Loop (HFPLL) that are used to generate three internal system clock sources: the 16 MHz High-Frequency Internal Oscillator (HFINTOSC), 500 kHz (MFINTOSC) and the 31 kHz Low-Frequency Internal Oscillator (LFINTOSC).
The system clock can be selected between external or internal clock sources via the System Clock Select (SCS) bits in the OSCCON register. See Section 5.3
“Clock Switching” for additional information.

5.2.1 EXTERNAL CLOCK SOURCES

An external clock source can be used as the device system clock by performing one of the following actions:
• Program the FOSC<2:0> bits in the Configuration Word 1 to select an external clock source that will be used as the default system clock upon a device Reset.
• Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to:
- Timer1 Oscillator during run-time, or
- An external clock source determined by the
value of the FOSC bits.
See Section 5.3 “Clock Switching”for more informa­tion.
5.2.1.1 EC Mode
The External Clock (EC) mode allows an externally generated logic level signal to be the system clock source. When operating in this mode, an external clock source is connected to the OSC1 input. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. Figure 5-2 shows the pin connections for EC mode.
EC mode has 3 power modes to select from through Configuration Word 1:
• High-power, 4-32 MHz (FOSC = 111)
• Medium power, 0.5-4 MHz (FOSC = 110)
• Low-power, 0-0.5 MHz (FOSC = 101)
The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in operation after a Power-on Reset (POR) or wake-up from Sleep. Because the PIC
®
MCU design is fully static, stopping the external clock input will have the effect of halting the device while leaving all data intact. Upon restarting the external clock, the device will resume operation as if no time had elapsed.
FIGURE 5-2: EXTERNAL CLOCK (EC)
MODE OPERATION
5.2.1.2 LP, XT, HS Modes
The LP, XT and HS modes support the use of quartz crystal resonators or ceramic resonators connected to OSC1 and OSC2 (Figure 5-3). The three modes select a low, medium or high gain setting of the internal inverter-amplifier to support various resonator types and speed.
LP Oscillator mode selects the lowest gain setting of the internal inverter-amplifier. LP mode current consumption is the least of the three modes. This mode is designed to drive only 32.768 kHz tuning-fork type crystals (watch crystals).
XT Oscillator mode selects the intermediate gain setting of the internal inverter-amplifier. XT mode current consumption is the medium of the three modes. This mode is best suited to drive resonators with a medium drive level specification.
HS Oscillator mode selects the highest gain setting of the internal inverter-amplifier. HS mode current consumption is the highest of the three modes. This mode is best suited for resonators that require a high drive setting.
Figure 5-3 and Figure 5-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
2011 Microchip Technology Inc. DS41391D-page 53
PIC16(L)F1826/27
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of R
F varies with the Oscillator mode
selected (typically between 2 M to 10 M.
C1
C2
Quartz
R
S
(1)
OSC1/CLKIN
RF
(2)
Sleep
To Internal Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of R
F varies with the Oscillator mode
selected (typically between 2 M to 10 M.
3: An additional parallel feedback resistor (R
P)
may be required for proper ceramic resonator operation.
C1
C2
Ceramic
R
S
(1)
OSC1/CLKIN
RF
(2)
Sleep
To Internal Logic
PIC® MCU
RP
(3)
Resonator
OSC2/CLKOUT
FIGURE 5-3: QUARTZ CRYSTAL
OPERATION (LP, XT OR HS MODE)
Note 1: Quartz crystal characteristics vary
according to type, package and manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application.
2: Always verify oscillator performance over
DD and temperature range that is
the V expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC Devices” (DS00826)
• AN849, “Basic PIC
(DS00849)
• AN943, “Practical PIC Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work
(DS00949)
®
and PIC
®
Oscillator Design
®
Oscillator
FIGURE 5-4: CERAMIC RESONATOR
OPERATION (XT OR HS MODE)
5.2.1.3 Oscillator Start-up Timer (OST)
If the oscillator module is configured for LP, XT or HS modes, the Oscillator Start-up Timer (OST) counts 1024 oscillations from OSC1. This occurs following a Power-on Reset (POR) and when the Power-up Timer (PWRT) has expired (if configured), or a wake-up from Sleep. During this time, the program counter does not
®
increment and program execution is suspended. The OST ensures that the oscillator circuit, using a quartz crystal resonator or ceramic resonator, has started and is providing a stable system clock to the oscillator module.
In order to minimize latency between external oscillator start-up and code execution, the Two-Speed Clock Start-up mode can be selected (see Section 5.4
“Two-Speed Clock Start-up Mode”).
DS41391D-page 54 2011 Microchip Technology Inc.
5.2.1.4 4X PLL
The oscillator module contains a 4X PLL that can be used with both external and internal clock sources to provide a system clock source. The input frequency for the 4X PLL must fall within specifications. See the PLL Clock Timing Specifications in Section 30.0
“Electrical Specifications”.
The 4X PLL may be enabled for use by one of two methods:
1. Program the PLLEN bit in Configuration Word 2
to a ‘1’.
2. Write the SPLLEN bit in the OSCCON register to
a ‘1’. If the PLLEN bit in Configuration Word 2 is programmed to a ‘1’, then the value of SPLLEN is ignored.
PIC16(L)F1826/27
C1
C2
32.768 kHz
T1OSI
To Internal Logic
PIC® MCU
Crystal
T1OSO
Quartz
OSC2/CLKOUT
CEXT
REXT
PIC® MCU
OSC1/CLKIN
F
OSC/4 or
Internal
Clock
VDD
VSS
Recommended values: 10 k  REXT 100 k, <3V
3 k  R
EXT 100 k, 3-5V
C
EXT > 20 pF, 2-5V
Note 1: Output depends upon CLKOUTEN bit of the
Configuration Word 1.
I/O
(1)
5.2.1.5 TIMER1 Oscillator
The Timer1 Oscillator is a separate crystal oscillator that is associated with the Timer1 peripheral. It is opti­mized for timekeeping operations with a 32.768 kHz crystal connected between the T1OSO and T1OSI device pins.
The Timer1 Oscillator can be used as an alternate sys­tem clock source and can be selected during run-time using clock switching. Refer to Section 5.3 “Clock
Switching” for more information.
FIGURE 5-5: QUARTZ CRYSTAL
OPERATION (TIMER1 OSCILLATOR)
5.2.1.6 External RC Mode
The external Resistor-Capacitor (RC) modes support the use of an external RC circuit. This allows the designer maximum flexibility in frequency choice while keeping costs to a minimum when clock accuracy is not required.
The RC circuit connects to OSC1. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. The function of the OSC2/CLKOUT pin is determined by the state of the CLKOUTEN
bit in Configuration Word 1.
Figure 5-6 shows the external RC mode connections.
FIGURE 5-6: EXTERNAL RC MODES
Note 1: Quartz crystal characteristics vary
according to type, package and manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application.
2: Always verify oscillator performance over
DD and temperature range that is
the V expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC Devices” (DS00826)
• AN849, “Basic PIC
(DS00849)
• AN943, “Practical PIC
2011 Microchip Technology Inc. DS41391D-page 55
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work
(DS00949)
• TB097, “Interfacing a Micro Crystal
MS1V-T1K 32.768 kHz Tuning Fork Crystal to a PIC16F690/SS” (DS91097)
• AN1288, “Design Practices for Low-Power External Oscillators
(DS01288)
®
and PIC
®
Oscillator Design
®
Oscillator
The RC oscillator frequency is a function of the supply voltage, the resistor (R
EXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting the oscillator frequency are:
• threshold voltage variation
• component tolerances
• packaging variations in capacitance
®
The user also needs to take into account variation due to tolerance of external RC components used.
PIC16(L)F1826/27

5.2.2 INTERNAL CLOCK SOURCES

The device may be configured to use the internal oscil­lator block as the system clock by performing one of the following actions:
• Program the FOSC<2:0> bits in Configuration Word 1 to select the INTOSC clock source, which will be used as the default system clock upon a device Reset.
• Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to the internal oscillator during run-time. See Section 5.3
“Clock Switching”for more information.
In INTOSC mode, OSC1/CLKIN is available for general purpose I/O. OSC2/CLKOUT is available for general purpose I/O or CLKOUT.
The function of the OSC2/CLKOUT pin is determined by the state of the CLKOUTEN Word 1.
The internal oscillator block has two independent oscillators and a dedicated Phase-Lock Loop, HFPLL that can produce one of three internal system clock sources.
1. The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at 16 MHz. The HFINTOSC source is generated from the 500 kHz MFINTOSC source and the dedicated Phase-Lock Loop, HFPLL. The frequency of the HFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3).
2. The MFINTOSC (Medium-Frequency Internal
Oscillator) is factory calibrated and operates at 500 kHz. The frequency of the MFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3).
3. The LFINTOSC (Low-Frequency Internal
Oscillator) is uncalibrated and operates at 31 kHz.
bit in Configuration
5.2.2.1 HFINTOSC
The High-Frequency Internal Oscillator (HFINTOSC) is a factory calibrated 16 MHz internal clock source. The frequency of the HFINTOSC can be altered via software using the OSCTUNE register (Register 5-3).
The output of the HFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of nine frequencies derived from the HFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section5.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The HFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’.
The High Frequency Internal Oscillator Ready bit (HFIOFR) of the OSCSTAT register indicates when the HFINTOSC is running and can be utilized.
The High Frequency Internal Oscillator Status Locked bit (HFIOFL) of the OSCSTAT register indicates when the HFINTOSC is running within 2% of its final value.
The High Frequency Internal Oscillator Status Stable bit (HFIOFS) of the OSCSTAT register indicates when the HFINTOSC is running within 0.5% of its final value.
5.2.2.2 MFINTOSC
The Medium-Frequency Internal Oscillator (MFINTOSC) is a factory calibrated 500 kHz internal clock source. The frequency of the MFINTOSC can be altered via software using the OSCTUNE register (Register 5-3).
The output of the MFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of nine frequencies derived from the MFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section5.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The MFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’
The Medium Frequency Internal Oscillator Ready bit (MFIOFR) of the OSCSTAT register indicates when the MFINTOSC is running and can be utilized.
DS41391D-page 56 2011 Microchip Technology Inc.
PIC16(L)F1826/27
5.2.2.3 Internal Oscillator Frequency Adjustment
The 500 kHz internal oscillator is factory calibrated. This internal oscillator can be adjusted in software by writing to the OSCTUNE register (Register 5-3). Since the HFINTOSC and MFINTOSC clock sources are derived from the 500 kHz internal oscillator a change in the OSCTUNE register value will apply to both.
The default value of the OSCTUNE register is ‘0’. The value is a 6-bit two’s complement number. A value of 1Fh will provide an adjustment to the maximum frequency. A value of 20h will provide an adjustment to the minimum frequency.
When the OSCTUNE register is modified, the oscillator frequency will begin shifting to the new frequency. Code execution continues during this shift. There is no indication that the shift has occurred.
OSCTUNE does not affect the LFINTOSC frequency. Operation of features that depend on the LFINTOSC clock source frequency, such as the Power-up Timer (PWRT), Watchdog Timer (WDT), Fail-Safe Clock
Monitor (FSCM) and peripherals, are not affected by the
change in frequency.
5.2.2.4 LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is an uncalibrated 31 kHz internal clock source.
The output of the LFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). Select 31 kHz, via software, using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.7 “Internal Oscillator
Clock Switch Timing” for more information. The
LFINTOSC is also the frequency for the Power-up Timer (PWRT), Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM).
The LFINTOSC is enabled by selecting 31 kHz (IRCF<3:0> bits of the OSCCON register = 000) as the system clock source (SCS bits of the OSCCON register = 1x), or when any of the following are enabled:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired LF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
Peripherals that use the LFINTOSC are:
• Power-up Timer (PWRT)
• Watchdog Timer (WDT)
• Fail-Safe Clock Monitor (FSCM)
The Low Frequency Internal Oscillator Ready bit (LFIOFR) of the OSCSTAT register indicates when the LFINTOSC is running and can be utilized.
5.2.2.5 Internal Oscillator Frequency Selection
The system clock speed can be selected via software using the Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register.
The output of the 16 MHz HFINTOSC and 31 kHz LFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). The Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register select the frequency output of the internal oscillators. One of the following frequencies can be selected via software:
• 32 MHz (requires 4X PLL)
•16 MHz
•8 MHz
•4 MHz
•2 MHz
•1 MHz
• 500 kHz (Default after Reset)
•250 kHz
•125 kHz
•62.5 kHz
•31.25 kHz
• 31 kHz (LFINTOSC)
Note: Following any Reset, the IRCF<3:0> bits
of the OSCCON register are set to ‘0111’ and the frequency selection is set to 500 kHz. The user can modify the IRCF bits to select a different frequency.
The IRCF<3:0> bits of the OSCCON register allow duplicate selections for some frequencies. These dupli­cate choices can offer system design trade-offs. Lower power consumption can be obtained when changing oscillator sources for a given frequency. Faster transi­tion times can be obtained between frequency changes that use the same oscillator source.
2011 Microchip Technology Inc. DS41391D-page 57
PIC16(L)F1826/27
5.2.2.6 32 MHz Internal Oscillator Frequency Selection
The Internal Oscillator Block can be used with the 4X PLL associated with the External Oscillator Block to produce a 32 MHz internal system clock source. The following settings are required to use the 32 MHz inter­nal clock source:
• The FOSC bits in Configuration Word 1 must be
set to use the INTOSC source as the device sys­tem clock (FOSC<2:0> = 100).
• The SCS bits in the OSCCON register must be
cleared to use the clock determined by FOSC<2:0> in Configuration Word 1 (SCS<1:0> = 00).
• The IRCF bits in the OSCCON register must be
set to the 8 MHz HFINTOSC set to use (IRCF<3:0> = 1110).
• The SPLLEN bit in the OSCCON register must be
set to enable the 4xPLL, or the PLLEN bit of the Configuration Word 2 must be programmed to a ‘1’.
Note: When using the PLLEN bit of the
Configuration Word 2, the 4xPLL cannot
be disabled by software and the 8 MHz HFINTOSC option will no longer be available.
The 4xPLL is not available for use with the internal oscillator when the SCS bits of the OSCCON register are set to ‘1x’. The SCS bits must be set to ‘00’ to use the 4xPLL with the internal oscillator.
5.2.2.7 Internal Oscillator Clock Switch Timing
When switching between the HFINTOSC, MFINTOSC and the LFINTOSC, the new oscillator may already be shut down to save power (see Figure 5-7). If this is the case, there is a delay after the IRCF<3:0> bits of the OSCCON register are modified before the frequency selection takes place. The OSCSTAT register will reflect the current active status of the HFINTOSC, MFINTOSC and LFINTOSC oscillators. The sequence of a frequency selection is as follows:
1. IRCF<3:0> bits of the OSCCON register are
modified.
2. If the new clock is shut down, a clock start-up
delay is started.
3. Clock switch circuitry waits for a falling edge of
the current clock.
4. The current clock is held low and the clock
switch circuitry waits for a rising edge in the new clock.
5. The new clock is now active.
6. The OSCSTAT register is updated as required.
7. Clock switch is complete.
See Figure 5-7 for more details.
If the internal oscillator speed is switched between two clocks of the same source, there is no start-up delay before the new frequency is selected. Clock switching time delays are shown in Table 5-1.
Start-up delay specifications are located in the oscillator tables of Section 30.0 “Electrical
Specifications”.
DS41391D-page 58 2011 Microchip Technology Inc.
FIGURE 5-7: INTERNAL OSCILLATOR SWITCH TIMING
HFINTOSC/
LFINTOSC
IRCF <3:0>
System Clock
HFINTOSC/
LFINTOSC
IRCF <3:0>
System Clock
0 0
0 0
Start-up Time
2-cycle Sync Running
2-cycle Sync Running
HFINTOSC/ LFINTOSC (FSCM and WDT disabled)
HFINTOSC/
LFINTOSC (Either FSCM or WDT enabled)
LFINTOSC
HFINTOSC/
IRCF <3:0>
System Clock
= 0 0
Start-up Time 2-cycle Sync
Running
LFINTOSC HFINTOSC/MFINTOSC
LFINTOSC turns off unless WDT or FSCM is enabled
MFINTOSC
MFINTOSC
MFINTOSC
MFINTOSC
MFINTOSC
PIC16(L)F1826/27
2011 Microchip Technology Inc. DS41391D-page 59
PIC16(L)F1826/27

5.3 Clock Switching

The system clock source can be switched between external and internal clock sources via software using the System Clock Select (SCS) bits of the OSCCON register. The following clock sources can be selected using the SCS bits:
• Default system oscillator determined by FOSC bits in Configuration Word 1
• Timer1 32 kHz crystal oscillator
• Internal Oscillator Block (INTOSC)
5.3.1 SYSTEM CLOCK SELECT (SCS)
BITS
The System Clock Select (SCS) bits of the OSCCON register selects the system clock source that is used for the CPU and peripherals.
• When the SCS bits of the OSCCON register = 00, the system clock source is determined by value of the FOSC<2:0> bits in the Configuration Word 1.
• When the SCS bits of the OSCCON register = 01, the system clock source is the Timer1 oscillator.
• When the SCS bits of the OSCCON register = 1x, the system clock source is chosen by the internal oscillator frequency selected by the IRCF<3:0> bits of the OSCCON register. After a Reset, the SCS bits of the OSCCON register are always cleared.
Note: Any automatic clock switch, which may
occur from Two-Speed Start-up or Fail-Safe Clock Monitor, does not update the SCS bits of the OSCCON register. The user can monitor the OSTS bit of the OSCSTAT register to determine the current system clock source.

5.3.3 TIMER1 OSCILLATOR

The Timer1 Oscillator is a separate crystal oscillator associated with the Timer1 peripheral. It is optimized for timekeeping operations with a 32.768 kHz crystal connected between the T1OSO and T1OSI device pins.
The Timer1 oscillator is enabled using the T1OSCEN control bit in the T1CON register. See Section 21.0
“Timer1 Module with Gate Control” for more
information about the Timer1 peripheral.
5.3.4 TIMER1 OSCILLATOR READY
(T1OSCR) BIT
The user must ensure that the Timer1 Oscillator is ready to be used before it is selected as a system clock source. The Timer1 Oscillator Ready (T1OSCR) bit of the OSCSTAT register indicates whether the Timer1 oscillator is ready to be used. After the T1OSCR bit is set, the SCS bits can be configured to select the Timer1 oscillator.
When switching between clock sources, a delay is required to allow the new clock to stabilize. These oscil­lator delays are shown in Table 5-1.
5.3.2 OSCILLATOR START-UP TIME-OUT
STATUS (OSTS) BIT
The Oscillator Start-up Time-out Status (OSTS) bit of the OSCSTAT register indicates whether the system clock is running from the external clock source, as defined by the FOSC<2:0> bits in the Configuration Word 1, or from the internal clock source. In particular, OSTS indicates that the Oscillator Start-up Timer (OST) has timed out for LP, XT or HS modes. The OST does not reflect the status of the Timer1 Oscillator.
DS41391D-page 60 2011 Microchip Technology Inc.
PIC16(L)F1826/27

5.4 Two-Speed Clock Start-up Mode

Two-Speed Start-up mode provides additional power savings by minimizing the latency between external oscillator start-up and code execution. In applications that make heavy use of the Sleep mode, Two-Speed Start-up will remove the external oscillator start-up time from the time spent awake and can reduce the overall power consumption of the device. This mode allows the application to wake-up from Sleep, perform a few instructions using the INTOSC internal oscillator block as the clock source and go back to Sleep without waiting for the external oscillator to become stable.
Two-Speed Start-up provides benefits when the oscil­lator module is configured for LP, XT, or HS modes. The Oscillator Start-up Timer (OST) is enabled for these modes and must count 1024 oscillations before the oscillator can be used as the system clock source.
If the oscillator module is configured for any mode other than LP, XT or HS mode, then Two-Speed Start-up is disabled. This is because the external clock oscillator does not require any stabilization time after POR or an exit from Sleep.
If the OST count reaches 1024 before the device enters Sleep mode, the OSTS bit of the OSCSTAT reg­ister is set and program execution switches to the external oscillator. However, the system may never operate from the external oscillator if the time spent awake is very short.
Note: Executing a SLEEP instruction will abort
the oscillator start-up time and will cause the OSTS bit of the OSCSTAT register to remain clear.

5.4.1 TWO-SPEED START-UP MODE CONFIGURATION

Two-Speed Start-up mode is configured by the following settings:
• IESO (of the Configuration Word 1) = 1; Inter-
nal/External Switchover bit (Two-Speed Start-up mode enabled).
• SCS (of the OSCCON register) = 00.
• FOSC<2:0> bits in the Configuration Word 1
configured for LP, XT or HS mode.
Two-Speed Start-up mode is entered after:
• Power-on Reset (POR) and, if enabled, after
Power-up Timer (PWRT) has expired, or
• Wake-up from Sleep.
TABLE 5-1: OSCILLATOR SWITCHING DELAYS
Switch From Switch To Frequency Oscillator Delay
(1) (1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
31 kHz
31.25 kHz-500 kHz
Oscillator Warm-up Delay (T
31.25kHz-16MHz DC – 32 MHz 2 cycles DC – 32 MHz 1 cycle of each
32 kHz-20 MHz 1024 Clock Cycles (OST)
31.25 kHz-500 kHz
31.25kHz-16MHz
2 s (approx.)
31 kHz 1 cycle of each
WARM)
LFINTOSC
Sleep/POR
MFINTOSC
HFINTOSC Sleep/POR EC, RC LFINTOSC EC, RC
Sleep/POR
Any clock source
Timer1 Oscillator
LP, XT, HS
MFINTOSC
HFINTOSC Any clock source LFINTOSC Any clock source Timer1 Oscillator 32 kHz 1024 Clock Cycles (OST) PLL inactive PLL active 16-32 MHz 2 ms (approx.) Note 1: PLL inactive.
2011 Microchip Technology Inc. DS41391D-page 61
PIC16(L)F1826/27
0 1 1022 1023
PC + 1
TOSTT
INTOSC
OSC1
OSC2
Program Counter
System Clock
PC - N
PC

5.4.2 TWO-SPEED START-UP SEQUENCE

1. Wake-up from Power-on Reset or Sleep.
2. Instructions begin execution by the internal
oscillator at the frequency set in the IRCF<3:0> bits of the OSCCON register.
3. OST enabled to count 1024 clock cycles.
4. OST timed out, wait for falling edge of the
internal oscillator.
5. OSTS is set.
6. System clock held low until the next falling edge
of new clock (LP, XT or HS mode).
7. System clock is switched to external clock
source.
FIGURE 5-8: TWO-SPEED START-UP

5.4.3 CHECKING TWO-SPEED CLOCK STATUS

Checking the state of the OSTS bit of the OSCSTAT register will confirm if the microcontroller is running from the external clock source, as defined by the FOSC<2:0> bits in the Configuration Word 1, or the internal oscillator.
DS41391D-page 62 2011 Microchip Technology Inc.
PIC16(L)F1826/27
External
LFINTOSC
÷ 64
S
R
Q
31 kHz
(~32 s)
488 Hz
(~2 ms)
Clock Monitor
Latch
Clock
Failure
Detected
Oscillator
Clock
Q
Sample Clock

5.5 Fail-Safe Clock Monitor

The Fail-Safe Clock Monitor (FSCM) allows the device to continue operating should the external oscillator fail. The FSCM can detect oscillator failure any time after the Oscillator Start-up Timer (OST) has expired. The FSCM is enabled by setting the FCMEN bit in the Configuration Word 1. The FSCM is applicable to all external Oscillator modes (LP, XT, HS, EC, Timer1 Oscillator and RC).

FIGURE 5-9: FSCM BLOCK DIAGRAM

5.5.1 FAIL-SAFE DETECTION

The FSCM module detects a failed oscillator by comparing the external oscillator to the FSCM sample clock. The sample clock is generated by dividing the LFINTOSC by 64. See Figure 5-9. Inside the fail detector block is a latch. The external clock sets the latch on each falling edge of the external clock. The sample clock clears the latch on each rising edge of the sample clock. A failure is detected when an entire half-cycle of the sample clock elapses before the external clock goes low.

5.5.3 FAIL-SAFE CONDITION CLEARING

The Fail-Safe condition is cleared after a Reset, executing a SLEEP instruction or changing the SCS bits of the OSCCON register. When the SCS bits are changed, the OST is restarted. While the OST is running, the device continues to operate from the INTOSC selected in OSCCON. When the OST times out, the Fail-Safe condition is cleared and the device will be operating from the external clock source. The Fail-Safe condition must be cleared before the OSFIF flag can be cleared.

5.5.4 RESET OR WAKE-UP FROM SLEEP

The FSCM is designed to detect an oscillator failure after the Oscillator Start-up Timer (OST) has expired. The OST is used after waking up from Sleep and after any type of Reset. The OST is not used with the EC or RC Clock modes so that the FSCM will be active as soon as the Reset or wake-up has completed. When the FSCM is enabled, the Two-Speed Start-up is also enabled. Therefore, the device will always be executing code while the OST is operating.
Note: Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active during oscillator start-up (i.e., after exiting Reset or Sleep). After an appropriate amount of time, the user should check the Status bits in the OSCSTAT register to verify the oscillator start-up and that the system clock switchover has successfully completed.

5.5.2 FAIL-SAFE OPERATION

When the external clock fails, the FSCM switches the device clock to an internal clock source and sets the bit flag OSFIF of the PIR2 register. Setting this flag will generate an interrupt if the OSFIE bit of the PIE2 register is also set. The device firmware can then take steps to mitigate the problems that may arise from a failed clock. The system clock will continue to be sourced from the internal clock source until the device firmware successfully restarts the external oscillator and switches back to external operation.
The internal clock source chosen by the FSCM is determined by the IRCF<3:0> bits of the OSCCON register. This allows the internal oscillator to be configured before a failure occurs.
2011 Microchip Technology Inc. DS41391D-page 63
PIC16(L)F1826/27
OSCFIF
System
Clock
Output
Sample Clock
Failure
Detected
Oscillator Failure
Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.
(Q)
Te st
Test Test
Clock Monitor Output
FIGURE 5-10: FSCM TIMING DIAGRAM
DS41391D-page 64 2011 Microchip Technology Inc.
PIC16(L)F1826/27

5.6 Oscillator Control Registers

REGISTER 5-1: OSCCON: OSCILLATOR CONTROL REGISTER

R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-1/1 U-0 R/W-0/0 R/W-0/0
SPLLEN IRCF<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 SPLLEN: Software PLL Enable bit
If PLLEN in Configuration Word 1 = SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements)
If PLLEN in Configuration Word 1 = 0: 1 = 4x PLL Is enabled 0 = 4x PLL is disabled
bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits
000x =31 kHz LF 0010 =31.25 kHz MF 0011 =31.25 kHz HF 0100 =62.5 kHz MF 0101 =125 kHz MF 0110 =250 kHz MF 0111 =500 kHz MF (default upon Reset) 1000 =125 kHz HF 1001 =250 kHz HF 1010 =500 kHz HF 1011 =1 MHz HF 1100 =2 MHz HF 1101 =4 MHz HF 1110 =8 MHz or 32 MHz HF(see Section 5.2.2.1 “HFINTOSC”) 1111 =16 MHz HF
bit 2 Unimplemented: Read as ‘0’ bit 1-0 SCS<1:0>: System Clock Select bits
1x = Internal oscillator block 01 = Timer1 oscillator 00 = Clock determined by FOSC<2:0> in Configuration Word 1.
(1)
(1) (1) (1)
1:
SCS<1:0>
Note 1: Duplicate frequency derived from HFINTOSC.
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REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER

R-1/q R-0/q R-q/q R-0/q R-0/q R-q/q R-0/0 R-0/q
T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional
bit 7 T1OSCR: Timer1 Oscillator Ready bit
If T1OSCEN =
1 = Timer1 oscillator is ready 0 = Timer1 oscillator is not ready
If T1OSCEN = 1 = Timer1 clock source is always ready
bit 6 PLLR 4x PLL Ready bit
1 = 4x PLL is ready 0 = 4x PLL is not ready
bit 5 OSTS: Oscillator Start-up Time-out Status bit
1 = Running from the clock defined by the FOSC<2:0> bits of the Configuration Word 1 0 = Running from an internal oscillator (FOSC<2:0> = 100)
bit 4 HFIOFR: High Frequency Internal Oscillator Ready bit
1 = HFINTOSC is ready 0 = HFINTOSC is not ready
bit 3 HFIOFL: High Frequency Internal Oscillator Locked bit
1 = HFINTOSC is at least 2% accurate 0 = HFINTOSC is not 2% accurate
bit 2 MFIOFR: Medium Frequency Internal Oscillator Ready bit
1 = MFINTOSC is ready 0 = MFINTOSC is not ready
bit 1 LFIOFR: Low Frequency Internal Oscillator Ready bit
1 = LFINTOSC is ready 0 = LFINTOSC is not ready
bit 0 HFIOFS: High Frequency Internal Oscillator Stable bit
1 = HFINTOSC is at least 0.5% accurate 0 = HFINTOSC is not 0.5% accurate
1:
0:
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REGISTER 5-3: OSCTUNE: OSCILLATOR TUNING REGISTER

U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
TUN<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TUN<5:0>: Frequency Tuning bits
011111 = Maximum frequency 011110 =
000001 = 000000 = Oscillator module is running at the factory-calibrated frequency. 111111 =
100000 = Minimum frequency

TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES

(1) (1)
Register on Page
94 97
187
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
OSCCON SPLLEN IRCF3 IRCF2 IRCF1 IRCF0
OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR
OSCTUNE
PIE2 OSFIE
PIR2
T1CON
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by clock sources. Note 1: PIC16(L)F1827 only.
TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 67
C2IE C1IE EEIE BCL1IE
OSFIF
TMR1CS1 TMR1CS0 T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1ON
C2IF C1IF EEIF BCL1IF CCP2IF
SCS1 SCS0 65
CCP2IE
HFIOFS 66

TABLE 5-3: SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH CLOCK SOURCES

Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0
CONFIG1
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by clock sources.
13:8
7:0
FCMEN IESO CLKOUTEN BOREN1 BOREN0 CPD
CP MCLRE PWRTE WDTE1 WDTE0 FOSC2 FOSC1 FOSC0
Register on Page
50
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NOTES:
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6.0 REFERENCE CLOCK MODULE

The reference clock module provides the ability to send a divided clock to the clock output pin of the device (CLKR) and provide a secondary internal clock source to the modulator module. This module is available in all oscillator configurations and allows the user to select a greater range of clock submultiples to drive external devices in the application. The reference clock module includes the following features:
• System clock is the source
• Available in all oscillator configurations
• Programmable clock divider
• Output enable to a port pin
• Selectable duty cycle
• Slew rate control
The reference clock module is controlled by the CLKRCON register (Register 6-1) and is enabled when setting the CLKREN bit. To output the divided clock sig­nal to the CLKR port pin, the CLKROE bit must be set. The CLKRDIV<2:0> bits enable the selection of 8 dif­ferent clock divider options. The CLKRDC<1:0> bits can be used to modify the duty cycle of the output
(1)
. The CLKRSLR bit controls slew rate limiting.
clock
Note 1: If the base clock rate is selected without
a divider, the output clock will always have a duty cycle equal to that of the source clock, unless a 0% duty cycle is selected. If the clock divider is set to base clock/2, then 25% and 75% duty cycle accuracy will be dependent upon the source clock.
For information on using the reference clock output with the modulator module, see Section 23.0 “Data
Signal Modulator”.

6.3 Conflicts with the CLKR Pin

There are two cases when the reference clock output signal cannot be output to the CLKR pin, if:
• LP, XT or HS Oscillator mode is selected.
• CLKOUT function is enabled.
Even if either of these cases are true, the module can still be enabled and the reference clock signal may be used in conjunction with the modulator module.

6.3.1 OSCILLATOR MODES

If LP, XT or HS oscillator modes are selected, the OSC2/CLKR pin must be used as an oscillator input pin and the CLKR output cannot be enabled. See
Section 5.2 “Clock Source Types” for more informa-
tion on different oscillator modes.

6.3.2 CLKOUT FUNCTION

The CLKOUT function has a higher priority than the reference clock module. Therefore, if the CLKOUT function is enabled by the CLKOUTEN tion Word 1, F pin. Reference Section 4.0 “Device Configuration” for more information.
OSC/4 will always be output on the port
bit in Configura-

6.4 Operation During Sleep

As the reference clock module relies on the system clock as its source, and the system clock is disabled in Sleep, the module does not function in Sleep, even if an external clock source or the Timer1 clock source is configured as the system clock. The module outputs will remain in their current state until the device exits Sleep.

6.1 Slew Rate

The slew rate limitation on the output port pin can be disabled. The slew rate limitation can be removed by clearing the CLKRSLR bit in the CLKRCON register.

6.2 Effects of a Reset

Upon any device Reset, the reference clock module is disabled. The user's firmware is responsible for initializing the module before enabling the output. The registers are reset to their default values.
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6.5 Reference Clock Control Register

REGISTER 6-1: CLKRCON: REFERENCE CLOCK CONTROL REGISTER

R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
CLKREN CLKROE CLKRSLR CLKRDC<1:0> CLKRDIV<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CLKREN: Reference Clock Module Enable bit
1 = Reference Clock module is enabled 0 = Reference Clock module is disabled
bit 6 CLKROE: Reference Clock Output Enable bit
1 = Reference Clock output is enabled on CLKR pin 0 = Reference Clock output disabled on CLKR pin
bit 5 CLKRSLR: Reference Clock Slew Rate Control limiting enable bit
1 = Slew Rate limiting is enabled 0 = Slew Rate limiting is disabled
bit 4-3 CLKRDC<1:0>: Reference Clock Duty Cycle bits
11 = Clock outputs duty cycle of 75% 10 = Clock outputs duty cycle of 50% 01 = Clock outputs duty cycle of 25% 00 = Clock outputs duty cycle of 0%
bit 2-0 CLKRDIV<2:0> Reference Clock Divider bits
111 = Base clock value divided by 128 110 = Base clock value divided by 64 101 = Base clock value divided by 32 100 = Base clock value divided by 16 011 = Base clock value divided by 8 010 = Base clock value divided by 4 001 = Base clock value divided by 2 000 = Base clock value
(2)
(1)
(3)
Note 1: In this mode, the 25% and 75% duty cycle accuracy will be dependent on the source clock duty cycle.
2: In this mode, the duty cycle will always be equal to the source clock duty cycle, unless a duty cycle of 0%
is selected.
3: To route CLKR to pin, CLKOUTEN
Word 1 = 0 will result in F
DS41391D-page 70 2011 Microchip Technology Inc.
OSC/4. See Section 6.3 “Conflicts with the CLKR Pin” for details.
of Configuration Word 1 = 1 is required. CLKOUTEN of Configuration
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TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH REFERENCE CLOCK SOURCES

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
CLKRCON CLKREN CLKROE CLKRSLR CLKRDC1 CLKRDC0 Legend: = unimplemented locations read as ‘0’. Shaded cells are not used by reference clock sources.
CLKRDIV2 CLKRDIV1 CLKRDIV0

TABLE 6-2: SUMMARY OF CONFIGURATION WORD WITH REFERENCE CLOCK SOURCES

Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0
CONFIG1
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by reference clock sources.
13:8
7:0
FCMEN IESO CLKOUTEN BOREN1 BOREN0 CPD
CP MCLRE PWRTE WDTE1 WDTE0 FOSC2 FOSC1 FOSC0
Register on Page
70
Register on Page
44
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NOTES:
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External Reset
MCLR
VDD
WDT
Time-out
Power-on
Reset
LFINTOSC
PWRT
64 ms
PWRTEN
Brown-out
Reset
BOR
RESET Instruction
Stack
Pointer
Stack Overflow/Underflow Reset
Sleep
MCLRE
Enable
Device Reset
Zero
Programming Mode Exit

7.0 RESETS

There are multiple ways to reset this device:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
•MCLR
•WDT Reset
RESET instruction
• Stack Overflow
• Stack Underflow
• Programming mode exit
To a llo w V can be enabled to extend the Reset time after a BOR or POR event.
A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 7-1.

FIGURE 7-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT

Reset
DD to stabilize, an optional power-up timer
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7.1 Power-on Reset (POR)

The POR circuit holds the device in Reset until VDD has reached an acceptable level for minimum operation. Slow rising V performance may require greater than minimum V The PWRT, BOR or MCLR extend the start-up period until all device operation conditions have been met.

7.1.1 POWER-UP TIMER (PWRT)

The Power-up Timer provides a nominal 64 ms time­out on POR or Brown-out Reset.
The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the V rise to an acceptable level. The Power-up Timer is enabled by clearing the PWRTE bit in Configuration Word 1.
The Power-up Timer starts after the release of the POR and BOR.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).

TABLE 7-1: BOR OPERATING MODES

BOREN<1:0> SBOREN Device Mode BOR Mode
DD, fast operating speeds or analog
DD.
features can be used to
DD to
11 X X Active Waits for BOR ready
Awake Active
10 X
Sleep Disabled

7.2 Brown-Out Reset (BOR)

The BOR circuit holds the device in Reset when Vdd reaches a selectable minimum level. Between the POR and BOR, complete voltage range coverage for execution protection can be implemented.
The Brown-out Reset module has four operating modes controlled by the BOREN<1:0> bits in Configu­ration Word 1. The four operating modes are:
• BOR is always on
• BOR is off when in Sleep
• BOR is controlled by software
• BOR is always off
Refer to Tab le 7 -1 for more information.
The Brown-out Reset voltage level is selectable by configuring the BORV bit in Configuration Word 2.
DD noise rejection filter prevents the BOR from trig-
A V gering on small events. If V duration greater than parameter T will reset. See Figure 7-2 for more information.
Device Operation
upon release of POR
DD falls below VBOR for a
BORDC, the device
Device Operation
upon wake- up from
Sleep
(1)
Waits for BOR ready
01
00 X X Disabled Begins immediately
Note 1: Even though this case specifically waits for the BOR, the BOR is already operating, so there is no delay in
start-up.
1
X
0 Disabled Begins immediately

7.2.1 BOR IS ALWAYS ON

When the BOREN bits of Configuration Word 1 are set to ‘11’, the BOR is always on. The device start-up will be delayed until the BOR is ready and V than the BOR threshold.
BOR protection is active during Sleep. The BOR does not delay wake-up from Sleep.
DD is higher

7.2.2 BOR IS OFF IN SLEEP

When the BOREN bits of Configuration Word 1 are set to ‘10’, the BOR is on, except in Sleep. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold.
BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready.
Active Begins immediately

7.2.3 BOR CONTROLLED BY SOFTWARE

When the BOREN bits of Configuration Word 1 are set to ‘01’, the BOR is controlled by the SBOREN bit of the BORCON register. The device start-up is not delayed by the BOR ready condition or the V
BOR protection begins as soon as the BOR circuit is ready. The status of the BOR circuit is reflected in the BORRDY bit of the BORCON register.
BOR protection is unchanged by Sleep.
DD level.
DS41391D-page 74 2011 Microchip Technology Inc.
FIGURE 7-2: BROWN-OUT SITUATIONS
TPWRT
(1)
VBOR
V
DD
Internal
Reset
VBOR
V
DD
Internal
Reset
TPWRT
(1)
< TPWRT
TPWRT
(1)
VBOR
V
DD
Internal
Reset
Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’.
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REGISTER 7-1: BORCON: BROWN-OUT RESET CONTROL REGISTER
R/W-1/u U-0 U-0 U-0 U-0 U-0 U-0 R-q/u
SBOREN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 SBOREN: Software Brown-out Reset Enable bit
bit 6-1 Unimplemented: Read as ‘0’ bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit
—BORRDY
If BOREN <1:0> in Configuration Word 1
01:
SBOREN is read/write, but has no effect on the BOR. If BOREN <1:0> in Configuration Word 1 =
01:
1 = BOR Enabled 0 = BOR Disabled
1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive
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7.3 MCLR

The MCLR is an optional external input that can reset the device. The MCLR MCLRE bit of Configuration Word 1 and the LVP bit of Configuration Word 2 (Ta b le 7 - 2).
function is controlled by the

TABLE 7-2: MCLR CONFIGURATION

MCLRE LVP MCLR
00Disabled 10Enabled x1Enabled

7.3.1 MCLR ENABLED

When MCLR is enabled and the pin is held low, the device is held in Reset. The MCLR
DD through an internal weak pull-up.
V
The device has a noise filter in the MCLR The filter will detect and ignore small pulses.
Note: A Reset does not drive the MCLR pin low.
pin is connected to
Reset path.

7.3.2 MCLR DISABLED

When MCLR is disabled, the pin functions as a general purpose input and the internal weak pull-up is under software control. See Section 12.2 “PORTA Regis-
ters” for more information.

7.4 Watchdog Timer (WDT) Reset

The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. See Section 10.0
“Watchdog Timer” for more information.

7.7 Programming Mode Exit

Upon exit of Programming mode, the device will behave as if a POR had just occurred.

7.8 Power-Up Timer

The Power-up Timer optionally delays device execution after a BOR or POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running.
The Power-up Timer is controlled by the PWRTE Configuration Word 1.
bit of

7.9 Start-up Sequence

Upon the release of a POR or BOR, the following must occur before the device will begin executing:
1. Power-up Timer runs to completion (if enabled).
2. Oscillator start-up timer runs to completion (if
required for oscillator source).
3. MCLR
The total time-out will vary based on oscillator configu­ration and Power-up Timer configuration. See
Section 5.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for more information.
The Power-up Timer and oscillator start-up timer run independently of MCLR long enough, the Power-up Timer and oscillator start­up timer will expire. Upon bringing MCLR device will begin execution immediately (see Figure 7-
3). This is useful for testing purposes or to synchronize
more than one device operating in parallel.
must be released (if enabled).
Reset. If MCLR is kept low
high, the

7.5 RESET Instruction

A RESET instruction will cause a device Reset. The RI bit in the PCON register will be set to ‘0’. See Ta b le 7 -4 for default conditions after a RESET instruction has occurred.

7.6 Stack Overflow/Underflow Reset

The device can reset when the Stack Overflows or Underflows. The STKOVF or STKUNF bits of the PCON register indicate the Reset condition. These Resets are enabled by setting the STVREN bit in Configuration Word
2. See Section 3 .4.2 “Overflow/Underflow Reset”for more information.
DS41391D-page 76 2011 Microchip Technology Inc.

FIGURE 7-3: RESET START-UP SEQUENCE

TOST
TMCLR
TPWRT
VDD
Internal POR
Power-Up Timer
MCLR
Internal RESET
Oscillator Modes
Oscillator Start-Up Timer
Oscillator
F
OSC
Internal Oscillator
Oscillator
F
OSC
External Clock (EC)
CLKIN
F
OSC
External Crystal
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7.10 Determining the Cause of a Reset

Upon any Reset, multiple bits in the STATUS and PCON register are updated to indicate the cause of the Reset. Ta b le 7 - 3 and Ta b le 7 - 4 show the Reset condi­tions of these registers.

TABLE 7-3: RESET STATUS BITS AND THEIR SIGNIFICANCE

STKOVF STKUNF RMCLR RI POR BOR TO PD Condition
00110x11Power-on Reset 00110x0xIllegal, TO 00110xx0Illegal, PD is set on POR 0011u011Brown-out Reset uuuuuu0uWDT Reset uuuuuu00WDT Wake-up from Sleep uuuuuu10Interrupt Wake-up from Sleep uu0uuuuuMCLR uu0uuu10MCLR u u u 0 u u u u RESET Instruction Executed 1uuuuuuuStack Overflow Reset (STVREN = 1) u1uuuuuuStack Underflow Reset (STVREN = 1)
is set on POR
Reset during normal operation
Reset during Sleep
(1)
(2)
STATUS
Register
---1 0uuu uu-- uuuu
PCON
Register
TABLE 7-4: RESET CONDITION FOR SPECIAL REGISTERS
Condition
Power-on Reset 0000h ---1 1000 00-- 110x
MCLR
Reset during normal operation 0000h ---u uuuu uu-- 0uuu
MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu WDT Reset 0000h ---0 uuuu uu-- uuuu WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu Brown-out Reset 0000h ---1 1uuu 00-- 11u0
Interrupt Wake-up from Sleep PC + 1 RESET Instruction Executed 0000h ---u uuuu uu-- u0uu Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on
the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.
2: If a Status bit is not implemented, that bit will be read as ‘0’.
Program
Counter
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7.11 Power Control (PCON) Register

The Power Control (PCON) register contains flag bits to differentiate between a:
• Power-on Reset (POR
• Brown-out Reset (BOR)
• Reset Instruction Reset (RI
•MCLR Reset (RMCLR)
• Stack Underflow Reset (STKUNF)
• Stack Overflow Reset (STKOVF)
The PCON register bits are shown in Register 7-2.

REGISTER 7-2: PCON: POWER CONTROL REGISTER

R/W/HS-0/q R/W/HS-0/q U-0 U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u
STKOVF STKUNF
bit 7 bit 0
Legend:
HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
)
)
RMCLR
RI POR BOR
bit 7 STKOVF: Stack Overflow Flag bit
1 = A Stack Overflow occurred 0 = A Stack Overflow has not occurred or set to ‘0’ by firmware
bit 6 STKUNF: Stack Underflow Flag bit
1 = A Stack Underflow occurred 0 = A Stack Underflow has not occurred or set to ‘0’ by firmware
bit 5-4 Unimplemented: Read as ‘0’ bit 3 RMCLR
1 = A MCLR Reset has not occurred or set to ‘1’ by firmware 0 = A MCLR
bit 2 RI
1 = A RESET instruction has not been executed or set to ‘1’ by firmware 0 = A RESET instruction has been executed (set to ‘0’ in hardware upon executing a RESET instruction)
bit 1 POR
1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR
1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset
: MCLR Reset Flag bit
Reset has occurred (set to ‘0’ in hardware when a MCLR Reset occurs)
: RESET Instruction Flag bit
: Power-on Reset Status bit
: Brown-out Reset Status bit
occurs)
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TABLE 7-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Register on Page
BORCON SBOREN
PCON STKOVF STKUNF
STATUS
WDTCON
Legend: — = unimplemented bit, reads as ‘0’. Shaded cells are not used by Resets. Note 1: Other (non Power-up) Resets include MCLR
—TOPD Z DC C
WDTPS4 WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN 99
BORRDY 75
—RMCLRRI POR BOR 79
Reset and Watchdog Timer Reset during normal operation.
21
DS41391D-page 80 2011 Microchip Technology Inc.

8.0 INTERRUPTS

D
CK
R
Q
D
CK
R
Q
RBx
IOCBNx
IOCBPx
Q2
D
CK
S
Q
Q4Q1
Data bus =
0 or 1
Write IOCBFx
IOCIE
To data bus
IOCBFx
Edge
Detect
IOC interrupt
to CPU core
From all other
IOCBFx individual
pin detectors
Q1
Q2 Q3 Q4
Q4Q1
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q4
Q4Q1
Q4Q1
Q4Q1
The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode.
This chapter contains the following information for Interrupts:
• Operation
• Interrupt Latency
• Interrupts During Sleep
•INT Pin
• Automatic Context Saving
Many peripherals produce Interrupts. Refer to the corresponding chapters for details.
A block diagram of the interrupt logic is shown in
Figure 8-1.

FIGURE 8-1: INTERRUPT LOGIC

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8.1 Operation

Interrupts are disabled upon any device Reset. They are enabled by setting the following bits:
• GIE bit of the INTCON register
• Interrupt Enable bit(s) for the specific interrupt events)
• PEIE bit of the INTCON register (if the Interrupt Enable bit of the interrupt event is contained in the PIEx registers)
The INTCON, PIRx registers record individual inter­rupts via interrupt flag bits. Interrupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits.
The following events happen when an interrupt event occurs while the GIE bit is set:
• Current prefetched instruction is flushed
• GIE bit is cleared
• Current Program Counter (PC) is pushed onto the stack
• Critical registers are automatically saved to the shadow registers (See Section 8.5 “Automatic
Context Saving”.”)
• PC is loaded with the interrupt vector 0004h
The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector.
The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit.
For additional information on a specific interrupt’s operation, refer to its peripheral chapter.

8.2 Interrupt Latency

Interrupt latency is defined as the time from when the interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous interrupts is 3 or 4 instruction cycles. For asynchronous interrupts, the latency is 3 to 5 instruction cycles, depending on when the interrupt occurs. See Figure 8-2 and Figure 8.3 for more details.
Note 1: Individual interrupt flag bits are set,
regardless of the state of any other enable bits.
2: All interrupts will be ignored while the GIE
bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again.
DS41391D-page 82 2011 Microchip Technology Inc.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT
PC 0004h 0005h
PC
Inst(0004h)NOP
GIE
Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4
1 Cycle Instruction at PC
PC
Inst(0004h)NOP
2 Cycle Instruction at PC
FSR ADDR PC+1 PC+2 0004h 0005h
PC
Inst(0004h)NOP
GIE
PCPC-1
3 Cycle Instruction at PC
Execute
Interrupt
Inst(PC)
Interrupt Sampled during Q1
Inst(PC)
PC-1 PC+1
NOP
PC
New PC/
PC+1
0005hPC-1
PC+1/FSR
ADDR
0004h
NOP
Interrupt
GIE
Interrupt
INST(PC) NOPNOP
FSR ADDR PC+1 PC+2 0004h 0005h
PC
Inst(0004h)NOP
GIE
PCPC-1
3 Cycle Instruction at PC
Interrupt
INST(PC) NOPNOP
NOP
Inst(0005h)
Execute
Execute
Execute
PIC16(L)F1826/27

FIGURE 8-2: INTERRUPT LATENCY

2011 Microchip Technology Inc. DS41391D-page 83
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Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT
INT pin
INTF
GIE
INSTRUCTION FLOW
PC
Instruction Fetched
Instruction Executed
Interrupt Latency
PC PC + 1
PC + 1
0004h
0005h
Inst (0004h)
Inst (0005h)
Dummy Cycle
Inst (PC)
Inst (PC + 1)
Inst (PC – 1)
Inst (0004h)
Dummy Cycle
Inst (PC)
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-5 T
CY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT not available in all Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in Section 30.0 “Electrical Specifications””. 5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1)
(2)
(3)
(4)
(5)
(1)

FIGURE 8-3: INT PIN INTERRUPT TIMING

DS41391D-page 84 2011 Microchip Technology Inc.

8.3 Interrupts During Sleep

Some interrupts can be used to wake from Sleep. To wake from Sleep, the peripheral must be able to operate without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep.
On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to Section 9.0 “Power-
Down Mode (Sleep)” for more details.

8.4 INT Pin

The INT pin can be used to generate an asynchronous edge-triggered interrupt. This interrupt is enabled by setting the INTE bit of the INTCON register. The INTEDG bit of the OPTION_REG register determines on which edge the interrupt will occur. When the INTEDG bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector.
PIC16(L)F1826/27

8.5 Automatic Context Saving

Upon entering an interrupt, the return PC address is saved on the stack. Additionally, the following registers are automatically saved in the Shadow registers:
• W register
• STATUS register (except for TO
• BSR register
• FSR registers
• PCLATH register
Upon exiting the Interrupt Service Routine, these regis­ters are automatically restored. Any modifications to these registers during the ISR will be lost. If modifica­tions to any of these registers are desired, the corre­sponding Shadow register should be modified and the value will be restored when exiting the ISR. The Shadow registers are available in Bank 31 and are readable and writable. Depending on the user’s appli­cation, other registers may also need to be saved.
and PD)
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8.6 Interrupt Control Registers

8.6.1 INTCON REGISTER

The INTCON register is a readable and writable register, that contains the various enable and flag bits for TMR0 register overflow, interrupt-on-change and external INT pin interrupts.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropri­ate interrupt flag bits are clear prior to enabling an interrupt.
REGISTER 8-1: INTCON: INTERRUPT CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0
GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all active interrupts 0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts
bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit
1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt
bit 4 INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt 0 = Disables the INT external interrupt
bit 3 IOCIE: Interrupt-on-Change Enable bit
1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change
bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed 0 = TMR0 register did not overflow
bit 1 INTF: INT External Interrupt Flag bit
1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur
bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit
1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state
(1)
(1)
Note 1: The IOCIF Flag bit is read-only and cleared when all the Interrupt-on-Change flags in the IOCBF register
have been cleared by software.
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8.6.2 PIE1 REGISTER

The PIE1 register contains the interrupt enable bits, as shown in Register 8-2.
REGISTER 8-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit
1 = Enables the Timer1 Gate Acquisition interrupt 0 = Disables the Timer1 Gate Acquisition interrupt
bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit
1 = Enables the ADC interrupt 0 = Disables the ADC interrupt
bit 5 RCIE: USART Receive Interrupt Enable bit
1 = Enables the USART receive interrupt 0 = Disables the USART receive interrupt
bit 4 TXIE: USART Transmit Interrupt Enable bit
1 = Enables the USART transmit interrupt 0 = Disables the USART transmit interrupt
bit 3 SSP1IE: Synchronous Serial Port 1 (MSSP1) Interrupt Enable bit
1 = Enables the MSSP1 interrupt 0 = Disables the MSSP1 interrupt
bit 2 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt
bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
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8.6.3 PIE2 REGISTER

The PIE2 register contains the interrupt enable bits, as shown in Register 8-3.
REGISTER 8-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0
OSFIE C2IE C1IE EEIE BCL1IE —CCP2IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 OSFIE: Oscillator Fail Interrupt Enable bit
1 = Enables the Oscillator Fail interrupt 0 = Disables the Oscillator Fail interrupt
bit 6 C2IE: Comparator C2 Interrupt Enable bit
1 = Enables the Comparator C2 interrupt 0 = Disables the Comparator C2 interrupt
bit 5 C1IE: Comparator C1 Interrupt Enable bit
1 = Enables the Comparator C1 interrupt 0 = Disables the Comparator C1 interrupt
bit 4 EEIE: EEPROM Write Completion Interrupt Enable bit
1 = Enables the EEPROM Write Completion interrupt 0 = Disables the EEPROM Write Completion interrupt
bit 3 BCL1IE: MSSP1 Bus Collision Interrupt Enable bit
1 = Enables the MSSP1 Bus Collision Interrupt 0 = Disables the MSSP1 Bus Collision Interrupt
bit 2-1 Unimplemented: Read as ‘0’ bit 0 CCP2IE: CCP2 Interrupt Enable bit
1 = Enables the CCP2 interrupt 0 = Disables the CCP2 interrupt
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
(1)
Note 1: PIC16(L)F1827 only.
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8.6.4 PIE3 REGISTER

The PIE3 register contains the interrupt enable bits, as shown in Register 8-4.
REGISTER 8-4: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0
CCP4IE CCP3IE TMR6IE —TMR4IE—
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’ bit 5 CCP4IE: CCP4 Interrupt Enable bit
1 = Enables the CCP4 interrupt 0 = Disables the CCP4 interrupt
bit 4 CCP3IE: CCP3 Interrupt Enable bit
1 = Enables the CCP3 interrupt 0 = Disables the CCP3 interrupt
bit 3 TMR6IE: TMR6 to PR6 Match Interrupt Enable bit
1 = Enables the TMR6 to PR6 Match interrupt 0 = Disables the TMR6 to PR6 Match interrupt
bit 2 Unimplemented: Read as ‘0’ bit 1 TMR4IE: TMR4 to PR4 Match Interrupt Enable bit
1 = Enables the TMR4 to PR4 Match interrupt 0 = Disables the TMR4 to PR4 Match interrupt
bit 0 Unimplemented: Read as ‘0
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
(1)
Note 1: This register is only available on PIC16(L)F1827.
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8.6.5 PIE4 REGISTER
The PIE4 register contains the interrupt enable bits, as shown in Register 8-5.
REGISTER 8-5: PIE4: PERIPHERAL INTERRUPT ENABLE REGISTER 4
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
BCL2IE SSP2IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’ bit 1 BCL2IE: MSSP2 Bus Collision Interrupt Enable bit
1 = Enables the MSSP2 Bus Collision Interrupt 0 = Disables the MSSP2 Bus Collision Interrupt
bit 0 SSP2IE: Master Synchronous Serial Port 2 (MSSP2) Interrupt Enable bit
1 = Enables the MSSP2 interrupt 0 = Disables the MSSP2 interrupt
(1)
Note 1: The PIE4 register is available only on the
PIC16(L)F1827 device.
2: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
(1)
Note 1: This register is only available on PIC16(L)F1827.
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8.6.6 PIR1 REGISTER

The PIR1 register contains the interrupt flag bits, as shown in Register 8-6.
REGISTER 8-6: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
R/W-0/0 R/W-0/0 R-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt.
bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 6 ADIF: A/D Converter Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 5 RCIF: USART Receive Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 4 TXIF: USART Transmit Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 3 SSP1IF: Synchronous Serial Port 1 (MSSP1) Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 2 CCP1IF: CCP1 Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
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8.6.7 PIR2 REGISTER

The PIR2 register contains the interrupt flag bits, as shown in Register 8-7.
REGISTER 8-7: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0
OSFIF C2IF C1IF EEIF BCL1IF —CCP2IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt.
(1)
bit 7 OSFIF: Oscillator Fail Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 6 C2IF: Comparator C2 Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 5 C1IF: Comparator C1 Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 4 EEIF: EEPROM Write Completion Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 3 BCL1IF: MSSP1 Bus Collision Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 2-1 Unimplemented: Read as ‘0’ bit 0 CCP2IF: CCP2 Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
Note 1: PIC16(L)F1827 only.
(1)
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8.6.8 PIR3 REGISTER

The PIR3 register contains the interrupt flag bits, as shown in Register 8-8.
REGISTER 8-8: PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0
CCP4IF CCP3IF TMR6IF —TMR4IF—
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt.
(1)
bit 7-6 Unimplemented: Read as ‘0’ bit 5 CCP4IF: CCP4 Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 4 CCP3IF: CCP3 Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 3 TMR6IF: TMR6 to PR6 Match Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 2 Unimplemented: Read as ‘0’ bit 1 TMR4IF: TMR4 to PR4 Match Interrupt Flag bit
1 = Interrupt is pending 0 = Interrupt is not pending
bit 0 Unimplemented: Read as ‘0 Note 1: This register is only available on PIC16(L)F1827.
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8.6.9 PIR4 REGISTER
The PIR4 register contains the interrupt flag bits, as shown in Register 8-9.
(1)
Note 1: The PIR4 register is available only on the
PIC16(L)F1827 device.
2: Interrupt flag bits are set when an inter-
rupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt.
REGISTER 8-9: PIR4: PERIPHERAL INTERRUPT REQUEST REGISTER 4
(1)
U-0 U-0 U-0 U-0 U-0 U-0 R/W/HS-0/0 R/W/HS-0/0
BCL2IF SSP2IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware
bit 7-2 Unimplemented: Read as ‘0’ bit 1 BCL2IF: MSSP2 Bus Collision Interrupt Flag bit
1 = A Bus Collision was detected (must be cleared in software) 0 = No Bus collision was detected
bit 0 SSP2IF: Master Synchronous Serial Port 2 (MSSP2) Interrupt Flag bit
1 = The Transmission/Reception/Bus Condition is complete (must be cleared in software) 0 = Waiting to Transmit/Receive/Bus Condition in progress
Note 1: This register is only available on PIC16(L)F1827.
TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 86
OPTION_REG
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 87
PIE2 OSFIE C2IE C1IE EEIE BCL1IE
(1)
PIE3
(1)
PIE4
PIR1
PIR2
(1)
PIR3
(1)
PIR4
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by Interrupts. Note 1: PIC16(L)F1827 only.
WPUEN INTEDG TMR0CS TMR0SE PSA PS2 PS1 PS0 177
CCP4IE CCP3IE TMR6IE —TMR4IE—89
TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF
OSFIF C2IF C1IF EEIF BCL1IF
CCP4IF CCP3IF TMR6IF —TMR4IF—93
—CCP2IF
CCP2IE
BCL2IE SSP2IE
BCL2IF SSP2IF
Register on Page
(1)
(1)
88
90
91
92
94
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9.0 POWER-DOWN MODE (SLEEP)

The Power-Down mode is entered by executing a SLEEP instruction.
Upon entering Sleep mode, the following conditions exist:
1. WDT will be cleared but keeps running, if enabled for operation during Sleep.
bit of the STATUS register is cleared.
2. PD
3. TO bit of the STATUS register is set.
4. CPU clock is disabled.
5. 31 kHz LFINTOSC is unaffected and peripherals that operate from it may continue operation in Sleep.
6. Timer1 oscillator is unaffected and peripherals that operate from it may continue operation in Sleep.
7. ADC is unaffected, if the dedicated FRC clock is selected.
8. Capacitive Sensing oscillator is unaffected.
9. I/O ports maintain the status they had before SLEEP was executed (driving high, low or high­impedance).
10. Resets other than WDT are not affected by Sleep mode.
Refer to individual chapters for more details on peripheral operation during Sleep.
To minimize current consumption, the following condi­tions should be considered:
• I/O pins should not be floating
• External circuitry sinking current from I/O pins
• Internal circuitry sourcing current from I/O pins
• Current draw from pins with internal weak pull-ups
• Modules using 31 kHz LFINTOSC
• Modules using Timer1 oscillator
I/O pins that are high-impedance inputs should be pulled to V rents caused by floating inputs.
Examples of internal circuitry that might be sourcing current include modules such as the DAC and FVR modules. See Section 17.0 “Digital-to-Analog Con-
verter (DAC) Module” and Section 14.0 “Fixed Volt­age Reference (FVR)” for more information on these
modules.
DD or VSS externally to avoid switching cur-

9.1 Wake-up from Sleep

The device can wake-up from Sleep through one of the following events:
1. External Reset input on MCLR
2. BOR Reset, if enabled
3. POR Reset
4. Watchdog Timer, if enabled
5. Any external interrupt
6. Interrupts by peripherals capable of running dur­ing Sleep (see individual peripheral for more information)
The first three events will cause a device Reset. The last three events are considered a continuation of pro­gram execution. To determine whether a device Reset or wake-up event occurred, refer to Section 7.10
“Determining the Cause of a Reset”.
When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is enabled, the device executes the instruction after the SLEEP instruction, the device will then call the Interrupt Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up.
pin, if enabled
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Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
(1)
CLKOUT
(2)
Interrupt flag
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction Fetched
Instruction Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC - 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency
(4)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h)
Inst(0005h)
Inst(0004h)
Dummy Cycle
PC + 2 0004h 0005h
Dummy Cycle
T
OST
(3)
PC + 2
Note 1: XT, HS or LP Oscillator mode assumed.
2: CLKOUT is not available in XT, HS, or LP Oscillator modes, but shown here for timing reference. 3: T
OST = 1024 TOSC (drawing not to scale). This delay applies only to XT, HS or LP Oscillator modes.
4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.

9.1.1 WAKE-UP USING INTERRUPTS

When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction
- SLEEP instruction will execute as a NOP.
- WDT and WDT prescaler will not be cleared bit of the STATUS register will not be set
-TO
-PD
bit of the STATUS register will not be
cleared.
• If the interrupt occurs during or after the execu-
tion of a SLEEP instruction
- SLEEP instruction will be completely exe-
cuted
- Device will immediately wake-up from Sleep
- WDT and WDT prescaler will be cleared
-TO
bit of the STATUS register will be set
-PD bit of the STATUS register will be cleared.
Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test
bit. If the PD bit is set, the SLEEP instruction
the PD was executed as a NOP.
FIGURE 9-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT
TABLE 9-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 91 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 134 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 134 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 134
PIE1 TMR1GIE ADIE RCIE
PIE4
(1)
PIE2
PIR1
PIR2
PIR4
(1)
STATUS
WDTCON
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-down mode. Note 1: PIC16(L)F1827 only.
DS41391D-page 96 2011 Microchip Technology Inc.
OSFIE C2IE C1IE EEIE BCL1IE
TMR1GIF ADIF RCIF
OSFIF C2IF C1IF EEIF BCL1IF CCP2IF
—TOPD Z DC C — WDTPS4 WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN 105
TXIE SSP1IE CCP1IE TMR2IE TMR1IE 92
TXIF SSP1IF CCP1IF TMR2IF TMR1IF
CCP2IE
BCL2IE SSP2IE
BCL2IF SSP2IF
(1)
(1)
Register on
Page
93 95 96 97 99 23

10.0 WATCHDOG TIMER

LFINTOSC
23-bit Programmable
Prescaler WDT
WDT Time-out
WDTPS<4:0>
SWDTEN
Sleep
WDTE<1:0> = 11
WDTE<1:0> = 01
WDTE<1:0> = 10
The Watchdog Timer is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events.
The WDT has the following features:
• Independent clock source
• Multiple operating modes
- WDT is always on
- WDT is off when in Sleep
- WDT is controlled by software
- WDT is always off
• Configurable time-out period is from 1 ms to 256 seconds (typical)
• Multiple Reset conditions
• Operation during Sleep

FIGURE 10-1: WATCHDOG TIMER BLOCK DIAGRAM

PIC16(L)F1826/27
2011 Microchip Technology Inc. DS41391D-page 97
PIC16(L)F1826/27

10.1 Independent Clock Source

The WDT derives its time base from the 31 kHz LFINTOSC internal oscillator. Time intervals in this chapter are based on a nominal interval of 1 ms. See
Section 30.0 “Electrical Specifications” for the
LFINTOSC tolerances.

10.2 WDT Operating Modes

The Watchdog Timer module has four operating modes controlled by the WDTE<1:0> bits in Configuration Word 1. See Table 10-1.

10.2.1 WDT IS ALWAYS ON

When the WDTE bits of Configuration Word 1 are set to ‘11’, the WDT is always on.
WDT protection is active during Sleep.

10.2.2 WDT IS OFF IN SLEEP

When the WDTE bits of Configuration Word 1 are set to ‘10’, the WDT is on, except in Sleep.
WDT protection is not active during Sleep.

10.2.3 WDT CONTROLLED BY SOFTWARE

When the WDTE bits of Configuration Word 1 are set to ‘01’, the WDT is controlled by the SWDTEN bit of the WDTCON register.
WDT protection is unchanged by Sleep. See
Table 10-1 for more details.
TABLE 10-1: WDT OPERATING MODES
WDTE<1:0> SWDTEN
Device
Mode
WDT
Mode

10.3 Time-Out Period

The WDTPS bits of the WDTCON register set the time-out period from 1 ms to 256 seconds (nominal). After a Reset, the default time-out period is 2 seconds.

10.4 Clearing the WDT

The WDT is cleared when any of the following condi­tions occur:
•Any Reset
CLRWDT instruction is executed
• Device enters Sleep
• Device wakes up from Sleep
• Oscillator fail event
• WDT is disabled
• Oscillator Start-up TImer (OST) is running
See Table 10-2 for more information.

10.5 Operation During Sleep

When the device enters Sleep, the WDT is cleared. If the WDT is enabled during Sleep, the WDT resumes counting.
When the device exits Sleep, the WDT is cleared again. The WDT remains clear until the OST, if enabled, completes. See Section 5.0 “Oscillator
Module (With Fail-Safe Clock Monitor)” for more
information on the OST.
When a WDT time-out occurs while the device is in Sleep, no Reset is generated. Instead, the device wakes up and resumes operation. The TO in the STATUS register are changed to indicate the event. See Register 3-1 for more information.
and PD bits
11 X XActive
10 X
1
01
0 Disabled
00 X X Disabled
Awake Active
Sleep Disabled
Active
X

TABLE 10-2: WDT CLEARING CONDITIONS

Conditions WDT
WDTE<1:0> = 00 WDTE<1:0> = 01 and SWDTEN = 0 WDTE<1:0> = 10 and enter Sleep CLRWDT Command Oscillator Fail Detected Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST Change INTOSC divider (IRCF bits) Unaffected
DS41391D-page 98 2011 Microchip Technology Inc.
Cleared
PIC16(L)F1826/27

10.6 Watchdog Control Register

REGISTER 10-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER

U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0
WDTPS<4:0> SWDTEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’ bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits
Bit Value = Prescale Rate
00000 = 1:32 (Interval 1 ms nominal) 00001 = 1:64 (Interval 2 ms nominal) 00010 = 1:128 (Interval 4 ms nominal) 00011 = 1:256 (Interval 8 ms nominal) 00100 = 1:512 (Interval 16 ms nominal) 00101 = 1:1024 (Interval 32 ms nominal) 00110 = 1:2048 (Interval 64 ms nominal) 00111 = 1:4096 (Interval 128 ms nominal) 01000 = 1:8192 (Interval 256 ms nominal) 01001 = 1:16384 (Interval 512 ms nominal) 01010 = 1:32768 (Interval 1s nominal) 01011 = 1:65536 (Interval 2s nominal) (Reset value) 01100 = 1:131072 (2 01101 = 1:262144 (2 01110 = 1:524288 (2 01111 = 1:1048576 (2 10000 = 1:2097152 (2 10001 = 1:4194304 (2 10010 = 1:8388608 (2
17
) (Interval 4s nominal)
18
) (Interval 8s nominal)
19
) (Interval 16s nominal)
20
) (Interval 32s nominal)
21
) (Interval 64s nominal)
22
) (Interval 128s nominal)
23
) (Interval 256s nominal)
(1)
10011 = Reserved. Results in minimum interval (1:32)
11111 = Reserved. Results in minimum interval (1:32)
bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit
If WDTE<1:0> = This bit is ignored. If WDTE<1:0> =
1 = WDT is turned on 0 = WDT is turned off
If WDTE<1:0> = This bit is ignored.
Note 1: Times are approximate. WDT time is based on 31 kHz LFINTOSC.
2011 Microchip Technology Inc. DS41391D-page 99
00:
01:
1x:
PIC16(L)F1826/27

TABLE 10-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
OSCCON
STATUS
WDTCON Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer.
IRCF<3:0> —SCS<1:0>
—TOPD Z DC C
WDTPS<4:0> SWDTEN

TABLE 10-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER

Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0
CONFIG1
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.
13:8
7:0
FCMEN IESO CLKOUTEN BOREN<1:0> CPD
CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
Register on Page
69
21
99
Register on Page
44
DS41391D-page 100 2011 Microchip Technology Inc.
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