Note the following details of the code protection feature on Microchip devices:
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
K
logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
DS41391D-page 2 2011 Microchip Technology Inc.
PIC16(L)F1826/27
18/20/28-Pin Flash Microcontrollers wit h na noWatt XLP Techno logy
High-Performance RISC CPU:
• C Compiler Optimized Architecture
• 256 bytes Data EEPROM
• Up to 8 Kbytes Linear Program Memory
Addressing
• Up to 384 bytes Linear Data Memory Addressing
• Interrupt Capability with Automatic Context Saving
• 16-Level Deep Hardware Stack with Optional
Overflow/Underflow Reset
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 101
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 135
15.0 Temperature Indicator.............................................................................................................................................................. 137
18.0 SR Latch................................................................................................................................................................................... 157
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 193
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 231
29.0 Instruction Set Summary.......................................................................................................................................................... 325
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 371
32.0 Development Support............................................................................................................................................................... 379
Index .................................................................................................................................................................................................. 395
The Microchip Web Site..................................................................................................................................................................... 403
Customer Change Notification Service .............................................................................................................................................. 403
Customer Support .............................................................................................................................................................................. 403
Product Identification System ............................................................................................................................................................ 405
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We
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An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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DS41391D-page 8 2011 Microchip Technology Inc.
1.0DEVICE OVERVIEW
The PIC16(L)F1826/27 are described within this data
sheet. They are available in 18/20/28-pin packages.
Figure 1-1 shows a block diagram of the
PIC16(L)F1826/27 devices. Table 1-2 shows the pinout
descriptions.
Reference Ta bl e 1 -1 for peripherals available per
device.
TABLE 1-1:DEVICE PERIPHERAL
SUMMARY
Peripheral
PIC16(L)F1826/27
PIC16F/LF1826
ADC●●
Capacitive Sensing Module●●
Digital-to-Analog Converter (DAC)●●
Digital Signal Modulator (DSM)●●
EUSART●●
Fixed Voltage Reference (FVR)●●
Reference Clock Module●●
SR Latch●●
Capture/Compare/PWM Modules
ECCP1●●
ECCP2●
CCP3●
CCP4●
Comparators
C1●●
C2●●
Master Synchronous Serial Ports
MSSP1●●
MSSP2●
Timers
Timer0●●
Timer1●●
Timer2●●
Timer4●
Timer6●
PIC16(L)F1827
2011 Microchip Technology Inc.DS41391D-page 9
PIC16(L)F1826/27
PORTA
EUSART
Comparators
MSSPx
Timer2-
Timer1Timer0
ECCPx
ADC
10-Bit
CCPx
PORTB
SR
Latch
Note 1:See applicable chapters for more information on peripherals.
2:See Ta bl e 1 -1 for peripherals available on specific devices.
CPU
Program
Flash Memory
EEPROM
RAM
OSC1/CLKIN
OSC2/CLKOUT
Timing
Generation
INTRC
Oscillator
MCLR
(Figure 2-1)
Modulator
CapSense
Clock
CLKR
Reference
Type s
DAC
FVR
FIGURE 1-1:PIC16(L)F1826/27BLOCK DIAGRAM
DS41391D-page 10 2011 Microchip Technology Inc.
T ABLE 1-2:PIC16(L)F1826/27 PINOUT DESCRIPTION
Input
NameFunction
Type
Output
Type
PIC16(L)F1826/27
Description
RA0/AN0/CPS0/C12IN0-/
(2)
SDO2
RA0TTLCMOS General purpose I/O.
AN0AN—A/D Channel 0 input.
CPS0AN—Capacitive sensing input 0.
C12IN0-AN—Comparator C1 or C2 negative input.
SDO2—CMOS SPI data output.
(2)
RA1/AN1/CPS1/C12IN1-/SS2
RA1TTLCMOS General purpose I/O.
AN1AN—A/D Channel 1 input.
CPS1AN—Capacitive sensing input 1.
C12IN1-AN—Comparator C1 or C2 negative input.
ST—Slave Select input 2.
RA2/AN2/CPS2/C12IN2-/
C12IN+/V
REF-/DACOUT
SS2
RA2TTLCMOS General purpose I/O.
AN2AN—A/D Channel 2 input.
CPS2AN—Capacitive sensing input 2.
C12IN2-AN—Comparator C1 or C2 negative input.
C12IN+AN—Comparator C1 or C2 positive input.
REF-AN—A/D Negative Voltage Reference input.
V
DACOUT—ANVoltage Reference output.
RA3/AN3/CPS3/C12IN3-/C1IN+/
REF+/C1OUT/CCP3
V
(2)
/SRQ
RA3TTLCMOS General purpose I/O.
AN3AN—A/D Channel 3 input.
CPS3AN—Capacitive sensing input 3.
C12IN3-AN—Comparator C1 or C2 negative input.
C1IN+AN—Comparator C1 positive input.
REF+AN—A/D Voltage Reference input.
V
C1OUT—CMOS Comparator C1 output.
CCP3STCMOS Capture/Compare/PWM3.
SRQ—CMOS SR latch non-inverting output.
RA4/AN4/CPS4/C2OUT/T0CKI/
(2)
/SRNQ
CCP4
RA4TTLCMOS General purpose I/O.
AN4AN—A/D Channel 4 input.
CPS4AN—Capacitive sensing input 4.
C2OUT—CMOS Comparator C2 output.
T0CKIST—Timer0 clock input.
CCP4STCMOS Capture/Compare/PWM4.
SRNQ—CMOS SR latch inverting output.
RA5/MCLR
/VPP/SS1
Legend: AN = Analog input or output CMOS= CMOS compatible input or outputOD= Open Drain
TTL = TTL compatible inputST= Schmitt Trigger input with CMOS levels I
(1,2)
RA5TTLCMOS General purpose I/O.
MCLR
V
PPHV—Programming voltage.
SS1
ST—Master Clear with internal pull-up.
ST—Slave Select input 1.
2
C™ = Schmitt Trigger input with I2C
HV = High VoltageXTAL = Crystallevels
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
2: Functions are only available on the PIC16(L)F1827.
3: Default function location.
Legend: AN = Analog input or output CMOS= CMOS compatible input or outputOD= Open Drain
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
TTL = TTL compatible inputST= Schmitt Trigger input with CMOS levels I
HV = High VoltageXTAL = Crystallevels
2: Functions are only available on the PIC16(L)F1827.
3: Default function location.
Type
Output
Type
Description
2
C™ = Schmitt Trigger input with I2C
DS41391D-page 14 2011 Microchip Technology Inc.
2.0ENHANCED MID-RANGE CPU
This family of devices contain an enhanced mid-range
8-bit CPU core. The CPU has 49 instructions. Interrupt
capability includes automatic context saving. The
hardware stack is 16 levels deep and has Overflow and
Underflow Reset capability. Direct, Indirect, and
Relative addressing modes are available. Two File
Select Registers (FSRs) provide the ability to read
program and data memory.
• Automatic Interrupt Context Saving
• 16-level Stack with Overflow and Underflow
• File Select Registers
• Instruction Set
2.1Automatic Interrupt Context
Saving
During interrupts, certain registers are automatically
saved in shadow registers and restored when returning
from the interrupt. This saves stack space and user
code. See Section 8.5 “Automatic Context Saving”,
for more information.
PIC16(L)F1826/27
2.216-level Stack with Overflow and
Underflow
These devices have an external stack memory 15 bits
wide and 16 words deep. A Stack Overflow or Underflow will set the appropriate bit (STKOVF or STKUNF)
in the PCON register, and if enabled will cause a software Reset. See section Section 3.4 “Stack” for more
details.
2.3File Select Registers
There are two 16-bit File Select Registers (FSR). FSRs
can access all file registers and program memory,
which allows one Data Pointer for all memory. When an
FSR points to program memory, there is one additional
instruction cycle in instructions using INDF to allow the
data to be fetched. General purpose memory can now
also be addressed linearly, providing the ability to
access contiguous data larger than 80 bytes. There are
also new instructions to support the FSRs. See
Section 3.4 “Stack”for more details.
2.4Instruction Set
There are 49 instructions for the enhanced mid-range
CPU to support the features of the CPU. See
Section 29.0 “Instruction Set Summary” for more
details.
2011 Microchip Technology Inc.DS41391D-page 15
PIC16(L)F1826/27
Data Bus
8
14
Program
Bus
Instruction reg
Program Counter
8 LevelStack
(13-bit)
Direct Addr
7
12
Addr MUX
FSR reg
STATUS reg
MUX
ALU
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
V
DD
8
8
Brown-out
Reset
12
3
VSS
Internal
Oscillator
Block
Configuration
Data Bus
8
14
Program
Bus
Instruction reg
Program Counter
8 LevelStack
(13-bit)
Direct Addr
7
Addr MUX
FSR reg
STATUS reg
MUX
ALU
W reg
Instruction
Decode &
Control
Timing
Generation
V
DD
8
8
3
VSS
Internal
Oscillator
Block
Configuration
15
Data Bus
8
14
Program
Bus
Instruction Reg
Program Counter
16-Level Stack
(15-bit)
Direct Addr
7
RAM Addr
Addr MUX
Indirect
Addr
FSR0 Reg
STATUS Reg
MUX
ALU
Instruction
Decode and
Control
Timing
Generation
V
DD
8
8
3
VSS
Internal
Oscillator
Block
Configuration
Flash
Program
Memory
RAM
FSR regFSR reg
FSR1 Reg
15
15
MUX
15
Program Memory
Read (PMR)
12
FSR regFSR reg
BSR Reg
5
FIGURE 2-1:CORE BLOCK DIAGRAM
DS41391D-page 16 2011 Microchip Technology Inc.
PIC16(L)F1826/27
3.0MEMORY ORGANIZATION
There are three types of memory in PIC16(L)F1826/27:
Data Memory, Program Memory and Data EEPROM
Memory
• Program Memory
• Data Memory
• Data EEPROM memory
(1)
.
- Core Registers
- Special Function Registers
- General Purpose RAM
- Common RAM
- Device Memory Maps
- Special Function Registers Summary
Note 1: The Data EEPROM Memory and the
method to access Flash memory through
the EECON registers is described in
Section 11.0 “Data EEPROM and Flash
Program Memory Control”.
(1)
The following features are associated with access and
control of program memory and data memory:
• PCL and PCLATH
•Stack
• Indirect Addressing
3.1Program Memory Organization
The enhanced mid-range core has a 15-bit program
counter capable of addressing a 32K x 14 program
memory space. Table 3-1 shows the memory sizes
implemented for the PIC16(L)F1826/27 family.
Accessing a location above these boundaries will cause
a wrap-around within the implemented memory space.
The Reset vector is at 0000h and the interrupt vector is
at 0004h (see Figures 3-1 and 3-2).
TABLE 3-1:DEVICE SIZES AND ADDRESSES
DeviceProgram Memory Space (Words)Last Program Memory Address
PIC16(L)F18262,04807FFh
PIC16(L)F18274,0960FFFh
2011 Microchip Technology Inc.DS41391D-page 17
PIC16(L)F1826/27
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
Stack Level 1
0005h
On-chip
Program
Memory
Page 0
07FFh
Wraps to Page 0
Wraps to Page 0
Wraps to Page 0
0800h
CALL, CALLW
RETURN, RETLW
Interrupt, RETFIE
Rollover to Page 0
Rollover to Page 0
7FFFh
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
CALL, CALLW
RETURN, RETLW
Stack Level 1
0005h
On-chip
Program
Memory
Page 0
07FFh
Rollover to Page 0
0800h
0FFFh
1000h
7FFFh
Page 1
Rollover to Page 1
Interrupt, RETFIE
FIGURE 3-1:PROGRAM MEMORY MAP
AND STACK FOR
PIC16(L)F1826
FIGURE 3-2:PROGRAM MEMORY MAP
AND STACK FOR
PIC16(L)F1827
DS41391D-page 18 2011 Microchip Technology Inc.
3.1.1READING PROGRAM MEMORY AS
constants
BRW;Add Index in W to
;program counter to
;select data
RETLW DATA0;Index0 data
RETLW DATA1;Index1 data
RETLW DATA2
RETLW DATA3
my_function
;… LOTS OF CODE…
MOVLWDATA_INDEX
call constants
;… THE CONSTANT IS IN W
DATA
There are two methods of accessing constants in program memory. The first method is to use tables of
RETLW instructions. The second method is to set an
FSR to point to the program memory.
3.1.1.1RETLW Instruction
The RETLW instruction can be used to provide access
to tables of constants. The recommended way to create
such a table is shown in Example 3-1.
EXAMPLE 3-1:RETLW INSTRUCTION
PIC16(L)F1826/27
The BRW instruction makes this type of table very simple to implement. If your code must remain portable
with previous generations of microcontrollers, then the
BRW instruction is not available so the older table read
method must be used.
2011 Microchip Technology Inc.DS41391D-page 19
PIC16(L)F1826/27
constants
RETLW DATA0;Index0 data
RETLW DATA1;Index1 data
RETLW DATA2
RETLW DATA3
x00h or x80hINDF0
x01h or x81hINDF1
x02h or x82hPCL
x03h or x83hSTATUS
x04h or x84hFSR0L
x05h or x85hFSR0H
x06h or x86hFSR1L
x07h or x87hFSR1H
x08h or x88hBSR
x09h or x89hWREG
x0Ah or x8AhPCLATH
x0Bh or x8BhINTCON
3.1.1.2Indirect Read with FSR
The program memory can be accessed as data by setting bit 7 of the FSRxH register and reading the matching INDFx register. The MOVIW instruction will place the
lower 8 bits of the addressed word in the W register.
Writes to the program memory cannot be performed via
the INDF registers. Instructions that access the program memory via the FSR require one extra instruction
cycle to complete. Example 3-2 demonstrates accessing the program memory via an FSR.
The HIGH directive will set bit<7> if a label points to a
location in program memory.
EXAMPLE 3-2:ACCESSING PROGRAM
MEMORY VIA FSR
3.2.1CORE REGISTERS
The core registers contain the registers that directly
affect the basic operation. The core registers occupy
the first 12 addresses of every data memory bank
(addresses x00h/x08h through x0Bh/x8Bh). These
registers are listed below in Ta bl e 3 -2. For for detailed
information, see Tab le 3 -5 .
TABLE 3-2:CORE REGISTERS
3.2Data Memory Organization
The data memory is partitioned in 32 memory banks
with 128 bytes in a bank. Each bank consists of
(Figure 3-3):
• 12 core registers
• 20 Special Function Registers (SFR)
• Up to 80 bytes of General Purpose RAM (GPR)
• 16 bytes of common RAM
The active bank is selected by writing the bank number
into the Bank Select Register (BSR). Unimplemented
memory will read as ‘0’. All data memory can be
accessed either directly (via instructions that use the
file registers) or indirectly via the two File Select
Registers (FSR). See Section 3.5 “Indirect
Addressing” for more information.
Data Memory uses a 12-bit address. The upper 7-bit of
the address define the Bank address and the lower
5-bits select the registers/RAM in that bank.
DS41391D-page 20 2011 Microchip Technology Inc.
PIC16(L)F1826/27
3.2.1.1STATUS Register
The STATUS register, shown in Register 3-1, contains:
• the arithmetic status of the ALU
• the Reset status
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
and PD bits are not
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits (Refer to Section 29.0
“Instruction Set Summary”).
Note 1: The C and DC bits operate as Borrow
and Digit Borrow out bits, respectively, in
subtraction.
REGISTER 3-1:STATUS: STATUS REGISTER
U-0U-0U-0R-1/qR-1/qR/W-0/uR/W-0/uR/W-0/u
———
bit 7bit 0
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is clearedq = Value depends on condition
TO
PDZDC
(1)
(1)
C
bit 7-5Unimplemented: Read as ‘0’
bit 4TO
bit 3PD
bit 2Z: Zero bit
bit 1DC: Digit Carry/Digit Borrow
bit 0C: Carry/Borrow
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order
bit of the source register.
: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
(1)
bit
(ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
(1)
(1)
2011 Microchip Technology Inc.DS41391D-page 21
PIC16(L)F1826/27
0Bh
0Ch
1Fh
20h
6Fh
70h
7Fh
00h
Common RAM
(16 bytes)
General Purpose RAM
(80 bytes maximum)
Core Registers
(12 bytes)
Special Function Registers
(20 bytes maximum)
Memory Region
7-bit Bank Offset
3.2.2SPECIAL FUNCTION REGISTER
The Special Function Registers are registers used by
the application to control the desired operation of
peripheral functions in the device. The Special Function
Registers occupy the 20 bytes after the core registers of
every data memory bank (addresses x0Ch/x8Ch
through x1Fh/x9Fh). The registers associated with the
operation of the peripherals are described in the
appropriate peripheral chapter of this data sheet.
3.2.3GENERAL PURPOSE RAM
There are up to 80 bytes of GPR in each data memory
bank. The Special Function Registers occupy the 20
bytes after the core registers of every data memory
bank (addresses x0Ch/x8Ch through x1Fh/x9Fh).
3.2.3.1Linear Access to GPR
The general purpose RAM can be accessed in a
non-banked method via the FSRs. This can simplify
access to large memory structures. See Section 3 .5.2
“Linear Data Memory” for more information.
3.2.4COMMON RAM
There are 16 bytes of common RAM accessible from all
banks.
FIGURE 3-3:BANKED MEMORY
PARTITIONING
DS41391D-page 22 2011 Microchip Technology Inc.
3.2.5DEVICE MEMORY MAPS
The memory maps for the device family are as shown
in Table 3-3 and Tab le 3 -4 .
014hPIR4
015hTMR0Timer0 Module Registerxxxx xxxx uuuu uuuu
016hTMR1LHolding Register for the Least Significant Byte of the 16-bit TMR1 Registerxxxx xxxx uuuu uuuu
017hTMR1HHolding Register for the Most Significant Byte of the 16-bit TMR1 Registerxxxx xxxx uuuu uuuu