Note the following details of the code protection feature on Microchip devices:
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
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intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
K
logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
DS41391D-page 2 2011 Microchip Technology Inc.
PIC16(L)F1826/27
18/20/28-Pin Flash Microcontrollers wit h na noWatt XLP Techno logy
High-Performance RISC CPU:
• C Compiler Optimized Architecture
• 256 bytes Data EEPROM
• Up to 8 Kbytes Linear Program Memory
Addressing
• Up to 384 bytes Linear Data Memory Addressing
• Interrupt Capability with Automatic Context Saving
• 16-Level Deep Hardware Stack with Optional
Overflow/Underflow Reset
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 101
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 135
15.0 Temperature Indicator.............................................................................................................................................................. 137
18.0 SR Latch................................................................................................................................................................................... 157
23.0 Data Signal Modulator (DSM) .................................................................................................................................................. 193
25.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 231
29.0 Instruction Set Summary.......................................................................................................................................................... 325
31.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 371
32.0 Development Support............................................................................................................................................................... 379
Index .................................................................................................................................................................................................. 395
The Microchip Web Site..................................................................................................................................................................... 403
Customer Change Notification Service .............................................................................................................................................. 403
Customer Support .............................................................................................................................................................................. 403
Product Identification System ............................................................................................................................................................ 405
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We
welcome your feedback.
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The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
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An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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DS41391D-page 8 2011 Microchip Technology Inc.
1.0DEVICE OVERVIEW
The PIC16(L)F1826/27 are described within this data
sheet. They are available in 18/20/28-pin packages.
Figure 1-1 shows a block diagram of the
PIC16(L)F1826/27 devices. Table 1-2 shows the pinout
descriptions.
Reference Ta bl e 1 -1 for peripherals available per
device.
TABLE 1-1:DEVICE PERIPHERAL
SUMMARY
Peripheral
PIC16(L)F1826/27
PIC16F/LF1826
ADC●●
Capacitive Sensing Module●●
Digital-to-Analog Converter (DAC)●●
Digital Signal Modulator (DSM)●●
EUSART●●
Fixed Voltage Reference (FVR)●●
Reference Clock Module●●
SR Latch●●
Capture/Compare/PWM Modules
ECCP1●●
ECCP2●
CCP3●
CCP4●
Comparators
C1●●
C2●●
Master Synchronous Serial Ports
MSSP1●●
MSSP2●
Timers
Timer0●●
Timer1●●
Timer2●●
Timer4●
Timer6●
PIC16(L)F1827
2011 Microchip Technology Inc.DS41391D-page 9
PIC16(L)F1826/27
PORTA
EUSART
Comparators
MSSPx
Timer2-
Timer1Timer0
ECCPx
ADC
10-Bit
CCPx
PORTB
SR
Latch
Note 1:See applicable chapters for more information on peripherals.
2:See Ta bl e 1 -1 for peripherals available on specific devices.
CPU
Program
Flash Memory
EEPROM
RAM
OSC1/CLKIN
OSC2/CLKOUT
Timing
Generation
INTRC
Oscillator
MCLR
(Figure 2-1)
Modulator
CapSense
Clock
CLKR
Reference
Type s
DAC
FVR
FIGURE 1-1:PIC16(L)F1826/27BLOCK DIAGRAM
DS41391D-page 10 2011 Microchip Technology Inc.
T ABLE 1-2:PIC16(L)F1826/27 PINOUT DESCRIPTION
Input
NameFunction
Type
Output
Type
PIC16(L)F1826/27
Description
RA0/AN0/CPS0/C12IN0-/
(2)
SDO2
RA0TTLCMOS General purpose I/O.
AN0AN—A/D Channel 0 input.
CPS0AN—Capacitive sensing input 0.
C12IN0-AN—Comparator C1 or C2 negative input.
SDO2—CMOS SPI data output.
(2)
RA1/AN1/CPS1/C12IN1-/SS2
RA1TTLCMOS General purpose I/O.
AN1AN—A/D Channel 1 input.
CPS1AN—Capacitive sensing input 1.
C12IN1-AN—Comparator C1 or C2 negative input.
ST—Slave Select input 2.
RA2/AN2/CPS2/C12IN2-/
C12IN+/V
REF-/DACOUT
SS2
RA2TTLCMOS General purpose I/O.
AN2AN—A/D Channel 2 input.
CPS2AN—Capacitive sensing input 2.
C12IN2-AN—Comparator C1 or C2 negative input.
C12IN+AN—Comparator C1 or C2 positive input.
REF-AN—A/D Negative Voltage Reference input.
V
DACOUT—ANVoltage Reference output.
RA3/AN3/CPS3/C12IN3-/C1IN+/
REF+/C1OUT/CCP3
V
(2)
/SRQ
RA3TTLCMOS General purpose I/O.
AN3AN—A/D Channel 3 input.
CPS3AN—Capacitive sensing input 3.
C12IN3-AN—Comparator C1 or C2 negative input.
C1IN+AN—Comparator C1 positive input.
REF+AN—A/D Voltage Reference input.
V
C1OUT—CMOS Comparator C1 output.
CCP3STCMOS Capture/Compare/PWM3.
SRQ—CMOS SR latch non-inverting output.
RA4/AN4/CPS4/C2OUT/T0CKI/
(2)
/SRNQ
CCP4
RA4TTLCMOS General purpose I/O.
AN4AN—A/D Channel 4 input.
CPS4AN—Capacitive sensing input 4.
C2OUT—CMOS Comparator C2 output.
T0CKIST—Timer0 clock input.
CCP4STCMOS Capture/Compare/PWM4.
SRNQ—CMOS SR latch inverting output.
RA5/MCLR
/VPP/SS1
Legend: AN = Analog input or output CMOS= CMOS compatible input or outputOD= Open Drain
TTL = TTL compatible inputST= Schmitt Trigger input with CMOS levels I
(1,2)
RA5TTLCMOS General purpose I/O.
MCLR
V
PPHV—Programming voltage.
SS1
ST—Master Clear with internal pull-up.
ST—Slave Select input 1.
2
C™ = Schmitt Trigger input with I2C
HV = High VoltageXTAL = Crystallevels
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
2: Functions are only available on the PIC16(L)F1827.
3: Default function location.
Legend: AN = Analog input or output CMOS= CMOS compatible input or outputOD= Open Drain
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
TTL = TTL compatible inputST= Schmitt Trigger input with CMOS levels I
HV = High VoltageXTAL = Crystallevels
2: Functions are only available on the PIC16(L)F1827.
3: Default function location.
Type
Output
Type
Description
2
C™ = Schmitt Trigger input with I2C
DS41391D-page 14 2011 Microchip Technology Inc.
2.0ENHANCED MID-RANGE CPU
This family of devices contain an enhanced mid-range
8-bit CPU core. The CPU has 49 instructions. Interrupt
capability includes automatic context saving. The
hardware stack is 16 levels deep and has Overflow and
Underflow Reset capability. Direct, Indirect, and
Relative addressing modes are available. Two File
Select Registers (FSRs) provide the ability to read
program and data memory.
• Automatic Interrupt Context Saving
• 16-level Stack with Overflow and Underflow
• File Select Registers
• Instruction Set
2.1Automatic Interrupt Context
Saving
During interrupts, certain registers are automatically
saved in shadow registers and restored when returning
from the interrupt. This saves stack space and user
code. See Section 8.5 “Automatic Context Saving”,
for more information.
PIC16(L)F1826/27
2.216-level Stack with Overflow and
Underflow
These devices have an external stack memory 15 bits
wide and 16 words deep. A Stack Overflow or Underflow will set the appropriate bit (STKOVF or STKUNF)
in the PCON register, and if enabled will cause a software Reset. See section Section 3.4 “Stack” for more
details.
2.3File Select Registers
There are two 16-bit File Select Registers (FSR). FSRs
can access all file registers and program memory,
which allows one Data Pointer for all memory. When an
FSR points to program memory, there is one additional
instruction cycle in instructions using INDF to allow the
data to be fetched. General purpose memory can now
also be addressed linearly, providing the ability to
access contiguous data larger than 80 bytes. There are
also new instructions to support the FSRs. See
Section 3.4 “Stack”for more details.
2.4Instruction Set
There are 49 instructions for the enhanced mid-range
CPU to support the features of the CPU. See
Section 29.0 “Instruction Set Summary” for more
details.
2011 Microchip Technology Inc.DS41391D-page 15
PIC16(L)F1826/27
Data Bus
8
14
Program
Bus
Instruction reg
Program Counter
8 LevelStack
(13-bit)
Direct Addr
7
12
Addr MUX
FSR reg
STATUS reg
MUX
ALU
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
V
DD
8
8
Brown-out
Reset
12
3
VSS
Internal
Oscillator
Block
Configuration
Data Bus
8
14
Program
Bus
Instruction reg
Program Counter
8 LevelStack
(13-bit)
Direct Addr
7
Addr MUX
FSR reg
STATUS reg
MUX
ALU
W reg
Instruction
Decode &
Control
Timing
Generation
V
DD
8
8
3
VSS
Internal
Oscillator
Block
Configuration
15
Data Bus
8
14
Program
Bus
Instruction Reg
Program Counter
16-Level Stack
(15-bit)
Direct Addr
7
RAM Addr
Addr MUX
Indirect
Addr
FSR0 Reg
STATUS Reg
MUX
ALU
Instruction
Decode and
Control
Timing
Generation
V
DD
8
8
3
VSS
Internal
Oscillator
Block
Configuration
Flash
Program
Memory
RAM
FSR regFSR reg
FSR1 Reg
15
15
MUX
15
Program Memory
Read (PMR)
12
FSR regFSR reg
BSR Reg
5
FIGURE 2-1:CORE BLOCK DIAGRAM
DS41391D-page 16 2011 Microchip Technology Inc.
PIC16(L)F1826/27
3.0MEMORY ORGANIZATION
There are three types of memory in PIC16(L)F1826/27:
Data Memory, Program Memory and Data EEPROM
Memory
• Program Memory
• Data Memory
• Data EEPROM memory
(1)
.
- Core Registers
- Special Function Registers
- General Purpose RAM
- Common RAM
- Device Memory Maps
- Special Function Registers Summary
Note 1: The Data EEPROM Memory and the
method to access Flash memory through
the EECON registers is described in
Section 11.0 “Data EEPROM and Flash
Program Memory Control”.
(1)
The following features are associated with access and
control of program memory and data memory:
• PCL and PCLATH
•Stack
• Indirect Addressing
3.1Program Memory Organization
The enhanced mid-range core has a 15-bit program
counter capable of addressing a 32K x 14 program
memory space. Table 3-1 shows the memory sizes
implemented for the PIC16(L)F1826/27 family.
Accessing a location above these boundaries will cause
a wrap-around within the implemented memory space.
The Reset vector is at 0000h and the interrupt vector is
at 0004h (see Figures 3-1 and 3-2).
TABLE 3-1:DEVICE SIZES AND ADDRESSES
DeviceProgram Memory Space (Words)Last Program Memory Address
PIC16(L)F18262,04807FFh
PIC16(L)F18274,0960FFFh
2011 Microchip Technology Inc.DS41391D-page 17
PIC16(L)F1826/27
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
Stack Level 1
0005h
On-chip
Program
Memory
Page 0
07FFh
Wraps to Page 0
Wraps to Page 0
Wraps to Page 0
0800h
CALL, CALLW
RETURN, RETLW
Interrupt, RETFIE
Rollover to Page 0
Rollover to Page 0
7FFFh
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
CALL, CALLW
RETURN, RETLW
Stack Level 1
0005h
On-chip
Program
Memory
Page 0
07FFh
Rollover to Page 0
0800h
0FFFh
1000h
7FFFh
Page 1
Rollover to Page 1
Interrupt, RETFIE
FIGURE 3-1:PROGRAM MEMORY MAP
AND STACK FOR
PIC16(L)F1826
FIGURE 3-2:PROGRAM MEMORY MAP
AND STACK FOR
PIC16(L)F1827
DS41391D-page 18 2011 Microchip Technology Inc.
3.1.1READING PROGRAM MEMORY AS
constants
BRW;Add Index in W to
;program counter to
;select data
RETLW DATA0;Index0 data
RETLW DATA1;Index1 data
RETLW DATA2
RETLW DATA3
my_function
;… LOTS OF CODE…
MOVLWDATA_INDEX
call constants
;… THE CONSTANT IS IN W
DATA
There are two methods of accessing constants in program memory. The first method is to use tables of
RETLW instructions. The second method is to set an
FSR to point to the program memory.
3.1.1.1RETLW Instruction
The RETLW instruction can be used to provide access
to tables of constants. The recommended way to create
such a table is shown in Example 3-1.
EXAMPLE 3-1:RETLW INSTRUCTION
PIC16(L)F1826/27
The BRW instruction makes this type of table very simple to implement. If your code must remain portable
with previous generations of microcontrollers, then the
BRW instruction is not available so the older table read
method must be used.
2011 Microchip Technology Inc.DS41391D-page 19
PIC16(L)F1826/27
constants
RETLW DATA0;Index0 data
RETLW DATA1;Index1 data
RETLW DATA2
RETLW DATA3
x00h or x80hINDF0
x01h or x81hINDF1
x02h or x82hPCL
x03h or x83hSTATUS
x04h or x84hFSR0L
x05h or x85hFSR0H
x06h or x86hFSR1L
x07h or x87hFSR1H
x08h or x88hBSR
x09h or x89hWREG
x0Ah or x8AhPCLATH
x0Bh or x8BhINTCON
3.1.1.2Indirect Read with FSR
The program memory can be accessed as data by setting bit 7 of the FSRxH register and reading the matching INDFx register. The MOVIW instruction will place the
lower 8 bits of the addressed word in the W register.
Writes to the program memory cannot be performed via
the INDF registers. Instructions that access the program memory via the FSR require one extra instruction
cycle to complete. Example 3-2 demonstrates accessing the program memory via an FSR.
The HIGH directive will set bit<7> if a label points to a
location in program memory.
EXAMPLE 3-2:ACCESSING PROGRAM
MEMORY VIA FSR
3.2.1CORE REGISTERS
The core registers contain the registers that directly
affect the basic operation. The core registers occupy
the first 12 addresses of every data memory bank
(addresses x00h/x08h through x0Bh/x8Bh). These
registers are listed below in Ta bl e 3 -2. For for detailed
information, see Tab le 3 -5 .
TABLE 3-2:CORE REGISTERS
3.2Data Memory Organization
The data memory is partitioned in 32 memory banks
with 128 bytes in a bank. Each bank consists of
(Figure 3-3):
• 12 core registers
• 20 Special Function Registers (SFR)
• Up to 80 bytes of General Purpose RAM (GPR)
• 16 bytes of common RAM
The active bank is selected by writing the bank number
into the Bank Select Register (BSR). Unimplemented
memory will read as ‘0’. All data memory can be
accessed either directly (via instructions that use the
file registers) or indirectly via the two File Select
Registers (FSR). See Section 3.5 “Indirect
Addressing” for more information.
Data Memory uses a 12-bit address. The upper 7-bit of
the address define the Bank address and the lower
5-bits select the registers/RAM in that bank.
DS41391D-page 20 2011 Microchip Technology Inc.
PIC16(L)F1826/27
3.2.1.1STATUS Register
The STATUS register, shown in Register 3-1, contains:
• the arithmetic status of the ALU
• the Reset status
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
and PD bits are not
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits (Refer to Section 29.0
“Instruction Set Summary”).
Note 1: The C and DC bits operate as Borrow
and Digit Borrow out bits, respectively, in
subtraction.
REGISTER 3-1:STATUS: STATUS REGISTER
U-0U-0U-0R-1/qR-1/qR/W-0/uR/W-0/uR/W-0/u
———
bit 7bit 0
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is clearedq = Value depends on condition
TO
PDZDC
(1)
(1)
C
bit 7-5Unimplemented: Read as ‘0’
bit 4TO
bit 3PD
bit 2Z: Zero bit
bit 1DC: Digit Carry/Digit Borrow
bit 0C: Carry/Borrow
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order
bit of the source register.
: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
(1)
bit
(ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
(1)
(1)
2011 Microchip Technology Inc.DS41391D-page 21
PIC16(L)F1826/27
0Bh
0Ch
1Fh
20h
6Fh
70h
7Fh
00h
Common RAM
(16 bytes)
General Purpose RAM
(80 bytes maximum)
Core Registers
(12 bytes)
Special Function Registers
(20 bytes maximum)
Memory Region
7-bit Bank Offset
3.2.2SPECIAL FUNCTION REGISTER
The Special Function Registers are registers used by
the application to control the desired operation of
peripheral functions in the device. The Special Function
Registers occupy the 20 bytes after the core registers of
every data memory bank (addresses x0Ch/x8Ch
through x1Fh/x9Fh). The registers associated with the
operation of the peripherals are described in the
appropriate peripheral chapter of this data sheet.
3.2.3GENERAL PURPOSE RAM
There are up to 80 bytes of GPR in each data memory
bank. The Special Function Registers occupy the 20
bytes after the core registers of every data memory
bank (addresses x0Ch/x8Ch through x1Fh/x9Fh).
3.2.3.1Linear Access to GPR
The general purpose RAM can be accessed in a
non-banked method via the FSRs. This can simplify
access to large memory structures. See Section 3 .5.2
“Linear Data Memory” for more information.
3.2.4COMMON RAM
There are 16 bytes of common RAM accessible from all
banks.
FIGURE 3-3:BANKED MEMORY
PARTITIONING
DS41391D-page 22 2011 Microchip Technology Inc.
3.2.5DEVICE MEMORY MAPS
The memory maps for the device family are as shown
in Table 3-3 and Tab le 3 -4 .
014hPIR4
015hTMR0Timer0 Module Registerxxxx xxxx uuuu uuuu
016hTMR1LHolding Register for the Least Significant Byte of the 16-bit TMR1 Registerxxxx xxxx uuuu uuuu
017hTMR1HHolding Register for the Most Significant Byte of the 16-bit TMR1 Registerxxxx xxxx uuuu uuuu
Indirect Data Memory Address 1 High Pointer Shadowxxxx xxxx uuuu uuuu
SHAD
—Unimplemented——
STKPTR
TOSL
TOSH
Shaded locations are unimplemented, read as ‘0’.
———Current Stack pointer---1 1111 ---1 1111
Top-of-Stack Low bytexxxx xxxx uuuu uuuu
—Top-of-Stack High byte-xxx xxxx -uuu uuuu
SHAD
C_SHAD ---- -xxx ---- -uuu
Value on
POR, BOR
Value on all
other
Resets
2011 Microchip Technology Inc.DS41391D-page 35
PIC16(L)F1826/27
PCLPCH
0
14
PC
06
7
ALU Result
8
PCLATH
PCLPCH
0
14
PC
06
4
OPCODE <10:0>
11
PCLATH
PCLPCH
0
14
PC
06
7
W
8
PCLATH
Instruction with
PCL as
Destination
GOTO, CALL
CALLW
PCL
PCH
0
14
PC
PC + W
15
BRW
PCLPCH
0
14
PC
PC + OPCODE <8:0>
15
BRA
3.3PCL and PCLATH
The Program Counter (PC) is 15 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<14:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 3-4 shows the five
situations for the loading of the PC.
FIGURE 3-4:LOADING OF PC IN
DIFFERENT SITUATIONS
3.3.3COMPUTED FUNCTION CALLS
A computed function CALL allows programs to maintain
tables of functions and provide another way to execute
state machines or look-up tables. When performing a
table read using a computed function CALL, care
should be exercised if the table location crosses a PCL
memory boundary (each 256-byte block).
If using the CALL instruction, the PCH<2:0> and PCL
registers are loaded with the operand of the CALL
instruction. PCH<6:3> is loaded with PCLATH<6:3>.
The CALLW instruction enables computed calls by combining PCLATH and W to form the destination address.
A computed CALLW is accomplished by loading the W
register with the desired address and executing CALLW.
The PCL register is loaded with the value of W and
PCH is loaded with PCLATH.
3.3.4BRANCHING
The branching instructions add an offset to the PC.
This allows relocatable code and code that crosses
page boundaries. There are two forms of branching,
BRW and BRA. The PC will have incremented to fetch
the next instruction in both cases. When using either
branching instruction, a PCL memory boundary may be
crossed.
If using BRW, load the W register with the desired
unsigned address and execute BRW. The entire PC will
be loaded with the address PC + 1 + W.
If using BRA, the entire PC will be loaded with PC + 1 +,
the signed value of the operand of the BRA instruction.
3.3.1MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program Counter PC<14:8> bits (PCH) to be replaced by the contents
of the PCLATH register. This allows the entire contents
of the program counter to be changed by writing the
desired upper 7 bits to the PCLATH register. When the
lower 8 bits are written to the PCL register, all 15 bits of
the program counter will change to the values contained in the PCLATH register and those being written
to the PCL register.
3.3.2COMPUTED GOTO
A computed GOTO is accomplished by adding an offset to
the program counter (ADDWF PC L). When performing a
table read using a computed GOTO method, care should
be exercised if the table location crosses a PCL memory
boundary (each 256-byte block). Refer to Application
Note AN556, “Implementing a T able Read” (DS00556).
DS41391D-page 36 2011 Microchip Technology Inc.
PIC16(L)F1826/27
TOSH:TOSL
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x03
0x02
0x01
0x00
0x04
0x05
0x06
0x07
0x1F
Stack Reset Disabled
(STVREN = 0)
Stack Reset Enabled
(STVREN = 1)
0x0000
Initial Stack Configuration:
After Reset, the stack is empty. The
empty stack is initialized so the Stack
Pointer is pointing at 0x1F. If the Stack
Overflow/Underflow Reset is enabled, the
TOSH/TOSL registers will return ‘0’. If
the Stack Overflow/Underflow Reset is
disabled, the TOSH/TOSL registers will
return the contents of stack address 0x0F.
STKPTR = 0x1F
STKPTR = 0x1F
3.4Stack
All devices have a 16-level x 15-bit wide hardware
stack (refer to Figures 3-5 through 3-8). The stack
space is not part of either program or data space. The
PC is PUSHed onto the stack when CALL or CALLW
instructions are executed or an interrupt causes a
branch. The stack is POPed in the event of a RETURN,RETLW or a RETFIE instruction execution. PCLATH is
not affected by a PUSH or POP operation.
The stack operates as a circular buffer if the STVREN
bit is programmed to ‘0‘ (Configuration Word 2). This
means that after the stack has been PUSHed sixteen
times, the seventeenth PUSH overwrites the value that
was stored from the first PUSH. The eighteenth PUSH
overwrites the second PUSH (and so on). The
STKOVF and STKUNF flag bits will be set on an Overflow/Underflow, regardless of whether the Reset is
enabled.
Note 1: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, CALLW, RETURN, RETLW and
RETFIE instructions or the vectoring to
an interrupt address.
3.4.1ACCESSING THE STACK
The stack is available through the TOSH, TOSL and
STKPTR registers. STKPTR is the current value of the
Stack Pointer. TOSH:TOSL register pair points to the
TOP of the stack. Both registers are read/writable. TOS
is split into TOSH and TOSL due to the 15-bit size of the
PC. To access the stack, adjust the value of STKPTR,
which will position TOSH:TOSL, then read/write to
TOSH:TOSL. STKPTR is 5 bits to allow detection of
overflow and underflow.
Note:Care should be taken when modifying the
STKPTR while interrupts are enabled.
During normal program operation, CALL, CALLW and
Interrupts will increment STKPTR while RETLW,RETURN, and RETFIE will decrement STKPTR. At any
time STKPTR can be inspected to see how much stack
is left. The STKPTR always points at the currently used
place on the stack. Therefore, a CALL or CALLW will
increment the STKPTR and then write the PC, and a
return will unload the PC and then decrement STKPTR.
Reference Figure 3-5 through Figure 3-8 for examples
of accessing the stack.
FIGURE 3-5:ACCESSING THE STACK EXAMPLE 1
2011 Microchip Technology Inc.DS41391D-page 37
PIC16(L)F1826/27
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x03
0x02
0x01
0x00
0x04
0x05
0x06
0x07
Return Address
This figure shows the stack configuration
after the first CALL or a single interrupt.
If a RETURN instruction is executed, the
return address will be placed in the
Program Counter and the Stack Pointer
decremented to the empty state (0x1F).
STKPTR = 0x00
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x03
0x02
0x01
0x00
0x04
0x05
0x06
0x07
Return Address
After seven CALLs, or six CALLs and an
interrupt, the stack looks like the figure
on the left. A series of RETURN instructions
will repeatedly place the return addresses
into the Program Counter and pop the stack.
STKPTR = 0x06
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
FIGURE 3-6:ACCESSING THE STACK EXAMPLE 2
FIGURE 3-7:ACCESSING THE STACK EXAMPLE 3
DS41391D-page 38 2011 Microchip Technology Inc.
FIGURE 3-8:ACCESSING THE STACK EXAMPLE 4
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x03
0x02
0x01
0x00
0x04
0x05
0x06
0x07
Return Address
When the stack is full, the next CALL or
interrupt will set the Stack Pointer to
0x10. This is identical to address 0x00
so the stack will wrap and overwrite the
return address at 0x00. If the Stack
Overflow/Underflow Reset is enabled, a
Reset will occur and location 0x00 will
not be overwritten.
STKPTR = 0x10
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
PIC16(L)F1826/27
3.4.2OVERFLOW/UNDERFLOW RESET
If the STVREN bit in Configuration Word 2 is
programmed to ‘1’, the device will be reset if the stack
is PUSHed beyond the sixteenth level or POPed
beyond the first level, setting the appropriate bits
(STKOVF or STKUNF, respectively) in the PCON
register.
3.5Indirect Addressing
The INDFn registers are not physical registers. Any
instruction that accesses an INDFn register actually
accesses the register at the address specified by the
File Select Registers (FSR). If the FSRn address
specifies one of the two INDFn registers, the read will
return ‘0’ and the write will not occur (though Status bits
may be affected). The FSRn register value is created
by the pair FSRnH and FSRnL.
The FSR registers form a 16-bit address that allows an
addressing space with 65536 locations. These locations
are divided into three memory regions:
• Traditional Data Memory
• Linear Data Memory
• Program Flash Memory
2011 Microchip Technology Inc.DS41391D-page 39
PIC16(L)F1826/27
0x0000
0x0FFF
Traditional
FSR
Address
Range
Data Memory
0x1000
Reserved
Linear
Data Memory
Reserved
0x2000
0x29AF
0x29B0
0x7FFF
0x8000
0xFFFF
0x0000
0x0FFF
0x0000
0x7FFF
Program
Flash Memory
Note:Not all memory regions are completely implemented. Consult device memory tables for memory limits.
0x1FFF
FIGURE 3-9:INDIRECT ADDRESSING
DS41391D-page 40 2011 Microchip Technology Inc.
3.5.1TRADITIONAL DATA MEMORY
Indirect AddressingDirect Addressing
Bank Select
Location Select
4BSR6
0
From Opcode
FSRxL70
Bank Select
Location Select
0000 0001 00101111
0x00
0x7F
Bank 0 Bank 1 Bank 2Bank 31
0
FSRxH70
0000
The traditional data memory is a region from FSR
address 0x000 to FSR address 0xFFF. The addresses
correspond to the absolute addresses of all SFR, GPR
and common registers.
FIGURE 3-10:TRADITIONAL DATA MEMORY MAP
PIC16(L)F1826/27
2011 Microchip Technology Inc.DS41391D-page 41
PIC16(L)F1826/27
7
0
1
7
0
0
Location Select
0x2000
FSRnH
FSRnL
0x020
Bank 0
0x06F
0x0A0
Bank 1
0x0EF
0x120
Bank 2
0x16F
0xF20
Bank 30
0xF6F
0x29AF
0
7
1
7
0
0
Location Select
0x8000
FSRnH
FSRnL
0x0000
0x7FFF
0xFFFF
Program
Flash
Memory
(low 8
bits)
3.5.2LINEAR DATA MEMORY
The linear data memory is the region from FSR
address 0x2000 to FSR address 0x29AF. This region is
a virtual region that points back to the 80-byte blocks of
GPR memory in all the banks.
Unimplemented memory reads as 0x00. Use of the
linear data memory region allows buffers to be larger
than 80 bytes because incrementing the FSR beyond
one bank will go directly to the GPR memory of the next
bank.
The 16 bytes of common memory are not included in
the linear data memory region.
FIGURE 3-11:LINEAR DATA MEMORY
MAP
3.5.3PROGRAM FLASH MEMORY
To make constant data access easier, the entire
program Flash memory is mapped to the upper half of
the FSR address space. When the MSB of FSRnH is
set, the lower 15 bits are the address in program
memory which will be accessed through INDF. Only the
lower 8 bits of each memory location is accessible via
INDF. Writing to the program Flash memory cannot be
accomplished via the FSR/INDF interface. All
instructions that access program Flash memory via the
FSR/INDF interface will require one additional
instruction cycle to complete.
FIGURE 3-12:PROGRAM FLASH
MEMORY MAP
DS41391D-page 42 2011 Microchip Technology Inc.
4.0DEVICE CONFIGURATION
Device Configuration consists of Configuration Word 1
and Configuration Word 2, Code Protection and Device
ID.
4.1Configuration Words
There are several Configuration Word bits that allow
different oscillator and memory protection options.
These are implemented as Configuration Word 1 at
8007h and Configuration Word 2 at 8008h.
Note:The DEBUG bit in Configuration Word is
managed automatically by device
development tools including debuggers
and programmers. For normal device
operation, this bit should be maintained as
a '1'.
PIC16(L)F1826/27
2011 Microchip Technology Inc.DS41391D-page 43
PIC16(L)F1826/27
REGISTER 4-1:CONFIGURATION WORD 1
R/P-1R/P-1R/P-1R/P-1R/P-1R/P-1/1
FCMENIESOCLKOUTEN
bit 13bit 8
R/P-1R/P-1R/P-1R/P-1R/P-1R/P-1R/P-1R/P-1
CP
bit 7bit 0
Legend:
R = Readable bitP = Programmable bitU = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared‘1’ = Bit is set-n = Value when blank or after Bulk Erase
bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit
bit 12IESO: Internal External Switchover bit
bit 11CLKOUTEN
bit 10-9BOREN<1:0>: Brown-out Reset Enable bits
bit 8CPD: Data Code Protection bit
bit 7CP
bit 6MCLRE: MCLR/VPP Pin Function Select bit
bit 5PWRTE
bit 4-3WDTE<1:0>: Watchdog Timer Enable bit
MCLREPWRTEWDTE<1:0>FOSC<2:0>
1 = Fail-Safe Clock Monitor is enabled
0 = Fail-Safe Clock Monitor is disabled
1 = Internal/External Switchover mode is enabled
0 = Internal/External Switchover mode is disabled
: Clock Out Enable bit
If
FOSC configuration bits are set to LP, XT, HS modes:
This bit is ignored, CLKOUT function is disabled. Oscillator function on the CLKOUT pin.
All other
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
01 = BOR controlled by SBOREN bit of the BORCON register
00 = BOR disabled
1 = Data memory code protection is disabled
0 = Data memory code protection is enabled
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
If LVP bit =
If LVP bit =
1 = PWRT disabled
0 = PWRT enabled
11 = WDT enabled
10 = WDT enabled while running and disabled in Sleep
01 = WDT controlled by the SWDTEN bit in the WDTCON register
00 = WDT disabled
FOSC modes:
1 = CLKOUT function is disabled. I/O function on the CLKOUT pin.
0 = CLKOUT function is enabled on the CLKOUT pin
(2)
: Code Protection bit
1:
This bit is ignored.
0:
1 =MCLR
0 =MCLR
/VPP pin function is MCLR; Weak pull-up enabled.
/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of
WPUE3 bit.
: Power-up Timer Enable bit
BOREN<1:0>CPD
DS41391D-page 44 2011 Microchip Technology Inc.
REGISTER 4-1:CONFIGURATION WORD 1 (CONTINUED)
bit 2-0FOSC<2:0>: Oscillator Selection bits
111 = ECH: External Clock, High-Power mode (4-20 MHz): device clock supplied to CLKIN pin
110 = ECM: External Clock, Medium-Power mode (0.5-4 MHz): device clock supplied to CLKIN pin
101 = ECL: External Clock, Low-Power mode (0-0.5 MHz): device clock supplied to CLKIN pin
100 = INTOSC oscillator: I/O function on CLKIN pin
011 = EXTRC oscillator: External RC circuit connected to CLKIN pin
010 = HS oscillator: High-speed crystal/resonator connected between OSC1 and OSC2 pins
001 = XT oscillator: Crystal/resonator connected between OSC1 and OSC2 pins
000 = LP oscillator: Low-power crystal connected between OSC1 and OSC2 pins
PIC16(L)F1826/27
2011 Microchip Technology Inc.DS41391D-page 45
PIC16(L)F1826/27
REGISTER 4-2:CONFIGURATION WORD 2
R/P-1R/P-1U-1R/P-1R/P-1R/P-1/1
(1)
LVP
bit 13bit 8
U-1U-1U-1R/P-1/1U-1U-1R/P-1R/P-1
———Reserved——WRT<1:0>
bit 7bit 0
Legend:
R = Readable bitP = Programmable bitU = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared‘1’ = Bit is set-n = Value when blank or after Bulk Erase
bit 13LVP: Low-Voltage Programming Enable bit
1 = Low-voltage programming enabled
0 = High-voltage on MCLR
bit 12DEBUG: In-Circuit Debugger Mode bit
1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins
0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger
bit 11Unimplemented: Read as ‘1’
bit 10BORV: Brown-out Reset Voltage Selection bit
1 = Brown-out Reset voltage set to 1.9V (typical)
0 = Brown-out Reset voltage set to 2.5V (typical)
bit 9STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Stack Overflow or Underflow will cause a Reset
0 = Stack Overflow or Underflow will not cause a Reset
bit 8PLLEN: PLL Enable bit
1 = 4xPLL enabled
0 = 4xPLL disabled
bit 7-5Unimplemented: Read as ‘1’
bit 4Reserved: This location should be programmed to a ‘1’.
bit 3-2Unimplemented: Read as ‘1’
bit 1-0WRT<1:0>: Flash Memory Self-Write Protection bits
2 kW Flash memory (PIC16(L)F1826 only)
11 = Write protection off
10 = 000h to 1FFh write-protected, 200h to 7FFh may be modified by EECON control
01 = 000h to 3FFh write-protected, 400h to 7FFh may be modified by EECON control
00 = 000h to 7FFh write-protected, no addresses may be modified by EECON control
4 kW Flash memory (PIC16(L)F1827 only)
11 = Write protection off
10 = 000h to 1FFh write-protected, 200h to FFFh may be modified by EECON control
01 = 000h to 7FFh write-protected, 800h to FFFh may be modified by EECON control
00 = 000h to FFFh write-protected, no addresses may be modified by EECON control
DEBUG
must be used for programming
(2)
—BORVSTVRENPLLEN
:
:
Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
2: The DEBUG
including debuggers and programmers. For normal device operation, this bit should be
maintained as a '1'.
DS41391D-page 46 2011 Microchip Technology Inc.
bit in Configuration Word is managed automatically by device development tools
4.2Code Protection
Code protection allows the device to be protected from
unauthorized access. Program memory protection and
data EEPROM protection are controlled independently.
Internal access to the program memory and data
EEPROM are unaffected by any code protection
setting.
4.2.1PROGRAM MEMORY PROTECTION
The entire program memory space is protected from
external reads and writes by the CP
Word 1. When CP
program memory are inhibited and a read will return all
‘0’s. The CPU can continue to read program memory,
regardless of the protection bit settings. Writing the
program memory is dependent upon the write
protection setting. See Section 4.3 “Write
Protection” for more information.
= 0, external reads and writes of
4.2.2DATA EEPROM PROTECTION
The entire data EEPROM is protected from external
reads and writes by the CPD
nal reads and writes of data EEPROM are inhibited.
The CPU can continue to read and write data EEPROM
regardless of the protection bit settings.
bit in Configuration
bit. When CPD = 0, exter-
PIC16(L)F1826/27
4.3Write Protection
Write protection allows the device to be protected from
unintended self-writes. Applications, such as bootloader software, can be protected while allowing other
regions of the program memory to be modified.
The WRT<1:0> bits in Configuration Word 2 define the
size of the program memory block that is protected.
4.4User ID
Four memory locations (8000h-8003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
readable and writable during normal execution. See
Section 11.5 “User ID, Device ID and Configuration
Word Access” for more information on accessing
these memory locations.
checksum calculation, see the “PIC16F/LF1826/27
Memory Programming Specification” (DS41390).
For more information on
2011 Microchip Technology Inc.DS41391D-page 47
PIC16(L)F1826/27
4.5Device ID and Revision ID
The memory location 8006h is where the Device ID and
Revision ID are stored. The upper nine bits hold the
Device ID. The lower five bits hold the Revision ID. See
Section 11.5 “User ID, Device ID and Configuration
Word Access” for more information on accessing
these memory locations.
Development tools, such as device programmers and
debuggers, may be used to read the Device ID and
Revision ID.
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing performance and minimizing power consumption. Figure 5-1
illustrates a block diagram of the oscillator module.
Clock sources can be supplied from external oscillators,
quartz crystal resonators, ceramic resonators and
Resistor-Capacitor (RC) circuits. In addition, the system
clock source can be supplied from one of two internal
oscillators and PLL circuits, with a choice of speeds
selectable via software. Additional clock features
include:
• Selectable system clock source between external
or internal sources via software.
• Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and
code execution.
• Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP,
XT, HS, EC or RC modes) and switch
automatically to the internal oscillator.
5.XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode (up to 4 MHz)
6.HS – High Gain Crystal or Ceramic Resonator
mode (4 MHz to 20 MHz)
7.RC – External Resistor-Capacitor (RC).
8.INTOSC – Internal oscillator (31 kHz to 32 MHz).
Clock Source modes are selected by the FOSC<2:0>
bits in the Configuration Word 1. The FOSC bits
determine the type of oscillator that will be used when
the device is first powered.
The EC clock mode relies on an external logic level
signal as the device clock source. The LP, XT, and HS
clock modes require an external crystal or resonator to
be connected to the device. Each mode is optimized for
a different frequency range. The RC clock mode
requires an external resistor and capacitor to set the
oscillator frequency.
The INTOSC internal oscillator block produces low,
medium, and high frequency clock sources, designated
LFINTOSC, MFINTOSC, and HFINTOSC. (see
Internal Oscillator Block, Figure 5-1). A wide selection
of device clock frequencies may be derived from these
three clock sources.
Clock sources can be classified as external or internal.
External clock sources rely on external circuitry for the
clock source to function. Examples are: oscillator modules (EC mode), quartz crystal resonators or ceramic
resonators (LP, XT and HS modes) and Resistor-Capacitor (RC) mode circuits.
Internal clock sources are contained internally within
the oscillator module. The internal oscillator block has
two internal oscillators and a dedicated Phase-Lock
Loop (HFPLL) that are used to generate three internal
system clock sources: the 16 MHz High-Frequency
Internal Oscillator (HFINTOSC), 500 kHz (MFINTOSC)
and the 31 kHz Low-Frequency Internal Oscillator
(LFINTOSC).
The system clock can be selected between external or
internal clock sources via the System Clock Select
(SCS) bits in the OSCCON register. See Section 5.3
“Clock Switching” for additional information.
5.2.1EXTERNAL CLOCK SOURCES
An external clock source can be used as the device
system clock by performing one of the following
actions:
• Program the FOSC<2:0> bits in the Configuration
Word 1 to select an external clock source that will
be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to:
- Timer1 Oscillator during run-time, or
- An external clock source determined by the
value of the FOSC bits.
See Section 5.3 “Clock Switching”for more information.
5.2.1.1EC Mode
The External Clock (EC) mode allows an externally
generated logic level signal to be the system clock
source. When operating in this mode, an external clock
source is connected to the OSC1 input.
OSC2/CLKOUT is available for general purpose I/O or
CLKOUT. Figure 5-2 shows the pin connections for EC
mode.
EC mode has 3 power modes to select from through
Configuration Word 1:
• High-power, 4-32 MHz (FOSC = 111)
• Medium power, 0.5-4 MHz (FOSC = 110)
• Low-power, 0-0.5 MHz (FOSC = 101)
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC
®
MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
FIGURE 5-2:EXTERNAL CLOCK (EC)
MODE OPERATION
5.2.1.2LP, XT, HS Modes
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 and OSC2 (Figure 5-3). The three modes select
a low, medium or high gain setting of the internal
inverter-amplifier to support various resonator types
and speed.
LP Oscillator mode selects the lowest gain setting of the
internal inverter-amplifier. LP mode current consumption
is the least of the three modes. This mode is designed to
drive only 32.768 kHz tuning-fork type crystals (watch
crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current consumption is the medium of the three modes.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of the
internal inverter-amplifier. HS mode current consumption
is the highest of the three modes. This mode is best
suited for resonators that require a high drive setting.
Figure 5-3 and Figure 5-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
2011 Microchip Technology Inc.DS41391D-page 53
PIC16(L)F1826/27
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of R
F varies with the Oscillator mode
selected (typically between 2 M to 10 M.
C1
C2
Quartz
R
S
(1)
OSC1/CLKIN
RF
(2)
Sleep
To Internal
Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of R
F varies with the Oscillator mode
selected (typically between 2 M to 10 M.
3: An additional parallel feedback resistor (R
P)
may be required for proper ceramic resonator
operation.
C1
C2
Ceramic
R
S
(1)
OSC1/CLKIN
RF
(2)
Sleep
To Internal
Logic
PIC® MCU
RP
(3)
Resonator
OSC2/CLKOUT
FIGURE 5-3:QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
Note 1: Quartz crystal characteristics vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
DD and temperature range that is
the V
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC
Devices” (DS00826)
• AN849, “Basic PIC
(DS00849)
• AN943, “Practical PICAnalysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
®
and PIC
®
Oscillator Design”
®
Oscillator
FIGURE 5-4:CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
5.2.1.3Oscillator Start-up Timer (OST)
If the oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
®
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
crystal resonator or ceramic resonator, has started and
is providing a stable system clock to the oscillator
module.
In order to minimize latency between external oscillator
start-up and code execution, the Two-Speed Clock
Start-up mode can be selected (see Section 5.4
“Two-Speed Clock Start-up Mode”).
DS41391D-page 54 2011 Microchip Technology Inc.
5.2.1.44X PLL
The oscillator module contains a 4X PLL that can be
used with both external and internal clock sources to
provide a system clock source. The input frequency for
the 4X PLL must fall within specifications. See the PLL
Clock Timing Specifications in Section 30.0
“Electrical Specifications”.
The 4X PLL may be enabled for use by one of two
methods:
1. Program the PLLEN bit in Configuration Word 2
to a ‘1’.
2. Write the SPLLEN bit in the OSCCON register to
a ‘1’. If the PLLEN bit in Configuration Word 2 is
programmed to a ‘1’, then the value of SPLLEN
is ignored.
PIC16(L)F1826/27
C1
C2
32.768 kHz
T1OSI
To Internal
Logic
PIC® MCU
Crystal
T1OSO
Quartz
OSC2/CLKOUT
CEXT
REXT
PIC® MCU
OSC1/CLKIN
F
OSC/4 or
Internal
Clock
VDD
VSS
Recommended values: 10 k REXT 100 k, <3V
3 k R
EXT 100 k, 3-5V
C
EXT > 20 pF, 2-5V
Note 1:Output depends upon CLKOUTEN bit of the
Configuration Word 1.
I/O
(1)
5.2.1.5TIMER1 Oscillator
The Timer1 Oscillator is a separate crystal oscillator
that is associated with the Timer1 peripheral. It is optimized for timekeeping operations with a 32.768 kHz
crystal connected between the T1OSO and T1OSI
device pins.
The Timer1 Oscillator can be used as an alternate system clock source and can be selected during run-time
using clock switching. Refer to Section 5.3 “Clock
Switching” for more information.
FIGURE 5-5:QUARTZ CRYSTAL
OPERATION (TIMER1
OSCILLATOR)
5.2.1.6External RC Mode
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required.
The RC circuit connects to OSC1. OSC2/CLKOUT is
available for general purpose I/O or CLKOUT. The
function of the OSC2/CLKOUT pin is determined by the
state of the CLKOUTEN
bit in Configuration Word 1.
Figure 5-6 shows the external RC mode connections.
FIGURE 5-6:EXTERNAL RC MODES
Note 1: Quartz crystal characteristics vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
DD and temperature range that is
the V
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC
Devices” (DS00826)
• AN849, “Basic PIC
(DS00849)
• AN943, “Practical PIC
2011 Microchip Technology Inc.DS41391D-page 55
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
• TB097, “Interfacing a Micro Crystal
MS1V-T1K 32.768 kHz Tuning Fork
Crystal to a PIC16F690/SS” (DS91097)
• AN1288, “Design Practices for
Low-Power External Oscillators”
(DS01288)
®
and PIC
®
Oscillator Design”
®
Oscillator
The RC oscillator frequency is a function of the supply
voltage, the resistor (R
EXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
• threshold voltage variation
• component tolerances
• packaging variations in capacitance
®
The user also needs to take into account variation due
to tolerance of external RC components used.
PIC16(L)F1826/27
5.2.2INTERNAL CLOCK SOURCES
The device may be configured to use the internal oscillator block as the system clock by performing one of the
following actions:
• Program the FOSC<2:0> bits in Configuration
Word 1 to select the INTOSC clock source, which
will be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to the internal
oscillator during run-time. See Section 5.3
“Clock Switching”for more information.
In INTOSC mode, OSC1/CLKIN is available for general
purpose I/O. OSC2/CLKOUT is available for general
purpose I/O or CLKOUT.
The function of the OSC2/CLKOUT pin is determined
by the state of the CLKOUTEN
Word 1.
The internal oscillator block has two independent
oscillators and a dedicated Phase-Lock Loop, HFPLL
that can produce one of three internal system clock
sources.
1.The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
16 MHz. The HFINTOSC source is generated
from the 500 kHz MFINTOSC source and the
dedicated Phase-Lock Loop, HFPLL. The
frequency of the HFINTOSC can be
user-adjusted via software using the OSCTUNE
register (Register 5-3).
2.The MFINTOSC (Medium-Frequency Internal
Oscillator) is factory calibrated and operates at
500 kHz. The frequency of the MFINTOSC can
be user-adjusted via software using the
OSCTUNE register (Register 5-3).
3.The LFINTOSC (Low-Frequency Internal
Oscillator) is uncalibrated and operates at
31 kHz.
bit in Configuration
5.2.2.1HFINTOSC
The High-Frequency Internal Oscillator (HFINTOSC) is
a factory calibrated 16 MHz internal clock source. The
frequency of the HFINTOSC can be altered via
software using the OSCTUNE register (Register 5-3).
The output of the HFINTOSC connects to a postscaler
and multiplexer (see Figure 5-1). One of nine
frequencies derived from the HFINTOSC can be
selected via software using the IRCF<3:0> bits of the
OSCCON register. See Section5.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The HFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’.
The High Frequency Internal Oscillator Ready bit
(HFIOFR) of the OSCSTAT register indicates when the
HFINTOSC is running and can be utilized.
The High Frequency Internal Oscillator Status Locked
bit (HFIOFL) of the OSCSTAT register indicates when
the HFINTOSC is running within 2% of its final value.
The High Frequency Internal Oscillator Status Stable
bit (HFIOFS) of the OSCSTAT register indicates when
the HFINTOSC is running within 0.5% of its final value.
5.2.2.2MFINTOSC
The Medium-Frequency Internal Oscillator
(MFINTOSC) is a factory calibrated 500 kHz internal
clock source. The frequency of the MFINTOSC can be
altered via software using the OSCTUNE register
(Register 5-3).
The output of the MFINTOSC connects to a postscaler
and multiplexer (see Figure 5-1). One of nine
frequencies derived from the MFINTOSC can be
selected via software using the IRCF<3:0> bits of the
OSCCON register. See Section5.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The MFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
The Medium Frequency Internal Oscillator Ready bit
(MFIOFR) of the OSCSTAT register indicates when the
MFINTOSC is running and can be utilized.
DS41391D-page 56 2011 Microchip Technology Inc.
PIC16(L)F1826/27
5.2.2.3Internal Oscillator Frequency
Adjustment
The 500 kHz internal oscillator is factory calibrated.
This internal oscillator can be adjusted in software by
writing to the OSCTUNE register (Register 5-3). Since
the HFINTOSC and MFINTOSC clock sources are
derived from the 500 kHz internal oscillator a change in
the OSCTUNE register value will apply to both.
The default value of the OSCTUNE register is ‘0’. The
value is a 6-bit two’s complement number. A value of
1Fh will provide an adjustment to the maximum
frequency. A value of 20h will provide an adjustment to
the minimum frequency.
When the OSCTUNE register is modified, the oscillator
frequency will begin shifting to the new frequency. Code
execution continues during this shift. There is no
indication that the shift has occurred.
OSCTUNE does not affect the LFINTOSC frequency.
Operation of features that depend on the LFINTOSC
clock source frequency, such as the Power-up Timer
(PWRT), Watchdog Timer (WDT), Fail-Safe Clock
Monitor (FSCM) and peripherals, are not affected by the
change in frequency.
5.2.2.4LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is
an uncalibrated 31 kHz internal clock source.
The output of the LFINTOSC connects to a postscaler
and multiplexer (see Figure 5-1). Select 31 kHz, via
software, using the IRCF<3:0> bits of the OSCCON
register. See Section 5.2.2.7 “Internal Oscillator
Clock Switch Timing” for more information. The
LFINTOSC is also the frequency for the Power-up Timer
(PWRT), Watchdog Timer (WDT) and Fail-Safe Clock
Monitor (FSCM).
The LFINTOSC is enabled by selecting 31 kHz
(IRCF<3:0> bits of the OSCCON register = 000) as the
system clock source (SCS bits of the OSCCON
register = 1x), or when any of the following are
enabled:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired LF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
Peripherals that use the LFINTOSC are:
• Power-up Timer (PWRT)
• Watchdog Timer (WDT)
• Fail-Safe Clock Monitor (FSCM)
The Low Frequency Internal Oscillator Ready bit
(LFIOFR) of the OSCSTAT register indicates when the
LFINTOSC is running and can be utilized.
5.2.2.5Internal Oscillator Frequency
Selection
The system clock speed can be selected via software
using the Internal Oscillator Frequency Select bits
IRCF<3:0> of the OSCCON register.
The output of the 16 MHz HFINTOSC and 31 kHz
LFINTOSC connects to a postscaler and multiplexer
(see Figure 5-1). The Internal Oscillator Frequency
Select bits IRCF<3:0> of the OSCCON register select
the frequency output of the internal oscillators. One of
the following frequencies can be selected via software:
• 32 MHz (requires 4X PLL)
•16 MHz
•8 MHz
•4 MHz
•2 MHz
•1 MHz
• 500 kHz (Default after Reset)
•250 kHz
•125 kHz
•62.5 kHz
•31.25 kHz
• 31 kHz (LFINTOSC)
Note:Following any Reset, the IRCF<3:0> bits
of the OSCCON register are set to ‘0111’
and the frequency selection is set to
500 kHz. The user can modify the IRCF
bits to select a different frequency.
The IRCF<3:0> bits of the OSCCON register allow
duplicate selections for some frequencies. These duplicate choices can offer system design trade-offs. Lower
power consumption can be obtained when changing
oscillator sources for a given frequency. Faster transition times can be obtained between frequency changes
that use the same oscillator source.
2011 Microchip Technology Inc.DS41391D-page 57
PIC16(L)F1826/27
5.2.2.632 MHz Internal Oscillator
Frequency Selection
The Internal Oscillator Block can be used with the 4X
PLL associated with the External Oscillator Block to
produce a 32 MHz internal system clock source. The
following settings are required to use the 32 MHz internal clock source:
• The FOSC bits in Configuration Word 1 must be
set to use the INTOSC source as the device system clock (FOSC<2:0> = 100).
• The SCS bits in the OSCCON register must be
cleared to use the clock determined by
FOSC<2:0> in Configuration Word 1
(SCS<1:0> = 00).
• The IRCF bits in the OSCCON register must be
set to the 8 MHz HFINTOSC set to use
(IRCF<3:0> = 1110).
• The SPLLEN bit in the OSCCON register must be
set to enable the 4xPLL, or the PLLEN bit of the
Configuration Word 2 must be programmed to a
‘1’.
Note:When using the PLLEN bit of the
Configuration Word 2, the 4xPLL cannot
be disabled by software and the 8 MHz
HFINTOSC option will no longer be
available.
The 4xPLL is not available for use with the internal
oscillator when the SCS bits of the OSCCON register
are set to ‘1x’. The SCS bits must be set to ‘00’ to use
the 4xPLL with the internal oscillator.
5.2.2.7Internal Oscillator Clock Switch
Timing
When switching between the HFINTOSC, MFINTOSC
and the LFINTOSC, the new oscillator may already be
shut down to save power (see Figure 5-7). If this is the
case, there is a delay after the IRCF<3:0> bits of the
OSCCON register are modified before the frequency
selection takes place. The OSCSTAT register will
reflect the current active status of the HFINTOSC,
MFINTOSC and LFINTOSC oscillators. The sequence
of a frequency selection is as follows:
1.IRCF<3:0> bits of the OSCCON register are
modified.
2. If the new clock is shut down, a clock start-up
delay is started.
3. Clock switch circuitry waits for a falling edge of
the current clock.
4. The current clock is held low and the clock
switch circuitry waits for a rising edge in the new
clock.
5. The new clock is now active.
6. The OSCSTAT register is updated as required.
7.Clock switch is complete.
See Figure 5-7 for more details.
If the internal oscillator speed is switched between two
clocks of the same source, there is no start-up delay
before the new frequency is selected. Clock switching
time delays are shown in Table 5-1.
Start-up delay specifications are located in the
oscillator tables of Section 30.0 “Electrical
Specifications”.
DS41391D-page 58 2011 Microchip Technology Inc.
FIGURE 5-7:INTERNAL OSCILLATOR SWITCH TIMING
HFINTOSC/
LFINTOSC
IRCF <3:0>
System Clock
HFINTOSC/
LFINTOSC
IRCF <3:0>
System Clock
00
00
Start-up Time
2-cycle SyncRunning
2-cycle SyncRunning
HFINTOSC/LFINTOSC (FSCM and WDT disabled)
HFINTOSC/
LFINTOSC (Either FSCM or WDT enabled)
LFINTOSC
HFINTOSC/
IRCF <3:0>
System Clock
= 00
Start-up Time 2-cycle Sync
Running
LFINTOSCHFINTOSC/MFINTOSC
LFINTOSC turns off unless WDT or FSCM is enabled
MFINTOSC
MFINTOSC
MFINTOSC
MFINTOSC
MFINTOSC
PIC16(L)F1826/27
2011 Microchip Technology Inc.DS41391D-page 59
PIC16(L)F1826/27
5.3Clock Switching
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS) bits of the OSCCON
register. The following clock sources can be selected
using the SCS bits:
• Default system oscillator determined by FOSC
bits in Configuration Word 1
• Timer1 32 kHz crystal oscillator
• Internal Oscillator Block (INTOSC)
5.3.1SYSTEM CLOCK SELECT (SCS)
BITS
The System Clock Select (SCS) bits of the OSCCON
register selects the system clock source that is used for
the CPU and peripherals.
• When the SCS bits of the OSCCON register = 00,
the system clock source is determined by value of
the FOSC<2:0> bits in the Configuration Word 1.
• When the SCS bits of the OSCCON register = 01,
the system clock source is the Timer1 oscillator.
• When the SCS bits of the OSCCON register = 1x,
the system clock source is chosen by the internal
oscillator frequency selected by the IRCF<3:0>
bits of the OSCCON register. After a Reset, the
SCS bits of the OSCCON register are always
cleared.
Note:Any automatic clock switch, which may
occur from Two-Speed Start-up or
Fail-Safe Clock Monitor, does not update
the SCS bits of the OSCCON register. The
user can monitor the OSTS bit of the
OSCSTAT register to determine the current
system clock source.
5.3.3TIMER1 OSCILLATOR
The Timer1 Oscillator is a separate crystal oscillator
associated with the Timer1 peripheral. It is optimized
for timekeeping operations with a 32.768 kHz crystal
connected between the T1OSO and T1OSI device
pins.
The Timer1 oscillator is enabled using the T1OSCEN
control bit in the T1CON register. See Section 21.0
“Timer1 Module with Gate Control” for more
information about the Timer1 peripheral.
5.3.4TIMER1 OSCILLATOR READY
(T1OSCR) BIT
The user must ensure that the Timer1 Oscillator is
ready to be used before it is selected as a system clock
source. The Timer1 Oscillator Ready (T1OSCR) bit of
the OSCSTAT register indicates whether the Timer1
oscillator is ready to be used. After the T1OSCR bit is
set, the SCS bits can be configured to select the Timer1
oscillator.
When switching between clock sources, a delay is
required to allow the new clock to stabilize. These oscillator delays are shown in Table 5-1.
5.3.2OSCILLATOR START-UP TIME-OUT
STATUS (OSTS) BIT
The Oscillator Start-up Time-out Status (OSTS) bit of
the OSCSTAT register indicates whether the system
clock is running from the external clock source, as
defined by the FOSC<2:0> bits in the Configuration
Word 1, or from the internal clock source. In particular,
OSTS indicates that the Oscillator Start-up Timer
(OST) has timed out for LP, XT or HS modes. The OST
does not reflect the status of the Timer1 Oscillator.
DS41391D-page 60 2011 Microchip Technology Inc.
PIC16(L)F1826/27
5.4Two-Speed Clock Start-up Mode
Two-Speed Start-up mode provides additional power
savings by minimizing the latency between external
oscillator start-up and code execution. In applications
that make heavy use of the Sleep mode, Two-Speed
Start-up will remove the external oscillator start-up
time from the time spent awake and can reduce the
overall power consumption of the device. This mode
allows the application to wake-up from Sleep, perform
a few instructions using the INTOSC internal oscillator
block as the clock source and go back to Sleep without
waiting for the external oscillator to become stable.
Two-Speed Start-up provides benefits when the oscillator module is configured for LP, XT, or HS modes.
The Oscillator Start-up Timer (OST) is enabled for
these modes and must count 1024 oscillations before
the oscillator can be used as the system clock source.
If the oscillator module is configured for any mode
other than LP, XT or HS mode, then Two-Speed
Start-up is disabled. This is because the external clock
oscillator does not require any stabilization time after
POR or an exit from Sleep.
If the OST count reaches 1024 before the device
enters Sleep mode, the OSTS bit of the OSCSTAT register is set and program execution switches to the
external oscillator. However, the system may never
operate from the external oscillator if the time spent
awake is very short.
Note:Executing a SLEEP instruction will abort
the oscillator start-up time and will cause
the OSTS bit of the OSCSTAT register to
remain clear.
5.4.1TWO-SPEED START-UP MODE
CONFIGURATION
Two-Speed Start-up mode is configured by the
following settings:
• IESO (of the Configuration Word 1) = 1; Inter-
nal/External Switchover bit (Two-Speed Start-up
mode enabled).
• SCS (of the OSCCON register) = 00.
• FOSC<2:0> bits in the Configuration Word 1
configured for LP, XT or HS mode.
Two-Speed Start-up mode is entered after:
• Power-on Reset (POR) and, if enabled, after
Power-up Timer (PWRT) has expired, or
• Wake-up from Sleep.
TABLE 5-1:OSCILLATOR SWITCHING DELAYS
Switch FromSwitch ToFrequencyOscillator Delay
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
31 kHz
31.25 kHz-500 kHz
Oscillator Warm-up Delay (T
31.25kHz-16MHz
DC – 32 MHz2 cycles
DC – 32 MHz1 cycle of each
32 kHz-20 MHz1024 Clock Cycles (OST)
31.25 kHz-500 kHz
31.25kHz-16MHz
2 s (approx.)
31 kHz1 cycle of each
WARM)
LFINTOSC
Sleep/POR
MFINTOSC
HFINTOSC
Sleep/POREC, RC
LFINTOSCEC, RC
Sleep/POR
Any clock source
Timer1 Oscillator
LP, XT, HS
MFINTOSC
HFINTOSC
Any clock sourceLFINTOSC
Any clock sourceTimer1 Oscillator32 kHz1024 Clock Cycles (OST)
PLL inactivePLL active16-32 MHz2 ms (approx.)
Note 1: PLL inactive.
2011 Microchip Technology Inc.DS41391D-page 61
PIC16(L)F1826/27
011022 1023
PC + 1
TOSTT
INTOSC
OSC1
OSC2
Program Counter
System Clock
PC - N
PC
5.4.2TWO-SPEED START-UP
SEQUENCE
1. Wake-up from Power-on Reset or Sleep.
2.Instructions begin execution by the internal
oscillator at the frequency set in the IRCF<3:0>
bits of the OSCCON register.
3. OST enabled to count 1024 clock cycles.
4.OST timed out, wait for falling edge of the
internal oscillator.
5.OSTS is set.
6. System clock held low until the next falling edge
of new clock (LP, XT or HS mode).
7. System clock is switched to external clock
source.
FIGURE 5-8:TWO-SPEED START-UP
5.4.3CHECKING TWO-SPEED CLOCK
STATUS
Checking the state of the OSTS bit of the OSCSTAT
register will confirm if the microcontroller is running
from the external clock source, as defined by the
FOSC<2:0> bits in the Configuration Word 1, or the
internal oscillator.
DS41391D-page 62 2011 Microchip Technology Inc.
PIC16(L)F1826/27
External
LFINTOSC
÷ 64
S
R
Q
31 kHz
(~32 s)
488 Hz
(~2 ms)
Clock Monitor
Latch
Clock
Failure
Detected
Oscillator
Clock
Q
Sample Clock
5.5Fail-Safe Clock Monitor
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue operating should the external oscillator fail.
The FSCM can detect oscillator failure any time after
the Oscillator Start-up Timer (OST) has expired. The
FSCM is enabled by setting the FCMEN bit in the
Configuration Word 1. The FSCM is applicable to all
external Oscillator modes (LP, XT, HS, EC, Timer1
Oscillator and RC).
FIGURE 5-9:FSCM BLOCK DIAGRAM
5.5.1FAIL-SAFE DETECTION
The FSCM module detects a failed oscillator by
comparing the external oscillator to the FSCM sample
clock. The sample clock is generated by dividing the
LFINTOSC by 64. See Figure 5-9. Inside the fail
detector block is a latch. The external clock sets the
latch on each falling edge of the external clock. The
sample clock clears the latch on each rising edge of the
sample clock. A failure is detected when an entire
half-cycle of the sample clock elapses before the
external clock goes low.
5.5.3FAIL-SAFE CONDITION CLEARING
The Fail-Safe condition is cleared after a Reset,
executing a SLEEP instruction or changing the SCS bits
of the OSCCON register. When the SCS bits are
changed, the OST is restarted. While the OST is
running, the device continues to operate from the
INTOSC selected in OSCCON. When the OST times
out, the Fail-Safe condition is cleared and the device
will be operating from the external clock source. The
Fail-Safe condition must be cleared before the OSFIF
flag can be cleared.
5.5.4RESET OR WAKE-UP FROM SLEEP
The FSCM is designed to detect an oscillator failure
after the Oscillator Start-up Timer (OST) has expired.
The OST is used after waking up from Sleep and after
any type of Reset. The OST is not used with the EC or
RC Clock modes so that the FSCM will be active as
soon as the Reset or wake-up has completed. When
the FSCM is enabled, the Two-Speed Start-up is also
enabled. Therefore, the device will always be executing
code while the OST is operating.
Note:Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active
during oscillator start-up (i.e., after exiting
Reset or Sleep). After an appropriate
amount of time, the user should check the
Status bits in the OSCSTAT register to
verify the oscillator start-up and that the
system clock switchover has successfully
completed.
5.5.2FAIL-SAFE OPERATION
When the external clock fails, the FSCM switches the
device clock to an internal clock source and sets the bit
flag OSFIF of the PIR2 register. Setting this flag will
generate an interrupt if the OSFIE bit of the PIE2
register is also set. The device firmware can then take
steps to mitigate the problems that may arise from a
failed clock. The system clock will continue to be
sourced from the internal clock source until the device
firmware successfully restarts the external oscillator
and switches back to external operation.
The internal clock source chosen by the FSCM is
determined by the IRCF<3:0> bits of the OSCCON
register. This allows the internal oscillator to be
configured before a failure occurs.
2011 Microchip Technology Inc.DS41391D-page 63
PIC16(L)F1826/27
OSCFIF
System
Clock
Output
Sample Clock
Failure
Detected
Oscillator
Failure
Note:The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7SPLLEN: Software PLL Enable bit
If PLLEN in Configuration Word 1 =
SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements)
If PLLEN in Configuration Word 1 = 0:1 = 4x PLL Is enabled
0 = 4x PLL is disabled
bit 6-3IRCF<3:0>: Internal Oscillator Frequency Select bits
bit 2Unimplemented: Read as ‘0’
bit 1-0SCS<1:0>: System Clock Select bits
1x = Internal oscillator block
01 = Timer1 oscillator
00 = Clock determined by FOSC<2:0> in Configuration Word 1.
(1)
(1)
(1)
(1)
1:
—
SCS<1:0>
Note 1: Duplicate frequency derived from HFINTOSC.
2011 Microchip Technology Inc.DS41391D-page 65
PIC16(L)F1826/27
REGISTER 5-2:OSCSTAT: OSCILLATOR STATUS REGISTER
R-1/qR-0/qR-q/qR-0/qR-0/qR-q/qR-0/0R-0/q
T1OSCRPLLROSTSHFIOFRHFIOFLMFIOFRLFIOFRHFIOFS
bit 7bit 0
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is clearedq = Conditional
bit 7T1OSCR: Timer1 Oscillator Ready bit
If T1OSCEN =
1 = Timer1 oscillator is ready
0 = Timer1 oscillator is not ready
If T1OSCEN =
1 = Timer1 clock source is always ready
bit 6PLLR 4x PLL Ready bit
1 = 4x PLL is ready
0 = 4x PLL is not ready
bit 5OSTS: Oscillator Start-up Time-out Status bit
1 = Running from the clock defined by the FOSC<2:0> bits of the Configuration Word 1
0 = Running from an internal oscillator (FOSC<2:0> = 100)
bit 4HFIOFR: High Frequency Internal Oscillator Ready bit
1 = HFINTOSC is ready
0 = HFINTOSC is not ready
bit 3HFIOFL: High Frequency Internal Oscillator Locked bit
1 = HFINTOSC is at least 2% accurate
0 = HFINTOSC is not 2% accurate
bit 2MFIOFR: Medium Frequency Internal Oscillator Ready bit
1 = MFINTOSC is ready
0 = MFINTOSC is not ready
bit 1LFIOFR: Low Frequency Internal Oscillator Ready bit
1 = LFINTOSC is ready
0 = LFINTOSC is not ready
bit 0HFIOFS: High Frequency Internal Oscillator Stable bit
1 = HFINTOSC is at least 0.5% accurate
0 = HFINTOSC is not 0.5% accurate
1:
0:
DS41391D-page 66 2011 Microchip Technology Inc.
PIC16(L)F1826/27
REGISTER 5-3:OSCTUNE: OSCILLATOR TUNING REGISTER
U-0U-0R/W-0/0R/W-0/0R/W-0/0R/W-0/0R/W-0/0R/W-0/0
——TUN<5:0>
bit 7bit 0
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7-6Unimplemented: Read as ‘0’
bit 5-0TUN<5:0>: Frequency Tuning bits
011111 = Maximum frequency
011110 =
•
•
•
000001 =
000000 = Oscillator module is running at the factory-calibrated frequency.
111111 =
•
•
•
100000 = Minimum frequency
TABLE 5-2:SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
(1)
(1)
Register
on Page
94
97
187
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
OSCCONSPLLENIRCF3IRCF2IRCF1IRCF0
OSCSTATT1OSCRPLLROSTSHFIOFRHFIOFLMFIOFRLFIOFR
OSCTUNE
PIE2OSFIE
PIR2
T1CON
Legend:— = unimplemented locations read as ‘0’. Shaded cells are not used by clock sources.
Note 1:PIC16(L)F1827 only.
Legend:— = unimplemented locations read as ‘0’. Shaded cells are not used by clock sources.
13:8
7:0
——FCMENIESOCLKOUTEN BOREN1BOREN0CPD
CPMCLREPWRTEWDTE1WDTE0FOSC2FOSC1FOSC0
Register
on Page
50
2011 Microchip Technology Inc.DS41391D-page 67
PIC16(L)F1826/27
NOTES:
DS41391D-page 68 2011 Microchip Technology Inc.
PIC16(L)F1826/27
6.0REFERENCE CLOCK MODULE
The reference clock module provides the ability to send
a divided clock to the clock output pin of the device
(CLKR) and provide a secondary internal clock source
to the modulator module. This module is available in all
oscillator configurations and allows the user to select a
greater range of clock submultiples to drive external
devices in the application. The reference clock module
includes the following features:
• System clock is the source
• Available in all oscillator configurations
• Programmable clock divider
• Output enable to a port pin
• Selectable duty cycle
• Slew rate control
The reference clock module is controlled by the
CLKRCON register (Register 6-1) and is enabled when
setting the CLKREN bit. To output the divided clock signal to the CLKR port pin, the CLKROE bit must be set.
The CLKRDIV<2:0> bits enable the selection of 8 different clock divider options. The CLKRDC<1:0> bits
can be used to modify the duty cycle of the output
(1)
. The CLKRSLR bit controls slew rate limiting.
clock
Note 1: If the base clock rate is selected without
a divider, the output clock will always
have a duty cycle equal to that of the
source clock, unless a 0% duty cycle is
selected. If the clock divider is set to base
clock/2, then 25% and 75% duty cycle
accuracy will be dependent upon the
source clock.
For information on using the reference clock output
with the modulator module, see Section 23.0 “Data
Signal Modulator”.
6.3Conflicts with the CLKR Pin
There are two cases when the reference clock output
signal cannot be output to the CLKR pin, if:
• LP, XT or HS Oscillator mode is selected.
• CLKOUT function is enabled.
Even if either of these cases are true, the module can
still be enabled and the reference clock signal may be
used in conjunction with the modulator module.
6.3.1OSCILLATOR MODES
If LP, XT or HS oscillator modes are selected, the
OSC2/CLKR pin must be used as an oscillator input pin
and the CLKR output cannot be enabled. See
Section 5.2 “Clock Source Types” for more informa-
tion on different oscillator modes.
6.3.2CLKOUT FUNCTION
The CLKOUT function has a higher priority than the
reference clock module. Therefore, if the CLKOUT
function is enabled by the CLKOUTEN
tion Word 1, F
pin. Reference Section 4.0 “Device Configuration”
for more information.
OSC/4 will always be output on the port
bit in Configura-
6.4Operation During Sleep
As the reference clock module relies on the system
clock as its source, and the system clock is disabled in
Sleep, the module does not function in Sleep, even if
an external clock source or the Timer1 clock source is
configured as the system clock. The module outputs
will remain in their current state until the device exits
Sleep.
6.1Slew Rate
The slew rate limitation on the output port pin can be
disabled. The slew rate limitation can be removed by
clearing the CLKRSLR bit in the CLKRCON register.
6.2Effects of a Reset
Upon any device Reset, the reference clock module is
disabled. The user's firmware is responsible for
initializing the module before enabling the output. The
registers are reset to their default values.
2011 Microchip Technology Inc.DS41391D-page 69
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6.5Reference Clock Control Register
REGISTER 6-1:CLKRCON: REFERENCE CLOCK CONTROL REGISTER
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7CLKREN: Reference Clock Module Enable bit
1 = Reference Clock module is enabled
0 = Reference Clock module is disabled
bit 6CLKROE: Reference Clock Output Enable bit
1 = Reference Clock output is enabled on CLKR pin
0 = Reference Clock output disabled on CLKR pin
bit 5CLKRSLR: Reference Clock Slew Rate Control limiting enable bit
1 = Slew Rate limiting is enabled
0 = Slew Rate limiting is disabled
bit 4-3CLKRDC<1:0>: Reference Clock Duty Cycle bits
11 = Clock outputs duty cycle of 75%
10 = Clock outputs duty cycle of 50%
01 = Clock outputs duty cycle of 25%
00 = Clock outputs duty cycle of 0%
bit 2-0CLKRDIV<2:0> Reference Clock Divider bits
111 = Base clock value divided by 128
110 = Base clock value divided by 64
101 = Base clock value divided by 32
100 = Base clock value divided by 16
011 = Base clock value divided by 8
010 = Base clock value divided by 4
001 = Base clock value divided by 2
000 = Base clock value
(2)
(1)
(3)
Note 1: In this mode, the 25% and 75% duty cycle accuracy will be dependent on the source clock duty cycle.
2: In this mode, the duty cycle will always be equal to the source clock duty cycle, unless a duty cycle of 0%
is selected.
3: To route CLKR to pin, CLKOUTEN
Word 1 = 0 will result in F
DS41391D-page 70 2011 Microchip Technology Inc.
OSC/4. See Section 6.3 “Conflicts with the CLKR Pin” for details.
of Configuration Word 1 = 1 is required. CLKOUTEN of Configuration
PIC16(L)F1826/27
TABLE 6-1:SUMMARY OF REGISTERS ASSOCIATED WITH REFERENCE CLOCK SOURCES
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
CLKRCONCLKRENCLKROE CLKRSLR CLKRDC1CLKRDC0
Legend:— = unimplemented locations read as ‘0’. Shaded cells are not used by reference clock sources.
CLKRDIV2 CLKRDIV1 CLKRDIV0
TABLE 6-2:SUMMARY OF CONFIGURATION WORD WITH REFERENCE CLOCK SOURCES
Legend:— = unimplemented locations read as ‘0’. Shaded cells are not used by reference clock sources.
13:8
7:0
——FCMENIESOCLKOUTEN BOREN1BOREN0CPD
CPMCLREPWRTEWDTE1WDTE0FOSC2FOSC1FOSC0
Register
on Page
70
Register
on Page
44
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NOTES:
DS41391D-page 72 2011 Microchip Technology Inc.
PIC16(L)F1826/27
External Reset
MCLR
VDD
WDT
Time-out
Power-on
Reset
LFINTOSC
PWRT
64 ms
PWRTEN
Brown-out
Reset
BOR
RESET Instruction
Stack
Pointer
Stack Overflow/Underflow Reset
Sleep
MCLRE
Enable
Device
Reset
Zero
Programming Mode Exit
7.0RESETS
There are multiple ways to reset this device:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
•MCLR
•WDT Reset
• RESET instruction
• Stack Overflow
• Stack Underflow
• Programming mode exit
To a llo w V
can be enabled to extend the Reset time after a BOR
or POR event.
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 7-1.
FIGURE 7-1:SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Reset
DD to stabilize, an optional power-up timer
2011 Microchip Technology Inc.DS41391D-page 73
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7.1Power-on Reset (POR)
The POR circuit holds the device in Reset until VDD has
reached an acceptable level for minimum operation.
Slow rising V
performance may require greater than minimum V
The PWRT, BOR or MCLR
extend the start-up period until all device operation
conditions have been met.
7.1.1POWER-UP TIMER (PWRT)
The Power-up Timer provides a nominal 64 ms timeout on POR or Brown-out Reset.
The device is held in Reset as long as PWRT is active.
The PWRT delay allows additional time for the V
rise to an acceptable level. The Power-up Timer is
enabled by clearing the PWRTE bit in Configuration
Word 1.
The Power-up Timer starts after the release of the POR
and BOR.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
TABLE 7-1:BOR OPERATING MODES
BOREN<1:0>SBORENDevice ModeBOR Mode
DD, fast operating speeds or analog
DD.
features can be used to
DD to
11XXActiveWaits for BOR ready
AwakeActive
10X
SleepDisabled
7.2Brown-Out Reset (BOR)
The BOR circuit holds the device in Reset when Vdd
reaches a selectable minimum level. Between the
POR and BOR, complete voltage range coverage for
execution protection can be implemented.
The Brown-out Reset module has four operating
modes controlled by the BOREN<1:0> bits in Configuration Word 1. The four operating modes are:
• BOR is always on
• BOR is off when in Sleep
• BOR is controlled by software
• BOR is always off
Refer to Tab le 7 -1 for more information.
The Brown-out Reset voltage level is selectable by
configuring the BORV bit in Configuration Word 2.
DD noise rejection filter prevents the BOR from trig-
A V
gering on small events. If V
duration greater than parameter T
will reset. See Figure 7-2 for more information.
Device Operation
upon release of POR
DD falls below VBOR for a
BORDC, the device
Device Operation
upon wake- up from
Sleep
(1)
Waits for BOR ready
01
00XXDisabledBegins immediately
Note 1: Even though this case specifically waits for the BOR, the BOR is already operating, so there is no delay in
start-up.
1
X
0DisabledBegins immediately
7.2.1BOR IS ALWAYS ON
When the BOREN bits of Configuration Word 1 are set
to ‘11’, the BOR is always on. The device start-up will
be delayed until the BOR is ready and V
than the BOR threshold.
BOR protection is active during Sleep. The BOR does
not delay wake-up from Sleep.
DD is higher
7.2.2BOR IS OFF IN SLEEP
When the BOREN bits of Configuration Word 1 are set
to ‘10’, the BOR is on, except in Sleep. The device
start-up will be delayed until the BOR is ready and VDD
is higher than the BOR threshold.
BOR protection is not active during Sleep. The device
wake-up will be delayed until the BOR is ready.
ActiveBegins immediately
7.2.3BOR CONTROLLED BY SOFTWARE
When the BOREN bits of Configuration Word 1 are set
to ‘01’, the BOR is controlled by the SBOREN bit of the
BORCON register. The device start-up is not delayed
by the BOR ready condition or the V
BOR protection begins as soon as the BOR circuit is
ready. The status of the BOR circuit is reflected in the
BORRDY bit of the BORCON register.
BOR protection is unchanged by Sleep.
DD level.
DS41391D-page 74 2011 Microchip Technology Inc.
FIGURE 7-2: BROWN-OUT SITUATIONS
TPWRT
(1)
VBOR
V
DD
Internal
Reset
VBOR
V
DD
Internal
Reset
TPWRT
(1)
< TPWRT
TPWRT
(1)
VBOR
V
DD
Internal
Reset
Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’.
PIC16(L)F1826/27
REGISTER 7-1:BORCON: BROWN-OUT RESET CONTROL REGISTER
R/W-1/uU-0U-0U-0U-0U-0U-0R-q/u
SBOREN
bit 7bit 0
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is clearedq = Value depends on condition
bit 7SBOREN: Software Brown-out Reset Enable bit
bit 6-1Unimplemented: Read as ‘0’
bit 0BORRDY: Brown-out Reset Circuit Ready Status bit
——————BORRDY
If BOREN <1:0> in Configuration Word 1
01:
SBOREN is read/write, but has no effect on the BOR.
If BOREN <1:0> in Configuration Word 1 =
01:
1 = BOR Enabled
0 = BOR Disabled
1 = The Brown-out Reset circuit is active
0 = The Brown-out Reset circuit is inactive
2011 Microchip Technology Inc.DS41391D-page 75
PIC16(L)F1826/27
7.3MCLR
The MCLR is an optional external input that can reset
the device. The MCLR
MCLRE bit of Configuration Word 1 and the LVP bit of
Configuration Word 2 (Ta b le 7 - 2).
function is controlled by the
TABLE 7-2:MCLR CONFIGURATION
MCLRELVPMCLR
00Disabled
10Enabled
x1Enabled
7.3.1MCLR ENABLED
When MCLR is enabled and the pin is held low, the
device is held in Reset. The MCLR
DD through an internal weak pull-up.
V
The device has a noise filter in the MCLR
The filter will detect and ignore small pulses.
Note:A Reset does not drive the MCLR pin low.
pin is connected to
Reset path.
7.3.2MCLR DISABLED
When MCLR is disabled, the pin functions as a general
purpose input and the internal weak pull-up is under
software control. See Section 12.2 “PORTA Regis-
ters” for more information.
7.4Watchdog Timer (WDT) Reset
The Watchdog Timer generates a Reset if the firmware
does not issue a CLRWDT instruction within the time-out
period. The TO and PD bits in the STATUS register are
changed to indicate the WDT Reset. See Section 10.0
“Watchdog Timer” for more information.
7.7Programming Mode Exit
Upon exit of Programming mode, the device will
behave as if a POR had just occurred.
7.8Power-Up Timer
The Power-up Timer optionally delays device execution
after a BOR or POR event. This timer is typically used to
allow VDD to stabilize before allowing the device to start
running.
The Power-up Timer is controlled by the PWRTE
Configuration Word 1.
bit of
7.9Start-up Sequence
Upon the release of a POR or BOR, the following must
occur before the device will begin executing:
1. Power-up Timer runs to completion (if enabled).
2. Oscillator start-up timer runs to completion (if
required for oscillator source).
3. MCLR
The total time-out will vary based on oscillator configuration and Power-up Timer configuration. See
Section 5.0 “Oscillator Module (With Fail-Safe
Clock Monitor)” for more information.
The Power-up Timer and oscillator start-up timer run
independently of MCLR
long enough, the Power-up Timer and oscillator startup timer will expire. Upon bringing MCLR
device will begin execution immediately (see Figure 7-
3). This is useful for testing purposes or to synchronize
more than one device operating in parallel.
must be released (if enabled).
Reset. If MCLR is kept low
high, the
7.5RESET Instruction
A RESET instruction will cause a device Reset. The RI
bit in the PCON register will be set to ‘0’. See Ta b le 7 -4
for default conditions after a RESET instruction has
occurred.
7.6Stack Overflow/Underflow Reset
The device can reset when the Stack Overflows or
Underflows. The STKOVF or STKUNF bits of the PCON
register indicate the Reset condition. These Resets are
enabled by setting the STVREN bit in Configuration Word
2. See Section 3 .4.2 “Overflow/Underflow Reset”for
more information.
DS41391D-page 76 2011 Microchip Technology Inc.
FIGURE 7-3:RESET START-UP SEQUENCE
TOST
TMCLR
TPWRT
VDD
Internal POR
Power-Up Timer
MCLR
Internal RESET
Oscillator Modes
Oscillator Start-Up Timer
Oscillator
F
OSC
Internal Oscillator
Oscillator
F
OSC
External Clock (EC)
CLKIN
F
OSC
External Crystal
PIC16(L)F1826/27
2011 Microchip Technology Inc.DS41391D-page 77
PIC16(L)F1826/27
7.10Determining the Cause of a Reset
Upon any Reset, multiple bits in the STATUS and
PCON register are updated to indicate the cause of the
Reset. Ta b le 7 - 3 and Ta b le 7 - 4 show the Reset conditions of these registers.
TABLE 7-3:RESET STATUS BITS AND THEIR SIGNIFICANCE
STKOVF STKUNF RMCLRRIPORBORTOPDCondition
00110x11Power-on Reset
00110x0xIllegal, TO
00110xx0Illegal, PD is set on POR
0011u011Brown-out Reset
uuuuuu0uWDT Reset
uuuuuu00WDT Wake-up from Sleep
uuuuuu10Interrupt Wake-up from Sleep
uu0uuuuuMCLR
uu0uuu10MCLR
uuu0uuuuRESET Instruction Executed
1uuuuuuuStack Overflow Reset (STVREN = 1)
u1uuuuuuStack Underflow Reset (STVREN = 1)
is set on POR
Reset during normal operation
Reset during Sleep
(1)
(2)
STATUS
Register
---1 0uuuuu-- uuuu
PCON
Register
TABLE 7-4:RESET CONDITION FOR SPECIAL REGISTERS
Condition
Power-on Reset0000h---1 100000-- 110x
MCLR
Reset during normal operation0000h---u uuuuuu-- 0uuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.
Note1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on
the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.
2: If a Status bit is not implemented, that bit will be read as ‘0’.
Program
Counter
DS41391D-page 78 2011 Microchip Technology Inc.
PIC16(L)F1826/27
7.11Power Control (PCON) Register
The Power Control (PCON) register contains flag bits
to differentiate between a:
HC = Bit is cleared by hardwareHS = Bit is set by hardware
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-m/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is clearedq = Value depends on condition
)
)
——
RMCLR
RIPORBOR
bit 7STKOVF: Stack Overflow Flag bit
1 = A Stack Overflow occurred
0 = A Stack Overflow has not occurred or set to ‘0’ by firmware
bit 6STKUNF: Stack Underflow Flag bit
1 = A Stack Underflow occurred
0 = A Stack Underflow has not occurred or set to ‘0’ by firmware
bit 5-4Unimplemented: Read as ‘0’
bit 3RMCLR
1 = A MCLR Reset has not occurred or set to ‘1’ by firmware
0 = A MCLR
bit 2RI
1 = A RESET instruction has not been executed or set to ‘1’ by firmware
0 = A RESET instruction has been executed (set to ‘0’ in hardware upon executing a RESET instruction)
bit 1POR
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0BOR
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset
: MCLR Reset Flag bit
Reset has occurred (set to ‘0’ in hardware when a MCLR Reset occurs)
: RESET Instruction Flag bit
: Power-on Reset Status bit
: Brown-out Reset Status bit
occurs)
2011 Microchip Technology Inc.DS41391D-page 79
PIC16(L)F1826/27
TABLE 7-5:SUMMARY OF REGISTERS ASSOCIATED WITH RESETS
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2 Bit 1Bit 0
Register
on Page
BORCON SBOREN
PCONSTKOVFSTKUNF
STATUS
WDTCON
Legend: — = unimplemented bit, reads as ‘0’. Shaded cells are not used by Resets.
Note 1: Other (non Power-up) Resets include MCLR
———TOPDZDCC
——WDTPS4 WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN99
——————BORRDY75
——RMCLRRIPORBOR79
Reset and Watchdog Timer Reset during normal operation.
21
DS41391D-page 80 2011 Microchip Technology Inc.
8.0INTERRUPTS
D
CK
R
Q
D
CK
R
Q
RBx
IOCBNx
IOCBPx
Q2
D
CK
S
Q
Q4Q1
Data bus =
0 or 1
Write IOCBFx
IOCIE
To data bus
IOCBFx
Edge
Detect
IOC interrupt
to CPU core
From all other
IOCBFx individual
pin detectors
Q1
Q2
Q3
Q4
Q4Q1
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q4
Q4Q1
Q4Q1
Q4Q1
The interrupt feature allows certain events to preempt
normal program flow. Firmware is used to determine
the source of the interrupt and act accordingly. Some
interrupts can be configured to wake the MCU from
Sleep mode.
This chapter contains the following information for
Interrupts:
• Operation
• Interrupt Latency
• Interrupts During Sleep
•INT Pin
• Automatic Context Saving
Many peripherals produce Interrupts. Refer to the
corresponding chapters for details.
A block diagram of the interrupt logic is shown in
Figure 8-1.
FIGURE 8-1:INTERRUPT LOGIC
PIC16(L)F1826/27
2011 Microchip Technology Inc.DS41391D-page 81
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8.1Operation
Interrupts are disabled upon any device Reset. They
are enabled by setting the following bits:
• GIE bit of the INTCON register
• Interrupt Enable bit(s) for the specific interrupt
events)
• PEIE bit of the INTCON register (if the Interrupt
Enable bit of the interrupt event is contained in the
PIEx registers)
The INTCON, PIRx registers record individual interrupts via interrupt flag bits. Interrupt flag bits will be set,
regardless of the status of the GIE, PEIE and individual
interrupt enable bits.
The following events happen when an interrupt event
occurs while the GIE bit is set:
• Current prefetched instruction is flushed
• GIE bit is cleared
• Current Program Counter (PC) is pushed onto the
stack
• Critical registers are automatically saved to the
shadow registers (See “Section 8.5 “Automatic
Context Saving”.”)
• PC is loaded with the interrupt vector 0004h
The firmware within the Interrupt Service Routine (ISR)
should determine the source of the interrupt by polling
the interrupt flag bits. The interrupt flag bits must be
cleared before exiting the ISR to avoid repeated
interrupts. Because the GIE bit is cleared, any interrupt
that occurs while executing the ISR will be recorded
through its interrupt flag, but will not cause the
processor to redirect to the interrupt vector.
The RETFIE instruction exits the ISR by popping the
previous address from the stack, restoring the saved
context from the shadow registers and setting the GIE
bit.
For additional information on a specific interrupt’s
operation, refer to its peripheral chapter.
8.2Interrupt Latency
Interrupt latency is defined as the time from when the
interrupt event occurs to the time code execution at the
interrupt vector begins. The latency for synchronous
interrupts is 3 or 4 instruction cycles. For asynchronous
interrupts, the latency is 3 to 5 instruction cycles,
depending on when the interrupt occurs. See Figure 8-2
and Figure 8.3 for more details.
Note 1: Individual interrupt flag bits are set,
regardless of the state of any other
enable bits.
2: All interrupts will be ignored while the GIE
bit is cleared. Any interrupt occurring
while the GIE bit is clear will be serviced
when the GIE bit is set again.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT not available in all Oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 30.0 “Electrical Specifications””.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1)
(2)
(3)
(4)
(5)
(1)
FIGURE 8-3:INT PIN INTERRUPT TIMING
DS41391D-page 84 2011 Microchip Technology Inc.
8.3Interrupts During Sleep
Some interrupts can be used to wake from Sleep. To
wake from Sleep, the peripheral must be able to
operate without the system clock. The interrupt source
must have the appropriate Interrupt Enable bit(s) set
prior to entering Sleep.
On waking from Sleep, if the GIE bit is also set, the
processor will branch to the interrupt vector. Otherwise,
the processor will continue executing instructions after
the SLEEP instruction. The instruction directly after the
SLEEP instruction will always be executed before
branching to the ISR. Refer to Section 9.0 “Power-
Down Mode (Sleep)” for more details.
8.4INT Pin
The INT pin can be used to generate an asynchronous
edge-triggered interrupt. This interrupt is enabled by
setting the INTE bit of the INTCON register. The
INTEDG bit of the OPTION_REG register determines on
which edge the interrupt will occur. When the INTEDG
bit is set, the rising edge will cause the interrupt. When
the INTEDG bit is clear, the falling edge will cause the
interrupt. The INTF bit of the INTCON register will be set
when a valid edge appears on the INT pin. If the GIE and
INTE bits are also set, the processor will redirect
program execution to the interrupt vector.
PIC16(L)F1826/27
8.5Automatic Context Saving
Upon entering an interrupt, the return PC address is
saved on the stack. Additionally, the following registers
are automatically saved in the Shadow registers:
• W register
• STATUS register (except for TO
• BSR register
• FSR registers
• PCLATH register
Upon exiting the Interrupt Service Routine, these registers are automatically restored. Any modifications to
these registers during the ISR will be lost. If modifications to any of these registers are desired, the corresponding Shadow register should be modified and the
value will be restored when exiting the ISR. The
Shadow registers are available in Bank 31 and are
readable and writable. Depending on the user’s application, other registers may also need to be saved.
and PD)
2011 Microchip Technology Inc.DS41391D-page 85
PIC16(L)F1826/27
8.6Interrupt Control Registers
8.6.1INTCON REGISTER
The INTCON register is a readable and writable
register, that contains the various enable and flag bits
for TMR0 register overflow, interrupt-on-change and
external INT pin interrupts.
Note:Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7GIE: Global Interrupt Enable bit
1 = Enables all active interrupts
0 = Disables all interrupts
bit 6PEIE: Peripheral Interrupt Enable bit
1 = Enables all active peripheral interrupts
0 = Disables all peripheral interrupts
bit 5TMR0IE: Timer0 Overflow Interrupt Enable bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3IOCIE: Interrupt-on-Change Enable bit
1 = Enables the interrupt-on-change
0 = Disables the interrupt-on-change
bit 2TMR0IF: Timer0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed
0 = TMR0 register did not overflow
bit 1INTF: INT External Interrupt Flag bit
1 = The INT external interrupt occurred
0 = The INT external interrupt did not occur
bit 0IOCIF: Interrupt-on-Change Interrupt Flag bit
1 = When at least one of the interrupt-on-change pins changed state
0 = None of the interrupt-on-change pins have changed state
(1)
(1)
Note 1: The IOCIF Flag bit is read-only and cleared when all the Interrupt-on-Change flags in the IOCBF register
have been cleared by software.
DS41391D-page 86 2011 Microchip Technology Inc.
PIC16(L)F1826/27
8.6.2PIE1 REGISTER
The PIE1 register contains the interrupt enable bits, as
shown in Register 8-2.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7TMR1GIE: Timer1 Gate Interrupt Enable bit
1 = Enables the Timer1 Gate Acquisition interrupt
0 = Disables the Timer1 Gate Acquisition interrupt
bit 6ADIE: A/D Converter (ADC) Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5RCIE: USART Receive Interrupt Enable bit
1 = Enables the USART receive interrupt
0 = Disables the USART receive interrupt
bit 4TXIE: USART Transmit Interrupt Enable bit
1 = Enables the USART transmit interrupt
0 = Disables the USART transmit interrupt
bit 3SSP1IE: Synchronous Serial Port 1 (MSSP1) Interrupt Enable bit
1 = Enables the MSSP1 interrupt
0 = Disables the MSSP1 interrupt
bit 2CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
Note:Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
2011 Microchip Technology Inc.DS41391D-page 87
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8.6.3PIE2 REGISTER
The PIE2 register contains the interrupt enable bits, as
shown in Register 8-3.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7OSFIE: Oscillator Fail Interrupt Enable bit
1 = Enables the Oscillator Fail interrupt
0 = Disables the Oscillator Fail interrupt
bit 6C2IE: Comparator C2 Interrupt Enable bit
1 = Enables the Comparator C2 interrupt
0 = Disables the Comparator C2 interrupt
bit 5C1IE: Comparator C1 Interrupt Enable bit
1 = Enables the Comparator C1 interrupt
0 = Disables the Comparator C1 interrupt
bit 4EEIE: EEPROM Write Completion Interrupt Enable bit
1 = Enables the EEPROM Write Completion interrupt
0 = Disables the EEPROM Write Completion interrupt
bit 3BCL1IE: MSSP1 Bus Collision Interrupt Enable bit
1 = Enables the MSSP1 Bus Collision Interrupt
0 = Disables the MSSP1 Bus Collision Interrupt
bit 2-1Unimplemented: Read as ‘0’
bit 0CCP2IE: CCP2 Interrupt Enable bit
1 = Enables the CCP2 interrupt
0 = Disables the CCP2 interrupt
Note:Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
(1)
Note 1: PIC16(L)F1827 only.
DS41391D-page 88 2011 Microchip Technology Inc.
PIC16(L)F1826/27
8.6.4PIE3 REGISTER
The PIE3 register contains the interrupt enable bits, as
shown in Register 8-4.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7-6Unimplemented: Read as ‘0’
bit 5CCP4IE: CCP4 Interrupt Enable bit
1 = Enables the CCP4 interrupt
0 = Disables the CCP4 interrupt
bit 4CCP3IE: CCP3 Interrupt Enable bit
1 = Enables the CCP3 interrupt
0 = Disables the CCP3 interrupt
bit 3TMR6IE: TMR6 to PR6 Match Interrupt Enable bit
1 = Enables the TMR6 to PR6 Match interrupt
0 = Disables the TMR6 to PR6 Match interrupt
bit 2Unimplemented: Read as ‘0’
bit 1TMR4IE: TMR4 to PR4 Match Interrupt Enable bit
1 = Enables the TMR4 to PR4 Match interrupt
0 = Disables the TMR4 to PR4 Match interrupt
bit 0Unimplemented: Read as ‘0’
Note:Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
(1)
Note 1: This register is only available on PIC16(L)F1827.
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8.6.5PIE4 REGISTER
The PIE4 register contains the interrupt enable bits, as
shown in Register 8-5.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7-2Unimplemented: Read as ‘0’
bit 1BCL2IE: MSSP2 Bus Collision Interrupt Enable bit
1 = Enables the MSSP2 Bus Collision Interrupt
0 = Disables the MSSP2 Bus Collision Interrupt
bit 0SSP2IE: Master Synchronous Serial Port 2 (MSSP2) Interrupt Enable bit
1 = Enables the MSSP2 interrupt
0 = Disables the MSSP2 interrupt
(1)
Note 1: The PIE4 register is available only on the
PIC16(L)F1827 device.
2: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
(1)
Note 1: This register is only available on PIC16(L)F1827.
DS41391D-page 90 2011 Microchip Technology Inc.
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8.6.6PIR1 REGISTER
The PIR1 register contains the interrupt flag bits, as
shown in Register 8-6.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
Note:Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
bit 7TMR1GIF: Timer1 Gate Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6ADIF: A/D Converter Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5RCIF: USART Receive Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4TXIF: USART Transmit Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3SSP1IF: Synchronous Serial Port 1 (MSSP1) Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2CCP1IF: CCP1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 1TMR2IF: Timer2 to PR2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
2011 Microchip Technology Inc.DS41391D-page 91
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8.6.7PIR2 REGISTER
The PIR2 register contains the interrupt flag bits, as
shown in Register 8-7.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
Note:Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
(1)
bit 7OSFIF: Oscillator Fail Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6C2IF: Comparator C2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5C1IF: Comparator C1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4EEIF: EEPROM Write Completion Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3BCL1IF: MSSP1 Bus Collision Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2-1Unimplemented: Read as ‘0’
bit 0CCP2IF: CCP2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note 1: PIC16(L)F1827 only.
(1)
DS41391D-page 92 2011 Microchip Technology Inc.
PIC16(L)F1826/27
8.6.8PIR3 REGISTER
The PIR3 register contains the interrupt flag bits, as
shown in Register 8-8.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
Note:Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
(1)
bit 7-6Unimplemented: Read as ‘0’
bit 5CCP4IF: CCP4 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4CCP3IF: CCP3 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3TMR6IF: TMR6 to PR6 Match Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2Unimplemented: Read as ‘0’
bit 1TMR4IF: TMR4 to PR4 Match Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0Unimplemented: Read as ‘0’
Note 1: This register is only available on PIC16(L)F1827.
2011 Microchip Technology Inc.DS41391D-page 93
PIC16(L)F1826/27
8.6.9PIR4 REGISTER
The PIR4 register contains the interrupt flag bits, as
shown in Register 8-9.
(1)
Note 1: The PIR4 register is available only on the
PIC16(L)F1827 device.
2: Interrupt flag bits are set when an inter-
rupt condition occurs, regardless of the
state of its corresponding enable bit or
the Global Enable bit, GIE, of the
INTCON register. User software should
ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt.
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is clearedHS = Bit is set by hardware
bit 7-2Unimplemented: Read as ‘0’
bit 1BCL2IF: MSSP2 Bus Collision Interrupt Flag bit
1 = A Bus Collision was detected (must be cleared in software)
0 = No Bus collision was detected
bit 0SSP2IF: Master Synchronous Serial Port 2 (MSSP2) Interrupt Flag bit
1 = The Transmission/Reception/Bus Condition is complete (must be cleared in software)
0 = Waiting to Transmit/Receive/Bus Condition in progress
Note 1: This register is only available on PIC16(L)F1827.
TABLE 8-1:SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
INTCONGIE PEIETMR0IEINTEIOCIETMR0IFINTFIOCIF86
OPTION_REG
PIE1TMR1GIEADIERCIETXIESSP1IECCP1IETMR2IETMR1IE87
PIE2OSFIEC2IEC1IEEEIEBCL1IE
(1)
PIE3
(1)
PIE4
PIR1
PIR2
(1)
PIR3
(1)
PIR4
Legend:— = unimplemented locations read as ‘0’. Shaded cells are not used by Interrupts.
Note 1: PIC16(L)F1827 only.
WPUENINTEDGTMR0CSTMR0SEPSAPS2PS1PS0177
—
——CCP4IECCP3IETMR6IE—TMR4IE—89
——————
TMR1GIFADIFRCIFTXIFSSP1IFCCP1IFTMR2IFTMR1IF
OSFIFC2IFC1IFEEIFBCL1IF
——CCP4IFCCP3IFTMR6IF—TMR4IF—93
——————
——CCP2IF
—CCP2IE
BCL2IESSP2IE
BCL2IFSSP2IF
Register
on Page
(1)
(1)
88
90
91
92
94
DS41391D-page 94 2011 Microchip Technology Inc.
PIC16(L)F1826/27
9.0POWER-DOWN MODE (SLEEP)
The Power-Down mode is entered by executing a
SLEEP instruction.
Upon entering Sleep mode, the following conditions
exist:
1. WDT will be cleared but keeps running, if
enabled for operation during Sleep.
bit of the STATUS register is cleared.
2.PD
3.TO bit of the STATUS register is set.
4.CPU clock is disabled.
5. 31 kHz LFINTOSC is unaffected and peripherals
that operate from it may continue operation in
Sleep.
6. Timer1 oscillator is unaffected and peripherals
that operate from it may continue operation in
Sleep.
7. ADC is unaffected, if the dedicated FRC clock is
selected.
8.Capacitive Sensing oscillator is unaffected.
9. I/O ports maintain the status they had before
SLEEP was executed (driving high, low or highimpedance).
10. Resets other than WDT are not affected by
Sleep mode.
Refer to individual chapters for more details on
peripheral operation during Sleep.
To minimize current consumption, the following conditions should be considered:
• I/O pins should not be floating
• External circuitry sinking current from I/O pins
• Internal circuitry sourcing current from I/O pins
• Current draw from pins with internal weak pull-ups
• Modules using 31 kHz LFINTOSC
• Modules using Timer1 oscillator
I/O pins that are high-impedance inputs should be
pulled to V
rents caused by floating inputs.
Examples of internal circuitry that might be sourcing
current include modules such as the DAC and FVR
modules. See Section 17.0 “Digital-to-Analog Con-
verter (DAC) Module” and Section 14.0 “Fixed Voltage Reference (FVR)” for more information on these
modules.
DD or VSS externally to avoid switching cur-
9.1Wake-up from Sleep
The device can wake-up from Sleep through one of the
following events:
1. External Reset input on MCLR
2.BOR Reset, if enabled
3.POR Reset
4. Watchdog Timer, if enabled
5. Any external interrupt
6. Interrupts by peripherals capable of running during Sleep (see individual peripheral for more
information)
The first three events will cause a device Reset. The
last three events are considered a continuation of program execution. To determine whether a device Reset
or wake-up event occurred, refer to Section 7.10
“Determining the Cause of a Reset”.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP instruction, the device will then call the Interrupt
Service Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
pin, if enabled
2011 Microchip Technology Inc.DS41391D-page 95
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Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
(1)
CLKOUT
(2)
Interrupt flag
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PCPC + 1PC + 2
Inst(PC) = Sleep
Inst(PC - 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency
(4)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h)
Inst(0005h)
Inst(0004h)
Dummy Cycle
PC + 20004h0005h
Dummy Cycle
T
OST
(3)
PC + 2
Note 1:XT, HS or LP Oscillator mode assumed.
2:CLKOUT is not available in XT, HS, or LP Oscillator modes, but shown here for timing reference.
3:T
OST = 1024 TOSC (drawing not to scale). This delay applies only to XT, HS or LP Oscillator modes.
4:GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.
9.1.1WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction
- SLEEP instruction will execute as a NOP.
- WDT and WDT prescaler will not be cleared
bit of the STATUS register will not be set
-TO
-PD
bit of the STATUS register will not be
cleared.
• If the interrupt occurs during or after the execu-
tion of a SLEEP instruction
- SLEEP instruction will be completely exe-
cuted
- Device will immediately wake-up from Sleep
- WDT and WDT prescaler will be cleared
-TO
bit of the STATUS register will be set
-PD bit of the STATUS register will be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
bit. If the PD bit is set, the SLEEP instruction
the PD
was executed as a NOP.
FIGURE 9-1:WAKE-UP FROM SLEEP THROUGH INTERRUPT
TABLE 9-1:SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE
The Watchdog Timer is a system timer that generates
a Reset if the firmware does not issue a CLRWDT
instruction within the time-out period. The Watchdog
Timer is typically used to recover the system from
unexpected events.
The WDT has the following features:
• Independent clock source
• Multiple operating modes
- WDT is always on
- WDT is off when in Sleep
- WDT is controlled by software
- WDT is always off
• Configurable time-out period is from 1 ms to 256
seconds (typical)
• Multiple Reset conditions
• Operation during Sleep
FIGURE 10-1:WATCHDOG TIMER BLOCK DIAGRAM
PIC16(L)F1826/27
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10.1Independent Clock Source
The WDT derives its time base from the 31 kHz
LFINTOSC internal oscillator. Time intervals in this
chapter are based on a nominal interval of 1 ms. See
Section 30.0 “Electrical Specifications” for the
LFINTOSC tolerances.
10.2WDT Operating Modes
The Watchdog Timer module has four operating modes
controlled by the WDTE<1:0> bits in Configuration
Word 1. See Table 10-1.
10.2.1WDT IS ALWAYS ON
When the WDTE bits of Configuration Word 1 are set to
‘11’, the WDT is always on.
WDT protection is active during Sleep.
10.2.2WDT IS OFF IN SLEEP
When the WDTE bits of Configuration Word 1 are set to
‘10’, the WDT is on, except in Sleep.
WDT protection is not active during Sleep.
10.2.3WDT CONTROLLED BY SOFTWARE
When the WDTE bits of Configuration Word 1 are set to
‘01’, the WDT is controlled by the SWDTEN bit of the
WDTCON register.
WDT protection is unchanged by Sleep. See
Table 10-1 for more details.
TABLE 10-1:WDT OPERATING MODES
WDTE<1:0>SWDTEN
Device
Mode
WDT
Mode
10.3Time-Out Period
The WDTPS bits of the WDTCON register set the
time-out period from 1 ms to 256 seconds (nominal).
After a Reset, the default time-out period is 2 seconds.
10.4Clearing the WDT
The WDT is cleared when any of the following conditions occur:
•Any Reset
• CLRWDT instruction is executed
• Device enters Sleep
• Device wakes up from Sleep
• Oscillator fail event
• WDT is disabled
• Oscillator Start-up TImer (OST) is running
See Table 10-2 for more information.
10.5Operation During Sleep
When the device enters Sleep, the WDT is cleared. If
the WDT is enabled during Sleep, the WDT resumes
counting.
When the device exits Sleep, the WDT is cleared
again. The WDT remains clear until the OST, if
enabled, completes. See Section 5.0 “Oscillator
Module (With Fail-Safe Clock Monitor)” for more
information on the OST.
When a WDT time-out occurs while the device is in
Sleep, no Reset is generated. Instead, the device
wakes up and resumes operation. The TO
in the STATUS register are changed to indicate the
event. See Register 3-1 for more information.
and PD bits
11XXActive
10X
1
01
0Disabled
00XXDisabled
AwakeActive
SleepDisabled
Active
X
TABLE 10-2:WDT CLEARING CONDITIONS
ConditionsWDT
WDTE<1:0> = 00
WDTE<1:0> = 01 and SWDTEN = 0
WDTE<1:0> = 10 and enter Sleep
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK
Exit Sleep + System Clock = XT, HS, LPCleared until the end of OST
Change INTOSC divider (IRCF bits)Unaffected
DS41391D-page 98 2011 Microchip Technology Inc.
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PIC16(L)F1826/27
10.6Watchdog Control Register
REGISTER 10-1:WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0U-0R/W-0/0R/W-1/1R/W-0/0R/W-1/1R/W-1/1R/W-0/0
——WDTPS<4:0>SWDTEN
bit 7bit 0
Legend:
R = Readable bitW = Writable bitU = Unimplemented bit, read as ‘0’
u = Bit is unchangedx = Bit is unknown-m/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set‘0’ = Bit is cleared
bit 7-6Unimplemented: Read as ‘0’
bit 5-1WDTPS<4:0>: Watchdog Timer Period Select bits