Master/Slave clock selection in a backplane application
160 MHz operation (typical)
100ps duty cycle distortion (typical)
50ps channel to channel skew (typical)
3.3V power supply design
Glitch-free power on at CLKI/O pins
Low Power design (16mA @ 3.3V static)
Accepts small swing (300mV typical) differential signal levels
Industrial temperature operating range (40°C to +85°C)
Available in 24-pin TSSOP Packaging (L)
PI90LVB16
3V Bus LVDS 1-to-6
Clock Buffer/Bus Transceiver
General Description
PI90LVB16 is a six-channel LVTTL clock distribution driver with 50
picosecond channel-to-channel skew. It translates one BLVDS
(Bus Low-Voltage Differential Signaling) input signal into six LVTTLcompatible output signals for distribution to adjacent chips on the
same board. The PI90LVB16 accepts BLVDS (300mV typical) differential input levels, and translates them to 3V CMOS output levels.
The 160MHz PI90LVB16 can be the master clock, driving inputs of
other clock I/O pins in a multipoint environment. It can also drive
the BLVDS backplane with a separate channel acting as a return/
source LVTTL clock source. The master/slave clock selection of the
driving source is controlled by the CrdCLKIN and the DE pins. An
output enable pin OE, when high, forces all CLK
A backplane clock distribution network must be able to drive many
transmission line stubs. The Bus LVDS feature of the PI90LVB16 is
ideal for driving data transfers in large, high-performance backplane
system applications. The device can be used as a source synchronous driver to distribute clock signals within data and telecommunications systems.
pins high.
OUT
Driver Mode Truth Table
tupnItuptuO
EOEDKLCdrC
NI
+O/IKLCO/IKLCKLC
LLLLHL
LLHH LH
HLLL HH
HLH H L H
HHXZZH
Function Diagram
OE
CLKI/0+
CLKI/0–
R
Delay
D
Receive Mode Truth Table
tupnI
TUO
EOEDKLCdrC
NI
HHXXH
LHXDIV≥V70.0H
LH XDIV≤V70.0L
L = Low Logic State; H = High Logic State; X = Irrelevant
Z = High Impedance
1. Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. These ratings
are not meant to imply that the devices should be operated at these limits. The table of Electrical Characteristics specifies conditions of
device operation.
2. ESD Rating: ESD qualification is performed per the following: HBM (1.5kΩ, 100pF), Machine Model (250V, 0Ω), IEC 1000-4-2. All V
pins connected together, all ground pins connected together.
3. Current into device pins are defined as positive. Current out of device pins defined as negative. All voltages are referenced to ground except
VID, VOD, VTH, and VTL
4. All typicals are given for: VCC = +3.3V and TA = +25°C.
5. The VCMR range is reduced for larger VID. Example: If VID=400 mV, then VCMR is 02V to 2.2VAVID up to VCC-0V may be applied
between the CLKI/O+ and CLKI/O inputs, with the Common Mode set to VCC/2.
6. Only one output should be momentarily shorted at a time. Do not exceed package power dissipation rating.
7. CL includes probe and fixture capacitance.
8. Generator waveform for all tests unless otherwise specified: f = 25 MHz, Zo = 50Ω, tr = 1ns, tf = 1ns (10%90%). To ensure fastest
propagation delay and minimum skew, clock input edge rates should not be slower than 1ns/V; control signals not slower than 3ns/V.
In general, the faster the input edge rate, the better the AC performance,
9. All device output transition times are based on characterization measurements and are guaranteed by design.
10. t
is the difference in receiver propagation delay t
SKIR
PLH-tPHL
of one device, and is the duty cycle distortion of the output at any given
temperature and VCC. The propagation delay specification is a device-to-device worst case over process, voltage and temperature.
11. t
is the difference in receiver propagation delay between channels in the same device of any outputs switching in the same direction.
SK2R
This parameter is guaranteed by design and characterization.
12. t
part-to-part skew, is the difference in receiver propagation delay between devices of any outputs switching in the same direction.
SK3R
This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. t
defined as Max-Min differential propagation delay. This parameter is guaranteed by design and characterization.
13. t
14. t
is the difference in driver propagation delay t
SK1D
part-to-part skew, is the difference in driver propagation delay between devices of any outputs switching in the same direction. This
SK2D
PLH-tPHL
and is the duty cycle distortion of the CLKI/O outputs.
specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. t
SK2D
defined as Max-Min differential propagation delay.