Datasheet PI74LPT16543A, PI74LPT16543V Datasheet (PERICOM)

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PI74LPT16543
16-BIT LATCHED TRANSCEIVERS
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PS2072A 01/16/97
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PI74LPT16543
Fast CMOS 16-Bit Latched Transceivers
Product Description
Pericom Semiconductor’s PI74LPT series of logic circuits are pro­duced in the Company’s advanced 0.6 micron CMOS technology, achieving industry leading speed grades.
The PI74LPT16543 is 16-bit latched transceivers organized with two sets of eight D-type latches with separate input and output controls for each set. For data flow from A to B, for example, the A­to-B Enable (xCEAB) input must be LOW in order to enter data from xAx or to take data from xBx, as indicated in the Truth Table. With xCEAB LOW, a LOW signal makes the A-to-B latches transparent; a subsequent LOW-to-HIGH transition of the xLEAB signal puts the A latches in the storage mode and their outputs no longer change the A inputs. With xCEAB and xOEAB both LOW, the 3-state B output buffers are active and reflect the data present at the output of the A latches. Control of data from B to A is similar, but uses the xCEAB, xLEAB, and xOEAB inputs.
The PI74LPT16543 can be driven from either 3.3V or 5.0V devices allowing this device to be used as a translator in a mixed 3.3/5.0V system.
Product Features
• Compatible with LCX™ and LVT™ families of products
• Supports 5V Tolerant Mixed Signal Mode Operation – Input can be 3V or 5V – Output can be 3V or connected to 5V bus
• Advanced Low Power CMOS Operation
• Excellent output drive capability: Balanced drives (24 mA sink and source)
• Pin compatible with industry standard double-density pinouts
• Low ground bounce outputs
• Hysteresis on all inputs
• Industrial operating temperature range: –40°C to +85°C
• Multiple center pins and distributed Vcc/GND pins minimize switching noise
• Packages available: – 56-pin 240 mil wide plastic TSSOP (A) – 56-pin 300 mil wide plastic SSOP (V)
1B0
D
C
1A0
TO 7 OTHER CHANNELS
D
C
1
LEAB
1
CEAB
1
OEAB
1
LEBA
1
CEBA
1
OEBA
2B0
D
C
2A0
TO 7 OTHER CHANNELS
D
C
2
LEAB
2
CEAB
2
OEAB
2
LEBA
2
CEBA
2
OEBA
Logic Block Diagram
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Product Pin Description
Pin Name Description
xOEAB A-to-B Output Enable Input (Active LOW) xOEBA B-to-A Output Enable Input (Active LOW) xCEAB A-to-B Enable Input (Active LOW) xCEBA B-to-A Enable Input (Active LOW) xLEAB A-to-B Latch Enable Input (Active LOW) xLEBA B-to-A Latch Enable Input (Active LOW) xAx A-to-B Data Inputs or B-to-A 3-State Outputs xBx B-to-A Data Inputs or B-to-A 3-State Outputs GND Ground VCC Power
Latch Output
Inputs Status Buffers
XCEAB XLEAB XOEAB XAX TO XBXXBX
H X X Storing High Z X H X Storing X X X H X High Z L L L Transparent Current A Inputs L H L Storing Previous* A Inputs
Product Pin Configuration
1OEAB
1LEAB
1CEAB
GND
1A0 1A1
VCC
1A2 1A3 1A4
GND
1A5 1A6 1A7 2A0 2A1 2A2
GND
2A3 2A4 2A5
VCC
2A6 2A7
GND
2CEAB
2LEAB
2OEAB
1OEBA 1LEBA 1CEBA
GND
1B0 1B1
VCC
1B2 1B3 1B4 GND 1B5 1B6 1B7 2B0 2B1 2B2 GND 2B3 2B4 2B5
VCC
2B6 2B7
GND
2CEBA 2LEBA 2OEBA
Truth Table
(1)
NOTES:
1. *Before xLEAB LOW-to-HIGH Transistion H = High Voltage Level L = Low Voltage Level X = Don't Care or Irrelevant Z = High Impedance
2. A-to-B data flow shown. B-to-A flow control is the same, except using xCEBA, xLEBA, and xOEBA.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34
33 25 26 27 28
32
31
30
29
56-PIN
V56 A56
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DC Electrical Characteristics (Over the Operating Range, TA = –40°C to +85°C, VCC = 2.7V to 3.6V)
Parameters Description Test Conditions
(1)
Min. Typ
(2)
Max. Units
VIH Input HIGH Voltage (Input pins) Guaranteed Logic HIGH Level 2.2 5.5 V
Input HIGH Voltage (I/O pins) 2.0 5.5 V
VIL Input LOW Voltage Guaranteed Logic LOW Level –0.5 0.8 V
(Input and I/O pins)
IIH Input HIGH Current (Input pins) VCC = Max. VIN = 5.5V ±1 µA
Input HIGH Current (I/O pins) VCC = Max. VIN = VCC ——±A
IIL Input LOW Current (Input pins) VCC = Max. VIN = GND ±1 µA
Input LOW Current (I/O pins) VCC = Max. VIN = GND ±1 µA IOZH High Impedance Output Current VCC = Max. VOUT = 5.5V ±1 µA IOZL (3-State Output pins) VCC = Max. VOUT = GND ±1 µA VIK Clamp Diode Voltage VCC = Min., IIN = –18 mA –0.7 –1.2 V IODH Output HIGH Current VCC = 3.3V, VIN = VIH or VIL, VO = 1.5V
(3)
–36 –60 –110 mA
IODL Output LOW Current VCC = 3.3V, VIN = VIH or VIL, VO = 1.5V
(3)
50 90 200 mA
VOH Output HIGH Voltage VCC = Min. IOH = –0.1 mA Vcc-0.2 V
VIN = VIH or VIL IOH = –3 mA 2.4 3.0 V VCC = 3.0V, IOH = –8 mA 2.4
(5)
3.0 V
VIN = VIH or VIL IOH = –24 mA 2.0
VOL Output LOW Voltage VCC = Min. IOL = 0.1 mA 0.2 V
VIN = VIH or VIL IOL = 16 mA 0.2 0.4 V
IOL = 24 mA 0.3 0.5 V
IOS Short Circuit Current
(4)
VCC = Max.
(3)
, VOUT = GND –60 –85 –240 mA
IOFF Power Down Disable VCC = 0V, VIN or VOUT
≤≤
≤≤
4.5V ±100 µA
VH Input Hysteresis 150 mV
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Note:
Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the de­vice. This is a stress rating only and functional opera­tion of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Notes:
1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at Vcc = 3.3V, +25°C ambient and maximum loading.
3. Not more than one output should be shorted at one time. Duration of the test should not exceed one second.
4. This parameter is guaranteed but not tested.
5. VOH = VCC – 0.6V at rated current.
Storage Temperature.............................................................–55°C to +125°C
Ambient Temperature with Power Applied............................ –40°C to +85°C
Supply Voltage to Ground Potential (Inputs & Vcc Only)......–0.5V to +7.0V
Supply Voltage to Ground Potential (Outputs & D/O Only) ..–0.5V to +7.0V
DC Input Voltage ....................................................................–0.5V to +7.0V
DC Output Current ..............................................................................120 mA
Power Dissipation.................................................................................... 1.0W
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Power Supply Characteristics
Parameters Description Test Conditions
(1)
Min. Typ
(2)
Max. Units
ICC Quiescent Power Supply Current VCC = Max. VIN = GND or VCC 0.1 10 µA ICC Quiescent Power Supply Current VCC = Max. VIN = VCC – 0.6V
(3)
2.0 30 µA
TTL Inputs HIGH
ICCD Dynamic Power Supply
(4)
VCC = Max., VIN = VCC 50 75 µA/ Outputs Open VIN = GND MHz
XOE = GND
One Bit Toggling 50% Duty Cycle
IC Total Power Supply VCC = Max., VIN = VCC – 0.6V 0.6 2.3 mA
Current
(6)
Outputs Open VIN = GND fI = 10 MHZ 50% Duty Cycle
XOE = GND
One Bit Toggling VCC = Max., VIN = VCC – 0.6V 2.1 4.7
(5)
Outputs Open VIN = GND fI = 2.5 MHZ 50% Duty Cycle
XOE = GND
16 Bits Toggling
Notes:
1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device.
2. Typical values are at Vcc = 3.3V, +25°C ambient.
3. Per TTL driven input; all other inputs at Vcc or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of the Icc formula. These limits are guaranteed but not tested.
6. IC =IQUIESCENT + IINPUTS + IDYNAMIC
IC = ICC + ICC DHNT + ICCD (fCP/2 + fINI) ICC = Quiescent Current (ICCL, ICCH and ICCZ) ICC = Power Supply Current for a TTL High Input DH = Duty Cycle for TTL Inputs High NT = Number of TTL Inputs at DH ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL) fCP = Clock Frequency for Register Devices (Zero for Non-Register Devices) NCP = Number of Clock Inputs at fCP fI = Input Frequency NI = Number of Inputs at fI All currents are in milliamps and all frequencies are in megahertz.
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Switching Characteristics over Operating Range
(1)
LPT16543 LPT16543A LPT16543C
Com. Com. Com.
Parameters Description Conditions
(2)
Min
(3)
Max Min
(3)
Max Min
(3)
Max Unit
t
PLH
Propagation Delay CL = 50 pF 2.5 8.5 2.5 6.5 2.5 5.3 ns
t
PHL
Transparent Mode RL = 500
xAx to xBx or xBx to xAx
t
PLH
Propagation Delay 2.5 12.5 2.5 8.0 2.5 7.0 ns
t
PHL
xLEBA to xAx, xLEAB to xBx
t
PZH
Output Enable Time 2.0 12.0 2.0 9.0 2.0 8.0 ns
t
PZL
xOEBA or xOEAB to xAx or xBx
t
PHZ
Output Disable Time
(4)
2.0 9.0 2.0 7.5 2.0 6.5 ns
t
PLZ
xOEBA or xOEAB to xAx or xBx
t
SU
Setup Time HIGH or LOW 3.0 2.0 2.0 ns xAx or xBx to xLEAB or xLEBA
t
H
Hold Time HIGH or LOW 2.0 2.0 2.0 ns xAx or xBx to xLEAB or xLEBA
t
W
xLEAB or xLEBA Pulse Width 5.0 5.0 5.0 ns LOW
t
SK
(o) Output Skew
(5)
0.5 0.5 0.5 ns
Notes:
1. Propagation Delays and Enable/Disable times are with Vcc = 3.3V ±0.3V, normal range. For Vcc = 2.7V, extended range, all Propagation Delays and Enable/Disable times should be degraded by 20%.
2. See test circuit and wave forms.
3. Minimum limits are guaranteed but not tested on Propagation Delays.
4. This parameter is guaranteed but not production tested.
5. Skew between any two outputs, of the same package, switching in the same direction. This parameter is guaranteed by design.
Note:
1. This parameter is determined by device characterization but is not production tested.
Capacitance (TA = 25°C, f = 1 MHz)
Parameters
(1)
Description Test Conditions Typ Max. Units
CIN Input Capacitance VIN = 0V 4.5 6 pF COUT Output Capacitance VOUT = 0V 5.5 8 pF
Pericom Semiconductor Corporation
2380 Bering Drive • San Jose, CA 95131 • 1-800-435-2336 • Fax (408) 435-1100 • http://www.pericom.com
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