• High-performance, low-cost solution for switching
between different LAN signals
• Ultra-low quiescent power (0.1 µA typical)
• Low crosstalk: –40 dB @ 30 Mbps
• Low insertion loss or on-resistance: 3Ω typical
• Single extended supply operation up to 6.2V ± 5%
• Off isolation: –30 dB @ 30 Mbps
• Wide bandwidth data rates > 200 Mbps
• Packages available:
– 16-pin 150 mil wide plastic SOIC (W)
– 16-pin 150 mil wide plastic QSOP (Q)
– 20-pin 173 mil wide plastic TSSOP (L)
Logic Block Diagram
IA
1
IB
0
IB
IA
0
E
1
Product Description:
Pericom Semiconductor’s PI5L series of logic circuits are
produced in the Company’s advanced submicron CMOS
technology.
The PI5L100 is a Quad 2:1 multiplexer/demultiplexer
LanSwitch with three-state outputs. This device can be used for
switching between various standards, such as 10 Base-T, 100
Base-T, 100VG-AnyLAN or Token Ring. Generally, this part
can be used to replace mechanical relays in low voltage LAN
applications that have phsical layer, unshielded twisted pair
media (UTP) with either CAT 3 or CAT 5 grade cable.
The PI5L100 is powered from a 6.2V Zener voltage to reduce
the insertion loss.
(Above which the useful life may be impaired. For user guidelines, not tested.)
PI5L100
LanSwitch QUAD 2:1 MUX/DEMUX
Storage Temperature .................................................................–65°C to +150°C
Ambient Temperature with Power Applied..................................... 0°C to +70°C
Supply Voltage to Ground Potential (Inputs & Vcc Only) .......... –0.5V to +7.0V
Supply Voltage to Ground Potential (Outputs & D/O Only) ....... –0.5V to +7.0V
DC Input Voltage ......................................................................... –0.5V to +7.0V
DC Output Current ................................................................................... 120 mA
Power Dissipation......................................................................................... 0.5W
Note:
Stresses greater than those listed under
MAXIMUM RATINGS may cause permanent
damage to the device. This is a stress rating
only and functional operation of the device at
these or any other conditions above those
indicated in the operational sections of this
specification is not implied. Exposure to
absolute maximum rating conditions for
extended periods may affect reliability.
DC Electrical Characteristics (Over the Operating Range, TA = 0°C to +70°C, VCC = 6.2V, + 5%, – 2%)
Parameters DescriptionTest Conditions
(1)
Min.Typ
VIHInput HIGH VoltageGuaranteed Logic HIGH Level2.0——V
VILInput LOW VoltageGuaranteed Logic LOW Level–0.5—0.8V
IIHInput HIGH CurrentVCC = Max., VIN = VCC——±1µA
IILInput LOW CurrentVCC = Max., VIN = GND——±1µA
IOZHHigh Impedance Output Current0 ≤ A, B ≤ VCC——±1µA
VIKClamp Diode VoltageVCC = Min., IIN = –18 mA—–0.7–1.2
V
IOSShort Circuit Current
(3)
A (B) = 0V, B (A) = VCC100——m A
(2)
Max.Units
VHInput Hysteresis at Control Pins—150—mV
VONSwitch On VoltageVIN = 4.5V, E = LOW3.7
(4)
4.06
(5)
—V
See Figure 10, RL = 100Ω
(6)
RON
RON
M1 Switch On ResistanceCalculated from VON1911.2—Ω
(7)
M2 Switch On ResistanceVIN = 4.5V, E = LOW2.03.0—Ω
See Figure 10, RL = 100Ω
∆RONOn Resistance MatchVIN = 4.5V, E = LOW—1.0—Ω
Notes:
1. For Max. or Min. conditions, use appropriate value specified under
Electrical Characteristics for the applicable device type.
2. Typical values are at Vcc = 6.2V, TA = 25°C ambient temperature.
3. Not more than one output should be shorted at one time. Duration of the
test should not exceed one second.
4. VON (min) value is at Vcc = 6.1V, TA = 70°C.
5. The expected AC VON value is about 125 mV higher than the DC VON
value using the similar test circuit in Figure 10 with VIN swing from 0.0V
to 4.5V at 10 MHz sine wave.
6. The value of RON of M1 is calculated with the equvalent mathematical
formula of the test circuit in Figure 10.
V
IN
– V
RON (M1) =
where
I
ON
=
RL + RON (M2)
with RON (M2) = 3 Ohm
ON
I
ON
ON
V
7. This parameter is determined by device characterization but is not
production tested.
1. This parameter is determined by device characterization but is not production tested.
(1)
DescriptionTest ConditionsTypMax.Units
Power Supply Characteristics
Parameters DescriptionTest Conditions
(1)
Min.Typ
ICCQuiescent PowerVCC = Max.VIN = GND or VCC—0.13.0µ A
Supply Current
∆ICCSupply Current perVCC = Max.VIN = 3.4V
(3)
——2.5m A
Input @ TTL HIGH
(2)
Max.Units
PI5L100
ICCDSupply Current perVCC = Max.,——0.25mA /
Input per MHz
(4)
Input Pins OpenMHz
E = GND
Control Input Toggling
50% Duty Cycle
Notes:
1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device.
2. Typical values are at Vcc = 6.2V, +25°C ambient.
3. Per TTL driven input (VIN = 3.4V, control inputs only); A and B pins do not contribute to Icc.
4. This current applies to the control inputs only and represent the current required to switch internal capacitance at the specified
frequency. The A and B inputs generate no significant AC or DC currents as they transition. This parameter is not tested, but is
guaranteed by design.
3. The bus switch contributes no propagational delay other than the RC delay of the ON resistance of the switch and the load capacitance. The time constant for the switch alone is of the
order of 0.25 ns for 50 pF load. Since this time constant is much smaller than the rise/fall times
of typical driving signals, it adds very little propagational delay to the system. Propagational
delay of the bus switch when used in a system is determined by the driving circuit on the
driving side of the switch and its interaction with the load on the driven side.
The PI5L100 was designed to switch between various
standards such as 10Base-T, 100Base-T, 100VGAnyLAN, and Token Ring. Also general purpose
applications such as loopback, line termination, and line
clamps that might normally use mechanical relays are
also ideal uses for this LAN Switch (see Figure 11
applications). Generally speaking, this LAN Switch can
be used for data rates to 200 Mbps and data signal levels
from 0V to 4.5V.
LAN StandardsData Rate per twisted pair (UTP)
10Base-T10 Mbps
100Base-T100 Mbps
100VG-AnyLAN25 Mbps
Differential Crosstalk ...X
Adjacent pins cause the most crosstalk because of the
interlead package capacitance which is generally in the
order of 0.5 pF (pin-to-pin). It can be seen in Figure 11
that this Evaluation (EV) Board schematic uses four
pairs of switches. The pair 1B/2B are RX1 that connect
to YA and YB. The second pair 3B/4B are TX1 and
connect to YC and YB. Pairs 3 and 4 are grounded for
this differential crosstalk test. The purpose of this EV
board is to determine the amont of crosstalk between the
transmit and receive pairs in a full duplex application.
Figure 15 shows the scope waveforms. Traces 1 and 2
are single ended inputs to the differential inputs of the
DUT. Trace 3 is the differential X
equates to 20LOG V
44dB. Since the edge rate is 2 ns, the effective input
frequency is equal to 0.3/t
TALK (DIF)
TALK output which
OUT/VIN = 20LOG 30 mV/5V = –
R which is ~150 MHz. So the
approximate Differential Crosstalk at 150 MHz is
–44dB.
Because pins measured are not adjacent, the differential
crosstalk is typically > 60 dB at 10 MHz. The load
resistor (R
ance). Increasing the data rate or R
L) used was 100 ( to match the UTP imped-
L will also increase
differential crosstalk.
CC Bias Voltage vs RON
V
To keep RON to a minimum, it is recommended that the
CC voltage be increased to a voltage between +6.0V
V
and +6.5V (see Figure 13). The R
ON vs VIN curve shows
the effect of on-resistance and input voltage which is
exponential. Ideally an input voltage between 0.2V and
3.6V will keep RON in the flat part of the curve (
flatness is ~2
Ω).
∆RON or
Signal Distortion
Distortion of the input signal is equated to 20LOG
L. So keeping RON flat as the data signal level varies
R
∆RON/
is critical to low distortion. It should also be noted that
increasing the data rate increases harmonic distortion
which also effects the signal amplitude.
Evaluation Board
Figure 14 shows the layout for an EV board that can be
used for evaluation. This is a 2-layer board and is oneinch square.
Pericom Semiconductor Corporation’s products are not authorized for use as critical components in life support
devices or systems unless a specific written agreement pertaining to such intended use is executed between the
manufacturer and an officer of PSC.
1. Life support devices or systems are devices or systems which:
(a ) are intended for surgical implant into the body, or
(b ) support or sustain life and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
2. A critical component is any component of a life support device or system whose failure to perform can be
reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
Pericom Semiconductor Corporation reserves the right to make changes to its products or specifications at any time,
without notice, in order to improve design or performance and to supply the best possible product. Pericom
Semiconductor does not assume any responsibility for use of any circuitry described other than the circuitry embodied
in a Pericom Semiconductor product. The Company makes no representations that circuitry described herein is free
from patent infringement or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent, patent rights, or other rights, of Pericom Semiconductor Corporation.
PERICOM Semiconductor, Inc. • 2380 Bering Drive • San Jose, CA 95131 • (408) 435-0800 • Fax: (408) 435-1100
228
PS7031B 04/29/97
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