Datasheet PHP87N03LT Datasheet (Philips)

Page 1
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT Logic level FET PHD87N03LT

FEATURES SYMBOL QUICK REFERENCE DATA

’Trench’ technology V
d
= 25 V
DSS
• Very low on-state resistance
= 75 A
D
• Low thermal resistance
• Logic level compatible R
g
R
s
9.5 m (VGS = 10 V)
DS(ON)
10.5 m (VGS = 5 V)
DS(ON)

GENERAL DESCRIPTION

N-channel enhancement mode logic level field-effect power transistor in a plastic envelope using ’trench’ technology. Applications:-
• High frequency computer motherboard d.c. to d.c. converters
• High current switching The PHP87N03LT is supplied in the SOT78 (TO220AB) conventional leaded package.
The PHB87N03LT is supplied in the SOT404 (D2PAK) surface mounting package. The PHD87N03LT is supplied in the SOT428 (DPAK)surface mounting package.

PINNING SOT78 (TO220AB) SOT404 (D2PAK) SOT428 (DPAK)

PIN DESCRIPTION
1 gate 2 drain
1
3 source
tab drain
tab
123
tab
2
13
tab
2
1
3

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DSS
V
DGR
V
GS
V
GSM
I
D
I
DM
P
tot
Tj, T
1 It is not possible to make connection to pin:2 of the SOT404 or SOT428 packages.
October 1999 1 Rev 1.600
Drain-source voltage Tj = 25 ˚C to 175˚C - 25 V Drain-gate voltage Tj = 25 ˚C to 175˚C; RGS = 20 k -25V Gate-source voltage (DC) - ± 15 V Gate-source voltage (pulse Tj 150 ˚C - ± 20 V peak value) Drain current (DC) Tmb = 25 ˚C - 75 A
Tmb = 100 ˚C - 61 A Drain current (pulse peak Tmb = 25 ˚C - 240 A value) Total power dissipation Tmb = 25 ˚C - 142 W Operating junction and - 55 175 ˚C
stg
storage temperature
Page 2
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT
Logic level FET PHD87N03LT

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
R
th j-a

AVALANCHE LIMITING VALUE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
W
DSS

ELECTRICAL CHARACTERISTICS

Tj= 25˚C unless otherwise specified
Thermal resistance junction - - 1.05 K/W to mounting base Thermal resistance junction SOT78 package, in free air - 60 - K/W to ambient SOT404 or SOT428 package, pcb - 50 - K/W
mounted, minimum footprint
Drain-source non-repetitive ID = 45 A; VDD 15 V; - 200 mJ unclamped inductive turn-off VGS = 5 V; RGS = 50 ; Tmb = 25 ˚C energy
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
Drain-source breakdown VGS = 0 V; ID = 0.25 mA; 25 - - V voltage Tj = -55˚C 22 - - V
V
GS(TO)
Gate threshold voltage VDS = VGS; ID = 1 mA 1 1.5 2 V
Tj = 175˚C 0.5 - - V
Tj = -55˚C - - 2.3 V
R
DS(ON)
Drain-source on-state VGS = 5 V; ID = 25 A - 9 10.5 m resistance VGS = 10 V; ID = 25 A - 8.5 9.5 m
VGS = 5 V; ID = 25 A; Tj = 175˚C - - 19.5 m
g I I
fs GSS DSS
Forward transconductance VDS = 25 V; ID = 25 A 12 51 - S Gate source leakage current VGS = ±5 V; VDS = 0 V - 10 100 nA Zero gate voltage drain VDS = 25 V; VGS = 0 V; - 0.05 10 µA current Tj = 175˚C - - 500 µA
Q Q Q
t t t t
L L
g(tot) gs gd
d on r d off f
d
d
Total gate charge ID = 75 A; V
= 15 V; VGS = 5 V - 39 - nC
DD
Gate-source charge - 9 - nC Gate-drain (Miller) charge - 18.5 - nC
Turn-on delay time VDD = 15 V; ID = 25 A; - 9 15 ns Turn-on rise time VGS = 10 V; RG = 5 -5470ns Turn-off delay time Resistive load - 136 160 ns Turn-off fall time - 85 100 ns
Internal drain inductance Measured tab to centre of die - 3.5 - nH Internal drain inductance Measured from drain lead to centre of die - 4.5 - nH
(SOT78 package only)
L
s
Internal source inductance Measured from source lead to source - 7.5 - nH
bond pad
C
iss
C
oss
C
rss
Input capacitance VGS = 0 V; VDS = 20 V; f = 1 MHz - 2304 - pF Output capacitance - 620 - pF Feedback capacitance - 448 - pF
October 1999 2 Rev 1.600
Page 3
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT
Logic level FET PHD87N03LT

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tj = 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
S
I
SM
V
SD
t
rr
Q
rr
Continuous source current - - 75 A (body diode) Pulsed source current (body - - 240 A diode) Diode forward voltage IF = 25 A; VGS = 0 V - 0.85 1.2 V
IF = 40 A; VGS = 0 V - 0.9 -
Reverse recovery time IF = 20 A; -dIF/dt = 100 A/µs; - 109 - ns Reverse recovery charge VGS = 0 V; VR = 25 V - 0.2 - µC
Normalised Power Derating, PD (%)
100
90 80 70 60 50 40 30 20 10
0
0 25 50 75 100 125 150 175
Mounting Base temperature, Tmb (C)
Fig.1. Normalised power dissipation.
PD% = 100⋅PD/P
Normalised Current Derating, ID (%)
100
90 80 70 60 50 40 30 20 10
0
0 25 50 75 100 125 150 175
Mounting Base temperature, Tmb (C)
D 25 ˚C
= f(Tmb)
Peak Pulsed Drain Current, IDM (A)
1000
RDS(on) = VDS/ ID
100
10
1
1 10 100
D.C.
Drain-Source Voltage, VDS (V)
tp = 10 us
100 us
1 ms
10 ms 100 ms
Fig.3. Safe operating area
ID & IDM = f(VDS); IDM single pulse; parameter t
Transient thermal impedance, Zth j-mb (K/W)
10
1
D = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
single pulse
1E-06 1E-05 1E-04 1E-03 1E-02 1E-01 1E+00
Pulse width, tp (s)
P
D
D = tp/T
tp
T
p
Fig.2. Normalised continuous drain current.
ID% = 100⋅ID/I
= f(Tmb); VGS ≥ 5 V
D 25 ˚C
Fig.4. Transient thermal impedance.
Z
= f(t); parameter D = tp/T
th j-mb
October 1999 3 Rev 1.600
Page 4
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT Logic level FET PHD87N03LT
Drain Current, ID (A)
50
VGS = 10V
45
5 V
40
4.5 V
35 30 25 20 15 10
5 0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
2.8 V
3 V
Drain-Source Voltage, VDS (V)
Tj = 25 C
2.6 V
2.4 V
2.2 V
2 V
Fig.5. Typical output characteristics, Tj = 25 ˚C
ID = f(VDS)
Drain-Source On Resistance, RDS(on) (Ohms)
0.05 2 V
0.045
0.04
0.035
0.03
0.025
0.02
0.015
0.01
0.005 0
2.2 V
0 5 10 15 20 25 30 35 40 45 50
2.4 V
Drain Current, ID (A)
2.6 V
5 V
Tj = 25 C
2.8V
3 V
4.5 V
VGS = 10V
Fig.6. Typical on-state resistance, Tj = 25 ˚C
R
= f(ID)
DS(ON)
Transconductance, gfs (S)
60 55 50 45 40 35 30 25 20 15 10
5 0
0 5 10 15 20 25 30 35 40
.
Fig.8. Typical transconductance, Tj = 25 ˚C
Tj = 25 C
175 C
Drain current, ID (A)
VDS > ID X RDS(ON)
.
gfs = f(ID)
Normalised On-state Resistance
2
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1 1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1 0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
.
Fig.9. Normalised drain-source on-state resistance.
Junction temperature, Tj (C)
a = R
DS(ON)/RDS(ON)25 ˚C
= f(Tj)
Drain current, ID (A)
50
VDS > ID X RDS(ON)
45 40 35 30 25 20 15 10
5 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
175 C
Tj = 25 C
Gate-source voltage, VGS (V)
Fig.7. Typical transfer characteristics.
ID = f(VGS)
Threshold Voltage, VGS(TO) (V)
2.25
2
1.75
1.5
1.25
1
0.75
0.5
0.25
0
-60 -40 -20 0 20 40 60 80 100 120 140 160 180 Junction Temperature, Tj (C)
maximum
typical
minimum
Fig.10. Gate threshold voltage.
V
= f(Tj); conditions: ID = 1 mA; VDS = V
GS(TO)
GS
October 1999 4 Rev 1.600
Page 5
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT Logic level FET PHD87N03LT
Drain current, ID (A)
1.0E-01 VDS = 5 V
1.0E-02
1.0E-03
1.0E-04
1.0E-05
1.0E-06
minimum typical maximum
0 0.5 1 1.5 2 2.5 3
Gate-source voltage, VGS (V)
Fig.11. Sub-threshold drain current.
ID = f(V
; conditions: Tj = 25 ˚C; VDS = V
GS)
GS
Gate-source voltage, VGS (V)
15
ID = 75A
14 13
Tj = 25 C
12
VDD = 15 V
11 10
9 8 7 6 5 4 3 2 1 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
Gate charge, QG (nC)
Fig.13. Typical turn-on gate-charge characteristics.
V
= f(QG)
GS
Capacitances, Ciss, Coss, Crss (pF)
10000
1000
100
0.1 1 10 100
Fig.12. Typical capacitances, C
Drain-Source Voltage, VDS (V)
, C
iss
oss
C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
Ciss
Coss
Crss
, C
rss
100
IF / A
9510-30
80
60
Tj / C = 175 25
40
20
0
0 0.5 1 1.5 2
.
Fig.14. Typical reverse diode current.
IF = f(V
); conditions: V
SDS
VSDS / V
= 0 V; parameter T
GS
j
October 1999 5 Rev 1.600
Page 6
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT
Logic level FET PHD87N03LT

MECHANICAL DATA

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220 SOT78

AE
P
A
1
D
1
D
(1)
L
2
b
1
L
DIMENSIONS (mm are the original dimensions)
b
A
UNIT
mm
Note
1. Terminals in this zone are not tinned.
OUTLINE VERSION
SOT78 TO-220
A
1
4.5
1.39
4.1
1.27
b
c
1
0.9
0.7
IEC JEDEC EIAJ
0.7
1.3
0.4
1.0
123
e
e
0 5 10 mm
D
D
1
15.8
6.4
15.2
5.9
REFERENCES
q
L
1
Q
L
2
max.
3.0
(1)
c
qQ
P
3.8
3.0
3.6
2.7
EUROPEAN
PROJECTION
2.6
2.2
ISSUE DATE
97-06-11
b
scale
e
10.3
9.7
E
2.54
15.0
13.5
L
L
1
3.30
2.79
Fig.15. SOT78 (TO220AB); pin 2 connected to mounting base (Net mass:2g)
Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static discharge during transport or handling.
2. Refer to mounting instructions for SOT78 (TO220AB) package.
3. Epoxy meets UL94 V0 at 1/8".
October 1999 6 Rev 1.600
Page 7
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT
Logic level FET PHD87N03LT
MECHANICAL DATA
Plastic single-ended surface mounted package (Philips version of D2-PAK); 3 leads (one lead cropped)
base
A
1
L
p
c
Q
E
D
1
D
H
D
2
13
b
e e
0 2.5 5 mm
scale
mounting

SOT404

A
DIMENSIONS (mm are the original dimensions)
A
UNIT
mm
A
4.50
4.10
OUTLINE VERSION
SOT404
b
1
1.40
0.85
1.27
0.60
IEC JEDEC EIAJ
0.64
0.46
max.
11
D
D
1
1.60
1.20
REFERENCES
10.30
9.70
E
eLpHDQc
2.60
15.40
2.90
2.54
2.10
14.80
2.20
EUROPEAN
PROJECTION
ISSUE DATE
98-12-14 99-06-25
Fig.16. SOT404 surface mounting package. Centre pin connected to mounting base.
Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static discharge during transport or handling.
2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18.
3. Epoxy meets UL94 V0 at 1/8".
October 1999 7 Rev 1.600
Page 8
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT
Logic level FET PHD87N03LT

MOUNTING INSTRUCTIONS

Dimensions in mm
11.5
9.0
17.5
2.0
3.8
5.08
Fig.17. SOT404 : soldering pattern for surface mounting
.
October 1999 8 Rev 1.600
Page 9
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT
Logic level FET PHD87N03LT

MECHANICAL DATA

Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads (one lead cropped)

SOT428

seating plane
E
b
2
L
2
2
A
D
L
A
1
mounting
base
H
E
L
1
y
A
A
2
E
1
D
1
13
b
1
e
e
1
DIMENSIONS (mm are the original dimensions)
A
(1)
A
UNIT
mm
Note
1. Measured from heatsink back to lead.
A
1
max.
0.65
2.38
0.45
2.22
OUTLINE
VERSION
SOT428 98-04-07
b
2
0.89
0.71
max.
0.89
1.1
0.71
0.9
IEC JEDEC EIAJ
wA
M
bc
0 10 20 mm
scale
b
1
b
c
2
5.36
0.4
5.26
0.2
D
D
max.
max.
6.22
4.81
5.98
4.45
REFERENCES
E
E
max.
6.73
6.47
min.
4.0
1
2.285
ee
1
4.57
max.
1
H
10.4
9.6
E
L
L
min.
2.95
0.5
2.55
EUROPEAN
PROJECTION
1
L
2
0.7
0.5
w
max.
0.2 0.2
ISSUE DATE
y
Fig.18. SOT428 surface mounting package. Centre pin connected to mounting base.
Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static discharge during transport or handling.
2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18.
3. Epoxy meets UL94 V0 at 1/8".
October 1999 9 Rev 1.600
Page 10
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT
Logic level FET PHD87N03LT

MOUNTING INSTRUCTIONS

Dimensions in mm
7.0
7.0
2.15
2.5
4.57
1.5
Fig.19. SOT428 : soldering pattern for surface mounting
.
October 1999 10 Rev 1.600
Page 11
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP87N03LT, PHB87N03LT
Logic level FET PHD87N03LT

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
October 1999 11 Rev 1.600
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