emitter-base cut-off currentVEB=5V; IC=0−−100nA
DC current gainVCE=5V; IC=10mA200−−
collector-emitter saturation voltageIC= 5 mA; IB= 0.25 mA−−100mV
collector capacitanceIE=ie= 0; VCB= 10 V; f = 1 MHz
TR1 (NPN)−−2.5pF
TR2 (PNP)−−3pF
2001 Nov 074
Page 5
Philips SemiconductorsProduct specification
NPN/PNP resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = open
3
10
handbook, halfpage
h
FE
2
10
−1
10
TR1 (NPN); VCE=5V.
(1) T
(2) T
(3) T
amb
amb
amb
= 100°C.
=25°C.
= −40 °C.
(1)
(2)
(3)
11010
MHC024
2
IC (mA)
3
10
handbook, halfpage
V
CEsat
(mV)
2
10
10
−1
10
TR1 (NPN); IC/IB= 20.
(1) T
(2) T
(3) T
amb
amb
amb
= 100 °C.
=25°C.
= −40 °C.
PEMD6
MHC025
(1)
(2)
(3)
110
IC (mA)
2
10
Fig.3DC current gain as a function of collector
current; typical values.
3
10
handbook, halfpage
h
FE
2
10
10
−1
−10
TR2 (PNP); VCE= −5V.
(1) T
(2) T
(3) T
amb
amb
amb
= 100 °C.
=25°C.
= −40 °C.
(1)
(2)
(3)
−1−10
MHC026
IC (mA)
−10
Fig.4Collector-emitter saturation voltage as a
function of collector current; typical values.
IC (mA)
MHC027
−10
2
3
−10
handbook, halfpage
V
CEsat
(mV)
2
−10
(1)
(2)
(3)
2
−10
−10
−1
−1−10
TR2 (PNP); IC/IB= 20.
(1) T
(2) T
(3) T
amb
amb
amb
= 100 °C.
=25°C.
= −40 °C.
Fig.5DC current gain as a function of collector
current; typical values.
2001 Nov 075
Fig.6Collector-emitter saturation voltage as a
function of collector current; typical values.
Page 6
Philips SemiconductorsProduct specification
NPN/PNP resistor-equipped transistors;
PEMD6
R1 = 4.7 kΩ, R2 = open
PACKAGE OUTLINE
Plastic surface mounted package; 6 leadsSOT666
D
S
YS
A
E
H
E
X
pin 1 index
123
e
DIMENSIONS (mm are the original dimensions)
UNITb
mm
A
0.6
0.5
0.27
0.17
p
cD
0.18
0.08
1
1.7
1.5
b
p
e
E
1.3
1.1
456
A
wM
A
012 mm
scale
e
H
L
1.0
e
1
E
1.7
0.5
1.5
0.3
0.1
p
w
0.1y0.1
detail X
c
L
p
OUTLINE
VERSION
SOT666
IEC JEDEC EIAJ
REFERENCES
2001 Nov 076
EUROPEAN
PROJECTION
ISSUE DATE
01-01-04
01-08-27
Page 7
Philips SemiconductorsProduct specification
NPN/PNP resistor-equipped transistors;
PEMD6
R1 = 4.7 kΩ, R2 = open
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS
Objective dataDevelopmentThis data sheet contains data from the objective specification for product
Preliminary dataQualificationThis data sheet contains data from the preliminary specification.
Product dataProductionThis data sheet contains data from the product specification. Philips
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
(1)
STATUS
(2)
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
DEFINITIONS
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting valuesdefinition Limitingvalues givenare in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese orat anyother conditionsabovethose givenin the
Characteristics sectionsof the specification isnot implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation orwarrantythat suchapplications willbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably beexpected toresult inpersonal injury.Philips
Semiconductorscustomers usingorselling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse ofany oftheseproducts, conveysno licenceortitle
under any patent, copyright, or mask work right to these
products,and makesno representationsor warrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2001 Nov 077
Page 8
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
The information presented in this document doesnot formpart of any quotation or contract, isbelieved tobe accurate and reliable and may bechanged
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands613514/02/pp8 Date of release: 2001 Nov 07Document order number: 9397 75009048
SCA73
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