Datasheet PDSP16318A, PDSP16318GC1R, PDSP16318IG, PDSP16318MC Datasheet (MITEL)

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PDSP16318/PDSP16318A
PDSP16318/16318A
Complex Accumulator
Advance Information
Supersedes version DS3708 - 2.4 September 1996 DS3708 - 3.1 November 1998
The PDSP16318/A contains two independent 20-bit Adder/Subtractors combined with accumulator registers and shift structures. The four port architecture permits full 20MHz throughout in FFT and filter applications.
Two PDSP16318As combined with a single PDSP16112A Complex Multiplier provide a complete arithmetic solution for a Radix 2 DIT FFT Butterfly. A new complex Butterfly result can be generated every 50ns allowing 1K complex FFTs to be executed in 256µs.
FEATURES
GC100
Full 20MHz Throughout in FFT Applications
Four Independent 16-bit I/O Ports
20-bit Addition or Accumulation
Fully Compatible with PDSP16112 Complex Multiplier
On Chip Shift Structures for Result Scaling
Overflow Detection
Independent Three-State Outputs and Clock
Enables for 2 Port 20MHz Operation
1.4 micron CMOS
500mW Maximum Power Dissipation
100 CQFP package
APPLICATIONS
High speed Complex FFT or DFTs
Complex Finite Impulse Response (FIR) Filtering
Complex Conjugation
Complex Correlation/Convolution
A
REG DELAY
Fig.1 Pin connections - Top view (GC100)
ASSOCIATED PRODUCTS
PDSP16112 16 x 12 Complex Multiplier PDSP16116 16 x 16 Complex Multiplier PDSP1601 ALU and Barrel Shifter PDSP16330 Pythagoras Processor
ORDERING INFORMATION
Industrial (-40°C to +85°C)
PDSP16318A/IG/GC1R (20MHz - QFP)
Military (-55°C to +125°C)
PDSP16318/MC/GC1R (10MHz - QFP
MIL STD 883C Screened)
N.B. Further details of the Military grade part are available
in a separate datasheet
B
SHIFT
REG
C
A
A
SHIFT
B
REG
B
Fig. 2 PDSP16318 simplified block diagram
REG
D
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PDSP16318/16318A
16 16
A
CLK
B
A REG
REG
S2:0ASRDELCEA
8
CYCLE DELAY
1616
MUX
MUX
MUX
20
B
20 16 16
SHIFT
A
20
20
20
MS
20
A
B
REG
REG
20
SHIFT
REG
CLR OVR
REG
OEC
D
1616
D
CEB ASI OED
Fig. 3 Block diagram
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FUNCTIONAL DESCRIPTION
The PDSP16318 is a Dual 20-bit Adder/Subtractor configured to support Complex Arithmetic. The device may be used with each of the adders allocated to real or imaginary data (e.g. Complex Conjugation), the entire device allocated to Real or Imaginary Data (e.g. Radix 2 Butterflys) or each of the adders configured as accumulators and allocated to real or imaginary data (Complex Filters). Each of these modes ensures that a full 20MHz throughput is maintained through both adders, the first and last mode illustrating true Complex operation, where both real and imaginary data is handled by the single device.
Both Adder/Subtractors may be controlled independently via the ASR and ASI inputs. These controls permit A + B, A - B, B - A or pass A operations, where the A input to the Adder is derived from the input multiplexer. The
CLR control line allows the clearing of both accumulator registers. The two multiplexers may be controlled via the MS
inputs, to select either new input data, or fed-back data from
PDSP16318/16318A
the accumulator registers. The PDSP16318 contains an 8­cycle deskew register selected via the DEL control. This deskew register is used in FFT applications to ensure correct phasing of data that has not passed through the PDSP16112 Complex Multiplier.
The 16-bit outputs from the PDSP16318 are derived from the 20-bit result generated by the Adders. The three bit S2:0 input selects eight different shifted output formats ranging from the most significant 16 bits of the 20-bit data, to the least significant 13 bits of the 20-bit data. In this mode the 14th, 15th and 16th bits of the output are set to zero. The shift selected is applied to both adder outputs, and determines the function of the OVR flag. The OVR flag becomes active when either of the two adders produces a result that has more significant digits than the MSB of the 16-bit output from the device. In this manner all cases when invalid data appears on the output are flagged.
Symbol
A15:0 B15:0
C15:0 D15:0 CLK
CEA
CEB
OEC
OED
OVR
ASR1:0 ASI1:0
CLR
MS
S2:0
Type
Input Input
Output Output Input Input Input Input
Input
Output
Input Input Input
Input
Input
Description
Data presented to this input is loaded into the input register on the rising edge of CLK. A15 is the MSB. Data presented to this input is loaded into the input register on the rising edge of CLK. B15 is the MSB
and has the same weighting as A15. New data appears on this output after the rising edge of CLK. C15 is the MSB. New data appears on this output after the rising edge of CLK. C15 is the MSB.
Common Clock to all internal registers Clock enable: when low the clock to the A input register is enabled. Clock enable: when low the clock to the B input register is enabled. Output enable: Asynchronous 3-state output control: The C outputs are in a high impedance
state when this input is high. Output enable: Asynchronous 3-state output control: The D outputs are in a high impedance
state when this input is high. Overflow flag: This flag will go high in any cycle during which either the output data overflows the number
range selected or either of the adder results overflow. A new OVR appears after the rising edge of the CLK.
Add/subtract Real: Control input for the 'Real' adder. This input is latched by the rising edge of clock. Add/subtract Imag: Control input for the 'Imag' adder. This input is latched by the rising edge of clock. Accumulator Clear: Common accumulator clear for both Adder/Subtractor units. This input is latched by
the rising edge of CLK. Mux select: Control input for both adder multiplexers. This input is latched by the rising edge of CLK.
When high the feedback path is selected. Scaling control: This input selects the 16-bit field from the 20-bit adder result that is routed to the outputs.
This input is latched by the rising edge of CLK.
DEL
VCC GND
Input
Power Ground
Delay Control: This input selects the delayed input to the real adder for operations involving the PDSP16112. This input is latched by the rising edge of CLK.
+5V supply: Both Vcc pins must be connected. 0V supply: Both GND pins must be connected.
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PDSP16318/16318A
DEL
0 1
Delay Mux Control
A port input Delayed A port input
GC pin
77 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99
100
5
Function
D7 D8 D9
D10 GND VCC
D11
D12
D13
D14
D15
C15
C14
C13
C12 VCC GND
C11
C10
C9 C8
GC pin
6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Function
C7 C6 C5 C4 C3 C2 C1 C0
OED OEC
S2 S1 S0
MS ASI1 ASI0
DEL CLR
ASR1 ASR0
A0
GC pin
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51
Function
A1 A2 A3 A4 A5 A6 A7 A8
A9 A10 A11 A12 A13 A14 A15
CEA
B15 B14 B13 B12 B11
Device Pinout for ceramic QFP (GC100)
GC pin
56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76
Function
B10
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
CLK
CEB
OVR
D0 D1 D2 D3 D4 D5 D6
ASR or ASI
ASX1
S2:0 Adder result
S0
S1
S2
0
0
0 0 0 0 1 1 1 1
1
0
0
1
1
1
0
0
1
0
0
1
1
1
ASX0
0 0 1 1
191518
0 1 0 1
14 15
ALU Function
A + B
A A - B B - A
17
16
13
12
14
13
15
14 15
15
11 12 13 14 15
MS
Real and Imag' Mux Control
0
B port input/Del mux output
1
C accumulator/D accumualtor
11
12
13
14
7
8
9
10 11 12 13 14 15
10 11 12 13 14 15
10 11 12 13 14 15
8
9
9 10 11 12 13 14
10
6 7 8
9 10 11 12 13
10 11 12
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5 6 7 8 9
10 11
4
5
5
6
6
7
7
8
8
9
9
10
2
3
3
4
4
5
5
6
6
7
7
8
8
9
0
1 2 3 4 5 6 7
0
1 2 3 4 5 6
0
1 2 3 4 5
0
1
1
2
2
3
3
4
NOTE the output data is padded with zeros.
4
This table shows the portion of the adder result passed to the D15:0 and C15:0 outputs. Where fewer than 16 adder bits are selected
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PDSP16318/16318A
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply voltage VCC -0.5V to 7.0V Input voltage VIN -0.9V to VCC +0.9V Output voltage VOUT -0.9V to VCC +0.9V Clamp diode current per pin Ik (see Note 2) 18mA Static discharge voltage (HMB) VSTAT 500V Storage temperature range TS -65°C to +150°C Ambient temperature with power applied Tamb
Industrial -40°C to +85°C
Military -55°C to +125°C Junction temperature 150°C Package power dissipation PTOT 1000mW
NOTES
1. Exceeding these ratings may cause permanent damage. Functional operation under these conditions is not implied.
2. Maximum dissipation or 1 second should not be exceeded, only one output to be tested at any one time.
3. Exposure to absolute maximum ratings for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
Package Type
GC
θ
JC °C/W
12
θ
JA °C/W
35
Test Waveform - measurement level
Delay from output high to output high impedance
Delay from output low to output high impedance
Delay from output high impedance to Output low
Delay from output high impedance to Output high
NOTES
1. V
- Voltage reached when output driven high
H
2. V
- Voltage reached when output driven low
L
V
V
1.5V
1.5V
H
L
I
OL
0.5V
0.5V
0.5V
0.5V
1.5V
DUT
100p
I
OH
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PDSP16318/16318A
ELECTRICAL CHARACTERISTICS
Test conditions (unless otherwise stated):
T
(Commercial) = 0°C to +70°C, VCC = 5.0V ± 5%, GND = 0V
amb
T
(Industrial) =-40°C to +85°C, VCC = 5.0V ± 10%, GND = 0V
amb
T
(Military) =-55°C to +125°C, VCC = 5.0V ± 10%, GND = 0V
amb
STATIC CHARACTERISTICS
Value
Characteristic Symbol Units Conditions
Min. Typ. Max.
Output high voltage V Output low voltage V Input high voltage V Input low voltage V Input leakage current I Output leakage current l Output SC current I Input capacitance C
OH
OL IH
IL IL oz OS
IN
SWITCHING CHARACTERISTICS
Characteristic
Clock period Clock High Time Clock Low Time A15:0, B15:0 setup to clock rising edge A15:0, B15:0 hold after clock rising edge MS, S2:0, ASI setup to clock rising edge
DEL, ASR, DEL, ASR, CLR, MS, S2:0, ASI hold after
clock rising edge
CEA, CEB setup to clock falling edge CEA, CEB hold after clock rising edge
Clock rising edge to OVR, C15:0, D15:0
OEC/OED low to C15:0/D15:0 high data valid OEC/OED low to C15:0/D15:0 low data valid OEC/OED high to C15:0/D15:0 high impedance
Vcc current
CLR setup to clock rising edge
2.4 - V IOH = 3.2mA
- 0.4 V lOL=-3.2mA
3.5 - V
- 0.5 V
-10 +10 µA GND < VIN<V
-50 - +50 µA GND <V 20 - 200 mA Vcc = Max
OUT
< V
- 9 - pF
Value
Industrial
Min.
50 15 15
5 2
10
5 2
2 8 5
-
-
-
-
Max.
-
-
-
-
-
-
-
-
-
­30 30 30 30
110
Value
Military
PDSP16318PDSP16318A
Min.
100
20 20
8 2
10
8 2
2 8 5
-
-
-
-
Max.
-
-
-
-
-
-
-
-
-
­40 40 40 40 70
Units
ns ns ns ns ns ns ns ns
ns ns ns ns ns ns
mA
CC
CC
Conditions
2 x LSTTL + 20pF 2 x LSTTL + 20pF 2 x LSTTL + 20pF 2 x LSTTL + 20pF
CC = max,
V TTL input levels Outputs unloaded, fCLK = max
Vcc current
NOTES
1. LSTTL is equivalent to IOH = 20 microamps, IOL = -0.4mA
2. Current is defined as negative into the device
3. CMOS input levels are defined as: VIL = 0.5 VIH = VDD - 0.5
6
VCC = max,
-
-
60
30
mA
CMOS input levels Outputs unloaded, fCLK = max
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