•6 additional buffer/driver lines peripheral to cable
•5 additional control lines from cable
•5V tolerant
•ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model
•Latch up protection exceeds 500 mA per JEDEC Std 19
•Input Hysteresis
•Low Noise Operation
DESCRIPTION
The PDI1284P1 1 parallel interface chip is designed to provide an
asynchronous, 8-bit, bi-directional, parallel interface for personal
computers. The part includes all 19 signal lines defined by the
IEEE1284 interface specification for Byte, Nibble, EPP, and ECP
modes. The part is designed for hosts or peripherals operating at
3.3V to interface 3.3V or 5.0V devices.
The 8 transceiver pairs (A/B 1-8) allow data transmission from the A
bus to the B bus, or from the B bus to the A bus, depending on the
state of the direction pin DIR.
The B bus and the Y9-Y13 lines have either totem pole or resistor
pull up outputs, depending on the state of the high drive enable pin
HD. The A bus has only totem pole style outputs. All inputs are TTL
compatible with at least 400mV of input hysteresis at V
•IEEE 1284 Compliant Level 1 & 2
•Overvoltage Protection on B/Y side for OFF-state
•A side 3-State option
•B side active or resistive pull up option
•Cable side V
QUICK REFERENCE DATA
SYMBOLPARAMETER
R
D
R
PU
SRB/Y Side slew rateRL = 62Ω; CL = 50pF (See Waveform 4)0.2V/ns
I
CC
V
HYS
t
PLH/tPHL
A –B/Y
for 5V or 3V operation
CC
CONDITIONS
T
= 25°C; GND = 0V
amb
B/Y Side output resistanceVCC = 3.3V; VO = 1.65V ±0.2V (See Figure 2)45Ω
B/Y side pull up resistanceVCC = 3.3V; Outputs, resistive pull up1.4KΩ
A= Side driving internal IC
B= Side driving external cable (bidirectional)
C= Side receiving control signals from internal cable
Y= Side driving external cable (unidirectional)
X= Don’t care – control signals in
Z= High Z or 3-State
O.C.= Open collector
= Totem pole output
t
P
r
= Resistive pull up: 1.4kΩ (nominal) on B/Y/C cable side and
P
*When DIR = L and OEA
. However, while a B/Y side output is Low as driven by a
V
CC
Low signal on the A side, that particular B/Y side resistor is
switched out to stop current drain from V
= H, the output signal is isolated
through it.
CC
from the input signal. B1 – 8 signals maintain an r
on the input for this mode.
DC supply voltage–0.5 to +4.6V
DC cable supply voltage–0.5 to +6.5V
DC input diode currentVI < 0±20mA
DC output diode currentVO < 0±50mA
DC input voltage
ADC output voltage on A side–0.5 to V
3
3
4
40ns transient–2 to +7V
–0.5 to +5.5V
–0.5 to +5.5V
CC
DC output currentOutputs in High or Low state±50mA
Storage temperature range–60 to +150°C
Continuous current through VCC or GND±200mA
+0.5V
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
4. V
B/Y (tr) guarantees only that this part will not be damaged by reflections in application so long as the voltage levels remain in the
OUT
specified range.
RECOMMENDED OPERATING CONDITIONS
LIMITS
MINMAX
V
OUT
V
V
V
OUT
T
CC
CCB
V
V
I
OH
I
OL
amb
DC supply voltage3.03.6V
DC cable supply voltage3.05.5V
High level Input voltage2.0V
IH
Low level input voltage0.8V
IL
B/YB/Y output voltage–0.55.5V
AA side output voltage0V
B/Y side output current High–14mA
B/Y side output current Low14mA
Operating free-air temperature range0+70°C
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1999
All rights reserved. Printed in U.S.A.
Date of release: 09-99
Document order number:9397 750 06421
1999 Sep 17
12
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