Datasheet PCK2000MDB Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
PCK2000M
CK97 (66/100MHz) Mobile System Clock Generator
Product specification 1998 Sep 29
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Philips Semiconductors Product specification
FEA TURES
Reduced pincount version of PCK2000 for mobile applications
Mixed 2.5V and 3.3V operation
Two CPU clocks at 2.5V
Six synchronous PCI clocks at 3.3V, one free–running
One 3.3V reference clock @ 14.318 MHz
Reference 14.31818 MHz Xtal oscillator input
100 MHz or 66 MHz operation
Power management control input pins
175 ps CPU clock jitter
175 ps skew on outputs
Available in 28–pin SSOP package
1.5 – 4ns CPU–PCI delay
Power down if PWRDWN is held LOW
See PCK2000 for 48-pin version
DESCRIPTION
The PCK2000M is a clock synthesizer/driver chip for a Pentium Pro or other similar processors, typically used in mobile applications.
The PCK2000M has two CPU clock outputs at 2.5V. There are six PCI clock outputs running at 33 MHz. One of the PCI clock outputs is free–running. The 3.3V reference clock outputs at 14.318 MHz. All clock outputs meet Intel’s drive strength, rise/fall time, jitter, accuracy, and skew requirements.
The part possesses dedicated powerdown, CPUSTOP, and PCISTOP input pins for power management control. These inputs are synchronized on–chip and ensure glitch–free output transitions. When the CPUSTOP input is asserted, the CPU clock outputs are driven LOW. When the PCIST OP inputs is asserted, the PCI clock outputs are driven LOW.
Finally, when the PWRDWN input pin is asserted, the internal reference oscillator and PLLs are shut down, and all outputs are driven LOW, except the free running PCICLK_F clock output.
The PCK2000M is available in a 28–pin SSOP package.
PIN CONFIGURATION
XTAL IN
OUT V
XTAL
V
SSPCI0
PCICLK_F
PCICLK1
V
DDPCI0
PCICLK2 PCICLK3
V
DDPCI1
V
SSPCI1
DDCORE0
SSCORE0
10 11 12 17 13 16V 14 15V
PCICLK4
PCICLK5 CPUSTOP
V
1 227 3 4 5 6 7 8 9
TOP VIEW
28
SSREF
DDREF
REF
26 25
V
DDCPU
24
CPUCLK0
23
CPUCLK1
22
V
SSCPU
21
V
DDCORE1
20
V 19 18
SSCORE1
PCISTOP
PWRDWN
SEL
SEL100/66
SA00448
PCK2000M
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DRAWING NUMBER
28-Pin Plastic SSOP 0°C to +70°C PCK2000M DB PCK2000M DB SOT341-1
Intel and Pentium are registered trademarks of Intel Corporation.
1998 Sep 29 853-2128 20101
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Philips Semiconductors Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
PIN DESCRIPTION
PIN NUMBER SYMBOL FUNCTION
26 REF 14.318 MHz clock output 28 V 27 V
SSREF DDREF
1 XTAL_IN 14.318 MHz crystal input 2 XTAL_OUT 14.318 MHz crystal output
3, 12 V
[0–1] GROUND for PCI outputs
SSPCI
4 PCICLK_F Free-running PCI output
6, 9 V
[0–1] POWER for PCI outputs
DDPCI
5, 7, 8, 10, 11 PCICLK [1–5] PCI clock outputs.
13, 21 V 14, 20 V
[0–1] Isolated POWER for core
DDCORE
[0–1] Isolated GROUND for core
SSCORE
16 SEL Logic select pins 15 SEL100/66 17 PWRDWN Control pin to put device in powerdown state, active low
18 CPUSTOP Control pin to disable CPU clocks, active low 19 PCISTOP Control pin to disable PCI clocks, active low 25 V 22 V
DDCPU SSCPU
23, 24 CPUCLK [0–1] CPU and Host clock outputs 2.5V
NOTE:
1. V
and VSS names in the above tables reflects a likely internal POWER and GROUND partition to reduce the effects of internal noise on
DD
the performance of the device. In reality, the platform will be configured with the V tied to a common 3.3V supply and all V
pins being common.
SS
GROUND for REF output POWER for REF output
Select pin for enabling 66 MHz or 100MHz or 66 MHz. L = 66 Mhz H = 100MHz
Power for CPU outputs GROUND for CPU outputs
pins tied to a 2.5V supply, all remaining V
DDCPU
DD
pins
BLOCK DIAGRAM
XTAL_IN
XTAL_OUT
SEL100/66
CPUSTOP
PCISTOP
PWRDWN
SEL0
X
X
X
X
X X X
14.318 MHZ OSC
LOGIC
PLL1
PWRDWN
LOGIC
STOP
LOGIC
PWRDWN
LOGIC
STOP
LOGIC
REFCLK (14.318 MHz)
X
CPUCLK [0–1]
X
PCICLK_F (33MHz)
X
PCICLK [1–5] (33MHz)
X
SW00275
1998 Sep 29
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Philips Semiconductors Product specification
CK97 (66/100MHz) Mobile System Clock Generator
SELECT FUNCTIONS
SEL100/66 SEL0 FUNCTION NOTES
0 0 TRI-State 1 0 1 Active 66MHz 1 0 Test mode 1 1 1 Active 100MHz
NOTES:
1. Internal decode logic for all two select inputs implemented.
FUNCTION
DESCRIPTION
Tri-State Hi-Z Hi-Z Hi-Z
Test mode TCLK/2 TCLK/6 TCLK
FUNCTION TABLE
SEL 100/66 CPU/PCI RATIO
0 2 66.66 33.33 14.318 1 3 100 33.33 14.318
CPU PCI, PCI_F REF
CPUCLK (0–1)
(MHz)
OUTPUTS
CPICLK (1–5)
PCICLK_F
(MHz)
PCK2000M
REF
(MHz)
CLOCK ENABLE CONFIGURATION
CPUSTOP PCISTOP PWRDWN CPUCLK PCICLK PCICLK_F
X X 0 LOW LOW LOW Stopped OFF OFF 0 0 1 LOW LOW 33MHz Running Running Running 0 1 1 LOW 33MHz 33MHz Running Running Running 1 0 1 100/66MHz LOW 33MHz Running Running Running 1 1 1 100/66MHz 33MHz 33MHz Running Running Running
OTHER
CLOCKS
PLL OSCILLATOR
POWER MANAGEMENT REQUIREMENTS
LATENCY
SIGNAL SIGNAL STATE
CPUSTOP 0 (DISABLED) 1
1 (ENABLED) 1
PCISTOP 0 (DISABLED) 1
1 (ENABLED) 1
PWRDWN 1 (NORMAL OPERATION) 3ms
0 (POWER DOWN) 2 MAX
NOTES:
1. Clock ON/OFF latency is defined as the number of rising edges of free running PCICLKs between the clock disable goes HIGH/LOW to the first valid clock that comes out of the device.
2. Power up latency is when PWRDWN goes inactive (HIGH) to when the first valid clocks are driven from the device.
NO. OF RISING EDGES OF FREE RUNNING
PCICLK
1998 Sep 29
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Philips Semiconductors Product specification
SYMBOL
PARAMETER
CONDITION
UNIT
SYMBOL
PARAMETER
CONDITIONS
UNIT
CK97 (66/100MHz) Mobile System Clock Generator
ABSOLUTE MAXIMUM RATINGS
1, 2
PCK2000M
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to VSS (VSS = 0V)
LIMITS
MIN MAX
V V V
T
P
DD3 DDQ3 DDQ2
I
IK
V
I
I
OK
V
O
I
O
STG
TOT
DC 3.3V core supply voltage –0.5 +4.6 V
DC 3.3V I/O supply voltage –0.5 +4.6 V DC 2.5V I/O supply voltage –0.5 +3.6 V
DC input diode current VI < 0 –50 mA
DC input voltage Note 2 –0.5 5.5 V
DC output diode current VO > VCC or VO < 0 ±50 mA
DC output voltage Note 2 –0.5 VCC + 0.5 V
DC output source or sink current VO >= 0 to V
CC
±50 mA
Storage temperature range –65 +150 °C
Power dissipation per package
plastic medium-shrink (SSOP)
For temperature range: –40 to +125°C
above +55°C derate linearly with 11.3mW/K
850 mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
NOTES:
1. V
DD3
2. V
DDQ3
3. V
DDQ2
V V V
T
DD3 DDQ3 DDQ2
V
I
V
O
amb
= V
= V = V
DDCORE1
DDREF
DDCPU0
Operating ambient temperature range in free air 0 +70 °C
= V
= V
= V
DC 3.3V core supply voltage Note 1 3.135 3.465 V
DC 3.3V I/O supply voltage Note 2 3.135 3.465 V DC 2.5V I/O supply voltage Note 3 2.135 2.625 V
DC input voltage range 0 V
DC output voltage range 0
= 3.3V
DDCPU1
= 3.3V
= 2.5V
DDCORE2
DDPCI0
LIMITS
MIN MAX
DD3
V
DDQ2
V
DDQ3
V V
1998 Sep 29
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Philips Semiconductors Product specification
TEST CONDITIONS
SYMBOL
PARAMETER
I
mA
I
mA
I
mA
I
mA
O erating su ly current
O erating su ly current
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
DC CHARACTERISTICS
LIMITS
T
= 0°C to +70°C UNIT
SYMBOL PARAMETER
V
V
V
V
V
V V
V
V
±I
IH
IL
OH2
OL2
OH3
OL3
POH POL
OH
OH
OL
OL
±I
OZ
DD
(V)
HIGH level input voltage 3.135 to 3.465
LOW level input voltage 3.135 to 3.465
2.5V output HIGH voltage CPUCLK
2.5V output LOW voltage CPUCLK
3.3V output HIGH voltage REF
3.3V output LOW voltage REF
2.375 to 2.625 IOH = –1mA
2.375 to 2.625 IOL = 1mA 0.4 V
3.135 to 3.465 IOH = –1mA 2.0 V
3.135 to 3.465 IOL = 1mA 0.4 V
PCI output HIGH voltage 3.135 to 3.465 IOH = –1mA 2.4 V
PCI output LOW voltage 3.135 to 3.465 IOL = 1mA 0.55 V
output HIGH current
output HIGH current
output LOW current
output LOW current
I
Input leakage current 3.465 5 µA
3-State output OFF-State
CPUCLK
PCI
CPUCLK
PCI
current
2.375 V
2.625 V
3.135 V
3.465 V
2.375 V
2.625 V
3.135 V
3.465 V
3.465
OUT
= 2.375V –27
OUT
OUT
= 3.135V –33
OUT
OUT OUT
OUT
OUT
V
OUT
Vdd or GND
OTHER MIN TYP MAX
V
= 2.5V
DDQ2
±5%
V
= 3.3V
DDQ3
±5%
V
= 3.3V
DDQ3
±5%
= 1.0V –27
= 1.0V –33
= 1.2V 27 – = 0.3V 30
= 1.95V 30
= 0.4V 38
=
IO = 0 10 µA
Cin Input pin capacitance 5 pF
Cxtal
Xtal pin capacitance, as seen by external crystal
Cout Output pin capacitance 6 pF
1 1
1 1
I
I
dd3
dd2
p
pp
3.465
66MHz mode Outputs loaded
100MHz mode Outputs loaded
Powerdown supply current All static inputs to V
p
pp
2.625
66MHz mode Output loaded
100MHz mode Output loaded
Powerdown supply current All static inputs to V
or GND 500 µA
DD
or GND 100 µA
DD
NOTE:
1. All clock outputs loaded with maximum lump capacitance test load specified in AC characteristics section.
amb
2.0 VDD + 0.3 V
VSS – 0.3 0.8 V
2.0 V
18 pF
170 mA 170 mA
72 mA
100 mA
1998 Sep 29
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Philips Semiconductors Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
AC CHARACTERISTICS
VDDREF = VDDPCI (0–1)= 3.3V ± 5%; VDDCPU = 2.5V ± 5%; f
= 14.31818 MHz
crystal
CPU CLOCK OUTPUTS, CPU(0–3) (LUMP CAPACITANCE TEST LOAD = 20pF)
SYMBOL PARAMETER
TEST CONDITIONS
NOTES MIN MAX
T
(tP) CPUCLK period 2 15.0 15.5
HKP
T
(tH) CPUCLK HIGH time 66MHz 1, 5 5.2 ns
HKH
T
(tL) CPUCLK LOW time 1, 5 5.0
HKL
T
(tP) CPUCLK period 2 10.0 10.5
HKP
T
(tH) CPUCLK HIGH time 100MHz 1, 5 3.0 ns
HKH
T
(tL) CPUCLK LOW time 1, 5 2.8
HKL
T
(tR) CPUCLK rise time 9 0.4 1.6 ns
HRISE
T
(tF) CPUCLK fall time 9 0.4 1.6 ns
HFALL
T
(tJC) CPUCLK jitter 175 ps
JITTER
DUTY CYCLE (tD) Output Duty Cycle 1 45 55 %
T
(tSK) CPU Bus CLK skew 2 175 ps
HSKW
T
(fST) CPUCLK stabilization from Power-up 7 3 ms
HSTB
LIMITS
T
= 0°C to +70°C
amb
UNIT
PCI CLOCK OUTPUTS, PCI(1–5) AND PCI_F (LUMP CAPACITANCE TEST LOAD = 30pF)
SYMBOL PARAMETER
TEST CONDITIONS
NOTES MIN MAX
T
(tP) PCICLK period 3 30.0 ns
PKP
T
PKPS
T
(tH) PCICLK HIGH time 1 12.0 ns
PKH
T
(tL) PCICLK LOW time 1 12.0 ns
PKL
T
(tR) PCICLK rise time 10 0.5 2.0 ns
HRISE
T
(tF) PCICLK fall time 10 0.5 2.0 ns
HFALL
T
(tSK) PCI Bus CLK skew 2 500 ps
PSKW
T
HPOFFSET
T
(tO) CPUCLK to PCICLK Offset 2, 4 1.5 4.0 ns
(fST) PCICLK stabilization from Power-up 7 3 ms
PSTB
PCICLK period stability 8 500 ps
LIMITS
T
= 0°C to +70°C
amb
REF CLOCK OUTPUT (LUMP CAPACITANCE TEST LOAD = 20pF)
SYMBOL PARAMETER
TEST CONDITIONS
NOTES MIN MAX
f Frequency, Actual
T
(tR) Output rise edge rate 1 4 ns
HRISE
T
(tF) Output fall edge rate 1 4 ns
HFALL
Frequency generated
by Crystal
DUTY CYCLE (tD) Duty Cycle 45 55 %
T
(fST) Frequency stabilization from Power-up (cold start) 3 ms
HSTB
LIMITS
T
= 0°C to +70°C
amb
14.31818 MHz
UNIT
UNIT
1998 Sep 29
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Philips Semiconductors Product specification
CK97 (66/100MHz) Mobile System Clock Generator
PCK2000M
ALL CLOCK OUTPUTS
SYMBOL PARAMETER
TEST CONDITIONS
NOTES MIN MAX
T
, T
PZL
PZH
T
, T
PLZ
PHZ
Output enable time 1.0 8.0 ns
Output disable time 1.0 8.0 ns
NOTES:
1. See Figure 3 for measure points.
2. Period, jitter, offset, and skew are measured on the rising edge @ 1.25V for 2.5V clocks and @ 1.5V for 3.3V clocks.
3. The PCICLK is the CPUCLK divided by two at CPUCLK = 66.6MHz. PCICLK is the CPUCLK divided by three at CPUCLK = 100MHz.
4. The CPUCLK must always lead the PCICLK as shown in Figure 2.
5. T
6. T
7. The time is specified from when V
is measured @ 2.0V as shown in Figure 4.
HKH
is measured @ 0.4V as shown in Figure 4.
HKL
stable and operating within specification.
achieves its nominal operating level (typical condition is V
DDQ
= 3.3V) until the frequency output is
DDQ
8. Defined as once the clock is at its nominal operating frequency, the adjacent period changes cannot exceed the time specified .
9. T
10.T
HRISE HRISE
and T and T
are measured as a transition through the threshold region VOL = 0.4V and VOH = 2.0V (1mA) JEDEC specification.
HFALL
(REF, PCI) are measured as a transition through the threshold region VOL = 0.4V and VOH = 2.4V
HFALL
LIMITS
T
= 0°C to +70°C
amb
AC WAVEFORMS
VM = 1.25V @ V VX = VOL + 0.3V VY = VOH –0.3V V
and VOH are the typical output voltage drop that occur with the
OL
output load.
and 1.5V @ V
DDQ2
DDQ3
UNIT
1.25V
CPUCLK
1.25V
CPUCLK
T
HSKW
Figure 1. CPUCLK to CPUCLK skew
1.25V
CPUCLK
1.5V
PCICLK
T
HPOFFSET
Figure 2. CPUCLK to PCICLK offset
V
DDQ2
V
SS
V
DDQ2
V
SS
SW00240
V
DDQ2
V
SS
V
DDQ3
V
SS
SW00241
T
HKH
2.5V CLOCKING INTERFACE
3.3V CLOCKING INTERFACE
(TTL)
1.25
2.0
0.4
T
RISE
T
PKH
2.4
1.5
0.4
T
RISE
Figure 3. 2.5V/3.3V Clock waveforms
T
HKP
DUTY CYCLE
T
FALL
T
PKP
T
FALL
T
HKL
T
PKL
SW00242
1998 Sep 29
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Philips Semiconductors Product specification
CK97 (66/100MHz) Mobile System Clock Generator
V
I
SEL 100, 66, SEL1, SEL0
V
M
GND
t
V
DD
OUTPUT LOW-to-OFF OFF-to-LOW
V
OL
V
OH
OUTPUT HIGH-to-OFF OFF-to-HIGH
V
SS
PLZ
t
outputs enabled
PHZ
V
X
V
Y
Figure 4. 3-State enable and disable times.
outputs disabled
t
PZL
V
M
t
PZH
V
M
outputs enabled
SW00239
COMPONENT
MEASUREMENT
POINTS
V
COMPONENT
MEASUREMENT
POINTS
V
Figure 5. Component versus system measure points
VOH = 2.0V
= 0.4V
OL
VOH = 2.4V
= 0.4V
OL
2.5VOLT MEASURE POINTS
V
SS
3.3VOLT MEASURE POINTS
V
SS
PCK2000M
V
DDQ2
V
= 1.7V
IH
1.25V
V
= 0.7V
IL
V
DDQ3
V
= 2.0V
IH
1.5V = 0.7V
V
IL
SYSTEM
MEASUREMENT
POINTS
SYSTEM
MEASUREMENT
POINTS
SW00243
1998 Sep 29
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Philips Semiconductors Product specification
CK97 (66/100MHz) Mobile System Clock Generator
CPUSTOP
CPUCLK (INTERNAL)
PCICLK (INTERNAL)
PCICLK (FREE-RUNNING)
CPUSTOP
CPUCLK (EXTERNAL)
PCISTOP
CPUCLK (INTERNAL)
PCK2000M
PCICLK (INTERNAL)
PCICLK (FREE-RUNNING)
PCISTOP
PCICLK (EXTERNAL)
PWRDWN
CPUCLK (INTERNAL)
PCICLK (INTERNAL)
PWRDWN
CPUCLK (EXTERNAL)
PCICLK (EXTERNAL)
1998 Sep 29
VCO
CRYSTAL
SW00244
Figure 6. Power Management
10
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Philips Semiconductors Product specification
CK97 (66/100MHz) Mobile System Clock Generator
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3mm SOT341-1
PCK2000M
1998 Sep 29
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Philips Semiconductors Product specification
PCK2000MCK97 (66/100MHz) Mobile System Clock Generator
Data sheet status
Data sheet status
Objective specification
Preliminary specification
Product specification
Product status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96 Document order number: 9397–750-04604
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