Datasheet PCF8575C Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

PCF8575C

Remote 16-bit I/O expander for

2

I

C-bus

Product specification
File under Integrated Circuits, IC12

1999 Aug 05

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 BLOCK DIAGRAM
5 PINNING
6 FUNCTIONAL DESCRIPTION

6.1 Quasi-bidirectional I/Os

6.2 Addressing

6.3 Reading from a port (input mode)

6.4 Writing to the port (output mode)

6.5 Interrupt
7 CHARACTERISTICS OF THE I2C-BUS

7.1 Bit transfer

7.2 START and STOP conditions

7.3 System configuration

7.4 Acknowledge
8 LIMITING VALUES
9 HANDLING
10 CHARACTERISTICS
11 I2C-BUS TIMING CHARACTERISTICS
12 DEVICE PROTECTION
13 PACKAGE OUTLINE
14 SOLDERING

14.1 Introduction to soldering surface mount
packages

14.2 Reflow soldering

14.3 Wave soldering

14.4 Manual soldering

14.5 Suitability of surface mount IC packages for
wave and reflow soldering methods

15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
17 PURCHASE OF PHILIPS I2C COMPONENTS

PCF8575C

1999 Aug 05 2

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

1 FEATURES

• Operating supply voltage from 4.5 to 5.5 V

• Low standby current consumption of 10 µA maximum

• I2C-bus to parallel port expander

• 400 kbits/s FAST I2C-bus

• Open-drain interrupt output

• 16-bit remote I/O port for the I2C-bus

• Compatible with most microcontrollers

• Latched outputs with high current drive capability for

directly driving LEDs

• Address by 3 hardware address pins for use of up to

8 devices

• SSOP24 package.

2 GENERAL DESCRIPTION

The device is a silicon CMOS circuit. It provides general
purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I2C-bus).

PCF8575C

The deviceconsists of a 16-bit quasi-bidirectional port and
an I2C-bus interface. The PCF8575C has a low current
consumption and includes latched outputs with high
current drive capability for directly driving LEDs. It also
possesses an interruptline (INT) which can beconnected
to the interrupt logic of the microcontroller. By sending an
interrupt signal on this line, the remote I/O can inform the
microcontrollerif thereis incoming dataon itsportswithout
having to communicate via the I2C-bus. This means that
the device is an I2C-bus slave transmitter/receiver.

Every data transmission fromthe PCF8575Cmust consist
of an even number of bytes, the first byte will be referred
to as P07 to P00 and the second byteas P17 to P10. The
third will be referred to as P07 to P00 and so on.

3 ORDERING INFORMATION

TYPE

NUMBER

PCF8575CTS SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

NAME DESCRIPTION VERSION

PACKAGE

1999 Aug 05 3

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

4 BLOCK DIAGRAM

handbook, full pagewidth

INT

A0
A1
A2

SCL

SDA

1

21

2
3

22
23

INPUT

FILTER

INTERRUPT

LOGIC

PCF8575C

I2C-BUS

CONTROL

SHIFT

REGISTER

LP FILTER

16 BITS

I/O

PORT

PCF8575C

P00 to P07

4 to 11

P10 to P17

13 to 20

WRITE pulse

DD
SS

24
12

POWER-ON

RESET

V
V

READ pulse

MGS630

Fig.1 Block diagram.

1999 Aug 05 4

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

5 PINNING

SYMBOL PIN DESCRIPTION

INT 1 interrupt output (active LOW)
A1 2 address input 1
A2 3 address input 2
P00 4 quasi-bidirectional I/O 00
P01 5 quasi-bidirectional I/O 01
P02 6 quasi-bidirectional I/O 02
P03 7 quasi-bidirectional I/O 03
P04 8 quasi-bidirectional I/O 04
P05 9 quasi-bidirectional I/O 05
P06 10 quasi-bidirectional I/O 06
P07 11 quasi-bidirectional I/O 07
V

SS

P10 13 quasi-bidirectional I/O 10
P11 14 quasi-bidirectional I/O 11
P12 15 quasi-bidirectional I/O 12
P13 16 quasi-bidirectional I/O 13
P14 17 quasi-bidirectional I/O 14
P15 18 quasi-bidirectional I/O 15
P16 19 quasi-bidirectional I/O 16
P17 20 quasi-bidirectional I/O 17
A0 21 address input 0
SCL 22 serial clock line input
SDA 23 serial data line input/output
V

DD

12 supply ground

24 supply voltage

handbook, halfpage

INT

A1

A2
P00
P01
P02

1
2
3
4
5
6

24
23
22
21
20
19

PCF8575C

P03
P04
P05
P06
P07

V

SS

7
8

9
10
11
12

18
17
16
15
14
13

MGS631

Fig.2 Pin configuration.

PCF8575C

V

DD

SDA
SCL
A0
P17
P16
P15
P14
P13
P12
P11
P10

1999 Aug 05 5

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575C

6 FUNCTIONAL DESCRIPTION

6.1 Quasi-bidirectional I/Os

The16 ports (seeFig.3) areentirely independent andcan beused eitheras input oroutput ports.Input dataistransferred
from the ports to the microcontroller in the READ mode (see Fig.6). Output data istransmitted to the portsin the WRITE
mode (see Fig.5).

This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction.
At power-on all the I/Os are in 3-state mode. The strong pull-up to VDD (I

) allows a fast rising edge into a heavily

OHt

loaded output. This strong pull-up turns on when the output is written HIGH, and is switched off by the negative edge of
SCL. Afterthis short periodthe output isin 3-state mode.The I/O should bewritten HIGH beforebeing used asan input.
After power-on as all the I/Os are set to 3-state all of them can be used as inputs. Any change in setting of the I/Os as
either inputs or outputs can be donewith the write mode.Warning: If a HIGH is applied to an I/O whichhas been written
earlier to LOW, a large current (IOL) will flow to VSS (see Chapter 10; note 3).

handbook, full pagewidth

write pulse

data from
shift register

power-on
reset

DQ

FF

C

I

S

I

OHt

I

OL

V

DD

P00 to P07
P10 to 17

V

SS

Q

D

FF

C

read pulse

data to
shift register

I

S

to interrupt

MGS632

logic

Fig.3 Simplified schematic diagram of each I/O.

6.2 Addressing

Figures 4, 5 and 6 show the address and timing diagrams. Before any data is transmitted or received the master must
sendthe addressof thereceivervia theSDA line.Thefirst bytetransmitted aftertheSTART conditioncarries theaddress
of theslave deviceand theread/write bit. Theaddress ofthe slavedevice must notbe changedbetween theSTART and
the STOP conditions. The PCF8575C acts as a slave receiver or a slave transmitter.

handbook, halfpage

S 0 1 0 0 A2 A1 A0 R/W A

slave address

MGL541

Fig.4 Byte containing the slave address and the R/W bits.

1999 Aug 05 6

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1999 Aug 05 7

SCL

12345678

dbook, full pagewidth

Integral multiples of two bytes

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I

WRITE TO

PORT

DATA OUTPUT

FROM PORT

05 OUTPUT

VOLTAGE

05 PULL-UP

OUTPUT CURRENT

INT

slave address (PCF8575C)

S 0 1 0 0 A2 A1 A0 0 A P07 P06 P00 P17 P101

start condition R/W P05acknowledge

from slave

data to port 0 data to port 1

A ASDA

acknowledge
from slave

I

OHt

t

pv

t

ir

acknowledge
from slave

Data A0 and

B0 valid

MGS633

2

C-bus

PCF8575C

Fig.5 WRITE mode (output).

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1999 Aug 05 8

SCL

SDA

S 0 1 0 0 A2 A1 A0 1 A P07 P06 P05 P04

P03 P02 P01 P00 P17 P10

A A P07 P00 A P17 P10 1P

ook, full pagewidth

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I

READ FROM PORT

DATA INTO PORT

INT

t

iv

R/W acknowledge

from slave

t

h

t

ir

t

su

acknowledge
from receiver

t

ir

acknowledge
from receiver

P07 to P00 P17 to P10P07 to P00 P17 to P10 P07 to P00 P17 to P10

acknowledge
from receiver

MGL543

non acknowledge
from receiver

A LOW-to-HIGH transition of SDA, while SCL isHIGHisdefinedasthe STOP condition (P).Transferofdatacanbe stopped at any moment by a STOPcondition.Whenthisoccurs, data present
at the latest acknowledge phase is valid (output mode). Input data is lost.

Fig.6 READ mode (input).

2

C-bus

PCF8575C

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

6.3 Reading from a port (input mode)

All ports programmed as input should be set to logic 1.
To read, the master (microcontroller) first addresses the
slave device after it receives the interrupt. By setting the
last bit of the byte containing the slave address to logic 1
theread modeis entered.Thedata bytesthat followonthe
SDA are the values on the ports.

If the dataon theinput portchanges fasterthan themaster
can read, this data may be lost.

6.4 Writing to the port (output mode)

To write, the master (microcontroller) first addresses the
slave device. By setting the last bit of the byte containing
the slave address to logic 0 the write modeis entered.The
PCF8575C acknowledges and the master sends the first
data byte for P07 to P00. After the first data byte is
acknowledged by the PCF8575C, the second data byte
P17 to P10 is sent by the master. Once again the
PCF8575C acknowledges the receipt of the data after
which this 16-bit data is presented on the port lines.

The numberof data bytesthat can besent successively is
not limited. After every two bytes the previous data is
overwritten.

PCF8575C

6.5 Interrupt

The PCF8575C provides an open-drain interrupt (INT)
which can be fed to a corresponding input of the
microcontroller (see Figs 5, 6 and 8). This gives these
chips a kind of a master function which can initiate an
action elsewhere in the system.

Aninterrupt isgeneratedby anyrising or fallingedge ofthe
port inputs. After time tiv the signal INT is valid.

Theinterrupt disappearswhen dataon theport ischanged
to the original setting or data is read from or written to the
device which has generated the interrupt.

In the write mode the interrupt may become deactivated
(HIGH) onthe risingedge of the write toport pulse.On the
falling edge of the write to port pulse the interrupt is
definitely deactivated (HIGH).

The interrupt is reset in the read mode on the rising edge
of the read from port pulse.

During the resetting of the interrupt itself any changes on
the I/Os may not generate an interrupt. After the interrupt
isreset anychangein I/Os willbedetected andtransmitted
as an INT.

The first data byte in every pair refers to Port 0
(P07 to P00), whereas the second data byte in every pair
refers to Port 1 (P17 to P10), see Fig.7.

handbook, full pagewidth

07 06 05 04 03 02 01 00

P07 P06 P05 P04 P03 P02 P01 P00

First Byte

Second Byte

17

A

16 15 14 13 12 11 10

P17 P16 P15 P14 P13 P12 P11 P10

A

MGL545

Fig.7 Correlation between bits and ports.

1999 Aug 05 9

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

handbook, full pagewidth

V

MICROCOMPUTER

INT

PCF8575C

DD

(1)

INT INT

PCF8575C

(2)

PCF8575C

PCF8575C

(8)

INT

MGS634

Fig.8 Application of multiple PCF8575Cs with interrupt.

1999 Aug 05 10

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

7 CHARACTERISTICS OF THE I2C-BUS

The I2C-bus is for bidirectional, 2-line communication
between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not
busy.

7.1 Bit transfer

One data bit is transferred during each clock pulse. The
data on the SDA line must remain stable during the HIGH
period ofthe clockpulse as changes in thedata lineat this
time will be interpreted as control signals (see Fig.9).

7.2 START and STOP conditions

Bothdata andclock linesremainHIGH whenthe busisnot
busy. AHIGH-to-LOW transition of thedata line, while the
clock is HIGH is defined as the START condition (S).

A LOW-to-HIGH transition of the data line while the clock
is HIGH is defined as the STOP condition P (see Fig.10).

PCF8575C

7.4 Acknowledge

The number of data bytes transferred between the START
andthe STOPconditions from transmitterto receiverisnot
limited. Each byte of eight bits is followed by one
acknowledge bit. The transmitter must release the SDA
line before the receiver can send an acknowledge bit.

A slave receiver which is addressed must generate an
acknowledge after the reception of each byte. Also a
master mustgenerate an acknowledgeafter the reception
of each byte that has been clocked out of the slave
transmitter. The device that acknowledges has to pull
downthe SDAline duringthe acknowledgeclock pulse,so
that theSDA line is stable LOW during theHIGH period of
the acknowledge related clock pulse, set-up and hold
times must be taken into account.

A master receiver must signal an end of data to the
transmitter by not generating an acknowledge after the
last byte that has been clocked out of the slave. This is
doneby themasterreceiver byholdingthe SDAline HIGH.
In this event the transmitter must release the data line to
enable the master to generate a STOP condition.

7.3 System configuration

A devicegenerating a message isa ‘transmitter’, a device
receiving the message is the ‘receiver’. The device that
controlsthe messageisthe ‘master’andthe deviceswhich
are controlled by the master are the ‘slaves’ (see Fig.11).

handbook, full pagewidth

SDA

SCL

data line

stable;

data valid

Fig.9 Bit transfer.

change

of data

allowed

MBC621

1999 Aug 05 11

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

handbook, full pagewidth

SDA

SCL

S

START condition

Fig.10 Definition of START and STOP conditions.

SDA
SCL

P

STOP condition

PCF8575C

SDA

SCL

MBC622

handbook, full pagewidth

MASTER

TRANSMITTER /

RECEIVER

DATA OUTPUT

BY TRANSMITTER

DATA OUTPUT

BY RECEIVER

SCL FROM

MASTER

SLAVE

RECEIVER

S

START

condition

SLAVE

TRANSMITTER /

RECEIVER

Fig.11 System configuration.

MASTER

TRANSMITTER

not acknowledge

acknowledge

MASTER

TRANSMITTER /

RECEIVER

9821

clock pulse for

acknowledgement

MGL539

MBA605

Fig.12 Acknowledgment on the I2C-bus.

1999 Aug 05 12

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575C

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); note 1.

SYMBOL PARAMETER MIN. MAX. UNIT

V

DD

I

DD

I

SS

V

I

I

I

I

O

P

tot

P

O

T

stg

T

amb

supply voltage −0.5 +6.5 V
supply current −±100 mA
supply current −±100 mA
input voltage VSS− 0.5 VDD+ 0.5 V
DC input current −±20 mA
DC output current −±25 mA
total power dissipation − 400 mW
power dissipation per output − 100 mW
storage temperature −65 +150 °C
ambient temperature −40 +85 °C

Note

1. Stress above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is
a stress ratings only and functional operation of the device atthese or any otherconditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.

9 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to takeprecautions appropriate to handling MOS devices.Advice can be found in Data Handbook IC12 under

“Handling MOS Devices”

.

10 CHARACTERISTICS

VDD= 4.5 to 5.5 V; VSS=0V; T

= −40 to +85 °C; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

DD

I

DD

supply voltage 4.5 − 5.5 V
supply current operating mode; no

− 100 200 µA
load; VI=VDD or VSS;
f

= 400 kHz

SCL

I

DD(stb)

V

POR

V

IL1

standby current standby mode; no load;

VI=VDD or V

SS

− 2.5 10 µA

Power-on reset voltage note 1 − 1.2 1.8 V
LOW-level input voltage

−0.8 − 0.3V

DD

V

pins A0, A1, A2, SDA and SCL

V

IL2

LOW-level input voltage

−0.8 − 0.6V

DD

V

pins P00 to P17

V

IH1

HIGH-level input voltage

0.7V

− VDD+ 0.8 V

DD

pins A0, A1, A2, SDA and SCL

V

IH2

HIGH-level input voltage

0.8V

− VDD+ 0.8 V

DD

pins P00 to P17

1999 Aug 05 13

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575C

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I
I

L
IHL

leakage current at all pins VI=VDD or V

SS

current through protection diode VI>VDD or VI<VSS;

−2 − +2 µA

−−±2mA

note 2

Input SCL; input/output SDA

I

OL

C

I

LOW-level output current VOL= 0.4 V; note 3 3 −−mA
input capacitance VI=VSS; note 2 −−7pF

I/Os; P00 to P07 and P10 to P17

I
I
C
C

OL
OHt

I
O

LOW-level output current VOL= 1 V; note 3 10 25 − mA
transient pull-up current VOH=VSS; see Fig.5 −0.5 −1.0 − mA
input capacitance note 2 −−10 pF
output capacitance note 2 −−10 pF

Port timing; CL≤ 100 pF (see Figs 5 and 6)
t

pv

t

su

t

h

output data valid −−4µs
input data set-up time 0 −−µs

input data hold time 4 −−µs
Interrupt INT (see Fig.13)
I

OL

LOW-level output current VOL= 0.4 V 1.6 −−mA
TIMING;CL≤100 PF (see Figs 5 and 6)
t

iv

t

ir

input data valid time −−4µs

reset delay time −−4µs

Notes

1. The Power-on reset circuit resets the I2C-bus logic with VDD<V

and sets all I/Os to logic 1 (with current source

POR

to VDD).

2. The value is not tested, but verified on sampling basis.

3. A singleLOW-level output current(IOL) mustnot exceed20 mA for anextended time. The sum ofall I

at anypoint

OLs

in time must not exceed 100 mA.

1999 Aug 05 14

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575C

11 I2C-BUS TIMING CHARACTERISTICS

See Fig.13 and note 1.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

f

SCL

t

SW

t

BUF

SCL clock frequency − 400 kHz
tolerable spike width on bus note 2 − 50 ns
BUS free time between a STOP

1.3 −µs

and START condition

t

SU;STA

t

HD;STA

t

LOW

t

HIGH

t

r

t

f

t

SU;DAT

t

HD;DAT

t

SU;STO

C

b

START condition set-up time 0.6 −µs
START condition hold time 0.6 −µs
SCL LOW time 1.3 −µs
SCL HIGH time 0.6 −µs
SCL and SDA rise time note 3 20 + 0.1C
SCL and SDA fall time note 3 20 + 0.1C

300 ns

b

300 ns

b

data set-up time 100 − ns
data hold time 0 − ns
STOP condition set-up time 0.6 −µs
capacitive load represented by

− 400 pF

each bus line

Notes

1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to V

IL

and VIH with an input voltage swing of VSS to VDD.

2. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of widths less than t

SW(max)

.

3. The rise and fall times specified here refer to the driver device (PCF8575C) and are part of the general fast I2C-bus
specification when PCF8575C asserts an acknowledge on SDA, the minimum fall time is 20 ns + 0.1Cb.

handbook, full pagewidth

PROTOCOL

SCL

SDA

CONDITION

t

SU;STA

t

BUF

START

(S)

BIT 7

MSB

(A7)

t

LOWtHIGH

t

r

BIT 6

(A6)

1/f

SCL

t

f

BIT 0

LSB

(R/W)

ACKNOWLEDGE

(A)

STOP

CONDITION

(P)

t

HD;STA

t

SU;DAT

Fig.13 I2C-bus timing diagram.

1999 Aug 05 15

t

HD;DAT

t

SU;STO

MGL546

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

12 DEVICE PROTECTION

handbook, full pagewidth

V

INT

A1

A2
P00
P01
P02
P03
P04
P05
P06
P07

SS

1
2
3
4
5
6
7
8
9
10
11
12

PCF8575C

V

DD

24

V

DD

23

SDA

22

SCL

21

A0

20

P17

19

P16

18

P15

17

P14

16

P13

15

P12

14

P11

13

P10

substrate V

SS

MGS635

Fig.14 Device protection diagram.

1999 Aug 05 16

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

13 PACKAGE OUTLINE

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

D

c

y

Z

24 13

PCF8575C

SOT340-1

E

H

E

A

X

v M

A

pin 1 index

112

w M

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.0

0.21

0.05

1.80

1.65

0.25

b

3

p

0.38

0.25

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

p

cD

0.20

8.4

0.09

8.0

0 2.5 5 mm

scale

(1)E(1) (1)

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

Q

A

2

A

1

detail X

1.03

0.9

0.63

0.7

(A )

L

p

L

A

3

θ

0.13 0.10.2

0.8

0.4

o

8

o

0

OUTLINE
VERSION

SOT340-1 MO-150AG

IEC JEDEC EIAJ

REFERENCES

1999 Aug 05 17

EUROPEAN

PROJECTION

ISSUE DATE

93-09-08
95-02-04

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

14 SOLDERING

14.1 Introduction to soldering surface mount
packages

Thistext givesavery briefinsightto acomplex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

14.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuitboard byscreenprinting, stencillingor
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, solderingand cooling)vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

14.3 Wave soldering

Conventional single wave soldering is not recommended
forsurface mountdevices(SMDs) orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

PCF8575C

• Use a double-wave soldering method comprising a
turbulent wavewith high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages withleadson foursides,the footprintmust
be placedat a 45° angleto the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and beforesoldering, thepackage must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

14.4 Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

If wave soldering isused the following conditions must be
observed for optimal results:

1999 Aug 05 18

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575C

14.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD

PACKAGE

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are notsuitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave solderingis only suitablefor SSOP and TSSOP packageswith a pitch(e) equal toor largerthan 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

1999 Aug 05 19

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

15 DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

16 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in suchapplications do so at theirown risk and agree tofully indemnify Philips for any damages resulting from such
improper use or sale.

PCF8575C

17 PURCHASE OF PHILIPS I

Purchase of Philips I
components inthe I2C systemprovided the systemconforms to the I2C specificationdefined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

1999 Aug 05 20

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

NOTES

PCF8575C

1999 Aug 05 21

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

NOTES

PCF8575C

1999 Aug 05 22

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

NOTES

PCF8575C

1999 Aug 05 23

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
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Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
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Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

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Indonesia: PTPhilipsDevelopmentCorporation,SemiconductorsDivision,
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Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
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Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, ViaCasati, 23 -20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
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Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

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209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotationor contract, is believed tobe accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

67

SCA

Printed in The Netherlands 465006/01/pp24 Date of release: 1999 Aug 05 Document order number: 9397 75006117