Datasheet PCF50603 Datasheet (Philips)

Page 1
查询PCF50603供应商
INTEGRATED CIRCUITS
DATA SH EET
PCF50603
Controller for power supply and battery management
Preliminary specification 2003 Oct 31
Page 2
Controller for power supply and battery management
CONTENTS
1 FEATURES
1.1 System control
1.2 Supply voltage generation
1.3 Battery management
1.4 Subscriber identity module card interface 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION
8.1 On/off control
8.1.1 Operating states
8.1.2 Reset generation
8.1.3 Watchdog timer
8.1.4 Automatic restart after battery removal
8.1.5 Debounce filters
8.2 Serial interface (I2C-bus)
8.3 Interrupt controller (INT)
8.4 Power supply modules
8.5 Main battery charger (MBC)
8.5.1 Supported charger plugs
8.5.2 External components
PCF50603
8.6 Backup battery charger (BBC)
8.7 SIM card interface (SIMI)
8.8 Battery voltage monitor (BVM)
8.9 Temperature high sensor (TS)
8.10 Real time clock (RTC)
8.11 Pulse-width modulator (PWM1 and PWM2)
8.12 LED modulator (LED1 and LED2)
8.13 General purpose outputs (GPO) 9 LIMITING VALUES 10 CHARACTERISTICS 11 APPLICATION INFORMATION 12 PACKAGE OUTLINE 13 SOLDERING
13.1 Introduction to soldering surface mount packages
13.2 Reflow soldering
13.3 Wave soldering
13.4 Manual soldering
13.5 Suitability of surface mount IC packages for wave and reflow soldering methods
14 DATA SHEET STATUS 15 DEFINITIONS 16 DISCLAIMERS 17 PURCHASE OF PHILIPS I2C COMPONENTS
2003 Oct 31 2
Page 3
Controller for power supply and battery management
1 FEATURES
1.1 System control
Serial 400 kHz I2C-bus interface to transfer the control data between the PCF50603 and the host controller
On/Off Control (OOC) module to control the power ramp-up and ramp-down sequences for the handset. Furthermore it determines the supported system operating states: NOPOWER, SAVE, STANDBY and ACTIVE to realize minimum power consumption in all states.
Internal Current Controlled Oscillator (CCO) generates the internal high clock frequency. The generated frequency is typically 3.6 MHz.
Anaccurate32.768 kHzoscillator.Thisoscillatorcanbe used to supply the 32 kHz clock domains in the system, to improve the accuracy of the internal clock and to reduce the power consumption of the PCF50603.
Interrupt controller (INT) that generates the interrupt request for the host controller. All interrupt sources can be masked.
The Real Time Clock (RTC) module uses the 32 kHz clock to provide time reference and alarm functions with wake up control for the handset
Oneaccessory recognition pin with debounce filters and capability to start up the system (REC1_N)
One accessory detection comparator input pin with programmable threshold levels that issues an interrupt when an accessory is connected (REC2_N)
TwoPulse-WidthModulators(PWM1andPWM2)which generate an output voltage with programmable duty cycle and frequency
Two LED modulators (LED1 and LED2) capable of generating eight different blinking patterns with eight different repetition periods
Three General Purpose Outputs (GPO) programmable via the serial interface. The GPOs are open-drain NMOST outputs, capable of handling the full battery voltage range and high sink currents. The GPOs can be programmed to be continuously active LOW or 3-state, in addition the GPO outputs can be controlled by the LED or PWM modulators.
Watchdog timer that can be activated by software.
PCF50603
1.2 Supply voltage generation
The power supplies have three programmable activity modes (OFF, ECO and ON). In the ACTIVE state, the operation modes can be selected by the two external pins PWREN1 and PWREN2.
One Charge Pump (CP) with programmable output voltage for the supply of white or blue LEDs
Two 100 mA LDO voltage regulators (RF1REG and RF2REG) with fixed output voltage (mask programmable) for RF supplies. RF1REG and RF2REG are optimized for low noise, high power supply rejection and excellent load regulation.
Two 150 mA LDO voltage regulators (D1REG and D2REG) optimized for small external capacitors. D1REG provides a programmable output voltage, D2REG provides a fixed output voltage (mask programmable).
One 150 mA LDO voltage regulator (IOREG) dedicated for the supply of the I/O pads. IOREG has a fixed output voltage (mask programmable) and is optimized for a small external capacitor.
One 100 mA LDO voltage regulator (LPREG) with fixed output voltage (mask programmable). In low power operation (ECO) mode LPREG can be used to permanently supply parts in the system in all activity states.
One 100 mA LDO voltage regulator (D3REG) with programmableoutputvoltage.D3REGisoptimizedfora small external capacitor.
One 250 mA LDO voltage regulator (HCREG) with programmableoutputvoltage. The high current HCREG is optimized for applications like hands-free audio.
D1REG, D2REG, D3REG, IOREG and LPREG support ECO mode. In this mode the output current is limited to 1 mA and the internal power consumption is reduced significantly.
The Temperature high Sensor (TS) provides thermal protection for the whole chip
Enhanced ESD protection on all pins that connect to the main battery pack
Microphone bias voltage generator with low noise and high power supply rejection (MBGEN).
2003 Oct 31 3
Page 4
Controller for power supply and battery management
1.3 Battery management
Operates from a three cell NiCd/NiMH or a one cell Li-ion battery pack
Battery Voltage Monitor (BVM) to detect a too low main battery voltage with programmable threshold levels. A low battery condition is reported via the interrupt mechanism.
Charger control. There is an option between two different charger control functions, depending on the configuration:
– Configuration Constant Current Constant Voltage
(CCCV). Linear charger control supporting Li-ion as well as NiCd/NiMH battery types for a wide range of battery capacities.
– Configuration BATMAX comparator that compares
the battery voltage against a programmable threshold voltage. This function can be activated by software and is used to detect the end-of-charge.
Supports the use of a backup battery that powers at empty main battery situations. The backup battery is used to supply the RTC, the internal state and the LPVDDsupplyinit’sECOmode.Goldcaps,LiandLi-ion cells are supported.
Includes a Backup Battery Charger (BBC). A rechargeable backup battery or backup capacitor can be charged from the main battery. For charging, a programmable constant voltage mode is supported.
PCF50603
1.4 Subscriber identity module card interface
Two different modes that can be selected with the Subscriber Identity Module card Interface (SIMI):
– Transparent interface including an arbiter and signal
level translators
– Subscriber Identity Module (SIM) card interface with
integrated sequencer, arbiter and signal level translators. The sequencer supports and controls card activation and de-activation, warm reset and controlled clock stop for power-down modes.
Dedicated SIM supply (SIMREG). Supports
3.0 V and 1.8 V cards, including a power saving ECO mode for the power-down mode of the SIM card.
Enhanced ESD protection on all pins that connect to the SIM card contact pins.
2 APPLICATIONS
Mobile phones.
3 GENERAL DESCRIPTION
The PCF50603 is a highly integrated solution for power supply generation, battery management including charging and a SIM card interface including supply generation.Thedeviceiscontrolledbyahostcontrollervia a 400 kHz I2C-bus serial interface.
4 QUICK REFERENCE DATA
VSS= REFGND = GND = 0 V; T
= 40 °C to +85 °C; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V V V
BAT SAVE CHG
main battery input voltage 0 5.7 V backup battery input voltage 0 5.7 V charger input voltage DC 0 15.0 V
rectified sine wave;
0 20.0 V
100 Hz to 120 Hz; note 1
V
CHGMIN
minimum charger voltage
2.7 V
enabling MBC module
f
CLKCCO
high clock frequency 32 kHz clock available 3.42 3.6 3.78 MHz
Note
1. Not allowed in CCCV configuration.
2003 Oct 31 4
Page 5
Controller for power supply and battery management
5 ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
PCF50603HN HVQFN48 plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 × 6 × 0.85 mm
PCF50603
SOT778-1
2003 Oct 31 5
Page 6
Controller for power supply and battery management
6 BLOCK DIAGRAM
OSCI
OSCO
25
26
UNIT
CLOCK
GENERATOR
BBC
IRQ_N
32kHz
OSCILLATOR
INT
CONTROLLER
CHGDRV
CHGCUR/
BATMAX
34
33
AND
BATMAX
COMPARATOR
MBC
31
BAT
V
BVM
SAVEVCHG
V
30
32
SUPPLY
MODULE
INTERNAL
VINT
29
CPVBAT
SCP
363738
CP
SCN
CPVDD
35
PCF50603
MDB679
HCREG
RF2REG
RF1REG
18 17
24
2320
22
19
RF1VDD RF2VDD HCVDDD3VDD
book, full pagewidth
27 11 4 6 5 101
ONKEY_N RSTHC_N CLK32K PWREN1 PWREN2 REC1_N
OOC
TS
PCF50603
system clocks
operation modes
temp_ok
ALARM
RTC AND
status data
control data
C-BUS
2
I
INTERFACE
3
2
reference voltage
bias currents
ON-CHIP
28
AUDIO
REFERENCE
DETECTION
12
13
PWM1 AND PWM2
GPO
48
47
46
internal supply
LED1 AND LED2
8
9
7
SIMI
434244
45
LPREG
D1REG
D2REG
IOREG
D3REG
SIMREG
41
LPD1VBAT LPVDD RF12VBAT HCVBAT
21
D1VDD
16
Fig.1 Block diagram.
14 15
40 39
SIMD3VBAT IOVDD IOD2VBAT D2VDD
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
2003 Oct 31 6
SCL
SDA
REFC
REC2_N
MICBIAS
GPO1
GPO2
GPO3
SIMIOHC
SIMCKHC
SIMIOCD
SIMCKCD
SIMRSHC_N
SIMEN
SIMVCC
SIMRSCD_N
Page 7
Controller for power supply
PCF50603
and battery management
7 PINNING
SYMBOL PIN SUPPLY DESCRIPTION
VSS and REFGND
n.a. ground and VSS pads of all modules are connected to the ground plane of the package
REC1_N 1 VINT accessory recognition input with debounce filter (active LOW); input with internal
pull-up resistor to VINT
2
SCL 2 IOVDD I SDA 3 IOVDD I
C-bus clock input
2
C-bus data input and output CLK32K 4 IOVDD 32.768 kHz digital clock output; in ACTIVE state and IOVDD is on PWREN2 5 IOVDD control signal input; selects in combination with PWREN1 the ON, OFF or ECO
mode of the linear regulators
PWREN1 6 IOVDD control signal input; selects in combination with PWREN2 the ON, OFF or ECO
mode of the linear regulators SIMRSHC_N 7 IOVDD SIM reset input from host controller (active LOW) SIMCKHC 8 IOVDD SIM clock input from host controller SIMIOHC 9 IOVDD SIM I/O data to or from the host controller with an internal pull-up resistor to
IOVDD IRQ_N 10 IOVDD interrupt request output to host controller (active LOW); open-drain output with an
internal pull-up resistor to IOVDD RSTHC_N 11 IOVDD reset output to host controller (active LOW) MICBIAS 12 n.a. microphone bias output voltage REC2_N 13 MICBIAS accessory recognition input with debounce filter and programmable threshold
(active LOW) IOVDD 14 n.a. IOREG output voltage IOD2VBAT 15 n.a. IOREG and D2REG input voltage D2VDD 16 n.a. D2REG output voltage HCVDD 17 n.a. HCREG output voltage HCVBAT 18 n.a. HCREG input voltage LPVDD 19 n.a. LPREG output voltage LPD1VBAT 20 n.a. LPREG and D1REG input voltage D1VDD 21 n.a. D1REG output voltage RF1VDD 22 n.a. RF1REG output voltage RF12VBAT 23 n.a. RF1REG and RF2REG input voltage RF2VDD 24 n.a. RF2REG output voltage OSCO 25 VINT 32.768 kHz oscillator output OSCI 26 VINT 32.768 kHz oscillator input ONKEY_N 27 VINT On-key (active LOW); input with internal pull-up resistor to VINT REFC 28 n.a. reference voltage bypass capacitor connection VINT 29 n.a. internal supply voltage output V V V
SAVE BAT CHG
30 n.a. backup battery supply voltage 31 n.a. main battery supply voltage 32 n.a. charger voltage
(1)
2003 Oct 31 7
Page 8
Controller for power supply
PCF50603
and battery management
SYMBOL PIN SUPPLY DESCRIPTION
CHGDRV 33 n.a. drive of external charger circuitry (configuration CCCV) CHGCUR/
BATMAX CPVDD 35 n.a. charge pump output voltage
CPVBAT 36 n.a. charge pump input voltage SCP 37 n.a. switching capacitor positive side SCN 38 n.a. switching capacitor negative side D3VDD 39 n.a. D3REG output voltage SIMD3VBAT 40 n.a. SIMREG and D3REG input voltage SIMVCC 41 n.a. SIMREG output voltage SIMIOCD 42 SIMVCC SIM I/O data to/from the SIM card; internal pull-up resistor to SIMVCC SIMCKCD 43 SIMVCC SIM clock output to the SIM card SIMRSCD_N 44 SIMVCC SIM reset output to the SIM card (active LOW) SIMEN 45 IOVDD enable SIMI and SIMREG GPO3 46 n.a. general purpose open-drain output 3 GPO2 47 n.a. general purpose open-drain output 2 GPO1 48 n.a. general purpose open-drain output 1
34 n.a. configuration CCCV: charger current feedback
configuration BATMAX: open-drain output of BATMAX comparator
(1)
Note
1. One ESD diode reverse biased to VSSexcept pin V between pad and VSS.
who has one clamp in series with a 500 resistor connected
CHG
2003 Oct 31 8
Page 9
Controller for power supply and battery management
handbook, full pagewidth
MICBIAS
RSTHC_N
IRQ_N
SIMIOHC
SIMCKHC
SIMRSHC_N
PWREN1 PWREN2
CLK32K
SDA
SCL
REC1_N
LPVDD
HCVDD
REC2_N
IOVDD
IOD2VBAT
1314151617181920212223 12 25 11 26 10 27
9 28 8 29 7 30 6 31 5 32 4 33 3 34 2 35 1 36
4847464544434241403938
GPO3
GPO1
GPO2
HCVBAT
D2VDD
PCF50603HN
SIMEN
SIMCKCD
SIMRSCD_N
LPD1VBAT
SIMVCC
SIMIOCD
D1VDD
RF12VBAT
RF1VDD
SCN
D3VDD
SIMD3VBAT
RF2VDD
24
37
SCP
OSCO OSCI ONKEY_N REFC VINT V
SAVE
V
BAT
V
CHG
CHGDRV CHGCUR/BATMAX CPVDD CPVBAT
MDB680
PCF50603
Bottom view. All GND and VSS pads are connected to the ground plane.
Fig.2 Pin configuration.
2003 Oct 31 9
Page 10
Controller for power supply and battery management
8 FUNCTIONAL DESCRIPTION
8.1 On/off control
8.1.1 OPERATING STATES The PCF50603 has four operating states (see Fig.3):
NOPOWER
SAVE
STANDBY
ACTIVE.
handbook, full pagewidth
SAVE
V
< V
BAT
VERY_LOW_BAT
V
SAVE
V
CHG
AND
> V
VERY_LOW_BACK
OR
> V
VERY_LOW_BAT
V
V
SAVE
V
BAT
CHG
NOPOWER
< V
< V
< V
PCF50603
VERY_LOW_BAT
AND
VERY_LOW_BACK
AND
VERY_LOW_BAT
Fig.3 State diagram.
8.1.2 RESET GENERATION TheOOC generates an internal and an external reseteach
time the system goes from STANDBY to ACTIVE state. All registersfor the regulators and convertersarereset to their default values.
STANDBY
V
> V
BAT
VERY_LOW_BAT
ACTIVE
V
> V
BAT
LOW_BAT
MDB681
The RSTHC_N is kept LOW for minimum 10 ms after entering the ACTIVE state. If the IOREG supply is switched off, RSTHC_N becomes LOW again (see Fig.4).
A special condition occurs when the main battery voltage drops below the V
VERY_LOW_BAT
limit of typically 2.7 V; the RSTHC_N is asserted in order to shut down the host controller immediately (see Fig.5).
2003 Oct 31 10
Page 11
Controller for power supply and battery management
handbook, full pagewidth
system state
RSTHC_N
xxVDD
32 kHz oscillator
CLK32K
Before the supplies are turned on, the internal 32 kHz clock is already stable. After power up of the IOVDD supply the external clock on pin CLK32K becomes available.
STANDBY STANDBYACTIVE
t
= 10 ms
reset
PCF50603
MDB682
handbook, full pagewidth
system state
RSTHC_N
SIM activation
xxVDD
32 kHz oscillator
CLK32K
Fig.4 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition).
STANDBY STANDBYACTIVE
t
= 10 ms
reset
SIM emergency deactivation
MDB683
Before the supplies are turned on, the internal 32 kHz clock is already stable. After power up of the IOVDD supply the external clock on pin CLK32K becomes available.
Fig.5 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition).
2003 Oct 31 11
Page 12
Controller for power supply and battery management
8.1.3 WATCHDOG TIMER The OOC contains a WatchDog Timer (WDT). By default
it is not activated. It can be activated by setting bit WDT_RST in the OOCC register to logic 1. Once this bithasbeenset,the watchdog is enabled, and needs to be cleared once every eight seconds. If the watchdog is not reset in time, the PCF50603 automatically goes to the STANDBY state when the watchdog timer expires. Status bit WDTEXP is set when the watchdog timer expires. After each ACTIVE to STANDBY transition the WDT is disabled and needs to be activated again by software when entering the ACTIVE state.
8.1.4 AUTOMATIC RESTART AFTER BATTERY REMOVAL The PMU allows for an automatic restart from SAVE to
ACTIVE state when the main battery is removed for a period less than two seconds (t
BATRMLIM
especially convenient to avoid accidental switch-off of the
). This feature is
PCF50603
phone due to mechanical bounce on the battery. The automatic restart is enabled or disabled by control bit BATRM_EN in the OOCC register. By default this automatic restart feature is disabled.
Status bit BATRMSTAT in the OOCS2 register indicates whetherthe PMU returned to ACTIVE stateduetoa restart after battery removal. The status bit remains active until the PMU returns to STANDBY or SAVE state.
Figure 6 shows the timing for an automatic restart due to battery removal.
This feature is only triggered by battery removal (V
< 2.7 V). All other shut-down conditions like, low
BAT
battery, high temperature, programming GO_STDBY do not trigger this function.
This feature is only applicable upon the condition that a BBC (V
SAVE>VVERY_LOW_BACK
) is available in the system.
handbook, full pagewidth
(internal status bit)
system
state
V
BAT
V
SAVE
CLK32K
RSTHC_N
xxVDD
BATRMSTAT
ACTIVE
V
LOW_BAT
V
VERY_LOW_BAT
V
LOW_BACK
SAVE
<t
BATRMLIM
t
reset
ACTIVE
MCE539
Fig.6 Automatic restart after battery removal.
2003 Oct 31 12
Page 13
Controller for power supply
PCF50603
and battery management
8.1.5 DEBOUNCE FILTERS Fig.7 is applicable for all debounce filters in the PCF50603.
handbook, full pagewidth
The debounced signal keeps the old value until the new value has been stable for at least the applicable debounce time. Any spike (>30 ms) in the original signal will reset the debounce timer again. This filter suppresses all signal changes that are shorter than the debounce time.
un-debounced
debounced
interrupts
t
debounce
falling edge
Fig.7 Definition of debounce filter.
t
debounce
rising edge
MDB684
8.2 Serial interface (I2C-bus)
The I2C-bus is the serial interface of the PCF50603. A detailed description of the I2C-bus specification, including applications, is given in the brochure: The I2C-bus and how to use it, order no. 9398 393 40011 or I2C-bus Peripherals Data Handbook IC12.
8.3 Interrupt controller (INT)
The PCF50603 uses the interrupt controller to indicate to thesystemcontroller if the status of the PCF50603 change and that an action of the system controller is required. Interrupts can be generated by several modules of the PCF50603. The interrupt generator handles all interrupts with the same priority. Priority setting shall be done by the system controller software.
There are no timing requirements for interrupt service response times. All events that require immediate actions are performed by the PCF50603 without any action by the system controller.
The function of the interrupt module is to capture, mask and combine the interrupt signals from the modules that can generate an interrupt. All interrupts are combined in the interrupt signal IRQ_N. The IRQ_N signal is implemented as an open-drain output with an internal pull-up resistor.
The interrupt module is powered in all states (except NOPOWER) and retains the register values. Events that occur in the STANDBY state, are captured and can be read out by the system controller once the system is in the ACTIVE state.
The IRQ_N signal is asserted in the ACTIVE state whenever one or more PCF50603 interrupts are active.
Each interrupt register (8-bits) is cleared when it is read (R&C) through the I
2
C-bus interface. New interrupts that occur during a R&C action are captured in an intermediate register (see Figs.8 and 9).
All interrupts related to shut-down conditions (LOWBAT, ONKEY1S and HIGHTMP) are automatically cleared on a transition from ACTIVE to STANDBY state.
All interrupts can be masked: this effectively prevents that IRQ_N is asserted for masked interrupts. Masking is implementedwith a mask bit in the mask registers for each interrupt source. Nevertheless, the interrupt status registers still provide the actual interrupt status of the masked interrupts, which allows polling of the interrupt status registers. Note that if the mask bit is cleared for an active interrupt, the IRQ_N line goes LOW at the next falling edge of the output pin CLK32K.
2003 Oct 31 13
Page 14
Controller for power supply and battery management
handbook, full pagewidth
IRQ_N
2
I
C-bus
read request &
address
read
INT1
PCF50603
(1)
read
INT2
read INT3
MDB685
Read access can be done with or without incremental addressing. (1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts.
Fig.8 Interrupt timing; no interrupt captured during read sequence.
handbook, full pagewidth
IRQ_N
I
2
C-bus
read request &
address
read
INT1
(1)
read
INT2
minimal 1 CLK32
read INT3
MDB686
Read access can be done with or without incremental addressing. (1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts.
Fig.9 Interrupt timing; interrupt captured during read sequence.
2003 Oct 31 14
Page 15
Controller for power supply
PCF50603
and battery management
8.4 Power supply modules
In total 11 power supply modules are available in the PCF50603; see Table 1:
Threeregulators for supplying the digital and analog circuitry (D1REG, D2REG and D3REG). These regulators support the ECO mode
One regulator for high current supply (HCREG)
One regulator for the SIMI supply (SIMREG)
One charge pump (CP)
One regulator for supplying the I/O pads (IOREG). This regulator supports the ECO mode
One regulator for low power supply (LPREG). This regulator supports the ECO mode, the LPREG is the only regulator
that can be enabled in SAVE and STANDBY state (ECO mode only)
Two low-noise regulators for RF supply (RF1REG and RF2REG)
One ultra low-noise regulator for supplying a microphone (MBGEN).
Table 1 Power supply modules; VSS= REFGND = GND = 0 V; T
SUPPLY
NAME
NOMINAL
CURRENT
(mA)
MINIMUM VOLTAGE
(V)
MAXIMUM
VOLTAGE
(V)
VOLTAGE
STEPS
(mV)
= 40 °C to +85 °C; unless otherwise specified.
amb
RESET
VOLTAGE
(V)
ECO
MODE
PSRR
(dB)
SIZEEXTERNAL
(1)
CAPACITOR
(nF)
(2)
Programmable power supplies
D1REG 150 1.20 3.20 100 note 3 yes 60 470 D3REG 100 1.20 3.20 100 note 3 yes 60 470
(6)
(4)
2.60 3.20 200 note 3 no 60 4700
(5)
60 1000
3.50 5.00 500 note 3 no 220/4700
(7)
HCREG 250 SIMREG 20 1.80 3.00 1.8 yes CP 75
Fixed power supplies, mask programmable
D2REG 150 1.20 3.20 100 note 3 yes 60 470 IOREG 150 1.20 3.20 100 note 3 yes 60 470 LPREG 100 1.20 3.20 100 note 3 yes 60 470 RF1REG RF2REG
(8) (8)
100 2.60 3.00 100 note 3 no 70 4700 100 2.60 3.00 100 note 3 no 70 4700
Fixed power supply
MBGEN 1.5 2.15 2.15 2.15 yes 110 4700
Notes
1. Typical value, 100 Hz < f < 1000 Hz.
2. Typical values assume X5R or X7R type of capacitor.
3. Mask programmable for reset settings of different types.
4. Under specific conditions a nominal current of 300 mA can be delivered.
5. When SIMI is in Power-down mode.
6. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current
is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA.
7. The CP module requires both a switching capacitor as well as an output capacitor.
8. Optimized for low noise (30 µV RMS value, 400 Hz < f < 80 kHz).
2003 Oct 31 15
Page 16
Controller for power supply and battery management
8.5 Main battery charger (MBC)
The main battery charger (MBC) module provides a completeconstant-current/constant-voltage linear charger controller for lithium-ion (Li-ion) batteries (in CCCV configuration) or a programmable battery threshold level detector for end-of-charge indication (configuration BATMAX). Nickel-cadmium (NiCd) and Nickel metal hydride (NiMH) batteries can also be charged with constant current.
Only an external power PNP transistor is required to control the charge current. The CC and CCCV control circuitry is fully integrated in the PCF50603 charging module.
In CCCV configuration the charging process for Li-ion/Li-pol batteries is performed under control of the host controller. The communication between the PCF50603 charger module and the host controller is interrupt based, which simplifies the control of the PCF50603.
PCF50603
The fast charge current is determined by the value of the external sense resistor. The charge current in the pre and trickle charge phase is programmable as a ratio of the fast charge current.
In BATMAX configuration an end-of-charge indication is available on the BATMAX pin.
8.5.1 SUPPORTED CHARGER PLUGS The PCF50603 charger circuitry supports the following
type of charger plugs (see Fig.10):
Regulated charger plugs with output voltage at least
0.5 V above the battery voltage with a maximum of 10 V and with current limitation up to 3C of the used battery (CCCV and BATMAX configuration)
Non regulated charger plugs with peak output voltages up to 20 V with a duration of less than 14 ms and with current limitation up to 3C of the used battery (BATMAX configuration only).
handbook, full pagewidth
10 V
2.7 V
V
CHG
Regulated charger plug. Non regulated charger plug.
I
CHG
15 V 10 V
2.7 V
V
CHG
< 14 ms
Fig.10 Characteristics of the supported charger plugs.
< 14 ms
t
MDB687
2003 Oct 31 16
Page 17
Controller for power supply and battery management
8.5.2 EXTERNAL COMPONENTS A small discrete circuit must be used to control the charge current (see Fig.11).
handbook, halfpage
(1) The charge switch requires a current gain in the range of 50 to 400 for stable loop operation.
Fig.11 Charge current external circuitry.
V
CHG
CHGDRV
CHGCUR
V
BAT
0.15
BC869
R
sense
(1)
MDB688
PCF50603
8.6 Backup battery charger (BBC)
The BBC is implemented as a voltage limited current source with a selectable output resistor. It offers the following features:
Selectableoutput resistor to reduce the current at higher voltages
Four programmable charge currents
Two programmable maximum limiting voltages
The BBC can be enabled in the ACTIVE state; in all
other states the BBC is disabled.
8.7 SIM card interface (SIMI)
The SIMI provides the facilities to communicate with SIM. It offers the following features:
Support for transparent mode. The host controller controls the communication with the SIM card, including the activation and deactivation sequences.
Support for sequencer mode. The internal sequencer of the PCF50603 performs the activation and deactivation sequences.
Includes a dedicated linear regulator for the SIM card supply(SIMREG) supporting both 1.8 V and 3.0 V cards
Provides level-shifters for the SIM interfacing signals. The level-shifters translate the host controller signal levels (IOVDD) to SIM card signal levels (SIMVCC) and vice versa.
In transparent mode the SIMEN input allows the host controller to have direct control over the SIM card supply. In sequencer mode the SIMEN input indicates the presence of a SIM card.
Enhanced ESD protection on all SIM contact pins
The SIMI and SIMREG can be enabled in the ACTIVE
state. In all other states the SIMI and SIMREG are disabled.
8.8 Battery voltage monitor (BVM)
The BVM monitors the main battery voltage. It offers the following features:
Programmable low battery threshold (V
LOW_BAT
)
Hysteresis and selectable debounce filter built in to prevent fast cycling
The BVM is enabled in all activity states.
The BVM observes permanently the main battery voltage and generates a LOWBAT interrupt if the battery voltage drops below the programmed threshold voltage V
LOW_BAT
(see Fig.12). When a LOWBAT interrupt is generated in ACTIVE state, the host controller should initiate a transition to STANDBY state. In case the host controller does not initiate a transition to the STANDBY state within eight seconds after the interrupt occurred, the OOC forces the PCF50603 to the STANDBY state in order to prevent a too deep discharge of the battery.
2003 Oct 31 17
Page 18
Controller for power supply and battery management
handbook, full pagewidth
V
LOW_BAT
8.9 Temperature high sensor (TS)
The TS monitors the junction temperature of the PCF50603. It offers the following features:
Fixed temperature threshold
Hysteresis and debounce filter built in to prevent fast
cycling
The TS is enabled in ACTIVE state, in all other states the TS is disabled.
The behaviour of the TS is shown in Figure 13.
V
BAT
LOWBAT
interrupt
V
Fig.12 BVM and LOWBAT behaviour.
PCF50603
V
hys
t
debounce
t
MDB689
A HIGHTMP interrupt is generated when the temperature threshold is passed for more than 62 ms (debouncing time). When a HIGHTMP interrupt is generated the host controller should initiate a transition to STANDBY state. In case the host controller does not initiate a transition to the STANDBY state within 1 second after the interrupt occurred,theOOCforcesthe PCF50603 to the STANDBY state in order to prevent damage to the circuit.
The hysteresis and debounce time have been built in to prevent fast cycling of the HIGHTMP signal.
The TS can not be disabled via the I2C-bus.
handbook, full pagewidth
150 °C
130
HIGHTMP
interrupt
°C
T
j
t
debounce
Fig.13 TS behaviour.
2003 Oct 31 18
T
hys
t
debounce
t
MDB690
Page 19
Controller for power supply and battery management
8.10 Real time clock (RTC)
The RTC module provides the time information to the handset based on a 1 Hz clock frequency. Basically it is a 32-bit counter counting elapsed seconds.
The RTC module contains one alarm function that generates an interrupt if the actual RTC time equals the content of the alarm register. The alarm registers are preset to all 1 s which effectively disables the alarm; effectively no alarm interrupt will be generated as long as the RTC counter does not overflow. It is recommended to mask the ALARM interrupt before a new value is written to the alarm registers, in order to preventinterrupts during the write actions (a new setting may require up to 4 register writes).
The RTC module is able to generate an interrupt each second (SECOND interrupt) as well as each minute (MINUTE interrupt). When the RTC starts up the first time (after transition from NOPOWER state) the minute interruptis aligned with each 60 seconds crossing. If the synchronization with the 60 second crossing is required after reprogramming the RTC time registers it is up to the software to program the RTC time registers with a modulo 60 value.
PCF50603
8.12 LED modulator (LED1 and LED2)
The PCF50603 contains two LED modulators (LED1 and LED2), which can be selected as input for any of the GPO outputs. The LED modulator of the PCF50603 is used for the control of the indicator LEDs. They offer the following features:
The LED driver can select eight different repetition periods
Capable of generating eight different blinking patterns. The selected pattern is generated once per repetition period
The LED can be used as a status indicator during the ACTIVE state or when a charger is connected.
8.13 General purpose outputs (GPO)
The PCF50603 contains three high current (100 mA) open-drain GPOs. They offer the following features:
Each GPO can be configured as a constant LOW level, a high impedance, a LED modulator output, a PWM output or as the complementary PWM output PWM
The GPOs can sink 100 mA from any supply or battery voltage.
8.11 Pulse-width modulator (PWM1 and PWM2)
The two PWMs (PWM1 and PWM2) offer the following features:
Programmable frequency and duty cycle
Any of the GPOs can be connected to either the PWMs
or the inverse of the PWMs
The PWMs can be independently enabled in ACTIVE state. In all other states the PWMs are disabled.
2003 Oct 31 19
Page 20
Controller for power supply
PCF50603
and battery management
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V V V V
I
I
I
O
P T
T V
BAT SAVE CHG I
tot amb
stg esd
main battery voltage 0.5 +6.5 V backup battery input voltage 0.5 +6.5 V charger input voltage 0.5 +20 V input voltage on any pin with
0.5 +6.5 V
respect to REFGND input current at any input 10 +10 mA output current at any output 10 +10 mA total power dissipation 2000 mW operating ambient
40 +85 °C
temperature storage temperature 55 +150 °C electrostatic discharge
voltage
HBM; note 1
pins SIMEN, IOD2VBAT, SIMD3VBAT,
−±6000 V SIMRSCD_N, SIMCKCD, SIMIOCD, V
, V
BAT
, CPVBAT, LPD1VBAT,
SAVE
REC1_N, SIMVCC, RF12VBAT, HCVBAT, REC2_N
pin V
CHG
−±4000 V other pins −±2000 V
MM; note 2 −±200 V
Notes
1. Human Body Model: equivalent to discharging a 100 pF capacitor via a 1.5 k resistor.
2. Machine Model: equivalent to discharging a 200 pF capacitor via a 0 resistor.
10 CHARACTERISTICS
V
= REFGND = GND = 0 V; T
SS
= 40 °C to +85 °C; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V V V
BAT SAVE CHG
main battery input voltage 0 5.7 V backup battery input voltage 0 5.7 V charger input voltage DC 0 15.0 V
rectified sine wave;
0 20.0 V
100 Hz to 120 Hz; note 1
V
CHGMIN
minimum charger voltage
2.7 V
enabling MBC module
f
CLKCCO
high clock frequency 32 kHz clock available 3.42 3.6 3.78 MHz
D1 regulator
V
O
I
O
output voltage 1.20 3.20 V output current −−150 mA
2003 Oct 31 20
Page 21
Controller for power supply
PCF50603
and battery management
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
D3 regulator
V
O
I
O
HC regulator
V
O
I
O
SIM regulator
V
O
I
O
CP regulator
V
O
I
O
D2 regulator
V
O
I
O
IO regulator
V
O
I
O
LP regulator
V
O
I
O
RF1 regulator
V
O
I
O
RF2 regulator
V
O
I
O
MBGEN regulator
V
O
I
O
Notes
1. Under specific conditions a nominal current of 300 mA can be delivered.
2. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA.
output voltage 1.20 3.20 V output current −−100 mA
output voltage 2.60 3.20 V output current note 1 −−250 mA
output voltage 1.80 3.00 V output current −−20 mA
output voltage 3.50 5.00 V output current note 2 −−75 mA
output voltage 1.20 3.20 V output current −−150 mA
output voltage 1.20 3.20 V output current −−150 mA
output voltage 1.20 3.20 V output current −−100 mA
output voltage 2.60 3.00 V output current −−100 mA
output voltage 2.60 3.00 V output current −−100 mA
output voltage 2.15 2.15 V output current −−1.5 mA
2003 Oct 31 21
Page 22
Controller for power supply and battery management
11 APPLICATION INFORMATION
handbook, full pagewidth
MAIN
BATTERY
2.2 µF
V
CHG
RF1VDD
RF2VDD
SCP SCN
CPVDD
GPO3
GPO2
GPO1
OSCI
OSCO
SIMEN
SIMVCC
V
BAT
31
34 33 32
27
22
24
37 38
35
46
47
48
26
25
45
44 42 43 41
BATTERY
CHARGER
CONSTANT
CURRENT
RF
UNIT
back light
back light
32.768 kHz
IOVDD
card present
SIM
CARD
READER
+
EL lamp
2.2 µF
or
DC
10 M
DC
R
SENSE
(3)
on key
4700 nF
4700 nF
220 nF
4700 nF
10 pF 10 pF
10 k
SIMRSCD_N
1000 nF
CHGCUR
CHGDRV
ONKEY_N
SIMIOCD
SIMCKCD
RF12VBAT
23
LPD1VBAT
20
IOD2VBAT
15
PCF50603
REFGND/V
SIMD3VBAT
40
SS
CPVBAT
36
HCVBAT
18
30
29
28
12
17
19
13
1
21
14
16
39
6
5 11 10
4
3
2
9
8
7
V
SAVE
VINT
REFC
MICBIAS
HCVDD
LPVDD
REC2_N REC1_N D1VDD
IOVDD
D2VDD
D3VDD
PWREN1 PWREN2
RSTHC_N IRQ_N CLK32K SDA SCL SIMIOHC SIMCKHC
SIMRSHC_N
battery
backup
470 nF
100 nF
4700 nF
(1)
4700 nF
(2)
470 nF
headset
from bottom connector
470 nF
470 nF
470 nF
470 nF
1 k 1 k
revmod
PCF50603
RAM 1.8 V
FLASH 1.8 V
AUXADCx
MICP
MICN
VDDA
VDDD
PCF5213
VDDE3
VDDA
VDDC VDDE1 VDDE2
LOWVOLT_N
ONKEY
AUXON_N
GPON0 RFSIGx RSTON
SIMERRN
CLK32I
SDA SCL
SIMIO
SIMCLK
GPOx
MDB691
(1) HCVDD is reserved for hands free audio supply. (2) LPVDD not used in the system. (3) Connect V
to ground if charger is used in BATMAX configuration.
CHG
Fig.14 Application diagram.
2003 Oct 31 22
Page 23
Controller for power supply and battery management
12 PACKAGE OUTLINE
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm
A
D
terminal 1 index area
B
E
A
PCF50603
SOT778-1
A
1
detail X
c
e
1
D
4.25
3.95
1/2 e
b
25
1/2 e
36
E
4.25
3.95
37
scale
h
e
1
4.4
0.41
D
h
0 2.5 5 mm
(1)
E
h
6.1
5.9
REFERENCES
e
13 24
L
12
E
h
1
terminal 1 index area
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
(1)
A
UNIT
mm
OUTLINE
VERSION
SOT778-1 - - -- - - - - -
max.
A
0.05
0.00
1
48
bc
0.25
0.15
(1)
D
6.1
0.2
5.9
IEC JEDEC JEITA
e
v
w
e
4.4
C
y
w
C
1
ye
0.05 0.1
EUROPEAN
PROJECTION
y
1
M
ACCB
M
e
2
L
2
0.5
0.1v0.05
0.3
y
X
ISSUE DATE
02-07-05
2003 Oct 31 23
Page 24
Controller for power supply and battery management
13 SOLDERING
13.1 Introduction to soldering surface mount packages
Thistext gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011). There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for certainsurface mount ICs, but it is not suitable forfinepitch SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied totheprinted-circuitboardby screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
below 220 °C (SnPb process) or below 245 °C (Pb-free
process) – for all BGA and SSOP-T packages – for packages with a thickness 2.5 mm – for packages with a thickness < 2.5 mm and a
volume 350 mm3 so called thick/large packages.
below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended forsurface mount devices (SMDs) or printed-circuit boards
PCF50603
with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
Forpackages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
2003 Oct 31 24
Page 25
Controller for power supply
PCF50603
and battery management
13.5 Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, LBGA, LFBGA, SQFP, SSOP-T DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
(1)
(3)
, TFBGA, VFBGA not suitable suitable
not suitable
HTSSOP, HVQFN, HVSON, SMS
(5)
PLCC
, SO, SOJ suitable suitable LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO, VSSOP not recommended
(8)
PMFP
not suitable not suitable
Notes
1. FormoredetailedinformationontheBGApackagesrefer to the
“(LF)BGAApplicationNote
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
SOLDERING METHOD
WAVE REFLOW
(4)
(5)(6) (7)
suitable
suitable suitable
”(AN01026);orderacopy
(2)
.
2003 Oct 31 25
Page 26
Controller for power supply
PCF50603
and battery management
14 DATA SHEET STATUS
LEVEL
I Objective data Development This data sheet contains data from the objective specification for product
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
III Product data Production This data sheet contains data from the product specification. Philips
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
development. Philips Semiconductors reserves the right to change the specification in any manner without notice.
Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
15 DEFINITIONS Short-form specification The data in a short-form
specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device atthese or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentation or warranty that such applicationswillbe suitable for the specified use without further testing or modification.
16 DISCLAIMERS Life support applications These products are not
designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductorscustomers using or selling theseproducts for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes  Philips Semiconductors reserves the right to make changes in the products ­including circuits, standard cells, and/or software ­described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Oct 31 26
Page 27
Controller for power supply and battery management
17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
2
C components conveys a license under the Philips’ I2C patent to use the
PCF50603
2003 Oct 31 27
Page 28
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R54/01/pp28 Date of release: 2003 Oct 31 Document order number: 9397 750 11771
SCA75
Page 29
WWW.ALLDATASHEET.COM
Copyright © Each Manufacturing Company.
All Datasheets cannot be modified without permission.
This datasheet has been download from :
www.AllDataSheet.com
100% Free DataSheet Search Site.
Free Download.
No Register.
Fast Search System.
www.AllDataSheet.com
Loading...