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PCF1303T
Datasheet (Philips)
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Datasheet PCF1303T Datasheet (Philips)

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Page 1
INTEGRATED CIRCUITS
DATA SH EET
PCF1303T
18-element bar graph LCD driver
Product specification File under Integrated Circuits, IC01
November 1986
Page 2
18-element bar graph LCD driver PCF1303T

GENERAL DESCRIPTION

The PCF1303T is an 18-element bar graph LCD driver with linear relation to control voltage (Vc) when in pointer or thermometer mode.
Fig.1 Block diagram.

PACKAGE OUTLINE

PCF1303T: 28-lead mini-pack; plastic (SO28; SOT136A); SOT136-1; 1996 September 02.
November 1986 2
Page 3
Philips Semiconductors Product specification
18-element bar graph LCD driver PCF1303T

PIN DESCRIPTION

PIN NO. SYMBOL NAME AND FUNCTION
1V 4I 5V 6 to 23 Q 24 Q 25 V 26 V 27 V 28 V
osc
1
SS
to Q
1
R c ref min ref max DD

FUNCTION TABLE

oscillator pin mode select input ground (0 V) segment outputs
18
back-plane output control voltage reference voltage inputs
positive supply voltage
I
1
L pointer H thermometer
H = HIGH voltage level L = LOW voltage level
MODE
(1) Pins 2 and 3 should be connected to VSS.
Fig.2 Pin configuration.
November 1986 3
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Philips Semiconductors Product specification
18-element bar graph LCD driver PCF1303T

FUNCTIONAL DESCRIPTION

The PCF1303T is an 18-element bar graph LCD driver with linear relation to the control voltage when in pointer or thermometer mode.
The first segment will energize when the control voltage is less than the trigger voltage (V
see equation (3)).
T(bar)2
The circuit has analogue and digital sections. The analogue section consists of a comparator with the inverting input coupled to the input control voltage. The
non-inverting input of the comparator is connected via 17 analogue switches to the nodes of an 18-element resistor divider. The extremities of the resistor divider are coupled via high-input impedance amplifiers to the maximum reference voltage input and the minimum reference voltage input.
The control input functions with Schmitt trigger action. The digital section has one reference output (QR) to drive the back-plane and 18 outputs (Q1 to Q18) to drive the
segments. The segment outputs incorporate two latches and some gates. The circuit is driven by an on-chip oscillator with external resistors and capacitors. The outputs are driven at typical
100 Hz.

LINEARITY

V
V ∆V
V
step′
step
V
step′
∆V
±=
step
is the voltage drop (internal) across the resistor-ladder network.
is the differential on V
step
V
()V
ref max
=
step′
---------------------------------------------------------------------------------------------
∆V±
2′
.
step
()–
ref min
18
∆V±
2
(1)
(2)
∆V
and ∆V2′ are the maximum offset voltage spread of the on-chip voltage followers.
2

ABSOLUTE VOLTAGE TRIGGER LEVEL

The absolute voltage trigger level at the V
V
T bar()n
V
()n1–()V
ref min
∆V±
{}∆V±
+=
2
pin is V
c
step′
T(bar)n
∆V±
;
R
V±
1
H
n = number of segments; 2 ≤ n ≤ 18. ∆V
is the voltage deviation at step n of the resistor-ladder network (for n = 2 or 18, ∆VR = ∆V
R
∆V1 is the offset voltage for the on-chip comparator. VH is the hysteresis voltage: 30% V
≥ VH ≥ 10% V
step
step.
Note to equation (3) For ∆V2 the same sign (+ or −) should be used as in equation (2).
step
(3)
).
November 1986 4
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Philips Semiconductors Product specification
18-element bar graph LCD driver PCF1303T

RATINGS

Limiting values as in accordance with the Absolute Maximum System (IEC 134)
Supply voltage V Voltage on any input V D.C. current into any input or output ± I Storage temperature range T Operating ambient temperature range T

D.C. CHARACTERISTICS

= 0 V
V
SS
(°C)
T
amb
PARAMETER V
SYMBOL −40 +25 +85 UNIT NOTES
DD
V MIN. MAX. MIN. TYP. MAX. MIN. MAX.
Quiescent device 10,0 I
DD
1200 1200 1200 µA1 current Operating supply 8,2 I
DD
2,0 2,0 2,0 mA 2 current Input leakage 6,0 ± I current 8,2 ± I
10,0 ± I HIGH level 6,0 V input voltage 8,2 V select input I
1
10,0 V LOW level input 6,0 V voltage 8,2 V select input I
1
10,0 V HIGH level 6,0 V output voltage 8,2 V
10,0 V LOW level 6,0 V output voltage 8,2 V
10,0 V Output current 6,0 −I HIGH 8,2 −I
10,0 −I Output current 6,0 I LOW 8,2 I
10,0 I
OL OL OL
IH IH IH IL IL IL OH OH OH OL OL OL
OH OH OH
I I I
4,2 4,2 4,2 V 5,8 5,8 5,8 V 7,0 7,0 7,0 V
5,95 5,95 5,95 V 4 8,15 8,15 8,15 V 9,95 9,95 9,95 V
0,6 0,5 0,35 mA 5 0,85 0,7 0,45 mA 1,0 0,85 0,6 mA 0,65 0,5 0,4 mA 6 1,0 0,8 0,6 mA 1,3 1,0 0,8 mA
300 300 1000 nA 3 300 300 1000 nA 300 300 1000 nA
1,8 1,8 1,8 V 2,4 2,4 2,4 V 3,0 3,0 3,0 V
0,05 0,05 0,05 V 4 0,05 0,05 0,05 V 0,05 0,05 0,05 V
DD I
I stg amb
−0,5 to + 15 V
−0,5 to VDD+ 0,5 V
max. 10 mA
−25 to + 125 °C
−40 to + 85 °C
November 1986 5
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Philips Semiconductors Product specification
18-element bar graph LCD driver PCF1303T
T
(°C)
amb
PARAMETER V
Input voltage 6,0 V control input V
c
8,2 V
10,0 V Input voltage 6,0 V V
input 8,2 V
ref max
10,0 V Input voltage 6,0 V V
input 8,2 V
ref min
10,0 V V
− 6,0 ∆V
ref max
V
ref min
8,2 ∆V
10,0 ∆V DC component 8,2 ± V bar output to back-plane output Back-plane 8,2 f frequency Input offset 8,2 ± V voltage Step voltage 8,2 ± ∆V variation Input voltage 6,0 SR 50 50 50 V/s 11 slew rate 8,2 SR 50 50 50 V/s V
input 10,0 SR 50 50 50 V/s
c
SYMBOL −40 +25 +85 UNIT NOTES
DD
V MIN. MAX. MIN. TYP. MAX. MIN. MAX.
IC IC IC IR max IR max IR max IR min IR min IR min
I I I
BP
BP
IO
step
0,0 6,0 0,0 6,0 0,0 6,0 V 0,0 8,2 0,0 8,2 0,0 8,2 V 0,0 10,0 0,0 10,0 0,0 10,0 V 3,6 5,5 3,6 5,5 3,6 5,5 V 3,6 7,7 3,6 7,7 3,6 7,7 V 3,6 9,5 3,6 9,5 3,6 9,5 V 0,5 1,0 0,5 1,0 0,5 1,0 V 0,5 4,5 0,5 4,5 0,5 4,5 V 0,5 6,0 0,5 6,0 0,5 6,0 V 3,0 3,0 3,0 V 3,0 3,0 3,0 V 3,0 3,0 3,0 V
25 10 25 25 mV 7
90 110 100 90 110 Hz 8
120 120 120 mV 9
50 50 50 mV 10
November 1986 6
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Philips Semiconductors Product specification
18-element bar graph LCD driver PCF1303T
Notes to D.C. characteristics
1. V
2. See Fig.2.
3. Pin under test at VSS or VDD. All other inputs simultaneously at VSS or VDD.
4. IO = 0, all inputs at VSS or VDD.
5. VOH = VDD− 0,5 V, all inputs at VSS or VDD.
6. VOL = 0,4 V, all inputs at VSS or VDD.
7. fBP = 100 Hz, load segment outputs to back-plane output.
8. R
9. Number of segments 2 or 18.
10. See equation (1).
11. Condition applies with clock oscillator such that f
ref min
= 0,5 V, V
= 9,5 V, Vc = V
ref max
= 0 V, I1 at VSS or VDD.
osc
C1− C18≤ 0,01 µF, CBP= C1+ C2+ . . . C18≤ 0,05 µF, R1− R18≥ 2 MΩ.
= 0,1 MΩ, C
osc
= 390 pF.
osc
For n = 2:
V
V
VcV
IO
–
ref min
ref max
– V
------------------------------------------------------------------- -
) V
18
ref min
)(–(
±=
H
For n = 18:
()V
V
VcV
V
IO
–
ref max
ref max
--------------------------------------------------------- ­18
()–
ref min
V
±+=
H
BP
= 100 Hz.
Fig.3 Typical application.
November 1986 7
Page 8
Philips Semiconductors Product specification
18-element bar graph LCD driver PCF1303T

PACKAGE OUTLINE

SO28: plastic small outline package; 28 leads; body width 7.5 mm
D
c
y
Z
28
pin 1 index
1
e
15
14
w M
b
p

SOT136-1

E
H
E
Q
A
2
A
1
L
p
L
detail X
(A )
A
X
v M
A
A
3
θ
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT136-1
A
max.
2.65
0.10
A
0.30
0.10
0.012
0.004
A2A
1
2.45
2.25
0.096
0.089
IEC JEDEC EIAJ
075E06 MS-013AE
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1) (1)
cD
18.1
7.6
7.4
0.30
0.29
1.27
0.050
17.7
0.71
0.69
REFERENCES
November 1986 8
eHELLpQ
10.65
10.00
0.419
0.394
1.4
0.055
1.1
0.4
0.043
0.016
1.1
1.0
0.043
0.039
PROJECTION
0.25
0.25 0.1
0.01
0.01
EUROPEAN
ywv θ
Z
0.9
0.4
0.035
0.004
0.016
ISSUE DATE
95-01-24 97-05-22
o
8
o
0
Page 9
Philips Semiconductors Product specification
18-element bar graph LCD driver PCF1303T
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
November 1986 9
Page 10
Philips Semiconductors Product specification
18-element bar graph LCD driver PCF1303T

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
November 1986 10
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