Datasheet PCD50922H, PCD50912H Datasheet (Philips)

DATA SH EET

Objective specification
File under Integrated Circuits, IC17

1998 Apr 27

INTEGRATED CIRCUITS

PCD509x2/zuu/v family

Low cost; low power DECT
baseband controllers (ABC-PRO)

1998 Apr 27 2

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 BLOCK DIAGRAM
5 PINNING INFORMATION

5.1 Pinning

5.2 Pin description
6 FUNCTIONAL DESCRIPTION

6.1 DECT baseband controller system
7 PACKAGE OUTLINES
8 SOLDERING

8.1 Introduction

8.2 Reflow soldering

8.3 Wave soldering

8.4 Repairing soldered joints
9 DEFINITIONS
10 LIFE SUPPORT APPLICATIONS
11 PURCHASE OF PHILIPS I2C COMPONENTS

1998 Apr 27 3

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

1 FEATURES

• The PCD50912 is designed for GAP compatible DECT
handsets

• The PCD50922 is designed for GAP compatible DECT
base stations serving up to six handsets

• Fully static 80C51 microcontroller

• Emulation supported for 80C51 program development

• Four 8-bit ports (P0, P1, P2 and P3), 32 I/O lines

• Dedicated port pins for keyboard, I2C-bus, interrupt

sources and/or external memory

• Fifteen interrupt sources (including those from TICB,
BML and DSP) with two priority levels

• I

2

C-bus interface

• UART with IrDA-compatible Data Transmission Mode

• 256 bytes of microcontroller main RAM

• 3 kbytes of microcontroller AUX RAM

• 1 kbyte of shared System Data RAM

• 64 kbytes of mask programmable ROM

• 128 kbyte address space for external ROM access,

maximum 192 kbytes together with internal ROM

• 128 kbytes of external RAM addressable

• Embedded DSP with 6.912, 13.824 or 27.648 Mips

• Speech and IOM-2 interface

• BML for TDMA frame (de)multiplexing. Transmission or

reception can be programmed for any slot

• Ciphering, scrambling, CRC checking/generation,
protected B-fields

• Local call and B-field loop-back

• Automatic receiver delay adjustment programmable per

slot to correct for terminal mobility

• Phase error measurement and phase error correction by
hardware

• Serial interface to synthesizer for frequency
programming

• Programmable timing and polarity of radio-control
signals

• Easy interfacing with radio circuits, operating at different
supply voltages

• GMSK pulse shaper with two different pulse shapes
(BT = 0.5 and BT = 0.8)

• Comparator for use as bit-slicer

• 3 channel time-multiplexed 8-bit ADC for RSSI, battery

and general input voltage measurement

• Battery management supported by programmable
current source for temperature or charge current
measurement

• On-chip 8-bit DAC for various purposes

• Low power crystal oscillator at 13.824 MHz

• Programmable on-chip capacitors for frequency

adjustment to 13.824 MHz with large pulling range

• High performance DAC and ADC for dynamic earpiece
and dynamic or electret microphone

• Analog-to-digital path switchable sensitivity for
microphone or line interface input

• On-chip reference voltage and supply for electret
microphone

• Very low ohmic buzzer output

• Pulse density modulated or pulse width modulated

buzzer output signal

• Power-on-reset

• Low power operation optimized for 2 battery cells in

handset

• Long standby time due to reduced digital supply voltage
and reduced activity in idle-locked mode

• Flexible supply voltage concept due to use of level
shifters between each supply voltage domain

• Eight independent supply voltage domains:
– 1.8 to 3.6 V for digital core, microcontroller ports P0

and P2, and also P1 and P3
– 1.8 to 3.6 V for buzzer, oscillator and battery
– 2.7 to 3.6 V for RF interface and analog circuits

• CMOS technology

• Small and flat LQFP80 package.

1998 Apr 27 4

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

2 GENERAL DESCRIPTION

The PCD509x2 family is designed for low power GAP
compatible DECT handset (PP) and base station (FP)
applications. The circuit includes the audio interface, the
DSP, the microcontroller and the Burst Mode Logic, and
contains all functionality to convert speech and data
signals from/to the analog side (microphone and earpiece
or line interface circuit) to/from the radio side
(1.152 Mbits/s data).

This circuit is a member of the ABC family, where A stands
for ‘ADPCM codec’, B for ‘Burst Mode Logic’ and C for
‘microController’. The name ABC-PRO stands for
PROfessional ABC.

The PCD509x2/zuu/v contains on-chip ROM for the
embedded DSP code and on-chip ROM for the embedded
microcontroller code. It is these ROM codes that
differentiate between various chip derivatives. For each
DSP code a separate DSP user manual is published.
Please contact Philips Semiconductors for more
information.

This family specification contains the hardware description
that is independent of the used ROM codes.

The numerical digit ‘x’ in PCD509x2 determines the
intended application area (e.g. PCD50912 for use in
handsets or PCD50922 for use in simple base stations,
etc.). The last numerical digit ‘2’ is used to denote
hardware derivatives. The extension digits ‘z’ (A to Z) and
‘uu’ (00 to 99) denote the DSP and the microcontroller
software version, respectively. The extension ‘v’ denotes
the hardware version updates of the circuit.

Although the microcontroller ROM code is present on-chip,
an external program memory for the microcontroller code
can be used. This is not the case for the DSP ROM code
which is fixed by the chip version.

Throughout this family specification the term PCD509x2 is
used to cover all sub types and versions. If any specific
feature or parameter is connected to a certain sub type or
version this will be specifically written. Until otherwise
stated this family specification is valid for hardware
version 1 (v = 1).

3 ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

PCD50912H LQFP80 plastic low profile quad flat package; 80 leads; body 12 × 12 × 1.4 mm SOT315-1
PCD50922H

1998 Apr 27 5

Philips Semiconductors Objective specification

Low cost; low power DECT baseband

controllers (ABC-PRO)

PCD509x2/zuu/v family

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4 BLOCK DIAGRAM

o

k, full pagewidth

MGM858

R_DATAM

R_DATAP

REF_CLK

SLICE_CTR

R_PWR

R_ENABLE

S_PWR

S_CLK

S_DATA

S_ENABLE

GPP

T_PWR

T_ENABLE

ANT_SW1

ANT_SW0

LEVEL

SHIFTER

AGM

BURST
MODE
LOGIC

(BML)

CLOCK

GENERATOR

(CLG)

TIMING

CONTROL

BLOCK

(TICB)

WATCHDOG

TIMER

(WDT)

ISB

RESET

GENERATOR

(RGE)

DIGITAL

CONTROL

OF

ANALOG

(DCA)

80CL51 CORE

ROM

(64 kBYTES)

AB-MICROCONTROLLER

INTERFACE (ABCIF)

LEVEL SHIFTER

PORT 0

8

8 8 8

LEVEL SHIFTER

PORT 2

LEVEL SHIFTER

PORT 1

LEVEL SHIFTER

PORT 3

AUX-RAM

(3 kBYTES)

MICROCONTROLLER-RAM

(256 BYTES)

I2C-BUS UART

SYSTEM

DATA

RAM

(SDR)

(1 kBYTE)

DIGITAL
SIGNAL

PROCESSOR

(DSP)

MEMORY

DIGITAL

DECIMATING

FILTER

(DDF)

DIGITAL

NOISE

SHAPER

(DNS)

DIGITAL

PULSE

SHAPER

(DPS)

DIGITAL

PULSE

SHAPER

(DPS)

LEVEL

SHIFTER

DIGITAL

RECEIVE

FILTER

(DRF)

ANALOG VOLTAGE

REFERENCE

(AVR)

POWER-ON-RESET

(POR)

ANALOG

VOLTAGE

SOURCE

(AVS)

AUXILIARY

ADC

(AAD)

Σ ∆

1-BIT ADC

ATS

1-BIT DAC (ARD)

AMP

V

ref

BUZZER BUFFER

(ABB)

CODEC

V

DDD

V

DDD

V

DDD

V

DD(BZ)

V

DDD

V

DDA

V

DD(RF)

V

DDD

ALE A16

V

DD(OSC)

V

DDD

V

DD(BAT)

V

DDA

T_GSMK/

T_DATA

XTAL1

XTAL2

M_RESET

VBGP

VANLO

MICM/LIFP

MICP/LIFM

EARM

EARP

BZM

BZP

ANALOG SWITCH (ASW)

V

ref

ANALOG SUBTRACTOR (ASU)

V

DD(BAT)

ANALOG RSSI TREATMENT (ART)

RSSI_AN

ADJUSTABLE CURRENT SOURCE (ACS)

VANLI

V

DDD

P0 P2 P3

(1)

P1

(1)

V

DDD

V

DD(P0, P2)

V

DD(P1, P3)

MICROCONTROLLER

PCD509x2

IB BUS

LEVEL

SHIFTER

EA

PSEN

digital pins

supply pins

analog pins

V

SSD

V

DD(P1, P3)

V

DD(P0, P2)

V

SS(P0, P2)

V

DD(BZ)

V

SS(BZ)

V

DD(RF)

V

SS(RF)

V

DDA

V

SSA

V

DD(OSC)

V

SS(OSC)

V

DD(BAT)

LEVEL

SHIFTER

LEVEL

SHIFTER

LEVEL

SHIFTER

LEVEL

SHIFTER

LEVEL

SHIFTER

SPEECH

INTERFACE

IOM



ADPCM

(SPI)

ISB BUS

CONTROLLER

(IBC)

Fig.1 Block diagram.

(1) Ports 1 and 3 are shared with alternative functions.

1998 Apr 27 6

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

5 PINNING INFORMATION

5.1 Pinning

Fig.2 Pin configuration (LQPF80).

ndbook, full pagewidth

PCD509x2/zuu/v

MGM857

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19

P1.1/INT3

P1.0/INT2
M_RESET
ANT_SW0
ANT_SW1

T_ENABLE

T_PWR

GPP

S_ENABLE

S_DATA

S_CLK

S_PWR

R_ENABLE

R_PWR

SLICE_CTR

V

DD(RF)

V

SS(RF)

REF_CLK

RSSI_AN

T_GSMK/T_DATA 20

60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

80

79

78

77

76

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

P1.2/INT4/DI

P1.3/INT5/DO

P1.4/INT6/DCK

P1.5/INT7/FS1

P1.6/INT8/SCL

P1.7/INT9/SDA

V

DD(P1, P3)VDDDVSSD

P3.0/RXD

P3.1/TXD

P3.4/T0

P3.5/T1

P0.0

P0.1

R_DATAP

R_DATAM

V

DD(OSC)

XTAL2

XTAL1

V

SS(OSC)

V

DD(BAT)

VANLI

VANLO

V

DDA

EARM

EARP

V

SSA

VBGP

V

ref

MICM/LIFP

MICP/LIFM

V

DD(BZ)

BZM

BZP

P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
ALE
PSEN

V

DD(P0, P2)

V

SS(P0, P2)

A16
P2.7
P2.6
P2.5
P2.4
P2.3
P2.2
P2.1
P2.0

V

SS(BZ)

P3.7/RD

P3.6/WR

P3.2/INT0

P3.3/INT1/IrDA

EA

1998 Apr 27 7

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

5.2 Pin description
Table 1 LQFP80 package

SYMBOL PIN I/O

STATE

AFTER

RESET

(1)

SUPPLY
DOMAIN

DESCRIPTION

P1.1/INT3 1 I/O HIGH V

DD(P1,P3)

80C51 port pin/external interrupt 3

P1.0/INT2 2 I/O HIGH V

DD(P1,P3)

80C51 port pin/external interrupt 2

M_RESET 3 I − V

DDD

master reset input (Schmitt trigger)

ANT_SW0 4 O HIGH V

DD(RF)

antenna switch 0

ANT_SW1 5 O HIGH V

DD(RF)

antenna switch 1

T_ENABLE 6 O HIGH V

DD(RF)

enable transmitter

T_PWR 7 O LOW V

DD(RF)

switch transmitter power

GPP 8 O LOW V

DD(RF)

general purpose pin used for the following:
CLK100
VCO_BND_SW
GP_CLK7
GP_CLK3
GP_CLK05
R_SLICED
on/of

100 Hz signal related to DECT frame timing
VCO band switch

6.912 MHz general purpose clock

3.456 MHz general purpose clock
576 kHz general purpose clock
ABS bitslice comparator output
static high/low.

S_ENABLE 9 O LOW V

DD(RF)

synthesizer enable

S_DATA 10 O LOW V

DD(RF)

serial synthesizer data

S_CLK 11 O LOW V

DD(RF)

clock for serial synthesizer interface

S_PWR 12 O LOW V

DD(RF)

switch synthesizer power

R_ENABLE 13 O HIGH V

DD(RF)

enable receiver

R_PWR 14 O HIGH V

DD(RF)

switch receiver power

SLICE_CTR 15 O LOW V

DD(RF)

switch slicer time constant

V

DD(RF)

16 −− − positive supply voltage for RF interface pins

V

SS(RF)

17 −− − negative supply voltage for RF interface pins

REF_CLK 18 O running V

DD(RF)

programmable reference clock for synthesizer

RSSI_AN 19 I − V

DD(RF)

analog input for RSSI measurement

T_GMSK/T_DATA 20 O off V

DD(RF)

transmitter data output, filtered/digital

R_DATAP 21 I − V

DD(RF)

positive input for receiver data

R_DATAM 22 I − V

DD(RF)

negative input for receiver data

V

DD(OSC)

23 −− − positive supply for crystal oscillator

XTAL2 24 O running V

DD(OSC)

crystal oscillator output

XTAL1 25 I − V

DD(OSC)

crystal oscillator input

1998 Apr 27 8

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

V

SS(OSC)

26 −− − negative supply for crystal oscillator

V

DD(BAT)

27 I −−positive battery supply voltage

VANLI 28 I/O − V

DDA

analog input to ADC, current output

VANLO 29 O off V

DDA

analog output from DAC

V

DDA

30 −− − positive supply voltage for analog circuits

EARM 31 O off V

DDA

negative output to earpiece

EARP 32 O off V

DDA

positive output to earpiece

V

SSA

33 −− − negative supply voltage for analog circuits

VBGP 34 O 1.2 V V

DD(BAT)

bandgap output voltage (+1.2 V)

V

ref

35 O off V

DDA

reference voltage, microphone supply (+2 V)

MICM/LIFP 36 I off V

DDA

negative/positive input from microphone/line

MICP/LIFM 37 I off V

DDA

positive/negative input from microphone/line

V

DD(BZ)

38 −− − positive supply voltage for buzzer

BZM 39 O LOW V

DD(BZ)

negative buzzer output

BZP 40 O LOW V

DD(BZ)

positive buzzer output

V

SS(BZ)

41 −− − negative supply voltage for buzzer

P2.0 42 I/O HIGH V

DD(P0,P2)

bidirectional Port 3 pins (80C51)

P2.1 43 I/O HIGH V

DD(P0,P2)

P2.2 44 I/O HIGH V

DD(P0,P2)

P2.3 45 I/O HIGH V

DD(P0,P2)

P2.4 46 I/O HIGH V

DD(P0,P2)

P2.5 47 I/O HIGH V

DD(P0,P2)

P2.6 48 I/O HIGH V

DD(P0,P2)

P2.7 49 I/O HIGH V

DD(P0,P2)

A16 50 O LOW V

DD(P0,P2)

A16 address select

V

SS(P0,P2)

51 −− − negative supply voltage

V

DD(P0,P2)

52 −− − positive supply voltage for periphery pins

PSEN 53 O HIGH V

DD(P0,P2)

program store enable (80C51), active LOW

ALE 54 O HIGH V

DD(P0,P2)

address latch enable (80C51)

P0.7 55 I/O HIGH V

DD(P0,P2)

bidirectional Port 0 pins (80C51)

P0.6 56 I/O HIGH V

DD(P0,P2)

P0.5 57 I/O HIGH V

DD(P0,P2)

P0.4 58 I/O HIGH V

DD(P0,P2)

P0.3 59 I/O HIGH V

DD(P0,P2)

P0.2 60 I/O HIGH V

DD(P0,P2)

P0.1 61 I/O HIGH V

DD(P0,P2)

P0.0 62 I/O HIGH V

DD(P0,P2)

SYMBOL PIN I/O

STATE

AFTER

RESET

(1)

SUPPLY
DOMAIN

DESCRIPTION

1998 Apr 27 9

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

Note

1. In the ‘State After Reset’ column the following symbols are used:
a) HIGH means active HIGH, for BUPxSW pin types this means weak pull-up
b) LOW means active LOW
c) ‘running’ means the clock signal is active
d) ‘off’ means the high-impedance state.

EA 63 I − V

DD(P0,P2)

external access (80C51), active LOW

P3.7/

RD 64 I/O HIGH V

DD(P1,P3)

80C51 port pin/Read data, active LOW

P3.6/

WR 65 I/O HIGH V

DD(P1,P3)

80C51 port pin/Write data, active LOW

P3.5/T1 66 I/O HIGH V

DD(P1,P3)

80C51 port pin/Timer 1 input

P3.4/T0 67 I/O HIGH V

DD(P1,P3)

80C51 port pin/Timer 0 input

P3.3/

INT1/IrDA 68 I/O HIGH V

DD(P1,P3)

80C51 port pin/external interrupt 1/IrDA clock

P3.2/

INT0 69 I/O HIGH V

DD(P1,P3)

80C51 port pin/external interrupt 0

P3.1/TXD 70 I/O HIGH V

DD(P1,P3)

80C51 port pin/UART transmit data

P3.0/RXD 71 I/O HIGH V

DD(P1,P3)

80C51 port pin/UART receive data

V

SSD

72 −− − negative supply voltage for digital core

V

DDD

73 −− − positive supply voltage for digital core

V

DD(P1,P3)

74 −− − positive supply voltage for periphery pins

P1.7/INT9/SDA 75 I/O off V

DD(P1,P3)

80C51 port pin/external interrupt 9/I2C-bus data

P1.6/INT8/SCL 76 I/O off V

DD(P1,P3)

80C51 port pin/external interrupt 8/I2C-bus clock

P1.5/INT7/FS1 77 I/O HIGH V

DD(P1,P3)

80C51 port pin/external interrupt 7/SPI Frame Sync

P1.4/INT6/DCK 78 I/O HIGH V

DD(P1,P3)

80C51 port pin/external interrupt 6/SPI Data Clock

P1.3/INT5/DO 79 I/O HIGH V

DD(P1,P3)

80C51 port pin/external interrupt 5/SPI Data Out

P1.2/INT4/DI 80 I/O HIGH V

DD(P1,P3)

80C51 port pin/external interrupt 4/SPI Data In

SYMBOL PIN I/O

STATE

AFTER

RESET

(1)

SUPPLY
DOMAIN

DESCRIPTION

1998 Apr 27 10

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

6 FUNCTIONAL DESCRIPTION

6.1 DECT baseband controller system

The PCD509x2 is a family of baseband controllers,
designed for use in Digital Enhanced Cordless
Telecommunications systems (DECT). The family is
designed for minimal component-count and minimal power
consumption for very long standby times. All baseband
controllers include an embedded 80C51 microcontroller
with on-chip memory, including an IrDA (Infrared Data
Association) compatible UART and I

2

C-bus. The Burst
Mode Logic performs the time-critical MAC layer functions
for applications in DECT handsets and base stations.
The implemented RF Interface is compatible with the
Philips Burst Mode Controller PCD504x. The ADPCM
transcoding is in compliance with the CCITT
Recommendation G.726. Also included is an on-chip
codec with receive and transmit filters, complying with
CCITT Recommendation G.712. Power-on-reset logic and
power management functions further reduce power
consumption and external components.

The chip is intended to support stand-alone systems only
(see Fig.3). There are no provisions to build clusters of
base stations. There are no provisions for external
controllers to exert control over the embedded 80C51.
There are no provisions for external controllers to have
direct access to the on-chip data memories. There are no
provisions to allow handsets to receive from two
unsynchronised base stations simultaneously, but a
handset can operate in a multi base station environment
as long as they are synchronous base stations.

Refer to the block diagram in Fig.1. The DECT Controller
consists of a number of functional blocks that operate
more or less autonomously and communicate with each
other via the System Data RAM (SDR). Blocks have
access to SDR via the Internal System Bus (ISB). The ISB
consists of an 8-bit data bus, a 10-bit address bus and a
number of bus-request/bus-grant signals. Access to the
ISB is controlled by ISB Bus Controller (IBC). The IBC
acknowledges bus requests on the basis of a priority
scheme. The embedded 80C51 controller is to be
programmed by the user. It must contain DECT software
from Man-Machine Interface (MMI) to the DECT protocols
TBC, CBC and DBC (refer to

“Figures 10 to 13, in

Section 6 of prETS 300 175-3: June

1996”). Software is

available from Philips Semiconductors.
Hardware state machines in the Burst Mode Logic (BML)

and the Speech Interface (SPI) execute the lower blocks in
the TBC, CBC and DBC. The 80C51 has control over the
BML and the SPI via tables in SDR. The BML saves serial
data, received via R_DATAP/M, in buffer areas in SDR.
The position of the buffers in SDR is fixed by the 80C51
software by means of the tables previously mentioned.
A-fields and B-fields are stored in separate buffers. In this
way, two traffic bearers, each with their private A-fields,
can share the same B-field buffer as is required in case of
bearer hand-over or local call. The DSP and Codec
support speech processing functions like analog-to-digital
and digital-to-analog conversion, filtering, ADPCM
encoding and decoding, 8-bit µ-law PCM to 14-bit linear
PCM conversion and its reverse, echo cancelling, tone
generation etc.

Fig.3 Block diagram examples of DECT systems with PCD509xy.

handbook, full pagewidth

MGM859

PCD50922

LINE

INTERFACE

(e.g. PCA1070)

a/b line

RADIO

CIRCUITS

handbook, full pagewidth

MGM860

PCD50912

MICROPHONE

EARPIECE

RADIO

CIRCUITS

a. Handset.

b. Base station.

1998 Apr 27 11

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

7 PACKAGE OUTLINE

UNIT

A

max.

A1A2A3bpcE

(1)

eH

E

LL

p

Zywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

1.6

0.16

0.04

1.5

1.3

0.25

0.27

0.13

0.18

0.12

12.1

11.9

0.5

14.15

13.85

1.45

1.05

7
0

o
o

0.15 0.10.21.0

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.30

SOT315-1

97-07-15

95-12-19

D

(1) (1)(1)

12.1

11.9

H

D

14.15

13.85

E

Z

1.45

1.05

D

b

p

e

θ

E

A

1

A

L

p

detail X

L

(A )

3

B

20

c

D

H

b

p

E

H

A

2

v M

B

D

Z

D

A

Z

E

e

v M

A

X

1

80

61

60 41

40

21

y

pin 1 index

w M

w M

0 5 10 mm

scale

LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm

SOT315-1

1998 Apr 27 12

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

8 SOLDERING

8.1 Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

8.2 Reflow soldering

Reflow soldering techniques are suitable for all LQFP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250 °C.

8.3 Wave soldering

Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

CAUTION

Wave soldering is NOT applicable for all LQFP
packages with a pitch (e) equal or less than 0.5 mm.

If wave soldering cannot be avoided, for LQFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

8.4 Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1998 Apr 27 13

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

9 DEFINITIONS

10 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

11 PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Short-form specification The data in this specification is extracted from a full data sheet with the same type

number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1998 Apr 27 14

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

NOTES

1998 Apr 27 15

Philips Semiconductors Objective specification

Low cost; low power DECT baseband
controllers (ABC-PRO)

PCD509x2/zuu/v family

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1998 SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]

Printed in The Netherlands 435102/1200/01/pp16 Date of release: 1998 Apr 27 Document order number: 9397 750 03527