Datasheet PCD3349AT-107, PCD3349AT-144, PCD3349AP-107-3, PCD3349AP-117 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1996 Dec 18
File under Integrated Circuits, IC03

1998 May 11

INTEGRATED CIRCUITS

PCD3349A

8-bit microcontroller with
DTMF generator

1998 May 11 2

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 BLOCK DIAGRAM
5 PINNING INFORMATION

5.1 Pinning

5.2 Pin description
6 FREQUENCY GENERATOR

6.1 Frequency generator derivative registers

6.2 Frequency registers

6.3 DTMF frequencies

6.4 Modem frequencies

6.5 Musical scale frequencies
7 TIMING
8 RESET
9 STOP MODE
10 IDLE MODE
11 INSTRUCTION SET
12 SUMMARY OF MASK OPTIONS
13 LIMITING VALUES
14 HANDLING
15 DC CHARACTERISTICS
16 AC CHARACTERISTICS
17 PACKAGE OUTLINES
18 SOLDERING

18.1 Introduction

18.2 DIP

18.3 SO
19 DEFINITIONS
20 LIFE SUPPORT APPLICATIONS

1998 May 11 3

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

1 FEATURES

• 8-bit CPU, ROM, RAM, I/O in a single 28-lead package

• 4-kbyte ROM

• 224-byte RAM

• Over 100 instructions (based on MAB8048) all of 1 or 2

cycles

• 20 quasi-bidirectional I/O port lines

• 8-bit programmable Timer/event counter 1

• 2 single-level vectored interrupts:

– external
– Timer/event counter 1

• Two test inputs, one of which also serves as the external
interrupt input

• DTMF tone generator

• Reference for supply and temperature-independent

TONE output

• Filtering for low output distortion (CEPT compatible)

• Power-on-reset

• Stop and Idle modes

• Supply voltage: 1.8 to 6 V (DTMF TONE output from

2.5 V)

• Low standby voltage of 1 V

• Low Stop mode current of 1 µA (typical)

• Clock frequency: 1 to 16 MHz (3.58 MHz for DTMF

suggested)

• Manufactured in silicon gate CMOS process.

2 GENERAL DESCRIPTION

The PCD3349A provides 4 kbytes of Program Memory,
224 bytes of RAM and 20 I/O lines.

The PCD3349A is a microcontroller which has been
designed primarily for telecom applications. It includes an
on-chip dual tone multi-frequency (DTMF) generator.

The instruction set is based on that of the MAB8048 and is
software compatible with the PCD33xxA family.

This data sheet details the specific properties of the
PCD3349A. The shared characteristics of the PCD33xxA
family of microcontrollers are described in the

“PCD33xxA

Family”

data sheet and also in

“Data Handbook IC03;

Section PCD33xxA Family”

, which should be read in

conjunction with this publication.

3 ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

PCD3349AP DIP28

plastic dual in-line package; 28 leads (600 mil)

SOT117-1

PCD3349AT SO28

plastic small outline package; 28 leads; body width 7.5 mm

SOT136-1

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

1998 May 11 4

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4 BLOCK DIAGRAM

handbook, full pagewidth

OSCILLATOR

MBG098

PORT 0

FLIP-FLOP

PORT 0

BUFFER

88

HIGHER
PROGRAM
COUNTER

LOWER
PROGRAM
COUNTER

PROGRAM

STATUS

WORD

MEMORY

BANK

FLIP-FLOPS

RESIDENT ROM

4 kbytes

DECODE

8

T1

8

8

5 888 8

8

P0.0 to P0.7

RAM
ADDRESS
REGISTER

ACCUMULATOR

TEMPORARY

REGISTER 1

PCD3349A

HGF

REGISTER

8

88

LGF

REGISTER

SINE WAVE

GENERATOR

TEMPORARY

REGISTER 2

ARITHMETIC

LOGIC UNIT

INSTRUCTION

REGISTER

&

DECODER

DECIMAL

ADJUST

CONTROL & TIMING

XTAL 2XTAL 1RESET

STOP
IDLE

INTERRUPT

INITIALIZE

CONDITIONAL

BRANCH

LOGIC

CE / T0

CE / T0

T1
TIMER

FLAG

CARRY
ACC

ACC BIT

TEST

RESIDENT RAM ARRAY

224 bytes

MULTIPLEXER

8 LEVEL STACK

(VARIABLE LENGTH)

OPTIONAL SECOND

REGISTER BANK

DATA STORE

D
E
C
O
D
E

REGISTER 0
REGISTER 1
REGISTER 2
REGISTER 3
REGISTER 4
REGISTER 5
REGISTER 6
REGISTER 7

PORT 1

FLIP-FLOP

PORT 1

BUFFER

P1.0 to P1.7

8

8

PORT 2

FLIP-FLOP

PORT 2

BUFFER

P2.0 to P2.3

4

4

TIMER/
EVENT

COUNTER

32

INTERNAL

CLOCK

FREQUENCY

30

8

88 8 8

INTERRUPT

LOGIC

timer interrupt

external interrupt

TONE

FILTER

POWER-ON-RESET

V

POR

RESET

Fig.1 Block diagram.

1998 May 11 5

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

5 PINNING INFORMATION

5.1 Pinning

Fig.2 Pin configuration (SOT117-1 and SOT136-1).

handbook, halfpage

PCD3349A

MBG087

1
2
3
4
5
6
7
8

9
10
11
12
13
14

28
27
26
25
24
23
22
21
20
19
18
17
16
15

P0.1 P0.0

P2.3
P2.2
P2.1

V

DD
TONE
V

SS
P2.0

P1.7
P1.6
P1.5
P1.4
P1.3
P1.2

P0.2
P0.3
P0.4
P0.5
P0.6
P0.7

T1
XTAL1
XTAL2

RESET

P1.0

P1.1

CE/T0

5.2 Pin description
Table 1 SOT117-1 and SOT136-1 packages

SYMBOL PIN DESCRIPTION

P0.0 to P0.7 28, 1 to 7 Port 0: 8 quasi-bidirectional

I/O lines

T1 8 Test 1 or count input of 8-bit

Timer/event counter 1

XTAL1 9 crystal oscillator or external

clock input
XTAL2 10 crystal oscillator output
RESET 11 reset input
CE/

T0 12 Chip Enable or Test 0

P1.0 to P1.7 13 to 20 Port 1: 8 quasi-bidirectional

I/O lines
P2.0 to P2.3 21, 25,

26, 27

Port 2: 4 quasi-bidirectional

I/O lines
V

SS

22 ground
TONE 23 DTMF output
V

DD

24 positive supply voltage

1998 May 11 6

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

6 FREQUENCY GENERATOR

A versatile frequency generator section is provided (see
Fig.3). For normal operation, use a 3.58 MHz quartz
crystal or PXE resonator. The frequency generator
includes precision circuitry for dual tone multifrequency
(DTMF) signals, which is typically used for tone dialling
telephone sets.

The TONE output can alternatively issue twelve modem
frequencies for data rates between 300 and 1200 bits/s.

In addition to DTMF and modem frequencies, two octaves
of musical scale in steps of semitones are available.

6.1 Frequency generator derivative registers

Table 2 gives the derivative addresses, mnemonics and access types of the frequency generator derivative registers.
The addresses 03H to FFH are not used.

Table 2 Addresses of the frequency generator derivative registers

Notes

1. HGF = High Group Frequency; access type W.

2. LGF = Low Group Frequency; access type W.

ADDRESS REGISTER 7 6 5 4 3 2 1 0

01H HGF

(1)

H7 H6 H5 H4 H3 H2 H1 H0

02H LGF

(2)

L7 L6 L5 L4 L3 L2 L1 L0

Fig.3 Block diagram of the frequency generator section.

book, full pagewidth

HGF

REGISTER

MBG099

DIGITAL

SINE WAVE

SYNTHESIZER

8

SWITCHED-

CAPACITOR

BANDGAP
VOLTAGE

REFERENCE

DAC

DAC

LGF

REGISTER

DIGITAL

SINE WAVE

SYNTHESIZER

8

8 internal bus

SWITCHED-

CAPACITOR

LOW-PASS FILTER

RC LOW-PASS

FILTER

TONE

1998 May 11 7

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

6.2 Frequency registers

The two frequency registers HGF and LGF define two
frequencies. From these, the digital sine synthesizers
together with the Digital-to-Analog Converters (DACs)
construct two sine waves. Their amplitudes are precisely
scaled according to the bandgap voltage reference. This
ensures TONE output levels independent of supply
voltage and temperature. The amplitude of the Low Group
Frequency sine wave is attenuated by 2 dB compared to
the amplitude of the High Group Frequency sine wave.

The two sine waves are summed and then filtered by an
on-chip switched capacitor and RC low-pass filters. These
guarantee that all DTMF tones generated fulfil the CEPT
recommendations with respect to amplitude, frequency
deviation, total harmonic distortion and suppression of
unwanted frequency components.

The value 00H in a frequency register stops the
corresponding digital sine synthesizer. If both frequency
registers contain 00H, the whole frequency generator is
shut off, resulting in lower power consumption.

The frequency of the sine wave generated is dependent
upon the decimal value ‘x’ held in the frequency registers
(HGF and LGF), and this may be calculated as follows:

; where 60 ≤ x ≤ 255.

The frequency limitation given by x ≥ 60 is due to the
low-pass filters which would attenuate higher frequency
sine waves.

6.3 DTMF frequencies

Assuming an oscillator frequency f

xtal

= 3.58 MHz, the
DTMF standard frequencies can be implemented as
shown in Table 3.

The relationship between telephone keyboard symbols
and the frequency register contents are given in Table 4.

f

f

xtal

23 x 2+()[]

--------------------------------

-

=

Table 3 DTMF standard frequencies and their

implementation; value = LGF, HGF contents

Table 4 Dialling symbols, corresponding DTMF

frequency pairs and frequency registers content

VALUE

(HEX)

FREQUENCY (Hz) DEVIATION

STANDARD GENERATED (%) (Hz)

DD 697 697.90 0.13 0.90

C8 770 770.46 0.06 0.46
B5 852 850.45 −0.18 −1.55
A3 941 943.23 0.24 2.23

7F 1209 1206.45 −0.21 −2.55
72 1336 1341.66 0.42 5.66
67 1477 1482.21 0.35 5.21

5D 1633 1638.24 0.32 5.24

TELEPHONE

KEYBOARD

SYMBOLS

DTMF FREQ.

PAIRS

(Hz)

LGF

VALUE

(HEX)

HGF

VALUE

(HEX)

0 (941, 1336) A3 72
1 (697, 1209) DD 7F
2 (697, 1336) DD 72
3 (697, 1477) DD 67
4 (770, 1209) C8 7F
5 (770, 1336) C8 72
6 (770, 1477) C8 67
7 (852, 1209) B5 7F
8 (852, 1336) B5 72
9 (852, 1477) B5 67
A (697, 1633) DD 5D

B (770, 1633) C8 5D
C (852, 1633) B5 5D
D (941, 1633) A3 5D

• (941, 1209) A3 7F

# (941, 1477) A3 67

1998 May 11 8

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

6.4 Modem frequencies

Again assuming an oscillator frequency f

xtal

= 3.58 MHz,
the standard modem frequency pairs summarized in
Table 5 can be implemented. It is suggested to define the
frequency by the HGF register while the LGF register
contains 00H, disabling Low Group Frequency generation.

Table 5 Standard modem frequency pairs and their

implementation

Notes

1. Standard is V.21.

2. Standard is Bell 103.

3. Standard is Bell 202.

4. Standard is V.23.

6.5 Musical scale frequencies

Finally, two octaves of musical scale in steps of semitones
can be realized, again assuming an oscillator frequency
f

xtal

= 3.58 MHz (Table 6). It is suggested to define the
frequency by the HGF register while the LGF contains
00H, disabling Low Group Frequency generation.

HGF

VALU

E

(HEX)

FREQUENCY (Hz) DEVIATION

MODEM GENERATED (%) (Hz)

9D 980

(1)

978.82 −0.12 −1.18

82 1180

(1)

1179.03 −0.08 −0.97

8F 1070

(2)

1073.33 0.31 3.33

79 1270

(2)

1265.30 −0.37 −4.70

80 1200

(3)

1197.17 −0.24 −2.83

45 2200

(3)

2192.01 −0.36 −7.99

76 1300

(4)

1296.94 −0.24 −3.06

48 2100

(4)

2103.14 0.15 3.14

5C 1650

(1)

1655.66 0.34 5.66

52 1850

(1)

1852.77 0.15 2.77

4B 2025

(2)

2021.20 −0.19 −3.80

44 2225

(2)

2223.32 −0.08 −1.68

Table 6 Musical scale frequencies and their

implementation

Note

1. Standard scale based on A4 at 440 Hz.

NOTE

HGF

VALUE

(HEX)

FREQUENCY (Hz)

STANDARD

(1)

GENERATED

D#5 F8 622.3 622.5

E5 EA 659.3 659.5
F5 DD 698.5 697.9

F#5 D0 740.0 741.1

G5 C5 784.0 782.1

G#5 B9 830.6 832.3

A5 AF 880.0 879.3

A#5 A5 923.3 931.9

B5 9C 987.8 985.0
C6 93 1046.5 1044.5

C#6 8A 1108.7 1111.7

D6 82 1174.7 1179.0

D#6 7B 1244.5 1245.1

E6 74 1318.5 1318.9
F6 6D 1396.9 1402.1

F#6 67 1480.0 1482.2

G6 61 1568.0 1572.0

G#6 5C 1661.2 1655.7

A6 56 1760.0 1768.5

A#6 51 1864.7 1875.1

B6 4D 1975.5 1970.0
C7 48 2093.0 2103.3

C#7 44 2217.5 2223.3

D7 40 2349.3 2358.1

D#7 3D 2489.0 2470.4

1998 May 11 9

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

7 TIMING

Although the PCD3349A operates over a clock frequency
range from 1 to 16 MHz, f

xtal

= 3.58 MHz will usually be
chosen to take full advantage of the frequency generator
section.

8 RESET

In addition to the conditions given in the

“PCD33xxA

Family”

data sheet, all derivative registers are cleared in

the RESET state.

9 STOP MODE

Since the oscillator is switched off, the frequency
generator receives no clock. It is suggested to clear both
the HGF and LGF registers before entering Stop mode.
This will cut-off the biasing of the internal amplifiers,
considerably reducing current requirements.

10 IDLE MODE

In the Idle mode, the frequency generator remains
operative.

11 INSTRUCTION SET RESTRICTIONS

Since no serial I/O interface is provided, the serial I/O
(Input/Output) instructions are not available. ‘MOV Dx, A’
is the only applicable derivative instruction because the
derivative registers are write-only.

ROM space being restricted to 4 kbytes, SEL MB2/3 would
define non-existing Program Memory banks and should
therefore be avoided.

RAM space being restricted to 224 bytes, care should be
taken to avoid accesses to non-existing RAM locations.

12 SUMMARY OF MASK OPTIONS
Table 7 Port mask options

Notes

1. Port output drives:

a) Option 1: standard I/O.
b) Option 2: open-drain I/O.
c) Option 3: push-pull output; see

“PCD33xxA Family”

data sheet.

2. Port state after reset: S = Set (HIGH) and R = Reset (LOW).

Table 8 Mask options

PORT NAME

PORT OUTPUT DRIVE

(1)

PORT STATE AFTER RESET

(2)

OPTION 1 OPTION 2 OPTION 3

SET RESET

Port 0 (P0.0 to P0.7) X X X X X
Port 1 (P1.0 to P1.7) X X X X X
Port 2 (P2.0 to P2.7) X X X X X

FEATURE DESCRIPTION

ROM code: program/data Any mix of instructions and data up to ROM size of 4 kbytes.
Power-on-reset voltage level: V

POR

1.2 to 3.6 V in increments of 100 mV; OFF

Oscillator transconductance: g

m

LOW transconductance: g

mL

MEDIUM transconductance: g

mM

HIGH transconductance: g

mH

1998 May 11 10

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

13 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); see note 1 and 2.

Notes

1. Stresses above those listed under Limiting Values may cause permanent damage to the device.

2. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to

V

SS

unless otherwise noted.

14 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take
normal precautions appropriate to handling MOS devices (see

“Handling MOS devices”

).

15 DC CHARACTERISTICS

V

DD

= 1.8 to 6 V; VSS=0V; T

amb

= −25 to +70 °C; all voltages with respect to VSS; f

xtal

= 3.58 MHz (gmL); unless

otherwise specified.

SYMBOL PARAMETER MIN. MAX. UNIT

V

DD

supply voltage −0.5 +7.0 V

V

I

all input voltages −0.5 VDD+ 0.5 V

I

I,IO

DC input or output current −10 +10 mA

P

tot

total power dissipation − 125 mW

P

O

power dissipation per output − 30 mW

I

SS

ground supply current −50 +50 mA

T

stg

storage temperature −65 +150 °C

T

j

operating junction temperature − 90 °C

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (see Figs 5 to 9)

V

DD

supply voltage

operating; note 1 1.8 − 6V
RAM data retention in

Stop mode

1.0 − 6V

I

DD

operating supply current;
note 2

VDD= 3 V; value HGF ≠ 0 and/or LGF ≠ 0 − 0.9 1.8 mA
V

DD

=3V − 0.3 0.6 mA

V

DD

=5V; f

xtal

= 10 MHz (gmL) − 1.1 3.0 mA

V

DD

=5V; f

xtal

= 16 MHz (gmM) − 1.7 5.0 mA

V

DD

=5V; f

xtal

= 16 MHz (gmH) − 2.5 6.0 mA

I

DD(idle)

supply current Idle mode;
note 2

VDD= 3 V; value HGF ≠ 0 and/or LGF ≠ 0 − 0.7 1.4 mA
V

DD

= 3 V; value HGF = LGF = 0 − 0.2 0.4 mA

V

DD

=5V; f

xtal

= 10 MHz (gmL) − 0.8 1.6 mA

V

DD

=5V; f

xtal

= 16 MHz (gmM) − 1.2 4.0 mA

V

DD

=5V; f

xtal

= 16 MHz (gmH) − 1.7 5.0 mA

I

DD(stp)

supply current Stop mode VDD= 1.8 V; T

amb

=25°C; note 3 − 1.0 2.5 µA

V

DD

= 1.8 V; T

amb

=70°C; note 3 −−10 µA

1998 May 11 11

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

Notes

1. TONE output requires VDD≥ 2.5 V.

2. VIL=VSS; VIH=VDD; open-drain outputs connected to VSS; all other outputs open; value HGF = LGF = 0, unless

otherwise specified.

3. Crystal connected between XTAL1 and XTAL2; pins T1 and CE/T0 at VSS; value HGF = LGF = 0.

4. Values are specified for DTMF frequencies only (CEPT).

5. Related to the Low Group Frequency (LGF) component (CEPT).

6. V

POR

is an option chosen by the user. Depending on its value, it may restrict the supply voltage range.

Inputs

V

IL

LOW-level input voltage 0 − 0.3VDDV

V

IH

HIGH-level input voltage 0.7VDD− V

DD

V

I

IL

input leakage current VSS≤ VI≤ V

DD

−1 − +1 µA
Port outputs (see Figs 10 to 12)
I

OL

LOW-level port sink
current

VDD= 3 V; VO= 0.4 V 0.7 3.5 − mA

I

OH

HIGH-level port pull-up
source current

VO= 2.7 V; VDD=3V −10 −20 −µA
V

O

=0V; VDD=3V −−100 −300 µA

I

OH

HIGH-level port push-pull
source current

VDD= 3 V; VO= 2.6 V −0.7 −4 − mA

TONE output (see Fig.4; notes 1 and 4)
V

HGrms

HGF voltage (RMS) 158 181 205 mV

V

LGrms

LGF voltage (RMS) 125 142 160 mV
frequency deviation −0.6 − 0.6 %

V

DC

DC voltage level − 0.5VDD− V

Z

O

 output impedance − 100 500 Ω

V

G

pre-emphasis of group 1.5 2.0 2.5 dB

THD total harmonic distortion T

amb

=25°C; note 5 − 25 − dB

Power-on-reset

∆V

POR

Power-on-reset level
variation around chosen
V

POR

note 6 −0.5 0 +0.5 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

f∆ f⁄

1998 May 11 12

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

Fig.4 TONE output test circuit.

handbook, halfpage

MGB835

10 kΩ

TONE

50 pF

1 µF

DEVICE TYPE NUMBER

(1)

V

DD

V

SS

(1) Device type number: PCD3349A

Fig.5 Typical supply current (IDD) in Stop mode as

a function of supply voltage (VDD).

handbook, halfpage

1

6

4

3

1

5

2

0

35

V

DD

(V)

7

MGB826

I

DD(stp)

(µA)

Fig.6 Typical operating supply current (IDD) as a

function of supply voltage (VDD).

andbook, halfpage

1

6

4

2

0

35

V

DD

(V)

7

MGB827

I

DD

(mA)

16 MHz

3.58 MHz
HGF or LGF ≠ 0

10 MHz

3.58 MHz

Measured with crystal between XTAL1 and XTAL2.

Fig.7 Typical operating supply current (IDD) as a

function of clock frequency (f

xtal

).

handbook, halfpage

6

0

2

2

4

1

MGB828

10 10

I

DD

(mA)

f

xtal

(MHz)

3 V

5 V

Measured with function generator on XTAL1.

1998 May 11 13

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

Fig.8 Typical supply current (IDD) in Idle mode as

a function of supply voltage (VDD).

andbook, halfpage

1

6

4

2

0

35

V

DD

(V)

7

MGB829

I

DD(idle)

(mA)

16 MHz

3.58 MHz
HGF or LGF ≠ 0

10 MHz

3.58 MHz

Measured with crystal between XTAL1 and XTAL2.

Fig.9 Typical supply current (IDD) in Idle mode as

a function of clock frequency (f

xtal

).

Measured with function generator on XTAL1.

handbook, halfpage

6

0

2

2

4

1

MGB830

10 10

I

DD(idle)

(mA)

f

xtal

(MHz)

3 V

5 V

Fig.10 Typical LOW-level port output sink current

(IOL) as a function of supply voltage (VDD).

VO= 0.4 V.

handbook, halfpage

1

12

8

4

0

35

V

DD

(V)

7

MGB831

I

OL

(mA)

Fig.11 Typical HIGH-level output pull-up source

current (IOH) as a function of supply voltage
(VDD).

handbook, halfpage

MBG095

VDD(V)

135 7

−200

−100

0

−300

(µA)

I

OH

SS

V = V

O

DD

V = 0.9V

O

1998 May 11 14

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

Fig.12 Typical HIGH-level push-pull output source

current (IOH) as a function of supply voltage
(VDD).

VO=VDD− 0.4 V.

handbook, halfpage

1

−12

−8

−4

0

35

V

DD

(V)

7

MGB833

I

OH1

(mA)

Fig.13 Typical Power-on-reset level (V

POR

) as

function of temperature.

handbook, halfpage

−25

6

4

2

0

25 75

70

T

amb

(°C)

125

MGD495

V

DD

(V)

V

POR

= 1.3 V

V

POR

= 2.0 V

1998 May 11 15

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

16 AC CHARACTERISTICS

V

DD

= 1.8 to 6 V; VSS=0V; T

amb

= −25 to +70 °C; all voltages with respect to VSS; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

t

r

rise time all outputs VDD=5V; T

amb

=25°C; CL=50pF − 30 − ns

t

f

fall time all outputs − 30 − ns

f

xtal

clock frequency see Fig.14 1 − 16 MHz
Oscillator (see Fig.15)
g

mL

LOW transconductance VDD= 5 V 0.2 0.4 1.0 mS
g

mM

MEDIUM transconductance 0.9 1.6 3.2 mS
g

mH

HIGH transconductance 3.0 4.5 9.0 mS
R

F

feedback resistor 0.3 1.0 3.0 MΩ

handbook, halfpage

MLA493

VDD (V)

135 7

f

xtal

(MHz)

12

9

6

3

0

15

18

guaranteed
operating range

Fig.14 Maximum clock frequency (f

xtal

) as a

function of supply voltage (VDD).

Fig.15 Typical transconductance as a function of

supply voltage (VDD).

handbook, halfpage

1357

V

DD

(V)

10

−1

MBG097

1

10

g

m

(mS)

g

mH

g

mM

g

mL

1998 May 11 16

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

17 PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

(1)

(1) (1)

cD E weM

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT117-1

92-11-17
95-01-14

A

min.

A

max.

b

Z

max.

M

E

e

1

1.7

1.3

0.53

0.38

0.32

0.23

36.0

35.0

14.1

13.7

3.9

3.4

0.252.54 15.24

15.80

15.24

17.15

15.90

1.75.1 0.51 4.0

0.066

0.051

0.020

0.014

0.013

0.009

1.41

1.34

0.56

0.54

0.15

0.13

0.010.10 0.60

0.62

0.60

0.68

0.63

0.0670.20 0.020 0.16

051G05 MO-015AH

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

28

1

15

14

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1

1998 May 11 17

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

UNIT

A

max.

A

1

A2A3b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

18.1

17.7

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT136-1

X

14

28

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

c

L

v M

A

e

15

1

(A )

3

A

y

0.25

075E06 MS-013AE

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.71

0.69

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

SO28: plastic small outline package; 28 leads; body width 7.5 mm

SOT136-1

95-01-24
97-05-22

1998 May 11 18

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

18 SOLDERING

18.1 Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

18.2 DIP

18.2.1 S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

18.2.2 R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

18.3 SO

18.3.1 REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

18.3.2 W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

18.3.3 R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1998 May 11 19

Philips Semiconductors Product specification

8-bit microcontroller with DTMF generator PCD3349A

19 DEFINITIONS

20 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1998 SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
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South America: Al. Vicente Pinzon, 173, 6th floor,
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Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
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Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
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Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
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Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]

Printed in The Netherlands 415102/1200/05/pp20 Date of release: 1998 May 11 Document order number: 9397 750 03605