Datasheet PCD3311CP, PCD3311CT, PCD3312CP, PCD3312CT Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

PCD3311C; PCD3312C

DTMF/modem/musical-tone
generators

Product specification
Supersedes data of May 1990
File under Integrated Circuits, IC03

1996 Nov 21

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 QUICK REFERENCE DATA
4 ORDERING INFORMATION
5 BLOCK DIAGRAM
6 PINNING INFORMATION

6.1 Pinning PCD3311CP

6.2 Pin description PCD3311CP

6.3 Pinning PCD3311CT

6.4 Pin description PCD3311CT

6.5 Pinning PCD3312C

6.6 Pin description PCD3312C
7 FUNCTIONAL DESCRIPTION

7.1 General

7.2 Clock/oscillator connection

7.3 Mode selection (PCD3311C)

7.4 Data inputs (PCD3311C)

7.5 Strobe input (PCD3311C )

7.6 I2C-bus clock and data inputs

7.7 Address input

7.8 I2C-bus data configuration

7.9 Tone output

7.10 Power-on reset

7.11 Tables of Input and output
8I

8.1 Bit transfer

8.2 Start and stop conditions

8.3 System configuration

8.4 Acknowledge

8.5 Timing specifications

8.5.1 Standard mode

8.5.2 Low-speed mode
9 HANDLING
10 LIMITING VALUES
11 CHARACTERISTICS
12 APPLICATION INFORMATION
13 PACKAGE OUTLINES
14 SOLDERING

14.1 Introduction

14.2 DIP

14.2.1 Soldering by dipping or by wave

14.2.2 Repairing soldered joints

14.3 SO

14.3.1 Reflow soldering

14.3.2 Wave soldering

14.3.3 Repairing soldered joints

2

C-BUS INTERFACE

15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
17 PURCHASE OF PHILIPS I2C COMPONENTS

1996 Nov 21 2

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

1 FEATURES

• DTMF, modem and musical tone generation

• Stabilized output voltage level

• Low output distortion with on-chip filtering conforming to

CEPT recommendations

• Latched inputs for data bus applications

• I2C-bus compatible

• Selection of parallel or serial (I2C-bus) data input

(PCD3311C).

used, and a separate microcontroller is required to control
the devices.

Both the devices can interface to I

2

C-bus compatible
microcontrollers for serial input. The PCD3311C can also
interface directly to all standard microcontrollers,
accepting a binary coded parallel input.

With their on-chip voltage reference the PCD3311C and
PCD3312C provide constant output amplitudes which are
independent of the operating supply voltage and ambient
temperature.

An on-chip filtering system assures a very low total

2 GENERAL DESCRIPTION

The PCD3311C and PCD3312C are single-chip silicon
gate CMOS integrated circuits. They are intended
principally for use in telephone sets to provide the
dual-tone multi-frequency (DTMF) combinations required
for tone dialling systems. The various audio output
frequencies are generated from an on-chip 3.58 MHz
quartz crystal-controlled oscillator. A separate crystal is

harmonic distortion in accordance with CEPT
recommendations.

In addition to the standard DTMF frequencies the devices
can also provide:

• Twelve standard frequencies used in simplex modem

applications for data rates from 300 to 1200 bits per
second

• Two octaves of musical scales in steps of semitones.

3 QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DD

I

DD

I

stb

V

HG(RMS)

V

LG(RMS)

G

v

operating supply voltage 2.5 − 6.0 V
operating supply current −−0.9 mA
standby current −−3µA
DTMF HIGH group output voltage level (RMS value) 158 192 205 mV
DTMF LOW group output voltage level (RMS value) 125 150 160 mV

pre-emphasis (voltage gain) of group 1.85 2.10 2.35 dB
THD total harmonic distortion −−25 − dB
T

amb

operating ambient temperature −25 − +70 °C

4 ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

PCD3311CP DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
PCD3311CT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
PCD3312CP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
PCD3312CT SO8 plastic small outline package; 8 leads; body width 7.5 mm SOT176-1

1996 Nov 21 3

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

5 BLOCK DIAGRAM

handbook, full pagewidth

D5
D4
D3
D2

3

4
12
11
10

9(8)
8(7)

5

MODE

D1/SDA
D0/SCL

STROBE

The un-parenthesised numbers are for the PCD3311CP, those in parenthesis for the PCD3312C.

OSCI OSCO

OSCILLATOR

INPUT

CONTROL

LOGIC

A

0

1(3)

7(6)

2(4)

GENERATOR

HIGH

GROUP

DIVIDER

DIVIDER

SELECTION

(ROM)

LOW

GROUP

DIVIDER

CLOCK

SWITCHED

CAPACITOR

BANDGAP

VOLTAGE

REFERENCE

ADDER

Fig.1 Block diagram.

DAC

HIGH

DAC

LOW

V

DD

14(2) 13(1)

SWITCHED

CAPACITOR

PCD3311C
PCD3312C

V

SS

RESISTOR

CAPACITOR

MGG543

(5)6

TONE

6 PINNING INFORMATION

6.1 Pinning PCD3311CP

handbook, halfpage

OSCI
OSCO
MODE

D5

STROBE

TONE

A0

1
2
3
4

PCD3311CP

5
6
7

Fig.2 Pin configuration PCD3311CP.

MGG508

14
13
12
11
10

9
8

V

DD

V

SS

D4
D3
D2
D1/SDA
D0/SCL

6.2 Pin description PCD3311CP

SYMBOL PIN TYPE DESCRIPTION

OSCI 1 I oscillator input
OSCO 2 O oscillator output
MODE 3 I mode select input (selects

2

C or parallel data input)

I
D5 4 I parallel data input
STROBE 5 I strobe input (for loading

data in parallel mode)
TONE 6 O frequency output (DTMF,

modem, musical tones)
A0 7 I slave address input (to be

connected to V

or VSS)

DD

D0/SCL 8 I parallel data input or

2

C-bus clock line

I
D1/SDA 9 I parallel data input or

2

C-bus data line

I
D2 − D4 10 − 12 I parallel data inputs
V

SS

V

DD

13 P negative supply
14 P positive supply

1996 Nov 21 4

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

6.3 Pinning PCD3311CT

handbook, halfpage

OSCI

OSCO

MODE

D5

n.c.

STROBE

TONE

A0

1
2
3
4

PCD3311CT

5
6
7
8

Fig.3 Pin configuration PCD3311CT.

MGG509

16
15
14
13
12
11
10

9

V

DD

V

SS

D4

n.c.
D3
D2
D1/SDA
D0/SCL

6.4 Pin description PCD3311CT
SYMBOL PIN TYPE DESCRIPTION

OSCI 1 I oscillator input
OSCO 2 O oscillator output
MODE 3 I mode select input (selects

2

C or parallel data input)

I
D5 4 I parallel data input
n.c. 5 − not connected
STROBE 6 I strobe input (for loading

data in parallel mode)
TONE 7 O frequency output (DTMF,

modem, musical tones)
A0 8 I slave address input (to be

connected to V

or VSS)

DD

D0/SCL 9 I parallel data input or

2

C-bus clock line

I
D1/SDA 10 I parallel data input or

2

C-bus data line

I
D2, D3 11, 12 I parallel data inputs
n.c. 13 − not connected
D4 14 I parallel data input
V

SS

V

DD

15 P negative supply
16 P positive supply

6.5 Pinning PCD3312C

handbook, halfpage

V

SS

V

DD

OSCI

OSCO

1
2

PCD3312C

3
4

Fig.4 Pin configuration PCD3312C.

MGG510

6.6 Pin description PCD3312C
SYMBOL PIN TYPE DESCRIPTION

V

SS

V

DD

1 P negative supply

2 P positive supply
OSCI 3 I oscillator input
OSCO 4 O oscillator output

SDA

8

SCL

7

A0

6

TONE

5

TONE 5 O frequency output (DTMF,

modem, musical tones)

A0 6 I slave address input (to be

or VSS)

DD

SCL 7 I I
SDA 8 I I

connected to V

2

C-bus clock line

2

C-bus data line

1996 Nov 21 5

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

7 FUNCTIONAL DESCRIPTION

7.1 General (see Fig.1)

The Input Control Logic decodes the input data to
determine whether DTMF, modem or musical tones are
selected; and which particular tone or combination of
tones is required.

A code representing the required tones is sent to the
Divider Selection ROM which selects the correct division
ratio in both of the Frequency Dividers (or in one divider, if
only a single tone is required).

The Oscillator circuit provides a square wave of frequency

3.58 MHz. Each Frequency Divider divides the frequency
of the Oscillator to give a serial digital square wave with a
frequency simply related to that of the required tone.

The output from each Frequency Divider goes to a DAC,
which is also fed by a clock derived from the oscillator.
Using these two signals, the DAC produces an
approximate sine wave of the required frequency, with an
amplitude derived from the Voltage Reference.

The output from the DAC goes to an Adder where, for
DTMF, it is combined with the output from the other DAC.

The output from the Adder goes through two stages of Low
Pass Filters to give a smoothed tone (single or dual), and
finally to the TONE output.

7.4 Data inputs (PCD3311C)

Inputs D0, D1, D2, D3, D4 and D5 are used in the parallel
data input mode of the PCD3311C. Inputs D0 and D1 are
also used in serial input mode when they act as the SCL
and SDA inputs respectively. Inputs D0 and D1 have no
internal pull-down or pull-up resistors and must not be left
open in any application. Inputs D2, D3, D4 and D5 have
internal pull-down.

D4 and D5 are used to select between DTMF dual, DTMF
single, modem and musical tones (see Table 1). D0, D1,
D2 and D3 select the tone combination or single tone
within the selected application. They also, in combination
with D4, select the standby mode. See Tables 2, 3, 4
and 5.

PCD 3312C has no parallel data pins as data input is via

2

C-bus.

the I

Table 1 Use of D5 and D4 to select application

D5 D4 APPLICATION

LOW LOW DTMF single tones; musical tones;

standby
LOW HIGH DTMF dual tones (all 16 combinations)
HIGH LOW modem tones
HIGH HIGH musical tones

7.2 Clock/oscillator connection

The timebase for the PCD3311C and PCD3312C is a
crystal-controlled oscillator, requiring a 3.58 MHz quartz
crystal to be connected between OSCI and OSCO.
Alternatively, the OSCI input can be driven from an
external clock of 3.58 MHz.

7.3 Mode selection (PCD3311C)

The MODE input selects the data input mode for the
PCD3311C. When MODE is connected to V

(HIGH),

DD

data can be received in the parallel mode. When
connected to VSS (LOW) or left open, data can be received
via the serial I2C-bus.

PCD 3312C has no MODE input as data input is via the
I2C-bus only.

7.5 Strobe input (PCD3311C )

The STROBE input (with internal pull-down) allows the
loading of parallel data into D0 to D5 when MODE is HIGH.

The data inputs must be stable preceding the
positive-going edge of the strobe pulse (active HIGH).
Input data are loaded at the negative-going edge of the
strobe pulse and then the corresponding tone (or standby
mode) is provided at the TONE output. The output remains
unchanged until the negative-going edge of the next
STROBE pulse (for new data) is received. Figure 5 is an
example of the timing relationship between STROBE and
the data inputs.

When MODE is LOW, data is received serially via the

2

C-bus.

I

1996 Nov 21 6

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

90%

t

SPW

t

DH

oscillator OFF

t

(ON)

tone

oscillator ON

no output tone

oscillator ON

output tones

handbook, full pagewidth

STROBE

TONE

10%

t

DS

D0

D1

D2

D3

D4

D5

MGG511

Fig.5 Timing of STROBE, parallel data inputs and TONE output (770 Hz + 1477 Hz in example) in the parallel

mode (MODE = HIGH).

7.6 I2C-bus clock and data inputs

SCL and SDA are the serial clock and serial data inputs
according to the I2C-bus specification, see Chapter 8.
SCL and SDA must be pulled up externally to VDD.

For the PCD3311C, SCL and SDA are combined with
parallel inputs D0 and D1 respectively - D0/SCL and
D1/SDA operate serially only when MODE is LOW.

7.7 Address input

Address input A0 defines the least significant bit of the

2

C-bus address of the device (see Fig.6). The first 6 bits

I
of the address are fixed internally. By tying the A0 of each
device to VDD (HIGH) and VSS(LOW) respectively, two
different PCD3311C or PCD3312C devices can be
individually addressed on the bus.

Whether one or two devices are used, A0 must be
connected to VDD or VSS.

1996 Nov 21 7

7.8 I

2

C-bus data configuration (see Fig.6)

The PCD3311C and PCD3312C are always slave
receivers in the I2C-bus configuration. The R/W bit in is
thus always LOW, indicating that the master
(microcontroller) is writing.

The slave address in the serial mode consists of 7 bits: 6
bits internally fixed, 1 externally set via A0. in the serial
mode, the same input data codes are used as in the
parallel mode. See Tables 2, 3, 4 and 5.

7.9 Tone output

The single and dual tones provided at the TONE output are
first filtered by an on-chip switched-capacitor filter,
followed by an active RC low-pass filter. The filtered tones
fulfil the CEPT recommendations for total harmonic
distortion of DTMF tones. An on-chip reference voltage
provides output tone levels independent of the supply
voltage. Tables 3, 4 and 5 give the frequency deviation of
the output tones with respect to the standard DTMF,
modem and music frequencies.

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

handbook, full pagewidth

acknowledge

from slave

MSB

S 010010A00AXXD5D4D3D2D1D0AP

slave address data

MGG512

R/W

acknowledge

from slave

internal STROBE

for data latching

Fig.6 I2C-bus data format.

7.10 Power-on reset

In order to avoid an undefined state when the power is switched ON, the devices have an internal reset circuit which sets
the standby mode (oscillator OFF).

7.11 TABLES OF INPUT AND OUTPUT

The specified output tones are obtained when a 3.579545 MHz crystal is used.
In each table, the logical states for the input data lines are related to voltage levels as follows:
1 = HIGH = V
0 = LOW = V

DD

SS

X = don’t care

Table 2 Input data for no output tone, TONE in 3-state

D5 D4 D3 D2 D1 D0 HEX

(1)

X 0 0 0 0 0 00 or 20 ON
X 0 0 0 0 1 01 or 21 OFF
X 0 0 0 1 0 02 or 22 OFF
X 0 0 0 1 1 03 or 23 OFF

Note

1. The alternative HEX values depend on the value of D5.

1996 Nov 21 8

OSCILLATOR

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

Table 3 Input data and output for DTMF tones

STANDARD

D5 D4 D3 D2 D1 D0 HEX SYMBOL

00100008 − 697 697.90 +0.13 +0.90
00100109 − 770 770.46 +0.06 +0.46
0010100A − 852 850.45 −0.18 −1.55
0010110B − 941 943.23 +0.24 +2.23
0011000C − 1209 1206.45 −0.21 −2.55
0011010D − 1336 1341.66 +0.42 +5.66
0011100E − 1477 1482.21 +0.35 +5.21
0011110F − 1633 1638.24 +0.32 +5.24
01000010 0 941+1336 −−−
01000111 1 697+1209 −−−
01001012 2 697+1336 −−−
01001113 3 697+1477 −−−
01010014 4 770+1209 −−−
01010115 5 770+1336 −−−
01011016 6 770+1477 −−−
01011117 7 852+1209 −−−
01100018 8 852+1336 −−−
01100119 9 852+1477 −−−
0110101A A697+1633 −−−
0110111B B770+1633 −−−
0111001C C852+1633 −−−
0111011D D941+1633 −−−
0111101E * 941+1209 −−−
0111111F # 941+1477 −−−

FREQUENCY

Hz Hz % Hz

TONE

OUTPUT

FREQ.

FREQUENCY

DEVIATION

Table 4 Input data and output for modem tones

STANDARD

D5 D4 D3 D2 D1 D0 HEX

10010024 13001296.94 −0.24 −3.06
10010125 21002103.14 +0.15 +3.14
10011026 12001197.17 −0.24 −2.83
10011127 22002192.01 −0.36 −7.99
10100028 980978.82 −0.12 −1.18
10100129 11801179.03 −0.08 −0.97

1996 Nov 21 9

FREQUENCY

Hz Hz % Hz

TONE

OUTPUT

FREQ.

FREQUENCY

DEVIATION

TELECOM.

STANDARD

V.23

Bell 202

V.21

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

STANDARD

D5 D4 D3 D2 D1 D0 HEX

1010102A 10701073.33 +0.31 +3.33
1010112B 12701265.30 −0.37 −4.70
1011002C 16501655.66 +0.34 +5.66
1011012D 18501852.77 +0.15 +2.77
1011102E 20252021.20 −0.19 −3.80
1011112F 22252223.32 −0.08 −1.68

Table 5 Input/output for musical tones

D5 D4 D3 D2 D1 D0 HEX NOTE

11000030 D#5 622.3 622.5
11000131 E5 659.3 659.5
11001032 F5 698.5 697.9
11001133 F#5 740.0 741.1
11010034 G5 784.0 782.1
11010135 G#5 830.6 832.3
11011036 A5 880.0 879.3
11011137 A#5 932.3 931.9
11100038 B5 987.8 985.0
11100139 C6 1046.5 1044.5
1110103A C#6 1108.7 1111.7
10100129 D6 1174.7 1179.0
1110113B D#6 1244.5 1245.1
1111003C E6 1318.5 1318.9
1111013D F6 1396.9 1402.1
0011100E F#6 1480.0 1482.2
1111103E G6 1568.0 1572.0
1011002C G#6 1661.2 1655.7
1111113F A6 1760.0 1768.5
00010004 A#6 1864.7 1875.1
00010105 B6 1975.5 1970.0
10010125 C7 2093.0 2103.1
1011112F C#7 2217.5 2223.3
00111006 D7 2349.3 2358.1
00011107 D#7 2489.0 2470.4

FREQUENCY

Hz Hz % Hz

TONE

OUTPUT

FREQ.

FREQUENCY

DEVIATION

STD. FREQ.

BASED ON

A4 = 440 Hz

Hz Hz

FREQUENCY

TELECOM.

STANDARD

Bell 103

V.21

Bell 103

TONE

OUTPUT

1996 Nov 21 10

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

8I2C-BUS INTERFACE

The I2C-bus is for two-way communication between different ICs or modules. It uses only two lines, a serial data line
(SDA) and a serial clock line (SCL), both of which are bi-directional. Both lines must be connected to a positive supply
via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus
is not busy.

8.1 Bit transfer (see Fig.7)
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period

of the clock pulse as changes in the data line at this time will be interpreted as control signals.

SDA

SCL

data line

stable;

data valid

change

of data

allowed

MBC621

Fig.7 Bit transfer.

8.2 Start and stop conditions (see Fig.8)
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the

clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is
defined as the stop condition (P).

SDA

SCL

S

START condition

P

STOP condition

SDA

SCL

MBC622

Fig.8 Start and stop conditions.

1996 Nov 21 11

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

8.3 System configuration (see Fig.9)
A device generating a message is a ‘transmitter’, a device receiving a message is the ‘receiver’. The device that controls

message transfer is the ‘master’ and the devices that are controlled by the master are the ‘slaves’.

SDA
SCL

MASTER

TRANSMITTER /

RECEIVER

SLAVE

RECEIVER

SLAVE

TRANSMITTER /

RECEIVER

MASTER

TRANSMITTER

MASTER

TRANSMITTER /

RECEIVER

MBA605

Fig.9 System configuration.

8.4 Acknowledge

The number of data bytes transferred between the start and stop conditions from transmitter to receiver is not limited.
Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the
transmitter whereas the master generates an extra acknowledge after the reception of each byte. Also a master must
generate an acknowledge after reception of each byte that has been clocked out of the slave transmitter. The device that
acknowledges has to pull down the SDA line during the acknowledge-related clock pulse. Set-up and hold times must
be taken into account to ensure that the SDA line is stable LOW during the whole HIGH period of the
acknowledge-related clock pulse. A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data
line HIGH to enable the master to generate the stop condition.

DATA OUTPUT

BY TRANSMITTER

DATA OUTPUT

BY RECEIVER

SCL FROM

MASTER

S

START

CONDITION

Fig.10 Acknowledgment on the I2C-bus.

1996 Nov 21 12

not acknowledge

acknowledge

MBC602

9821

clock pulse for

acknowledgement

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

8.5 Timing specifications

The PCD3311C and PCD3312C accept data input from a microcontroller and are ‘slave receivers’ when operating via
the I2C-bus. They support the ‘standard’ and ‘low-speed’ modes of the I2C-bus, but not the ‘fast’ mode detailed in

I2C-bus and how to use it”

document order no. 9398 393 40011. The timing requirements for the devices are described

in Sections 8.5.1 and 8.5.2.

“The

8.5.1 S

TANDARD MODE

Masters generate a bus clock with a maximum frequency of 100 kHz. Detailed timing is shown in Fig.11, where the two
signal levels are LOW = VIL and HIGH = VIH, see Chapter 11. Figure 12 shows a complete data transfer in standard
mode. The time symbols are explained in Table 6.

handbook, full pagewidth

SDA

t

HIGH

t

f

t

SU;DAT

t

SU;STO

SCL

SDA

MBC764

t

BUF

t

HD;STA

t

LOW

t

r

t

SU;STA

t

HD;DAT

Fig.11 Standard mode timing.

1996 Nov 21 13

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

handbook, full pagewidth

Clock LOW minimum = 4.7 µs; clock HIGH minimum = 4 µs.
The dashed line is the acknowledgment of the receiver.
Mark-to-space ratio = 1 : 1 (LOW-to-HIGH).
Maximum number of bytes is unrestricted.
Premature termination of transfer is allowed by generation of STOP condition.
Acknowledge clock bit must be provided by master.

SDA

SCL

CONDITION

981 - 7981 - 7981 - 7

ACKADDRESS R/W

DATASTART

ACK

CONDITION

START

STOPACKADDRESS R/W

MBC765

Fig.12 Complete data transfer in standard mode.

Table 6 Explanation of time symbols used in Fig.11

SYMBOL PARAMETER REMARKS MIN. MAX. UNIT

f

t
t

SCL
SW
BUF

SCL clock frequency 0 100 kHz
tolerable pulse spike width − 100 ns
bus free time The time that the bus is free (SDA is HIGH)

4.7 −µs
before a new transmission is initiated by SDA
going LOW.

t

SU;STA

t

HD;STA

set-up time repeated START Only valid for repeated start code. 4.7 −µs
hold time ST ART condition The time between SDA going LOW and the first

4.0 −µs
valid negative-going transition of SCL.

t

LOW

t

HIGH

t

r

t

f

t

SU;DAT

t

HD;DAT

t

SU;STO

SCL LOW time The LOW period of the SCL clock. 4.7 −µs
SCL HIGH time The HIGH period of the SCL clock. 4.0 −µs
rise time SDA and SCL − 1.0 µs
fall time SDA and SCL − 0.3 µs
data set-up time 250 − ns
data hold time 0 − ns
set-up time STOP condition 4.0 −µs

8.5.2 L

OW-SPEED MODE

Masters generate a bus clock with a maximum frequency of 2 kHz; a minimum LOW period of 105 µs and a minimum
HIGH period of 365 µs. The mark-to-space ratio is 1 : 3 LOW-to-HIGH. Detailed timing is shown in Fig.13, where the two
signal levels are LOW = VIL and HIGH = VIH, see Chapter 11. Figure 14 shows a complete data transfer in low-speed
mode.The time symbols are explained in Table 7.

1996 Nov 21 14

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

handbook, full pagewidth

SDA

SCL

SDA

handbook, full pagewidth

SDA

t

BUF

t

HD;STA

t

LOW

t

r

t

SU;STA

t

HIGH

Fig.13 Low-speed mode timing.

t

f

t

SU;DAT

t

HD;DAT

t

SU;STO

MGG545

R/W

SCL

START

CONDITION

Clock LOW minimum = 130 µs ±25 µs; clock HIGH minimum 390 µs ±25 µs.
Mark-to-space ratio = 1 : 3 (LOW-to-HIGH).
Start byte 0000 0001.
Maximum number of bytes = 6.
Premature termination of transfer not allowed.
Acknowledge clock bit must be provided by master.

START BYTE DUMMY

ACKNOWLEDGE

Fig.14 Complete data transfer in low speed mode.

1996 Nov 21 15

REPEATED

START

CONDITION

ADDRESS

ACKNOWLEDGE STOP

CONDITION

MGG546

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

Table 7 Explanation of time symbols used in Fig.13

SYMBOL PARAMETER REMARKS MIN. MAX. UNIT

f

SCL

t

SW

t

BUF

t

SU;STA

t

HD;STA

t

LOW

t

HIGH

t

r

t

f

t

SU;DAT

t

HD;DAT

t

SU;STO

SCL clock frequency 0 2 kHz
tolerable pulse spike width − 100 ns
bus free time The time that the bus is free (SDA is

105 −µs
HIGH) before a new transmission is
initiated by SDA going LOW.

set-up time repeated START Only valid for repeated start code. 105 155 µs
hold time START condition The time between SDA going LOW and

365 415 µs
the first valid negative-going transition of
SCL.

SCL LOW time The LOW period of the SCL clock. 105 155 µs
SCL HIGH time The HIGH period of the SCL clock. 365 −µs
rise time SDA and SCL − 1.0 µs
fall time SDA and SCL − 0.3 µs
data set-up time 250 − ns
data hold time 0 − ns
set-up time STOP condition 105 155 µs

9 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take
normal precautions appropriate to handling MOS devices (see

devices”

).

“Handbook IC03, Section: General, Handling MOS

1996 Nov 21 16

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

10 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V
V
I
I
P
P
I
I
T
T

DD

I
I
O

tot

O
DD
SS

stg

amb

supply voltage −0.8 +8.0 V
all input voltages −0.8 VDD+ 0.8 V
DC input current −10 +10 mA
DC output current −10 +10 mA
total power dissipation − 300 mW
power dissipation per output − 50 mW
supply current through pin V
supply current through pin V

DD
SS

−50 +50 mA

−50 +50 mA

storage temperature −65 +150 °C
operating ambient temperature −25 +70 °C

11 CHARACTERISTICS

= 2.5 to 6.0 V; VSS=0V; T

V

DD

= −25 to +70 °C; all voltages with respect to VSS; f

amb

= 3.58 MHz (gmL);

xtal

maximum series resistance = 50 Ω; unless otherwise specified.

SYMBOL PARAMETER MIN. TYP MAX. UNIT

V
I

DD
DD

operating supply voltage 2.5 − 6.0 V
operating supply current (note 1)

no output tone − 50 100 µA
single output tone − 0.5 0.8 mA
dual output tone − 0.6 0.9 mA

I

stb

static standby current (note 2) −−3µA

Inputs/outputs (SDA)

TO D5; MODE; STROBE

D0
V

IL

V

IH

LOW level input voltage 0 − 0.3V
HIGH level input voltage 0.7V

DD

− V

DD

DD

V

V
D2 TO D5 MODE; STROBE; A0
I

IL

pull-down input current; VI=V

DD

−30 −150 −300 nA
SCL (D0); SDA (D1)
I

OL

f

SCL

C

i

t

i

LOW level output current (SDA); VOL= 0.4 V 3 −−mA
SCL clock frequency −−100 kHz
input capacitance; VI=V

SS

−−7pF

allowable input spike pulse width −−100 ns

1996 Nov 21 17

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

SYMBOL PARAMETER MIN. TYP MAX. UNIT

TONE output (see test circuit, Fig.15)

V

HG(RMS)

V

LG(RMS)

V

DC

G

v

THD Total Harmonic Distortion; T

 output impedance − 0.1 0.5 kΩ

Z

o

OSCI input

V

OSC(p-p)

Timing (V

t

OSC(ON)

t

TONE(ON)

t

SPW

t

DS

t

DH

Notes

1. Oscillator ON; VDD= 3 V; crystal connected between OSCI and OSCO; D0/SCL and D1/SDA connected via
resistance of 5.6 kΩ to VDD; all other pins left open.

2. As note 1, but with oscillator OFF.

3. Related to the level of the LOW group frequency component, according to CEPT recommendations.

4. Related to the level of the fundamental frequency.

5. Oscillator must be running.

6. Values are referenced to the 10% and 90% levels of the relevant pulse amplitudes, with a total voltage swing from
VSSto VDD.

DTMF output voltage (RMS), HIGH group 158 192 205 mV
DTMF output voltage (RMS), LOW group 125 150 160 mV
DC voltage level −

1

⁄2V

DD

− V

voltage gain (pre-emphasis) of group 1.85 2.10 2.35 dB

=25°C

amb

dual tone (note 3) −−25 − dB
modem tone (note 4) −−29 − dB

maximum allowable amplitude at OSCI −−V

=3V)

DD

− VSSV

DD

oscillator start-up time − 3 − ms
TONE start-up time (note 5) − 0.5 − ms
STROBE pulse width (note 6) 400 −−ns
data set-up time (note 6) 150 −−ns
data hold time (note 6) 100 −−ns

handbook, halfpage

V

DD

PCD3311C
PCD3312C

TONE

V

SS

Fig.15 TONE output test circuit.

1996 Nov 21 18

1 µF

50 pF

10 kΩ

MGG513

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

1.6

handbook, halfpage

I

stb

(µA)

1.2

0.8

0.4

0

0

2

4

T

amb

−25 ˚C

+25 ˚C
+70 ˚C

68

V

DD

Fig.16 Standby supply current as a function of

supply voltage; oscillator OFF.

MGG514

=

(V)

300

handbook, halfpage

I

DD

(µA)

200

100

0

0

24 86

MGG515

T

amb

−25 ˚C

+25 ˚C
+70 ˚C

VDD (V)

Fig.17 Operating supply current as a function of

supply voltage; oscillator ON, no output at
TONE.

=

1.5

handbook, halfpage

I

DD

(mA)

1

0.5

0

0

24 86

MGG516

T

amb

−25 ˚C
+25 ˚C

+70 ˚C

VDD (V)

=

Fig.18 Operating supply current as a function of

supply voltage; oscillator ON, dual tone at
TONE.

1996 Nov 21 19

I

(µA)

6

I

4

2

0

T

= −25 ˚C

amb

+70 ˚C

0



+25 ˚C

123

VI (V)

handbook, halfpage

Fig.19 Pull-down input current as a function of

input voltage; VDD=3V.

MGG517

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

−11

handbook, halfpage

V

TONE

(dBm)

−12

T

amb

−25 ˚C
+25 ˚C

=

HIGH GROUP

MGG518

+70 ˚C

−13

−14

−25 ˚C
+25 ˚C

LOW GROUP

+70 ˚C

−15

0246

VDD (V)

Fig.20 DTMF output voltage levels as a function of

operating supply voltage; RL=1MΩ.

handbook, full pagewidth

level

(dBm)

0

−20

−40

0.4

handbook, halfpage

V

TONE

MGG519

(dB)

T

=

0

amb

−25 ˚C
+25 ˚C

−0.4
+70 ˚C

−0.8

6

10

5

10

4

10

RL (Ω)

Fig.21 Dual tone output voltage level as a function

of output load resistance.

MGG520

CS203

3

10

−60

−80

−100

012345

handbook, full pagewidth

0

level

(dBm)

−20

−40

−60

−80

−100

01020304050

Fig.22 Typical frequency spectrum of a dual tone signal after flat-band amplification of 6 dB.

1996 Nov 21 20

frequency (kHz)

MGG521

CS203

frequency (kHz)

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

12 APPLICATION INFORMATION

handbook, halfpage

3A21
6B54
9C87

D0

V

MICROCONTROLLER

SS

GENERAL
PURPOSE

(4 or 8-BIT)

V

DD

mute

data bus

OSCI OSCO STROBE

D0

D5

MODE

PCD3311C

TONE

V

V

DD

SS

MBH669

Fig.23 PCD3311C driven by microcontroller with parallel data bus.

handbook, halfpage

3A21
6B54
9C87

D0

V

TELEPHONY

MICROCONTROLLER

V

SS

PCF84C21A

DD

mute

OSCI OSCO

3.58 MHz

2

I

C bus

4 pF

OSCI OSCO

SCL
SDA

PCD3312C

A

0

TONE

V

V

DD

SS

MGG544

Fig.24 PCD3312C driven by microcontroller PCF84C21A. The PCF84C21A is a single-chip 8-bit microcontroller

with 2 kbytes ROM and I2C-bus. The same application is possible with the PCD3311C with MODE = VSS.

1996 Nov 21 21

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

13 PACKAGE OUTLINES

DIP14: plastic dual in-line package; 14 leads (300 mil)

D

seating plane

L

Z

14

pin 1 index

e

b

SOT27-1

M

E

A

2

A

A

1

w M

b

1

8

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE

VERSION

SOT27-1

1 2

min.

max.

1.73

1.13

0.068

0.044

IEC JEDEC EIAJ

050G04 MO-001AA

b

b

1

0.53

0.38

0.021

0.015

0.36

0.23

0.014

0.009

REFERENCES

cD

(1) (1)

19.50

18.55

0.77

0.73

1996 Nov 21 22

7

L

Ee M

6.48

6.20

0.26

0.24

e

1

3.60

3.05

0.14

0.12

M

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

10.0

8.3

0.39

0.33

w

max.

0.2542.54 7.62

0.010.10 0.30

0.0870.17 0.020 0.13

ISSUE DATE

92-11-17
95-03-11

(1)

Z

2.24.2 0.51 3.2

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

pin 1 index

1

e

9

A

2

A

8

w M

b

p

SOT162-1

E

H

E

Q

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE

VERSION

SOT162-1

A

max.

2.65

0.10

A

0.30

0.10

0.012

0.004

A2A

1

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E03 MS-013AA

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.5

7.6

7.4

0.30

0.29

1.27

0.050

10.1

0.41

0.40

REFERENCES

1996 Nov 21 23

eHELLpQ

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

92-11-17

95-01-24

0

o
o

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

DIP8: plastic dual in-line package; 8 leads (300 mil)

D

seating plane

A

L

Z

e

b

8

pin 1 index

1

w M

b

1

b

2

5

SOT97-1

M

E

A

2

A

c

(e )

1

M

H

E

1

4

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

mm

inches

max.

12

min.

max.

b

1.73

1.14

0.068

0.045

b

1

0.53

0.38

0.021

0.015

b

1.07

0.89

0.042

0.035

cD E e M

2

0.36

0.23

0.014

0.009

9.8

9.2

0.39

0.36

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT97-1

IEC JEDEC EIAJ

050G01 MO-001AN

REFERENCES

1996 Nov 21 24

(1) (1)

6.48

6.20

0.26

0.24

L

3.60

3.05

0.14

0.12

M

8.25

7.80

0.32

0.31

E

10.0

0.39

0.33

e

1

EUROPEAN

PROJECTION

H

8.3

w

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.10 0.30

0.0450.17 0.020 0.13

ISSUE DATE

(1)

Z

92-11-17
95-02-04

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

SO8: plastic small outline package; 8 leads; body width 7.5 mm

D

c

y

Z

8

pin 1 index

1

e

5

A

2

A

1

4

w M

b

p

E

H

E

detail X

SOT176-1

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

A

max.

2.65

0.10

OUTLINE

VERSION

SOT176-1

A1A2A3b

0.3

2.45

0.1

0.012

0.004

0.25

2.25

0.096

0.01

0.089

IEC JEDEC EIAJ

p

0.49

0.36

0.019

0.014

0.32

0.23

0.013

0.009

(1)E(1)

cD

7.65

7.45

0.30

0.29

REFERENCES

7.6

7.4

0.30

0.29

1.27

0.050

1996 Nov 21 25

eHELLpQywv θ

1.45

0.057

1.1

0.45

0.043

0.018

1.1

1.0

0.043

0.039

0.25 0.1

0.25

0.01 0.004

0.01

EUROPEAN

PROJECTION

10.65

10.00

0.42

0.39

(1)

Z

2.0

1.8

0.079

0.071

ISSUE DATE

91-08-13
95-02-25

o

8

o

0

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

14 SOLDERING

14.1 Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

14.2 DIP

14.2.1 S

OLDERING BY DIPPING OR BY WA VE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

14.2.2 R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

14.3 SO

14.3.1 REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

14.3.2 W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

14.3.3 R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1996 Nov 21 26

Philips Semiconductors Product specification

DTMF/modem/musical-tone generators PCD3311C; PCD3312C

15 DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

16 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

17 PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

1996 Nov 21 27

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 417021/1200/02/pp28 Date of release: 1996 Nov 21 Document order number: 9397 750 01155