15.3.3Repairing soldered joints
16DEFINITIONS
17LIFE SUPPORT APPLICATIONS
1996 Nov 212
Page 3
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
1FEATURES
• Pulse, DTMF and ‘mixed mode’ dialling
• Mixed mode dialling: start with pulse dial, end with
DTMF dial (e.g. for control of DTMF user equipment via
a pulse network)
• 23-digit memory stores last number dialled, or number
noted during conversation (notepad)
• Redial of both PABX and external calls
• Supports 16 dial keys: 0 to 9, ∗, # A, B, C, and D
• Supports 4 function keys:
– Program (P) used to input notepad numbers
– Flash (FL) allows re-dialling without on-hook
– Redial (R) recalls and redialls stored number
– Change from pulse dial to DTMF dial in
mixed mode (>)
• DTMF timing:
– for manual dialling, maximum duration burst/pause
intervals are user-determined, but at least minimum
duration burst/pause intervals are ensured
– for redial, minimum duration burst/pause intervals are
used
• On-chip voltage reference for supply and temperature
independent tone output
• On-chip filtering for low output distortion
(CEPT compatible)
• Uses standard single-contact or double-contact
(common left open) keyboard
• Keyboard entries fully debounced
• Flash (register recall) output.
2GENERAL DESCRIPTION
The PCD3310 and PCD3310A are single-chip silicon gate
CMOS integrated circuits. They are dual-standard diallers
for pulse or dual tone multi-frequency (DTMF) dialling, with
on-chip oscillators suitable for use with 3.58 MHz crystals.
Input data is derived from any standard matrix keyboard
for dialling in either the pulse or DTMF mode.
Numbers up to 23 digits can be retained in RAM for
dialling/redialling.
3QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
DD
V
stb
I
DD(stb)
I
DD(conv)
I
DD(pulse)
I
DD(DTMF)
V
HG(RMS)
operating supply voltage2.5−6.0V
standby supply voltage1.8−6.0V
standby current (on hook)V
= 1.8 V−1.44µA
stb
operating current in conversation modeVDD=3V−−150µA
operating current in pulse dialling modeVDD=3V−−200µA
operating current in DTMF dialling modeVDD=3V−0.60.9mA
DTMF output voltage level for HIGH group
−192−mV
(RMS value)
V
LG(RMS)
DTMF output voltage level for LOW group
−150−mV
(RMS value)
G
v
voltage gain (pre-emphasis) of group−2.1−dB
THDtotal harmonic distortion−−25−dB
T
amb
operating ambient temperature−25−+70°C
1996 Nov 213
Page 4
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
4ORDERING INFORMATION
Table 1 Package information
TYPE
NUMBER
PCD3310PDIP20plastic dual in-line package; 20 leads (300 mil)SOT146-1
PCD3310APDIP20plastic dual in-line package; 20 leads (300 mil)SOT146-1
PCD3310TSO28plastic small outline package; 28 leads; body width 7.5 mmSOT136-1
PCD3310ATSO28plastic small outline package; 28 leads; body width 7.5 mmSOT136-1
2. Note that the PCD3310P; 10T and the PCD3310AP; 10AT differ only in the break/make ratio in pulse dialling.
The break/make times equate to mark-to-space ratios of 2 : 1 and 3 : 2 respectively.
NAMEDESCRIPTIONVERSION
PULSE DIAL; BREAK/MAKE TIME (see notes 1 and 2)
) = 840 ms.
id
PACKAGE
MARK-TO-SPACE
RATIO
1996 Nov 214
Page 5
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
5BLOCK DIAGRAM
DD
V
(21)
DP/FLO
16
PD
(2)
PD/DTMF
2
DTMF
19
(27)
DTMF LOW GROUP
COUNTER/CONTROLLER
DAC
+
(5)
LOW
4
VSSTONE
3
(3)
OSCILLATOR
COUNTER
TIME BASE
RESET DELAY
(28)
(1)
MGE490
20
OSCOOSCI
1
handbook, full pagewidth
CODE CONVERTER
PD AND FLASH LOGIC
TIMING CONTROLLER
PCD3310 FAMILY
OUTPUT
DAC
HIGH
DTMF HIGH GROUP
COUNTER/CONTROLLER
V
VOLTAGE
REFERENCE
POINTER
COUNTER
CONTROLLER
ADDRESS
DECODING
MAIN
REGISTER
ref
READ/
WRITE
OUTPUT
ON
RESET
POWER
INPUT
REGISTER
TEMPORARY
LOGIC
CONTROL
KEYPAD
INTERFACE/LOGIC
(26)
(24)
(20)
(8)
(19)
(17)
(16)
(15)
(14)
(13)
(12)
(10)
(9)
(22)
18
(23)
17
15
5
14
13
12
11
10
9
8
7
6
M2
CE
M1
M1
FLD
CF/DMODE/FS
COL 4
COL 3
COL 2
COL 1
ROW 1
ROW 2
ROW 3
ROW 4
ROW 5
Fig.1 Block diagram.
1996 Nov 215
The pin numbers given in parenthesis refer to the PCD3310T.
Page 6
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
6PINNING
PINS
SYMBOL
OSCI11Ioscillator input
PD/DTMF22Iselect pin; pulse or DTMF dialling input
TONE33Osingle or dual tone frequency output
n.c.−4−not connected
V
Pulse and DTMF diallers with redialPCD3310; PCD3310A
handbook, halfpage
PD/DTMF
Fig.2 Pin configuration (DIP20 package).
OSCI
TONE
V
SS
FLD
ROW 5
ROW 4
ROW 3
ROW 2
ROW 1
1
2
3
4
5
PCD3310P
PCD3310AP
6
7
8
9
10
MGE489
OSCO
20
19
V
DD
18
CE
17
M1
16
DP/FLO
CF/DMODE/FS
15
COL 4
14
COL 3
13
COL 2
12
COL 1
11
handbook, halfpage
PD/DTMF
Fig.3 Pin configuration (SO28 package).
OSCI
TONE
n.c.
V
SS
n.c.
n.c.
FLD
ROW 5
ROW 4
n.c.
ROW 3
ROW 2
ROW 1
1
2
3
4
5
6
7
PCD3310T
PCD3310AT
8
9
10
11
12
13
MGE488
OSCO
28
V
27
DD
CE
26
n.c.
25
M1
24
23
M1
M2
22
21
DP/FLO
CF/DMODE/FS
20
COL 4
19
n.c.
18
COL 3
17
COL 2
16
1514
COL 1
7FUNCTIONAL DESCRIPTION
References to ‘the device’ apply to both the PCD3310 and
the PCD3310A.
7.1Power supply (V
The positive supply of the device (V
and VSS)
DD
) must meet the
DD
voltage requirements as indicated in Chapter 11.
To avoid undefined states of the device at power-on, an
internal reset circuit clears the control logic and counters.
If VDD drops below the minimum standby supply voltage of
1.8 V the power-on reset circuit inhibits redialling after
hook-off. The power-on reset signal has the highest
priority; it blocks and resets the device without delay
regardless of the state of chip enable input (CE).
7.2Clock oscillator (OSCI and OSCO)
The timebase for the device for both pulse and DTMF
dialling is a crystal controlled on-chip oscillator which is
completed by connecting a 3.58 MHz crystal or ceramic
resonator between the OSCI and OSCO pins.
Recommended resonator type:
• 3.58 MHz PXE - Murata; CSA 3.58MG310VA.
7.3Chip enable (CE)
The CE input enables the device and is used to initialize
the device. When CE is LOW it provides the static standby
condition. In this state the clock oscillator is disabled, all
registers and logic are reset with the exception of the redial
registers, Read Address Counter (RAC), Write Address
Counter (WAC) and Temporary Write Address Counter
(TWAC). The RAC points to the first digit of the last
number dialled, the WAC and TWAC point to the last
entered digits in the main and temporary registers
(see Fig.6). The keyboard input is inhibited, but data
previously entered is saved in the redial registers provided
is higher than V
V
DD
. The current drawn is I
stb
(standby
stb
current) and serves to retain data in the redial registers
during hook-on.
When CE is HIGH it activates the clock oscillator and the
device changes from static standby condition to the
conversation mode. The current consumption is I
DD(conv)
until the first digit is entered from the keyboard. Then a
dialling or redialling operation starts. The operating current
is I
DD(pulse)
if in the pulse dialling mode, or I
DD(DTMF)
if the
DTMF dialling mode is selected.
1996 Nov 217
Page 8
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
If the CE input is taken to a LOW level for longer than time
period trd (see Figs 11 and 12 and Chapter 12) an internal
reset pulse will be generated at the end of the trd period.
The system changes to the static standby state. Short CE
pulses of < trd will not affect the operation of the device and
reset pulses are not produced.
7.4Mode selection (
7.4.1P
ULSE MODE
PD/DTMF)
If PD/DTMF = VSS the pulse mode is selected. Entries of
non-numeric keys are neglected, they are neither stored in
the redial register nor transmitted.
7.4.2DTMF
MODE
If PD/DTMF = VDD the dual tone multi-frequency dialling
mode is selected. Each non-function key activated
corresponds to a combination of two tones, one of four
LOW and one of four HIGH frequencies, corresponding to
the key’s row and column in the keyboard matrix.
See Fig.4 and Table 3. The frequencies are transmitted
with a constant amplitude, regardless of power supply
variations. Harmonic content is filtered out thus meeting
the CEPT recommendations.
entries are debounced on both the leading and trailing
edges for approximately time period t
as shown in
e
Figs 11, 12, 13 and 14. Each entry is tested for validity.
When a key is depressed, keyboard scanning starts and
only returns to the sense mode after release of that key.
handbook, halfpage
54321 1234
MGE491
ROWS
COLUMNS
123
45
7
∗
PFLR
6
9
8
#
0
KEYBOARD
A
B
C
D
>
The transmission time is calibrated for redial. In manual
operation the duration of bursts and pauses is the actual
key depression time, but not less than the minimum
transmission time (tt) or minimum pause time (tp).
7.4.3M
IXED MODE
When the PD/DTMF pin is open-circuit the mixed mode is
selected. After activation of CE or FL (Flash) the device
starts as a pulse dialler and remains in this state until a
non-numeric dial key (A, B, C, D,∗, #) or the function key >
is activated. Pressing a non-numeric dial key causes the
corresponding DTMF tones to be output, and any
subsequent dialling to be in DTMF mode. Pressing >
causes no output tones, but any subsequent dialling is in
DTMF mode. The > key should be used if the first DTMF
output required is numeric. The device remains in DTMF
dial mode until FL is activated or after a static standby
condition when CE is re-activated.
A connection between the PD/DTMF pin and VDD also
initiates DTMF dialling. Chip enable, FL or a connection of
PD/DTMF pin to VSS sets the device back to pulse dialling.
7.5Keyboard inputs/outputs
Fig.4 Keyboard organization.
ROW 5 of the keyboard contains the following function
keys:
• P = memory clear and programming (notepad)
• FL = flash or register recall
• R = redial
• > = change of dial mode from pulse to DTMF in mixed
dialling mode.
In the pulse dialling mode the valid keys are the
10 numeric dial keys (0 to 9). The non-numeric dial keys
(A, B, C, D, ∗, #) have no effect on the dialling or the redial
storage. Valid function keys are P, R and FL.
In the DTMF mode all dial keys are valid. They are
transmitted as a dual tone combination and at the same
time stored in the redial register. Valid function keys are P,
FL and R.
In the mixed mode all key entries are valid and executed
accordingly.
The sense column inputs COL 1 to COL 4 and the
scanning row outputs ROW 1 to ROW 5 of the device are
connected to the keyboard as shown in Fig.4. All keyboard
1996 Nov 218
Page 9
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
7.6Flash duration control (FLD)
Flash (or register recall) is activated by the FL key and can
be used in DTMF and pulse dialling modes.
The FL key has the same effect as placing the telephone
‘on-hook’ for a calibrated time. Pressing the FL key will
produce a timed line-break of 100 ms (min.) at the DP/FLO
output. During the conversation mode pressing FL also
acts as a chip enable. The flash pulse duration (tFL) is
calibrated and can be prolonged with an external resistor
and capacitor connected to the FLD input/output (see
Fig.5). The flash pulse resets the Read Address Counter
(RAC) to the address of the first entered digit of the last
number dialled. Subsequent redial is possible (see Fig.9).
The counter of the reset delay time is held for a period of
.
t
FL
7.7TONE output (DTMF mode)
The single and dual tones which are provided at the TONE
output are filtered by an on-chip switched capacitor filter,
followed by an on-chip active RC low-pass filter. Hence,
the total harmonic distortion of the DTMF tones meets the
CEPT recommendations. The tone output has the
following states:
• tone OFF; 3-state
• tone ON; the associated frequencies are superimposed
1
on a DC level of
⁄2VDD.
When the DTMF mode is selected output tones are timed
in manual dialling with a minimum duration of bursts and
pauses, and in redial with a calibrated timing. Single tones
may be generated for test purposes (CE = HIGH). Each
row and column has one corresponding frequency.
High group frequencies are generated by connecting the
column to V
and LOW group frequencies are generated
SS
by forcing the row to VDD. The single tone frequency will be
transmitted during activation time, but it is neither
calibrated nor stored.
An on-chip reference voltage provides output tone levels
independent of the supply voltage. Table 3 shows the
frequency tolerance of the output tones for DTMF
signalling.
dbook, full pagewidth
(a) Flash duration control circuit.
(b) Flash pulse timing. t
FLRC
≈ R × C.
60
nA
FLD
(a)
R
FLO
C
Fig.5 Flash pulse duration setting.
1996 Nov 219
(b)
t
FLRC
MGE492
t
FL
Page 10
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
Table 3 Frequency tolerance of the output tones for DTMF signalling; f
COL 112091206.45−0.21−2.55
COL 213361341.66+0.42+5.66
COL 314771482.21+0.35+5.21
COL 416331638.24+0.32+5.25
7.8Dial pulse and Flash output (DP/FLO)
This is a combined output which provides control signals
for timing in pulse dialling or for a calibrated line break
(flash or register recall) in both dialling modes.
7.9Mute output (M1)
The MUTE output can be used to disable the microphone
during dialling.
During pulse dialling the mute output becomes active
HIGH for the period of the inter-digit pause, break time and
make time. It remains at this level until the last digit is
pulsed out.
During DTMF dialling the mute output becomes active
HIGH for the period of tone transmission and remains at
this level until the end of hold-over time. It is also active
HIGH during flash and flash hold-over time.
7.10Mute output (
M1)
Inverted output of M1. In the PCD3310P it is only available
as a bonding option of M1.
7.11Muting output (M2)
Active HIGH output during actual dialling; i.e. during break
or make time in pulse dialling, or during tone ON/OFF in
DTMF dialling. It is an open drain p-channel output.
valid digit, the Temporary Write Address Counter (TWAC)
will be set to the first address of the temporary register,
and the decoded digit will be stored in the temporary
register at that address. The TWAC is then incremented to
the next address. The first 5 valid digits will be decoded
and stored in the temporary register in this way, and have
no effect on the main register and its associated Write
Address Counter (WAC). After the sixth valid digit is
entered, the TWAC indicates an overflow condition.
The data from the temporary register will be copied into the
5 least significant places of the main register and the
TWAC into the WAC. The sixth digit, and all subsequent
digits will be stored in the main register (a total of not more
than 23). If more than 23 digits are entered redial will be
inhibited. If not more than 5 digits are entered only the
temporary register and the associated TWAC are affected.
All entries are debounced on both the leading and trailing
edges for at least time period t
13 and 14.
Each entry is tested for validity before being stored in the
redial registers.
• For DTMF dialling all dial keys are valid
• For pulse dialling only numeric dial keys are valid.
Simultaneous to their acceptance and corresponding to
the selected mode (pulse, DTMF or mixed), the entries are
transmitted as pulse-trains or as DTMF frequencies in
accordance with PTT requirements. Non-numeric dial key
8DIALLING PROCEDURES (see Figs 7, 8 and 9)
entries are neglected during pulse dialling; they are neither
stored nor transmitted.
8.1Dialling
= 3.579545 MHz
xtal
FREQUENCY DEVIATION
%Hz
as shown in Figs 11, 12,
e
After CE has risen to V
the oscillator starts running and
DD
the Read Address Counter (RAC) is set to the first address
of both the main and temporary redial registers, ready to
redial any stored number (see Fig.6). By dialling the first
1996 Nov 2110
Page 11
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
8.2Redialling
After CE has risen to VDD the oscillator starts running.
The address of the first digit in the redial register is stored
in the RAC, and the device is in the conversation mode.
If ‘R’ is the first keyboard entry the device starts redialling
the contents of the temporary register. If the overflow flag
of the TWAC was set in the previous dialling, the redialling
continues in the main register.
Because access to an external line from a PABX usually
involves dialling an access code and waiting for an access
tone, a ‘one-press’ redial may fail due to insufficient delay
between the access code and the external number.
For this reason, the access code should be redialled. If the
access code (up to 4 digits) matches the first part of the
stored number, then pressing R after the access tone is
obtained will cause the rest of the number to be redialled
(see Fig.7, PABX).
Timing in the DTMF mode is calibrated for both tone bursts
and pauses.
In mixed mode only the first part entered (the pulse dialled
part of the stored number) can be redialled.
During redial keyboard entries (function or non-function)
are not accepted until the device returns to the
conversation mode after completion of redialling. No redial
activity takes place if one of the following events occur:
• Power-on reset
• Memory clear (‘P’ without subsequent data entry)
• Memory overflow (more than 23 valid data entries).
8.3Notepad
The redial register can also be used as a notepad. In the
conversation mode a number with up to 23 digits can be
entered and stored for redialling. By activating the program
key (P) the WAC and TWAC pointers are reset. This acts
like a memory clear (redial is inhibited). Afterwards, by
entering and storing any digits, redialling will be possible
after flash or hook-on and hook-off (see Fig.9).
During notepad programming the numbers entered will not
be transmitted nor is the mute active, only the confidence
tone is generated.
handbook, full pagewidth
write address counter (WAC)
read address counter (RAC)
addressed
through pointers
WAC or RAC
23
6
5
4
3
2
1
MAIN REGISTER
ADDRESS COUNTER
addressed
through pointers
TWAC or RAC
Fig.6 Program memory map.
5
4
3
2
1
TEMPORARY REGISTER
TEMPORARY WRITE
ADDRESS COUNTER (TWAC)
MGE493
1996 Nov 2111
Page 12
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
handbook, full pagewidth
PUBLIC EXCHANGE
PABX
DIAL external number
DIAL
OFF-HOOK
key-in
≤23 digits
462 75 30
ON-HOOK
OFF-HOOKOFF-HOOKOFF-HOOK
key-in
ACCESS DIGIT(S)
0
≤4 digits
REDIAL
OFF-HOOK
key-in R
462 75 30
ON-HOOK
REDIAL external number (1)
key-in
same previous
ACCESS DIGIT(S)
0
conversation
mode
standby
mode
pulse or
tone out
if internal number ≤5 digits
DIAL internal number
key-in
internal number
≤5 digits
12345
wait for
access tone
key-in
external number
462 75 30
ON-HOOK
(1) If [access digit(s) + external number] ≤23 digits.
wait for
access tone
key-in R
external number
462 75 30
ON-HOOK
Fig.7 Pulse or DTMF dialling mode.
1996 Nov 2112
ON-HOOK
REDIAL internal number
OFF-HOOK
key-in R
internal number
12345
ON-HOOK
MGE494
Page 13
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
handbook, full pagewidth
pulse dialling
DTMF dialling
DIAL
OFF-HOOK
key-in
462 75 30
(or any voice indication)
* 1 2 3 4 5 6 7
8 9 A B C D
ON-HOOK
REDIAL
OFF-HOOK
#
set in pulse dialling
pulse output
wait for signal
automatic switch to DTMF or manual by
TONE-output
>
pulse dialling
key-in R
462 75 30
if total
(PD + DTMF)
≤23 digits
ON-HOOK
MGE495
Fig.8 Pulse/DTMF and mixed mode dialling.
1996 Nov 2113
pulse output
Page 14
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
handbook, full pagewidth
NOTEPAD PROGRAM
NOTEPAD REDIAL
OFF-HOOK
key-in
462 75 30
ON-HOOK
MEMORY CLEAR
OFF-HOOK
key-in P
key-in
355 44 99
≤23 digits
no dialling - no muting
OFF-HOOK
OFF-HOOK
key-in R
355 44 99
ON-HOOK
FLASH
OFF-HOOK
key-in
462 75 30
key-in P
ON-HOOK
key-in R
Fig.9 Notepad, memory clear, flash; independent of dialling mode.
1996 Nov 2114
no
redialling
key-in
ACCESS DIGIT(S)
wait for
access tone
key-in
external number
462 75 30
key-in FL
wait for
access tone
key-in
internal number
12345
0
REDIAL
(see PABX
procedure)
MGE496
Page 15
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
9HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take
normal precautions appropriate to handling MOS devices (see
devices”
).
10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERMIN.MAX.UNIT
V
DD
I
DD
I
I
I
O
V
I
P
tot
P
o
T
stg
T
amb
supply voltage−0.8+8.0V
supply current−50mA
DC input current−10+10mA
DC output current−10+10mA
all input voltages−0.8VDD+ 0.8V
total power dissipation−300mW
power dissipation per output−50mW
storage temperature range−65+150°C
operating ambient temperature−25+70°C
“Data Handbook ICO3, Section: General, Handling MOS
11 CHARACTERISTICS
V
=3V; VSS=0V; f
DD
= 3.579545 MHz; T
osc
= −25 to +70 °C; unless otherwise specified.
amb
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supply
V
DD
V
stb
I
DD(conv)
operating supply voltage2.5−6.0V
standby supply voltage1.8−6.0V
operating supply current in conversation
oscillator ON−−150µA
mode
I
DD(pulse)
operating supply current in pulse dialling
−−200µA
or flash mode
I
DD(DTMF)
I
DD(stb)
operating supply current in DTMF
dialling mode
standby supply currentVDD= 1.8 V
tone ON−0.60.9mA
one OFF−−200µA
−1.44.0µA
oscillator OFF; note 1
Inputs
V
IL
V
IH
I
LI
LOW level input voltage0−0.3V
HIGH level input voltage0.7V
DD
−V
DD
DD
V
V
input leakage current pin CE−1−+1µA
Keyboard inputs
R
KON
R
KOFF
keyboard ON resistance−−2kΩ
keyboard OFF resistance1−−MΩ
1996 Nov 2115
Page 16
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Outputs
I
OL
LOW level output sink current pins M1,
M1, DP/FLO, CF and FLD
LOW level output sink current pin
PD/DTMF
I
OH
HIGH level output source current pins
M1, M1, DP/FLO, CF and M2
HIGH level output source current pin
PD/DTMF
HIGH level output source current pin
FLD
Tone output (see Fig.10)
V
HG(RMS)
DTMF output voltage levels for HIGH
group (RMS value)
V
LG(RMS)
DTMF output voltage levels for LOW
group (RMS value)
∆ffrequency deviation−0.6−+0.6%
V
DC
output impedance−0.10.5kΩ
Z
O
G
v
DC voltage level−0.5V
voltage gain (pre-emphasis) of group1.852.12.35dB
THDtotal harmonic distortionT
Notes
1. Crystal connected between OSCI and OSCO; CE at VSS and all other pins open-circuit.
2. <10 mA dynamic current to set/reset PD/DTMF pin (mixed mode).
3. Flash inactive; output voltage = VSS.
4. Related to the level of the LOW group frequency component, according to CEPT recommendations.
VOL=VSS+ 0.5 V0.7−−mA
VOL=VSS+ 0.5 V;
−−1mA
note 2
VOH=VDD− 0.5 V−0.6−−mA
V
OH=VDD
− 0.5 V;
−−−1mA
note 2
V
OH=VDD
− 0.5 V;
−−60−nA
note 3
VDD= 2.5 to 6 V158192205mV
VDD= 2.5 to 6 V125150160mV
−V
DD
=25°C; note 4−−25−dB
amb
handbook, halfpage
V
DD
PCD3310X
TONE
V
SS
Fig.10 Tone output test circuit.
1996 Nov 2116
1 µF
50 pF10 kΩ
MGE501
Page 17
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
12 TIMING CHARACTERISTICS
When any key is activated a square wave (330 Hz) is generated and appears at the CF output to serve as an acoustic
feed-back for the user.
SYMBOLPARAMETERMIN.TYP.MAX.UNIT
DTMF dialling
, t
t
t
p
, t
t
t
p
Pulse dialling (PCD3310)
f
dp
t
id
t
b
t
m
Pulse dialling (PCD3310A)
f
dp
t
id
t
b
t
m
General
t
FL
t
flh
t
h
t
on
t
e
t
rd
transmission and pause times (manual dialling)68−−ms
transmission and pause times (redialling)687072ms
dialling pulse frequency9.81010.4Hz
inter-digit pause828840844ms
break time666768ms
make time323334ms
dialling pulse frequency9.81010.4Hz
inter-digit pause828840844ms
break time596061ms
make time394041ms
flash pulse duration98100102ms
flash hold-over time313334ms
hold-over time (muting on M1)788081ms
clock start-up time−4−ms
debounce time−12−ms
reset delay time−160−ms
1996 Nov 2117
Page 18
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
handbook, full pagewidth
CE
KEYBOARD
ENTRY
M1
M2
DP/FLO
DTMF
The dashed line signifies floating.
t
rd
t
e
34
t
id
CONVERSATION
MODE
(await dialling tone)
(no effect)
>t
>t
e
e
T
2
1
t
b
n × t
m
dp
DIALLING MODE
t
t
m
3
t
id
T
n × t
4
t
m
dp
23
1
t
b
CONVERSATION
Fig.11 Timing diagram for pulse dialling (PD/DTMF = VSS).
t
m
MODE
t
rd
STATIC
STANDBY
MODE
MGE497
handbook, full pagewidth
CE
KEYBOARD
ENTRY
M1
M2
DTMF
DP/FLO
The dashed line signifies floating.
t
rd
<t
<t
t
p
12
t
e
ttt
>t
p
(no effect)
t
3F
t
e
t
h
>t
t
t
t
e
e
t
e
t
h
Fig.12 Timing diagram for DTMF dialling (PD/DTMF = VDD).
t
flh
t
fl
MGE498
1996 Nov 2118
Page 19
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
handbook, full pagewidth
The dashed line signifies floating.
CE
KEYBOARD
ENTRY
M1
DIAL TONE
DTMF
00
t
e
t
h
t
t
e
e
R
t
e
telephone number
MGE500
Fig.13 Timing diagram showing REDIAL where PABX access digits are the first keyboard entries in DTMF dialling
mode.
handbook, full pagewidth
KEYBOARD
ENTRY
2
t
e
∗
t
e
t
e
2
t
e
t
e
DP/FLO
t
id
DTMF
M1
M2
PD/DTMF
The dashed line signifies floating.
Fig.14 .Timing diagram for mixed mode (PD/DTMF open-circuit).
1996 Nov 2119
t
h
DTMF diallingpulse dialling
MGE502
Page 20
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
13 APPLICATION INFORMATION
(3)
ok, full pagewidth
≤450
l
Z
C
9
8
kΩ
470
R3
D
#
0
∗
ROW 4
7
kΩ
R8
1%
kΩ
3.92
>
R
FL
P
ROW 5
6
BF423
1%
R6
110
R9
20 Ω
390 Ω
PCD3310P
BC547
J2
kΩ
1%
470
R11
DP/
kΩ
(1)
130 Ω
FLO
16
C12
R12
220
820
MGE503
2
select pin
M1
17
470 kΩ
BST76
PD/DTMF
470 kΩ10 MΩ
BC547BZX79/C10
3.9 Ω
.
SS
4
SS
V
Fig.15 Application diagram of the full electronic basic telephone set.
nF
bal
Z
Ω
A
B
123
45678
ROW 1
ROW 2
2.2 nF
R7
10
68
1%
9
BC557
100
2.2
µF
100
µF
4.7
100 pF
kΩ
1%
R2
130
ROW 3
470
CC
to V
nF
C5
nF
(10 V)
(10 V)
kΩ
COL 4
COL 3
COL 2
COL 1
12
13
3
TONE
10 kΩ
100 nF
DTMF
13
TEA1060/61
11
150 nF
12
141110
CC
15
AGCV
1716
SLPE
3218
14
19 20 1
18
DD
V
CE
redial
capacitor
R14
R5
10 V
to V
R13
C14
SS
10 µF
10 V
(4)
≥450
l
Z
2.2 µF
S1
C13
R4
1%
CC
to V
10 nF
10 nF
2.2 µF
C7
1 nF
kΩ
C4
100
R1
620
10
nF
BAS11
BAV10
(2)
kΩ
3.6
9
1%
8
67
10 pF
5
4
Ω
1%
1
BZX79/C12
4 ×
BAS11
1996 Nov 2120
a/b
line
−U
b/a
(2) The value of resistor R14 is determined by the required level at LN and the DTMF gain of the TEA1060 and TEA1061.
(3) Symmetrical low-impedance inputs for dynamic and magnetic microphones (TEA1060).
(1) Automatic line compensation obtained by connecting R6 to V
(4) Asymmetrical high-impedance inputs for electret microphones (TEA1061).
Page 21
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT146-1
12
min.
max.
1.73
1.30
0.068
0.051
IEC JEDEC EIAJ
SC603
b
b
1
0.53
0.38
0.021
0.015
REFERENCES
0.36
0.23
0.014
0.009
cD E eM
(1)(1)
26.92
26.54
1.060
1.045
1996 Nov 2121
6.40
6.22
0.25
0.24
10
(1)
M
e
L
1
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
H
E
10.0
0.2542.547.62
8.3
0.39
0.010.100.30
0.33
ISSUE DATE
92-11-17
95-05-24
Z
w
max.
2.04.20.513.2
0.0780.170.0200.13
Page 22
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
SO28: plastic small outline package; 28 leads; body width 7.5 mm
D
c
y
Z
28
pin 1 index
1
e
15
14
w M
b
p
SOT136-1
E
H
E
Q
A
2
A
1
L
p
L
detail X
(A )
A
X
v M
A
A
3
θ
0510 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT136-1
A
max.
2.65
0.10
A
0.30
0.10
0.012
0.004
A2A
1
2.45
2.25
0.096
0.089
IEC JEDEC EIAJ
075E06 MS-013AE
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1)(1)
cD
18.1
7.6
7.4
0.30
0.29
1.27
0.050
17.7
0.71
0.69
REFERENCES
1996 Nov 2122
eHELLpQ
10.65
10.00
0.42
0.39
1.4
0.055
1.1
0.4
0.043
0.016
1.1
1.0
0.043
0.039
PROJECTION
0.25
0.250.1
0.01
0.01
EUROPEAN
ywvθ
Z
0.9
0.4
0.035
0.004
0.016
ISSUE DATE
91-08-13
95-01-24
o
8
o
0
Page 23
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
15 SOLDERING
15.1Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
15.2DIP
15.2.1S
OLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
15.2.2R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
15.3SO
15.3.1REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
15.3.2W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
15.3.3R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Nov 2123
Page 24
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
16 DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1996 Nov 2124
Page 25
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
NOTES
1996 Nov 2125
Page 26
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
NOTES
1996 Nov 2126
Page 27
Philips SemiconductorsProduct specification
Pulse and DTMF diallers with redialPCD3310; PCD3310A
NOTES
1996 Nov 2127
Page 28
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands417021/1200/03/pp28 Date of release: 1996 Nov 21Document order number: 9397750 01075
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