Datasheet PCB8517 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

PCB8517

Stand-alone OSD for monitor
applications

Objective specification
File under Integrated Circuits, IC02

1997 Mar 03

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

FEATURES
Interface with microcontroller

• 3-wire high speed (maximum 2.5 Mbits/s) serial
interface with three types of transmission sequence.

On-Screen Display (OSD)

• On-chip PLL oscillator to generate the OSD dot clock
frequency which is 384 × horizontal sync frequency

• Horizontal sync frequency range of 10 to 100 kHz

• 10 rows of 24 characters display buffer

• 128 character fonts

• 12 × 16 character matrix

• Programmable height of displayed character (from

16 to 63 scan-lines); frame basis

• 4 types of character size; single/double character
height/width; row basis

• Horizontal starting position: 32 different positions
(6 dots for each step)

• Vertical starting position: 64 different positions
(4 scan-lines for each step)

• 8 foreground character colours: selection of only 2 out of
the 8 (outside the window) and 4 out of the of 8 (in the
window) in the same row

• 3 character shadowing modes:
– No shadow
– Shadowing
– Bordering shadow

• 3 fully programmable background windows with
overlapping capability and presetting priorities (for
multi-level application). The window colour can be
selected from 1 out of 8

• Half tone in background window supported

• Single 5 V power supply

• Available in DIP16 package.

GENERAL DESCRIPTION

The PCB8517 is a stand-alone OSD which is used to
display the adjustment/status information on the screen of
an auto-sync monitor for menu driving application.

The display operation of the device is controlled by a
microcontroller which programs the internal 273 bytes of
RAM via a 3-wire high-speed serial interface. The on-chip
PLL oscillator and programmable character height are
used to keep the same character size displayed on the
screen in different display modes, VGA, SVGA and XGA
for example.

The OSD of the PCB8517 provides display buffers of
10 rows with 24 characters each. These display buffers
can select from 128 customized character fonts (with
12 × 16 bit resolution) to be displayed. The characters
displayed on the screen can be specified double height,
double width, different colour and with/without shadowing.
Three positional background windows are provided for
multi-level application.

ORDERING INFORMATION

TYPE

NUMBER

PCB8517P DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4

1997 Mar 03 2

NAME DESCRIPTION VERSION

PACKAGE

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

BLOCK DIAGRAM

handbook, full pagewidth

VCO
BIAS

HFLB

VFLB

EN

SDI

SCK

V

DDA

4

2
3

5

10

6

7

8

+

OSCILLATOR

−

DISPLAY CONTROL

DISPLAY BUFFER

24 × 10 RAM

HIGH SPEED SERIAL

I/O INTERFACE

PLL

V

SSA

1

CHARACTER FONTS

3

VCLK

4

12-STAGE SHIFT REGISTER

128 FONT ROM

CONTROL

REGISTERS

V

DDD

916

WINDOW AND

FRAME CONTROL

COLOUR

ENCODER

V

SSD

OSDEN

15

RED

14

GREEN

13

BLUE

12

FB

11

HTONE

MGD762

Fig.1 Block diagram.

1997 Mar 03 3

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

PINNING

SYMBOL PIN DESCRIPTION

V

SSA

VCO 2 DC control voltage input/output to regulate the internal PLL oscillator frequency; a low-pass filter

BIAS 3 bias input/output to regulate the bias current of internal current control oscillator to resonate at a

V

DDA

HFLB 5 horizontal sync input signal from flyback circuit with negative polarity
EN 6 active LOW input to enable serial interface
SDI 7 data input of serial interface
SCK 8 clock input of serial interface
V

DDD

VFLB 10 vertical sync input signal from flyback circuit with negative polarity
HTONE 11 half tone control which outputs a logic 1 during windowing except characters are displayed; it is

FB 12 fast blanking output of OSD; active HIGH and high impedance when OSD is disabled
BLUE 13 blue colour output of OSD; active HIGH and high impedance when OSD is disabled
GREEN 14 green colour output of OSD; active HIGH and high impedance when OSD is disabled
RED 15 red colour output of OSD; active HIGH and high impedance when OSD is disabled
V

SSD

1 analog ground

circuit is connected to this pin

specific dot frequency

4 analog power supply

9 digital power supply

used to lower the external RED, GREEN and BLUE amplifier gain to achieve a transparent
windowing effect

16 digital ground

handbook, halfpage

V

SSA

VCO
BIAS

V

DDA

HFLB

SDI

SCK

EN

1
2
3
4
5
6
7
8

PCB8517

MGD760

16
15
14
13
12
11
10

9

V

SSD

RED
GREEN
BLUE
FB
HTONE
VFLB
V

DDD

Fig.2 Pin configuration.

1997 Mar 03 4

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

FUNCTIONAL DESCRIPTION
3-wire high speed serial interface (HSSI)

The 3-wire (

EN, SDI and SCK) high speed serial interface
of the PCB8517 is write only and is used to write data from
the microcontroller to the internal 273 bytes of RAM (see
Section “Internal RAM organization (see Fig.4)”) to control
the OSD. The RAM is organized into 11 rows of
32 columns (see Fig.4) and can be programmed by three
types of sequence (see Section “Data sequence and
format”).

ATA PROTOCOL

D
Figure 3 shows the protocol of HSSI. To initiate HSSI

transmission, pin EN must be LOW to enable the
PCB8517 to accept data. The EN input must be pulled
LOW prior to the occurrence of SCK and remain LOW until
after the last SCK clock pulse. The rising edge of SCK
facilitates the input data of SDI being shifted into an 8-bit
shift register. When the shift register is full this data will be
loaded into a row address register, column address
register or into one of the internal RAM bytes.

Table 1 shows the switching characteristics when the
HFLB pin has a pulse presented, but when there is no
horizontal sync pulse present on the HFLB pin, the
transmission bit rate will be slowed down to 500 kbit/s.

Table 1 Switching characteristics (under operating

conditions)

SYMBOL PARAMETER MIN. MAX. UNIT

t

su(EN)

t

h(EN)

t

SCKL

t

SCKH

t

su(SDI)

t

h(SDI)

EN to SCK set-up time 200 − ns
EN to SCK hold time 100 − ns
SCK LOW time 200 − ns
SCK HIGH time 200 − ns
SDI data set-up time 200 − ns
SDI data hold time 100 − ns

handbook, full pagewidth

EN

SCK

SDI

t

su(EN)

B7

MSB

t

SCKH

first byte

t

SCKL

t

su(SDI)

t

h(SDI)

B0 B7B7 B0 B7 B0

LSB

last byte

Fig.3 3-wire serial interface protocol.

t

h(EN)

MGD764

1997 Mar 03 5

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

DATA SEQUENCE AND FORMAT
The PCB8517 provides the following 3 types of

transmission sequence:

• Sequence A: R ⇒ CA ⇒ D ⇒ R ⇒ CA ⇒ D etc.

• Sequence B: R ⇒ CA ⇒ D ⇒ CA ⇒ D ⇒ CA ⇒ D etc.

• Sequence C: R ⇒ CB ⇒ D ⇒ D ⇒ D ⇒ D etc.

Where: R = row address,
CA = column address A, CB = column address B,
D = data of RAM.

The column address will be increased by 1 automatically
after each bit of data has been stored into the RAM.
In sequence C, if the column address of the last data is
1FH, the row address will also be increased by 1.
The sequence A is particularly suitable for updating small
amounts of data between different rows. However, if the
current information byte has the same row address as the
previous one, sequence B is recommended. For a greater
information update, such as a power-up situation,
sequence C should be used.

Table 2 Data format

ADDRESS

B7 B6 B5 B4 B3 B2 B1 B0

Row address 1 X X X R3 R2 R1 R0
Column address A 0 0 X C4 C3 C2 C1 C0
Column address B 0 1 X C4 C3 C2 C1 C0

Bit B7 in Table 2 is used to distinguish between row or
column address and bit B6 is used to distinguish between
column address A or B. When A or B sequence is
transmitted, the column address should be formatted as
column address A, and the data format of column
address B is used for sequence C. There are some
limitations on using mixed formats during a single
transmission, for example when pin
LOW once.

Allowed:

• From A to B or C

• From B to A.

Not allowed:

• From C to A or B.

DATA BYTE

(1)

EN has been pulled to

Note

1. X = don’t care.

Internal RAM organization (see Fig.4)
The internal RAM is addressed with rows 0 to 10 and columns 0 to 31. The OSD character display buffers are located in

columns 0 to 23 of rows 0 to 9. Each display buffer contains a character ROM address and the colour control bit
corresponding to a display location on the monitor screen.

Each row data is associated with two control registers which are located at columns 30 and 31 of their respective row.
Also three window control registers for three windows together with three frame control register occupy the first
13 columns of row 10.

1997 Mar 03 6

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

handbook, full pagewidth

0

ROW CHARACTER DISPLAY BUFFERS RESERVED

9

WINDOW 1

10

CONTROL

02356891213 31

WINDOW 2

CONTROL

WINDOW 3

CONTROL

COLUMN

230 24 29 30 31

FRAME

CONTROL

Fig.4 Internal RAM map.

DISPLAY BUFFERS

ROW

CONTROL

RESERVED

MGD763

Table 3 Display buffers; see Table 4

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

CCS0 CA6 CA5 CA4 CA3 CA2 CA1 CA0

Table 4 Explanation of Table 3

BIT NAME DESCRIPTION

7 CCS0 This bit defines the characters colour. When the character has no window background

with it, colour 0 is selected if CCS0 = 0, otherwise colour 1 is selected. When the
character is inside a window and the CCS1 bit of the corresponding windows control
register is 0, the colour selection is the same as no window background, and if
CCS1 = 1, colour 2 is selected when CCS0 = 0, otherwise colour 3 is selected.

6 to 0 CA6 to CA0 These 7 bits define 1 of 128 character symbols to be displayed in this position.

1997 Mar 03 7

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

ROW CONTROL REGISTERS

Table 5 Column 30

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

R0 G0 B0 R1 G1 B1 CHS CWS

Table 6 Explanation of Table 5

BIT NAME DESCRIPTION

7 to 5 R0, G0, B0 colour definition of colour 0
4 to 2 R1, G1, B1 colour definition of colour 1

1 CHS This bit defines the height of the display character; when CHS = 1 double height is

selected.

(1)

0 CWS This bit defines the width of the display character; when CWS = 1 double width

selected.

is

Note

1. When the display row is selected to be double width, only even column characters will be displayed on the screen

and the odd column characters will not appear.

Table 7 Column 31

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

R2 G2 B2 R3 G3 B3 reserved

Table 8 Explanation of Table 7

BIT NAME DESCRIPTION

7 to 5 R2, G2, B2 colour definition of colour 2
4 to 2 R3, G3, B3 colour definition of colour 3

WINDOW CONTROL REGISTERS
There are three control registers for each window. Window 1 occupies columns 0 to 2 of row 10, columns 3 to 5 of

row 10 are occupied by window 2 and columns 6 to 8 of row 10 are occupied by window 3. If window overlapping occurs,
the highest priority window will cover the lowest. Window 1 has the highest priority and window 3 the lowest.

Table 9 Columns 0, 3 and 6 of row 10

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

MSB row start address LSB MSB row end address LSB

1997 Mar 03 8

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

Table 10 Explanation of Table 9

BIT NAME DESCRIPTION

7to4 − These bits specify which row is the start of window.
3to0 − These bits specify which row is the end of window.

Table 11 Columns 1, 4 and 7 of row 10

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

MSB column start address LSB WEN CCS1 reserved

Table 12 Explanation of Table 11

BIT NAME DESCRIPTION

7to3 − These bits specify which column is the start of the window.

2 WEN When this bit is set to logic 1 the corresponding window background is enabled.
1 CCS1 When this bit is set to logic 1, the characters resided within this particular window can

have two extra colour selections (i.e. colour 2 and colour 3); see Section “Display
buffers”.

Table 13 Columns 2, 5 and 8 of row 10

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

MSB column end address LSB WR WG WB

Table 14 Explanation of Table 13

BIT NAME DESCRIPTION

7to3 − These bits specify which column is the end of the window.
2 to 0 WR, WG, WB These bits define the colour of the window.

RAME CONTROL REGISTERS

F

Table 15 Column 9 of row 10

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

reserved MSB vertical start position LSB

1997 Mar 03 9

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

Table 16 Explanation of Table 15

BIT NAME DESCRIPTION

5to0 − These bits specify the vertical starting position of OSD. The counting starts from the

falling edge of the VFLB signal (e.g. enter vertical flyback period) and each increment
represents four scan line movement to the bottom. 64 positions are provided.
The default value is 4 after power-up. The time from the falling edge of the VFLB signal
to starting display is:

= (vertical start position) × 4 × t

t

v

Where t

= one horizontal line display time.

h-sync

h-sync+th-sync

Table 17 Column 10 of row 10

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

reserved MSB horizontal start position LSB

.

Table 18 Explanation of Table 17

BIT NAME DESCRIPTION

4to0 − These bits specify the horizontal starting position of OSD. The counting starts from the

falling edge of the HFLB signal (e.g. enter horizontal flyback period) and each increment
represents six dots movement to the right. 32 positions are provided. The default value
is 15 after power-up. The time from the falling edge of the HFLB signal to starting
display is:

= (horizontal start position) × 6 × t

t

h

Where t

= one pixel display time (e.g. one horizontal line display time/384).

dot

+61×t

dot

dot

.

A horizontal display line consists of 384 dots, which include 288 dots (e.g. 12 dots × 24 characters) for display character,
and 96 dots for the blank region.

Table 19 Column 11 of row 10

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

reserved CH5 CH4 CH3 CH2 CH1 CH0

Table 20 Explanation of Table 19

BIT NAME DESCRIPTION

5 to 0 CH5 to CH0 These bits specify the height of displayed characters. Table 21 shows the lines to be

repeated.
The height of character can be specified from 16 to 63 scan lines. For example, when
CH5 to CH0 = 00 0010, the height of character will be 18 scan lines, the 4th and 12th
line will be double scanned but others will be scanned once.

1997 Mar 03 10

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

Table 21 The repeat line of character

CH5 to CH0

LINE NUMBER

0123456789101112131415

CH0 = 1 −−−−−−−−V−−−−−−−
CH1 = 1 −−−−V−−−−−−−V−−−
CH2 = 1 −−V−−−V−−−V−−−V−
CH4 = 1 − V − V − V − V − V − V − V − V
CH5 and CH4 = 0X all sixteen lines scanned once
CH5 and CH4 = 10 all sixteen lines scanned twice
CH5 and CH4 = 11 all sixteen lines scanned three times

Note

1. V indicates which line of the character will be repeated one more time.

Table 22 Column 12 of row 10

(1)

DATA BYTE

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

OSDEN BSEN SHSE reserved FBC

Table 23 Explanation of Table 22

BIT NAME DESCRIPTION

7 OSDEN The OSD circuit is active when this bit is set to logic 1. The outputs of R, G, B and FB

will be high impedance when OSD is disabled.
6 BSEN The bordering or shadowing effect is enabled when this bit is set to logic 1.
5 SHSE The shadowing of characters is selected if this bit is set to logic 1, otherwise bordering

of characters is chosen.
0 FBC This bit defines the output configuration of the FB pin. If this bit is set to logic 0, then the

output of FB will be logic HIGH when displaying character or window, otherwise the

output of FB is logic HIGH only when displaying characters.

1997 Mar 03 11

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

Character ROM

The character ROM contains 128 character fonts. Each
font consists of a 12 × 16 dot matrix.

Bordering and shadowing of characters

The characters displayed on the screen can be specified
with or without shadowing or with border shadowing by
setting the BSEN and SHSE bits of frame control register
“Column 11 of row 10”. If shadowing is specified, there is
black shadow on the right and bottom sides of character,
and if border shadowing is specified, the black shadowing
will surround both internal and external sides of characters
(see Fig.5). The characters shadow will not appear if it is
outside the display area of character (i.e. 12 × 16 dots).

Combination of two or more character fonts to
formulate a new symbol

User can combine two (or more) character fonts to
formulate a new higher resolution symbol in a horizontal
direction, but the combination of two fonts in a vertical
direction could cause the shadowing or bordering shadow
of upper font to be missed if shadowing or bordering is
applied.

PLL clock generator

By tracing the signal on the HFLB pin, the on-chip PLL
circuit generates the clock (VCLK) which is used for both
system clock and dot clock of the OSD. The frequency of
VCLK signal is determined by following equation:

f

VCLK=fHFLB

× 384 (i.e. the frequency range of VCLK

signal is from 3.84 to 38.4 MHz).
When there is no horizontal sync pulse present on the

HFLB pin, the PLL circuit will generate a 2.5 MHz
(approximate) clock for the system clock, and the RED,
GREEN, BLUE and FB pins will be high impedance.

handbook, full pagewidth

0
1
2
3
4
5
6
7
8

9
10
11
12
13
14
15

no shadow

0
1
2
3
4
5
6
7
8

9
10
11
12
13
14
15

shadowing

Fig.5 Character shadowing and bordering.

1997 Mar 03 12

0
1
2
3
4
5
6
7
8

9
10
11
12
13
14
15

bordering shadow

MGD759

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

PCB8517P/001 character fonts

dbook, full pagewidth

Fig.6 Character fonts 00H to 1FH.

1997 Mar 03 13

MGD755

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

dbook, full pagewidth

Fig.7 Character fonts 20H to 3FH.

1997 Mar 03 14

MGD756

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

dbook, full pagewidth

Fig.8 Character fonts 40H to 5FH.

1997 Mar 03 15

MGD757

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

dbook, full pagewidth

Fig.9 Character fonts 60H to 7FH.

1997 Mar 03 16

MGD758

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

LIMITING VALUES

In accordance with the absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

DDX

V

i

T

stg

T

amb

DC CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DDX

I

DDX

digital supply voltage −0.3 +7.0 V
input voltage (all inputs) −0.3 V

DDX

+ 0.3 V
storage temperature −55 +125 °C
operating ambient temperature 0 70 °C

digital supply voltage 4.75 5.0 5.25 V
digital supply current VI=V

DDX

;

−−25 mA

no load on outputs

Inputs

V

IH

V

IL

Outputs

I

OH(source)

I

OL(sink)

HIGH level input voltage 2.0 − V
LOW level input voltage V

HIGH level output current (source) VO≥ V

− 0.8 5.0 −−mA

DDX

− 0.3 − 0.8 V

SSX

DDX

+ 0.3 V

LOW level output current (sink) VO≤ 0.5 5.0 −−mA

1997 Mar 03 17

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

APPLICATION INFORMATION

R, G and B video signals

handbook, full pagewidth

from PC or work station

horizontal sync from

deflection circuit

vertical sync from

deflection circuit

MICROCONTROLLER

HFLB

VFLB

EN

SDI

SCK

10

PCF8517

6

7

8

155

14

13

12

11

2

3

RED

GREEN

BLUE

FB

HTONE

(2)

VCO

5.6 kΩ

(2)

BIAS

MIXER

(1)

1 MΩ

0.01 µF

5.6 kΩ10 kΩ

0.01 µF

R, G and B outputs
to video circuit

MGD761

The analog power and ground pins should be separated from other circuits.
(1) Only connected when half tone is applied.
(2) The recommended circuit or value of components connected to VCO and BIAS could be changed in a different printed-circuit board layout.

Fig.10 Application circuit.

1997 Mar 03 18

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil)

D

seating plane

L

Z

16

pin 1 index

e

b

SOT38-4

M

E

A

2

A

A

1

w M

b

1

b

2

9

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT38-4

12

min.

max.

IEC JEDEC EIAJ

b

1.73

1.30

0.068

0.051

b

1

0.53

0.38

0.021

0.015

b

1.25

0.85

0.049

0.033

REFERENCES

cD E e M

2

0.36

0.23

0.014

0.009

19.50

18.55

0.77

0.73

1997 Mar 03 19

8

(1) (1)

6.48

6.20

0.26

0.24

L

e

1

M

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

E

10.0

8.3

0.39

0.33

H

0.2542.54 7.62

0.010.10 0.30

ISSUE DATE

92-11-17
95-01-14

w

max.

0.764.2 0.51 3.2

0.0300.17 0.020 0.13

(1)

Z

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

(order code 9398 652 90011).

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Mar 03 20

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

NOTES

1997 Mar 03 21

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

NOTES

1997 Mar 03 22

Philips Semiconductors Objective specification

Stand-alone OSD for monitor applications PCB8517

NOTES

1997 Mar 03 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547047/1200/01/pp24 Date of release: 1997 Mar 03 Document order number: 9397 75001017