Datasheet PCA82C251U, PCA82C251, PCA82C251T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

PCA82C251

CAN transceiver for 24 V systems

Product specification
Supersedes data of 1997 Mar 14
File under Integrated Circuits, IC18

2000 Jan 13

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

FEATURES

• Fully compatible with the

“ISO 11898-24 V”

standard

• Slope control to reduce RFI

• Thermally protected

• Short-circuit proof to battery and ground in 24 V

powered systems

GENERAL DESCRIPTION

The PCA82C251 is the interface between the CAN
protocol controller and the physical bus. It is primarily
intended for applications (up to 1 Mbaud) in trucks and
buses. The device provides differentialtransmit capability
to the bus and differential receive capability to the CAN
controller.

• Low-current standby mode

• An unpowered node does not disturb the bus lines

• At least 110 nodes can be connected

• High speed (up to 1 Mbaud)

• High immunity against electromagnetic interference.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
I
1/t
V
V
T

CC

CC

bit
CAN
diff
amb

supply voltage 4.5 5.5 V
supply current standby mode − 275 µA
maximum transmission speed non-return-to-zero 1 − Mbaud
CANH, CANL input/output voltage −36 +36 V
differential bus voltage 1.5 3.0 V
ambient temperature −40 +125 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION CODE

PACKAGE

PCA82C251 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
PCA82C251T SO8 plastic small outline package; 8 leads body width 3.9 mm SOT96-1
PCA82C251U − bare die; 2840 × 1780 × 380 µm −

2000 Jan 13 2

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

BLOCK DIAGRAM

handbook, full pagewidth

PINNING

TXD

Rs

RXD

V

ref

1

8

4

5

REFERENCE

SLOPE/

STANDBY

VOLTAGE

Fig.1 Block diagram.

PROTECTION

RECEIVER

PCA82C251

DRIVER

V

CC

GND

3

7

CANH
CANL

6

2

MBG613

SYMBOL PIN DESCRIPTION

TXD 1 transmit data input
GND 2 ground
V

CC

3 supply voltage
RXD 4 receive data output
V

ref

5 reference voltage output
CANL 6 LOW-level CAN voltage

input/output

CANH 7 HIGH-level CAN voltage

input/output

Rs 8 slope resistor input

2000 Jan 13 3

handbook, halfpage

1TXD
2

GND CANH

V

RXD

CC

PCA82C251

3
4

MBG612

8Rs
7
6

CANL
V

5

ref

Fig.2 Pin configuration.

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

FUNCTIONAL DESCRIPTION

The PCA82C251 is the interface between the CAN
protocol controller and the physical bus. It is primarily
intended for applications up to 1 Mbaud in trucks and
buses. The device provides differential transmit capability
to the bus and differential receive capability to the CAN
controller. It is fully compatible with the

“ISO 11898-24 V”

standard.
A current limiting circuit protects the transmitter output

stage against short-circuit to positive and negative battery
voltage. Although the power dissipation is increased
during this fault condition, this feature will prevent
destruction of the transmitter output stage.

If the junction temperature exceeds a value of
approximately 160 °C, the limiting current of both
transmitter outputs is decreased. Because the transmitter
is responsible for the major part of the power dissipation,
this will result in a reduced power dissipation and hence a
lowerchip temperature. All other partsof the IC will remain
operating. The thermal protection is particularly needed
when a bus line is short-circuited.

The CANH and CANL lines are also protected against
electrical transients which may occur in an automotive
environment.

Pin 8 (Rs) allows three different modes of operation to be
selected: high-speed, slope control or standby.

For high-speed operation, the transmitter output
transistors are simply switched on and off as fast as
possible. In this mode, no measures are taken to limit the
rise and fall slope. Use of a shielded cable is
recommended to avoid RFI problems. The high-speed
mode is selected by connecting pin 8 to ground.

The slope control mode allows the use of an unshielded
twisted pair or a parallel pair of wires as bus lines.
To reduce RFI, the rise and fall slope should be limited.
The rise and fall slope can be programmed with a resistor
connected from pin 8 to ground. The slope is proportional
to the current output at pin 8.

If a HIGH level is applied to pin 8, the circuit enters a low
current standby mode. In this mode, the transmitter is
switched off and the receiver is switched to a low current.
If dominant bits are detected (differential bus voltage
>0.9 V), RXD will be switched to a LOW level.
The microcontroller should react to this condition by
switching the transceiver back to normal operation
(via pin 8). Because the receiver is slower in standby
mode, the first message will be lost at higher bit rates.

Table 1 Truth table of the CAN transceiver

V

CC

TXD CANH CANL BUS STATE RXD

4.5 to 5.5 V 0 HIGH LOW dominant 0

4.5 to 5.5 V 1 (or floating) floating floating recessive 1

4.5<VCC< 5.5 V X

(1)

floating if

VRs> 0.75V

CC

floating if

VRs> 0.75V

floating 1

CC

0<VCC< 4.5 V floating floating floating floating X

Notes

1. X = don’t care.

2. If another bus node is transmitting a dominant bit, then RXD is logic 0.

Table 2 Pin Rs summary

CONDITION FORCED AT PIN Rs MODE RESULTING VOLTAGE OR CURRENT AT PIN Rs

> 0.75V

V

Rs

10 µA<−I

VRs< 0.3V

CC

< 200 µA slope control 0.4VCC<VRs< 0.6V

Rs

CC

standby −IRs<10µA

CC

high-speed −IRs< 500 µA

(2)
(2)

(1)

2000 Jan 13 4

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2;
positive input current.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

n

V

6

V

7

V

tr

T

stg

T

amb

T

vj

V

esd

supply voltage −0.3 +7.0 V
DC voltage at pins 1, 4, 5 and 8 −0.3 VCC+ 0.3 V
DC voltage at pin 6 (CANL) 0V<VCC< 5.5 V; TXD HIGH

−36 +36 V

or floating
0V<V

< 5.5 V; no time

CC

−36 +36 V

limit; note 1
0V<V

< 5.5 V; no time

CC

−36 +36 V

limit; note 2
DC voltage at pin 7 (CANH) 0V<VCC< 5.5 V; no time limit −36 +36 V
transient voltage on pins 6 and 7 see Fig.8 −200 +200 V
storage temperature −55 +150 °C
ambient temperature −40 +125 °C
virtual junction temperature note 3 −40 +150 °C
electrostatic discharge voltage note 4 −2500 +2500 V

note 5 −250 +250 V

Notes

1. TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/µs for voltages above +30 V.

2. Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW.

3. In accordance with
Tvj=T

amb+Pd×Rth(vj-a)

“IEC 60747-1”

, where R

the allowable combinations of power dissipation (Pd) and ambient temperature (T

. An alternative definition of virtual junction temperature is:

is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits

th(vj-a)

).

amb

4. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2500 V.

5. Classification B: machine model; C = 200 pF; R = 0 Ω; V = ±250 V.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air

PCA82C251 100 K/W
PCA82C251T 160 K/W

QUALITY SPECIFICATION

According to

“SNW-FQ-611 part E”

.

2000 Jan 13 5

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

CHARACTERISTICS

VCC= 4.5 to 5.5 V; T
to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design,
but only 100% tested at +25 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I

3

supply current dominant; V1=1V;

DC bus transmitter

V

IH

V

IL

I

IH

I

IL

V

6, 7

I

LO

HIGH-level input voltage output recessive 0.7V
LOW-level input voltage output dominant −0.3 − 0.3V
HIGH-level input current V1=4V −200 − +30 µA
LOW-level input current V1=1V −100 −−600 µA
recessive bus voltage V1= 4 V; no load 2.0 − 3.0 V
off-state output leakage

current

V

V
∆V

7

6

6,7

CANH output voltage V1=1V; VCC= 4.75 to 5.5 V 3.0 − 4.5 V

CANL output voltage V1=1V 0.5 − 2.0 V
difference between output

voltage at pins 6 and 7

I

I

sc7

sc6

short-circuit CANH current V7= −5V −−−200 mA

short-circuit CANL current V6=36V −−200 mA

DC bus receiver [V1= 4 V; pins 6 and 7 externally driven; −2V<(V6,V7) < 7 V; unless otherwise specified]

= −40 to + 125 °C; RL=60Ω; I8> −10 µA; unless otherwise specified; all voltages referenced

amb

−−78 mA

VCC< 5.1 V
dominant; V

=1V;

1

−−80 mA

VCC< 5.25 V
dominant; V

=1V;

1

−−85 mA

VCC< 5.5 V
recessive; V

=4V;

1

−−10 mA

R8=47kΩ
standby; note 1 −−275 µA

− VCC+ 0.3 V

CC

CC

−2V<(V6,V7)<7V −2 − +2 mA

−5V<(V

=1V; VCC= 4.5 to 4.75 V 2.75 − 4.5 V

V

1

) < 36 V −10 − +10 mA

6,V7

V1=1V 1.5 − 3.0 V
V

=1V; RL=45Ω 1.5 −−V

1

V

= 4 V; no load −500 − +50 mV

1

V

= −36 V −−100 − mA

7

V

V

V

diff(r)

diff(d)

differential input voltage
(recessive)

differential input voltage
(dominant)

note 2 −1.0 − +0.5 V

−7V<(V

−7V<(V

) < 12 V; note 2 −1.0 − +0.4 V

6,V7

) < 12 V; not

6, V7

standby mode
standby mode 0.97 − 5.0 V
standby mode;

V

= 4.5 to 5.10 V

CC

V

diff(hys)

differential input hysteresis see Fig.5 − 150 − mV

2000 Jan 13 6

0.9 − 5.0 V

1.0 − 5.0 V

0.91 − 5.0 V

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

OH

HIGH-level output voltage
(pin 4)

V

OL

LOW-level output voltage
(pin 4)

R

i

CANH, CANL input
resistance

R

diff

differential input resistance 20 − 100 kΩ

Reference output

V

ref

reference output voltage V8=1V;I5<50µA 0.45V

Timing (RL=60Ω; CL= 100 pF; unless otherwise specified. See Figs 3 and 4)

I4= −100 µA 0.8V

I4=1mA 0 − 0.2V
I

=10mA 0 − 1.5 V

4

CC

− V

CC

CC

5 − 25 kΩ

− 0.55V

V

=4V;I5<5µA 0.4V

8

CC

− 0.6V

CC

CC

CC

V

V

V
V

t

bit

t

onTXD

t

offTXD

t

onRXD

minimum bit time R8=0Ω−−1µs
delay TXD to bus active R8=0Ω−−50 ns
delay TXD to bus inactive R8=0Ω−40 80 ns
delay TXD to receiver

R8=0Ω−55 120 ns

active

t

offRXD

t

onRXD

delay TXD to receiver
inactive

delay TXD to receiver

R8=0Ω; T

amb

< +85 °C;

− 80 150 ns

VCC= 4.5 to 5.1 V
R

=0Ω; VCC= 4.5 to 5.1 V − 80 170 ns

8

R

=0Ω; T

8

=0Ω−90 190 ns

R

8

R

=47kΩ−290 400 ns

8

< +85 °C − 90 170 ns

amb

R8=47kΩ−440 550 ns

active
SR CANH, CANL slew rate R
t

WAKE

wake-uptime from standby

=47kΩ−7−V/µs

8

see Fig.6 −−20 µs

(via pin 8)
t

dRXDL

bus dominant to RXD LOW V8= 4 V; see Fig.7 −−3µs

Standby/slope control (pin 8)

V

stb

input voltage for standby

0.75V

CC

mode
I

slope

V

slope

slope control mode current −10 −−200 µA

slope control mode voltage 0.4V

CC

Notes

1. I1=I4=I5= 0 mA; 0 V < V6<VCC; 0V<V7<VCC; V8=VCC; T

amb

<90°C.

2. This is valid for the receiver in all modes: high-speed, slope control and standby.

−−V

− 0.6V

CC

V

2000 Jan 13 7

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

100 nF

V

CC

3

82

GND Rs

7

6

CANH

CANL

MBG614

TXD

V

ref

RXD

30 pF

+

5 V

1

5

PCA82C251 60 Ω 100 pF

4

Fig.3 Test circuit for dynamic characteristics.

handbook, full pagewidth

V

TXD

t

onRXD

0.9 V

0.3V

V

V

diff

RXD

t

onTXD

Fig.4 Timing diagram for dynamic characteristics.

2000 Jan 13 8

CC

t

offTXD

t

offRXD

0.5 V

0.7V

CC

MBG615

V

0 V

CC

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

handbook, full pagewidth

handbook, full pagewidth

V

V

RXD

V

RXD

Rs

hysteresis

0.5 0.9

Fig.5 Hysteresis.

MBG616

HIGH

LOW

V

(V)

diff

V

CC

0 V

V

=1V.

TXD

handbook, full pagewidth

VRs= 4 V; V

TXD

=4V.

t

WAKE

Fig.6 Timing diagram for wake up from standby.

V

diff

V

RXD

t

dRXDL

Fig.7 Timing diagram for bus dominant to RXD low.

MBG617

1.5 V

0 V

MBG618

2000 Jan 13 9

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

handbook, full pagewidth

The waveforms of the applied transients shall be in accordance with

TXD

V

ref

RXD

+

5 V

1

5

PCA82C251 60 Ω

4

GND Rs

Fig.8 Test circuit for automotive transients.

handbook, full pagewidth

100 nF

V

CC

3

“ISO 7637 part 1”

P8xC592

CAN-CONTROLLER

82

7

6

47 kΩ

CANH

CANL

500 pF

SCHAFFNER
GENERATOR

500 pF

, test pulses 1, 2, 3a and 3b.

MBG619

CRX1CRX0 PX,YCTX0

R

ext

V

LINE

ref

Rs

RXD

TXD

PCA82C251

CAN-TRANSCEIVER

CANH CANL

120 Ω 120 Ω

(1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation, dominant = LOW).
(2) If no slope control is desired: R

=0.

ext

CAN BUS

V

CC

GND

+

5 V

MBG620

100 nF

Fig.9 Application of the PCA82C251 CAN Transceiver.

2000 Jan 13 10

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

BONDING PAD LOCATIONS

COORDINATES

(1)

SYMBOL PAD

xy

TXD 1 196 137
GND 2 1080 137
V

CC

3 1567 137
RXD 4 2644 137
V

ref

5 2644 1644
CANL 6 1490 1644
CANH 7 748 1644
Rs 8 200 1610

Note

1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (x/y = 0).

handbook, full pagewidth

Rs

8

CANH

7

CANL

6

ref

V

5

1.78
mm

1

0

x

0

y

TXD

PCA82C251U

2

GND

Fig.10 Bonding pad locations.

2000 Jan 13 11

34

2.84 mm

CC

V

RXD

MGL944

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

seating plane

L

Z

8

pin 1 index

1

D

A

2

A

A

1

w M

b

e

b

1

b

2

5

E

4

M

E

c

(e )

1

M

H

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT97-1

12

min.

max.

1.73

1.14

0.068

0.045

IEC JEDEC EIAJ

050G01 MO-001 SC-504-8

b

b

0.53

0.38

0.021

0.015

1

1.07

0.89

0.042

0.035

b

2

REFERENCES

cD E e M

0.36

0.23

0.014

0.009

9.8

9.2

0.39

0.36

2000 Jan 13 12

(1) (1)

6.48

6.20

0.26

0.24

L

e

1

M

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

E

10.0

0.39

0.33

H

8.3

w

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.10 0.30

0.0450.17 0.020 0.13

ISSUE DATE

95-02-04
99-12-27

(1)

Z

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

SO8: plastic small outline package; 8 leads; body width 3.9 mm

D

c

y

Z

8

pin 1 index

1

e

5

A

2

A

4

w M

b

p

SOT96-1

E

H

E

1

L

detail X

A

X

v M

A

Q

(A )

L

p

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE

VERSION

SOT96-1

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

IEC JEDEC EIAJ

076E03 MS-012

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1)E(2)

cD

5.0

4.8

0.20

0.19

REFERENCES

4.0

3.8

0.16

0.15

1.27

0.050

2000 Jan 13 13

eHELLpQZywv θ

1.05

1.0

0.4

0.039

0.016

0.7

0.6

0.028

0.024

0.25 0.10.25

0.010.010.041 0.004

EUROPEAN

PROJECTION

6.2

5.8

0.244

0.228

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

97-05-22
99-12-27

o

8

o

0

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

SOLDERING
Introduction

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeand surface mount components are mixedon
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

stg(max)

). If the

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadson four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Jan 13 14

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

Suitability of IC packages for wave, reflow and dipping soldering methods

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable

WAVE REFLOW

(2)

− suitable

(1)

DIPPING

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

not suitable

(3)

suitable −

HTSSOP, SMS

(4)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

, SO, SOJ suitable suitable −

(4)(5)

suitable −

(6)

suitable −

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2000 Jan 13 15

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There are nopost packing tests performed on individual die or wafer. Philips Semiconductors
has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips
Semiconductorsassumes no liability for device functionality orperformanceof the die or systems after third partysawing,
handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in
which the die is used.

2000 Jan 13 16

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

NOTES

2000 Jan 13 17

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

NOTES

2000 Jan 13 18

Philips Semiconductors Productspecification

CAN transceiver for 24 V systems PCA82C251

NOTES

2000 Jan 13 19

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT PhilipsDevelopment Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

69

Printed in The Netherlands 285002/03/pp20 Date of release: 2000 Jan 13 Document order number: 9397 750 06611