Datasheet PC817XI2, PC817XI3, PC817XI4, PC817XI5, PC817XI6 Datasheet (Sharp)

h November 28, 1995

ELECTRONIC COMPONE

GROUP SHARP

CORPORATION

F \

DEVICE SPECIFICATION FOR

Business dealing name

PHOTOCOUPLER

MODEL No.

PC817

SPECIFICATION

OPTO-ELECTS
DEVICES DIV.

1. These specification sheets include the contents under the copyright of Sharp Corporation (“Sharp”].
Please keep them with reasonable care as important information. Please don’t reproduce
or cause anyone reproduce them without Sharp’s consent.

2. Please obey the instructions mentioned below for actual use of this device.
SHARP takes no responsibility for damage caused by improper use of the devices.

(I) This device is designed for general electronic equipment.

Main uses of this device are as follows;

[

* Computer

- OA equipment - Telecommunication equipment (Terminal)

- Measuring equipment l Tooling machine - AV equipment

l

Home appliance, etc.

1

(2) Please take proper steps in order to maintain reliability and safety, in case this device

is used for the uses mentioned below which require high reliability.

- [ Unit concerning control and safety of a vehicle (air plane, train, automobile etc.)

- Traffic signal * Gas leak detection breaker * Fire box and burglar alarm box
* Other safety equipment, etc.

1

(3) Please do not use for the uses mentioned below which require extremely high reliability.

- Space equipment [ * Telecommunication equipment (Trunk)
* Nuclear control equipment

* Medical equipment etc.

1

Contact a SHARP representative of sales office in advance when you intend to use S?%4.RP
devices for any applications other than those applications for general electronic equipment
recommend by SHARP at (1).

CUSTOMER’S APPROVAL

DATE
PRESENTED
BY

DATE

BY

T. Matsumura,
Department General Manager of
Engineering Dept.,11

Opto-Electronic Devices Div.

ELECOM Group
SHARP CORPORATION

SHARP CORPORATION

1

i November 28. 1995 1

1. Application

This specification applies to the outline and characteristics of photocoupler
Model No. PC8 17series.

2. Outline
Refer to the attached drawing No. CY7073K02.

3. Ratings and characteristics
Refer to the attached sheet, page 3 to 6.

4. Reliability
Refer to the attached sheet, page 7.

5. Incoming inspection
Refer to the attached sheet, page 8.

6. Supplement

6.1 Isolation voltage shall be measured in the following method.
(11 Short between anode to cathode on the primary side and between collector

to emitter on the secondary side.
(21 The dielectric withstand tester with zero-cross circuit shall be used.
(3) The wave form of applied voltage shall be a sine wave.

(It is recommended that the isolation voltage be measured in insulation oil.)

SHARP CORPORATION

6.2 Business dealing name

(” 0” mark indicates business dealing name of ordered product)

Ordered Business

Rank mark Ic (mA)

nroduct dealingname

0

PC817Xl

A, B, C, D or no mark 2.5 to 30

PC817XIl

A 4.0 to 8.0

PC8 17XI2

B .

6.5 to 13

PC8 17XI3 C

10to20
PC8 17XI4 D
PC817XI5 AorB
PC8 17Xi6 B or C

15 to 30

4.0to 13 :

6.5 to 20

I I

1 PC817XI7 1

C or D

1

10 to 30

PC8 172U8
PC8 17XI9

A, B or C
B, CorD

4.0 to 20

6.5 to 30

I

I

1 PC817XIO 1

A, B, C or D 1 4.oto30

6.3 This Model is approved by UL.
Approved Model No. : PC8 17
UL file No. : E64380

6.4 This product is not designed against irradiation.
This product is assembled with electrical input and output.
This product incorporates non-coherent light emitting diode.

Test

conditions

1,=5mA

vc,=5v

Ta=25’C

7. Notes
Refer to the attached sheet- 1 - 1, 2.

Ta=25”C

l 1 Forward current

Collector current Ic 50 mA
*l Collector power dissipation

PC 150 mW
*l Total power dissipation Ptot 200 mW
*3 Isolation voltage

viso

5

kVrms

Operating temperature

Topr -30 to +lOO ‘C

Storage temperature

Tstg

-55 to +125

“C

*4 Soldering temperature

Tsol 260 “C

‘1 The derating factors of absolute maximum ratings due to ambient temperature

are shown in Fig. 1 to 4.

*2 Pulse width_IlOO ,us, Duty ratio : 0.001 (Refer to Fig. 5)
*3 AC for 1 min, 40 to 6O%RH
l 4 For 10s

SHARP CORPORATION

3.2 Electra-optical characteristics

r

Input

output

Transfer
charac­teristics

Parameter Syllhl

Condition MIN. TYP. MAX. Unit

Forward voltage

VF

IFI,=20mA

1.2 1.4 v

Peak forward voltage

vFM

Im=0.5A

3.0 v

Reverse current

1,

v,=4v

10 PA

-

Terminal capacitance Ct

v=o, f=lkHz 30 250 pF

Dark current

kE0

vc,=20v, IF=0 :- - 100 nA

Collector-emitter

BvCEO

Ic=O. 1mA 35 - - V

breakdown voltage IF.=0

Emitter-collector

BvECO

I,=10 /LA, I,=0 6 - -

V

breakdown voltage
Collector current
Collector-emitter

saturation voltage
Isolation resistance

Ic

I,=5mA.VcE=5V 2.5 - 30 mA

V

CEfsat)

1,=2omA 0.1 0.2 v
Ic=lmA

R

IS0

DC500V 5XlO’O 1o’l - Q

40 to 6O%FW
Floating capacitance cf
Cut-off frequency fc

v=o, f=lMHz
vc,=5v, Ic=2mA -

R,=lOO R, -3dB

0.6 1.0 pF
80 - kHz

Rise time

Fall time

tr

vc,=2v 4

18 pus

Ic=2mA

lf R,=lOO R 3 18 pus

Rank mark

mark l 2

i 6. 5’0.5 1

7. 62ro-

3

1

Pin Nos. and internal
cdnnection diagram

d

2
d

T

1. oy

10.

oz.

1.

5

1

l-J

2. 54

$0.25

UNIT: l/l mm

l

2) Factory identification mark shall be or shall not be marked.
PC817

SHARP CORPORRTION

(Fig. 1) Forward current vs.

ambient temperature

-30 0 25 55 75 100 125
Ambient temperature Ta ( “C )

(Fig. 3) Collector power dissipation

vs. ambient temperature

-30 0 25 50 75 100 125
Ambient temperature Ta ( ‘C )

(Fig. 5) Peak forward current
z
.5

vs. duty ratio

2 2000

1000

i 500

2 200

; 100

m” 50
z

2 20

Y 10

2 5 lo-‘2 5 lo”2 5 lo-‘2 5 10”

e

Duty ratio

(Fig. 2) Diode power diss&iok<->,

vs. ambient temperature

-..

5 80
2 70
.+ i 60

P

t;

40

3

&

4 20

-30 0 25 55 75 100 125
Ambient temperature Ta ( ‘C )

(Fig. 4) Total power dissipation

vs. ambient temperature

r

-30 0 25 50 75 100 125
Ambient temperature Ta (‘C )

PulsewidthS ps
Ta=25’C

J

SHARP CORPORATION

4. Reliability
The reliability

of products shall be satisfied with items listed below.

Confidence level : 90%
LTPD: 10%/20%

Test Items

Test Conditions

$1
Solderability “2
Soldering heat

Terminal strength

(Tension)

Terminal strength
(Bending) *3

Mechanical shock

23O”C, 5 s
260°C. 10 s
Weight : 5N

5 s/each terminal

Weight : 2.5N
2 times /each terminal

15000m/s2, 0.5ms

3 times/ tX, +Y, fZ direction

Variable frequency
vibration

100 to 2000 to 1ooHz/4min

200m/s2

4 times/ X, Y, 2 direction

Temperature 1 cycle -55 ‘C to t 125°C
cycling (30mir-i) (30mi.n)

20 cycles test

High temp. and high +6O’C, 9O%RH, lOOOh
humidity storage

High temp. storage +125”C, lOOOh
Low temp. storage -55”C, 1 OOOh
Operation life I,=SOmA, Ptot=200mW

Ta=25”C, 1 OOOh

*l Test method, conforms to JIS C 7021.

Failure Judgement

Criteria

U

v,>ux 1.2
I,>UXZ
Icso >‘ux2
rc<LX0.7
V

CE(sat) > ’ ’ ’ O2

Upper

specification
limit

L : Lower

specification
limit

‘2 Solder shall adhere at the area of 95% or more of immersed portion of

lead and pin hole or other holes shall not be concentrated on one portion.

Samples (nl
Defective(C)

n=ll, C=O
n=ll, C=O

n=ll, C=O

n=ll, C=O

n=ll, C=O

n=ll, C=O

n=22,C=O

n=22,C=O

n=22 ,C=O
i-i=22 ,C=O
n=22.C=0

*3 Terminal bending direction is shown below.

5. Incoming inspection

5.1 Inspection items
(11 Electrical characteristics

V,, I,, I,,, VCE:(satj, Ic, R,,, Visa

(2) Appearance

5.2 Sampling method and Inspection level
A single sampling plan, normal inspection level II based on

IS0 2859 is applied. The AQL according to the inspection
items axe shown below.

Defect

Inspection item AQL (%)

-

SHARP CORPORATION

1 For cleaning

SHflRP CORPORATION

Precautions for Photocouplers

(1) Solvent cleaning : Solvent temperature 45°C or less

Immersion for 3 min or less

(2) Ultrasonic cleaning : The affect to device by ultrasonic cleaning is different

by cleaning bath size, ultrasonic power
output, cleaning time, PWB size or device mounting
condition etc. Please test it in actual using condition
and con&m that doesn’t occur any defect before starting
the ultrasonic cleaning.

Applicable solvent : Ethyl alcohol, Methyl alcohol

Freon TE * TF. DifIon-solvent S3-E

Please refrain form using Chloro Fluoro Carbon type solvent to clean

device as much as possible since it is internationally restricted to protect
the ozonosphere. Before you use alternative solvent you are requested
to confirm that it does not attack package resin.

2. The LED used in the Photocoupler generally decreases the light emission power
by operation. In case of long operation time, please design the circuit with considering
the degradation of the light emission power of the LED. (50% / 5years)

( 11 If solder refIow :

It is recommended that only one soldering be done at the temperature
and the time within the temperature profile as shown in the figure.

230t

200°C

180°C

25°C

I

-

3. Precaution for Soldering Photocoupler

(2) Other precautions

An infbared Iamp used to heat up for soldering may cause a localized

temperature rise in the resin. So keep the package temperature within

that specified in Item (1). Also avoid immersing the resin part in the solder.

SHflRP CORPORRTION