Datasheet PC3Q67 Datasheet (Sharp)

.

PREPARED BY:

DATE

I-), Ti&Grr~A qp-; I 9 1993

APPROVED BY: DATE

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SPEC No.
FILE No.

SHARI=

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ELECTRONIC COMPONENTS CROUP
SHARP CORPORATION

I

ISSUE April 9, 1993

PAGE
REPRESENTATIVE DIVISION

q
q

n

1 SPECIFICATION 10

ED-93033

12 Pages

PHOTOVOLTAICS DIV.
OPTO-ELECTRONIC DEVICES DJV

ELECTRONIC COMPONENTS DIV.

’ DEVICE SPECIFICATION FOR

PHOTOCOUPLER

hiODEL No.

1. This

2. Dlease obey the instructions mentioned below for actual use of this device.
(1) This device is designed for general electronic equipment.

(Zj Please take proper steps in order to maintain reliability and safety,

specification sheets include the contents under the copyright of

sharp

Corporation (“Sharp”).

important

:hem \;i’thout Sharp’s consent.

Main uses of this device are as follows; .

- Computer C * OA equipment -Telecommunication equipment (Terminal)

- Measuring equipment -Tooling machine

- Home appliance, etc.

in case this device is used for the uses mentioned below which require
high reliability.

information. Please don’t reproduce or cause anyone reproduce

Please keep them with reasonable care as

* AV equipment

w

1

-Unit concerning control and safety of a vehicle (air plane, train,
automobile etc.) * Gas leak detection breaker

i

-Fire box and burglar alarm box

(2) Please don’t use for the uses mentioned below which require

extremely high reliability

Telecommunication equipment (Trunk)

element), etc.

0 CLJSTG:6RR’S APPROVAL

DATE

BY

*Other safety equipment, etc..

Medical equipment (relating to any fatal

T. Matsumura,

Department General Manager of
Engineering Dept., TI
Opto-Electronic Devices Div.
ELECOM Group
SHARP CORPORATION

- Traffic signal
I

1

MODEL No. PACE

i.

Application

This specification applies to the outline and characteristics of
photocoupler Model No. PC3Q67.

2. Outline
Refer to the attached drawing No. CY5890K02.

Ratings and characteristics

3.

3.1 Absolute maximum ratings

PC3Q67 1

Ta=25"C

iInput /
/

I
ioutput

!
!

1

Parameter

--------_

*1 Forward current

Symbol Rating Unit ,

IF j

50 mA

*2 Peak forward current / Im 1 1 / A

!

Reverse voltage

"R f

6

,

; *1 Power dissipation

Collector-emitter voltage
Emitter-collector voltage

P 1 70 mW

"CEO

VECO )

35

6

Collector current Ic i 50

*l Collector power dissipation

150 mW

/2..-- j

*l Total power dissipation

I

Ptot !

!

170

Operating temperature ' Topr 1 i -30 % +lOO ! OC

___-

Storage temperature

i Tstg 1 -40 'L +125

I

-__-_-_--______

*3 Isolation voltage

-_~.---

*4 Soldering temperature

--- ___. --__

I

V

" i

( "1
1

I * 1

I
i LUW '

j

*1 The derating factors of absolute maximum rating due to ambient

temperature are shown in Fig. 1 'L 4.
*2 Pulse width < lOOus, Duty ratio : 0.001 (Refer to Fig. 5)
*3 AC for lmin.,

40 ,-I, 60%RH, f=60Hz

*4 For 10 s

3.2 Electra-optical characteristics

MODEL hb.

PC3Q67

PACE

l

2

Input

output

Transfer
charac­terostocs

Parameter Symbol

----.---+---

-1

Forward voltage

I

Reverse current
Terminal capacitance
Dark current

/ ICE0 / -

Collector-emitter
breakdown voltage 1

I

i

Emitter-collector

I

brakdown voltage
Collector current

Collector-emitter
saturation voltage

------­Isolation resistance

----T----- ,

Ta=25"C

MIN. I TYP. MAX.

VF -

i 1.2 1.4
1 v ?F=20mA

! I

Unit Conditions

' 10 1 pA ‘VR=4V

f

/ -

I 250

100

'V=O, f=lkHz i

pF I

ti /vCE=20v, IF'0 1

i

I
I

I
I
!

Response time (Rise) tr

r

L

Response time (Fall) I tf / -

/

j- 14 18 1 US jVCE=2V

,

3

18 ps RL=lOOQ

'Ic=2mA

j

I

4. Reliability
Refer to the attached sheet, Page 7.

5. Incoming inspection
Refer to the attached sheet, Page 8.

6. Supplements

6.1

Isolation voltape shall be measured in the following method.

1) Short between anode and cathode on the primary side and

(

between collector and Emitter on the secondary side.

(2) The dielectric withstand tester with zero-cross circuit shall

be used.

(3) The waveform of applied voltage shall be a sine wave.

(It is recommended that the isolation voltage be measured

in insulation oil)

6.2 (1) This product is not designed as radiation hardened.
(2) This product is assembled

with

electrical input and output.

(3) This product incorporates non coherent light emitting diode.

6.3 Package specifications
Refer to the attached sheet, Page 9 to 11.

6.4 uL

: Under preparation

7. Notes

7.1 For cleaning
* Cleaning conditions:

MODEL No.

PC3Q67

PAGE

4

(1) Solvent cleaning:

(2) Ultrason ic c 1 eaning:

* The cleaning

Solvent: Ethyl alcohol, Methyl alcohol, Isopropyl alcohol

Please refrain from using Chloro Fluoro Carbon type solvent to clean
devices as much as possible since it is restricted to protert the
ozonosphere. Before you use alternative solvent you are requested
to confirm that it does not damage package resin.

7.2 On mounting
In mounting this device, please perform soldering reflow satisfied

with the conditions indicated in page 12. And please pay attention

not to occur the temperature rising of the package sectionally.

shall be Carrie out with solvent below.

Solvent temperature 45°C or less

Immersion 3 min. or less

Affection to device by ultrasonic cleaning has

different affection by cleaning bath size,
ultrasonic power output, cleaning time, PWB size
or device mounting condition etc.

carries out ultrasonic cleaning, user should
select fit condition that doesn't occur defect.

Freon TE.TF, Daiflon-solvent S3-E

If user

8. Others
Any doubt as to this specification shall be determined in good faith

upon mutual consultation of the both parties.

Pti3Q67

Date code *1

pC3Q67

.2 Pin Nos. and internal

connection diagram

Page 5

m
d
ti

W

&

\,f i

Date code is composed of 2-digit number marked according to

*I)

DIN standard and t'lie following weekly-code .

First week : 1
Second week : 2
Third week : 3
Fouth week : 4

Fifth, Sixth week : 5

Epoxy'- resin

c 0.4

UNIT :1/l mm

Name P-Q67

Drawin
No.

Outline Dimensions

CY589OKO2

.;

pc3Q67

Page 6

Fig. 1 Forward current vs.

ambient temperature

SO

40

Y

30--

/ -

20 -

i- -

10

~-

t--

b

-‘JO- 0 25 55 75 100

Ambient temperature Ta ("C)

Fig. 3 Collector power dissipation

r\

vs. ambient temperature

Fig. 2 Diode power dissipation

I

ambient temperature

vs.

I I I I I

1

looI- -i--l-l--t-1-1

80.
70

-

60 ­40 ­20 -

-030

Fig. 4 Total power dissipation

200 -.
170

150 -

I

Ambi!nt fzmper?tur! Ty"(OC)

vs. ambient temperature

\ --t-I

\

..--

-30

Pig. 5 Peak forward current

i

0

Ambient temperature Ta ("C)

25 50 75 100

vs. duty ratio

Pulse width 5 100~s

Ta -

Duty ratio

25C

100

\

50--.

01111111

-30

Ambi!ent ~?rnpe?!atu~~ ?!'("C)

.

4. Reliability
The reliability of products shall be satisfied with items listed below.

Confidence level : 90%, LTPD : 10X/20%

PAGE

Test Items

I

Test Conditions

!

; Solderability *l 23O"C, 5 s
i Soldering heat *2

.:

! Terminal strength
: (Bending)

260°C 10 s

Weight : lNiO.lkgf}

*3

1 time/each termianl

/
! Mechanical shock 15000m/sZ~1500G~, 0.5ms

/ .

I Variable frequency

3 times/s, ?Y, +Z direction Ic < L x 0.7

100 'L 2000 Q 100 Hz/4 min.

! vibration 4 times/X,Y Z direction

/ 200m/sZ{20G] > u x 1.2

j Temperature

' 1 cycle -40°C --I, +125"C

1 cycling (30min.) (30min.)

20 cycle test

VF > u X 1.2

IR>uX

2 n=ll, C=O

ICE0 > u X 2

n=ll, C=O

,

---

*l Solder shall adhere at the area of 95% or more of immersed portion of

lead and pin hole or other holes shall not be concentrated on one portion.

*2

The lead pin depth dipped into solder shall be away 0.2mm from the

root of lead pins.

(Refer to the below)

*3 Terminal bending direction is shown below.

0.211~s or more

:.-i. ..<.;x-.. .+Soldering area

Weight :

t

lNfO.lkgf]

Incoming inspection

5.

5.1 Inspection items
(1) Electrical characteristics

VF, IR, 1~~0% VCE(sat), Ic, Rise, vim

(2) Appearance

5.2 Sampling method and Inspection level

A single sampling plan, normal inspection level II based on
MIL-STD-105D is applied.

items are shown below.

IMODEL No.

I

The AQL according to the inspection

PC3Q67

1 PAGE

I

8

Defect I

Major i Electrical characteristics / Normal

defect

' Minor / , Appearance defect except i Normal

defect ;

I

I
I

i

/

I

Inspection item

Unreadable marking I inspection II 0.1

_---

the above mensioned.

I

I Inspection level AQL(%)
I
I

I

!

inspection II 0.4

I

t

6.2 Package specifications

I

PC3Q67

I g

6.3.1
ill

(2)

(3)

(4)

iS>

6.2.2

Taping conditions (Refer to the attached sheet, Page 1
Tape structure and Dimensions
The tape shall have a structure in which a cover tape

pressed on the carrier tape of hard vinylchloride to protect against
static electricity.

Reel structure and Dimensions (Refer to the attached sheet, Page 11)

The taping reel shall be of corrugated cardboard with its dimensions
as shown in the attached drawing.

Direction of product insertion (Refer to the attached sheet, Page 11)

Product direction in carrier tape shall direct to the anode mark at

the hole side on the tape.
Joint of tape
The cover tape and carrier tape in one reel shall be jointless.
The way to repair taped failure devices
The way to repair taped failure devices cut a bottom of carrier tape

with a cutter,

shall be sealed with adhesive tape.

Adhesiveness of cover tape

and after replacing to good devices, the cutting portion

0)

is sealed heat-

6.2.3

6.2.4

6.2.5

6.2.6

The exfoliation force between carrier tape and cover tape shall be

0.2N{20gf)s lN{lOOgf]for the angle from 160" to 180".

Rolling method and quanfity
Wind the tape back on the reel so that the cover tape will be outside

the tape.
leader of the tape and fix the both ends with adhesive tape.

One reel shall contain 1000 PCS.

Marking

The outer packaging case shall be marked with following information.

* Model No.

Storage condition
Taped procuts shall be stored at the temperature lower than

5 Q 30°C and the humidities lower than 7O%RH.
Safety protection during shipping
There shall be no deformation of component or degradation of electrical

characteristecs due to shipping.

Attach more than 20cm of blank tape to the trailer and the

* Number of pieces delivered

* Production date

structure and Dimensions

TapL

PC3Q67 Page 10

J

-

K

-

I L

, ..,

Dimension list -(Unit :’

mm)

-_

I

A

I

L

­i

Somax

-z
I

A C

21. oto. 3
J

0. 410. 05

D E F G H I

11.5&O. 1 1.75to.i 12.0~0. 1 2.

K

L

3. oio. 1 7.420. 1

o-co. 1 4. wo. 1 41. 5 fb’ 10. 8+-O. 1

Ret1 structure and Dimensions

PC3Q67

Page 11

a

t

,' -4

Dimension list (Unit : mm)

a b c d e

f

330 25.51-1.5 1rjtEl.O 13io.5 23kl.O 2.OkO.5 2.oa5 L

Direction of product insertion

g

MODEL No.

Precautions for Soldering Photocouplers

1. If solder reflow:
It is recommended that only one soldering be done at the

temperature and the time within the temperature profile as

shown in the figure.

23O'C

2ooc

PC3Q67

PAGE

12

180':

L

23:

---

i-

_ pp i

2 min.

,&-1_min. ;

-----+

/ *l minY /
+-----q

1.5 min.

2. Other precautions

An

infrared lamp used to heat up for soldering may cause a
localized temperature rise in the resin. So keep the package
temperature within that specified in Item 1. Also avoid immersing
the resin part in the solder.