APPROVED BY:
DATE:
ELECTRONIC COMPONENTS
GROUP SHARP CORPORATION
SPECIFICATION
PREPARED BY: DATE: 1
I
SPEC. No. ED-97123A
I
REPRESENTATIVE DMSION
I
OPTO-ELECTRONIC DEVICES DN.
DEVICE SPECIFICATION FOR
Business dealing name
PHOTOCOUPLER
MODEL No.
PC3H7
1. These specification sheets include materials protected under copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This product is designed for use in the following application areas :
i
l
OA equipment l Audio visual equipment
* Home appliances
* Telecommunication equipment CTerminal) * Measuring equipment
* Tooling machines * Computers
1
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should b-e taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as :
[
* Transportation control and safety equipment (aircraft, train, automobile etc.)
- Traffic signals
* Gas leakage sensor breakers
* Rescue and security equipment
* Other safety equipment
1
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
[
. Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment
* Medical equipment
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE
BY
DATE
PRESENTED
c-y- f I )
BY
L \ ‘h
T.
MatsumLua.
Department General Manager of
Engineering Dept. ,I1
Opto-Electronic Devices Div.
ELECOM Group
SHARP CORPORATION
SHARP CORPORATION
ED-97123A 1 September 30, 1998
MODEL No.
PAG E
PC3H7 l/11
1. Application
This specification applies to the outline and characteristics of photocoupler;
Model No. PC3H7.
2. Outline
Refer to the attached drawing
No.
CY8375K02.
3. Ratings and characteristics
Refer to the attached sheet, page 4 to 6.
4. Reliability
Refer to the attached sheet, page 7.
5. Incoming inspection
Refer to the attached sheet, page 8.
6. Supplement
6.1 Isolation voltage shall be measured in the foIlowing method.
(1) Short between anode and cathode on the primary side and between
collector and emitter on the secondary side.
(2) The dielectric withstand tester with zero-cross circuit shaIl be used.
(3) The wave form of applied voltage shall be a sine wave.
6.2 This product is not designed against irradiation.
This product is assembled with electrical input and output.
This product incorporates non-coherent light emitting diode.
6.3 Packaging specifications
Refer to the attached sheet, page 9 to 11.
SHARP CORPORATION
6.4
Collector current (Ic) Delivery rank table
(,, G” mark indicates business dealing name of ordered product)
ED-97123A
1 September 30, 199(
MODEL No. PAGE
PC3H7
2/11
6.5 ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production process
for this product.
Materials for ODS : CFC,, Halon, Carbon tetrachloride.
1.1.1 -Trichloroethane (Methylchloroform)
6.6 Brominated flame retardants
Speclf?c bromlnated flame retardants such as the PBBO, and PBB, are not used
in this device at all.
7. Notes
Refer to the attached sheet- 1- 1, 2.
SHARP CORPORATION
ED-97123A
1 September 30, 199f
MODEL No.
PAG E
PC3H7
3/11
2. Outline
Rankmark
Date code l l
Anode mark
\
Pin Nos. and internal
connection diagram
Collector
Emitter
I
0.2
4.
4-to.
2
0
Anode
0
Cathode
Epoxy resin
Product mass : Approx. 0.05g
*1 ) 2 -digit number shall be marked according to DIN standard.
*21 Dimensions in parenthesis are shown for reference.
*3) Marking is laser marking
UNIT: l/l mm
PC3H7
Name
Drawing
No.
Outline Dimensions
(Business dealing
name : PC3H71
CY8375K02
SHARP CORPORATION
ED-97 123A
1 September 30, 199(
MODEL No.
PAG E
PC3H7
4/11
3. Ratings and characteristics
3.1 Absolute maximum ratings
Ta=25%
Emitter-collector voltage
V
EC0
6
V
output
Collector current Ic 50
mA
*l Collector power dissipation PC 150
mW
*l Total power dissipation Ptot
170 mW
Operating temperature Topr
-30 to +lOO
“C
Storage temperature
Tstg
-40 to +125
“C
*3 Isolation voltage vi.50
2.5 kVrms
l 4 Soldering temperature Tsol 260 “C
*l The derating factors of absolute maximum ratings due to ambient temperature
are shown in Fig. 1 to 4.
*2 Pulse widths100 ps, Duty ratio : 0.001 (Refer to Fig. 5)
*3 AC for 1 min. 40 to 6O%RH, f=GOHz
*4 ForlOs
SHARP CORPORATlON
3.2 Electra-optical characteristics
ED-97123A
1 September 30. 1998
MODEL No.
PAGE
PC3H7
5/11
Ta=25C
Collector-emitter
output breakdown voltage IF=0
Emitter-collector
BvECO
I,=10 /LA, I,=0 6 - - V
breakdown voltage
Collector current
Ic I,=lmA, vc,=5v 0.2 -
4 mA
Collector-emitter
V
CEbat)
1,=2omA
0.1 0.2 v
saturation voltage Ic=lmA
Transfer Isolation resistance * Rlso DC500V 5XlO’O 10” - Q
charac -
40 to 6O%RH
terlstics
Floating capacitance
cf v=o, f=lMHz
0.6 1.0 pF
Response time (Rise) tr
vc,=2v 4 18 /IS
Ic=2mA
Response time (Fall) tf
R,=lOO R
3 18 ps
SHflRP CORPORATION
(Fig. 1) Forward current vs.
ambient temperature
50
2
CT. 4o
3 i2 30
2
e 2o
E E
10
0
-30 0
25 55 75 100 125
Ambient temperature Ta (“C )
(Fig. 31 Collector power dissipation
5
vs. ambient temperature
2ool+l+l+i
150
100
50
0
-30 0 25 50 75
100 125
Ambient temperature Ta ( “C )
(Fig. 5) Peak forward current
2
vs. duty ratio
(Fig.
2) Diode power dissipation
vs. ambient temperature
u
-30 0 25 55 75 100 125
Ambient temperature Ta ( “C 1
(Fig. 4) Total power dissipation
vs. ambient temperature
3
g
3
g
200
8
170
F: & 150
8 100
g &
50
;ii
5
01111111
c-
-30 0 25 50 75 100 125
Ambient temperature Ta ( ‘C 1
Pulse widths100 p!s
Ta=25”C
Duty
ratio
4. Reliability
The reliability of products shall satis@
items listed below.
Confidence level : 90%
LTPD: 10%/20%
Test Items
Test Conditions Failure Judgement
‘1
Criteria
Solderability *2
I
230%, 5s
Soldering heat *3
I
260%, 10 s
Terminal strength
(Bending) *4
Weight : 1N
1 time/each terminal
Mechanical shock 15000m/s2, 0.5ms
3 times/ tX, tY, +Z direction
Variable frequency
vibration
100 to 2000 to 1ooHz/4min
200m/s2
4 times/ X, Y, 2 direction
Temperature
cycling
1 cycle -40 “C to + 125C
(30mi.n) (30mir-i)
20 cycles test
High temp. and high +85%, 85%RH, 500h
humidity storage
High temp. storage
I
+125’C, lOOOh
Low temp. storage
I
-40-C, 1 OOOh
Operation life 1,=5OmA, Ptot= 170mW
Ta=25”C, 1 OOOh
I
n=ll, C=O
I
U
v,>ux 1.2
I
n=ll, C=O
I
I,>UX2
EEO >UX2
Ic <LXO.7
V
CE(sat) > ux ’ *2
SHARP CORPORATION
ED-97123A
1 September 30, 199;
MODEL No.
PAGE
PC3H7
7/ 1 I
Upper
specification
limit
L : Lower
specification
limit
*1 Test method, conforms to JIS C 7021.
*2 Solder shall adhere at the area of 95% or more of immersed portion of
lead, and pin hole or other holes shall not be concentrated on one portion.
*3 The lead pm depth dipped into solder shall be 0.2mm away from the
root of lead pins.
*4 Terminal bending d irection is shown below.
n=22 ,C=O
n=22 ,C=O
n=22,C=O
n=22,C=O
n=22 ,C=O
3
Y-
90’ 90°
Weight : IN
0.2mm or more
SHARP CORPORATION
MODEL No.
PC3H7
PAG E
8/11
5. Incoming inspection
5.1 Inspection items
(1) Electrical characteristics
V,, I,, I,, , Vc,,st,, Ic, Riso, Viso
(2) Appearance
5.2 Sampling method and Inspection level
A single sampling plan, normal inspection level II based on
IS0 2859 is applied. The AQL according to the inspection
items are shown below.
Minor Appearance defect except
defect
the above mentioned.
SHARP CORPORATION
PC3H7
9/11
6.3 Package specifications
6.3.1 Taping conditions
(11 Tape structure and Dimensions (Refer to the attached sheet, Page 10)
The tape shall have a structure in which a cover tape is sealed heat-pressed on
the carrier tape.
(2) Reel structure and Dimensions (Refer to the attached sheet, Page 11)
The taping reel shall be of plastic with its dimensions
as shown in the attached drawing.
(31 Direction of product insertion (Refer to the attached sheet, Page 11)
Product direction in carrier tape shall direct to the anode mark at the
hole side on the tape.
(4) Joint of tape
The cover tape and carrier tape in one reel shall be jointless.
(5) The way to repair taped failure devices
The way to repair taped failure devices cut a bottom of carrier tape with a cutter, and
after replacing to good devices, the cut portion shall be sealed with adhesive tape.
6.3.2 Adhesiveness of cover tape
l
The exfoliation force between carrier tape and cover tape shall be
0.2N to 0.7N for the angle from 160’ to 180’ .
6.3.3 Rolling method and quantity
l
Wind the tape back on the reel so that the cover tape will be outside the tape.
Attach more than 20cm of blank tape to the trailer and the leader of the tape
and 6.x the both ends with adhesive tape. One reel shall contain 3OOOpcs.
6.3.4 Marking
l
The outer packaging case shall be marked with following information.
* Model No.
* Number of pieces delivered * Production date
6.3.5 Storage condition
l
Taped products shall be stored at the temperature
5 to 30°C and the humidities lower than 7O%RH.
6.3.6 Safety protection during shipping
l
There shall be no deformation of component or degradation of electrical
characteristics due to shipping.
ED-97123A
MODEL No.
1 September 30, 1998
1 PAGE
SHARP CORPORFITION
F _ D
G
E
/-T
(_.-.-. Q&.-Q -.-. ?#i&) .-.-.-. @ .-.-.-.- 6 -.-.-.-. &
C
1 /
-I-
A
K .
I
i
ED-97123A
1 September 307 1998
MODEL
No.
PAG
E
PC3H7 lO/ll
Carrier tape structure and Dimensions
5Omax
to.3 k-o.1 to.1 co.1 to.1 to. 1
null
12.0 5.5 1.75
8.0 2.0
4.0
K. L
+O.l
+O.l
-0.0 fO.1 f0.05 ko.1 to.1 -0.0
mm
+ 1.5 7.5 0.3 2.3 3.1 p 1.6
SHARP CORPORATION
ED-97123A 1 September 30, 199
MODEL No.
PAGE
PC3H7 ll/ll
Reel structure and Dimensions
a
Check word
a b
C
d e f
g
mm 330 13.5t1.5 1OOt1 13t0.5
23+1 2.0C0.5 2.0 kO.5
Direction of product insertion
Pull-out direction
SHARP CORPORATION
ED-97123A
MODEL No.
1 September 30. 1998
1 PAGE
PC3H7
I
Attach
I
Precautions for Photocouplers
1 For cleaning
(1) Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size, ultrasonic power
output, cleaning time, PWB sire or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
(31 Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
In case when the other solvent is used, there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
2. The LED used in the Photocoupler generally decreases the light emission power
by operation. In case of long operation time, please design the circuit with considering
the degradation of the light emission power of the LED. (50%/5years)
SHARP CORPORATION
ED-97123A
1 September 30. 1998
MODEL No.
PAGE
PC3H7
Attach
sheet- l-2
3. Precautions for Soldering Photocouplers
( 11 If solder reflow :
It is recommended that only one soldering be done at the temperature
and the time within the temperature profile as shown in the figure below.
230°C
25C
Since, influence to the device is different according to reflow equipment
and its condition, please use the device after confirming no damage
in the actual using condition.
(2 1 Other precautions
An inii-ared lamp used to heat up for soldering may cause a localized
temperature rise in the resin. So keep the package temperature within
that specified in Item (1). Also avoid immersing the resin part in the solder.
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