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data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device. ”
Page 2
PC356NT/PC358
■ Absolute Maximum Ratings
Parameter
Forward current
*1
Input
Peak forward current
Reverse voltage
Power dissipation
PC356NT
PC358
Output
Collector-emitter
voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Total power dissipation
*2
Isolation voltage
Operating temperature
Storage temperature
*3
Soldering temperature
*1 Pulse width<=100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute
*3 For 10 senconds
■ Electro-optical Characteristics
ParameterSymbolConditionsMIN.TYP.MAX.Unit
Forward voltageV
Input
Output
Transfercharacteristics
Reverse current
Terminal capacitance
Collector dark current
Collector-emitter
breakdown voltage
PC356NT
PC358
PC356NT
PC358
Emitter-collector breakdown voltage
Current transfer ratio
PC356NT
PC358
Collector-emitter saturation voltage
Isolation resistanceR
Floating capacitanceC
PC356NT
PC358
PC356NT
PC358
Response
time
Rise time
Fall time
SymbolRatingUnit
50mA
1A
6V
70mW
80V
6V
50mA
150mW
170mW
3 750
- 30 to + 100
- 40 to + 125
260˚C
=0= 20V, I
=0
=5V
CE
=5V
CE
BV
BV
V
I
F
I
FM
V
R
P
V
CEO
V
ECO
I
C
P
C
P
tot
V
iso
T
opr
T
stg
T
sol
= 20mA-1.21.4V
FIF
VR=4V-
I
R
V= 0, f= 1kHz
C
t
V
I
CEO
CTR
CE(sat
CEF
V
= 40V, I
CEF
= 0.1mA, IF=0
CEOIC
I=10µA, I = 06--V
EF
ECO
= 1mA, V100
I
F
I
= 5mA, V
F
)
IF= 20mA, IC= 1mA-0.2V
DC500V, 40 to 60%RH
ISO
V= 0, f= 1MHz-0.61.0pF
f
t
r
VCE= 2V, IC= 2mA
= 100Ω
R
L
t
f
(
Ta= 25˚C
V120
V
˚C
˚C
)
Soldering area
0.2mm or more
rms
(
Ta= 25˚C
-
10
-
30
250
-7
--A
80
1x10
--
--120
-400%
50600
-%
-
10
5x10
11
10
-Ω
-6-µs
-18µs
4
-8-µs
-18µs
3
)
µA
pF
V
Page 3
PC356NT/PC358
Fig. 1 Forward Current vs.
Ambient Temperature
70
60
)
50
mA
(
F
40
30
20
Forward current I
10
0
0255075100125
-30
Ambient temperature Ta (˚C
)
Fig. 3 Collector Power Dissipation vs.
Ambient Temperature
200
)
mW
150
(
C
100
50
Collector power dissipation P
0
0255075100125
-30
Ambient temperature T
a
(˚C
)
Fig. 5 Peak Forward Current vs. Duty Ratio
Fig. 2 Diode Power Dissipation vs.
Ambient Temperature
100
)
mW
(
80
70
60
40
Diode power dissipation P
20
0
-30
050 55100
)
Ambient temperature T
a
(˚C
Fig. 4 Total Power Dissipation vs.
Ambient Temperature
300
)
250
mW
(
200
tot
170
150
100
50
Total power dissipation P
0
-30
05025100
Ambient temperature Ta (˚C
)
Fig. 6 Forward Current vs. Forward Voltage
10000
5000
)
2000
mA
(
1000
FM
500
200
100
50
Peak forward current I
20
10
5
-3
5252525
-2
10
Duty ratio
Pulse width <=100µs
T
= 25˚C
a
10
500
200
)
100
mA
(
50
F
20
10
5
Forward current I
1
-1
110
020.51.01.52.02.53.03.5
= 75˚C
T
a
50˚C
Forward voltage VF (V
25˚C
0˚C
- 25˚C
)
Page 4
PC356NT/PC358
Fig. 7-a Current Transfer Ratio vs.
Forward Current
500
)
400
%
(
300
200
Current transfer ratio CTR
100
0
0.1
110100100101
Forward current I
(
PC356NT
VCE=5V
T
= 25˚C
a
(mA
F
)
)
Fig. 8-a Collector Current vs.
Collector-emitter Voltage
50
40
)
mA
(
C
Collector current I
= 30mA
F
I
30
20
10
0
0
Collector-emitter voltage V
20mA
10mA
5mA
1mA
P
= 150mW
C
(
PC356NT
= 25˚C
T
a
)
(V
CE
)
108642
Fig. 9-a Relative Current Transfer Ratio vs.
Ambient Temperature
150
)
%
(
100
(
PC356NT
IF= 1mA
V
=5V
CE
)
Fig. 7-b Current Transfer Ratio vs.
Forward Current
200
180
)
160
%
(
140
120
100
80
60
Current transfer ratio CTR
40
20
0
0.1
Forward current IF (mA
V
CE
T
a
)
(
PC358
=5V
= 25˚C
)
50
Fig. 8-b Collector Current vs.
Collector-emitter Voltage
30
24
)
mA
(
C
18
12
Collector current I
6
0
= 30mA
I
F
20mA
10mA
1.83.65.47.29.0
0
Collector-emitter voltage V
(
PC358
Pc=150mW
5mA
)
(V
CE
)
Fig. 9-b Relative Current Transfer Ratio vs.
Ambient Temperature
150
)
%
(
(
PC358
I
= 5mA
F
V
=5V
CE
)
50
Relative current transfer ratio
0
-30
Ambient temperature T
100
Relative current transfer ratio
40
)
(˚C
a
100200
80
60
50
-30
Ambient temperature T
806040200
100
)
(˚C
a
Page 5
PC356NT/PC358
Fig.10-a Collector-emitter Saturation Voltage
vs. Ambient Temperature
0.16
0.14
0.12
0.10
0.08
)
V
0.06
(
)
sat
(
0.04
CE
Collector-emitter saturation voltage
V
0.02
0
-30
020406080
Ambient temperature T
(
PC356NT
IF= 20mA
I
= 1mA
C
)
(˚C
a
)
100
Fig.11-a Collector Dark Current vs.
Ambient Temperature
-5
10
5
-6
)
10
A
(
5
CEO
-7
10
5
-8
10
5
-9
10
5
Collector dark current I
-10
10
5
-11
10
-30
020406080
Ambient temperature Ta (˚C
(
PC356NT
= 20V
V
CE
)
)(
100
Fig.10-b Collector-emitter Saturation Voltage
vs. Ambient Temperature
0.16
0.14
0.12
0.10
0.08
)
V
(
)
0.06
sat
(
CE
0.04
Collector-emitter saturation voltage
V
0.02
0
-30
020406080
Ambient temperature Ta (˚C
(
PC358
IF= 20mA
I
= 1mA
C
)
)
100
Fig.11-b Collector Dark Current vs.
Ambient Temperature
-5
10
5
-6
)
10
A
(
5
CEO
-7
10
5
-8
10
5
-9
10
5
Collector dark current I
-10
10
5
-11
10
020406080
-30
Ambient temperature Ta (˚C
V
PC358
= 40V
CE
)
)
100
Fig.12-a Response Time vs. Load ResistanceFig.12-b Response Time vs. Load Resistance
500
V
CE
I
C
200
T
a
100
)
50
µs
(
20
10
5
Response time
2
1
0.5
0.2
0.1
0.01
(
PC356NT
=2V
= 2mA
= 25˚C
t
f
t
r
t
d
t
s
Load resistance RLoad resistance R
(kΩ
L
)(
V
=2V
CE
I
= 2mA
C
T
= 25˚C
a
)
100
µ s
(
PC358
t
r
t
f
)
10
t
Response time
1
1010.1
0.1
0.01
0.1110
)
d
t
s
100
)
(kΩ
L
Page 6
Input
Test Circuit for Response Time
V
CC
Output
Input
Output
t
d
R
R
D
L
PC356NT/PC358
10%
90%
t
s
t
t
r
f
Fig.13-a Collector-emitter Saturation
Voltage vs. Forward Current
4.8
I
C
3.6
2.4
)
V
(
)
1.2
sat
(
CE
Collector-emitter saturation voltage
V
0
0
Forward current I
= 0.5mA
1mA
3mA
5mA
7mA
(
PC356NT
(mA
F
)
Ta= 25˚C
1512963
)
■ Temperature Profile of Soldering Reflow
30 seconds
230˚C
200˚C
180˚C
1 minute
25˚C
2 minutes1.5 minutes1 minute
Fig.13-b Collector-emitter Saturation
Voltage vs. Forward Current
4.8
3.6
2.4
)
V
(
)
sat
(
1.2
CE
V
Collector-emitter saturation voltage
0
(1)
One time soldering reflow is recommended
I
= 0.5mA
C
1.0mA
3.0mA
5.0mA
7.0mA
Forward current IF (mA
(
PC358
= 25˚C
T
a
)
within the condition of temperature and
time profile shown below.
(2)
When using another soldering method such
as infrared ray lamp, the temperature may
rise partially in the mold of the device.
Keep the temperature on the package of
the device within the condition of above (1).
Please refer to the chapter
●
“ Precautions for Use ” .
)
1512963
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