Datasheet PBYR2540CTF, PBYR2545CTF Datasheet (Philips)

Page 1
Philips Semiconductors Product specification
Rectifier diodes PBYR2545CTF, PBYR2545CTX Schottky barrier
FEATURES SYMBOL QUICK REFERENCE DATA
• Low forward volt drop
• Fast switching V
• High thermal cycling performance I
a1
13
a2
• Isolated mounting tab
k
2
GENERAL DESCRIPTION
Dual, common cathode schottky rectifier diodes in a plastic envelope with electrically isolated mounting tab. Intended for use as output rectifiers in low voltage, high frequency switched mode power supplies.
The PBYR2545CTF is supplied in the SOT186 package. The PBYR2545CTX is supplied in the SOT186A package.
PINNING SOT186 SOT186A
= 40 V/ 45 V
R
= 20 A
O(AV)
VF 0.65V
PIN DESCRIPTION
case
case
1 anode 1 (a) 2 cathode (k) 3 anode 2 (a)
tab isolated
123
123
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
PBYR25 40CTF 45CTF PBYR25 40CTX 45CTX
V V V
I
O(AV)
I
FRM
I
FSM
I
RRM
T T
RRM
RWM
R
j
stg
Peak repetitive reverse - 40 45 V voltage Working peak reverse - 40 45 V voltage Continuous reverse voltage Ths 86 ˚C - 40 45 V
Average rectified output square wave; δ = 0.5; - 20 A current (both diodes Ths 98 ˚C conducting) Repetitive peak forward square wave; δ = 0.5; - 20 A current per diode Ths 98 ˚C Non-repetitive peak forward t = 10 ms - 135 A current per diode t = 8.3 ms - 150 A
sinusoidal; Tj = 125 ˚C prior to
Peak repetitive reverse pulse width and repetition rate - 1 A
surge; with reapplied V
surge current per diode limited by T
j max
RRM(max)
Operating junction - 150 ˚C temperature Storage temperature - 65 175 ˚C
October 1998 1 Rev 1.300
Page 2
Philips Semiconductors Product specification
Rectifier diodes PBYR2545CTF, PBYR2545CTX Schottky barrier
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
V
isol
C
isol
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-hs
R
th j-a
Peak isolation voltage from SOT186 package; R.H. 65%; clean and - - 1500 V all terminals to external dustfree heatsink
R.M.S. isolation voltage from SOT186A package; f = 50-60 Hz; - - 2500 V all terminals to external sinusoidal waveform; R.H. 65%; clean heatsink and dustfree
Capacitance from pin 2 to f = 1 MHz - 10 - pF external heatsink
Thermal resistance junction per diode - - 4.8 K/W to heatsink both diodes - - 4 K/W
(with heatsink compound) Thermal resistance junction in free air - 55 - K/W to ambient
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
I
R
C
d
Forward voltage per diode IF = 20 A; Tj = 125˚C - 0.58 0.65 V
IF = 20 A - 0.63 0.68 V Reverse current per diode VR = V
VR = V
RWM
; Tj = 100˚C - 30 40 mA
RWM
- 0.3 2 mA
Junction capacitance per VR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C - 530 - pF diode
October 1998 2 Rev 1.300
Page 3
Philips Semiconductors Product specification
Rectifier diodes PBYR2545CTF, PBYR2545CTX Schottky barrier
0.2
PBYR2545CTX
0.5
I
D = 1.0
p
t
D =
T
Forward dissipation, PF (W) Ths(max) (C)
15
Vo = 0.37 V Rs = 0.014 Ohms
10
5
0
0 5 10 15 20 25
0.1
Average forward current, IF(AV) (A)
Fig.1. Maximum forward dissipation PF = f(I
diode; square current waveform where
I
=I
F(AV)
Forward dissipation, PF (W) Ths(max) (C)
15
Vo = 0.37 V Rs = 0.014 Ohms
10
4
x √D.
F(RMS)
PBYR2545CTX
2.2
2.8
1.9
a = 1.57
t
p
T
t
F(AV)
78
102
126
150
) per
78
102
Reverse current, IR (mA)
100
125 C
10
100 C
75 C
1
50 C
0.1 Tj = 25 C
0.01 0
Reverse voltage, VR (V)
25 50
PBYR3045WT
Fig.4. Typical reverse leakage current per diode;
10000
1000
IR = f(VR); parameter T
Cd / pF
j
PBYR2545CT
F(AV)
126
150
) per
5
0
0 5 10 15
Average forward current, IF(AV) (A)
Fig.2. Maximum forward dissipation PF = f(I
diode; sinusoidal current waveform where a = form
factor = I
Forward current, IF (A)
50
Tj = 25 C Tj = 125 C
40
30
20
10
0
0 0.2 0.4 0.6 0.8 1 1.2 1.4
typ
Forward voltage, VF (V)
F(RMS)
max
/ I
F(AV)
.
PBYR2545CTX
Fig.3. Typical and maximum forward characteristic
IF = f(VF); parameter T
j
100
1
10 100
VR / V
Fig.5. Typical junction capacitance per diode;
Cd = f(VR); f = 1 MHz; Tj = 25˚C to 125 ˚C.
Transient thermal impedance, Zth j-hs (K/W)
10
1
0.1
0.01 1us 10us 100us 1ms 10ms 100ms 1s 10s
pulse width, tp (s)
t
p
P
D
T
t
p
D =
T
t
PBYR2545CTX
Fig.6. Transient thermal impedance per diode;
Z
= f(tp).
th j-hs
October 1998 3 Rev 1.300
Page 4
Philips Semiconductors Product specification
Rectifier diodes PBYR2545CTF, PBYR2545CTX Schottky barrier
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
3.5 max
not tinned
10.2 max
5.7
max
3.2
3.0
4.4
0.9
0.5
4.4
4.0
seating
plane
13.5 min
4.4
max
2.9 max
7.9
7.5 17
max
123
M
0.4
5.08
Fig.7. SOT186; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
0.9
0.7
2.54
top view
0.55 max
1.3
October 1998 4 Rev 1.300
Page 5
Philips Semiconductors Product specification
Rectifier diodes PBYR2545CTF, PBYR2545CTX Schottky barrier
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
10.3
Recesses (2x)
2.5
0.8 max. depth
3 max.
not tinned
13.5 min.
0.4
M
max
3.2
3.0
123
5.08
2.8
2.54
15.8 max.
3
19
max.
seating
plane
0.5
2.5
4.6
max
2.9 max
6.4
0.6
2.5
15.8 max
Fig.8. SOT186A; The seating plane is electrically isolated from all terminals.
1.3
1.0 (2x)
0.9
0.7
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
October 1998 5 Rev 1.300
Page 6
Philips Semiconductors Product specification
Rectifier diodes PBYR2545CTF, PBYR2545CTX Schottky barrier
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
October 1998 6 Rev 1.300
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