Datasheet PBYR1035B, PBYR1040B, PBYR1045B Datasheet (Philips)

Philips Semiconductors Product specification

Rectifier diodes PBYR1045B series
Schottky barrier

FEATURES SYMBOL QUICK REFERENCE DATA

• Low forward volt drop

• Fast switching V

• Reverse surge capability

• High thermal cycling performance I

k a

tab 3

• Low thermal resistance

GENERAL DESCRIPTION PINNING SOT404

= 40 V/ 45 V

R

= 10 A

F(AV)

VF ≤ 0.57 V

Schottky rectifierdiodesin aplastic PIN DESCRIPTION
envelope. Intended for use as

mb

output rectifiersin low voltage, high 1 no connection
frequency switched mode power
supplies. 2 cathode

The PBYR1045B seriesissupplied 3 anode
in the surface mounting SOT404
package. tab cathode

1

2

13

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
V

I

F(AV)

I

FRM

I

FSM

I

RRM

T
T

RRM

RWM

R

j

stg

Peak repetitive reverse - 40 45 V
voltage
Working peak reverse - 40 45 V
voltage
Continuous reverse voltage Tmb ≤ 113 ˚C - 40 45 V

Average rectified forward square wave; δ = 0.5; Tmb ≤ 136 ˚C - 10 A
current
Repetitive peak forward square wave; δ = 0.5; Tmb ≤ 136 ˚C - 20 A
current
Non-repetitive peak forward t = 10 ms - 135 A
current t = 8.3 ms - 150 A

sinusoidal; Tj = 125 ˚C prior to

surge; with reapplied V
Peak repetitive reverse pulse width and repetition rate - 1 A
surge current limited by T
Operating junction - 150 ˚C

j max

temperature
Storage temperature - 65 175 ˚C

PBYR10 40B 45B

RRM(max)

1 It is not possible to make connection to pin 2 of the SOT404 package.

July 1998 1 Rev 1.200

Philips Semiconductors Product specification

Rectifier diodes PBYR1045B series
Schottky barrier

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

R

th j-mb

R

th j-a

ELECTRICAL CHARACTERISTICS

Tj = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

F

I

R

C

d

Thermal resistance junction - - 2 K/W
to mounting base
Thermal resistance junction pcb mounted, minimum footprint, FR4 - 50 - K/W
to ambient board

Forward voltage IF = 10 A; Tj = 125˚C - 0.5 0.57 V

IF = 20 A; Tj = 125˚C - 0.69 0.72 V

IF = 20 A - 0.65 0.84 V
Reverse current VR = V

Junction capacitance VR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C - 350 - pF

VR = V

RWM

; Tj = 100˚C - 22 35 mA

RWM

- 0.2 1.3 mA

July 1998 2 Rev 1.200

Philips Semiconductors Product specification

Rectifier diodes PBYR1045B series
Schottky barrier

0.5

F(AV)

F(AV)

Tmb(max) (C)

t

p

T

=I

F(RMS)

Tmb(max) (C)

a = 1.57

1.9

.

D = 1.0

D =

p

t
T

t

F(AV)

x √D.

F(AV)

130

134

138

142

146

150

);

134
136
138
140
142
144
146
148
150

);

Forward dissipation, PF (W)

10

Vo = 0.42 V
Rs = 0.015 Ohms

8

6

4

2

0

0 5 10 15

0.1

Average forward current, IF(AV) (A)

PBYR1045

0.2

I

Fig.1. Maximum forward dissipation PF = f(I

square current waveform where I

Forward dissipation, PF (W)

8

Vo = 0.42 V
Rs = 0.015 Ohms

7
6
5
4
3
2
1
0

0246810

4

Average forward current, IF(AV) (A)

PBYR1045

2.2

2.8

Fig.2. Maximum forward dissipation PF = f(I

sinusoidal current waveform where a = form

factor = I

F(RMS)

/ I

Reverse current, IR (mA)

100

125 C

10

100 C

75 C

1

50 C

0.1

Tj = 25 C

0.01
0

25 50

Reverse voltage, VR (V)

PBYR1045

Fig.4. Typical reverse leakage current; IR = f(VR);

1000

100

10

parameter T

Cd / pF

1

VR / V

j

PBYR1045

10 100

Fig.5. Typical junction capacitance; Cd = f(VR);

f = 1 MHz; Tj = 25˚C to 125 ˚C.

Forward current, IF (A)

50

Tj = 25 C
Tj = 125 C

40

30

20

10

0

0 0.2 0.4 0.6 0.8 1 1.2 1.4

Forward voltage, VF (V)

typ

max

PBYR1045

Fig.3. Typical and maximum forward characteristic

IF = f(VF); parameter T

j

Fig.6. Transient thermal impedance; Z

Transient thermal impedance, Zth j-mb (K/W)

10

1

0.1

0.01

1us 10us 100us 1ms 10ms 100ms 1s 10s

pulse width, tp (s)

t

p

P

D

D =

T

PBYR1045

t

p

T

t

th j-mb

= f(tp).

July 1998 3 Rev 1.200

Philips Semiconductors Product specification

Rectifier diodes PBYR1045B series
Schottky barrier

MECHANICAL DATA

Dimensions in mm
Net Mass: 1.4 g

2.54 (x2)

MOUNTING INSTRUCTIONS

Dimensions in mm

10.3 max

11 max

15.4

0.85 max
(x2)

4.5 max

1.4 max

0.5

Fig.7. SOT404 : centre pin connected to mounting base.

11.5

2.5

9.0

17.5

2.0

3.8

5.08

Fig.8. SOT404 : soldering pattern for surface mounting

.

Notes

1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent
damage to MOS gate oxide.

2. Epoxy meets UL94 V0 at 1/8".

July 1998 4 Rev 1.200

Philips Semiconductors Product specification

Rectifier diodes PBYR1045B series
Schottky barrier

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

 Philips Electronics N.V. 1998

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

July 1998 5 Rev 1.200